A single-sided panel line automatic etching device and method

Abstract

The application relates to a single-panel line automatic etching device and method, and relates to the technical field of etching machine equipment, which comprises an etching box, a lifting mechanism arranged on the etching box, a fixing mechanism, a swing mechanism and a deflection mechanism. The fixing mechanism can adhere and stack the substrates of two one-way circuit boards together, clamps and fixes the two one-way circuit boards, exposes the copper surfaces of the two one-way circuit boards to the outside for etching, can etch double-sided circuit boards, and can simultaneously etch two single-sided circuit boards. The lifting mechanism and the deflection mechanism are matched, the circuit board is deflected at the same angle in the etching liquid to increase the liquid flow rate around the circuit board, the etching efficiency is improved, the swing mechanism and the deflection mechanism are matched, the circuit board is swung back and forth, the circuit board is inclined to the movement direction at the same time, the etching liquid is more easily separated from the board, the position of the adjusting screw seat is adjusted to adjust the deflection angle of the circuit board, and etching liquids with various viscosities are adapted.

Description

Technical Field

[0001] This application relates to the field of etching equipment technology, and in particular to an automatic etching device and method for single-sided PCB circuits. Background Technology

[0002] In the process of integrated circuit manufacturing, there is a step called circuit board etching, which mainly uses chemical or physical methods to remove excess copper foil from the circuit board to form the designed conductive lines. This step requires specialized etching equipment.

[0003] Patent CN221468003U discloses a circuit board etching machine. In this prior art, the rotating rod drives the main gear to rotate, the main gear drives the driven gear to rotate, the driven gear drives the first threaded rod to rotate, the first threaded rod drives the threaded cylinder to move down, the threaded cylinder descends and uses the rotating cylinder and fixed plate to drive the connecting column to descend, the connecting column descends and drives the first clamping plate to descend, and then drives the circuit board to move into the liquid tank. This solves the problem of the user's hand touching the chemical liquid to a certain extent.

[0004] However, the aforementioned existing technologies have the following technical defects:

[0005] First, the existing technology directly places the circuit board into the etching solution in the liquid tank. This method is suitable for etching double-sided circuit boards, but for single-sided circuit boards, one side is the substrate. If the substrate is in contact with the etching solution for a long time, it will cause irreversible damage. Therefore, the existing technology is not suitable for etching single-sided circuit boards, resulting in a limited range of applications for this device.

[0006] Second, the existing technology simply removes the circuit board from the etching solution after etching and allows the etching solution adhering to the surface of the circuit board to fall freely back into the liquid tank by gravity. This process is very long, prolongs production time, and reduces work efficiency. At the same time, some etching solution will still adhere to the surface of the circuit board. If this etching solution adheres to the copper plate of the circuit board for a long time, it will cause over-etching and make the circuit board unusable.

[0007] In summary, existing technologies still have room for improvement in terms of expanding the applicability of the device and reducing the scrap of circuit boards. Therefore, those skilled in the art have proposed a device that can etch single-sided circuit boards and quickly remove the etching solution adhering to the surface of the circuit board after it has been removed from the etching solution. Summary of the Invention

[0008] To address the aforementioned issues, in a first aspect, this application provides an automatic etching device and method for single-sided circuit boards, employing the following technical solution: it includes an etching box, on which a lifting mechanism is provided, the lifting mechanism including a T-shaped plate that is moved and disposed inside the etching box.

[0009] It also includes a fixing mechanism and a swinging mechanism. The fixing mechanism includes a U-shaped frame that is slidably set on the lower side of the T-shaped plate. A set of U-shaped plates are rotatably installed on the inner side of the U-shaped frame. A set of orifice plates that are distributed vertically and connected to the two U-shaped plates are arranged between them. A rectangular annular sealing ring is installed on the adjacent side of the orifice plate. A rectangular annular sealing airbag is also installed on the upper side of the lower orifice plate outside the sealing ring.

[0010] The swing mechanism includes a rocker arm that is rotatably mounted on the lower side of the T-shaped plate. A strip groove is provided on the side of the rocker arm, and a threaded seat II is slidably disposed in the strip groove. A connecting arm with its end hinged to the lower side of the threaded seat II is hinged to the U-shaped frame.

[0011] It is also equipped with a deflection mechanism, which causes the circuit board fixed inside the fixed mechanism to be deflected at different angles when the fixed mechanism is at different heights.

[0012] Preferably, the lower orifice plate is connected to the U-shaped plate, and an electric cylinder is installed on the upper side of the U-shaped plate. The telescopic arm end of the electric cylinder is connected to the upper orifice plate.

[0013] Preferably, a rectangular annular limiting ring adapted to the lower orifice plate is installed on the outer side of the orifice plate, and an air pump with an output end connected to the sealing airbag is installed on the lower side of one of the orifice plates.

[0014] Preferably, the threaded seat has threaded holes on both sides, and a one-way screw is provided in the threaded hole, which is adapted to it and whose two ends are rotatably connected to the inner wall of the strip groove.

