An optical element forming method based on numerical control path planning and process optimization

Abstract

The application discloses an optical element forming method based on numerical control path planning and process optimization, and relates to the technical field of high-end equipment manufacturing and industrial intelligent control, and specifically comprises the following steps: first, pre-treating an easy edge collapse area of an optical element, processing from right to left, and forming at least three stepped buffer areas with gradually increasing heights in sequence in the area; and second, processing the entire optical surface in a grating line form from left to right by a tool. The preset stepped buffer changes the interaction mode of the tool and the edge material, realizes smooth transition of cutting force and stress dispersion, and effectively inhibits edge collapse. Since the edge collapse risk is controlled, the second step of main processing does not need to be layered, and one-time processing can remove a large amount of material, so that the processing efficiency is significantly improved.

Description

Technical Field

[0001] This invention belongs to the field of high-end equipment manufacturing and industrial intelligent control technology, specifically relating to a method for forming optical components based on numerical control path planning and process optimization. It is particularly suitable for solving the edge chipping problem and efficiency bottleneck in the precision forming process of brittle glass. The path planning and segmented control concepts of this invention are closely related to the key technologies of path planning, process stability control, and intelligent recognition systems for complex curved surface components in novel additive manufacturing (such as laser cladding, DED). Background Technology

[0002] Optical components, especially precision optical components, are core components of modern high-tech equipment, playing a crucial role in aerospace, precision measurement, and optical communication. Currently, with the rapid development of industrial intelligence and high-performance additive manufacturing (such as laser powder / wire cladding technology, DED), the demand for high-precision, high-reliability optical components is exploding. For example, in advanced manufacturing processes such as laser cladding (DED), to achieve the development of an "image recognition and machine learning-based stable control system for the cladding process," the system needs to be equipped with a high-power laser optical system, a high-resolution imaging lens, or sensing optical components; the manufacturing precision and efficiency of these key optical components, which act as the "eyes" and "blood vessels," directly determine the performance of the entire intelligent manufacturing system.

[0003] Currently, the CNC forming of these key optical components typically employs diamond grinding wheels to cut and grind brittle glass materials to obtain the desired shape and size. This precision subtractive manufacturing method based on CNC systems places extremely high demands on complex path planning and real-time process control. Its technical challenges are similar to those of the 360° fully free conformal path additive manufacturing path planning system in DED additive manufacturing, namely, both require achieving efficient and high-quality complex surface forming while adhering to material properties and geometric constraints.

[0004] However, existing technologies face a common and pressing technical problem when processing brittle glass materials. Glass is a typical brittle material, with tensile strength far lower than compressive strength, making it highly sensitive to localized stress concentration. During diamond wheel cutting, especially when the tool approaches the edge of the glass workpiece, the remaining material on its right side is no longer supported or constrained by the material being processed. The tool exerts an outward pushing or squeezing force on the remaining material; this force easily induces and propagates microcracks within the brittle material, leading to edge breakage or chipping at the workpiece edge.

[0005] This problem is particularly prominent for optical elements with complex boundary shapes, such as rectangular off-axis aspherical surfaces. The sagitta at the periaxial and abaxial edges of these elements differs, increasing the complexity of their geometry. In CNC machining, conventional grating machining methods (i.e., the tool path is grating-shaped, for example, keeping the X-coordinate constant, the tool moves from one end to the other along the Y-direction, then the X-coordinate slightly increases, and then moves in the opposite direction along the Y-direction, repeating this cycle) are widely used. When the tool reciprocates along the Y-direction, if the grating width (e.g., the step size dx in the X-direction) is properly controlled (e.g., less than 0.1 mm), edge chipping on both the positive and negative Y sides can be effectively controlled. However, when the tool travels along the grating to the vicinity of the positive X-side edge of the workpiece, the material to be cut loses continuous support, and its structural characteristics resemble a cantilever beam. When the tool cuts at this point, the cutting force (especially the component perpendicular to this edge direction) can no longer be effectively dispersed by subsequent material, but instead acts concentrated on this "isolated" cantilever structure. This cantilever effect causes a sharp increase in local stress. Combined with the inherent brittleness of glass, this makes it easier for microcracks to initiate and propagate rapidly, ultimately leading to severe chipping.

