Near-infrared quantum light field optical parameter amplifier

Abstract

The invention discloses a near-infrared quantum light field optical parameter amplifier, and belongs to the technical field of imaging equipment. The near-infrared quantum light field optical parameter amplifier comprises an amplifier body, and a clamping groove is formed in the outer wall face of the amplifier body. A butt joint groove is formed between the wall surface of the sealing shell and the outer wall of the amplifier main body; the inner wall of the outer cover is provided with an inner wall cavity, and the inner wall cavity is provided with a clamping block capable of sliding in the vertical direction of the inner wall; a sliding rod is connected between the Peltier module and the outer cover, and the end of the Peltier module is connected with a push block used for pushing the clamping block; wherein the butt joint groove is divided into an upper cavity and a lower cavity by the Peltier module, the upper cavity and the lower cavity are sealed, and the lower cavity can push the Peltier module to slide upwards after being heated and expanded by the heat source surface of the Peltier. According to the invention, the installation of the outer cover can be quickly realized, and the sealing performance of the outer cover is prevented from being influenced by repeated disassembly and assembly. After the outer cover is inserted into the butt joint groove, clamping and sealing can be directly achieved, and the experiment continuity is improved.

Description

Technical Field

[0001] This invention relates to near-infrared quantum optical field parametric amplifiers, belonging to the field of imaging equipment technology. Background Technology

[0002] Optical parametric amplifiers (OPA) are optical amplifiers that utilize parametric nonlinear interactions and have wide applications in optical communication, spectral analysis, and optical imaging. During use, OPA typically requires adjustment of the entire device to conduct experiments with various parameters. However, when preparing a compressed optical field, it is crucial to ensure that the device is free from external interference. Therefore, an outer casing is needed to isolate the internal components from the external environment. This casing serves as a protective shell for the entire amplifier, providing both a seal and a connection port for stable connection to an external light source.

[0003] However, since the focus of the reflector inside the device needs to be adjusted multiple times during the experiment, most existing technologies use fixed seals to seal the amplifier. Repeated disassembly and reassembly of the outer cover will lead to a continuous decrease in the sealing performance, thereby affecting the normal operation of the amplifier. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to provide a near-infrared quantum optical field parametric amplifier, which solves the problem of reduced sealing performance caused by repeated disassembly and reassembly of the outer casing of the optical parametric amplifier in the prior art.

[0005] The technical problem to be solved by the present invention is achieved by the following technical solution: a near-infrared quantum optical field parametric amplifier, including an amplifier body with a snap-fit ​​groove on its outer wall; a sealed outer shell with a mating groove formed between its wall and the outer wall of the amplifier body; an outer cover with an inner wall cavity on its inner wall, the inner wall cavity having an opening facing the inner side of the outer cover, and a snap-fit ​​block that can slide vertically along the inner wall; a Peltier module, disposed below the opening of the outer cover, connected to the outer cover by a sliding rod, the end of the sliding rod extending into the inner wall cavity of the outer cover, and connected to a pusher block for pushing the snap-fit ​​block at its end; the Peltier module includes a cold source surface and a hot source surface; wherein, the Peltier module divides the mating groove into two sealed upper and lower chambers, the lower chamber being heated and expanded by the hot source surface of the Peltier, which can push the Peltier module to slide upward.

[0006] By adopting the above technical solution, the outer cover can be installed quickly, avoiding the impact of repeated disassembly and assembly on its sealing performance. The outer cover is engaged with the amplifier's main body via a mating groove; once inserted into the groove, it achieves a tight seal, saving time for experimenters and improving experimental continuity. By aligning the opening edge of the outer casing with the docking groove and inserting it, the Peltier module, located below the opening of the outer casing, first enters the docking groove, sealing it and dividing it into an upper and lower chamber. As it descends, the gas volume in the upper chamber is compressed, increasing its internal pressure. When the locking block located in the inner wall chamber enters the docking groove, the continuously compressed upper chamber pushes the pusher block until it fits against the inclined surface of the locking block, further pushing the locking block towards the opening of the inner wall chamber. However, since the locking block is blocked by the outer wall of the amplifier body at this time, the locking block continues to slide into the locking groove on the outer wall of the amplifier body as the outer casing descends. This achieves automatic locking installation of the outer casing. Because the Peltier module divides the docking groove into a lower and upper chamber, the two chambers are continuously compressed during the descent of the Peltier module, making the internal air pressure much greater than the normal atmospheric pressure of the outer casing, preventing external airflow from entering and thus achieving rapid sealing of the amplifier body.

