Transformer, power supply module and electronic equipment

Abstract

The invention provides a transformer, a power supply module and electronic equipment, relates to the technical field of communication, and aims to solve the problem that the power supply loss of the transformer is relatively large. The transformer comprises a magnetic core and a circuit board assembly, the circuit board assembly comprises a dielectric substrate, a plurality of first conducting layers and a plurality of second conducting layers, and the voltage level of the first conducting layers is smaller than that of the second conducting layers; the plurality of first conductive layers and the plurality of second conductive layers are stacked in the dielectric substrate at intervals along the thickness direction of the dielectric substrate; the circuit board assembly further comprises a through hole, the through hole penetrates through the dielectric substrate and the at least one first conductive layer, the second conductive layer is located in the dielectric substrate, and the magnetic core penetrates through the through hole. In the transformer provided by the invention, the through hole penetrates through the first conductive layer, and the through hole does not penetrate through the second conductive layer, so that the second conductive layer has relatively good insulation performance, and the first conductive layer has a relatively large layout area, so that the transformer has relatively small power loss and relatively good insulation safety.

Description

Technical Field

[0001] This application relates to the field of communication technology, and in particular to a transformer, a power supply module, and an electronic device. Background Technology

[0002] With the continuous improvement of communication equipment performance, its operating power consumption has also increased significantly. Higher operating power consumption significantly increases electricity costs for operators and users. Furthermore, in practical applications, transformers are needed to regulate electrical energy to supply power to the electrical components in communication equipment. During the process of transformer regulation, a certain degree of power loss is generated. Higher power loss is detrimental to improving energy utilization efficiency, thereby increasing electricity costs. Therefore, how to reduce transformer power loss has become an urgent technical problem to be solved. Summary of the Invention

[0003] This application provides a transformer, power module, and electronic device with low power loss.

[0004] In a first aspect, this application provides a transformer, including a magnetic core and a circuit board assembly. The circuit board assembly includes a dielectric substrate, a plurality of first conductive layers, and a plurality of second conductive layers. Along the thickness direction of the dielectric substrate, the plurality of first conductive layers and the plurality of second conductive layers are stacked at intervals within the dielectric substrate. The circuit board assembly also includes vias penetrating the dielectric substrate and at least one first conductive layer, and the plurality of second conductive layers are all located within the dielectric substrate. The magnetic core passes through the vias, thereby achieving effective mating between the magnetic core and the circuit board assembly. The voltage level of the first conductive layers is lower than the voltage level of the second conductive layers.

[0005] Specifically, "the voltage rating of the first conductive layer is lower than that of the second conductive layer" means that the maximum voltage that the second conductive layer can withstand is greater than that that the first conductive layer can withstand, while still meeting safety insulation requirements. Alternatively, it means that when a higher voltage is applied to the second conductive layer, it still maintains good safety and a low risk of leakage. A through-hole penetrates the first conductive layer but not the second conductive layer, giving the second conductive layer good insulation performance and allowing the first conductive layer to have a larger coverage area. Alternatively, it can be understood that when designing the second conductive layer, the location of the second through-hole can be reasonably avoided to prevent a reduction in the insulation safety of the second conductive layer. When designing the first conductive layer, the location of the first through-hole can be left unavoidable, effectively increasing the coverage area of ​​the first conductive layer. Current flowing through the first conductive layer experiences less loss, which helps reduce power loss in the transformer.

[0006] In a specific configuration, the through-hole can penetrate each first conductive layer, so that each first conductive layer has a small AC resistance, thereby effectively reducing the power loss of the entire transformer.

[0007] In one example, the first conductive layer and the second conductive layer are stacked sequentially along the thickness direction of the dielectric substrate. That is, two adjacent first conductive layers can be separated by the second conductive layer. Since the second conductive layer is enclosed within the dielectric substrate, it has good insulation safety. Therefore, when the second conductive layer separates two adjacent first conductive layers, it can effectively improve the arc distance and insulation safety between the two adjacent first conductive layers, thereby effectively improving the insulation safety of the entire transformer.

[0008] In one example, the distance between the first conductive layer and the inner wall of the via is greater than or equal to 0 microinches and less than or equal to 4 microinches. Alternatively, it can be understood that a smaller distance between the first conductive layer and the inner wall of the via helps to increase the coverage area of ​​the first conductive layer, thereby reducing AC resistance. A larger distance between the first conductive layer and the inner wall of the via helps to improve the insulation performance of the first conductive layer, thereby ensuring the safety insulation requirements of the transformer.

[0009] In one example, the distance between the second conductive layer and the inner wall of the via is greater than or equal to 4 microinches to ensure the insulation performance of the second conductive layer, thereby ensuring the safety insulation requirements of the transformer.

[0010] In one example, the distance between the first conductive layer and the periphery of the dielectric substrate is greater than or equal to 0 microinches and less than or equal to 4 microinches. Alternatively, it can be understood that a smaller distance between the first conductive layer and the periphery or edge of the dielectric substrate helps to increase the coverage area of ​​the first conductive layer, thereby reducing AC resistance. A larger distance between the first conductive layer and the periphery or edge of the dielectric substrate helps to improve the insulation performance of the first conductive layer, thereby ensuring the safety insulation requirements of the transformer.

