Optical scanning module circuit

Abstract

The invention provides an optical scanning module circuit which comprises a control chip and a plurality of photosensitive chips which are configured to be connected in parallel, receive a chip selection signal and a data output enabling signal from the control chip and sequentially transmit a plurality of photosensitive signals to the control chip in a time-sharing manner, each of the plurality of photosensitive chips comprises a serial peripheral interface and a plurality of photosensitive pixel circuits, each of the plurality of photosensitive pixel circuits corresponds to one of the plurality of cylindrical lenses of one optical scanning module, and the cylindrical lens transmits light to the corresponding photosensitive pixel circuit; the control chip is connected in series with the plurality of photosensitive chips which are connected in parallel through a chip selection connecting line and a data output enabling connecting line so as to control the plurality of photosensitive chips which are connected in parallel in a time-sharing and multi-construction-site mode.

Description

Technical Field

[0001] This invention relates to a circuit design, and more particularly to a circuit design for an optical scanning module capable of simultaneously scanning multiple colors of light. Background Technology

[0002] In traditional linear optical scanning modules, multiple photosensitive chips are each coupled to a control chip via multiple traces, and the control chip requires numerous pins to couple these traces. The control chip needs to generate multiple control commands to control each photosensitive chip individually. Therefore, traditional optical scanning modules have excessive internal traces, occupying a large amount of device space, which prevents them from being scaled down, and also presents the problem of complex control settings.

[0003] In addition, some common scanners on the market, such as document scanners and printers with built-in scanning functions, use linear scanners for scanning. However, the internal structure of most scanners is designed so that they can only record a single wavelength of image in a single recording process. To record color images, multiple exposures are required.

[0004] Metamaterial nanostructures can be used to provide an optical scanning module that can scan multiple colors simultaneously; however, the number of photosensitive sub-pixel circuits will increase by at least three times, as will the number and complexity of wiring.

[0005] Therefore, there is a need to provide an optical scanning module circuit that can simplify the wiring to overcome the above problems. Summary of the Invention

[0006] To effectively solve the above problems, this invention proposes an optical scanning module circuit, comprising: a control chip; and multiple photosensitive chips configured to be connected in parallel, wherein the photosensitive chips receive chip selection signals and data output enable signals from the control chip and sequentially and time-divisionally transmit multiple photosensitive signals to the control chip, wherein each of the multiple photosensitive chips includes a serial peripheral interface and multiple photosensitive pixel circuits, each of the multiple photosensitive pixel circuits corresponds to one of a plurality of cylindrical lenses of an optical scanning module, the cylindrical lenses transmit light to the corresponding photosensitive pixel circuit, and wherein the control chip is connected in series with the multiple photosensitive chips connected in parallel via a chip selection connection line and a data output enable connection line, so as to control the multiple photosensitive chips connected in parallel in a time-division multiplexing manner.

[0007] Preferably, the optical scanning module circuit further includes a data transmission connection line for connecting the control chip and the plurality of photosensitive chips connected in parallel, wherein the plurality of photosensitive chips transmit photosensitive signals to the control chip via the data transmission connection line.

[0008] Preferably, when both the chip selection signal and the data output enable signal are at a first voltage level, the plurality of photosensitive chips operate in a command receiving mode to receive a plurality of control commands sequentially and in a time-division multiplexing manner; when the chip selection signal is at a second voltage level and the data output enable signal is at the first voltage level, the plurality of photosensitive chips operate in a command executing mode; and when the chip selection signal is at the first voltage level and the data output enable signal is at the second voltage level, the plurality of photosensitive chips operate in a data output mode to output a plurality of photosensitive signals sequentially and in a time-division multiplexing manner to the control chip, thereby the control chip generating a sensing image based on the photosensitive signals.

[0009] Preferably, the first voltage level is a low voltage level, and the second voltage level is a high voltage level.

[0010] Preferably, the plurality of photosensitive chips are configured to have different chip numbers, and the plurality of photosensitive chips sequentially and in a time-division manner output the plurality of photosensitive signals to the plurality of photosensitive signal master control chips according to the different chip numbers.

[0011] Preferably, the plurality of photosensitive chips are arranged in a straight line along a first direction, and the photosensitive pixel circuits are arranged in a straight line along the first direction to correspond to the plurality of cylindrical lenses arranged in a straight line along the first direction.

