Display module and preparation method thereof

Abstract

The invention discloses a display module and a preparation method thereof, the display module comprises a plurality of display panels, each display panel comprises a light-emitting assembly, a packaging glue structure and a light processing film, the light-emitting assembly comprises a circuit board and a plurality of light-emitting devices, the light-emitting devices are arranged on one side of the circuit board, and the light processing film is arranged on the circuit board. The light-emitting device is electrically connected to a circuit pattern on the circuit board, the packaging adhesive structure covers the light-emitting assembly from the side where the light-emitting device is located, a plurality of light diffusion particles are distributed in the packaging adhesive structure, and the light processing film covers the side, away from the circuit board, of the packaging adhesive structure. According to the light processing film, the display contrast of the display panel can be improved, the uniformity of light emitted out of the light emitting side of the display panel can be effectively improved by distributing the multiple light diffusion particles in the packaging adhesive structure, and therefore the color uniformity of the surface of the light emitting side of the display panel is effectively improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display, in particular to a display module and a preparation method thereof. BACKGROUND

[0002] The display module usually comprises a plurality of display panels, and the display panel usually comprises a circuit board, a plurality of light emitting devices arranged on the circuit board, and a light-transmitting encapsulation glue covering the light emitting devices and the circuit board. When the display module is used for light emitting display, the uniformity of the surface color of the light emitting side of the display panel and the display contrast ratio will greatly affect the overall display effect of the light emitting display module.

[0003] The display module in the related art has the problems of poor uniformity of the surface color of the light emitting side of the display panel and small display contrast ratio. SUMMARY

[0004] An object of the present application is to provide a display module, which comprises a plurality of display panels, the surface color of the light emitting side of which is uniform, and the display contrast ratio of which is large, so that the display effect of the display module is better.

[0005] Another object of the present application is to provide a preparation method of a display module, which can manufacture the display module described above, the surface color of the light emitting side of which is uniform, and the display contrast ratio of which is large.

[0006] To achieve the above object, the present application adopts the following technical solutions:

[0007] In a first aspect, a display module is provided, comprising:

[0008] a plurality of display panels, the display panel comprising a light emitting assembly, an encapsulation glue structure, and a light processing film, the light emitting assembly comprising a circuit board and a plurality of light emitting devices, the plurality of light emitting devices being arranged on one side of the circuit board, and the light emitting devices being electrically connected to a circuit pattern on the circuit board, the encapsulation glue structure covering the light emitting assembly from the side where the light emitting devices are arranged, and a plurality of light diffusion particles being distributed in the encapsulation glue structure, the light processing film covering the side of the encapsulation glue structure away from the circuit board, and the light processing film being capable of improving the display contrast ratio of the display panel.

[0009] As a preferred technical solution of the display module, the light emitting assembly further comprises a cover layer, the cover layer being arranged on the surface of the circuit board and surrounding the outer periphery of the light emitting devices.

[0010] As a preferred technical solution of the display module, the weight of the encapsulation glue structure is m1, the total weight of the light diffusion particles in the encapsulation glue structure is m2, and 0.4(2*△L+0.1) %≤m2 / m1≤0.9(2*△L+0.1) % is satisfied.

[0011] Wherein, △L=J / P, J=AVLmax-AVLmin, P=S / N.

[0012] The luminance value of the light-emitting component is AVL, the maximum value of the luminance values AVL of all the light-emitting components is AVLmax, and the minimum value of the luminance values AVL of all the light-emitting components is AVLmin.

[0013] S is the sum of the luminance values AVL of all the light-emitting components, and N is the total number of the light-emitting components included in the display module.

[0014] As a preferred technical solution of the display module, the particle size Φ of the light diffusion particles satisfies: 1 μm≤Φ≤8 μm.

[0015] As a preferred technical solution of the display module, the particle size Φ of the light diffusion particles satisfies: 2 μm≤Φ≤4 μm.

[0016] As a preferred technical solution of the display module, the weight m1 of the encapsulation glue structure and the total weight m2 of the light diffusion particles in the encapsulation glue structure satisfy: 0.1 %≤m2 / m1≤0.64 %.

[0017] As a preferred technical solution of the display module, when 0.1 %≤m2 / m1≤0.19 %, the light transmittance of the light processing film is in the range of 98 % to 99 %.

[0018] When 0.19 %<m2 / m1≤0.37 %, the light transmittance of the light processing film is in the range of 95 % to 98 %.

[0019] When 0.37 %<m2 / m1≤0.64 %, the light transmittance of the light processing film is in the range of 90 % to 95 %.

[0020] As a preferred technical solution of the display module, along the opposite direction of the circuit board and the light processing film, the part of the encapsulation glue structure between the light-emitting device and the light processing film has a thickness d1, and 30 μm≤d1≤250 μm; and / or,

[0021] The light processing film has a thickness d2 in the opposite direction of the circuit board and the light processing film, 2 μm ≤ d2 ≤ 30 μm.

[0022] As a preferred technical solution of the display module, the light transmittance of the encapsulation glue structure is in the range of 85% to 95%; and / or,

[0023] The light transmittance of the light processing film is in the range of 90% to 99%.