[0015] Preferably, a second motor with its drive end connected to the rocker arm shaft is mounted on the upper side of the T-shaped plate, and a third motor with its drive end connected to one end of a one-way screw is mounted on the side of the rocker arm.

[0016] Preferably, the deflection mechanism includes two sets of rectangular blocks installed on both sides of the U-shaped frame. A vertical rod is installed between the two rectangular blocks in each set. A slide block is slidably mounted on the vertical rod. Springs are connected to the rectangular blocks on the upper and lower sides of the slide block.

[0017] Preferably, a T-shaped frame is installed on the side of the slide, and a turntable is installed on the rotating shaft end of the U-shaped plate and the U-shaped frame. A connecting rod with its lower end hinged to the side of the T-shaped frame is connected to the side edge of the turntable. Two sets of limiting blocks are symmetrically installed on the inner wall of the etching box, with two limiting blocks in each set distributed vertically.

[0018] Preferably, a pulley is rotatably mounted on the side of the T-shaped frame above the connecting rod. One of the pulleys is fitted with an upwardly inclined guide rail connected to the T-shaped plate, and the other pulley is fitted with a downwardly inclined guide rail connected to the T-shaped plate.

[0019] Preferably, a limiting block is provided on the front side of the etching box near the top.

[0020] On the other hand, this application also discloses an automatic etching method for single-sided board circuits: the method includes the following steps:

[0021] S1. Circuit board fixing: After stacking two circuit boards, fix them on the fixing mechanism.

[0022] S2. Circuit board etching: The circuit board fixed on the fixing mechanism is moved into the etching solution by the lifting mechanism and etched.

[0023] S3. Circuit board oscillation: During the etching process, the circuit board is frequently deflected at the same angle.

[0024] S4. Surface cleaning: After etching is completed, remove the circuit board from the etching solution and clean the etching solution adhering to its surface.

[0025] S5. Remove the circuit board. After cleaning the surface with etching solution, raise the circuit board to the height of the limit block and remove the etched circuit board.

[0026] In summary, this application includes at least one of the following beneficial technical effects:

[0027] The fixing mechanism of this application can attach and stack the substrate surfaces of two unidirectional circuit boards together and clamp them in place, exposing the copper surfaces of the two unidirectional circuit boards to the outside for etching, thus avoiding contact between the substrate and the etching solution. Therefore, this device can etch not only double-sided circuit boards but also single-sided circuit boards without damaging the substrate surface, increasing the applicability of the device. At the same time, it can etch two unidirectional circuit boards at the same time, increasing production efficiency.

[0028] 2. This application uses a lifting mechanism and a deflection mechanism to work together. When the fixing mechanism is at its highest position, the orifice plate is in a parallel state, which is convenient for installing or removing the circuit board. When the fixing mechanism descends, the deflection mechanism makes the orifice plate and the circuit board in a vertical state, which is convenient for them to enter the etching solution. It can also make the circuit board deflect back and forth at the same angle in the etching solution to increase the liquid flow rate around the circuit board and improve the etching efficiency.

[0029] Third, by coordinating the swing mechanism and the deflection mechanism, the circuit board fixed on the fixed mechanism swings back and forth. The inertia causes the etching solution adhering to its surface to detach. At the same time, during the back and forth swing of the fixed mechanism, the circuit board on the fixed mechanism is tilted in the direction of movement by guide rail one and guide rail two. The inertial force and the gravity component of the etching solution itself are superimposed to form an oblique resultant force. The direction of the resultant force is at a dynamic angle with the board surface, which more efficiently destroys the liquid film adhesion and makes the etching solution detach from the board more easily, thus improving the cleaning effect. The deflection angle of the circuit board can be adjusted by adjusting the position of the threaded seat, thus adapting to etching solutions of various viscosities. Attached Figure Description

[0030] The present application will be further described below with reference to the accompanying drawings and embodiments.

[0031] Figure 1 This is a schematic diagram of the structure of this application.

[0032] Figure 2 This is a schematic diagram of the internal structure of this application.

[0033] Figure 3 This is a schematic diagram of the internal structure of the second state of this application.

[0034] Figure 4 This is a schematic diagram of the lifting mechanism structure of this application.

[0035] Figure 5 This is a schematic diagram of the main structure of this application.

[0036] Figure 6 This is a schematic diagram of the fixed mechanism structure of this application.

[0037] Figure 7 This is a schematic diagram of the main structure of the fixed mechanism in this application.

[0038] Figure 8 This is a schematic diagram of the swing mechanism structure of this application.

[0039] Figure 9 This is a schematic diagram of the adjustment component structure of this application.

[0040] Figure 10 This is a schematic diagram of the deflection mechanism structure of this application.

[0041] Figure 11 This is a side view of the main body of this application.

[0042] Figure 12 This is a cross-sectional view of this application.

[0043] Figure 13 This is a schematic diagram of the cleaning mechanism structure of this application.