[0007] The present invention is further configured such that: the Peltier module includes two horizontal parts and two vertical parts, the length of the horizontal parts is greater than the length of the vertical parts, the horizontal parts and the vertical parts are connected end to end perpendicularly to form the Peltier module, a connecting block is provided at the connection point of the horizontal parts and the vertical parts, and the ends of the horizontal parts and the vertical parts are connected to the connecting block.

[0008] By adopting the above technical solution, the split structure can be processed separately for the horizontal part, the vertical part and the connecting block, reducing the difficulty of precision manufacturing, and at the same time facilitating the repair or replacement of partially damaged parts.

[0009] The present invention is further configured such that the sliding rod is fixed on the connecting block.

[0010] By adopting the above technical solution, the connecting blocks are set at the four corners of the Peltier module. By fixing the sliding rod to the connecting blocks, the force on the entire Peltier module can be made more uniform.

[0011] The present invention is further configured such that: a sealing outer ring is provided on both the transverse part and the longitudinal part, and the sealing outer ring is fitted with the inner walls of both sides of the docking groove after the Peltier module is inserted into the docking groove.

[0012] By adopting the above technical solution, wear caused by direct contact between the Peltier module and the inner wall of the mating groove can be avoided. Simultaneously, the sealing outer ring ensures better sealing, reducing heat exchange between the cold / hot ends and the outside environment, and minimizing air convection. The compression deformation of the sealing outer ring automatically compensates for the machining tolerances of the mating groove, ensuring the module's position is fixed after installation without requiring additional adjustments.

[0013] The present invention is further configured such that, when the Pal module is installed, the heat source surface of the transverse portion faces opposite to the heat source surface of the longitudinal portion.

[0014] By adopting the above technical solution, the sealing performance of the entire outer casing can be adjusted. By controlling the horizontal and vertical parts separately, the pressure between the upper and lower chambers can be adjusted so that the pressure inside both chambers is greater than the external atmospheric pressure. This isolates the external airflow from the amplifier body and achieves better sealing performance.

[0015] The present invention is further configured such that: a retaining plate is provided on the four sides of the outer wall of the outer cover, and a gap equal to the thickness of the sealing shell is reserved between the retaining plate and the outer wall of the outer cover.

[0016] By adopting the above technical solution, the gap between the card plate and the outer cover is used to snap the sealing shell in place, so that when the entire outer cover is installed, the sealing shell snaps into the gap, which can play a certain guiding role and make the installation of the outer cover smoother.

[0017] The invention is further configured such that: a sealing ring is slidably disposed on the outer wall of the outer cover, the sealing ring is in contact with the edge of the opening side of the sealing shell, a sliding groove is disposed on the inner side of the card plate, a guide rod is disposed in the sliding groove, an extension block extends into the sliding groove at the connection point between the sealing ring and the card plate, the guide rod passes through the extension block, and a compression spring is also sleeved on the guide rod.

[0018] By adopting the above technical solution, the amplifier body can be initially sealed. The compression spring applies elastic force to the extension block of the sealing ring through the guide rod, ensuring that the sealing ring always fits tightly against the edge of the sealing shell opening. Even if the shell undergoes slight deformation due to thermal expansion and contraction or mechanical vibration, it can still maintain its sealing performance. After long-term use, when the sealing ring wears out, the compression spring can automatically push the extension block to shift, compensating for the gap in the sealing surface and extending its service life.

[0019] The present invention is further configured such that: receiving mirrors for receiving external light sources and radiating mirrors for projecting light sources are provided on both sides of the outer cover, and a snap ring for connecting the external light source is provided at the position of the receiving mirror.

