Bionic compound eye, preparation method thereof and distance measuring system

Abstract

The application discloses a bionic compound eye and a preparation method and a distance measuring system thereof, and relates to the technical field of distance detection.The bionic compound eye comprises: a photoelectric detection layer, which is provided with a photoelectric array in a deformable area; the photoelectric array comprises a plurality of photoelectric detector units which are connected with each other through connecting rods; each photoelectric detector unit comprises: a bearing surface which bears a thin-film photosensitive material and an electrode, an annular structure surrounding the bearing surface, and a support beam connecting the annular structure and the bearing surface; a support layer which is provided with a hole and is bonded with a non-deformable area of the photoelectric detection layer; a three-dimensional curved surface support mold which applies pressure to the deformable area so that the connecting rods transmit tensile force to each photoelectric detector unit; the annular structure is deformed and the support beam is bent and arched, the tensile strain is converted into bending strain, and the bearing surface is driven to occur the out-of-plane deformation guided by buckling. The application can convert the destructive tensile strain into safe bending strain to protect the brittle thin-film photosensitive material.

Description

Technical Field

[0001] This invention relates to the field of distance detection technology, and in particular to a bionic compound eye and its preparation method, as well as a distance measurement system. Background Technology

[0002] The unique curved structure and multi-aperture optical properties of insect compound eyes provide important inspiration for the development of high-performance micro-optical distance measurement systems. These biomimetic systems show great application potential in fields such as robot vision, 3D velocimetry, and infrared guidance. However, existing biomimetic compound eye systems face significant technical bottlenecks. Traditional curved surface electronic integration processes are difficult to integrate with high-performance thin-film optoelectronic materials such as perovskites (e.g., organic-inorganic hybrid perovskites MAPbI3, CsPbBr3) and two-dimensional materials (e.g., transition metal sulfides MoS2, WS2, graphene, black phosphorus). While these materials possess excellent optoelectronic properties (e.g., high sensitivity, wide spectral response), their inherent mechanical brittleness makes them prone to failure due to stress concentration during curved surface assembly.

[0003] Current mainstream technologies still have inherent flaws: transfer printing requires extremely high stamp precision, which can easily damage photosensitive materials and deform patterns; splicing methods inevitably produce connection gaps, leading to optical interference and unstable signal transmission; 3D printing technology is limited by insufficient material compatibility and insufficient printing precision at the micro-nano scale. More importantly, existing processes cannot solve the mechanical mismatch problem of thin-film photosensitive materials when forming three-dimensional curved surfaces—the tensile strain that thin-film photosensitive materials experience during curved surface assembly and service far exceeds their mechanical tolerance limit, causing device performance degradation or damage.

[0004] Furthermore, existing compound eye systems often employ a compromise solution integrating microlens arrays and planar sensors, resulting in a spatial mismatch between the optical path and the sensing unit, severely limiting measurement uniformity and field-of-view consistency. These fundamental defects hinder the practical application of next-generation high-performance thin-film materials in biomimetic compound eye systems, necessitating breakthrough technological solutions. Summary of the Invention

[0005] To address the problems existing in the prior art, this invention provides a biomimetic compound eye and its preparation method, as well as a distance measurement system. It can trigger a buckling deformation mechanism by applying pressure to a mold, transforming destructive tensile strain into safe bending strain to protect brittle photosensitive materials, while simultaneously achieving self-adaptive three-dimensional curved surface integration of the photoelectric array.

[0006] To achieve the above objectives, the present invention provides a bionic compound eye, comprising:

[0007] A photoelectric detection layer has a photoelectric array disposed in a deformable region; the photoelectric array includes multiple photoelectric detector units interconnected by connecting rods; each photoelectric detector unit includes: a bearing surface supporting a thin film photosensitive material and an electrode, an annular structure surrounding the bearing surface, and a support beam connecting the annular structure and the bearing surface;

[0008] The support layer has holes and is bonded to the non-deformable area of ​​the photoelectric detection layer.

[0009] The three-dimensional curved surface support mold applies pressure to the deformable area through the holes, causing the connecting rod to transmit tensile force to each of the photodetector units; the deformation of the annular structure and the buckling and arching of the support beam convert tensile strain into bending strain, driving the bearing surface to undergo buckling-guided anisotropic deformation.

[0010] Optionally, the bionic compound eye further includes a base; the three-dimensional curved surface support mold is fixedly disposed on the base; the support layer is detachably connected to the base through a fastener.

[0011] Optionally, the three-dimensional curved surface support mold is a hemispherical, ellipsoidal, or saddle-shaped structure.

