Simulation IC synchronization test optimization method and system based on crosstalk simulation

Abstract

The invention discloses an analog IC synchronization test optimization method and system based on crosstalk simulation. The method comprises the following steps: firstly, acquiring position layout data and test signal data of each analog IC in a synchronous test process of the analog ICs, determining electromagnetic crosstalk information by combining test signals, and constructing a crosstalk schematic diagram according to the electromagnetic crosstalk information and the position layout data; clustering the schematic diagrams by using a spectral clustering algorithm, and identifying a crosstalk path in the synchronization test; designing an electromagnetic crosstalk signal isolation barrier based on the schematic diagram and the crosstalk path, deploying the electromagnetic crosstalk signal isolation barrier in a test environment, performing simulation evaluation on an independently tested analog IC by constructing and injecting a crosstalk simulation signal, and judging an isolation effect; and optimizing the isolation barrier according to an evaluation result to obtain an optimization scheme. According to the method, the electromagnetic crosstalk path in the synchronous test process can be effectively identified and isolated, and the accuracy and reliability of the simulation IC test are improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of analog integrated circuit test technology, in particular to an analog IC synchronous test optimization method and system based on crosstalk simulation. BACKGROUND

[0002] Analog integrated circuits (Analog Integrated Circuit, referred to as analog IC) are widely used in signal acquisition, amplification, filtering and other key links in electronic systems. With the increasing integration and the increasing demand for test efficiency, synchronous testing of analog ICs (i.e. parallel testing of multiple analog ICs on the same test platform) has become an important technical means in production and verification. However, in the process of synchronous testing, due to the close proximity of multiple analog ICs in physical space and the overlap of their working signal frequency spectrum range, electromagnetic crosstalk is easily generated.

[0003] The generation of electromagnetic crosstalk is mainly due to the parasitic capacitance and parasitic inductance between conductors, as well as spatial electromagnetic radiation coupling. In a high-frequency or high-speed signal transmission environment, crosstalk will introduce additional noise, causing the measured signal waveform to distort, the amplitude and phase to shift, and thus affecting the accuracy and stability of the test results. Therefore, traditional physical suppression methods such as shielding and isolation often have poor isolation effect or design redundancy in the absence of precise analysis and positioning.

[0004] Existing electromagnetic crosstalk analysis methods usually rely on static layout checks or simple frequency domain interference evaluations, making it difficult to combine the time-frequency characteristics in the dynamic process of synchronous testing, accurately identify the main crosstalk paths and key coupling nodes. In addition, for the design and optimization of isolation barriers, most methods lack a closed-loop adjustment mechanism based on simulation feedback, resulting in insufficient crosstalk suppression and difficulty in maintaining stable isolation performance between different test batches and product models.

[0005] Therefore, there is an urgent need for a synchronous test optimization method and system that can combine layout data and test signal characteristics, and achieve precise isolation barrier optimization through crosstalk path modeling and simulation evaluation, to improve the accuracy and consistency of analog IC testing and reduce the impact of electromagnetic crosstalk on test results. SUMMARY

[0006] To solve at least one of the above technical problems, the present application provides an analog IC synchronous test optimization method and system based on crosstalk simulation.

[0007] The first aspect of the present application provides an analog IC synchronous test optimization method based on crosstalk simulation, comprising:

[0008] acquire position layout data in a synchronous test process of analog ICs and test signal data of each analog IC, determine electromagnetic crosstalk information of each analog IC according to the test signal data, and construct a crosstalk schematic diagram according to the position layout data and the electromagnetic crosstalk information;

[0009] perform a clustering operation on the crosstalk schematic diagram based on a spectral clustering algorithm, and identify a crosstalk path in the synchronous test process of the analog ICs;

[0010] construct an electromagnetic crosstalk signal isolation barrier for the synchronous test of the analog ICs according to the crosstalk schematic diagram and the crosstalk path;

[0011] deploy the electromagnetic crosstalk signal isolation barrier in a synchronous test environment of the analog ICs, construct a crosstalk simulation signal, inject the crosstalk simulation signal into an independently tested analog IC to perform crosstalk simulation, and evaluate a crosstalk isolation effect of the crosstalk signal isolation barrier according to the crosstalk simulation;

[0012] optimize the crosstalk signal isolation barrier according to the isolation effect, and obtain an optimized crosstalk signal isolation barrier.