[0044] In the diagram: 1. Etching box; 2. Lifting mechanism; 201. Threaded cylinder; 202. One-way screw; 203. T-shaped plate; 204. Limiting rod; 205. Motor; 206. Gear; 3. Fixing mechanism; 301. U-shaped frame; 302. U-shaped plate; 303. Orifice plate; 304. Sealing ring; 305. Sealing airbag; 306. Limiting ring; 307. Electric cylinder; 308. Air pump; 4. Swinging mechanism; 401. Rocker arm; 402. Motor; 403. Strip groove; 404. Motor; 405. One-way screw; 406. Threaded seat; 407. Connecting... 408. Connecting arm; 409. Slide rail; 5. Slider; 5. Deflection mechanism; 501. Rectangular block; 502. Vertical rod; 503. Slide seat; 504. Spring; 505. Turntable; 506. T-shaped frame; 507. Pulley; 508. Connecting rod; 6. Cleaning mechanism; 601. One-way screw three; 602. Threaded seat three; 603. Vertical pipe; 604. Nozzle; 605. Synchronous pulley; 606. Synchronous belt; 607. Motor four; 7. Baffle; 8. Drain pipe; 9. Electric cylinder two; 10. Guide rail one; 11. Mounting bracket; 12. Guide rail two; 13. Limit block; 14. Box door. Detailed Implementation

[0045] The following combination Figure 1 - Figure 13 The embodiments of this application will be described in detail.

[0046] This application discloses an automatic etching device and method for single-sided circuit boards. The fixing mechanism of this application can attach and stack the substrate surfaces of two unidirectional circuit boards together and clamp and fix them, exposing the copper surfaces of the two unidirectional circuit boards to the outside for etching. Thus, this device can etch not only double-sided circuit boards but also single-sided circuit boards without damaging the substrate surface, increasing the applicability of the device. At the same time, it can etch two unidirectional circuit boards at the same time, increasing production efficiency.

[0047] Example 1:

[0048] like Figure 1 and Figure 4As shown, the etching chamber 1 is equipped with a lifting mechanism 2. The lifting mechanism 2 includes a T-shaped plate 203 that is movably disposed inside the etching chamber 1. A threaded cylinder 201 is rotatably mounted on the upper side of the etching chamber 1. A one-way screw 202 that is adapted to the threaded cylinder 201 and extends into the etching chamber 1 and is connected to the T-shaped plate 203 is disposed in the hole of the threaded cylinder 201. Two limiting rods 204 that extend to the outside of the etching chamber 1 and are slidably connected to the etching chamber 1 are symmetrically mounted on the upper side of the T-shaped plate 203. When the threaded cylinder 201 rotates, it drives the one-way screw 202 to descend. The descending one-way screw 202 drives the T-shaped plate 203 to move, and vice versa. The limiting rods 204 prevent the one-way screw 202 and the T-shaped plate 203 from rotating with the threaded cylinder 201.

[0049] like Figure 4 As shown, a motor 205 is installed on the upper side of the etching box 1 on one side of the threaded cylinder 201. Gears 206 are installed on both the drive end of the motor 205 and the side of the threaded cylinder 201, and the two gears 206 mesh with each other. The running motor 205 can drive the threaded cylinder 201 to rotate forward or backward through the two gears 206.

[0050] It should be noted that the motor 205 is a servo motor.

[0051] In summary, when motor 205 drives the threaded cylinder 201 to rotate forward, the rotating threaded cylinder 201 drives the one-way screw 202 to descend and causes the T-shaped plate 203 to descend. Conversely, when the motor 205 drives the threaded cylinder 201 to rotate in reverse, the rotating threaded cylinder 201 drives the one-way screw 202 to rise and causes the T-shaped plate 203 to rise.

[0052] like Figure 1 and Figure 2 As shown, etching solution is placed at the bottom of etching tank 1. A faucet (not shown in the figure) is placed on the side of etching tank 1 near the bottom. An input pipe (not shown in the figure) is placed on the side of etching tank 1 near the middle. Opening the faucet can discharge waste etching solution from etching tank 1 and inject new etching solution through the input pipe.

[0053] like Figure 2 and Figure 5 As shown, it also includes a fixing mechanism 3, which includes a U-shaped frame 301 disposed on the lower side of the T-shaped plate 203. A set of U-shaped plates 302 are rotatably mounted on the inner side of the U-shaped frame 301. A set of orifice plates 303 distributed vertically and connected to the two U-shaped plates 302 are disposed between them. The two single-sided circuit board substrates are attached and stacked together. Then, the two stacked circuit boards are placed on the lower orifice plate 303, and their edges are clamped and fixed by the two orifice plates 303.

[0054] like Figure 5 and Figure 6As shown, a rectangular annular sealing ring 304 is installed on the adjacent side of the orifice plate 303, and a rectangular annular sealing airbag 305 is also installed on the upper side of the lower orifice plate 303 outside the sealing ring 304. The sealing ring 304 is used to fill the gap between the orifice plate 303 and the circuit board, and the sealing airbag 305 is used to fill the gap between the two orifice plates 303 to prevent the etching solution from entering the gap between the two circuit boards.