[0020] By adopting the above technical solution, the overall compactness of the device can be improved, and the mirror is embedded in the side wall of the outer casing without increasing the volume.

[0021] The present invention is further configured such that: the snap-fit ​​ring includes an inner ring, an outer ring, and a plurality of snap-fit ​​push rods, the snap-fit ​​push rods are slidably disposed on the inner ring, one end is located in the inner circle of the inner ring, and the other end is located in the outer circle of the inner ring, the snap-fit ​​push rod located in the outer circle of the inner ring is provided with an oblique guide groove, and the outer ring is provided with a snap-fit ​​post that snaps with the oblique guide groove.

[0022] By adopting the above technical solution, the inclined guide groove of the sliding push rod and the outer ring locking post cooperate to achieve quick locking / releasing of the light source plug, which is convenient and tool-free. The inner ring end of the locking push rod is telescopically adjustable, compatible with fiber optic or lens interfaces of different diameters, improving the versatility of the equipment. The even distribution of the push rods ensures that the light source is automatically centered when inserted, avoiding optical path misalignment.

[0023] The present invention is further configured such that: the end of the snap-fit ​​push rod of the inner ring is provided with a clamping plate.

[0024] By adopting the above technical solution, the clamping contact area with the external laser emitter is increased, thereby improving the overall clamping stability.

[0025] The beneficial effects of this invention are: By using the Peltier module, the sealing performance can be prevented from deteriorating due to frequent disassembly of the outer casing. The Peltier divides the mating groove into an upper chamber and a lower chamber. By adjusting the pressure in the two chambers, a pneumatic seal can be achieved on the amplifier body, thus preventing the connection structure from loosening after multiple disassemblies of the outer casing and affecting the sealing performance of the entire outer casing.

[0026] By using push blocks and locking blocks installed in the inner wall chamber of the outer cover, the outer cover can be automatically locked in place. When the outer cover is inserted into the docking groove, the push block pushes the locking block into the locking groove, which can quickly realize the installation of the outer cover. At the same time, in conjunction with the Peltier module, the upper and lower chambers are heated or cooled to adjust the chamber pressure, so that the outer cover can stably provide a protective sealing function for the amplifier body.

[0027] The snap-fit ​​ring, positioned on the laser receiving mirror of the outer casing, allows for quick clamping and securing of the external laser emitter. The retractable clamping plate enables the snap-fit ​​ring to adapt to laser emitters of different sizes and specifications, while also automatically positioning the laser emitter to be clamped in the center of the laser receiving mirror, ensuring the accuracy of the laser emission source. Attached Figure Description

[0028] Figure 1 This is an exploded view of the present invention; Figure 2 This is a cross-sectional view of the present invention; Figure 3 For the present invention Figure 2 Enlarged schematic diagram of the structure at point A in the middle Figure 4 For the present invention Figure 2 Enlarged schematic diagram of the structure at point B; Figure 5 This is a three-dimensional structural diagram of the Peltier module of the present invention; Figure 6 This is a three-dimensional structural diagram of the present invention; Figure 7 This is a schematic diagram of the three-dimensional structure of the snap ring of the present invention; Figure 8 This is an exploded view of the snap ring of the present invention.

[0029] In the diagram: 1. Amplifier body; 101. Snap-fit ​​groove; 2. Sealed outer shell; 201. Docking groove; 3. Outer cover; 301. Inner wall chamber; 302. Snap-fit ​​block; 303. Upper chamber; 304. Lower chamber; 4. Peltier module; 401. Lateral section; 402. Longitudinal section; 403. Connecting block; 404. Sealing outer ring; 405. Heat source surface; 406. Cold source surface; 5. Sliding rod; 6. Push block; 7. Snap-fit ​​plate; 701. Slide groove; 702. Guide rod; 8. Sealing ring; 801. Extension block; 802. Compression spring; 9. Snap-fit ​​ring; 901. Inner ring; 902. Outer ring; 903. Snap-fit ​​push rod; 904. Angled guide groove; 905. Snap-fit ​​post; 906. Clamping plate; 907. Clamping spring. Detailed Implementation

[0030] To facilitate a clear understanding of the technical means, creative features, objectives, and effects of this invention, the invention will be further described below in conjunction with specific illustrations.