[0012] Preferably, the plurality of photosensitive sub-pixel circuits in the plurality of photosensitive pixel circuits are arranged in a straight line along a second direction, the second direction being perpendicular to the first direction.

[0013] Preferably, each of the plurality of photosensitive pixel circuits includes three photosensitive sub-pixel circuits, which are respectively designated as a red photosensitive sub-pixel circuit, a green photosensitive sub-pixel circuit, and a blue photosensitive sub-pixel circuit.

[0014] Preferably, each of the plurality of lenticular lenses has a light-emitting surface comprising a nanostructure array, which includes a plurality of nanostructures; and the nanostructure array deflects a portion of red light propagating in the lenticular lens to the red photosensitive sub-pixel circuit, a portion of green light propagating in the lenticular lens to the green photosensitive sub-pixel circuit, and a portion of blue light propagating in the lenticular lens to the blue photosensitive sub-pixel circuit.

[0015] Compared with the prior art, the optical scanning module circuit provided in this application embodiment has at least the following features:

[0016] Beneficial effects:

[0017] First, multiple photosensitive chips in the optical scanning module circuit can be controlled by simply connecting one chip select connection line and one enable signal connection line from the control chip, thereby enabling the multiple photosensitive chips in the optical scanning module circuit to transmit multiple sensing signals to the control chip in a time-division manner; Second, it effectively reduces the number of chip select connection lines required in the optical scanning module circuit and the volume occupied by the connection lines; and Third, it reduces the number of pins of the control chip.

[0018] To enable those skilled in the art to specifically understand the purpose, features, and effects of the present invention, the present invention will now be described in detail with reference to the following specific embodiments and accompanying drawings. Attached Figure Description

[0019] Figure 1 A schematic diagram showing the structure of an optical scanning module circuit according to an embodiment of the present invention;

[0020] Figure 2 A schematic diagram showing the structure of a photosensitive chip according to an embodiment of the present invention; and

[0021] Figure 3 A schematic diagram showing the structure of an optical scanning module according to an embodiment of the present invention.

[0022] Explanation of reference numerals in the attached figures

[0023] 110: Control chip; 120: Photosensitive chip; 122: Photosensitive pixel circuit; 310: lenticular lens; 312: nanostructure array; B: Blue photosensitive sub-pixel circuit; G: Green photosensitive sub-pixel circuit; R: Red photosensitive sub-pixel circuit. Detailed Implementation

[0024] The inventive concept will now be more fully described below with reference to the accompanying drawings, which illustrate exemplary embodiments of the inventive concept. The advantages and features of the inventive concept, as well as methods of achieving it, will become apparent from the exemplary embodiments described in more detail below with reference to the accompanying drawings. However, it should be noted that the inventive concept is not limited to the exemplary embodiments described below, but can be implemented in various forms. Therefore, exemplary embodiments are provided only to disclose the inventive concept and to enable those skilled in the art to understand the category of the inventive concept. In the drawings, exemplary embodiments of the inventive concept are not limited to the specific instances provided herein and are exaggerated for clarity.

[0025] The terminology used herein is for illustrative purposes only and is not intended to limit the invention. Unless the context clearly indicates otherwise, the singular forms of the terms “a” and “the” as used herein are intended to include the plural forms as well. The term “and / or” as used herein includes any and all combinations of one or more of the associated listed items. It should be understood that when a component is referred to as “connected” or “coupled” to another component, the component may be directly connected or coupled to the other component or there may be intermediate components.

[0026] Similarly, it should be understood that when a component (e.g., a layer, region, or substrate) is said to be "on" another component, the component may be directly on the other component, or there may be intermediate components. In contrast, the term "directly" implies the absence of intermediate components. Furthermore, it should be understood that when the terms "comprising" or "including" are used herein, they indicate the presence of the stated features, integers, steps, operations, components, and / or groups, but do not exclude the presence or addition of one or more other features, integers, steps, operations, components, and / or groups thereof.