[0055] Both the rectangular annular sealing ring 304 and the sealing airbag 305 are made of fluororubber, which will not be corroded by etching solution.

[0056] like Figure 5 and Figure 6 As shown, the lower orifice plate 303 is connected to the U-shaped plate 302. An electric cylinder 307 is installed on the upper side of the U-shaped plate 302. The telescopic arm end of the electric cylinder 307 is connected to the upper orifice plate 303. When the electric cylinder 307 extends, it can bring the upper orifice plate 303 closer to the lower orifice plate 303 to clamp the stacked circuit board between the two. When it retracts, it can move away from the lower orifice plate to release the clamping.

[0057] like Figure 5 and Figure 6 As shown, a rectangular annular limiting ring 306 is installed on the outer side of the lower orifice plate 303 to match it. An air pump 308 with its output end connected to the sealing airbag 305 is installed on the lower side of one of the orifice plates 302. The air pump 308 is a bidirectional air pump that can inflate or deflate the sealing airbag 305. At the same time, one side of the sealing airbag 305 is limited by the limiting ring 306, and the other side is limited by the edge of the stacked circuit board. When the sealing airbag 305 is inflated, it can only expand towards the upper orifice plate 303 until it contacts the upper plate and fills the gap between the two.

[0058] The air pump 308 and the electric cylinder 307 are both equipped with protective covers to prevent them from coming into contact with the etching solution.

[0059] It should be noted that a pressure sensor (not shown in the figure) is embedded on the lower side of the upper mouth plate 303 above the sealing airbag 305. A controller (not shown in the figure) electrically connected to the pressure sensor is installed on the outside of the etching box 1. When the sealing airbag 305 expands and adheres tightly to the upper mouth plate 303, it will squeeze the pressure sensor. When the squeezing pressure reaches a predetermined threshold (which can be reasonably determined by the operator according to the airbag inflation pressure range to ensure that the airbag pressure is within the normal range), the pressure sensor sends a signal to the controller, and the controller controls the air pump 308 to stop inflation.

[0060] like Figure 1 As shown, a door 14 is provided on the front side of the etching box 1 near the top. By opening the door 14, two stacked circuit boards that need to be etched can be placed on the fixing mechanism 3 or the etched circuit board on the fixing mechanism 3 can be taken out from the etching box 1.

[0061] In summary, after opening the cabinet door 14, tin-plat the two single-sided circuit boards whose etched surfaces need to be tin-plated, and then stack the two single-sided circuit board substrates together. Next, place the two stacked circuit boards on the lower orifice plate 303. The electric cylinder 307 extends, allowing the upper orifice plate 303 to move closer to the lower orifice plate 303, clamping the stacked circuit boards between them. The sealing ring 304 fills the gap between the circuit boards and the orifice plate 303. Then, the air pump 308 injects air into the sealing airbag 305, causing it to expand towards the upper orifice plate 303 until it is tightly pressed against the upper orifice plate 303, at which point the air supply stops. The air is used to fill the gap between the two orifice plates 303 with a sealing airbag 305. Then, the lifting mechanism 2 controls the fixing mechanism 3 to descend, which drives the two stacked circuit boards fixed on it to descend into the etching solution. Since the etching surface is exposed to the outside, the parts of the etching surface that are not covered by tin are etched, thus realizing the automatic etching of the single-sided circuit board. After completion, the lifting mechanism 2 raises the fixing mechanism 3 to the predetermined position, the air pump 308 releases the air from the sealing airbag 305 to release the seal, and then the electric cylinder 307 shortens to drive the upper orifice plate 303 to rise to release the clamp. Then the two boards can be taken out.

[0062] When etching a double-sided circuit board, place the double-sided circuit board directly on the lower orifice plate 303 and clamp it with the upper orifice plate 303. Then, use the lifting mechanism 2 to move the double-sided circuit board into the etching solution for etching.

[0063] like Figure 2 and Figure 10 As shown, a deflection mechanism 5 is also provided. The deflection mechanism 5 includes two sets of rectangular blocks 501 installed on both sides of the U-shaped frame 301. A vertical rod 502 is installed between the two rectangular blocks 501 in each set. A slide block 503 is slidably mounted on the vertical rod 502. Springs 504 (made of stainless steel) are connected between the upper and lower sides of the slide block 503 and the rectangular blocks 501 on the same side. When the slide block 503 moves upward, it will compress the upper spring 504 and stretch the lower spring 504. When the slide block 503 moves downward, it will compress the lower spring 504 and stretch the upper spring 504.