[0024] As a preferred technical solution of the display module, the surface gloss of the light emitting side of the light processing film is in the range of 4GU to 13GU.

[0025] As a preferred technical solution of the display module, the display module further comprises a cabinet, and a plurality of display panels are arranged in the cabinet.

[0026] In a second aspect, a preparation method of a display module is provided for manufacturing the display module of the first aspect, and the preparation method of the display module comprises the following steps:

[0027] In step S1, a light emitting assembly is provided, which comprises a circuit board and a plurality of light emitting devices arranged on one side of the circuit board;

[0028] In step S2, light transmittance glue mixed with light diffusion particles is provided;

[0029] In step S3, the light transmittance glue and the light processing film are arranged from the side of the light emitting devices of the light emitting assembly, and the light transmittance glue is solidified to form an encapsulation glue structure, thereby obtaining a display panel;

[0030] In step S4, the step S3 is repeated until all the light emitting assemblies are prepared into the display panel.

[0031] As a preferred technical solution of the preparation method of the display module, the step S2 comprises:

[0032] In step S21, the luminance value AVL of the light emitting side of all the light emitting assemblies is detected by a spectrophotometer under the same condition;

[0033] In step S22, the ratio of the weight m1 of the encapsulation glue structure to the total weight m2 of the light diffusion particles in the encapsulation glue structure is calculated by the formula 0.4(2*△L+0.1) % ≤ m2 / m1 ≤ 0.9(2*△L+0.1) %, wherein m1=m11+m12, the light transmittance glue comprises light transmittance glue water and a curing agent, m11 is the weight of the light transmittance glue water, and m12 is the weight of the curing agent;

[0034] Step S23, providing the light-transmitting glue and the light diffusion particles in a weight ratio satisfying the calculation result in the step S22, and stirring and mixing the light-transmitting glue and the light diffusion particles;

[0035] Step S24, providing the curing agent in a weight ratio satisfying the calculation result in the step S22 with the light-transmitting glue and the light diffusion particles, stirring and mixing the curing agent with the mixed light-transmitting glue and light diffusion particles, to obtain the light-transmitting glue mixed with the light diffusion particles.

[0036] As a preferred technical solution of the preparation method of the display module, the step S21 comprises:

[0037] Step S210, determining a plurality of predetermined position detection points for the light-emitting assembly;

[0038] Step S211, using the multi-angle spectrophotometer to measure each detection point respectively, and reading the detection values of the predetermined angles measured by the multi-angle spectrophotometer;

[0039] Step S212, calculating the average of the detection values detected by all the detection points to obtain the luminance value AVL of the display panel;

[0040] Step S213, repeating the steps S210 to S212 until the luminance values AVL of all the light-emitting assemblies are obtained.

[0041] As a preferred technical solution of the preparation method of the display module, the step S3 comprises:

[0042] Step S30, providing a substrate, and the substrate is provided with a light processing film;

[0043] Step S31, providing the light-transmitting glue mixed with the light diffusion particles on the light processing film;

[0044] Step S32, making the light-emitting device of the light-emitting assembly face the light-transmitting glue, then covering the light-emitting assembly on the light-transmitting glue, and at least embedding the light-emitting device into the light-transmitting glue;

[0045] Step S33, curing the light-transmitting glue to form the encapsulation glue structure;

[0046] Step S34, stripping the light-emitting assembly, the encapsulation glue structure and the light processing film from the substrate as a whole to obtain the display panel.

[0047] The present application has the following beneficial effects:

[0048] By covering the light processing film on the side of the encapsulation glue structure away from the circuit board, the display contrast of the display panel can be larger.

[0049] Furthermore, by distributing a plurality of light diffusion particles in the encapsulation glue structure, the light reflected by the surface of the light emitting side of the light emitting component and the light emitted by the light emitting device can be scattered and diffused by the light diffusion particles, so as to effectively improve the uniformity of the light emitted from the light emitting side of the display panel, thereby effectively improving the color uniformity of the surface of the light emitting side of the display panel.

[0050] Meanwhile, the surface color of the circuit board and the light emitting device can also be adjusted by the light processing film, so that the surface color of the light emitting side of the display panel is closer to the surface color of the light processing film, thereby making the surface color uniformity of the light emitting side of the display panel better.

[0051] Therefore, the display effect of the display module is better. BRIEF DESCRIPTION OF DRAWINGS

[0052] The present application will be further described in detail below according to the drawings and embodiments.

[0053] Figure 1 The structure schematic diagram of the display module described in the embodiment.

[0054] Figure 2 The Figure 1 The enlarged schematic diagram of the middle M.

[0055] Figure 3 The structure flow schematic diagram of part of steps of the preparation method of the display module described in the embodiment.