[0013] In the scheme, the acquisition of the position layout data in the synchronous test process of the analog ICs and the test signal data of each analog IC, the determination of the electromagnetic crosstalk information of each analog IC according to the test signal data, and the construction of the crosstalk schematic diagram according to the position layout data and the electromagnetic crosstalk information are specifically as follows:

[0014] extract test physical coordinates of each analog IC in the synchronous test process of the analog ICs based on board layout information of a target analog IC tester, and establish position layout data of the analog ICs through three-dimensional space mapping;

[0015] acquire test signal data of each analog IC in the synchronous test process of the analog ICs, the test signal data including time-domain waveform data and frequency-domain spectrum data, perform wavelet transform processing on the test signal data, extract a crosstalk noise component of the time-domain waveform signal, and calculate an instantaneous amplitude and an instantaneous frequency of the crosstalk noise component through Hilbert transform;

[0016] divide the frequency-domain spectrum data into windows based on a sliding time window, calculate electromagnetic crosstalk frequency points of the frequency-domain spectrum data in each division window based on Fourier transform, and calculate power spectral densities of the crosstalk frequency points;

[0017] calculate electromagnetic crosstalk strength and electromagnetic crosstalk frequency between the analog ICs according to the instantaneous amplitude and the instantaneous frequency of the crosstalk noise component and the power spectral densities of the crosstalk frequency points, and obtain electromagnetic crosstalk information of each analog IC;

[0018] mapping electromagnetic crosstalk information of each analog IC to the location layout data to construct a crosstalk schematic diagram of analog IC synchronous testing.

[0019] In the scheme, the spectrum clustering algorithm is used to perform clustering operation on the crosstalk schematic diagram to identify crosstalk paths in the analog IC synchronous testing process, and the specific process is as follows:

[0020] According to the location layout data, the spatial distance between each analog IC is determined, the signal energy correlation of each analog IC at the same frequency point is calculated according to the electromagnetic crosstalk frequency point power spectrum density, and the crosstalk coupling coefficient between each analog IC is determined by weighted calculation according to the spatial distance and signal energy correlation;

[0021] According to the crosstalk coupling coefficient, the crosstalk relationship between the analog ICs is determined, each analog IC is taken as a graph node, a connection edge is established between the analog IC nodes with crosstalk relationship, the connection weight of the connection edge is determined according to the crosstalk coupling coefficient and the crosstalk strength, and a weighted adjacency matrix of the analog ICs is constructed.

[0022] The weighted adjacency matrix is normalized, a degree matrix is calculated and a symmetric normalized Laplacian matrix is constructed, the eigenvectors corresponding to the first k largest eigenvalues are obtained through eigenvalue decomposition, and the eigenvectors are grouped into a feature matrix according to rows.

[0023] The row vectors of the feature matrix are subjected to K-means clustering, the analog ICs are divided into k crosstalk coupling clusters, the average crosstalk strength between the analog ICs in each crosstalk coupling cluster is calculated, and the analog IC pairs with an average crosstalk strength exceeding the inter-cluster crosstalk threshold are marked as strong coupling node pairs.

[0024] Based on the strong coupling node pairs, a crosstalk propagation directed graph is constructed, a depth-first search is performed on the crosstalk propagation directed graph, and a path with the maximum cumulative crosstalk strength is identified as a main crosstalk path.