[0031] like Figure 1 As shown, the near-infrared quantum optical field parametric amplifier includes an amplifier body 1, a sealed shell 2, an outer cover 3, and a Peltier module 4, which includes a cold source surface 406 and a hot source surface 405.

[0032] The sealing shell 2 is set on the outer ring of the amplifier body 1, and after wrapping the amplifier body 1, it forms a mating groove 201 between itself and the outer wall surface of the amplifier body 1. The outer cover 3 is snapped onto the top of the amplifier body 1 through the mating groove 201, sealing the relevant components on the top of the amplifier body 1. The high-pressure air chamber formed by the Peltier module 4 set behind the mating groove 201 achieves the sealing of the entire amplifier body 1, which can avoid the sealing performance of the outer cover 3 being affected by repeated disassembly and assembly.

[0033] Furthermore, such as Figure 2 and Figure 3As shown, the inner wall of the outer cover 3 is provided with an inner wall chamber 301. The inner wall chamber 301 has an opening facing the inside of the outer cover 3, and a locking block 302 that can slide vertically along the inner wall is provided at the opening of the inner wall chamber 301. After being pushed, the locking block 302 can slide out from the opening of the inner wall chamber 301. The Peltier module 4 is provided below the opening of the outer cover 3 and is connected to the outer cover 3 by a sliding rod 5. The sliding rod 5 is fixed on the connecting block 403. The end of the sliding rod 5 extends into the inner wall chamber 301 of the outer cover 3, and a push block 6 for pushing the locking block 302 is connected to the end. The push block 6 is used to push the locking block 302 to slide out from the opening of the inner wall chamber 301.

[0034] Connecting blocks 403 are set at the four corners of Peltier module 4. By fixing sliding rods 5 to connecting blocks 403, the force on the entire Peltier module 4 can be made more uniform.

[0035] After being inserted into the docking slot 201, the Peltier module 4 divides the docking slot 201 into two sealed upper chambers 303 and lower chambers 304. The cold source surface 406 and the hot source surface 405 of the Peltier module 4 correspond to the upper chamber 303 or the lower chamber 304, respectively. Specifically, the Peltier module 4 includes two transverse portions 401 and two longitudinal portions 402. Each transverse portion 401 and each longitudinal portion 402 contains one Peltier. The length of the transverse portion 401 is greater than the length of the longitudinal portion 402. The transverse portions 401 and the longitudinal portions 402 are connected end-to-end to form the Peltier module 4. A connecting block 403 is provided at the connection point between the transverse portions 401 and the longitudinal portions 402, and the ends of the transverse portions 401 and the longitudinal portions 402 are connected to the connecting block 403. A power supply for controlling the on / off state of the Peltier module 4 is installed in the connecting block 403. The power supply in each connecting block 403 controls the on / off state of one Peltier individually.

[0036] like Figure 3 and Figure 5 As shown, in this embodiment, when the Peltier module is installed, the heat source surface 405 of the transverse portion 401 faces opposite directions to the heat source surface 405 of the longitudinal portion 402. The heat source surface 405 of the transverse portion 401 facing the upper chamber 303 is the heat source surface 405, and the heat source surface 405 of the longitudinal portion 402 facing the lower chamber 304 is the heat source surface 405. By controlling the on / off state of the transverse portion 401 or the longitudinal portion 402 respectively, the position of the entire Peltier module 4 in the docking groove 201 can be controlled, thereby adjusting the pressure difference and internal temperature between the upper chamber 303 and the lower chamber 304.