[0056] In the figure:

[0057] 100, display panel; 200, base material; 300, box body;

[0058] 1, light emitting component; 11, circuit board; 12, light emitting device; 13, cover layer;

[0059] 2, encapsulation glue structure;

[0060] 3, light processing film;

[0061] 4, light diffusion particles. DETAILED DESCRIPTION

[0062] In order to make the technical problems solved by the present application, the technical solutions adopted and the technical effects reached more clear, the technical solutions of the embodiments of the present application will be further described in detail below with reference to the drawings. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0063] In the description of the present application, unless explicitly defined and limited otherwise, the terms "connected", "connected", "fixed" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0064] In the present application, unless explicitly defined and limited otherwise, the first feature "on" or "under" the second feature can include that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, the first feature "on", "above" and "above" the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "under", "below" and "below" the second feature includes that the first feature is directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0065] As shown in Figures 1 to 2 The present application provides a display module, comprising a plurality of display panels 100, the display panel 100 comprising a light emitting assembly 1, an encapsulation glue structure 2 and a light processing film 3, the light emitting assembly 1 comprising a circuit board 11 and a plurality of light emitting devices 12, the plurality of light emitting devices 12 being arranged on one side of the circuit board 11, and the light emitting devices 12 being electrically connected to the circuit pattern on the circuit board 11, the encapsulation glue structure 2 covering the light emitting assembly 1 from the side where the light emitting devices 12 are arranged, and a plurality of light diffusion particles 4 being distributed in the encapsulation glue structure 2, the light processing film 3 covering the side of the encapsulation glue structure 2 away from the circuit board 11, and the light processing film 3 being capable of improving the display contrast of the display panel 100.

[0066] By covering the light processing film 3 on the side of the encapsulation glue structure 2 away from the circuit board 11, the display contrast of the display panel 100 can be made larger.

[0067] Furthermore, by distributing a plurality of light diffusion particles 4 in the encapsulation glue structure 2, the light reflected by the surface of the light emitting side of the light emitting assembly 1 and the light emitted by the light emitting device 12 can be scattered and diffused by the light diffusion particles 4, so as to effectively improve the uniformity of the light emitted from the light emitting side of the display panel 100, thereby effectively improving the color uniformity of the surface of the light emitting side of the display panel 100.

[0068] Meanwhile, the surface color of the circuit board 11 and the light emitting device 12 can also be adjusted by the light processing film 3, so that the surface color of the light emitting side of the display panel 100 is closer to the surface color of the light processing film 3, thereby making the surface color uniformity of the light emitting side of the display panel 100 better.

[0069] Therefore, the display effect of the display module is better.

[0070] Specifically, the light processing film 3 can be a color close to black, for example, can be a color including but not limited to dark gray, dark brown, black, so that the surface of the light emitting side of the display panel 100 presents a color close to black under the action of the light processing film 3, thereby effectively improving the display contrast of the display panel 100.

[0071] Optionally, the light emitting assembly 1 further comprises a covering layer 13, which is arranged on the surface of the circuit board 11, so that the surface of the circuit board 11 can be shielded by the covering layer 13, and the surface color of the light emitting side of the light emitting assembly 1 can be adjusted. In other words, by arranging the covering layer 13 with a color close to or consistent with the light emitting device 12 on the surface of the circuit board 11, the surface color uniformity of the light emitting side of the light emitting assembly 1 can be improved.

[0072] The weight of the encapsulation glue structure 2 is m1, and the total weight of the light diffusion particles 4 in the encapsulation glue structure 2 is m2. The greater the weight ratio m2 / m1 of the light diffusion particles 4 to the encapsulation glue structure 2, the greater the scattering and diffusion effect of the light diffusion particles 4 on the light reflected by the surface of the light emitting side of the light emitting assembly 1 and the light emitted by the light emitting device 12. However, at the same time, the light diffusion particles 4 also cause a certain shielding effect on the light, resulting in a decrease in the light emitting efficiency of the display panel 100. Therefore, the weight ratio m2 / m1 of the diffusion particles to the encapsulation glue structure 2 can be selected based on the color difference of the surface of the light emitting side of the light emitting assembly 1, so that the light diffusion particles 4 and the encapsulation glue structure 2 as a whole can effectively improve the color uniformity of the light emitting side of the display panel 100 while avoiding excessive impact on the light emitting efficiency of the display panel 100. Based on this, the weight ratio m2 / m1 of the light diffusion particles 4 to the encapsulation glue structure 2 can satisfy: 0.4(2*△L+0.1) %≤m2 / m1≤0.9(2*△L+0.1) %, for example, the weight ratio m2 / m1 of the light diffusion particles 4 to the encapsulation glue structure 2 can be 0.4(2*△L+0.1) %, 0.425(2*△L+0.1) %, 0.45(2*△L+0.1) %, 0.475(2*△L+0.1) %, 0.5(2*△L+0.1) %, 0.525(2*△L+0.1) %, 0.55(2*△L+0.1) %, 0.575(2*△L+0.1) %, 0.6(2*△L+0.1) %, 0.625(2*△L+0.1) %, 0.65(2*△L+0.1) %, 0.675(2*△L+0.1) %, 0.7(2*△L+0.1) %, 0.725(2*△L+0.1) %, 0.75(2*△L+0.1) %, 0.775(2*△L+0.1) %, 0.8(2*△L+0.1) %, 0.825(2*△L+0.1) %, 0.85(2*△L+0.1) %, 0.875(2*△L+0.1) %, 0.88(2*△L+0.1) %, or 0.9(2*△L+0.1) %, etc.

