Sensor substrate material, array sensor, and preparation mold and preparation method

Abstract

The application provides a sensor substrate material, an array sensor, a preparation mold and a preparation method, and belongs to the technical field of automobile safety testing, and the array sensor comprises a sensor substrate and a wire layer, the sensor substrate is formed by heating and curing the sensor substrate material and a special mold; the wire layer comprises a first wire layer and a second wire layer, and is adhered to the upper surface and the lower surface of the sensor substrate respectively. The array sensor of the application realizes the balance of high sensitivity and mechanical toughness through reasonable proportioning of the sensor substrate material; the elastic recovery capability of the wire under the multi-directional stress scene such as stretching, compression and shearing can be ensured through pretreatment of the wire, and the electrical property and the mechanical property of the wire are not affected.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of automotive safety testing, and particularly relates to a sensor substrate material suitable for a crash test dummy skin, an array sensor, a preparation mold and a preparation method. BACKGROUND

[0002] Automobile crash testing is a core means for evaluating vehicle safety performance, and its sensor technology is evolving towards high precision, distributed, and multi-scene, especially in the field of bionic skin. In recent years, the types and quantities of external sensors used on human bodies or humanoid robots or crash test dummies have increased significantly. In order to monitor or analyze the stress of different skin parts of the human body, more and more bionic skins or artificial test skins with detection capabilities are being developed.

[0003] Existing crash test solutions have limited application scope, some are suitable for testing on human skin, and some are suitable for crash test dummies and humanoid robots, lacking universality. SUMMARY

[0004] In view of the problems existing in the prior art, the present application discloses an array sensor, a sensor substrate material thereof, a preparation method and a preparation mold.

[0005] In one aspect, the present application aims to provide a sensor substrate material comprising the following raw materials in weight percentage:

[0006] a base material 34%-35%;

[0007] a gallium-indium alloy 5%-6%;

[0008] a nickel powder 43%-44%;

[0009] a conductive ink 14%-15%.

[0010] Further, the base material comprises the following raw materials in weight percentage:

[0011] a polyvinyl chloride resin 35.5%-37.5%;

[0012] a dioctyl terephthalate 47.5%-50.5%;

[0013] calcium carbonate 0.1%-2%;

[0014] epoxy soybean oil 4%-7%;

[0015] an antioxidant stabilizer 0.5%-3%.

[0016] Further, the antioxidant stabilizer is triphenyl phosphite, which can prevent the degradation of PVC due to oxidation during processing and use.

[0017] In another aspect, the present application aims to provide an array sensor, comprising a sensor substrate and a wire layer, the sensor substrate is formed by curing the above-mentioned sensor substrate material; the wire layer comprises a first wire layer and a second wire layer, which are respectively adhered to the upper surface and the lower surface of the sensor substrate.

[0018] Further, the first wire layer comprises a plurality of wire bundles distributed along the X direction, for connecting the sensor units in the same row; the second wire layer comprises a plurality of wire bundles distributed along the Y direction, for connecting the sensor units in the same column.

[0019] Further, the array sensor further has an insulating layer outside the wire layer.

[0020] In another aspect, the present application aims to provide a preparation mold, comprising a base plate assembly, a first wire bundle plate and a second wire bundle plate;

[0021] The base plate assembly comprises a base pressing plate and a base preform plate, the base preform plate has a first assembly surface and a second assembly surface, and the base pressing plate has a third assembly surface; the base preform plate is detachably assembled to the base pressing plate, and a plurality of through holes are arrayed on the base preform plate; when the base preform plate is assembled with the base pressing plate, the first assembly surface of the base preform plate is attached to the third assembly surface of the base pressing plate.

[0022] The first wire bundle plate has a fourth assembly surface, which is detachably assembled to the second assembly surface of the base preform plate, for adhering the first wire layer to the upper surface of the sensor substrate.

[0023] The second wire bundle plate has a fifth assembly surface, which is detachably assembled to the fourth assembly surface of the first wire bundle plate, for adhering the second wire layer to the lower surface of the sensor substrate.

[0024] Further, the fourth assembly surface of the first wire bundle plate is provided with a plurality of first wire grooves along the X direction, which are correspondingly arranged with the row through holes on the base preform plate; when the first wire bundle plate is assembled with the base preform plate, the wire bundles fixed on the fourth assembly surface are attached to the upper surface of the sensor substrate.