[0006] To prevent such edge defects, existing technologies typically employ strict control over the depth of cut for each operation, generally limiting it to within 1 mm, and using a layered machining approach. This conservative machining strategy significantly reduces machining efficiency and prolongs the machining cycle. This efficiency limitation directly restricts the ability to provide large-volume, high-precision optical components for intelligent manufacturing systems (such as laser cladding (DED) systems), becoming a technological bottleneck hindering their widespread application. Therefore, developing an advanced forming method that can effectively prevent edge chipping while significantly improving machining efficiency through optimized CNC path planning and local process control is a critical technical problem that urgently needs to be solved, and it also provides an important technological foundation for the development of new DED additive manufacturing equipment and intelligent integrated systems. Summary of the Invention

[0007] The present invention aims to provide an optical element forming method based on CNC path planning and process optimization, in order to solve the problem that brittle glass is prone to edge chipping or breakage during the cutting process, and the resulting low processing efficiency.

[0008] In a first aspect, the present invention provides an optical element forming method based on numerical control path planning and process optimization. The surface equation of the optical element is expressed as Z = f(x, y) in the XYZ orthogonal coordinate system. The dimension of the optical element in the X direction is expressed as LX, and the dimension of the optical element in the Y direction is expressed as LY. After the tool machining path is projected onto the Z-axis normal plane direction as a grid line shape, with the positive X-axis side being the right side and the negative X-axis side being the left side, after fixing the optical element on the workbench of the numerical control machine, the method includes the following steps:

[0009] Control the tool to process the optical element in a grid line form from the right side to the left side, and the processing area is a partial area extending from the right edge X = LX / 2 to the left to X = LX / 2 - DX; where DX is the preprocessing width, and within the area of this DX width, the surface equation of the processing is at least divided into three sub-regions, which are defined in sequence from the right side (X = LX / 2) along the negative X-axis direction as:

[0010] The first sub-region: The range of X is from LX / 2 to LX / 2 - dx1, and its surface equation is set as Z = f(x, y) + dz1;

[0011] The second sub-region: The range of X is from LX / 2 - dx1 to LX / 2 - dx1 - dx2, and its surface equation is set as Z = f(x, y) + dz2;

[0012] The third sub-region: The range of X is from LX / 2 - dx1 - dx2 to LX / 2 - dx1 - dx2 - dx3, and its surface equation is set as Z = f(x, y) + dz3;

[0013] Where dz1 is the height compensation value of the first sub-region, dx1 is the width of the first sub-region; dz2 is the height compensation value of the second sub-region, dx2 is the width of the second sub-region; dz3 is the height compensation value of the third sub-region, dx3 is the width of the third sub-region; each height compensation value satisfies 0 < dz1 < dz2 < dz3, and the sum of the widths of each sub-region satisfies dx1 + dx2 + dx3 = DX;

[0014] Control the tool to process the entire optical surface Z = f(x, y) of the optical element in a grid line form from the left side to the right side.

[0015] In some embodiments, 0.5mm < dz1 < 1mm < dz2 < dz3 ≤ 3mm; the grid line spacing width of the processing in a grid line form does not exceed 0.1mm.

[0016] In some embodiments, the optical element is a rotationally symmetric aspherical surface or an off-axis aspherical surface.

[0017] In some embodiments, the optical element is a circular aperture optical element or a rectangular aperture optical element.

[0018] In some embodiments, the CNC cutting tool is a diamond grinding wheel tool, and the fillet radius r of the diamond grinding wheel tool satisfies: r>dz1.

[0019] In some embodiments, when the cutting tool is controlled to process the entire optical surface Z=f(x,y) of the optical element from left to right in the form of grid lines, the processing of the optical surface Z=f(x,y) is completed in one go.