[0027] Furthermore, exemplary embodiments in the detailed description will be illustrated by cross-sectional views of idealized exemplary drawings that serve as concepts of the invention. Accordingly, the shapes of the exemplary drawings may be modified according to manufacturing techniques and / or tolerable errors. Therefore, exemplary embodiments of the concepts of the invention are not limited to the specific shapes shown in the exemplary drawings, but may include other shapes that may be produced according to the manufacturing process. The areas illustrated in the drawings have general characteristics and are used to illustrate specific shapes of components. Therefore, this should not be considered as limiting the scope of the concepts of the invention.

[0028] It should also be understood that although terms such as "first," "second," and "third" may be used herein to describe various components, these components should not be limited to these terms. These terms are only used to distinguish individual components. Therefore, a first component in some embodiments may be referred to as a second component in other embodiments without departing from the teachings of the invention. Exemplary embodiments of the inventive concepts illustrated and described herein include their complementary counterparts. Throughout this specification, the same component numbers or the same indicators denote the same components.

[0029] Furthermore, exemplary embodiments are illustrated herein with reference to sectional views and / or plan views, which are idealized exemplary illustrative diagrams. Therefore, deviations from the illustrated shapes are expected due to factors such as manufacturing techniques and / or tolerances. Thus, exemplary embodiments should not be construed as limited to the shapes of the areas shown herein, but are intended to include shape deviations due to factors such as manufacturing processes. Therefore, the areas shown in the figures are schematic, and their shapes are not intended to illustrate the actual shapes of the areas of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0030] Figure 1 This is a schematic diagram showing the structure of an optical scanning module circuit according to an embodiment of the present invention.

[0031] refer to Figure 1 The optical scanning module circuit includes a control chip 110 and multiple photosensitive chips 120. The multiple photosensitive chips 120 are connected in parallel, and their respective connection lines converge at a node. This node is then connected to the control chip 110. In other words, the control chip 110 is connected to the multiple photosensitive chips 120 connected in parallel. The control chip 110 is only connected to one end of a connection line, and the other end of the connection line forms a node that connects to each of the multiple photosensitive chips 120. The relationship between the control chip 110 and the multiple photosensitive chips 120 is as follows: Figure 1 The connection relationship shown can be repeatedly applied to various signal connection lines, such as chip select connection lines, data output enable connection lines, data transmission connection lines, etc., to reduce the number of pins of the control chip 110.

[0032] In this embodiment, the control chip 110 is coupled to one end of a chip select connection line. Multiple photosensitive chips 120 each include a Serial Peripheral Interface (SPI) and multiple data output pins. Multiple chip select pins of the multiple SPI interfaces of the multiple photosensitive chips 120 are respectively coupled to the other end of the chip select connection line. Therefore, the control chip 110 can be coupled to one chip select pin of each of the photosensitive chips 120 via only one chip select connection line. In this embodiment, the photosensitive chips 120 can be arranged along one direction to achieve linear image sensing functionality.

[0033] In this embodiment, the control chip 110 is also coupled to one end of a data transmission connection line. The plurality of photosensitive chips 120 also include a plurality of data transmission pins, and these plurality of data transmission pins are respectively coupled to the other end of the data transmission connection line.

[0034] In this embodiment, the control chip 110 is also coupled to one end of a data output enable connection line. The plurality of photosensitive chips 120 also include a plurality of data output enable pins. Each photosensitive chip has one data output enable pin. The plurality of data output enable pins are respectively coupled to the other end of the data output enable connection line. In this regard, the control chip 110 is coupled to one data output enable pin of each of the photosensitive chips 120 via a connection line.

[0035] In this embodiment, the photosensitive chip 120 can perform exposure operations simultaneously. The photosensitive chips 120 can be configured with multiple different chip numbers, and each photosensitive chip 120 can sequentially and time-divisionally output sensing signals to the control chip 110 according to its different chip numbers. Therefore, the optical scanning module circuit of this embodiment only needs one chip selection connection line to output the sensing signals of each photosensitive chip 120, effectively reducing the number of connection lines and the volume occupied by those connection lines in the optical scanning module circuit.

[0036] In addition, the photosensitive chip 120 may have other functional pins, but the present invention does not limit this.

[0037] Figure 2 This is a schematic diagram showing the structure of a photosensitive chip according to an embodiment of the present invention.