[0012] Optionally, the ring structure is a centrally symmetrical ring structure, specifically a quadrilateral ring, an octagonal ring, a dodecagonal ring, or a circular ring.

[0013] Optionally, the bearing surface is a square, a circle, or a regular polygon.

[0014] Optionally, when the photoelectric array is in a planar state, the photodetector units in the even-numbered rows and the odd-numbered rows are orthogonal in structural orientation.

[0015] This invention also provides a method for preparing a bionic compound eye, comprising:

[0016] Based on the projection shape of the target three-dimensional curved surface electronic array in the top view, design the layout shape of the planar optoelectronic array so that the layout shape is consistent with the projection shape;

[0017] According to the layout shape, a photoelectric array frame is cut and fabricated in the target area of ​​the flexible substrate; the photoelectric array frame includes multiple unit bases connected to each other by connecting rods, each unit base includes a bearing surface, an annular structure surrounding the bearing surface, and a support beam connecting the bearing surface and the annular structure;

[0018] Electrodes are fabricated on each of the bearing surfaces, and corresponding connection circuits are fabricated on the annular structure, the support beam, and the connecting rod.

[0019] A thin film photosensitive material is coated on each of the electrodes to complete the fabrication of the photodetector layer; the area where the photodetector array is located in the photodetector layer is a deformable area, and the remaining areas are non-deformable areas.

[0020] A perforated support layer is prepared, and the non-deformable region of the photoelectric detection layer is bonded and fixed to the non-perforated region of the support layer.

[0021] After positioning the three-dimensional curved surface support mold, pressure is applied to the deformable area through the holes, driving the connecting rod to transmit tensile force to each of the photodetector units, causing the annular structure to deform and the support beam to buckle and arch, converting tensile strain into bending strain, and inducing buckling-guided anisotropic deformation of the bearing surface;

[0022] The positions of the support layer and the three-dimensional curved surface support mold are fixed to maintain the three-dimensional curved surface shape of the photoelectric array.

[0023] The present invention also provides a distance measurement system, comprising:

[0024] The aforementioned bionic compound eye;

[0025] The signal acquisition and processing unit is used to acquire the light intensity signals collected by each of the photodetector units and determine the spatial position of the target object based on the light intensity signals.

[0026] Optionally, the signal acquisition and processing unit includes:

[0027] A row-driven multiplexer, the output of which is connected to the row direction electrode group in the opto-array;

[0028] A column acquisition multiplexer, the input of which is connected to the column direction electrode group in the photoelectric array;

[0029] An operational amplifier is disposed between the column acquisition multiplexer and the column direction electrode group to construct an equipotential region to eliminate loop crosstalk;

[0030] The sampling resistor has one end connected to the output of the column acquisition multiplexer, and the other end grounded.

[0031] The main control chip is used for:

[0032] The row driving multiplexer is controlled to apply driving voltage to the row direction electrode group row by row, and the column acquisition multiplexer sequentially selects each column direction electrode group.

[0033] Based on the voltage value across the sampling resistor, the light intensity signal of each photodetector unit is obtained;

[0034] The spatial position of the target object is calculated based on the light intensity signal.

[0035] According to specific embodiments provided by the present invention, the present invention discloses the following technical effects:

[0036] The biomimetic compound eye provided by this invention applies pressure to the deformable region through a three-dimensional curved support mold, driving the connecting rod to transmit tensile force to each photodetector unit. This causes the ring structure and supporting beam to buckle and arch, efficiently converting tensile strain into bending strain. This mechanism ensures that the bearing surface experiences only a small bending strain (e.g., bending strain <1% at 50% tensile strain), preventing brittle thin-film photosensitive materials from failing due to excessive tensile strain. It successfully solves the mechanical mismatch problem of high-sensitivity thin films such as perovskite and two-dimensional materials in curved surface integration.

[0037] Meanwhile, the buckling-guided anisotropic deformation allows the bearing surface to autonomously adapt to the three-dimensional curved surface morphology, forming a continuous, gapless curved photoelectric array. This eliminates the optical path mismatch caused by the integration of traditional microlens arrays and planar sensors, significantly improving the uniformity of spatial position measurement and the consistency of the field of view. Furthermore, this structure eliminates the need for transfer stamps, discrete splicing, or complex 3D printing processes; it achieves low-damage integration of thin-film photosensitive materials on curved surfaces simply through mold pressure, breaking through the bottleneck of high-performance thin-film materials in biomimetic compound eyes. Attached Figure Description

[0038] The above and other objects, features and advantages of the present invention will become more apparent from the more detailed description of exemplary embodiments of the invention in conjunction with the accompanying drawings, wherein the same reference numerals generally represent the same parts in the exemplary embodiments of the invention.