[0011] In one example, the distance between the second conductive layer and the outer edge of the dielectric substrate is greater than or equal to 4 microinches. This ensures the insulation performance of the second conductive layer, thereby meeting the safety insulation requirements of the transformer.

[0012] In one example, the transformer also includes a corrosion-resistant material located on the inner wall of the through-hole, which seals the first conductive layer. The corrosion-resistant material effectively seals the first conductive layer, preventing it from corroding.

[0013] In one example, the transformer also includes a corrosion-resistant material located at the outer edge of the dielectric substrate and covering the first conductive layer. The corrosion-resistant material effectively covers the first conductive layer to prevent corrosion.

[0014] In one example, there is a gap between the magnetic core and the inner wall of the through hole to ensure effective fit between the magnetic core and the circuit board assembly.

[0015] In one example, the circuit board assembly includes at least two through holes, and the magnetic core includes at least two magnetic pillars, each of which passes through one of the at least two through holes. The transformer assembly also includes at least two coils, with at least one coil surrounding each magnetic pillar. Increasing the number of coils and magnetic pillars can effectively improve the transformer's transformation versatility, thus increasing its adaptability and wider application.

[0016] In a specific configuration, the circuit board assembly includes two through holes, designated as a first through hole and a second through hole. The magnetic core includes two magnetic pillars, designated as a first magnetic pillar and a second magnetic pillar. The first magnetic pillar passes through the first through hole, and the second magnetic pillar passes through the second through hole. A first conductive layer includes a first conductive pattern and a second conductive pattern. A second conductive layer includes a third conductive pattern and a fourth conductive pattern. The first conductive pattern surrounds the first magnetic pillar, and multiple first conductive patterns are connected in series. The second conductive pattern surrounds the second magnetic pillar, and multiple second conductive patterns are connected in series. The third conductive pattern surrounds the first magnetic pillar, and multiple third conductive patterns are connected in series. The fourth conductive pattern surrounds the second magnetic pillar, and multiple fourth conductive patterns are connected in series.

[0017] In this design, multiple first conductive patterns connected in series can form a coil, multiple second conductive patterns connected in series can form a coil, multiple third conductive patterns connected in series can form a coil, and multiple fourth conductive patterns connected in series can form a coil. Each coil can serve as both an input and an output, thereby effectively improving the transformer's voltage transformation versatility.

[0018] Secondly, this application also provides a power module, including a power converter and the aforementioned transformer, wherein the power converter is connected to a first conductive layer. Alternatively, the power converter may also be connected to a second conductive layer. Alternatively, the power converter may also be connected to both the first and second conductive layers. The power converter can effectively convert between alternating current and direct current, thereby meeting the power requirements of the transformer and the electrical devices. In the power module provided by this application, by equipping it with the aforementioned transformer, the power module exhibits lower power loss, which is beneficial for improving the efficiency of power utilization.

[0019] Thirdly, this application also provides an electronic device, including an electronic component and the aforementioned power module. The electronic component is connected to the output terminal of the power module, which supplies power to the electronic component. The power module can step down or step up the voltage of electrical energy before supplying it to the electronic component to ensure its power requirements. Alternatively, the power module can convert alternating current (AC) to direct current (DC) before supplying it to the electronic component, or vice versa. In the electronic device provided by this application, by equipping it with the aforementioned power module, the electronic device exhibits lower power loss, which is beneficial for improving the efficiency of energy utilization. Attached Figure Description

[0020] Figure 1 This is a schematic diagram illustrating an application scenario of a transformer provided in an embodiment of this application;

[0021] Figure 2 This is a schematic cross-sectional view of a conventional transformer provided in an embodiment of this application;

[0022] Figure 3 for Figure 2 A schematic diagram of the planar structure of the dielectric substrate of the transformer in the diagram;

[0023] Figure 4 A simplified structural diagram of a conventional transformer provided in this application embodiment;

[0024] Figure 5 This is a cross-sectional structural diagram of a transformer provided in an embodiment of this application;

[0025] Figure 6 A simplified structural diagram of a transformer provided in an embodiment of this application;

[0026] Figure 7 for Figure 6 A schematic diagram of the planar structure of the dielectric substrate in the image;

[0027] Figure 8 A cross-sectional structural schematic diagram of another transformer provided in an embodiment of this application;

[0028] Figure 9 A cross-sectional structural schematic diagram of another transformer provided in an embodiment of this application;

[0029] Figure 10 A cross-sectional structural schematic diagram of another transformer provided in an embodiment of this application;

[0030] Figure 11 for Figure 10 A schematic diagram of the planar structure of the dielectric substrate in the image;

[0031] Figure 12 for Figure 10 Another planar structural diagram of the dielectric substrate in the diagram;

[0032] Figure 13 A simplified structural diagram of a transformer provided in an embodiment of this application;

[0033] Figure 14 A cross-sectional structural schematic diagram of another transformer provided in an embodiment of this application;

[0034] Figure 15 A cross-sectional structural schematic diagram of another transformer provided in an embodiment of this application;

[0035] Figure 16 for Figure 15 A schematic diagram of the planar structure of the dielectric substrate in the image;

[0036] Figure 17 A cross-sectional structural schematic diagram of another transformer provided in an embodiment of this application;

[0037] Figure 18 A cross-sectional structural schematic diagram of another transformer provided in an embodiment of this application;

[0038] Figure 19 A simulation diagram of a transformer provided in an embodiment of this application;

[0039] Figure 20 A cross-sectional structural schematic diagram of another transformer provided in an embodiment of this application;

[0040] Figure 21 A cross-sectional structural schematic diagram of another transformer provided in an embodiment of this application;

[0041] Figure 22 A structural block diagram of a power module provided in an embodiment of this application;

[0042] Figure 23 This is a structural block diagram of an electronic device provided in an embodiment of this application. Detailed Implementation

[0043] To make the objectives, technical solutions, and advantages of this application clearer, the application will now be described in further detail with reference to the accompanying drawings.