[0037] The air in the upper chamber 303 is heated by the transverse section 401 and cooled by the longitudinal section 402, while the air in the lower chamber 304 is cooled by the transverse section 401 and heated by the longitudinal section 402. When the upper chamber 303 is heated by the heat source surface 405 of the transverse section 401, the cold source surface 406 of the transverse section 401 cools the lower chamber 304. At this time, the gas in the upper chamber 303 is heated and collides, while the gas in the lower chamber 304 is cooled and contracts, thereby controlling the descent of the entire Peltier module 4.

[0038] Specifically, when it is necessary to insert the outer cover 3 into the docking groove 201 to seal the amplifier body 1, the outer cover 3 is first inserted by aligning the open side edge of the outer cover 3 with the docking groove 201. The Peltier module 4, which is located below the opening of the outer cover 3, first enters the docking groove 201. After sealing the docking groove 201, the docking groove 201 is divided into two parts: the upper chamber 303 and the lower chamber 304. As the descent continues, the gas volume in the upper chamber 303 is compressed, increasing its internal pressure. When the locking block 302, located in the inner wall chamber 301, enters the docking groove 201, the continuously compressed upper chamber 303 pushes the push block 6 until it fits against the inclined surface of the locking block 302. This further pushes the locking block 302 towards the opening of the inner wall chamber 301. However, since the locking block 302 is blocked by the outer wall of the amplifier body 1 at this time, the locking block 302 continues to slide into the locking groove 101 on the outer wall of the amplifier body 1 as the outer cover 3 descends. This achieves automatic locking and installation of the outer cover 3. Because the Peltier module 4 divides the docking groove 201 into the lower chamber 304 and the upper chamber 303, the two chambers are continuously compressed during the descent of the Peltier module 4, resulting in an internal air pressure that is much greater than the normal atmospheric pressure of the outer cover 3. This prevents external airflow from entering and achieves rapid sealing of the amplifier body 1.

[0039] Furthermore, a spring is provided on the section of the sliding rod 5 in the upper chamber 303. When the entire Peltier module 4 is inserted into the docking groove 201 and descends, the air in the docking groove 201 is continuously compressed by the Peltier module 4, pushing the sliding rod 5 to slide. The spring provided on the sliding rod 5 prevents the push block 6 provided at the upper end of the sliding rod 5 from immediately engaging with the locking block 302. This prevents the locking block 302 from sliding out of the inner wall chamber 301 before it descends to the wall of the amplifier body 1, and prevents the locking block 302 from getting stuck on the upper surface of the amplifier body 1, thus preventing the entire outer cover 3 from descending.

[0040] Furthermore, such as Figure 3As shown, the push block 6 is a right triangle, and the locking block 302 is provided with an inclined surface that is parallel to the inclined surface of the push block 6. When the push block 6 moves upward to the position of the locking block 302, the two parallel inclined surfaces fit together. The push block 6 continues to move upward, thereby pushing the locking block 302 to move laterally and slide out toward the opening of the inner wall cavity 301, and lock into the locking groove 101 on the outer wall of the amplifier body 1.

[0041] In this embodiment, there are two locking slots 101, arranged side by side on the outer wall of the amplifier body 1. A second inclined surface is provided on the locking block 302. This second inclined surface allows the outer cover 3 to continue moving downwards as the locking block 302 engages with the upper locking slot 101. The locking block 302 then abuts against the side edge below the opening of the mating groove 201 via the second inclined surface, further pushing the outer cover 3 downwards. Due to the guiding effect of the second inclined surface, the locking block 302 retracts back into the inner wall cavity 301 until it moves with the outer cover 3 to the next locking slot 101 and engages with the lower locking slot 101. By providing multiple locking slots 101, the user can manually adjust the sealing of the outer cover 3. When a higher sealing is required, the outer cover 3 is pushed until the locking block 302 engages with the lower locking slot 101. The deeper the outer cover 3 descends, the higher the air pressure between the upper chamber 303 and the lower chamber 304, resulting in better sealing. Similarly, the pressure difference that the Peltier module 4 can adjust is also smaller. Therefore, users can select different heights of the snap-fit ​​slot 101 according to different experimental conditions.