[0039] Figure 1 This is a schematic diagram of the structure of a bionic compound eye as shown in an embodiment of the present invention;

[0040] Figure 2 This is a schematic diagram of a curved photodetector unit array shown in an embodiment of the present invention;

[0041] Figure 3 This is a schematic diagram of the structure of a photodetector unit according to an embodiment of the present invention;

[0042] Figure 4 This is a schematic diagram of a portion of the structure in a planar array used to construct a simulated compound eye, as shown in an embodiment of the present invention.

[0043] Figure 5 This is a schematic diagram of the wiring design of the connection circuit shown in an embodiment of the present invention; wherein, (5a) is a schematic diagram of the front wiring design and (5b) is a schematic diagram of the back wiring design.

[0044] Figure 6 This is a schematic diagram illustrating the relationship between strain and stress on a functional material under different tensile strain conditions, as shown in an embodiment of the present invention.

[0045] Figure 7 This is a schematic diagram illustrating the biaxial tensile deformation result of a 5×5 photoelectric array according to an embodiment of the present invention;

[0046] Figure 8 This is a schematic diagram of a planar array flexible circuit board according to an embodiment of the present invention;

[0047] Figure 9 This is a schematic diagram illustrating a method for assembling three-dimensional curved surface electrons according to an embodiment of the present invention;

[0048] Figure 10 This is a schematic diagram of the module structure of a distance measurement system according to an embodiment of the present invention. Detailed Implementation

[0049] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0050] Compound eyes are sophisticated optical organs unique to arthropods such as fruit flies and dragonflies. They are curved distance measurement systems formed by hundreds or even thousands of ommatidia arranged closely on a spherical primary eye. Each ommatidia's surface is a light-collecting corneal lens, connected to a crystalline cone and a visual neural network leading to the brain. Each ommatidia in a compound eye measures distance independently, and images from different angles can be stitched together to form a complete image. Unlike monocular distance measurement systems, insect compound eyes are not only small and lightweight but also possess a series of unique advantages, including a large field of view, high temporal resolution, low aberrations, and infinite depth of field, providing new inspiration and challenges for the development of advanced micro-optical distance measurement systems. Inspired by the structure of insect compound eyes, artificial biomimetic compound eyes have emerged, aiming to break through the limitations of traditional optical distance measurement systems by establishing multi-aperture optical systems similar to compound eyes, achieving functions comparable to insect compound eyes. Bionic compound eye distance measurement systems have shown broad application prospects in fields such as infrared guidance, radar early warning systems, robot vision, UAV detection, 3D velocimetry, and medical endoscopes.

[0051] The following are existing similar technical solutions:

[0052] Three-dimensional curved surface electronic assembly schemes based on transfer technology: First, the circuit pattern or electronic device is fabricated on a flat surface, and then transferred to a three-dimensional curved surface using transfer technology. For example, the wrapping curved surface transfer method proposed by the Flexible Electronics Technology Laboratory of Tsinghua University uses a petal-shaped stamp to wrap the planar circuit around the target sphere, realizing the fabrication of three-dimensional curved surface electronic devices. This method uses a uniform and gentle pressure field during the wrapping transfer process, ensuring full coverage of the entire sphere without damaging the hard and brittle electronic devices or weak connections. However, this scheme is not suitable for thin-film photosensitive materials, which are easily damaged during transfer assembly. This scheme requires extremely high precision in the design and fabrication of the stamp; the shape, size, and compatibility of the petal-shaped stamp with the planar circuit and the three-dimensional curved surface all affect the transfer effect. If the stamp design is unreasonable, it may cause deformation or displacement of the circuit pattern during the transfer process, affecting the performance of electronic components in the bionic compound eye distance measurement system, and thus affecting the distance measurement effect. Moreover, when dealing with complex-shaped three-dimensional curved surfaces, the uniformity and integrity of the transfer are difficult to guarantee, limiting its application in some specially shaped bionic compound eyes.

[0053] A modular 3D curved surface electronic assembly scheme involves first discretizing the planar circuit pattern into multiple parts using methods such as paper cutting, and then splicing them together on a 3D curved surface to achieve conformal integration. In the fabrication of certain biomimetic compound eye distance measurement systems, planar microlens arrays and sensor modules are cut into small pieces and then assembled on a hemispherical curved surface. However, this scheme suffers from unavoidable gaps between the discrete parts during the splicing process, which can easily lead to poor signal transmission or optical interference, affecting the continuity and stability of distance measurement. Furthermore, precise control of the position and angle of each part is required during splicing, which is difficult to perform manually. Insufficient splicing accuracy can result in aberrations and reduced resolution in the entire distance measurement system.