[0044] To facilitate understanding of the transformer provided in the embodiments of this application, its application scenarios will be introduced first below.

[0045] like Figure 1As shown, in practical applications, the operating voltage of electronic devices is relatively low. For example, some chips operate at low voltages such as 6V, 3.3V, or 1.8V. The power supply voltage in the grid is generally higher, such as 220V, 380V, or 400V. Therefore, in order to meet the power requirements of electronic devices such as chips, it is necessary to step down the voltage of the power grid.

[0046] The transformer provided in this application embodiment can be used in a power supply architecture for voltage step-up / step-down conversion. The transformer can be configured as a standalone device or integrated into electronic devices. For example, the transformer can be configured as a standalone device in a power supply architecture and combined with, for example, a primary power supply to achieve effective voltage conversion. Alternatively, the transformer can also be used in electronic devices such as routers, base stations, computers, and servers to provide power to electrical components such as chips within these devices.

[0047] As the performance of electronic devices continues to improve, their power consumption has also increased significantly. Higher power consumption can significantly increase electricity costs for operators and users. Therefore, the industry needs to develop more efficient transformers to reduce power loss.

[0048] like Figure 2 As shown, the current transformer 01 generally includes a magnetic core 011 and a circuit board assembly 012. The circuit board assembly 012 includes a multilayer stacked dielectric substrate 0121 and multiple copper layers 0122.

[0049] In addition, such as Figure 3 The diagram shows a plan view of a dielectric substrate 0121 and a copper layer 0122 located on the dielectric substrate 0121. Two C-shaped conductive patterns can be formed in the copper layer 0122 through processes such as etching. Please refer to the reference [reference needed]. Figure 2 and Figure 3 Along the thickness direction of the dielectric substrate 0121, the conductive patterns of the two Cs are connected in series through conductive structures such as metal vias (not shown in the figure), thereby forming a primary coil and a secondary coil, respectively. The coil connected to the power supply is usually called the primary coil and is typically used as the input terminal. The coil connected to the load is usually called the secondary coil and is typically used as the output terminal. That is, the primary coil refers to the coil that receives electrical energy, and the secondary coil refers to the coil that outputs electrical energy.

[0050] like Figure 2 and Figure 4As shown, the magnetic core 011 forms a closed magnetic circuit. When current flows through the primary coil 0125, a magnetic field is generated in the magnetic core 011, thus forming a magnetic flux. According to the principle of electromagnetic induction, when the alternating magnetic flux passes through the secondary coil 0126, an electromotive force is induced in the secondary coil 0126. That is, the primary coil 0125 and the secondary coil 0126 are electromagnetically connected through the magnetic core 011. By reasonably setting parameters such as the number of turns of the primary coil 0125 and the secondary coil 0126, the voltage can be increased or decreased.

[0051] like Figure 2 As shown, to achieve effective fitting between the circuit board assembly 012 and the magnetic core 011, the circuit board assembly 012 includes two through holes, namely through hole 0123 and through hole 0124, and the magnetic core 011 includes two magnetic pillars, namely magnetic pillar 0111 and magnetic pillar 0112. Magnetic pillar 0111 passes through through hole 0123, and magnetic pillar 0112 passes through through hole 0124. In the current transformer, considering the assembly precision between the circuit board assembly 012 and the magnetic core 011, the diameter of through hole 0123 is slightly larger than the outer diameter of magnetic pillar 0111, and the diameter of through hole 0124 is slightly larger than the outer diameter of magnetic pillar 0112. For example, the distance between the inner wall of through hole 0123 and the outer wall of magnetic pillar 0111 is approximately 2 microinches, allowing the magnetic core 011 to achieve good fitting with the circuit board assembly 012. In addition, to ensure the safety of transformer 01, copper layers 0122 are all located inside dielectric substrate 0121, and the distance between copper layers 0122 and the edge of dielectric substrate 0121 is relatively large, generally more than 10 microinches.

[0052] For example, such as Figure 3 As shown, the distance L between the copper layer 0122 and the inner wall of the through hole 0123 is greater than 10 microinches, which limits the area of ​​the copper layer 0122. The current has a large resistance when flowing through the copper layer 0122, which is not conducive to reducing the power loss of the transformer 01.

[0053] In summary, considering factors such as manufacturing precision and safety regulations, the copper layer 0122 has a relatively small footprint. This results in higher power losses during the power regulation process of transformer 01. Higher power losses hinder energy utilization efficiency and thus increase electricity costs. Therefore, reducing the power losses of transformer 01 is a pressing technical problem that needs to be solved.