[0073] wherein, △L=J / P, J=AVLmax-AVLmin, P=S / N, the luminance value of the light emitting side of all the light emitting assemblies 1 respectively detected by the spectrophotometer under the same conditions is AVL, AVLmax is the maximum value in the luminance values AVL measured by all the light emitting assemblies 1 respectively, AVLmin is the minimum value in the luminance values AVL measured by all the light emitting assemblies 1 respectively, S is the sum of the luminance values AVL measured by all the light emitting assemblies 1 respectively, and N is the total number of the light emitting assemblies 1 included in the display module. Therefore, the extreme value J of the AVL of all the light emitting assemblies 1 and the average value P of the AVL of all the light emitting assemblies 1 can be calculated, and then the luminance deviation ratio △L of all the light emitting assemblies 1 can be calculated.

[0074] The larger the particle size of the light diffusion particles 4, the greater the blocking effect on light, and the greater the light loss of the light emitting device 12 in the process of passing through the encapsulation glue structure 2 distributed with the light diffusion particles 4. Therefore, the smaller the particle size of the light diffusion particles 4 is better, but if the particle size of the light diffusion particles 4 is too small, the manufacturing cost of the light diffusion particles 4 will increase significantly. Therefore, the particle size of the light diffusion particles 4 cannot be too small. Based on this, the particle size Φ of the light diffusion particles 4 can satisfy: 1 μm≤Φ≤8 μm. For example, the particle size Φ of the light diffusion particles 4 can be 1 μm, 2 μm, 3 μm, 4 μm, 5 μm, 6 μm, 7 μm, or 8 μm, etc.

[0075] In order to make the cost of the light diffusion particles 4 lower while making the light loss of the light emitting device 12 in the process of passing through the encapsulation glue structure 2 distributed with the light diffusion particles 4 smaller, preferably, the particle size Φ of the light diffusion particles 4 can satisfy: 2 μm≤Φ≤4 μm. For example, the particle size Φ of the light diffusion particles 4 can be 2 μm, 2.2 μm, 2.4 μm, 2.5 μm, 2.6 μm, 2.8 μm, 3 μm, 3.2 μm, 3.4 μm, 3.5 μm, 3.6 μm, 3.8 μm, 4 μm.

[0076] As described in the foregoing, the greater the weight ratio m2 / m1 of the light diffusion particles 4 to the encapsulation glue structure 2, the more the total amount of the light diffusion particles 4 in the encapsulation glue structure 2, and the greater the scattering and diffusion effect of the light diffusion particles 4 on the light reflected by the surface of the light emitting side of the light emitting assembly 1 and the light emitted by the light emitting device 12. However, the greater the light loss of the light emitting device 12 in the process of passing through the encapsulation glue structure 2 distributed with the light diffusion particles 4. Therefore, the weight ratio m2 / m1 of the light diffusion particles 4 to the encapsulation glue structure 2 cannot be too large. Based on this, the weight ratio m2 / m1 of the light diffusion particles 4 to the encapsulation glue structure 2 can satisfy: 0.1%≤m2 / m1≤0.64%. For example, the weight ratio m2 / m1 of the light diffusion particles 4 to the encapsulation glue structure 2 can be 0.1%, 0.15%, 0.2%, 0.25%, 0.3%, 0.35%, 0.4%, 0.45%, 0.5%, 0.55%, 0.6%, or 0.64%, etc.

[0077] In order to have good light scattering and diffusion performance, the light diffusion particles 4 are usually white particles, and thus, the greater the weight ratio m2 / m1 of the light diffusion particles 4 to the encapsulation glue structure 2, the closer the color of the overall structure of the encapsulation glue structure 2 and the light diffusion particles 4 to white, and thus, the worse the display contrast of the light emitting side of the display panel 100. Therefore, the light transmittance of the light processing film 3 needs to be adjusted to adjust the degree of improvement of the display contrast of the light emitting side of the display panel 100 by the light processing film 3, so as to improve the appearance consistency while making the display contrast of the display panel 100 better by arranging the light diffusion particles 4 in the encapsulation glue structure 2. Next, the different selectable ranges of the light transmittance of the light processing film 3 in different weight ratios m2 / m1 of the light diffusion particles 4 to the encapsulation glue structure 2 will be exemplarily described.

[0078] In an optional example, when 0.1%≤m2 / m1≤0.19%, the total amount of the light diffusion particles 4 in the encapsulation glue structure 2 is small, and thus, the overall structure of the encapsulation glue structure 2 and the light diffusion particles 4 has a small influence on the display contrast of the display panel 100. Therefore, the light transmittance of the light processing film 3 can be large, and exemplarily, the light transmittance of the light processing film 3 can be in the range of 98% to 99%, for example, the light transmittance of the light processing film 3 can be 98%, 98.1%, 98.2%, 98.3%, 98.4%, 98.5%, 98.6%, 98.7%, 98.8%, 98.9% or 99%, etc.