[0025] Further, the fifth assembly surface of the second wire bundle plate is provided with a plurality of second wire grooves along the Y direction, which are correspondingly arranged with the column through holes on the base preform plate; when the second wire bundle plate is assembled with the first wire bundle plate, the wire bundles fixed on the fifth assembly surface are attached to the lower surface of the sensor substrate.

[0026] Further, the middle part of the fifth assembly surface is provided with a pressure layer along the Y direction.

[0027] Further, the two sides of the third assembly surface of the substrate pressing plate are provided with first sliding rails along the X direction, and the two sides of the first assembly surface of the substrate preform plate are provided with first sliding grooves along the X direction, and the first sliding grooves are matched with the first sliding rails, so that when the substrate preform plate is assembled with the substrate pressing plate, the first assembly surface is attached to the third assembly surface.

[0028] Further, the two sides of the second assembly surface of the substrate preform plate are provided with second sliding rails along the X direction, and the two sides of the fourth assembly surface of the first wire harness plate are provided with second sliding grooves along the X direction, and the second sliding rails are matched with the second sliding grooves, so that when the first wire harness plate is assembled with the substrate preform plate, the fourth assembly surface is attached to the second assembly surface.

[0029] Further, the preparation mold also has a guide rail support, the guide rail support includes a guide rail and a guide groove, the guide rail is slidably assembled in the second sliding groove; the two sides of the fifth assembly surface of the second wire harness plate are provided with third sliding rails along the X direction, and the third sliding rails are slidably assembled in the guide groove; the guide rail support is matched with the second sliding groove and the third sliding rails, so that when the second wire harness plate is assembled with the first wire harness plate, the pressure layer is in abutment with the fourth assembly surface of the first wire harness plate.

[0030] Further, the fourth assembly surface of the first wire harness plate is also provided with a first liquid injection groove and a first flow guide groove, the first liquid injection groove is provided with two groups, which are respectively located on the two sides of the first wire groove, and one end of the first flow guide groove is flush with the first wire groove, and the other end is opened at the edge of the first wire harness plate and forms a first liquid injection hole; the first flow guide groove is communicatively arranged at the flush end of the first liquid injection groove and the first wire groove.

[0031] Further, the fifth assembly surface of the second wire harness plate is provided with a second liquid injection groove and a second flow guide groove, the second liquid injection groove is provided with two groups, which are respectively located on the two sides of the second wire groove, and one end of the second liquid injection groove is opened at the edge of the second wire harness plate and forms a second liquid injection hole, and the other end is flush with the second wire groove; the second flow guide groove is communicatively arranged at the flush end of the second liquid injection groove and the second wire groove.

[0032] In yet another aspect, the present application aims to provide a preparation method of an array sensor, comprising the following steps:

[0033] S1. Assemble the substrate plate assembly, and lay the pre-prepared sensor substrate material on the substrate preform plate;

[0034] S2. Move the substrate plate assembly into a vacuum chamber for vacuum treatment;

[0035] S3. Add sensor substrate material to make up the empty space;

[0036] S4. Put the substrate plate assembly into a heating box for heating and curing to form the sensor substrate;

[0037] S5. Assemble and fix the first wire harness plate assembled with wire harness to the substrate preform plate, so that the wire harness is attached to the upper surface of the sensor substrate;

[0038] S6. Inject conductive glue to the joint between the first wire harness plate and the sensor substrate;

[0039] S7. Stand still until the conductive glue is cured to form the first wire layer;

[0040] S8. Remove the substrate pressing plate;

[0041] S9. Separate the sensor substrate from the substrate preform plate, and the sensor substrate is adhered to the first wire harness plate;

[0042] S10. Assemble and fix the second wire harness plate assembled with wire harness to the first wire harness plate, so that the wire harness is attached to the lower surface of the sensor substrate;

[0043] S11. Inject conductive glue to the joint between the second wire harness plate and the sensor substrate;

[0044] S12. Stand still until the conductive glue is cured to form the second wire layer.