[0054] 3D printing combined with material integration is a solution that directly constructs the structural framework of electronic devices on three-dimensional curved surfaces using 3D printing technology, while simultaneously integrating corresponding functional materials. For example, microfluidic-assisted 3D printing technology can be used to construct biomimetic compound eye structures on flexible substrates. Each microlens is connected to a bottom planar sensor via a refractive index-matched waveguide, mimicking the striations of an insect compound eye to achieve full-color wide-angle distance measurement and point source tracking. However, this approach currently has limited compatibility with a wide range of materials; many materials with excellent electrical and optical properties are difficult to use in the 3D printing process. Furthermore, while the precision of 3D printing is continuously improving, it remains insufficient for some tiny and precise structures in biomimetic compound eye distance measurement systems, such as nanoscale optical components, affecting the microscopic performance and distance measurement quality of the system.

[0055] Current biomimetic compound eye systems primarily rely on traditional semiconductor materials such as silicon (Si) and III-V compound semiconductors (e.g., gallium nitride) for their main materials (especially the photoelectric detection / sensing unit). However, thin-film functional materials that exhibit superior optoelectronic properties (such as high sensitivity, broad spectral response, fast response, tunable bandgap, and flexibility) at the single-device level, such as perovskites (e.g., organic-inorganic hybrid perovskites MAPbI3, CsPbBr3) and two-dimensional materials (e.g., transition metal sulfides MoS2, WS2, graphene, black phosphorus), are difficult to integrate effectively into biomimetic compound eye systems.

[0056] Furthermore, due to limitations in curved surface fabrication processes, most existing bionic compound eye systems are achieved by transferring microlens arrays onto curved substrates and then integrating them with commercial planar image sensors. This process makes it difficult to control uniformity and leads to a mismatch between the three-dimensional optical structure and the underlying planar commercial distance measuring instrument. Artificial compound eyes based on deformable electronic arrays also face problems such as low array density, three-dimensional stress mismatch, and poor stability.

[0057] To address the aforementioned problems, this invention provides a bionic compound eye with buckling-guided eccentric deformation and a distance measurement system.

[0058] Please see Figure 1 , Figure 1 This is a schematic diagram of the structure of a bionic compound eye. A bionic compound eye includes:

[0059] The photodetector layer 1 has a photodetector array in the deformable region; the photodetector array includes multiple photodetector units 11 connected to each other by connecting rods 12; each photodetector unit 11 includes: a bearing surface 111 bearing a thin film photosensitive material and an electrode, an annular structure 112 surrounding the bearing surface, and a support beam 113 connecting the annular structure 112 and the bearing surface 111.

[0060] Support layer 2 has holes and is bonded to the non-deformable area of ​​photoelectric detection layer 1;

[0061] The three-dimensional curved surface support mold 3 applies pressure to the deformable area through the holes, so that the connecting rod 12 transmits tensile force to each photodetector unit 11; the deformation of the ring structure 112 and the buckling and arching of the support beam 113 convert tensile strain into bending strain, driving the bearing surface 111 to undergo buckling-guided non-planar deformation.

[0062] For example, the thin-film photosensitive material in the photodetector layer 1 can be a perovskite thin film, a transition metal halide thin film, or an organic polymer photosensitive thin film; the deformable region in the photodetector layer 1 can be located at the central position (e.g., Figure 1 The settings shown in the image can also be set in other locations, allowing for flexible configuration as needed.

[0063] In the application, a photoelectric array based on a buckling-guided non-plane deformation structure is arranged in the deformable region of the photoelectric detection layer 1. This photoelectric array consists of multiple photoelectric detector units 11 interconnected by connecting rods 12. The connecting rods 12 are flexible thin rods, which can be straight or curved; the connecting rods 12 also connect to the non-deformable region. The support layer 2 has openings, the size and location of which correspond to the deformable region of the photoelectric detection layer 1; the unopened areas of the support layer 2 are bonded to the non-deformable areas of the photoelectric detection layer 1, forming a mechanical support boundary.

[0064] For example, the three-dimensional curved surface support mold 3 can be a hemispherical, ellipsoidal or saddle-shaped structure.