[0020] In some embodiments, when the tool is controlled to process the entire optical surface Z=f(x,y) of the optical element from left to right in the form of grid lines, the tool path is a stepping motion in the X direction and a reciprocating motion in the Y direction.

[0021] In some embodiments, the preprocessing width DX satisfies 5mm. <DX<20mm。

[0022] In some embodiments, when the cutting tool is controlled to process the optical element in a grid pattern from right to left, the widths dx1, dx2, and dx3 of the three sub-regions are equal.

[0023] In some embodiments, the bottom and outer wall of the diamond grinding wheel are electroplated with diamond, and the length of the electroplated area on the outer wall is greater than the maximum depth of the diamond grinding wheel cutting surface between the diamond grinding wheel and the optical element during the machining of the main grid lines.

[0024] Through the above technical solution, the present invention can achieve the following significant technical effects:

[0025] Effectively prevents edge chipping: The unique stepped buffer pretreatment effectively changes the cutting mode of the tool in the chipping area, greatly reduces local stress concentration, and thus significantly reduces or even eliminates the chipping or breakage phenomenon on the positive side edge of the brittle glass optical element, greatly improving the processing quality and yield.

[0026] Significantly improves processing efficiency: Since the risk of edge chipping is effectively controlled, the depth of cut or feed rate can be increased during the second step of main grid line processing, without the need to strictly limit the depth of cut and perform multiple layer processing as in existing technologies; this greatly shortens the processing time of a single optical element, thereby significantly improving overall processing efficiency and production throughput.

[0027] Simple to operate and easy to implement: This invention can be implemented by modifying the tool path and Z-axis coordinate value of the CNC program, without the need for additional processing equipment or complex auxiliary processes, and has good engineering feasibility and cost-effectiveness.

[0028] Applicable to complex surface shapes: This invention is based on the adjustment of the Z-axis surface shape equation, which enables it to be flexibly applied to the processing of optical elements with complex surface shapes and boundary shapes, such as rectangular off-axis aspherical surfaces. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of a rectangular optical element and an orthogonal coordinate system.

[0030] Figure 2 This is a schematic diagram of the grid line path;

[0031] Figure 3 This is a schematic diagram showing the location of the optical surface and three sub-regions on the optical glass.

[0032] Figure 4 This is a schematic diagram of a traditional processing method;

[0033] Figure 5 This is a schematic diagram of the preprocessing of the easily collapsible edge area on the right.

[0034] Figure 6 This is a schematic diagram of the main grid line processing.

[0035] Figure 7 This is a schematic diagram of the structure of a diamond grinding wheel tool. Detailed Implementation

[0036] To more clearly illustrate the technical solution of the invention, the following description is provided in conjunction with the accompanying drawings and embodiments.

[0037] Example 1

[0038] A method for forming optical elements based on numerical control path planning and process optimization, taking a rectangular optical element as an example, wherein the surface shape equation of the optical element is expressed as Z=f(x,y) in the XYZ orthogonal coordinate system, as follows. Figure 1 As shown, in the orthogonal coordinate system, the origin O of the X and Y axes is set at the geometric center of the optical element. The dimension of the optical element in the X direction is represented by LX, and the dimension of the optical element in the Y direction is represented by LY. The tool machining path is projected as a grid line shape in the Z-axis normal plane direction, as shown in the figure. Figure 2 As shown, the grating width is d, the positive X-axis side is the right side, and the negative X-axis side is the left side. After fixing the optical element on the CNC machine tool's worktable, the CNC forming includes the following steps:

[0039] S1. Pre-processing of the easily breakable edge area on the right side:

[0040] First, the processing begins from right to left using a grid pattern. The processing area extends from the right edge (X=LX / 2) to the left, reaching a region of X=LX / 2-DX, where DX is the preprocessing width. Within this DX-width region, the surface shape equation is divided into at least three sub-regions, such as... Figure 3As shown, from the right side (X = LX / 2) along the negative X-axis direction, it is defined in sequence as follows:

[0041] The first sub-region: The range of X is from LX / 2 to LX / 2 - dx1, and its surface equation is set as Z = f(x, y) + dz1;

[0042] The second sub-region: The range of X is from LX / 2 - dx1 to LX / 2 - dx1 - dx2, and its surface equation is set as Z = f(x, y) + dz2;

[0043] The third sub-region: The range of X is from LX / 2 - dx1 - dx2 to LX / 2 - dx1 - dx2 - dx3, and its surface equation is set as Z = f(x, y) + dz3;

[0044] Among them, dz1 is the height compensation value of the first sub-region, dx1 is the width of the first sub-region; dz2 is the height compensation value of the second sub-region, dx2 is the width of the second sub-region; dz3 is the height compensation value of the third sub-region, dx3 is the width of the third sub-region; each height compensation value satisfies 0 < dz1 < dz2 < dz3, and the sum of the widths of each sub-region satisfies dx1 + dx2 + dx3 = DX;

[0045] S2. Machining of the main grid lines: After completing the pretreatment of the easily chipped edge area on the right side, the tool machines the entire optical surface Z = f(x, y) in the form of grid lines from the left side to the right side.

[0046] Figure 4 It is a schematic diagram of machining an optical glass 3 into an optical element 1 using a diamond grinding wheel tool 2 in a traditional machining method. Without pretreatment or when the value of dz1 is too large, when the tool enters the edge area from left to right, the cutting edge or sharp corner of the tool will suddenly contact the cantilever-like material to be cut at a relatively large and nearly vertical cutting angle. This contact method is similar to applying a "peeling force" to brittle materials, which is extremely likely to cause stress concentration at the material edge, leading to the rapid expansion of microcracks and chipping.

[0047] The core principle of the present invention to solve the technical problem lies in "buffer reduction" and "stress dispersion". As Figure 5 shown, in order to facilitate the machining of the first to third sub-regions, the optical element can be placed obliquely. By machining from right to left, the material is deliberately "lifted" in the easily chipped edge area on the positive X side (that is: a height compensation value is set on the basis of Z = f(x, y)), and a stepped structure with gradually increasing heights (viewed from right to left) is formed; this means that when viewed from left to right, a buffer slope with gradually decreasing heights is formed near the positive X edge.

[0048] When the tool cuts in the form of grid lines from the left side to the right side in the second main machining step, as Figure 6As shown, its cutting trajectory will gradually enter this pre-set stepped buffer area; at this time, the tool no longer directly cuts a vertically edge lacking support, but faces an inclined transition surface with sufficient progressive material support; this buffer mechanism brings the following key advantages: smooth transition of cutting, when the tool enters the area prone to chipping, the cutting force no longer suddenly concentrates on a fragile cantilever structure. Instead, the cutting process becomes smoother and the cutting force is gradually loaded and dispersed; suppressing stress concentration, the stepped buffer structure changes the contact geometry between the tool and the material, effectively avoiding the direct "peeling" or "extrusion" effect of the tool on the edge material in traditional machining, thus significantly reducing local stress concentration and suppressing the initiation and propagation of microcracks; providing dynamic support, the pre-lifted material layer provides progressive and dynamic material support for the cutting path of the tool, effectively offsetting the instability caused by the cantilever effect.

[0049] The technical solution of this application can be used in the machining of rotationally symmetric aspherical or off-axis aspherical surfaces, and the optical element is an optical element with a circular aperture or a rectangular aperture.

[0050] Based on this embodiment, 0.5mm < dz1 < 1mm < dz2 < dz3 ≤ 3mm; the grid line spacing width in the form of grid lines does not exceed 0.1mm.