[0045] Compared with the prior art, the array sensor of the present application realizes the balance between high sensitivity and mechanical toughness through reasonable proportioning of the sensor substrate material; through pretreatment of the wire, the elastic recovery capability of the wire under multi-directional stress scenarios such as stretching, compression and shearing can be ensured, and the electrical and mechanical properties are not affected. In addition, the structure of the mold is designed ingeniously, through the design of sandwich structure, multiple layers of structure can be pressed together to realize the modularized preparation process and improve the product yield. BRIEF DESCRIPTION OF DRAWINGS

[0046] Figure 1 is a structural schematic diagram and working principle diagram of an array sensor according to an embodiment of the present application;

[0047] Figure 2 is a structural schematic diagram of a substrate preform plate according to another embodiment of the present application;

[0048] Figure 3 is a structural schematic diagram of a substrate pressing plate according to another embodiment of the present application;

[0049] Figure 4is a schematic diagram of an assembled structure of a substrate pressing plate and a substrate preform plate according to another embodiment of the present application;

[0050] Figure 5 is a schematic diagram of a first wire plate according to another embodiment of the present application;

[0051] Figure 6 is a schematic diagram of an assembled structure of a first wire plate and a substrate plate assembly according to another embodiment of the present application;

[0052] Figure 7 is a schematic diagram of a second wire plate according to another embodiment of the present application;

[0053] Figure 8 is a schematic diagram of a guide rail support according to another embodiment of the present application;

[0054] Figure 9 is a schematic diagram of an assembled structure of a second wire plate, a guide rail support and a first wire plate according to another embodiment of the present application.

[0055] In the drawings:

[0056] 11 - sensor substrate; 121 - first wire layer; 121 - second wire layer; 21 - substrate plate assembly; 211 - substrate pressing plate; 2111 - third assembly surface; 21111 - first sliding rail; 212 - substrate preform plate; 2121 - first assembly surface; 21211 - first sliding groove; 2122 - second assembly surface; 21221 - second sliding rail; 22 - first wire harness plate; 221 - fourth assembly surface; 2211 - first wire groove; 2212 - second sliding groove; 2213 - first liquid injection groove; 2214 - first liquid flow groove; 23 - second wire harness plate; 231 - fifth assembly surface; 2311 - second wire groove; 2312 - third sliding rail; 2313 - pressurizing layer; 2314 - second liquid injection groove; 2315 - second liquid flow groove; 24 - guide rail support; 241 - guide rail; 242 - guide groove. DETAILED DESCRIPTION

[0057] The technical solutions of the present application will be described clearly and completely below with reference to the drawings. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0058] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", "third" are only for descriptive purposes and cannot be understood as indicating or implying relative importance.

[0059] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances. In addition, the technical features involved in the different embodiments of the present application described below can be combined with each other as long as they do not conflict with each other.

[0060] Embodiment 1:

[0061] Figure 1 The structure diagram and working principle diagram of the array sensor of one embodiment of the present application are shown, which can be adapted to the bionic mannequin skin curved packaging, and is used for measuring the pressure received when the mannequin collides. Specifically, the array sensor is composed of a plurality of array-form arranged sensor units, including a sensor substrate 11 and a wire layer 12, the wire layer 12 includes a first wire layer 121 and a second wire layer 122, which are adhered to the upper surface and the lower surface of the sensor substrate 11 respectively. The sensor substrate 11 is prepared from the sensor substrate material and the mold which will be described in detail below, and will not be described in detail here. Further, the first wire layer 121 includes a plurality of X-directionally distributed wire bundles for connecting the sensor substrates 11 in the same row; the second wire layer 122 includes a plurality of Y-directionally arranged wire bundles for connecting the sensor substrates 11 in the same column. Through the row and column wire layout on the upper and lower surfaces, the first wire layer 121 and the second wire layer 122 together connect each sensor substrate 11 to the corresponding row wire bundle and column wire bundle. This structure not only realizes the complete function of the sensor array, but also significantly simplifies the wiring complexity and improves the reliability and stability of the entire sensor system. The preparation method of the wire bundle will be described in detail below, and will not be described in detail here.

[0062] Specifically, the core working principle of the array sensor of the present application is based on the piezoresistive effect: when external pressure acts on the sensor unit, the sensor unit deforms, resulting in a decrease in the average distance between conductive particles in the sensor substrate, forming a denser conductive network, thereby significantly reducing the resistance value of the sensor unit 111.

[0063] Specifically:

[0064] R ij is the reference resistance value of the i-th row, j-th column sensor unit at the initial height h;

[0065] When the pressure causes the sensor unit to compress to a height h' (h' < h), its resistance value becomes R' ij ;

[0066] Due to the characteristics of the piezoresistive material, the relationship is satisfied:

[0067] R' ij <R ij and ΔR = |R' ij－ R ij | is positively correlated with the pressure intensity.

[0068] By measuring the resistance change ΔR of each sensor unit in real time, and based on the pre-calibrated "pressure-resistance change" mapping relationship, the pressure value at the position can be accurately obtained. Combining the data independently measured by all sensor units in the array, the dynamic pressure distribution map of the dummy skin surface during the collision process can be finally generated.