[0079] In another optional example, when 0.19%<m2 / m1≤0.37%, the total amount of the light diffusion particles 4 in the encapsulation glue structure 2 is moderate, and thus, the overall structure of the encapsulation glue structure 2 and the light diffusion particles 4 has a moderate influence on the display contrast of the display panel 100. Therefore, the light transmittance of the light processing film 3 can be relatively large, and exemplarily, the light transmittance of the light processing film 3 can be in the range of 95% to 98%, for example, the light transmittance of the light processing film 3 can be 95%, 95.5%, 96%, 96.5%, 97%, 97.5% or 98%, etc.

[0080] In still another optional example, when 0.37%<m2 / m1≤0.64%, the total amount of the light diffusion particles 4 in the encapsulation glue structure 2 is large, and thus, the overall structure of the encapsulation glue structure 2 and the light diffusion particles 4 has a large influence on the display contrast of the display panel 100. Therefore, the light transmittance of the light processing film 3 needs to be large, and exemplarily, the light transmittance of the light processing film 3 can be in the range of 90% to 95%, for example, the light transmittance of the light processing film 3 can be 90%, 90.2%, 90.5%, 90.7%, 91.2%, 91.5%, 91.7%, 92.2%, 92.5%, 92.7%, 93.2%, 93.5%, 93.7%, 94.2%, 94.5%, 94.7% or 95%, etc.

[0081] In the direction opposite to the line board 11 and the light processing film 3, the part of the encapsulation glue structure 2 between the light emitting device 12 and the light processing film 3 has a thickness d1. In order to enable the light-transmitting glue 21 to cover the light emitting device 12 and achieve better encapsulation and protection, the thickness d1 can be relatively thick. However, if the thickness d1 is too thick, the overall thickness of the display panel 100 will be too thick, and the light will be excessively mixed in the process of passing through the encapsulation glue structure 2, which will cause the display clarity to decrease. Therefore, the thickness d1 cannot be too thick. Based on this, the thickness d1 of the encapsulation glue structure 2 can satisfy 30 μm ≤ d1 ≤ 250 μm. For example, the thickness d1 of the encapsulation glue structure 2 can be 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 100 μm, 120 μm, 150 μm, 170 μm, 200 μm, 220 μm, or 250 μm, etc.

[0082] In order to make the light loss of the light passing through the encapsulation glue structure 2 less, the light transmittance of the encapsulation glue structure 2 is closer to 100% the better. However, since the encapsulation glue structure 2 has a certain thickness, it is difficult to achieve a light transmittance particularly close to 100% without using special high-priced materials. Based on this, the light transmittance of the encapsulation glue structure 2 can be in the range of 85% to 95%. For example, the light transmittance of the encapsulation glue structure 2 can be 85%, 86%, 87%, 88%, 89%, 90%, 91%, 92%, 93%, 94%, or 95%, etc.

[0083] In the direction opposite to the line board 11 and the light processing film 3, the light processing film 3 has a thickness d2. The greater the thickness d2, the greater the shielding effect of the light processing film 3 on the light emitting side surface of the light emitting assembly 1, which can make the color consistency of the light emitting side of the display panel 100 better. However, the shielding effect of the light processing film 3 on the light emitted by the light emitting device 12 is also greater, and the overall thickness of the display panel 100 is also greater. Therefore, the thickness d2 cannot be too large. Based on this, the thickness d2 of the light processing film 3 can satisfy 2 μm ≤ d2 ≤ 30 μm. For example, the thickness d2 of the light processing film 3 can be 2 μm, 3 μm, 4 μm, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, 10 μm, 11 μm, 12 μm, 13 μm, 14 μm, 15 μm, 18 μm, 20 μm, 22 μm, 25 μm, 27 μm, or 30 μm, etc.

[0084] Preferably, the thickness d1 of the encapsulation glue structure 2 satisfies 50pm≤d1≤250pm, and the thickness d2 of the light processing film 3 satisfies 2pm≤d2≤15pm, so that the light emitting device 12 can be better packaged and protected, the color consistency of the light emitting side of the display panel 100 is better, the light mixing distance of the light emitted by the light emitting device 12 in the encapsulation glue structure 2 is smaller, the light loss of the light when passing through the light processing film 3 is smaller, and the thickness of the display panel 100 as a whole can be prevented from being too large.

[0085] Optionally, the light transmittance of the light processing film 3 can be in the range of 90% to 99%, so that the light loss of the light emitted by the light emitting device 12 when passing through the light processing film 3 is smaller. For example, the light transmittance of the light processing film 3 can be 90%, 91%, 92%, 93%, 94%, 95%, 96%, 97%, 98% or 99%, etc.

[0086] Preferably, the light transmittance of the encapsulation glue structure 2 is in the range of 85% to 95%, and the light transmittance of the light processing film 3 is in the range of 90% to 99%, so that the total light loss of the light emitted by the light emitting device 12 in the process of sequentially passing through the encapsulation glue structure 2 and the light processing film 3 is smaller, the maximum luminous brightness of the display panel 100 is larger, and the luminous efficiency is higher.