[0042] Furthermore, the locking block 302 is slidably engaged above the inner wall cavity 301, and a retraction spring is provided between the locking block 302 and the inner wall cavity 301. The retraction spring enables the locking block 302 to automatically retract into the inner wall cavity 301 without any other external force.

[0043] Both the transverse portion 401 and the longitudinal portion 402 are provided with sealing outer rings 404. After the Peltier module 4 is inserted into the mating groove 201, the sealing outer rings 404 fit against the inner walls of both sides of the mating groove 201. The sealing outer rings 404 prevent the Peltier module 4 from directly contacting the inner wall of the mating groove 201 and causing wear. At the same time, the sealing outer rings 404 can better ensure sealing performance, reduce heat exchange between the cold or hot end and the outside environment, and reduce air convection. The compression deformation of the sealing outer rings 404 automatically compensates for the machining tolerances of the mating groove 201, ensuring that the module is fixed in position after installation without the need for additional adjustments.

[0044] like Figure 1As shown, four retaining plates 7 are provided on the four sides of the outer wall of the outer cover 3. A gap equal to the thickness of the sealing shell 2 is reserved between the retaining plates 7 and the outer wall of the outer cover 3. The gap between the retaining plates 7 and the outer cover 3 is used to engage the sealing shell 2, so that when the entire outer cover 3 is installed, the sealing shell 2 is engaged into the gap, which can play a certain guiding role and make the installation of the outer cover 3 smoother.

[0045] Furthermore, such as Figure 4 As shown, a sealing ring 8 is slidably disposed on the outer wall of the outer cover 3. The sealing ring 8 is in contact with the opening edge of the sealing shell 2. A sliding groove 701 is provided on the inner side of the clamping plate 7. A guide rod 702 is disposed in the sliding groove 701. An extension block 801 extends into the sliding groove 701 from the connection point between the sealing ring 8 and the clamping plate 7. The guide rod 702 passes through the extension block 801. A compression spring 802 is also sleeved on the guide rod 702. During the process of the outer cover 3 descending to the docking groove 201, the sealing ring 8 abuts against the end of the sealing shell 2. As the outer cover 3 continues to descend, the compression spring 802 applies downward pressure to the entire sealing ring 8 through the extension block 801, thereby enabling the sealing ring 8 to adhere tightly to the sealing shell 2.

[0046] The compression spring 802 provides initial sealing for the amplifier body 1. Through the guide rod 702, the compression spring 802 applies elastic force to the extension block 801 of the sealing ring 8, ensuring that the sealing ring 8 remains tightly pressed against the edge of the opening in the sealing housing 2. Even if the housing undergoes minor deformation due to thermal expansion and contraction or mechanical vibration, the sealing performance is maintained. After prolonged use, when the sealing ring 8 wears down, the compression spring 802 automatically pushes the extension block 801 to compensate for the gap in the sealing surface, extending its service life.

[0047] In this embodiment, the outer cover 3 has receiving mirrors for receiving external light sources and radiating mirrors for projecting light sources on both side walls, and a snap ring 9 for connecting external light sources is provided at the receiving mirror position.

[0048] Specifically, such as Figure 6 , Figure 7 , Figure 8 As shown, the snap-fit ​​ring 9 includes an inner ring 901, an outer ring 902, and several snap-fit ​​push rods 903. The inner ring 901 is fixed at the receiving mirror surface. The outer ring 902 is slidably snapped onto the inner ring 901. The two outer rings 902 are connected by a connecting rod, which clamps the inner ring 901 between the two outer rings 902. The snap-fit ​​push rods 903 are slidably disposed on the inner ring 901, with one end located in the inner ring 901 and the other end located in the outer ring 901. The snap-fit ​​push rods 903 located in the outer ring 901 have a slanted guide groove 904. The outer ring 902 is provided with snap-fit ​​posts 905 that snap into the slanted guide groove 904. The end of the snap-fit ​​push rods 903 in the inner ring is provided with a clamping plate 906.

[0049] Furthermore, on the snap-fit ​​push rod 903, between the inner wall of the inner ring 901 and the snap-fit ​​push plate, a clamping spring 907 is sleeved, and the clamping spring 907 applies a pushing force to the push plate in the direction of the center of the inner ring 901.