[0069] Further, the sensor substrate material of the present application is composed of a base material and a conductive material, wherein the base material accounts for 34%-35% of the total formulation by weight percentage, and the conductive material accounts for 62%-65% of the total formulation by weight percentage. Specifically, the base material is composed of polyvinyl chloride resin, dioctyl terephthalate, calcium carbonate, epoxy soybean oil and antioxidant stabilizer, the polyvinyl chloride resin is the base skeleton, accounting for 37.5-40.5% of the total weight of the base material; the dioctyl terephthalate is the main plasticizer, accounting for 47.5-50.5% of the total weight of the base material; the calcium carbonate is a stability enhancer, accounting for 0.1-2% of the total weight of the base material; the epoxy soybean oil is a plasticizer synergist, used to improve the flexibility of the base material, accounting for 4-7% of the total weight of the base material; the antioxidant stabilizer can be triphenyl phosphite, which can prevent PVC from degrading due to oxidation during processing and use, accounting for 0.5-3% of the total weight of the base material. Further, the conductive material is composed of nickel powder, gallium-indium alloy and conductive ink, wherein the nickel powder serves as a conductive skeleton, providing basic conductivity, accounting for 43%-44% of the total weight of the conductive material; the liquid property of the gallium-indium alloy can improve the connectivity of the conductive network and reduce the contact resistance, accounting for 5%-6% of the total weight of the conductive material; the conductive ink has the dual functions of bonding nickel powder and assisting conduction, accounting for 14%-15% of the total weight of the conductive material. The sensor substrate material of the present application can achieve high sensitivity response of the sensor unit to small deformation while maintaining the mechanical toughness of the base material through reasonable formulation of the base material and the conductive material.

[0070] Further, the preparation steps of the sensor substrate material of the present application are as follows:

[0071] Step one, mix the components of the base material according to the weight percentage, and stir with a stirrer at 1500 rpm for about 2-3 H;

[0072] Step two, take out a part of the mixed base material, weigh the gallium-indium alloy, nickel powder and conductive ink according to the weight percentage, and stir with a stirrer at 1500 rpm for 15 min.

[0073] During the preparation of the sensor substrate material of the present application, the base material is relatively viscous, so it needs to be stirred thoroughly first to ensure that the components are mixed uniformly, and then the conductive material is added and stirred. In addition, due to the viscosity of the base material, the problem of sedimentation and stratification of the conductive material during subsequent vacuum extraction and heat curing can be largely avoided.

[0074] Further, the wire harness of the present application includes a plurality of silver wires, a PDMS colloid wrapped around the silver wires, and a plurality of reinforcing fibers arranged side by side with the silver wires. Specifically, the preparation steps of the wire harness are as follows:

[0075] Step one, prepare a plurality of silver wires with appropriate diameter and length;

[0076] Step two, put the silver wire into the prepared PDMS glue to form a four-week package;

[0077] Step three, add several reinforcing fibers to improve the mechanical strength of the wire;

[0078] Step four, use a hot press or hot air gun to heat and compact, so that the silver wire and reinforcing fiber are bonded together;

[0079] Step five, cooling and solidification.

[0080] The wire harness of the present application takes silver wire as the conductive core to ensure low impedance signal transmission. PDMS coating not only prevents silver wire from vulcanization and oxidation, but also simulates the "bionic nerve" of the crash dummy sensor and buffers stress; the setting of reinforcing fibers can increase the signal stability of the wire under impact, solving the problem of easy breakage of traditional wires in dynamic impact. Through PDMS coating and reinforcing fiber processing, the wire harness of the present application can not only meet the actual stress scenarios such as stretching, pulling, pressing and cutting, but also can restore the original physical structure of the wire within a certain stress range, without affecting the use performance and mechanical properties.

[0081] In summary, the array sensor of the present application realizes the balance between high sensitivity and mechanical toughness through reasonable proportioning of the sensor base material; through pretreatment of the wire, its elastic recovery ability under multi-directional stress scenarios such as stretching, compression and shearing can be guaranteed, without affecting its electrical and mechanical properties.

[0082] Example 2

[0083] To facilitate the understanding of the subsequent manufacturing process of the array sensor, this embodiment first describes the structure design of the special mold. As shown in Figures 2-9 The mold of the present application includes a base plate assembly 21, a first wire harness plate 22 and a second wire harness plate 23, the base plate assembly 21 is used to form the sensor base 11, the first wire harness plate 22 is used to adhere the wire harness along the X direction to the upper surface of the sensor base 11, and the second wire harness plate 23 is used to adhere the wire harness along the Y direction to the lower surface of the sensor base 11.