[0051] In the grid line machining strategy, restricting the step size (X-direction spacing) of the tool within a very small range (usually) can ensure sufficient material support and overlapping cutting at the edges in the positive and negative Y-directions, effectively suppressing chipping and surface roughness in the Y-direction, and ensuring the machining accuracy and surface quality of non-critical edges. The upper limit of dz1 < 1mm can effectively control the chipping depth of the edge in subsequent machining; in addition, the lower limit of dz1 > 0.5 reserves sufficient material margin for subsequent finer machining, ensuring that the first sub-region has sufficient Z-axis height as the initial support and buffer, and providing the minimum structural strength required to achieve smooth progressive cutting. Both dz2 and dz3 are greater than 1mm, ensuring that the stepped structure has sufficient longitudinal depth to form an effective buffer slope, which is the key geometric guarantee for achieving a large single depth of cut (e.g., greater than 1mm) in the main machining and avoiding layer-by-layer machining. The upper limit of dz3 ≤ 3mm ensures that any deep brittle damage that may occur in the dz3 region during the pretreatment process will be completely removed by the Z = f(x, y) trajectory of the second-step main machining, fundamentally eliminating hidden subsurface damage and ensuring the safety and product reliability of the overall machining.

[0052] Based on the above technical solution, when controlling the tool to machine the entire optical surface Z = f(x, y) of the optical element in the form of grid lines from left to right, the machining of the optical surface Z = f(x, y) is completed一次性.

[0053] When controlling the tool to process the entire optical surface Z = f(x, y) of the optical element in a raster form from left to right, the tool path steps in the X direction and reciprocates in the Y direction.

[0054] Based on this embodiment, the preprocessing width DX satisfies 5mm < DX < 20mm.

[0055] DX is the sum of the widths of three or more sub-regions. To ensure that each sub-region has sufficient width to construct clear steps and enable the tool to smoothly complete the transition of the cutting trajectory and force within it, the total width must be sufficient. The width of the steps is not enough to provide effective lateral support, and the main cutting force with a large depth of cut can easily penetrate this weak buffer structure, resulting in chipping still occurring. In addition, the processing of the preprocessing region DX is an additional step and still belongs to an additional path relative to the main processing. If DX is set too large, although the safety is improved, it means that a large part of the entire optical element surface is allocated to the preprocessing area, which will result in a large number of redundant cutting paths in the second-step main processing, thus significantly offsetting the efficiency improvement brought by the large depth of cut. In summary, 5mm < DX < 20mm is the golden range obtained through experimental verification: it ensures the mechanical stability of the edge buffer structure while maximizing the area of the main high-efficiency cutting region, achieving the maximization of the overall processing efficiency.

[0056] Based on the above technical solution, when controlling the tool to process the optical element in a raster form from right to left, the widths dx1, dx2, and dx3 of the three sub-regions are equal. By equalizing the widths, it can be ensured that the lateral distance the tool moves within each sub-region is equal. This makes the change of the cutting force and the gradualness of the material support occur within a stable spatial frequency, avoiding sudden changes in stress in a very narrow area, which is beneficial to the stable control of the processing process.

[0057] Embodiment 2

[0058] Based on Embodiment 1, a diamond grinding wheel tool is selected as the numerical control tool, as Figure 7 shown, the fillet radius r of the diamond grinding wheel tool satisfies: r > dz1.

[0059] By ensuring r > dz1, when the tool enters the first sub-region (with a height compensation of dz1), the first part that contacts the material is not the cutting edge but the rounded fillet part r. The fillet part provides a smaller and smoother effective cutting angle. The cutting process changes from the original "impact peeling" to "smooth progressive cutting". This geometric constraint enables the cutting force to be gradually loaded and dispersed, avoiding the instantaneous burst of stress at the material edge, thereby further improving the edge chipping resistance.

[0060] Example 3

[0061] Based on Example 2, the bottom and outer wall of the diamond grinding wheel tool are electroplated with diamond, and the length Ly of the electroplated area on the outer wall is greater than the maximum depth of the diamond grinding wheel tool cutting the optical element surface during the machining of the main grid lines.