[0050] During the installation of the laser source, the experimenter first rotates the outer ring 902, causing the locking pin 905 on the outer ring 902 to move within the inclined guide groove 904. This moves the locking push rod 903 towards the outer ring of the inner ring 901, causing the clamping plate 906 on the inner ring 901 to move away from the center of the inner ring 901. At this point, the cylindrical light source emitter is inserted between the three clamping plates 906. The outer ring 902 is then released, and the locking push rod 903, due to the elasticity of the clamping spring 907, pushes the clamping plate 906 back towards the inner ring of the inner ring 901, thus clamping and fixing the light source emitter. Simultaneously, the use of three clamping points ensures that the light source emitter is automatically positioned at the center of the inner ring 901 after being clamped, guaranteeing accurate output of the light source.

[0051] The inclined guide groove 904 of the sliding push rod, in conjunction with the locking post 905 of the outer ring 902, enables quick locking and releasing of the light source plug, offering convenient operation without tools. The inner ring end of the locking push rod 903 is telescopically adjustable, compatible with fiber optic or lens interfaces of different diameters, improving equipment versatility. The even distribution of the push rods ensures automatic centering of the light source upon insertion, preventing optical path misalignment.

[0052] Working principle: The installation process of outer cover 3, such as Figure 4 As shown, the Peltier module 4 is positioned at the lower end of the opening of the outer casing 3 via a sliding rod 5. During installation of the outer casing 3, the Peltier module 4 is first inserted into the mating groove 201, sealing the groove. As the Peltier module 4 descends, it compresses the air within the mating groove 201, resulting in a reverse thrust that pushes the Peltier module 4 relative to the outer casing 3. This causes the sliding rod 5 to slide upwards relative to the inner wall cavity 301 of the outer casing 3. After the locking block 302 descends with the outer casing 3 to the position of the outer wall of the amplifier body 1, the push block 6 and the locking block 302 engage with each other. Since the contact surface between the push block 6 and the locking block 302 is an inclined surface... Therefore, as the pusher 6 continues to rise, the inclined surface of the fitting guides the locking block 302 to slide laterally. However, at this time, the locking block 302 is blocked by the outer wall of the amplifier body 1 and cannot move. Therefore, the Peltier module 4 and the locking block 302 remain stationary relative to the outer cover 3. As the outer cover 3 continues to descend until the locking block 302 descends with the outer cover 3 to the locking groove 101, the pushing force on the locking block 302 is released. The sliding rod 5 pushes the pusher 6 upward, and the locking block 302 slides laterally out of the inner wall cavity 301, so that the locking block 302 is locked into the locking groove 101, realizing the automatic locking installation of the outer cover 3. The entire installation process only requires the experimenter to align the outer cover 3 with the docking groove 201 and press it down, which is simple to operate.

[0053] During the disassembly of the outer cover 3, the temperature of the gas inside the lower chamber 304 is lowered and the temperature of the gas inside the upper chamber 303 is raised by controlling the heating or cooling of the Peltier module 4. This causes the gas pressure inside the upper chamber 303 to be greater than the gas pressure inside the lower chamber 304. The expansion of the high-temperature gas in the upper chamber 303 will push the Peltier module 4 downward, causing the sliding rod 5 and the push block 6 to descend with the Peltier module 4. The push block 6 separates from the locking block 302. After the locking block 302 loses the external pushing force, it slides out of the locking groove 101 under the elastic force of the return spring and slides back into the inner wall chamber 301. Since the gas pressure inside the upper chamber 303 and the lower chamber 304 is always greater than the external pressure, the experimenter can directly remove the outer cover 3 from the docking groove 201 after the locking block 302 slides out of the locking groove 101.

[0054] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments, and various changes and modifications can be made without departing from the spirit and scope of the invention, all of which fall within the scope of protection claimed by the present invention. The scope of protection of the present invention is defined by the appended claims and their equivalents.