[0084] Specifically, as Figures 2-4As shown, the base plate assembly 21 includes a base pressing plate 211 and a base preform plate 212, the base preform plate 212 has a first assembly surface 2121 and a second assembly surface 2122, and the base pressing plate 211 has a third assembly surface 2111. The base preform plate 212 is detachably assembled to the base pressing plate 211, and a plurality of through holes are arrayed on the base preform plate 212. When the base preform plate 212 is assembled and fixed to the base pressing plate 211, the first assembly surface 2121 of the base preform plate 212 is attached to the third assembly surface 2111 of the base pressing plate 211, so that the through holes on the base preform plate 212 and the third assembly surface 2111 of the base pressing plate 211 together form microcavities for filling and curing of the sensor base material. It should be noted that the detachable assembly of the base preform plate 212 and the base pressing plate 211 has various forms, and here the sliding assembly is taken as an example for illustration. Specifically, as shown in Figure 4 As shown, the third assembly surface 2111 of the base pressing plate 211 is provided with first sliding rails 21111 on both sides along the X direction, and the first assembly surface 2121 of the base preform plate 212 is provided with first sliding grooves 21211 on both sides along the X direction. The first sliding rails 21111 can slide relative to the first sliding grooves 21211 to complete the assembly and fixation of the base preform plate 212 and the base pressing plate 211.

[0085] In use, the base pressing plate 211 is placed horizontally on the workbench, and the base preform plate 212 is assembled and fixed on the base pressing plate 211 through the guide cooperation of the first sliding rails 21111 and the first sliding grooves 21211; then the preformed sensor base material is spread on the surface of the base preform plate 212, and the spatula is used for scraping the paste to ensure that it is fully filled in the microcavity array; then the mold is moved into the vacuum chamber for 40 minutes to discharge the bubbles in the paste; the paste is supplemented again to fill the bubble vacancy; then the mold is placed in a 160°C heating box for 2H to complete the curing and forming of the sensor base. It should be noted that the mold can be made of CNC numerical control processing metal, or can be made of 3D printing or laser etching acrylic plate. In short, all manufacturing solutions that can meet the requirements of manufacturing precision and material preparation process, such as high temperature resistance, etc. can be used.

[0086] Further, as shown in Figure 6 The first wire harness plate 22 is combined with the base preform plate 212 to adhere the fixed wire harness on the first wire harness plate 22 to the upper surface of the sensor base. Specifically, in combination with Figure 5As shown, the first wire harness plate 22 has a fourth assembly surface 221, and a plurality of first wire grooves 2211 and two first liquid injection grooves 2213 are formed on the fourth assembly surface 221 along the X direction. The first wire grooves 2211 are arranged correspondingly to the row of through holes on the base prefabricated plate 212, and are used to realize accurate positioning and transfer bonding of the X direction wire harness. The row of through holes refers to the through holes in the X direction. The two first liquid injection grooves 2213 are respectively located on the two sides of the first wire grooves 2211, and one end of the first liquid injection groove 2213 is opened at the edge of the first wire harness plate 22 and forms a first liquid injection hole, and the other end is flush with the first wire groove 2211. A first flow groove 2214 is formed in communication with the end flush with the first wire groove 2211.

[0087] Further, in order to facilitate the assembly of the first wire harness plate 22 and the base prefabricated plate 212, second sliding rails 21221 are arranged on the two sides of the second assembly surface 2122 of the base prefabricated plate 212 along the X direction, and second sliding grooves 2212 are arranged on the two sides of the fourth assembly surface 221 of the first wire harness plate 22 along the X direction. The second sliding rails 21221 and the second sliding grooves 2212 are matched to make the fourth assembly surface 221 and the second assembly surface 2122 fit when the first wire harness plate 22 is assembled with the base prefabricated plate 212.