[0062] In the second step of machining the main grid lines, the machining method is depth cutting. The cutting force is not only borne by the bottom of the diamond wheel tool, but also by the outer wall of the tool, which bears the main cutting and dressing effect. The length of the electroplated area on the outer wall of the diamond wheel tool is greater than the maximum cutting depth between the diamond wheel tool and the optical element during the machining of the main grid lines. This can further improve the machining efficiency and thus achieve high-efficiency machining without the need for layering.

[0063] Example 4

[0064] This embodiment aims to demonstrate the application and significant effects of the method of the present invention in the processing of rectangular off-axis aspherical glass optical elements. The optical element is an off-axis aspherical surface and has a rectangular aperture.

[0065] Optical components: A brittle glass blank (e.g., K9 glass) with dimensions LX=200mm and LY=150mm is used. The surface to be processed is a specific off-axis aspherical surface Z=f(x,y).

[0066] CNC machine tool: A high-precision five-axis CNC milling machine is used; Machining steps:

[0067] (1) Processing the easily broken edge area on the right (preprocessing):

[0068] First, the CNC program is planned so that the tool cuts from right to left.

[0069] Set the width of the preprocessing area DX=10mm, that is, process from the rightmost edge X=LX / 2 (X=100mm) to the left to the area X=LX / 2-DX=90mm;

[0070] Within this 10mm wide area, the machined surface shape equation is divided into at least three sub-regions, defined sequentially from the right side (X=LX / 2) along the negative X-axis direction:

[0071] First sub-region: dx1=3mm, dz1=0.5mm; that is, the range of X is 100mm to 97mm; the surface equation of this sub-region is set as Z=f(x,y)+0.5;

[0072] Second sub-region: dx2=4mm, dz2=1.5mm; that is, the range of X is 97mm to 93mm; the surface equation of this sub-region is set as Z=f(x,y)+1.5;

[0073] The third sub-region has the following parameters: dx3 = 3 mm and dz3 = 2.8 mm. That is, the range of X is from 93 mm to 90 mm. The surface equation of this sub-region is set as Z = f(x,y) + 2.8.

[0074] (2) Main grid line processing (optical surface forming):

[0075] After completing the first step of preprocessing, the tool path is set to cut the grating lines from left to right to process the entire optical surface Z=f(x,y); the tool path for grating line processing is stepping in the X direction and reciprocating in the Y direction.

[0076] During the main body processing, the spacing of the grid lines in the X direction does not exceed 0.1mm to ensure the processing quality of the edges in the Y direction;

[0077] This embodiment achieves a single cutting depth greater than 1mm during the second step of main grid line processing, and can complete the processing of Z=f(x,y) in one go without layering, directly completing the material removal to that depth in one cut.

[0078] The above method for processing aspherical glass optical elements did not result in severe chipping or breakage at the edges of the optical elements, and the edge quality was intact. Compared with the traditional layered processing method (the depth of cut is limited to 1 mm each time, and 5 layers are required), this embodiment reduces the material removal time of the entire optical surface by about 80% while ensuring edge quality, which significantly improves processing efficiency. This fully verifies the effectiveness of smoothly transitioning the cutting through the preset stepped buffer area.

[0079] This invention discloses a method for forming optical elements based on CNC path planning and process optimization. To address the problem of edge chipping during the machining of brittle glass, a two-step machining scheme is proposed. First, the chipping-prone areas of the optical element are pre-treated, machined from right to left, forming at least three progressively higher (viewed from right to left) stepped buffer zones. Second, the tool machines the entire optical surface from left to right in a grid pattern. This invention, through the pre-set stepped buffers, alters the interaction between the tool and the edge material, achieving a smooth transition of cutting force and stress dispersion, effectively suppressing edge chipping. Because the risk of chipping is controlled, the second-step main machining does not require layering; a large amount of material is removed in a single cut, significantly improving machining efficiency. This invention is simple to operate, highly versatile, and applicable to rotationally symmetric and off-axis aspherical optical elements with circular or rectangular apertures.