Claims

1. A near-infrared quantum optical field light parametric amplifier, characterized in that, The application relates to an amplifier, which comprises the following parts: an amplifier body (1) provided with a clamping groove (101) on the outer wall surface; a sealing shell (2) which is provided with an abutting groove (201) between the wall surface and the outer wall of the amplifier body (1); an outer cover (3) provided with an inner wall cavity (301) on the inner wall, wherein the inner wall cavity (301) is provided with an opening in the inner side direction of the outer cover (3), and the inner wall cavity (301) is provided with a clamping block (302) which can slide in the vertical direction of the inner wall; a Peltier module (4) which is connected with the outer cover (3) through a sliding rod (5), wherein the end of the sliding rod (5) extends into the inner wall cavity (301) of the outer cover (3) and is connected with a pushing block (6) used for pushing the clamping block (302); wherein the Peltier module (4) divides the abutting groove (201) into two closed upper and lower cavities (303) and (304).

2. The near-infrared quantum optical field light parametric amplifier of claim 1, wherein: The Peltier module (4) comprises two transverse parts (401) and two longitudinal parts (402), the length of the transverse part (401) is greater than the length of the longitudinal part (402), the transverse part (401) and the longitudinal part (402) are vertically connected in a head-to-tail mode to form the Peltier module (4), the connecting block (403) is arranged at the connecting position of the transverse part (401) and the longitudinal part (402), and the end of the transverse part (401) and the longitudinal part (402) is connected to the connecting block (403).

3. The near-infrared quantum optical field light parametric amplifier of claim 2, wherein: The sliding rod (5) is fixed on the connecting block (403).

4. The near-infrared quantum optical field light parametric amplifier of claim 2, wherein: The transverse part (401) and the longitudinal part (402) are both provided with a sealing outer ring (404), and the sealing outer ring (404) is attached to the inner wall of the abutting groove (201) after the Peltier module (4) is clamped into the abutting groove (201).

5. The near-infrared quantum optical field light parametric amplifier of claim 2, wherein: The transverse part (401) and the longitudinal part (402) are both provided with a heat source surface (405) and a cold source surface (406), and the heat source surface (405) of the transverse part (401) faces in the opposite direction of the heat source surface (405) of the longitudinal part (402).

6. The near-infrared quantum optical field light parametric amplifier of claim 1, wherein: The outer wall of the outer cover (3) is provided with a clamping plate (7) on four surfaces, and a gap with the thickness of the sealing shell (2) is reserved between the clamping plate (7) and the outer wall of the outer cover (3).

7. The near-infrared quantum optical field light parametric amplifier of claim 6, wherein: The outer wall of the outer cover (3) is provided with a sealing ring (8) which is attached to the edge of the opening side of the sealing shell (2) when the outer cover (3) is installed, the inner side of the clamping plate (7) is provided with a sliding groove (701), the sliding groove (701) is provided with a guide rod (702), the connecting position of the sealing ring (8) and the clamping plate (7) extends into the sliding groove (701) through an extension block (801), the guide rod (702) penetrates through the extension block (801), and a compression spring (802) is further sleeved on the guide rod (702).

8. The near-infrared quantum optical field light parametric amplifier of claim 1, wherein: The outer wall of the outer cover (3) is provided with a receiving mirror surface used for receiving an external light source and a radiating mirror surface used for emitting a light source, and the receiving mirror surface is provided with a clamping ring (9) used for connecting the external light source.

9. The near-infrared quantum optical field light parametric amplifier of claim 8, wherein: The clamping ring (9) comprises an inner ring (901), an outer ring (902) and a plurality of clamping push rods (903), the clamping push rods (903) are slidingly arranged on the inner ring (901), one end is located in the inner ring (901), one end is located in the outer ring (901), a slanting guide groove (904) is formed on the clamping push rod (903) located in the outer ring (901), and the outer ring (902) is provided with a clamping column (905) clamped with the slanting guide groove (904).

10. The near-infrared quantum optical field light parametric amplifier of claim 9, wherein: The end of the clamping push rod (903) of the inner ring is provided with a clamping plate (906).

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