[0088] In use, the first wire harness plate 22 is assembled and fixed on the base prefabricated plate 212 through the guiding cooperation of the second sliding grooves 2212 and the second sliding rails 21221. At this time, the fourth assembly surface 221 of the first wire harness plate 22 and the second assembly surface 2122 of the base prefabricated plate 212 fit, so that the wire harness fixed in the first wire groove 2211 fits with the upper surface of the sensor base 11. Then the assembled mold is placed vertically with the first liquid injection hole upward, conductive glue is injected into one of the liquid injection holes, so that the glue solution uniformly infiltrates the contact surface of the first wire harness plate 22 and the sensor base 11. Then the mold is placed flat, the first wire harness plate 22 is located above, and after a period of time, the wire harness on the first wire harness plate 22 is adhered to the upper surface of the sensor base after the glue solution is solidified, forming a first wire layer. It should be noted that the design of the first liquid injection groove 2213 and the first flow groove 2214 utilizes the principle of a communicating vessel. When the glue solution overflows from the other liquid injection hole, it means that the glue solution has uniformly infiltrated the contact surface of the first wire harness plate 22 and the sensor base 11, solving the problem of uneven filling and overflow of conductive glue in traditional processes and improving the yield rate. In addition, placing the mold flat can make the glue solution better contact with the sensor base.

[0089] Further, as shown in Figure 9 The second wire harness plate 23 is combined with the first wire harness plate 22 to adhere the wire harness fixed on the second wire harness plate 23 to the lower surface of the sensor base. Specifically, in combination with Figure 7As shown, the second wire harness plate 23 has a fifth assembly surface 231, and a plurality of second wire grooves 2311 and two second liquid injection grooves 2314 are formed on the fifth assembly surface 231 along the Y direction. The second wire grooves 2311 are arranged correspondingly to the columnar through holes on the base prefabricated plate 212, so as to realize accurate positioning and transfer bonding of the Y direction wire harness. The two second liquid injection grooves 2314 are respectively located on the two sides of the second wire grooves 2311, and one end of the second liquid injection grooves 2314 is opened at the edge of the second wire harness plate 23 and forms a second liquid injection hole, and the other end is flush with the second wire grooves 2311. The end flush with the second wire grooves 2311 is communicated with a second flow groove 2315. It should be noted that before assembling the first wire harness plate 22 and the second wire harness plate 23, the base pressing plate 211 needs to be removed first, and then the sensor substrate 11 is separated from the base prefabricated plate 212. At this time, the sensor substrate 11 is adhered to the first wire harness plate 22, and then the first wire harness plate 22 is placed on the workbench, and then the second wire harness plate 23 is assembled and fixed on the first wire harness plate 22 through the guide cooperation of the guide rail bracket 24.

[0090] Specifically, in combination with Figure 8 As shown, the guide rail bracket 24 includes a guide rail 241 and a guide groove 242, and the guide rail 241 is slidably assembled in the second sliding groove 2212. The two sides of the fifth assembly surface 231 of the second wire harness plate 23 are provided with third sliding rails 2312 along the X direction, and the third sliding rails 2312 are slidably assembled in the guide groove 242. The guide rail bracket 24 is matched with the second sliding groove 2212 and the third sliding rail 2312, so that when the second wire harness plate 23 is assembled with the first wire harness plate 22, the fifth assembly surface 231 of the second wire harness plate 23 is attached to the lower surface of the sensor substrate.

[0091] Further, since the sensor substrate 11 is adhered to the fourth assembly surface 221 of the first wire harness plate 22, that is, the sensor substrate 11 is protruded on the fourth assembly surface 221, when the conductive adhesive is injected between the fifth assembly surface 231 of the second wire harness plate 23 and the sensor substrate 11, the glue liquid will be blocked in the gap between the sensor substrate 11 and the first wire harness plate 22, causing the sensor unit to fall off. The middle part of the second wire harness plate 23 protrudes along the Y direction, and the height of the pressing layer 2313 is 0.1mm, which is approximately equal to the thickness of the sensor substrate 11. When the second wire harness plate 23 is assembled and fixed with the first wire harness plate 22, the pressing layer 2313 of the second wire harness plate 23 is pressed on the fourth assembly surface of the first wire harness plate 22, so that each plate layer is in a certain interference assembly state.

[0092] In summary, the mold of the application has a clever structure design, through the design of sandwich structure, the multi-layer structure can be pressed together, the modular production process is realized, and the product yield is improved. In addition, through the guiding cooperation of the sliding rail and the sliding groove, the positioning accuracy of the mold is high, and the operation is simple and convenient.