Claims

1. A method for forming optical elements based on CNC path planning and process optimization, wherein the surface equation of the optical element is expressed as Z=f(x,y) in the XYZ orthogonal coordinate system, the dimension of the optical element in the X direction is expressed as LX, and the dimension of the optical element in the Y direction is expressed as LY; the tool machining path is projected as a grid line shape in the Z-axis normal plane direction, with the positive X-axis side being the right side and the negative X-axis side being the left side, characterized in that: After fixing the optical element on the worktable of the numerical control machine tool, the method comprises the following steps: Controlling the tool to process the optical element in the form of grid lines from the right side to the left, and the processing area is a partial area extending from the right edge X=LX / 2 to X=LX / 2-DX; wherein DX is a preprocessing width, and in the area of the DX width, the surface equation of the processing is divided into at least three sub-areas defined in turn from the right side (X=LX / 2) along the negative direction of the X axis as: The first sub-area: the range of X is LX / 2 to LX / 2-dx1, and the surface equation thereof is set as Z=f(x,y)+dz1; The second sub-area: the range of X is LX / 2-dx1 to LX / 2-dx1-dx2, and the surface equation thereof is set as Z=f(x,y)+dz2; The third sub-area: the range of X is LX / 2-dx1-dx2 to LX / 2-dx1-dx2-dx3, and the surface equation thereof is set as Z=f(x,y)+dz3; Wherein dz1 is the height compensation value of the first sub-area, dx1 is the width of the first sub-area; dz2 is the height compensation value of the second sub-area, dx2 is the width of the second sub-area; dz3 is the height compensation value of the third sub-area, dx3 is the width of the third sub-area; each height compensation value satisfies 0<dz1<dz2<dz3, and the sum of the widths of each sub-area satisfies dx1+dx2+dx3=DX; Controlling the tool to process the entire optical surface Z=f(x,y) of the optical element in the form of grid lines from the left side to the right.

2. The method for forming an optical element based on numerical control path planning and process optimization according to claim 1, characterized in that, 0.5mm<dz1<1mm<dz2<dz3≤3mm; the grid line spacing width processed in the form of grid lines is not more than 0.1mm.

3. The method for forming an optical element based on numerical control path planning and process optimization according to claim 1, characterized in that, The optical element is a rotationally symmetric aspheric surface or an off-axis aspheric surface.

4. The method for forming an optical element based on numerical control path planning and process optimization according to claim 1, characterized in that, The optical element is a circular aperture optical element or a rectangular aperture optical element.

5. The method for shaping optical elements based on numerical path planning and process optimization according to claim 1, characterized in that, The numerical control tool is a diamond grinding wheel tool, and the corner radius r of the diamond grinding wheel tool satisfies: r>dz1.

6. The method for shaping optical elements based on numerical path planning and process optimization according to claim 1, characterized in that, When controlling the tool to process the entire optical surface Z=f(x,y) of the optical element in the form of grid lines from the left side to the right, the processing of the optical surface Z=f(x,y) is completed at one time.

7. The method for shaping optical elements based on numerical path planning and process optimization according to claim 1, characterized in that, When controlling the tool to process the entire optical surface Z=f(x,y) of the optical element in the form of grid lines from the left side to the right, the tool path is X direction stepping and Y direction reciprocating tool walking.

8. The method for shaping optical elements based on numerical path planning and process optimization according to claim 1, characterized in that, The preprocessing width DX satisfies 5mm<DX<20mm.

9. The method for shaping optical elements based on numerical path planning and process optimization according to claim 1, characterized in that, When controlling the tool to process the optical element in the form of grid lines from the right side to the left, the widths dx1, dx2 and dx3 of the three sub-areas are equal.

10. The method for shaping optical elements based on numerical path planning and process optimization according to claim 1, characterized in that, The bottom and the outer side wall of the diamond grinding wheel tool are plated with diamond dust, and the plating area length of the outer side wall is greater than the maximum depth of the diamond grinding wheel tool and the cutting surface of the optical element during main body grid line processing.

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