[0087] Optionally, the surface gloss of the light emitting side of the light processing film 3 is in the range of 4GU to 13GU, so that the surface of the light emitting side of the light processing film 3 is not easy to reflect light, and the possibility of the phenomenon of glare and reflection occurring on the surface of the light emitting side of the light processing film 3, which causes the display contrast of the display panel 100 to decrease, can be reduced. For example, the surface gloss of the light emitting side of the light processing film 3 can be 4GU, 5GU, 6GU, 7GU, 8GU, 9GU, 10GU, 11GU, 12GU or 13GU, etc.

[0088] Optionally, the display module further comprises a box body 300, and the plurality of display panels 100 are arranged on the box body 300, so that the positions of the display panels 100 can be fixed by the box body 300, and the relative positions of the display panels 100 are more stable, and the structure of the display module as a whole is more stable.

[0089] Optionally, the circuit boards 11 of the plurality of display panels 100 can be electrically connected to external driving circuits, or the box body 300 can further carry a transfer circuit for electrically connecting to external driving circuits, and the circuit boards 11 of the plurality of display panels 100 are electrically connected to the transfer circuit, so as to be electrically connected to the external driving circuits through the transfer circuit.

[0090] In other embodiments, the plurality of display panels 100 included in the display module can also be respectively arranged on a structure capable of supporting the display panel 100, including but not limited to a wall, a support, etc.

[0091] As shown in Figure 3 The present application also provides a preparation method of a display module for manufacturing the display module as described in the foregoing technical solutions, and the preparation method of the display module comprises the following steps:

[0092] Step S1, providing a light-emitting assembly 1, the light-emitting assembly 1 comprising a circuit board 11 and a plurality of light-emitting devices 12 arranged on one side of the circuit board 11.

[0093] Step S2, providing a light-transmitting adhesive 21 mixed with light-diffusing particles 4.

[0094] In order to make the total amount of the light-diffusing particles 4 mixed in the light-transmitting adhesive 21 appropriate, so as to effectively improve the color uniformity of the light-emitting side of the display panel 100 by the light-diffusing particles 4 while avoiding excessive addition of the light-diffusing particles 4 to cause excessive impact on the light-emitting efficiency of the display panel 100, optionally, step S2 can comprise:

[0095] Step S21, detecting the luminance value AVL of the light-emitting side of all the light-emitting assemblies 1 by a spectrophotometer under the same condition.

[0096] Optionally, step S21 can comprise:

[0097] Step S210, determining a plurality of predetermined position detection points for the light-emitting assembly 1.

[0098] It can be understood that when repeating step S210, a plurality of the same predetermined position detection points are determined for each light-emitting assembly 1. For example, in step S210, five predetermined position detection points can be determined for the light-emitting assembly 1, which are respectively on the light-emitting side of the light-emitting assembly 1, four positions close to the four corners, and one position at the center. When repeating step S210, a plurality of predetermined position detection points are determined for each light-emitting assembly 1, which are respectively on the light-emitting side of the light-emitting assembly 1, four positions close to the four corners, and one position at the center.

[0099] Step S211, measuring each detection point by using a multi-angle spectrophotometer and reading the detection value of the predetermined angle measured by the multi-angle spectrophotometer.

[0100] For example, the multi-angle spectrophotometer can be used for colorimetric detection of multiple observation angles of the detection points. For example, the multi-angle spectrophotometer can be used for colorimetric detection of positions with observation angles of -15°, 15°, 25°, 45°, 75° and 110°. Each time, only the detection value of a predetermined angle is read, for example, the predetermined angle can be 75°. At this time, for each detection point of each light emitting component 1, only the detection value of the observation angle of 75° is read.

[0101] In step S212, the average of the detection values detected by all the detection points is calculated to obtain the luminance value AVL of the display panel 100.

[0102] In step S213, steps S210 to S212 are repeated until the luminance values AVL of all the light emitting components 1 are obtained.

[0103] In step S22, the ratio of the weight m1 of the encapsulation glue structure 2 to the total weight m2 of the light diffusion particles 4 in the encapsulation glue structure 2 is calculated by the formula 0.4(2*△L+0.1) %≤m2 / m1≤0.9(2*△L+0.1) %, wherein m1=m11+m12, the transparent glue 21 includes transparent glue 21 water and a curing agent, m11 is the weight of the transparent glue 21 water, and m12 is the weight of the curing agent.

[0104] The ratio of the transparent glue 21 water to the curing agent is determined according to different materials of the transparent glue 21 water and the curing agent. In general, the weight ratio m11 / m12 of the transparent glue 21 water to the curing agent is in the range of 1 to 3, for example, the weight ratio m11 / m12 of the transparent glue 21 water to the curing agent can be 1, 1.2, 1.4, 1.5, 1.6, 1.8, 2, 2.2, 2.4, 2.5, 2.6, 2.8 or 3, etc.