[0065] The three-dimensional curved surface support mold 3 applies curved surface pressure to the deformable area of ​​the photodetector layer 1 through the holes in the support layer 2. This pressure drives the connecting rod 12 to transmit tensile force to each photodetector unit 11, causing deformation of the annular structure 112 and simultaneously causing the support beam 113 to buckle and arch. Figure 2 As shown, this cooperative deformation mechanism efficiently converts the tensile strain borne by the photodetector layer 1 into bending strain, thereby driving buckling-guided anisoplanar deformation of the bearing surface 111. This anisoplanar deformation ensures that the thin-film photosensitive material only experiences minute bending strain, avoiding material failure problems caused by excessive tensile strain in traditional assembly.

[0066] In one embodiment, the bionic compound eye also includes a base 4; a three-dimensional curved surface support mold 3 is fixedly disposed on the base 4; and the support layer 2 is detachably connected to the base 4 by a fastener.

[0067] like Figure 1 As shown, the bionic compound eye further includes a base 4 as an overall support structure. The three-dimensional curved surface support mold 3 is fixedly mounted on the base 4 by adhesive bonding, forming a stable curved surface forming reference. The edge area of ​​the support layer 2 is detachably connected to the base 4 by fasteners 5, wherein the fasteners 5 are preferably screws. Specifically, through holes are opened in the non-adhesive area of ​​the support layer 2, and threaded holes are provided in the corresponding positions of the base 4. The screw passes through the through holes and is screwed into the threaded holes to complete the mechanical locking.

[0068] The photodetector unit 11 will be further described below.

[0069] See Figure 3 , Figure 3 This is a schematic diagram of the photodetector unit. Figure 3As shown, a thin film photosensitive material 114 and an electrode 115 are disposed on the bearing surface 111 of the photodetector unit 11; wherein, the thin film photosensitive material 114 can be made of perovskite, organic polymer, transition metal halide, etc.; the electrode 115 can be an interdigitated electrode, a point electrode array, etc., and the material can be common electrode materials such as Au, Ag, Cu.

[0070] Furthermore, the fabrication method of the aforementioned compound eye structure is described. The specific fabrication method includes biaxial stretching array mechanical structure design and simulation optimization, compatible sensor array fabrication based on FPCB (flexible printed circuit board) technology, and three-dimensional curved surface electronic assembly.

[0071] Design and simulation optimization of the mechanical structure of a biaxial stretching array;

[0072] This invention first designs a biaxial tensile array mechanical structure based on the mechanical properties of the thin film material. The biaxial tensile array mechanical structure consists of several buckling-guided anisotropic deformation structures 6 (photodetector units 11 and connecting rods 12). Through arrangement and combination, the even-numbered rows of buckling-guided anisotropic deformation structures are 90 degrees out of phase with the odd-numbered rows and are interconnected. Please refer to [link to relevant documentation]. Figure 4 , Figure 4 This demonstrates a portion of the structure (5×5 array section) in the planar array used to construct a simulated compound eye. For example... Figure 4 As shown, when the photoelectric array is in a planar state, the photodetector units in the even-numbered rows and the odd-numbered rows are orthogonal in structural orientation; this layout is used to construct a biaxial tensile array, so as to ensure that the tensile strain magnitude and direction in the four directions of the annular structure 112 are consistent as much as possible, and to minimize the stress distribution on the bearing surface 111.

[0073] Each buckling-guided anisotropic deformation structure 6 includes a photodetector unit 11 and a connecting rod 12 connected to it. The annular structure 112 is a centrally symmetrical annular structure, and can be exemplarily a quadrilateral ring, octagonal ring, dodecagonal ring, or circular ring; the bearing surface 111 can be a square, circle, or regular polygon. In applications, it can be cut on a flexible film according to a preset pattern. The flexible film material can be PET (polyethylene terephthalate), PI (polyimide), or other materials.

[0074] The working principle of the buckling-guided non-planar deformation structure 6 is as follows:

[0075] The buckling-guided non-planar deformation structure 6 maintains a planar state under stress-free conditions, facilitating the fabrication of functional materials and electrodes. The functional material bearing surface 111 is the functional material fabrication area; see [link to documentation]. Figure 5The annular structure 112, support beam 113, and connecting rod 12 can serve as the fabrication area for the connecting circuit. Figure (5a) shows the wiring design of the connecting circuit on the front side (the side facing away from the support layer 2), while Figure (5b) shows the wiring design of the connecting circuit on the reverse side (the side closer to the support layer 2). When the buckling-guided non-planar deformation structure 6 is under tensile strain, the annular structure 112 deforms, and the support beam 113 arches, causing the functional material bearing surface 111 to buckle slightly. The functional material on the functional material bearing surface 111 is subjected to only a small bending strain under large tensile conditions, at which point the support beam 113 and the annular structure 112 are in a non-coplanar state.