[0054] Therefore, embodiments of this application provide a transformer that can effectively reduce power loss.

[0055] To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0056] like Figure 5 As shown, in one example provided in this application, the transformer 10 includes a magnetic core 11 and a circuit board assembly 12. The circuit board assembly 12 includes a dielectric substrate 121 and a plurality of ( Figure 5 The diagram shows three) first conductive layers 122 and multiple ( Figure 5 (Four second conductive layers 123 are shown.) Along the thickness direction of the dielectric substrate 121, multiple first conductive layers 122 and multiple second conductive layers 123 are stacked at intervals within the dielectric substrate 121. The circuit board assembly 12 also includes vias (such as first vias 124 and second vias 125), which penetrate the dielectric substrate 121 and the first conductive layers 122. Furthermore, the vias (such as first vias 124 and second vias 125) do not penetrate the second conductive layers 123; all the second conductive layers 123 are located within the dielectric substrate 121, and the magnetic core 11 passes through the vias. The voltage rating of the first conductive layer 122 is lower than the voltage rating of the second conductive layer 123.

[0057] Specifically, the magnetic core 11 includes two magnetic pillars and two connecting arms. The two magnetic pillars are a first magnetic pillar 111 and a second magnetic pillar 112, and the two connecting arms are a first connecting arm 113 and a second connecting arm 114. The first magnetic pillar 111, the first connecting arm 113, the second magnetic pillar 112, and the second connecting arm 114 are connected sequentially to form a magnetic circuit. The circuit board assembly 12 includes two through holes, a first through hole 124 and a second through hole 125. The first magnetic pillar 111 passes through the first through hole 124, and the second magnetic pillar 112 passes through the second through hole 125, thereby achieving effective adaptation between the magnetic core 11 and the circuit board assembly 12.

[0058] Please refer to the following: Figure 5 and Figure 6 Along the thickness direction of the dielectric substrate 121, a plurality of first conductive layers 122 are connected through metal vias ( Figure 5 Structures such as (not shown in the image) are connected in series to form the first coil 1201, and multiple second conductive layers 123 are connected through metal vias (…). Figure 5 The first coil 1201 (not shown) and other structures are connected in series to form the second coil 1202. The first coil 1201 surrounds the first magnetic post 111, and the second coil 1202 surrounds the second magnetic post 112. When the first coil 1201 is the output and the second coil 1202 is the input, according to the principle of electromagnetic induction, when an alternating current is passed through the second coil 1202, an electromotive force is generated in the first coil 1201. By appropriately setting parameters such as the number of turns of the first coil 1201 and the second coil 1202, the voltage output by the first coil 1201 can be adjusted accordingly. For example, when the number of turns of the first coil 1201 is less than the number of turns of the second coil 1202, the voltage at the input terminal will be greater than the voltage at the output terminal, thus achieving a voltage reduction effect.

[0059] In the example provided in this application, the voltage level of the first conductive layer 122 being lower than that of the second conductive layer 123 specifically means that the maximum voltage that the second conductive layer 123 can withstand is greater than the maximum voltage that the first conductive layer 122 can withstand, while still meeting safety insulation requirements. Alternatively, when a higher voltage is applied to the second conductive layer 123, it still maintains good safety and a low risk of leakage. Through-holes (such as the first through-hole 124) penetrate the first conductive layer 122, while through-holes (such as the first through-hole 124 and the second through-hole 125) do not penetrate the second conductive layer 123, resulting in good insulation performance for the second conductive layer 123 and a larger coverage area for the first conductive layer 122. Alternatively, it can be understood that when configuring the second conductive layer 123, the location of the second through-hole 125 can be reasonably avoided to prevent a reduction in the insulation safety of the second conductive layer 123 due to the presence of the second through-hole 125. When setting the first conductive layer 122, the position of the first through hole 124 can be opened without avoiding it, thereby effectively increasing the layout area of ​​the first conductive layer 122. When the current flows in the first conductive layer 122, it has a small loss, which is beneficial to reduce the power loss of the transformer 10.

[0060] For example, after creating the second through-hole 125, the distance between the second conductive layer 123 and the inner wall of the second through-hole 125 can be greater than or equal to 4 microinches to ensure the insulation safety of the second conductive layer 123. The distance between the second conductive layer 123 and the inner wall of the second through-hole 125 can be reasonably set according to specific safety regulations, which will not be elaborated here. Furthermore, after creating the first through-hole 124, the distance between the first conductive layer 122 and the inner wall of the first through-hole 124 can be approximately zero, meaning the first conductive layer 122 is exposed within the first through-hole 124.

[0061] In summary, neither the first through-hole 124 nor the second through-hole 125 penetrates the second conductive layer 123, allowing the second conductive layer 123 to be effectively encapsulated within the dielectric substrate 121. This improves the insulation performance of the second conductive layer 123 and meets higher safety insulation requirements. Furthermore, the first conductive layer 122 has a large coverage area, effectively reducing the power loss of the transformer 10.

[0062] In a specific configuration, the dielectric substrate 121 can be a substrate used for fabricating a printed circuit board (PCB) or a substrate used for fabricating a flexible circuit board (FPC). Alternatively, the dielectric substrate 121 can be other types of substrates; this application does not limit the specific type of the dielectric substrate 121.