[0064] like Figure 10 As shown, a T-shaped frame 506 is installed on the side of the slide 503, and a turntable 505 is installed on the rotating shaft end of the U-shaped plate 302 and the U-shaped frame 301. A connecting rod 508 is hinged to the side of the T-shaped frame 506, and the lower end of the connecting rod is hinged to the side edge of the turntable 505. The moving T-shaped frame 506 will pull the turntable 505 to rotate through the connecting rod 508, thereby driving the circuit board fixed on the fixing mechanism 3 to rotate.

[0065] like Figure 2 and Figure 3As shown, two sets of limiting blocks 13 are symmetrically installed on the inner wall of the etching box 1. Each set of two limiting blocks 13 are distributed vertically. When the fixing mechanism 3 slowly rises until the T-shaped frame 506 contacts the upper limiting block 13, it will limit the T-shaped frame 506. When the fixing mechanism 3 continues to rise and drives the vertical rod 502 to rise, it will cause the slide 503 on it to fall relative to it, compressing the lower spring 504 and stretching the upper spring 504 at the same time. Through the connecting rod 508 and the turntable 505, it drives the orifice plate 303 to rotate. When the fixing mechanism 3 rises to the highest point, the circuit board fixed on the fixing mechanism 3 is in a parallel state, which is convenient for placing or removing the stacked circuit boards. When the fixing mechanism 3 slowly descends, there is no limit from the upper limiting block 13, which causes the compressed spring 504 to rebound and the stretched spring 504 to contract, thereby allowing the slide 503 to rise until the vertical rod 502 returns to its original position, driving the orifice plate 303 and the circuit board fixed thereto to be in a vertical state.

[0066] Once the fixing mechanism 3 is fully immersed in the etching solution, the motor 205 drives the threaded cylinder 201 to rotate a fixed number of turns in both directions. This causes the fixing mechanism 3 to move up and down frequently at a fixed distance within the etching solution. When the fixing mechanism 3 descends and contacts the lower limit block 13, the lower limit block 13 limits the T-shaped frame 506. Meanwhile, the fixing mechanism 3 drives the vertical rod 502 to continue descending, causing the slide 503 to be in an upward state relative to the vertical rod 502. This compresses the upper spring 504 and stretches the lower spring 504, simultaneously driving the circuit board fixed on the fixing mechanism 3 to deflect. When the fixing mechanism 3 rises, the spring 504 restores the position of the slide 503 and drives the circuit board on the fixing mechanism 3 to deflect in the opposite direction. This allows the circuit board to deflect back and forth frequently within the etching solution during etching, enhancing the circuit board's ability to avoid the flow rate of the etching solution, improving the etching effect, and reducing the etching time.

[0067] In summary, once the fixing mechanism 3 is fully immersed in the etching solution, the motor 205 drives the threaded cylinder 201 to rotate a fixed number of times in both directions, thereby causing the fixing mechanism 3 to move up and down frequently at a fixed distance within the etching solution. The lower limit block 13 limits the T-shaped frame 506 inside the deflection mechanism 5, allowing the rising and falling deflection mechanism 5 to drive the circuit board on the fixing mechanism 3 to deflect frequently in both directions within the etching solution. This enhances the circuit board's ability to avoid the flow rate of the etching solution, improves the etching effect, and reduces the etching time. When the fixing mechanism 3 slowly rises, the upper limit block 13 limits the T-shaped frame 506 inside the deflection mechanism 5. When the fixing mechanism 3 rises to its highest point, the circuit board is deflected to a parallel position.

[0068] like Figure 5 and Figure 8 As shown, the swing mechanism 4 includes two slide rails 408 symmetrically mounted on the lower side of the T-shaped plate 203. Each slide rail 408 has a slider 409 slidably mounted on it and connected to the U-shaped frame 301. The moving U-shaped frame 301 can drive the slider 409 to slide on the slide rail 408.

[0069] like Figure 8 and Figure 9 As shown, a second motor 402 is installed on the upper side of the T-shaped plate 203. The driving end of the second motor 402 extends to the lower part of the T-shaped plate 203 and is equipped with a rocker arm 401. A strip groove 403 is opened on the side of the rocker arm 401. A threaded seat 406 is provided in the strip groove 403. A connecting arm 407 with the end of the threaded seat 406 is hinged to the lower side. The second motor 402 drives the rocker arm 401 to rotate. The rocker arm 401 pulls the threaded seat 406 to swing back and forth frequently, thereby driving the circuit board fixed on the fixing mechanism 3 to swing back and forth. The etching liquid adhering to its surface is quickly removed by inertia.