[0093] Example 3

[0094] The steps of preparing the array sensor by using the above mold are as follows:

[0095] S1. Assemble the base plate assembly 21, and lay the prefabricated sensor base material flat on the base prefabricated plate 212;

[0096] S2. Move the base plate assembly 21 into a vacuum chamber for vacuum treatment;

[0097] S3. Add sensor base material to make up the empty space;

[0098] S4. Put the base plate assembly 21 into a heating box for heating and curing to form the sensor base 11;

[0099] S5. Assemble and fix the first wire harness plate 22 assembled with wire harness to the base prefabricated plate 212, so that the wire harness is attached to the upper surface of the sensor base 11;

[0100] S6. Inject conductive glue into the junction of the first wire harness plate 22 and the sensor base 11;

[0101] S7. After the conductive glue is cured, the first wire layer 121 is formed;

[0102] S8. Remove the base pressing plate 211;

[0103] S9. Separate the sensor base 11 from the base prefabricated plate 212, and the sensor base 11 is adhered to the first wire harness plate 22;

[0104] S10. Assemble and fix the second wire harness plate 23 assembled with wire harness to the first wire harness plate 22, so that the wire harness is attached to the lower surface of the sensor base 11;

[0105] S11. Inject conductive glue into the junction of the second wire harness plate 23 and the sensor base 11;

[0106] S12. After the conductive glue is cured, the second wire layer 122 is formed.

[0107] The preparation method of the array sensor has been described in detail in Example 2, and will not be repeated here.

[0108] It should be pointed out that the above is only the preferred embodiment of the present application, and does not limit the present application in any form. Any simple modification, equivalent change and modification of the above embodiment according to the technical essence of the present application still belongs to the scope of the technical solution of the present application.

Claims

1. An array-type sensor suitable for use on the skin of a crash test dummy, characterized in that, It includes a sensor substrate (11) and a wire layer (12), wherein the wire layer (12) includes a first wire layer (121) and a second wire layer (122), which are respectively adhered to the upper and lower surfaces of the sensor substrate (11); The first conductor layer (121) includes a plurality of conductor bundles distributed along the X direction for connecting sensor units in the same row; the second conductor layer (122) includes a plurality of conductor bundles distributed along the Y direction for connecting sensor units in the same column. The lead bundle comprises several silver wires, PDMS colloid wrapped around the silver wires, and several reinforcing fibers, and its preparation steps are as follows: Step 1: Prepare several silver wires of appropriate diameter and length; Step 2: Place the silver wire into the prepared PDMS colloid for initial coating, forming a wrap around the edges; Step 3: Add some reinforcing fibers to improve the mechanical strength of the conductor; Step 4: Use a hot press or hot air gun to heat and compact the silver wires and reinforcing fibers together. Step 5: Cool and solidify.

2. The array sensor for use on the skin of a crash test dummy according to claim 1, characterized in that, It also includes an insulating layer located outside the conductor layer.

3. A mold for fabricating an array-type sensor suitable for use on a crash test dummy skin as described in any one of claims 1-2, characterized in that, Includes a base plate assembly (21), a first wire harness plate (22), and a second wire harness plate (23); The base plate assembly (21) includes a base plate (211) and a base prefabricated plate (212). The base prefabricated plate (212) has a first assembly surface (2121) and a second assembly surface (2122), and the base plate (211) has a third assembly surface (2111). The base prefabricated plate (212) is detachably assembled to the base plate (211), and the base prefabricated plate (212) has a plurality of through holes arranged in an array. When the base prefabricated plate (212) is assembled with the base plate (211), the first assembly surface (2121) on the base prefabricated plate (212) is in contact with the third assembly surface (2111) of the base plate (211). The first wire harness plate (22) has a fourth assembly surface (221), which is detachably assembled to the second assembly surface (2122) of the substrate prefabricated plate (212) for adhering the first wire layer (121) to the upper surface of the sensor substrate (11); The second wire harness plate (23) has a fifth assembly surface (231), which is detachably assembled to the fourth assembly surface (221) of the first wire harness plate (22) for adhering the second wire layer (122) to the lower surface of the sensor substrate (11).

4. The preparation mold according to claim 3, characterized in that, The fourth assembly surface (221) of the first wire harness plate (22) is provided with a plurality of first wire grooves (2211) along the X direction. The first wire grooves (2211) are correspondingly arranged with the through holes on the substrate prefabricated plate (212). When the first wire harness plate (22) is assembled with the substrate prefabricated plate (212), the wire harness fixed on the fourth assembly surface (221) is attached to the upper surface of the sensor substrate (11).

5. The preparation mold according to claim 3, characterized in that, The second wire harness plate (23) has a plurality of second wire grooves (2311) opened along the Y direction on the fifth assembly surface (2311) and the second wire grooves (2311) are corresponding to the through holes on the substrate prefabricated plate (212); when the second wire harness plate (23) is assembled with the first wire harness plate (22), the wire harness fixed on the fifth assembly surface (231) is attached to the lower surface of the sensor substrate (11).