[0038] refer to Figure 2 , Figure 1 Each of the photosensitive chips 120 in the embodiment can realize as follows Figure 2 The architecture of the photosensitive chip 120 is shown. In this embodiment, the photosensitive chip 120 includes a chip select pin (not shown), multiple data transmission pins (not shown), a data output enable pin (not shown), one or more chip number pins (not shown), and multiple photosensitive pixel circuits 122. In this embodiment, the chip select pins of the multiple photosensitive chips 120 can be arranged as follows... Figure 1 The routing design shown is coupled to the other end of the chip select connection line. Multiple data transmission pins of multiple photosensitive chips 120 can be arranged as follows... Figure 1 The routing design shown connects to the other ends of multiple data transmission lines. The data output enable pins of the multiple photosensitive chips 120 can be arranged as follows... Figure 1 The routing design shown is coupled to the other end of a data output enable connection line.

[0039] In one embodiment, the photosensitive chip 120 may include multiple chip number pins. The photosensitive chip 120 can receive different digital signals via these multiple chip number pins to determine different chip numbers. For example, the photosensitive chip 120 may have four chip number pins and can respectively receive digital signals, such as those with a high voltage level representing the value "1" or a low voltage level representing the value "0" (e.g., determining the corresponding chip number based on the sequential arrangement of the values ​​"1" corresponding to the digital signals received by the four pins). Therefore, the internal control circuit of the photosensitive chip 120 can output the sensing signal of the photosensitive pixel circuit 122 to the control chip at a specific time (or a specific time slot) according to the specific chip number.

[0040] In another embodiment, the photosensitive chip 120 may include a chip number pin. The photosensitive chip 120 can receive different analog signals via this chip number pin to determine different chip numbers. For example, the photosensitive chip 120 may have a chip number pin and can receive analog signals of a specific voltage. Therefore, the internal control circuitry of the photosensitive chip 120 can determine a specific chip number based on the specific voltage, and output the sensing signal of the photosensitive pixel circuit 122 (or sensing pixel) to the control chip at a specific time based on this specific chip number. Figure 1 The photosensitive chips 120 can be disposed on the same circuit board (e.g., the same printed circuit board). Each photosensitive chip 120 has a chip number pin coupled to a voltage divider circuit on the circuit board and receives different voltage divider signals provided by the voltage divider circuit. Therefore, the photosensitive chip 120 can receive analog signals (i.e., different voltage divider signals) corresponding to different specific voltages to define different chip numbers.

[0041] In one embodiment, the control chip 110 can output a chip selection signal to the photosensitive chip 120 via a chip selection connection line, and can also output an enable signal to the photosensitive chip 120 via a data output enable connection line.

[0042] Initially, when the chip select signal and enable signal are both at the first voltage level, the photosensitive chip 120 can automatically operate in command receiving mode to sequentially and time-divisionally receive multiple control commands. When the chip select signal and enable signal are both at the low voltage level (e.g., corresponding to a value of "00"), the photosensitive chip 120 can automatically operate in command receiving mode to sequentially and time-divisionally receive multiple control commands. The photosensitive chip 120 receives multiple control commands sequentially and time-divisionally from the control chip 110 (e.g., via other pins of the photosensitive chip or other pins of the SPI interface).

[0043] Then, when the chip selection signal is at the second voltage level and the enable signal is at the first voltage level, the photosensitive chip 120 operates in command execution mode. In command execution mode, the photosensitive chip 120 can perform exposure value adjustment, gain value adjustment, offset value adjustment, image sensing, entering a waiting mode, or resetting, etc., but the present invention is not limited thereto. When the chip selection signal is at a high voltage level and the enable signal is at a low voltage level (e.g., corresponding to a value of "10"), the control chip 110 can operate the photosensitive chip 120 to perform relevant operations according to the corresponding control commands received. Furthermore, in the aforementioned image sensing operation, the photosensitive chip 120 can perform simultaneous exposure or time-division exposure, and the present invention is not limited thereto.

[0044] Finally, when the chip selection signal is at the first voltage level and the enable signal is at the second voltage level, the photosensitive chip 120 operates in output data mode to sequentially and time-divisionally output multiple sensing signals to the control chip 110. The control chip 110 uses the photosensitive chip 120 to sequentially and time-divisionally output multiple sensing signals according to their respective chip numbers. When the chip selection signal is at a low voltage level and the enable signal is at a high voltage level (e.g., corresponding to a value of "01"), the photosensitive chip 120 sequentially and time-divisionally outputs multiple sensing signals and transmits them to the control chip 110 through multiple data transmission lines, so that the control chip 110 can generate a sensing image based on these sensing signals. Therefore, the optical scanning module circuit of this embodiment can output the sensing signals of the photosensitive chip 120 through only one chip selection connection line and one data output enable connection line.