[0070] like Figure 5 and Figure 11 As shown, a pulley 507 is rotatably mounted on the side of the T-shaped frame 506 above the connecting rod 508. Below one pulley 507 is a guide rail 10 that slopes upward and connects to the T-shaped plate 203. Above the other pulley 507 is a guide rail 22 that slopes downward and connects to the T-shaped plate 203. Both guide rails 10 and 212 have a set of mounting brackets 11 connected to the traffic slide rail 408. When the fixing mechanism 3 swings towards guide rail 10, it drives the T-shaped frame 506 and the sliding block 503 to rise via guide rail 10 and the pulley 507 on the same side. The circuit board on the fixing mechanism 3 is pulled by the connecting rod 508 and the turntable 505 to deflect at a small angle towards the guide rail 10. When the fixing mechanism 3 moves in the opposite direction, the circuit board deflects in the opposite direction and returns to its original position when the slide 503 is restored. When the fixing mechanism 3 swings towards the guide rail 2 12, the T-shaped frame 506 is driven to descend via the guide rail 2 12 and the pulley 507 on the same side, causing the circuit board on the fixing mechanism 3 to deflect at a small angle towards the guide rail 2 12. When the fixing mechanism 3 moves in the opposite direction, the circuit board deflects in the opposite direction and returns to its original position when the slide 503 is restored.

[0071] When the fixed mechanism 3 swings in the opposite direction, the deflection mechanism 5 drives the circuit board fixed on the fixed mechanism 3 to tilt at a small angle in the swing direction. During the swing, the circuit board tilts, and the inertial force and the gravity component of the etching solution itself are superimposed to form an oblique resultant force. The direction of the resultant force is at a dynamic angle with the board surface, which more efficiently destroys the liquid film adhesion, allowing the etching solution to detach from the board more easily and improving the cleaning effect.

[0072] like Figure 9As shown, the threaded seat 406 has a threaded hole on its side. A one-way screw 405, which is adapted to the threaded seat and whose two ends are rotatably connected to the inner wall of the slot 403, is installed in the threaded hole. Bearings are installed at the rotatable connection points. A motor 404, whose drive end is connected to one end of the one-way screw 405, is installed on the side of the rocker arm 401. The motor 404 drives the one-way screw 405 to rotate, which drives the threaded seat 406 to move. The distance between the threaded seat 406 and the rocker arm 401 is adjusted, thereby changing the swing distance of the fixing mechanism 3. When the swing distance increases, the pulley 507 moves a greater distance on the guide rail 10 and the guide rail 2 12, resulting in a larger deflection angle of the circuit board. This not only adjusts the swing distance of the fixing mechanism 3, but also changes the deflection angle of the circuit board when it swings (high viscosity etching solution requires a larger tilt angle to overcome viscous resistance).

[0073] When using high-viscosity etching solution, the operator can adjust the position of thread seat 406 by controlling motor 3 404, thereby increasing the deflection angle of the circuit board each time, so that the etching solution can be more easily removed from it.

[0074] In summary, motor 402 drives rocker arm 401 to rotate. Rocker arm 401 pulls U-shaped frame 301 back and forth frequently through threaded seat 406, which in turn causes the circuit board fixed on the fixing mechanism 3 to swing back and forth. The etching solution adhering to its surface is detached by inertia. At the same time, during the back and forth swinging process of the fixing mechanism 3, the circuit board on the fixing mechanism 3 is tilted in the direction of movement through guide rail 1 10 and guide rail 2 12. The inertial force and the gravity component of the etching solution itself are superimposed to form an oblique resultant force. The direction of the resultant force is at a dynamic angle with the board surface, which more efficiently destroys the liquid film adhesion and makes the etching solution more easily detach from the board, thus improving the cleaning effect.

[0075] Example 2:

[0076] Based on Example 1, such as Figure 12 and Figure 13 As shown, it also includes a cleaning mechanism 6, which includes two one-way screws 601 rotatably mounted on the inner wall of the etching chamber 1. The one-way screws 601 are provided with threaded seats 602 that are slidably connected to the inner wall of the etching chamber 1. The rotating one-way screws 601 drive the threaded seats 602 to move on the one-way screws 601.

[0077] like Figure 12 and Figure 13As shown, a vertical tube 603 is installed on the lower side of the threaded seat 602. A set of nozzles 604, evenly distributed and facing the fixing mechanism 3, are installed on the side of the vertical tube 603. The input ends of the two vertical tubes 603 are connected to a water source, so that each nozzle 604 sprays water. After most of the etching solution on the circuit board surface is removed, the two sets of horizontally moving nozzles 604 spray water on the two etched surfaces of the circuit board to thoroughly clean the etching solution on the surface. The two sets of horizontally moving nozzles 604 can fully cover and clean the etched surfaces of the circuit board.

[0078] like Figure 13 As shown, one end of each of the two unidirectional screws 601 extends to the outside of the etching chamber 1 and is equipped with a synchronous pulley 605. A synchronous belt 606 is provided on both synchronous pulleys 605. A motor 607 is installed on the side of the etching chamber 1, with its drive end connected to the other end of one of the unidirectional screws 601. The running motor 607 drives the unidirectional screw 601 connected to it to rotate, and drives the other unidirectional screw 601 to rotate in the same direction through the synchronous pulley 605 and the synchronous belt 606.