6. The preparation mold according to claim 5, characterized in that, A pressure layer (2313) is provided in the middle of the fifth assembly surface (231) along the Y direction.

7. The preparation mold according to claim 4, characterized in that, The third assembly surface (2111) of the base plate (211) is provided with first slide rails (21111) on both sides along the X direction, and the first assembly surface (2121) of the base precast plate (212) is provided with first slide grooves (21211) on both sides along the X direction. The first slide grooves (21211) are matched with the first slide rails (21111) so that when the base precast plate (212) and the base plate (211) are assembled, the first assembly surface (2121) and the third assembly surface (2111) are in contact.

8. The preparation mold according to claim 6, characterized in that, The second assembly surface (2122) of the base prefabricated plate (212) is provided with a second slide rail (21221) on both sides along the X direction, and the fourth assembly surface (221) of the first wire harness plate (22) is provided with a second slide groove (2212) on both sides along the X direction. The second slide rail (21221) and the second slide groove (2212) are matched and configured so that when the first wire harness plate (22) is assembled with the base prefabricated plate (212), the fourth assembly surface (221) and the second assembly surface (2122) are in contact.

9. The preparation mold according to claim 8, characterized in that, It also includes a guide rail bracket (24), which includes a guide rail (241) and a guide groove (242). The guide rail (241) is slidably assembled in the second slide groove (2212). A third slide rail (2312) is provided on both sides of the fifth assembly surface (231) of the second wire harness plate (23) along the X direction. The third slide rail (2312) is slidably assembled in the guide groove (242). The guide rail bracket (24) is matched with the second slide groove (2212) and the third slide rail (2312) so that when the second wire harness plate (23) is assembled with the first wire harness plate (22), the pressure layer (2313) abuts against the fourth assembly surface (221) of the first wire harness plate (22).

10. The preparation mold according to claim 4, characterized in that, The fourth assembly surface (221) of the first wire harness plate (22) is also provided with a first liquid injection groove (2213) and a first flow guide groove (2214). The first liquid injection groove (2213) is provided in two sets, which are located on both sides of the first wire guide groove (2211). One end of the first flow guide groove (2214) is flush with the first wire guide groove (2211), and the other end opens at the edge of the first wire harness plate (22) and forms a first liquid injection hole. The first flow guide groove (2214) is connected to the flush end of the first liquid injection groove (2213) and the first wire guide groove (2211).

11. The preparation mold according to claim 5, characterized in that, The second wiring harness plate (23) has a second liquid injection groove (2314) and a second flow guide groove (2315) on its fifth assembly surface (231). The second liquid injection groove (2314) is provided in two sets, located on both sides of the second wire guide groove (2311). One end of the second liquid injection groove (2314) opens at the edge of the second wiring harness plate (23) and forms a second liquid injection hole, while the other end is flush with the second wire guide groove (2311). The second flow guide groove (2315) is connected to the flush end of the second liquid injection groove (2314) and the second wire guide groove (2311).

12. A method for fabricating an array sensor, using the mold described in any one of claims 3-11, characterized in that, Includes the following steps: S1. Assemble the substrate assembly (21) and lay the pre-made sensor substrate material flat on the substrate prefabricated plate (212); S2. The substrate assembly (21) is moved into a vacuum chamber for vacuum treatment; S3. Add sensor substrate material to fill the gaps; S4. The substrate assembly (21) is placed in a heating box and heated and cured to form the sensor substrate (11). S5. Assemble and fix the first wire harness plate (22) with the wire harness assembled on it to the base prefabricated plate (212) so that the wire harness is attached to the upper surface of the sensor base (11); S6. Inject conductive adhesive into the joint between the first wire harness plate (22) and the sensor substrate (11); S7. Let stand until the conductive adhesive cures to form the first conductor layer (121). S8. Remove the base plate (211). S9. Separate the sensor substrate (11) from the substrate prefabrication plate (212), and bond the sensor substrate (11) to the first wire harness plate (22); S10. Assemble and fix the second wire harness plate (23) with the wire harness assembled on it to the first wire harness plate (22), so that the wire harness is in contact with the lower surface of the sensor substrate (11); S11. Inject conductive adhesive into the joint between the second wire harness plate (23) and the sensor substrate (11); S12. Let stand until the conductive adhesive cures to form the second conductor layer (122).

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