[0105] In step S23, the transparent glue 21 water and the light diffusion particles 4 with a weight ratio satisfying the calculation result in step S22 are provided, and the transparent glue 21 water and the light diffusion particles 4 are stirred and mixed.

[0106] In step S24, the curing agent with a weight ratio satisfying the calculation result in step S22 is provided, and the curing agent and the mixed transparent glue 21 water and light diffusion particles 4 are stirred and mixed to obtain the transparent glue 21 mixed with the light diffusion particles 4.

[0107] By mixing the light diffusion particles 4 with the light-transmissive glue 21 water that has not yet mixed with the curing agent in advance in step S23, and then mixing the curing agent with the mixed light-transmissive glue 21 water and the light diffusion particles 4 in step S24, the light diffusion particles 4 and the light-transmissive glue 21 water can have a more sufficient stirring and mixing time, so that the light diffusion particles 4 can be more uniformly distributed in the encapsulation glue structure 2 formed by curing.

[0108] In step S3, the light-transmissive glue 21 and the light processing film 3 are arranged on the side where the light emitting device 12 of the self-luminous component 1 is located, and the light-transmissive glue 21 is cured to form the encapsulation glue structure 2, so as to obtain the display panel 100.

[0109] Optionally, step S3 can include:

[0110] In step S30, a substrate 200 is provided, and the substrate 200 is provided with the light processing film 3.

[0111] Optionally, one side of the substrate 200 can be provided with a concave-convex structure (not shown in the figure), and the light processing film 3 is arranged on the concave-convex structure, so that the surface of the light processing film 3 in contact with the substrate 200 forms a concave-convex texture corresponding to the concave-convex structure, which can reduce the smoothness of the surface of the light processing film 3, so that the gloss of the light processing film 3 is lower, thereby reducing the possibility of the phenomenon of glare and reflection on the surface of the light processing film 3, and reducing the problem of the display contrast of the display panel 100.

[0112] Optionally, the light processing film 3 can be formed by curing a light-transmissive black transfer glue arranged on the substrate 200. For example, the light-transmissive black transfer glue can be obtained by mixing a light-curing, heat-curing or other light-transmissive glue 21 with black colorant, carbon powder or other black material.

[0113] In step S31, the light-transmissive glue 21 mixed with the light diffusion particles 4 is arranged on the light processing film 3.

[0114] Optionally, a ring of the light-transmissive glue 21 can be arranged along the edge of the area where the light-transmissive glue 21 is needed to be arranged, so as to form a dam, and then the light-transmissive glue 21 is filled in the middle of the dam, so that the arrangement area of the light-transmissive glue 21 is controllable.

[0115] In step S32, the light emitting device 12 of the light emitting component 1 is directed towards the light-transmissive glue 21, and then the light emitting component 1 is arranged on the light-transmissive glue 21, and at least the light emitting device 12 is embedded in the light-transmissive glue 21.

[0116] Therefore, the light-transmissive glue 21 can cover the surface of the light emitting side of the light emitting component 1, and the light-transmissive glue 21 is connected between the light emitting component 1 and the light processing film 3.

[0117] In step S33, the light-transmissive glue 21 is cured to form the encapsulation glue structure 2.

[0118] Step S34, peeling the light-emitting component 1, the encapsulation glue structure 2 and the light processing film 3 from the substrate 200 as a whole to obtain the display panel 100.

[0119] Thus, the light processing film 3 can be arranged on the side of the encapsulation glue structure 2 away from the circuit board 11 more flatly and more simply.

[0120] Step S4, repeating step S3 until all the light-emitting components 1 are prepared into the display panel 100.

[0121] wherein, Figure 3 FIGS. 30, 31, 32 and 34 respectively show the structures obtained after step S30, step S31, step S32 and step S34.

[0122] It should be noted that the total weight of the local sample encapsulation glue structure 2 and the light diffusion particles 4 as a whole can be obtained by weighing, the total weight of the light diffusion particles 4 in the local sample can be detected by using the thermogravimetry analysis (TGA), and the weight ratio m2 / m1 of the light diffusion particles 4 to the encapsulation glue structure 2 can be calculated by dividing the total weight of the light diffusion particles 4 in the local sample by the total weight of the local sample encapsulation glue structure 2 and the light diffusion particles 4 as a whole.

[0123] In the description herein, it should be understood that the terms "upper", "lower", "left", "right", and the like orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of description and simplification of operation, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second" are only used to distinguish in description, and have no special meaning.

[0124] In the description of the present specification, the description referring to the terms "an embodiment", "an example" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example.

[0125] In addition, it should be understood that although the present specification is described in terms of embodiments, each embodiment does not necessarily contain only one independent technical solution, and the description of the specification is only for the sake of clarity, and those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can be appropriately combined to form other embodiments that those skilled in the art can understand.

[0126] The technical principles of the present application are described above in combination with specific embodiments. These descriptions are only for explaining the principles of the present application, and cannot be interpreted as limiting the protection scope of the present application in any way. Based on the explanations herein, other specific embodiments of the present application can be conceived by those skilled in the art without any creative effort, and these embodiments will all fall within the protection scope of the present application.