[0025] According to the location layout data of each analog IC on the main crosstalk path, the correlation coefficient of the spatial distance and the crosstalk strength between adjacent analog ICs on the path is calculated, the path segment with a correlation coefficient exceeding a distance influence threshold is marked as a distance-sensitive crosstalk path, and the main crosstalk path and the distance-sensitive crosstalk path are combined to construct a set of analog IC synchronous testing crosstalk paths.

[0026] In the scheme, the electromagnetic crosstalk signal isolation barrier for analog IC synchronous testing is constructed according to the crosstalk schematic diagram and the crosstalk path, and the specific process is as follows:

[0027] According to the electromagnetic crosstalk information of each analog IC in the crosstalk schematic diagram, the crosstalk strength distribution characteristics are extracted, the main lobe direction of electromagnetic field radiation is determined in combination with the propagation direction of the main crosstalk path in the crosstalk path set, and the signal coverage range of each analog IC in the three-dimensional space is calculated based on the main lobe direction of electromagnetic field radiation.

[0028] According to the spatial superposition analysis of the signal coverage range and the position layout data, the analog IC pairs in the electromagnetic field overlapping area are identified, and the center point of the electromagnetic field overlapping area is taken as the reference anchor point of the isolation barrier.

[0029] Based on the reference anchor point, an initial isolation barrier plane is constructed, the normal vector direction of the isolation barrier plane is adjusted according to the spatial correlation coefficient of the distance-sensitive crosstalk path in the crosstalk path set, and the adjusted isolation barrier plane forms the maximum angle with the distance-sensitive crosstalk path.

[0030] The intersection line length of the isolation barrier plane corresponding to the maximum angle and the signal coverage range of each analog IC is obtained, and when the intersection line length exceeds the intersection line threshold, the high crosstalk area and the low crosstalk area are divided on both sides of the isolation barrier plane according to the electromagnetic crosstalk strength distribution characteristics, and the metal shielding layer distribution strategy of the isolation barrier is generated based on the position coordinates of the high crosstalk area.

[0031] When the intersection line length is not greater than the intersection line threshold, the electromagnetic crosstalk frequency point power spectrum density of the adjacent analog ICs on the main crosstalk path is re-extracted, the frequency point energy difference value is calculated and the energy dominant frequency band is identified, the dielectric material parameters of the isolation barrier plane are determined based on the energy dominant frequency band, and the frequency band matched isolation barrier impedance optimization strategy is generated.

[0032] According to the metal shielding layer distribution strategy or the isolation barrier impedance optimization strategy, an electromagnetic crosstalk signal isolation barrier for analog IC synchronous testing is constructed.

[0033] In the scheme, the electromagnetic crosstalk signal isolation barrier is deployed in the analog IC synchronous testing environment, a crosstalk simulation signal is constructed, the crosstalk simulation signal is injected into an independently tested analog IC for crosstalk simulation, and the crosstalk isolation effect of the crosstalk signal isolation barrier is evaluated according to the crosstalk simulation, specifically:

[0034] Based on the strongly coupled node pairs and the corresponding electromagnetic crosstalk frequency points identified in the crosstalk schematic diagram, the power spectrum density characteristics of each frequency point are extracted, the time-domain crosstalk signal waveform is reconstructed through inverse Fourier transform, the time delay and attenuation coefficient of the crosstalk signal on the transmission path are calculated according to the spatial position relationship of the analog ICs on the main crosstalk path, and a crosstalk simulation signal equivalent to the synchronous testing environment is generated.

[0035] sequentially deploying a single analog IC at each load board position of a target analog IC test machine for independent simulation test, injecting the crosstalk simulation signal into the simulation test analog IC through a signal injection port of the test machine, and obtaining output signal data of the simulation test analog IC;

[0036] performing band-pass filtering on the output signal data, extracting a signal component matching a frequency band of the crosstalk simulation signal, and calculating an energy proportion of the signal component as a crosstalk coupling strength of a current test position;

[0037] According to the deployment position of the electromagnetic crosstalk signal isolation barrier, the analog IC regions on both sides of the isolation barrier are divided, the crosstalk coupling strength difference of the analog ICs on both sides of the barrier is calculated respectively, the crosstalk suppression rate is determined according to the difference, and the crosstalk isolation effect is determined according to the crosstalk suppression rate.