[0063] In addition, in practical applications, the circuit board assembly 12 can be formed by stacking a multilayer dielectric substrate 121 and a conductive layer.

[0064] For example, such as Figure 7 As shown, a dielectric substrate 121 is illustrated. A copper layer is present on the surface of the dielectric substrate 121, and a pattern is etched onto the copper layer using processes such as etching. Part of the pattern can form a first conductive layer 122, and another part of the pattern can form a second conductive layer 123.

[0065] In practical applications, the copper layer can also be a conductive layer formed of other conductive materials. Furthermore, the first conductive layer 122 and the second conductive layer 123 can be located on the same surface of the dielectric substrate 121, or they can be located on different surfaces. The structure and fabrication process of the circuit board assembly 12 can be configured according to currently common methods, and will not be elaborated upon here.

[0066] In specific configurations, the structure of the magnetic core 11 can be varied.

[0067] For example, such as Figure 5 As shown, in one example provided in this application, the magnetic core 11 is formed by two parts that are interlocked. Specifically, the magnetic core 11 includes two parts with a U-shaped structure. One of the parts (such as...) Figure 5 The upper part (of the structure) includes a first connecting arm 113, a portion of a first magnetic post 111, and a portion of a second magnetic post 112. The other part (such as...) Figure 5 The lower half of the structure includes a second connecting arm 114, a portion of a first magnetic post 111, and a portion of a second magnetic post 112.

[0068] When assembling the magnetic core 11 and the circuit board assembly 12, the two parts of the magnetic core 11 can be connected from both sides of the circuit board assembly 12, so that the first magnetic post 111 extends into the first through hole 124 and the second magnetic post 112 extends into the second through hole 125, which has good installation convenience.

[0069] The inner diameter of the first through hole 124 can be slightly larger than the outer diameter of the first magnetic post 111, allowing the first magnetic post 111 to be effectively inserted into the first through hole 124. Similarly, the inner diameter of the second through hole 125 can be slightly larger than the outer diameter of the second magnetic post 112, allowing the second magnetic post 112 to be effectively inserted into the second through hole 125. For example, the distance between the inner wall of the first through hole 124 and the outer wall of the first magnetic post 111 can be approximately 2 microinches. In specific configurations, the distance between the inner wall of the first through hole 124 and the outer wall of the first magnetic post 111 can be appropriately set according to the manufacturing process and precision requirements, which will not be elaborated upon here.

[0070] Furthermore, the magnetic core 11 can be made of ferrite material or other materials. In specific configurations, the material and shape of the magnetic core 11 can be configured according to currently commonly used types, and this application does not impose any restrictions on this.

[0071] In addition, in the example above, the distance between the first conductive layer 122 and the inner wall of the first through hole 124 is approximately zero, which gives the first conductive layer 122 a large coverage area.

[0072] In other examples, the distance between the first conductive layer 122 and the inner wall of the first through hole 124 can be increased to improve the insulation performance of the first conductive layer 122.

[0073] For example, such as Figure 8 As shown in one example provided in this application, after the first through-hole 124 is formed, the first conductive layer 122 can be etched to increase the distance between the first conductive layer 122 and the inner wall of the first through-hole 124, thereby increasing the arc distance between adjacent first conductive layers 122 and increasing the insulation safety of the first conductive layer 122. The etching depth of the first conductive layer 122 can be less than or equal to 4 microinches. In practical applications, the etching depth of the first conductive layer 122 can be reasonably set according to actual needs, which will not be elaborated here.

[0074] In the example above, the first through-hole 124 penetrates each first conductive layer 122. That is, each first conductive layer 122 has a large layout area. However, in practical applications, the first through-hole 124 can also penetrate at least one first conductive layer 122. That is, at least one first conductive layer 122 has a large layout area, which can still reduce the power loss of the transformer 10.

[0075] Alternatively, in some examples, the first via 124 may selectively penetrate the first conductive layer 122.

[0076] For example, such as Figure 9As shown in another example provided in this application, three first conductive layers are stacked sequentially: first conductive layer 122a, first conductive layer 122b, and first conductive layer 122c. The first through-hole 124 penetrates the first conductive layers 122a and 122c but not the first conductive layer 122b. That is, when configuring the first conductive layers 122a and 122c, the location of the first through-hole 124 can be left unobstructed, thereby effectively increasing the layout area of ​​the first conductive layers 122a and 122c. When current flows through the first conductive layers 122a and 122c, there is less loss, which helps reduce the power loss of the transformer 10. Furthermore, when configuring the first conductive layer 122b, the location of the first through-hole 124 can be avoided to prevent a reduction in the insulation safety of the first conductive layer 122b due to the presence of the first through-hole 124. In addition, since the first conductive layer 122b is located between the first conductive layer 122a and the first conductive layer 122c, the risk of arcing between the first conductive layer 122b and the first conductive layers 122a and 122c can be effectively reduced, thereby effectively improving the safety and withstand voltage performance of the transformer 10.

[0077] Understandably, in Figure 9 The example provided illustrates a circuit board assembly 12 comprising three first conductive layers 122. In practical applications, the circuit board assembly 12 may include four, five, or more first conductive layers 122. Therefore, when configured, the first via 124 can penetrate one of two adjacent first conductive layers 122, thereby reducing power loss in the transformer 10 while effectively improving its safety.