[0076] The preparation method of the above-mentioned simulated compound eye is as follows:

[0077] Based on the projection shape of the target three-dimensional curved electronic array in the top view, design the layout shape of the planar optoelectronic array so that the layout shape is consistent with the projection shape.

[0078] According to the layout shape, a photoelectric array frame is cut and prepared in the target area of ​​the flexible substrate; the photoelectric array frame includes multiple unit bases connected to each other by connecting rods, each unit base includes a bearing surface, an annular structure surrounding the bearing surface, and a support beam connecting the bearing surface and the annular structure;

[0079] Electrodes are fabricated on each bearing surface, and corresponding connection circuits are fabricated on the annular structure, support beam, and connecting rod.

[0080] Thin film photosensitive material is coated on each electrode to complete the fabrication of the photodetector layer; the area where the photodetector array is located in the photodetector layer is regarded as the deformable area, and the remaining area is regarded as the non-deformable area.

[0081] A perforated support layer is prepared, and the non-deformable area of ​​the photoelectric detection layer is bonded and fixed to the non-perforated area of ​​the support layer.

[0082] After positioning the three-dimensional curved surface support mold, pressure is applied to the deformable area through the holes, driving the connecting rod to transmit tensile force to each photodetector unit, causing the annular structure to deform and the support beam to buckle and arch, converting tensile strain into bending strain, and inducing buckling-guided anisotropic deformation of the bearing surface;

[0083] The positions of the fixed support layer and the three-dimensional curved surface support mold are maintained to preserve the three-dimensional curved surface shape of the photoelectric array.

[0084] In applications, simulation optimization can be used to optimize the size and shape of each part of the simulated compound eye. For example, the outer diameter of the ring structure can be used as a reference, the inner diameter of the ring structure can be 0.75-0.95 times it, the width of the support beam can be 0.03-0.2 times it, and the width of the bearing surface can be 0.3-0.7 times it. For example, the outer diameter of the ring structure is 10mm, the inner diameter is 9mm, the width of the support beam is 0.5mm, and the width of the bearing surface is 5mm.

[0085] like Figure 6 As shown, taking the ring structure 112, specifically a four-sided ring, as an example, within the tensile strain of 50% of the overall structure, the bending strain of the functional material bearing surface 111 is less than 1%, which meets the stress-strain range of the thin-film photosensitive material and ensures the various electrical properties of the thin-film photosensitive material. By arranging and connecting multiple buckling-guided non-planar deformation structures 6 in an array, under biaxial tensile strain, biaxial tensile deformation of the entire photoelectric array can be achieved (e.g., Figure 7 (As shown).

[0086] Furthermore, based on the aforementioned array strain conversion principle, arrangement, and structure, a planar array design for a compound eye distance measurement system is carried out. The corresponding planar array is designed based on the required array density and final formed shape. For example... Figure 8 As shown, Figure 8 A flexible planar array circuit board for constructing a compound eye system was demonstrated, comprising 185 pixels (i.e., 185 photodetectors) arranged in 15 rows and 15 columns, with PI as the substrate material. Thin-film photosensitive materials and electrodes were fabricated on this flexible circuit board. Applicable fabrication methods include spin coating, blade coating, evaporation, screen printing, magnetron sputtering, PECVD (plasma chemical vapor deposition), and chemical vapor deposition.

[0087] Taking perovskite thin film as an example, the specific preparation method is as follows:

[0088] A CH3NH3PbI3 precursor solution was prepared by stirring a mixture of MAI (0.48 g), PbI2 (1.44 g), DMA (1.92 mL), and DMSO (0.48 mL) at 60 °C for 12 hours. Then, a spin-coating process was performed using 50 μL of the precursor solution at 4000 rpm for 20 seconds. Ethyl acetate antisolvent was rapidly added dropwise after 10 seconds of spin-coating. After annealing in air at 105 °C for 30 minutes, a perovskite film was formed.

[0089] Finally, three-dimensional curved surface electronic assembly is performed; see [link / reference]. Figure 9The flexible circuit board is adhered around its perimeter to a support plate with a circular hole (this can be any rigid material, such as acrylic, glass, or plastic). A hemispherical support and a base plate are prepared. The support plate with the flexible circuit board attached is pressed down onto the hemispherical support. Due to its paper-cut structure, the array in the middle will deform under the pressure and the hemispherical support, forming a buckling-guided non-planar deformation structure that gradually wraps around the hemispherical surface. Afterward, the support plate and base plate are fixed (using adhesives, clamps, screws, etc.), thus completing the assembly of the three-dimensional curved surface electronics.