[0045] It is worth noting that the execution order of the above-described procedures is not limited. The above-described procedures are only used to indicate the operating conditions of the photosensitive chip 120. The optical scanning module circuit can decide to execute one of the above-described procedures according to the current operating requirements. The above-described procedures are used to indicate that the photosensitive chip 120 can execute the corresponding mode or operation according to the voltage levels of the currently received chip selection signal and enable signal. In addition, when the chip selection signal and enable signal are both at high voltage levels (e.g., "11"), the photosensitive chip 120 is unresponsive, but the present invention is not limited thereto.

[0046] In summary, the optical scanning module circuit and image sensing method of the present invention can control multiple photosensitive chips in the optical scanning module circuit with only one chip select connection line and one enable signal connection line. This allows the multiple photosensitive chips in the optical scanning module circuit to transmit multiple sensing signals to the control chip in a time-division manner, thereby achieving linear image sensing functionality. Therefore, the optical scanning module circuit and image sensing method of the present invention can effectively reduce the number of chip select connection lines required in the optical scanning module circuit and the volume occupied by these connection lines.

[0047] Figure 3 A schematic diagram showing the structure of an optical scanning module according to an embodiment of the present invention.

[0048] refer to Figure 3 The optical scanning module includes multiple cylindrical lenses 310, each corresponding to a photosensitive pixel circuit 122. The cylindrical lenses 310 of the optical scanning module can transmit the reflected light from the object being scanned to the light-emitting surface of the cylindrical lens 310, and then the light-emitting surface of the cylindrical lens 310 deflects the light to the corresponding photosensitive pixel circuit 122 to generate a photosensitive signal.

[0049] According to an embodiment of this invention, the light-emitting surface of the cylindrical lens 310 of the optical scanning module may include a nanostructure array 312, which contains multiple metamaterial nanostructures. The shape, size, fast axis direction of the optical axis, etc. of the metamaterial nanostructures can be designed as needed, so that the deflection angle of the light transmitted from the light-emitting surface of the cylindrical lens 310 can be adjusted.

[0050] For example, in the embodiments of this case, such as Figure 3 As shown, the photosensitive pixel circuit 122 may include three photosensitive sub-pixel circuits: a red photosensitive sub-pixel circuit R, a green photosensitive sub-pixel circuit G, and a blue photosensitive sub-pixel circuit B, but this invention is not limited to this. The shape, size, and fast axis direction of the metamaterial nanostructure of the nanostructure array 312 can be a function of its position coordinates on the light-emitting surface of the lenticular lens 310, such that the nanostructure array 312 simultaneously deflects (and may even further focus) a portion of the red light transmitted in the lenticular lens 310 to the red photosensitive sub-pixel circuit R, deflects ( and may even further focus) a portion of the green light transmitted in the lenticular lens 310 to the green photosensitive sub-pixel circuit G, and deflects ( and may even further focus) a portion of the blue light transmitted in the lenticular lens 310 to the blue photosensitive sub-pixel circuit B. In this way, it is possible to simultaneously sense and capture signals of multicolor light.

[0051] In another embodiment of this invention, the photosensitive pixel circuit 122 may include four photosensitive sub-pixel circuits, namely a red photosensitive sub-pixel circuit R, two green photosensitive sub-pixel circuits G and a blue photosensitive sub-pixel circuit B, but this invention is not limited thereto.

[0052] In this embodiment, the plurality of cylindrical lenses 310 and the plurality of photosensitive pixel circuits 122 of the optical scanning module can be arranged along a first direction to correspond to each other; while the plurality of photosensitive sub-pixel circuits in the photosensitive pixel circuits 122 can be arranged along a second direction, which is perpendicular to the first direction. In this way, the plurality of corresponding cylindrical lenses 310 and the plurality of photosensitive pixel circuits 122 can be arranged in a more compact manner, thereby improving the resolution of the optical scanning module.