[0078] Furthermore, in the example described above, which is an exemplary illustration of the first conductive layer 122 and the second conductive layer 123 being stacked respectively, the projections of the first conductive layer 122 and the second conductive layer 123 do not overlap along the thickness direction of the dielectric substrate 121.

[0079] In other examples, the projections of the first conductive layer 122 and the second conductive layer 123 may overlap along the thickness direction of the dielectric substrate 121.

[0080] For example, such as Figure 10 As shown, in one example provided in this application, the first conductive layer 122 and the second conductive layer 123 are stacked sequentially along the thickness direction of the dielectric substrate 121.

[0081] Please refer to the following: Figure 10 , Figure 11 and Figure 12Each first conductive layer 122 includes a first conductive pattern 1221 and a second conductive pattern 1222, and each second conductive layer 123 includes a third conductive pattern 1231 and a fourth conductive pattern 1232. The first conductive pattern 1221 surrounds the first magnetic post 111, the second conductive pattern 1222 surrounds the second magnetic post 112, the third conductive pattern 1231 surrounds the first magnetic post 111, and the fourth conductive pattern 1232 surrounds the second magnetic post 112.

[0082] Please refer to the following: Figure 10 and Figure 13 Multiple first conductive patterns 1221 connected in series form a first coil 1201, multiple second conductive patterns 1222 connected in series form a third coil 1203, multiple third conductive patterns 1231 connected in series form a second coil 1202, and multiple fourth conductive patterns 1232 connected in series form a fourth coil 1204.

[0083] In summary, in the example provided in this application, the transformer 10 includes four coils, each of which can be used as either an input or an output. For example, when the second coil 1202 is used as an input, the first coil 1201 and the fourth coil 1204 can both be used as outputs. When the third coil 1203 is used as an input, the first coil 1201 and the fourth coil 1204 can both be used as outputs. In practical applications, more diverse voltage transformations can be achieved by appropriately selecting the input and output terminals.

[0084] In addition, in the example provided in this application, stacking the first conductive layer 122 and the second conductive layer 123 can effectively improve the integration of the transformer 10 and is beneficial to the miniaturization design of the transformer 10.

[0085] In addition, the sequential stacking of the first conductive layer 122 and the second conductive layer 123 can also improve the insulation performance of the transformer 10.

[0086] For example, such as Figure 10 As shown, within the first through-hole 124 and the second through-hole 125, the third conductive pattern 1231 is encased within the dielectric substrate 121, thus exhibiting good insulation performance. Furthermore, the third conductive pattern 1231 separates two adjacent layers of first conductive patterns 1221, resulting in a longer arc distance between adjacent first conductive patterns 1221. This reduces the risk of arcing between adjacent first conductive patterns 1221, thereby effectively increasing the overall insulation performance of the transformer 10.

[0087] Understandably, in other examples, some first conductive layers 122 and second conductive layers 123 may also be stacked non-sequentially.

[0088] For example, such as Figure 14 As shown, in one example provided in this application, there are two adjacent first conductive layers 122 (such as the first conductive pattern 1221 and the second conductive pattern 1222) and two adjacent second conductive layers 123 (such as the third conductive pattern 1231 and the fourth conductive pattern 1232).

[0089] In summary, in practical applications, the positional layout of the first conductive layer 122 and the second conductive layer 123 can be reasonably selected and adjusted according to actual needs, which will not be elaborated here.

[0090] In addition, in the above example, the through hole (such as the first through hole 124) penetrates the first conductive layer 122, so that the first conductive layer 122 is exposed on the inner wall of the through hole.

[0091] In other examples, the first conductive layer 122 may also extend to the edge of the dielectric substrate 121, that is, to the edge of the entire circuit board assembly 12, while the second conductive layer 123 is exposed.

[0092] Specifically, such as Figure 15 and Figure 16 As shown, in one example provided in this application, the first conductive layer 122 includes a first conductive pattern 1221 and a second conductive pattern 1222. A first through-hole 124 penetrates the first conductive pattern 1221, meaning the first conductive pattern 1221 extends to the inner wall of the first through-hole 124. Furthermore, the first conductive pattern 1221 also extends to the edge of the dielectric substrate 121, thereby further increasing the area of ​​the first conductive pattern 1221. Correspondingly, a second through-hole 125 penetrates the second conductive pattern 1222, meaning the second conductive pattern 1222 extends to the inner wall of the second through-hole 125. Furthermore, the second conductive pattern 1222 also extends to the edge of the dielectric substrate 121, thereby further increasing the area of ​​the second conductive pattern 1222.

[0093] Or, such as Figure 17 As shown, in another example provided in this application, the first conductive layer 122 can be etched to improve the insulation performance of the transformer 10. Specifically, within the first through-hole 124 and the second through-hole 125, both the first conductive pattern 1221 and the second conductive pattern 1222 are etched to a certain depth (e.g., about 3 microinches) to form a notch 1220. Additionally, at the edge of the dielectric substrate 121, both the first conductive pattern 1221 and the second conductive pattern 1222 are etched to a certain depth (e.g., about 3 microinches) to form a notch 1220.