[0090] like Figure 10 As shown, the present invention also provides a distance measurement system, comprising:

[0091] The aforementioned bionic compound eye;

[0092] The signal acquisition and processing unit is used to acquire the light intensity signals collected by each photodetector unit and determine the spatial position of the target object based on the light intensity signals.

[0093] The signal acquisition and processing unit includes:

[0094] The output of the line drive multiplexer 71 is connected to the line direction electrode group in the opto-array.

[0095] The column acquisition multiplexer 72 has its input terminal connected to the column direction electrode group in the photoelectric array;

[0096] Operational amplifier 73 is disposed between column acquisition multiplexer 72 and column direction electrode group to construct equipotential region to eliminate loop crosstalk.

[0097] The sampling resistor 74 is connected at one end to the output of the column acquisition multiplexer 72, and the other end is grounded.

[0098] The main control chip 75 is used for:

[0099] The row drive multiplexer 71 applies a drive voltage to the row direction electrode group row by row, and the column acquisition multiplexer 72 sequentially selects each column direction electrode group.

[0100] Based on the voltage value across the sampling resistor 74, the light intensity signal of each photodetector unit is obtained.

[0101] Calculate the spatial position of the target object based on the light intensity signal.

[0102] In applications, optoelectronic arrays can employ a cross-electrode design, consisting of parallel row electrodes and column electrodes, the number of which is the same as the number of rows and columns in the array. See also Figure 10The system employs a row-by-row scanning method. The main control chip 75 drives the voltage VCC to the row direction electrode group through the row drive multiplexer 71. After the current passes through the photodetector unit under test, it is extracted from the corresponding column direction electrode under the control of another column acquisition multiplexer 72, passing through an operational amplifier 73. The function of the operational amplifier 73 is to cut off the circuit loop by constructing an equipotential region, thereby eliminating loop crosstalk. The current then passes through a sampling resistor 74, which is grounded. The main control chip 75 measures the voltage change across the sampling resistor 74 in real time and converts it into a corresponding digital signal to represent the relative illumination intensity of the photodetector unit under test. Through the control of the two multiplexers, rapid scanning of each photodetector unit in the array can be achieved. All signals are transmitted to the PC in real time, processed, and used for distance calculation and graphical display.

[0103] In one embodiment, the main control chip 75 is further used for:

[0104] The spatial location calculation results are transmitted to a display device for visualization.

[0105] The following section provides a further introduction to specific distance measurement methods.

[0106] The buckling-guided, non-planar deformation compound eye distance measurement system proposed in this invention mimics the structure and principle of insect compound eyes. It utilizes the physical law that light intensity decreases with the square of distance (i.e., the inverse square law) to determine the spatial position of a light source or target object through a distributed sensor array. When a point light source propagates in a uniform medium, its luminous flux (I) is inversely proportional to the square of the distance (r) to the light source: E = I / r². I is the luminous intensity of the light source (a constant, depending on the light source itself). This means that the farther away from the light source, the weaker the received light intensity and the faster the attenuation. This invention leverages the extremely high photosensitivity and detectivity of thin-film photosensitive materials (far exceeding that of silicon-based devices). Therefore, the orientation and distance of a single light source have different effects on the photodetectors of the compound eye system, enabling both static and dynamic distance measurements of the light source. The main steps are as follows:

[0107] First, the position and orientation of each sub-sensor (photodetector unit) in the buckling-guided eccentric deformation compound eye distance measurement system need to be determined, and the coordinates (x, y, y) of the sub-sensor need to be determined. i ,y i ,z i ).

[0108] Data reading and preprocessing: Light intensity measurement data is read through compound eyes. Based on the light intensity conversion equation, the measured data is transformed and then filtered to correct the measured values.

[0109] Light source position calculation: Extract the light intensity vector corresponding to the current measurement, first estimate the light source position, construct an optimization objective function based on the initial estimated light source position, calculate the Euclidean distance from the light source to each point on the compound eye, and then calculate the error between the measured light intensity and the theoretical light intensity according to the light intensity attenuation model;

[0110] Let the spatial coordinates of the target light source (target object) be (X,Y,Z), and the distance from the i-th eyelet to the light source be r. i Then the objective function is: ;

[0111] Combining the inverse square law (light intensity attenuation model) E i =I / r i 2 It can be transformed into:

[0112] ;

[0113] Subsequently, a nonlinear least squares optimization method was adopted to select measurement data from four or more sub-sensors (covering different spatial directions), iteratively solve for the optimal light source position, and finally plot the dynamic position change trajectory of the light source.