[0079] like Figure 1 and Figure 12 As shown, inside the etching chamber 1, below the cleaning mechanism 6, there is a baffle 7 extending to the outside of the etching chamber 1. Both sides of the etching chamber 1 are equipped with electric cylinders 9 whose telescopic arm ends are connected to the edges of the baffle 7 extending to the outside of the etching chamber 1. A drain pipe 8 is installed on the front side of the etching chamber 1 above the baffle 7. A valve is installed on the drain pipe 8. During cleaning, the electric cylinder 9 shortens and moves the baffle 7 into the etching chamber 1 to block the etching liquid. The water after cleaning the circuit board falls onto the baffle 7 and is then discharged from the drain pipe 8. After cleaning, the electric cylinder 9 extends and moves the baffle 7 out of the etching chamber 1 without affecting the next use.

[0080] In summary, after most of the etching solution is removed from the surface of the circuit board, the electric cylinder 2 9 shortens and moves the baffle 7 into the etching chamber 1 to block the etching solution. Then, the two unidirectional screws 3 601 rotate in the same direction to drive the two sets of nozzles 604 to move laterally. At the same time, the nozzles 604 spray water to rinse the same side of the etched surface of the circuit board, thoroughly cleaning the etching solution. The water after rinsing falls on the baffle 7 and is discharged through the drain pipe 8. Then, the oscillating mechanism 4 and the deflection mechanism 5 make the fixing mechanism 3 continue to oscillate and dry its surface.

[0081] This application also discloses an automatic etching method for single-sided PCB circuits, the steps of which are as follows:

[0082] S1. Circuit board fixing: After stacking two circuit boards, fix them on the fixing mechanism 3. Specifically, open the box door 14, tin-plate the etched side of the two single-sided circuit boards, and stack the two single-sided circuit board substrates together. Then, place the two stacked circuit boards on the lower orifice plate 303. The electric cylinder 307 extends to allow the upper orifice plate 303 to move closer to the lower orifice plate 303 to clamp the stacked circuit boards. The sealing ring 304 can fill the gap between the circuit board and the orifice plate 303. Then, the air pump 308 injects air into the sealing airbag 305 to make it expand towards the upper orifice plate 303 until it is tightly attached to the upper orifice plate 303, and then the air supply is stopped. The sealing airbag 305 fills the gap between the two orifice plates 303.

[0083] S2. Circuit board etching: The circuit board fixed on the fixing mechanism 3 is moved into the etching solution by the lifting mechanism 2 for etching. Specifically, the fixing mechanism 3 is lowered by the lifting mechanism 2 and the upper limit block 13 is released from the T-shaped frame 506 in the deflection mechanism 5, so that the horizontal circuit board becomes vertical. The fixing mechanism 3 continues to descend, which drives the two stacked circuit boards fixed on it to descend into the etching solution. Since the etching surface is exposed to the outside, the parts of the etching surface that are not covered by tin are etched, thus realizing the automatic etching of single-sided circuit boards.

[0084] S3. The circuit board swings, causing the circuit board to frequently deflect at the same angle during the etching process. Specifically, after the fixing mechanism 3 is fully immersed in the etching solution, the motor 205 drives the threaded cylinder 201 to rotate forward and backward a fixed number of times, thereby causing the fixing mechanism 3 to move up and down frequently at a fixed distance in the etching solution. The lower limit block 13 limits the T-shaped frame 506 in the deflection mechanism 5, allowing the rising and falling deflection mechanism 5 to drive the circuit board on the fixing mechanism 3 to frequently deflect forward and backward in the etching solution, thereby enhancing the circuit board's ability to avoid the flow rate of the etching solution, improving the etching effect, and reducing the etching time.

[0085] S4. Surface Cleaning: After etching, the circuit board is removed from the etching solution and the etching solution adhering to its surface is cleaned. Specifically, motor 2 402 drives rocker arm 401 to rotate. Rocker arm 401 pulls U-shaped frame 301 back and forth frequently through threaded seat 2 406, which in turn drives the circuit board fixed on the fixing mechanism 3 to swing back and forth. The etching solution adhering to its surface is detached by inertia. At the same time, during the back and forth swinging process of the fixing mechanism 3, the circuit board on the fixing mechanism 3 is tilted in the direction of movement through guide rail 1 10 and guide rail 2 12. The inertial force and the gravity component of the etching solution itself are superimposed to form an oblique resultant force. The direction of the resultant force is at a dynamic angle with the board surface, which more efficiently destroys the liquid film adhesion and makes the etching solution more easily detach from the board, improving the cleaning effect.

[0086] S5. After the circuit board is removed and the surface etching solution is cleaned, the circuit board is raised to the height of the limit block 13 and the etched circuit board is removed. Specifically, after the surface etching solution is cleaned, the fixing mechanism 3 is raised to the predetermined position by the lifting mechanism 2. At this time, the circuit board is deflected to a parallel angle by the upper limit block 13 and the deflection mechanism 5. Then, the air pump 308 releases air from the sealing airbag 305 to release the seal. Then, the electric cylinder 307 shortens and drives the upper orifice plate 303 to rise to release the clamp. Then, the two boards are taken out and two circuit boards to be etched are put in, and the next etching can be performed.