[0094] Etching the first conductive layer 122 can effectively ensure the safety and insulation requirements of the transformer 10, and also effectively ensure the efficiency of the transformer 10.

[0095] For example, such as Figure 19 As shown in the figure, this application also provides a simulation diagram. Figure 19 The horizontal axis represents the frequency of the alternating current, in kHz; the vertical axis represents the AC resistance of the first conductive layer 122.

[0096] Where S1 represents Figure 17 The simulated curve of the AC resistance of the first conductive layer 122 in the transformer 10 shown as a function of frequency. S2 represents... Figure 18 The simulation curve of the AC resistance of the first conductive layer 122 in the transformer 10 shown as a function of frequency.

[0097] It should be noted that, in Figure 17 In the transformer 10 shown, the distance between the first conductive layer 122 and the inner wall of the through-hole and the edge of the dielectric substrate 121 is approximately 3 microinches. Figure 18 In the transformer 10 shown, the pattern of the first conductive layer 122 is substantially the same as that of the second conductive layer 123. That is to say, in Figure 18 In the transformer 10 shown, the first conductive layer 122 avoids the location of the through hole, and the distance between the first conductive layer 122 and the inner wall of the through hole and the edge of the dielectric substrate 121 is approximately 12 microinches.

[0098] pass Figure 19 It is obvious that Figure 17 The AC resistance of the first conductive layer 122 shown is significantly lower than that of the first conductive layer 122 shown. Figure 18 The AC resistance of the first conductive layer 122 shown. Therefore, Figure 17 The transformer 10 shown has low power loss.

[0099] It should be noted that in practical applications, the depth of the notch 1220 formed by etching can be reasonably set according to actual needs.

[0100] In addition, such as Figure 20 As shown, in one example, the etched gap can be filled with an anti-corrosion material 13 to prevent the first conductive layer 122 from being exposed to the external environment, thereby preventing corrosion of the first conductive layer 122. Specifically, the anti-corrosion material 13 can be a chemically resistant material such as varnish, thus providing good protection for the first conductive layer 122. In practical applications, the specific material of the anti-corrosion material 13 can be reasonably selected according to actual needs, and this application does not impose any restrictions on this.

[0101] Additionally, it should be noted that the above example is exemplified by a circuit board assembly 12 comprising a first conductive layer 122 and a second conductive layer 123 with two different voltage levels. In other examples, the circuit board assembly 12 may also include conductive layers different from the first conductive layer 122 and the second conductive layer 123. For example, a third conductive layer may be included, the voltage level of which may be greater than the voltage level of the second conductive layer 123, or the voltage level of the third conductive layer may be less than the voltage level of the first conductive layer 122. Alternatively, the voltage level of the third conductive layer may be greater than the voltage level of the first conductive layer 122 and less than the voltage level of the second conductive layer 122. Furthermore, vias (such as the first via 124 or the second via 125 described above) may or may not penetrate the third conductive layer. Alternatively, vias may selectively penetrate different layers in a multilayer third conductive layer.

[0102] It should be noted that the above example is exemplified by the circuit board assembly 12 including two through holes and the magnetic core 11 including two magnetic pillars. In other examples, the circuit board assembly 12 may also include three or more through holes, and the magnetic core 11 may include three or more magnetic pillars. Alternatively, the transformer 10 may also include multiple magnetic cores 11.

[0103] For example, such as Figure 21 As shown, in another example provided in this application, the circuit board assembly 12 includes four through holes, namely through hole 124a, through hole 125a, through hole 124b, and through hole 125b. It also includes two magnetic cores, namely magnetic core 11a and magnetic core 11b. The two magnetic posts of magnetic core 11a pass through through holes 124a and 125a, respectively, and the two magnetic posts of magnetic core 11b pass through through holes 124b and 125b, respectively.

[0104] Or, it can be understood that, Figure 21 The transformer shown can be considered as two Figure 20 The transformers shown are cascaded together. That is to say, Figure 21 The transformer shown can achieve more diverse voltage transformations and has good flexibility and applicability.

[0105] In addition, in practical applications, transformer 10 is used to transform the voltage of alternating current. However, in power supply architectures, electrical energy may be transmitted in the form of direct current. Therefore, transformer 10 can also be combined with a power converter for further applications.

[0106] For example, such as Figure 22As shown in one example provided in this application, a power module is provided, which includes a power converter and a transformer. The power converter can be used to convert direct current (DC) to alternating current (AC). Specifically, the power converter may include metal-oxide-semiconductor field-effect transistors (MOS transistors), insulated-gate bipolar transistors (IGBTs), etc. The power converter can be of commonly used types, and this application does not impose any limitations on this.

[0107] The power converter can be located at either the input or output end of the transformer.

[0108] For example, such as Figure 22 As shown in the example provided in this application, the power module includes two power converters, namely a first power converter and a second power converter. The first power converter is located at the input end of the transformer and is electrically connected to the conductive layer in the transformer. The second power converter is located at the output end of the transformer and is also electrically connected to the conductive layer in the transformer. In practical applications, the first power converter can convert the external DC power into AC power and then supply it to the transformer, enabling the transformer to step up or step down the voltage of the electrical energy. The second power converter can convert the AC power output from the transformer into DC power and then output it externally, thereby meeting the power requirements of devices such as chips.