[0053] Compared with traditional optical scanning module circuits, the present invention has the following advantages: First, it only requires one chip select connection line and one enable signal connection line from the control chip to control multiple photosensitive chips in the optical scanning module circuit, so as to operate multiple photosensitive chips in the optical scanning module circuit to transmit multiple sensing signals to the control chip in a time-division manner; Second, it effectively reduces the number of chip select connection lines required in the optical scanning module circuit and the volume occupied by the connection lines; and Third, it reduces the number of pins of the control chip.

[0054] The above description illustrates the implementation of the present invention through specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0055] The above description is only a preferred embodiment of the present invention and is not intended to limit the scope of protection of the present invention; any equivalent changes or modifications made without departing from the principles described in the present invention should be included within the scope of protection of this patent.

Claims

1. An optical scanning module circuit, characterized in that, Include: A control chip; and Multiple photosensitive chips are configured to be connected in parallel, and receive chip selection signals and data output enable signals from the control chip to sequentially and time-divisionally transmit multiple photosensitive signals to the control chip. Each of the plurality of photosensitive chips includes a serial peripheral interface and a plurality of photosensitive pixel circuits. Each of the plurality of photosensitive pixel circuits corresponds to one of a plurality of cylindrical lenses in an optical scanning module. The cylindrical lens transmits light to the corresponding photosensitive pixel circuit. The control chip is connected in series with the multiple photosensitive chips connected in parallel via a chip select connection line and a data output enable connection line, so as to control the multiple photosensitive chips connected in parallel in a time-division multiple-site manner.

2. The optical scanning module circuit according to claim 1, characterized in that, It also includes a data transmission connection line for connecting the control chip and the plurality of photosensitive chips connected in parallel, wherein the plurality of photosensitive chips transmit photosensitive signals to the control chip via the data transmission connection line.

3. The optical scanning module circuit according to claim 1, Its features are, in, When both the chip selection signal and the data output enable signal are at a first voltage level, the plurality of photosensitive chips operate in a command receiving mode to receive a plurality of control commands sequentially and in a time-division manner. Wherein, when the chip selection signal is a second voltage level and the data output enable signal is the first voltage level, the plurality of photosensitive chips operate in a command execution mode; and When the chip selection signal is the first voltage level and the data output enable signal is the second voltage level, the plurality of photosensitive chips operate in an output data mode to sequentially and time-divisionally output a plurality of photosensitive signals to the control chip, thereby the control chip generates a sensing image based on the photosensitive signals.

4. The optical scanning module circuit according to claim 3, characterized in that, The first voltage level is a low voltage level, and the second voltage level is a high voltage level.

5. The optical scanning module circuit according to claim 1, characterized in that, The plurality of photosensitive chips are configured to have different chip numbers, and the plurality of photosensitive chips sequentially and in a time-division manner output the plurality of photosensitive signals to the plurality of photosensitive signal main control chips according to the different chip numbers.

6. The optical scanning module circuit according to claim 1, characterized in that, The plurality of photosensitive chips are arranged in a straight line along a first direction, and the photosensitive pixel circuits are arranged in a straight line along the first direction to correspond to the plurality of cylindrical lenses arranged in a straight line along the first direction.

7. The optical scanning module circuit according to claim 6, characterized in that, The plurality of photosensitive sub-pixel circuits in the plurality of photosensitive pixel circuits are arranged in a straight line along a second direction, which is perpendicular to the first direction.

8. The optical scanning module circuit according to claim 6, characterized in that, Each of the plurality of photosensitive pixel circuits includes three photosensitive sub-pixel circuits, which are respectively designated as red photosensitive sub-pixel circuit, green photosensitive sub-pixel circuit, and blue photosensitive sub-pixel circuit.

9. The optical scanning module circuit according to claim 8, characterized in that, in, Each of the plurality of cylindrical lenses has a light-emitting surface comprising an array of nanostructures, which includes a plurality of nanostructures; and Specifically, the nanostructure array deflects a portion of the red light propagating in the lenticular lens to the red photosensitive sub-pixel circuit, a portion of the green light propagating in the lenticular lens to the green photosensitive sub-pixel circuit, and a portion of the blue light propagating in the lenticular lens to the blue photosensitive sub-pixel circuit.

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