[0087] It will be apparent to those skilled in the art that this application is not limited to the details of the exemplary embodiments described above, and that this application can be implemented in other specific forms without departing from the spirit or essential characteristics of this application. Therefore, the embodiments should be considered in all respects as exemplary and not restrictive.

[0088] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. An automatic etching device for single-sided PCB circuits, comprising an etching chamber (1), wherein a lifting mechanism (2) is provided on the etching chamber (1), and the lifting mechanism (2) includes a T-shaped plate (203) movable inside the etching chamber (1), characterized in that: It also includes a fixing mechanism (3) and a swinging mechanism (4). The fixing mechanism (3) includes a U-shaped frame (301) that is slidably disposed on the lower side of the T-shaped plate (203). A set of U-shaped plates (302) are rotatably installed on the inner side of the U-shaped frame (301). A set of upper and lower slit plates (303) are disposed between the two U-shaped plates (302). A rectangular annular sealing ring (304) is installed on the adjacent side of the slit plate (303). A rectangular annular sealing airbag (305) is also installed on the upper side of the lower slit plate (303) outside the sealing ring (304). The swing mechanism (4) includes a rocker arm (401) rotatably mounted on the lower side of the T-shaped plate (203). A strip groove (403) is provided on the side of the rocker arm (401). A threaded seat (406) is slidably arranged in the strip groove (403). A connecting arm (407) with its end hinged to the lower side of the threaded seat (406) is hinged to the U-shaped frame (301). A deflection mechanism (5) is also provided, which causes the circuit board fixed inside the fixing mechanism (3) to be at different deflection angles when the fixing mechanism (3) is at different heights. The deflection mechanism (5) includes two sets of rectangular blocks (501) installed on both sides of the U-shaped frame (301). A vertical rod (502) is installed between the two rectangular blocks (501) in each set. A slide block (503) is slidably installed on the vertical rod (502). The slide block (503) is connected to the rectangular blocks (501) on the same side on the upper and lower sides. 1) Springs (504) are connected between each other. A T-shaped frame (506) is installed on the side of the slide (503). A turntable (505) is installed on the shaft end of the U-shaped plate (302) and the U-shaped frame (301). A connecting rod (508) with the lower end of the T-shaped frame (506) is hinged to the side of the turntable (505). Two sets of limiting blocks (13) are symmetrically installed on the inner wall of the etching box (1). The two limiting blocks (13) in each set are distributed vertically.

2. The apparatus according to claim 1, wherein: The lower orifice plate (303) is connected to the U-shaped plate (302). An electric cylinder (307) is installed on the upper side of the U-shaped plate (302). The telescopic arm end of the electric cylinder (307) is connected to the upper orifice plate (303).

3. The automatic etching device for single-sided circuit boards according to claim 2, characterized in that: A rectangular ring-shaped limiting ring (306) is installed on the outside of the lower orifice plate (303) to match it, and an air pump (308) with its output end connected to the sealing airbag (305) is installed on the lower side of one of the orifice plates (302).

4. The automatic etching device for single-sided PCB circuits according to claim 3, characterized in that: The threaded seat (406) has a threaded hole on its side, and a one-way screw (405) is provided in the threaded hole and is adapted to it and is rotatably connected to the inner wall of the strip groove (403) at both ends.

5. The automatic etching device for single-sided PCB circuits according to claim 4, characterized in that: The upper side of the T-shaped plate (203) is equipped with a second motor (402) whose drive end is connected to the shaft of the rocker arm (401), and the side of the rocker arm (401) is equipped with a third motor (404) whose drive end is connected to one end of the one-way screw (405).

6. The automatic etching device for single-sided circuit boards according to claim 5, characterized in that: The side of the T-shaped frame (506) is rotatably mounted with pulleys (507) above the connecting rod (508). One of the pulleys (507) is mounted with an upwardly inclined guide rail (10) connected to the T-shaped plate (203) below it, and the other pulley (507) is mounted with a downwardly inclined guide rail (12) connected to the T-shaped plate (203) above it.

7. The automatic etching device for single-sided PCB circuits according to claim 6, characterized in that: A limit block (13) is provided on the front side of the etching box (1) near the top.

8. An automatic etching method for single-sided PCB circuits, comprising an automatic etching apparatus for single-sided PCB circuits as described in any one of claims 1 to 7, characterized in that: The method includes the following steps: S1. Circuit board fixing: After stacking the two circuit boards, fix them on the fixing mechanism (3); S2, Circuit board etching: The circuit board fixed on the fixing mechanism (3) is moved into the etching solution by the lifting mechanism (2) and etched. S3. Circuit board oscillation, causing the circuit board to frequently deflect at the same angle during the etching process; S4. Surface cleaning: After etching is completed, remove the circuit board from the etching solution and clean the etching solution adhering to its surface. S5. Remove the circuit board. After cleaning the surface with etching solution, raise the circuit board to the height of the limit block (13) and remove the etched circuit board.

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