[0109] In practical applications, power modules can be used independently in power supply architectures or integrated into electronic devices.

[0110] For example, such as Figure 23 As shown in the illustration, this application also provides an electronic device, which includes electronic components and a power module. The electronic components are connected to the output terminal of the power module, which supplies power to the electronic components. Specifically, the power module can step down or step up the voltage of electrical energy before supplying it to the electronic components to ensure their power requirements. Alternatively, the power module can convert AC power to DC power before supplying it to the electronic components, or vice versa. In practical applications, the voltage and other parameters of the electrical energy can be reasonably adjusted according to the power requirements of the electronic components, which will not be elaborated upon here.

[0111] Specifically, the electronic device can be a chip or memory, etc. Alternatively, the electronic device can be a router, base station, computer, server, etc. This application does not limit the specific application scenario of the transformer or power module.

[0112] In the various embodiments of this application, unless otherwise specified or in case of logical conflict, the terminology and / or descriptions of different embodiments are consistent and can be referenced by each other. The technical features of different embodiments can be combined to form new embodiments according to their inherent logical relationship.

[0113] In this application, "multiple" means two or more. "And / or" describes the relationship between related objects, indicating that there can be three relationships. For example, A and / or B can mean: A exists alone, A and B exist simultaneously, or B exists alone, where A and B can be singular or plural.

[0114] It is understood that the various numerical designations used in the embodiments of this application are merely for descriptive convenience and are not intended to limit the scope of the embodiments of this application. The order of the process numbers described above does not imply the order of execution; the execution order of each process should be determined by its function and internal logic.

Claims

1. A transformer, characterized in that, Includes magnetic core and circuit board assembly; The circuit board assembly includes a dielectric substrate, multiple first conductive layers, and multiple second conductive layers; Along the thickness direction of the dielectric substrate, a plurality of first conductive layers and a plurality of second conductive layers are stacked at intervals within the dielectric substrate; The circuit board assembly further includes through-holes that penetrate the dielectric substrate and at least one of the first conductive layers, and a plurality of the second conductive layers are all located within the dielectric substrate; The magnetic core passes through the through hole; The voltage level of the first conductive layer is lower than that of the second conductive layer.

2. The transformer according to claim 1, characterized in that, The via penetrates each of the first conductive layers.

3. The transformer according to claim 1 or 2, characterized in that, Along the thickness direction of the dielectric substrate, the first conductive layer and the second conductive layer are stacked sequentially.

4. The transformer according to any one of claims 1 to 3, characterized in that, The distance between the first conductive layer and the inner wall of the through hole is greater than or equal to 0 microinches and less than or equal to 4 microinches.

5. The transformer according to any one of claims 1 to 4, characterized in that, The distance between the second conductive layer and the inner wall of the through hole is greater than or equal to 4 microinches.

6. The transformer according to any one of claims 1 to 5, characterized in that, The distance between the first conductive layer and the peripheral edge of the dielectric substrate is greater than or equal to 0 microinches and less than or equal to 4 microinches.

7. The transformer according to any one of claims 1 to 6, characterized in that, The distance between the second conductive layer and the peripheral edge of the dielectric substrate is greater than or equal to 4 microinches.

8. The transformer according to any one of claims 1 to 7, characterized in that, The transformer also includes an anti-corrosion material located on the inner wall of the through hole and covering the first conductive layer.

9. The transformer according to any one of claims 6 to 8, characterized in that, The transformer also includes an anti-corrosion material located at the outer edge of the dielectric substrate and covering the first conductive layer.

10. The transformer according to any one of claims 1 to 9, characterized in that, There is a gap between the magnetic core and the inner wall of the through hole.

11. The transformer according to any one of claims 1 to 10, characterized in that, The circuit board assembly includes at least two through holes, and the magnetic core includes at least two magnetic pillars, with the at least two magnetic pillars respectively passing through the at least two through holes; The transformer assembly also includes at least two coils, with at least one coil surrounding the periphery of each of the magnetic pillars.

12. The transformer according to claim 11, characterized in that, The circuit board assembly includes two through holes, which are a first through hole and a second through hole, and the magnetic core includes two magnetic pillars, which are a first magnetic pillar and a second magnetic pillar, with the first magnetic pillar passing through the first through hole and the second magnetic pillar passing through the second through hole. The first conductive layer includes a first conductive pattern and a second conductive pattern, and the second conductive layer includes a third conductive pattern and a fourth conductive pattern; The first conductive pattern surrounds the first magnetic pillar, and multiple first conductive patterns are connected in series. The second conductive pattern surrounds the second magnetic pillar, and multiple second conductive patterns are connected in series; The third conductive pattern surrounds the first magnetic post, and multiple third conductive patterns are connected in series; The fourth conductive pattern surrounds the second magnetic post, and multiple fourth conductive patterns are connected in series.

13. A power supply module, characterized in that, It includes a power converter and a transformer as described in any one of claims 1 to 12, wherein the power converter is connected to the first conductive layer and / or the second conductive layer.

14. An electronic device, characterized in that, It includes electronic devices and a power module as described in claim 13, wherein the electronic devices are connected to the output terminal of the power module, and the power module is used to supply power to the electronic devices.

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