Claims

1. A display module, characterized by The display module comprises: a plurality of display panels, each of the display panels comprising a light-emitting assembly, an encapsulation glue structure, and a light processing film, the light-emitting assembly comprising a circuit board and a plurality of light-emitting devices, the plurality of light-emitting devices being disposed on one side of the circuit board and electrically connected to a circuit pattern on the circuit board, the encapsulation glue structure covering the light-emitting assembly from the side where the light-emitting devices are located, the encapsulation glue structure containing a plurality of light diffusion particles, and the light processing film covering the side of the encapsulation glue structure away from the circuit board, the light processing film being capable of improving the display contrast of the display panel.

2. The display module of claim 1, wherein, The light-emitting assembly further comprises a cover layer disposed on the surface of the circuit board and surrounding the periphery of the light-emitting devices.

3. The display module of claim 1, wherein, The weight of the encapsulation glue structure is m1, the total weight of the light diffusion particles in the encapsulation glue structure is m2, and 0.4(2*△L+0.1) %≤m2 / m1≤0.9(2*△L+0.1) %; wherein △L=J / P, J=AVLmax-AVLmin, and P=S / N; The luminance value of the light-emitting side of all the light-emitting assemblies is AVL under the same conditions, AVLmax is the maximum value of the luminance values AVL of all the light-emitting assemblies, and AVLmin is the minimum value of the luminance values AVL of all the light-emitting assemblies. S is the sum of the luminance values AVL of all the light-emitting assemblies, and N is the total number of the light-emitting assemblies included in the display module.

4. The display module of claim 1, wherein, The particle size Φ of the light diffusion particles satisfies 1 μm≤Φ≤8 μm.

5. The display module of claim 4, wherein, The particle size Φ of the light diffusion particles satisfies 2 μm≤Φ≤4 μm.

6. The display module of any one of claims 1-5, wherein, The weight m1 of the encapsulation glue structure and the total weight m2 of the light diffusion particles in the encapsulation glue structure satisfy 0.1%≤m2 / m1≤0.64%.

7. The display module of claim 6, wherein, When 0.1%≤m2 / m1≤0.19%, the light transmittance of the light processing film is in the range of 98% to 99%; When 0.19%<m2 / m1≤0.37%, the light transmittance of the light processing film is in the range of 95% to 98%; When 0.37%<m2 / m1≤0.64%, the light transmittance of the light processing film is in the range of 90% to 95%.

8. The display module of any one of claims 1-5, wherein, In the direction opposite to the direction between the circuit board and the light processing film, the part of the encapsulation glue structure between the light-emitting devices and the light processing film has a thickness d1, and 30 μm≤d1≤250 μm. And / or, In the direction opposite to the direction between the circuit board and the light processing film, the light processing film has a thickness d2, and 2 μm≤d2≤30 μm.

9. The display module of any of claims 1-5, wherein, The light transmittance of the encapsulation glue structure is in the range of 85% to 95%; and / or, The light transmittance of the light processing film is in the range of 90% to 99%.

10. The display module of any of claims 1-5, wherein, The surface gloss of the light-emitting side of the light processing film is in the range of 4GU to 13GU.

11. The display module of any of claims 1-5, wherein, The display module further comprises a box, and the plurality of display panels are respectively arranged in the box.

12. A method for manufacturing a display module, characterized by, The preparation method of the display module comprises the following steps: The preparation method of the display module comprises the following steps: Step S1, providing a light-emitting assembly, the light-emitting assembly comprising a circuit board and a plurality of light-emitting devices arranged on one side of the circuit board; Step S2, providing light-transmitting glue mixed with light-diffusing particles; Step S3, arranging the light-transmitting glue and the light processing film from the side of the light-emitting devices of the light-emitting assembly, and curing the light-transmitting glue to form an encapsulation glue structure, to obtain a display panel; Step S4, repeating the step S3 until all the light-emitting assemblies are prepared into the display panel.

13. The method for preparing a display module according to claim 12, characterized in that, The step S2 comprises: Step S21, detecting the luminance value AVL of the light-emitting assembly on the light-emitting side by a spectrophotometer under the same condition; Step S22, calculating the ratio of the weight m1 of the encapsulation glue structure to the total weight m2 of the light-diffusing particles in the encapsulation glue structure by the formula 0.4(2*△L+0.1) %≤m2 / m1≤0.9(2*△L+0.1) %, wherein m1=m11+m12, the light-transmitting glue comprises light-transmitting glue water and a curing agent, m11 is the weight of the light-transmitting glue water, and m12 is the weight of the curing agent; Step S23, providing the light-transmitting glue water and the light-diffusing particles with the weight ratio satisfying the calculation result in the step S22, and stirring and mixing the light-transmitting glue water and the light-diffusing particles; Step S24, providing the curing agent with the weight ratio of the light-transmitting glue water and the light-diffusing particles satisfying the calculation result in the step S22, and stirring and mixing the curing agent with the mixed light-transmitting glue water and light-diffusing particles, to obtain the light-transmitting glue mixed with the light-diffusing particles.

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