[0114] The various embodiments of the present invention have been described above. These descriptions are exemplary and not exhaustive, nor are they limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is chosen to best explain the principles, practical application, or improvement of the technology in the market, or to enable others skilled in the art to understand the embodiments disclosed herein.

Claims

1. A biomimetic compound eye, characterized in that, include: The photoelectric detection layer has a photoelectric array set in the deformable area; The photoelectric array includes multiple photodetector units interconnected by connecting rods. Each of the photodetector units includes: a support surface carrying a thin film photosensitive material and an electrode, an annular structure surrounding the support surface, and a support beam connecting the annular structure and the support surface; The support layer has holes and is bonded to the non-deformable area of ​​the photoelectric detection layer. The three-dimensional curved surface support mold applies pressure to the deformable area through the holes, causing the connecting rod to transmit tensile force to each of the photodetector units; the deformation of the annular structure and the buckling and arching of the support beam convert tensile strain into bending strain, driving the bearing surface to undergo buckling-guided anisotropic deformation.

2. The bionic compound eye according to claim 1, characterized in that, The bionic compound eye also includes a base; the three-dimensional curved surface support mold is fixedly mounted on the base; the support layer is detachably connected to the base via a fastener.

3. The bionic compound eye according to claim 1, characterized in that, The three-dimensional curved surface support mold is a hemispherical, ellipsoidal, or saddle-shaped structure.

4. The bionic compound eye according to claim 1, characterized in that, The ring structure is a centrally symmetrical ring structure, specifically a quadrilateral ring, an octagonal ring, a dodecagonal ring, or a circular ring.

5. The bionic compound eye according to claim 1, characterized in that, The bearing surface is a square, a circle, or a regular polygon.

6. The bionic compound eye according to claim 1, characterized in that, When the photoelectric array is in a planar state, the photodetector units in the even-numbered rows and the odd-numbered rows are orthogonal in structural orientation.

7. A method for preparing a biomimetic compound eye, characterized in that, include: Based on the projection shape of the target three-dimensional curved surface electronic array in the top view, design the layout shape of the planar optoelectronic array so that the layout shape is consistent with the projection shape; According to the layout shape, a photoelectric array frame is cut and fabricated in the target area of ​​the flexible substrate; the photoelectric array frame includes multiple unit bases connected to each other by connecting rods, each unit base includes a bearing surface, an annular structure surrounding the bearing surface, and a support beam connecting the bearing surface and the annular structure; Electrodes are fabricated on each of the bearing surfaces, and corresponding connection circuits are fabricated on the annular structure, the support beam, and the connecting rod. A thin film photosensitive material is coated on each of the electrodes to complete the fabrication of the photodetector layer; the area where the photodetector array is located in the photodetector layer is a deformable area, and the remaining areas are non-deformable areas. A perforated support layer is prepared, and the non-deformable region of the photoelectric detection layer is bonded and fixed to the non-perforated region of the support layer. After positioning the three-dimensional curved surface support mold, pressure is applied to the deformable area through the holes, driving the connecting rod to transmit tensile force to each of the photodetector units, causing the annular structure to deform and the support beam to buckle and arch, converting tensile strain into bending strain, and inducing buckling-guided anisotropic deformation of the bearing surface; The positions of the support layer and the three-dimensional curved surface support mold are fixed to maintain the three-dimensional curved surface shape of the photoelectric array.

8. A distance measurement system, characterized in that, include: The bionic compound eye according to any one of claims 1 to 6; The signal acquisition and processing unit is used to acquire the light intensity signals collected by each of the photodetector units and determine the spatial position of the target object based on the light intensity signals.

9. The distance measurement system according to claim 8, characterized in that, The signal acquisition and processing unit includes: A row-driven multiplexer, the output of which is connected to the row direction electrode group in the opto-array; A column acquisition multiplexer, the input of which is connected to the column direction electrode group in the photoelectric array; An operational amplifier is disposed between the column acquisition multiplexer and the column direction electrode group to construct an equipotential region to eliminate loop crosstalk; The sampling resistor has one end connected to the output of the column acquisition multiplexer, and the other end grounded. The main control chip is used for: The row driving multiplexer is controlled to apply driving voltage to the row direction electrode group row by row, and the column acquisition multiplexer sequentially selects each column direction electrode group. Based on the voltage value across the sampling resistor, the light intensity signal of each photodetector unit is obtained; The spatial position of the target object is calculated based on the light intensity signal.

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