[0038] In the scheme, the crosstalk signal isolation barrier is optimized according to the isolation effect to obtain an optimized crosstalk signal isolation barrier, specifically:

[0039] According to the crosstalk isolation effect of the analog ICs independently tested at each load board position, a crosstalk isolation effect distribution map is constructed, and a region with a crosstalk suppression rate lower than a threshold value in the crosstalk isolation effect distribution map is extracted as an optimization target region;

[0040] According to the crosstalk path set of the optimization target region, the electromagnetic field radiation main lobe direction of the main crosstalk path is recalculated, the adjustment angle of the isolation shielding plane is determined by adjusting the orthogonal relationship between the normal vector of the isolation barrier plane and the updated radiation main lobe direction.

[0041] The frequency domain feature analysis is performed on the crosstalk simulation signal of the optimization target region, the residual crosstalk frequency band that is not effectively suppressed is identified, the required shielding layer thickness is calculated based on the power spectral density characteristics of the frequency band, and the crosstalk signal isolation barrier is optimized according to the adjustment angle of the isolation shielding plane and the increase in thickness of the shielding layer to obtain an optimized crosstalk signal isolation barrier.

[0042] The second aspect of the present application also provides an analog IC synchronous test optimization system based on crosstalk simulation, which comprises a memory and a processor, and the memory comprises an analog IC synchronous test optimization method based on crosstalk simulation.

[0043] Obtain position layout data and test signal data of each analog IC in the analog IC synchronous test process, determine electromagnetic crosstalk information of each analog IC according to the test signal data, and construct a crosstalk schematic diagram according to the position layout data and the electromagnetic crosstalk information.

[0044] perform clustering operation on the crosstalk schematic diagram based on a spectral clustering algorithm, and identify crosstalk paths in the simulation IC synchronous test process;

[0045] construct an electromagnetic crosstalk signal isolation barrier for the simulation IC synchronous test according to the crosstalk schematic diagram and the crosstalk paths;

[0046] deploy the electromagnetic crosstalk signal isolation barrier in a simulation IC synchronous test environment, construct a crosstalk simulation signal, inject the crosstalk simulation signal into an independently tested simulation IC for crosstalk simulation, and evaluate crosstalk isolation effect of the crosstalk signal isolation barrier according to the crosstalk simulation;

[0047] optimize the crosstalk signal isolation barrier according to the isolation effect, and obtain an optimized crosstalk signal isolation barrier.

[0048] The application discloses a simulation IC synchronous test optimization method and system based on crosstalk simulation. BRIEF DESCRIPTION OF DRAWINGS

[0049] Figure 1 A flowchart of the simulation IC synchronous test optimization method based on crosstalk simulation is shown;

[0050] Figure 2 A flowchart of the evaluation of the crosstalk isolation effect of the crosstalk signal isolation barrier is shown;

[0051] Figure 3 A flowchart of the optimized crosstalk signal isolation barrier is shown;

[0052] Figure 4 A block diagram of the simulation IC synchronous test optimization system based on crosstalk simulation is shown. DETAILED DESCRIPTION

[0053] In order to enable a more clear understanding of the above-mentioned objects, features and advantages of the present application, the present application will be further described in detail below with reference to the drawings and specific embodiments. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

[0054] In the following description, a large number of specific details are set forth in order to facilitate a thorough understanding of the present application, but the present application can also be implemented in other manners different from those described herein, and therefore, the protective scope of the present application is not limited by the specific embodiments disclosed below.

[0055] Figure 1 A flow chart of an analog IC synchronous test optimization method based on crosstalk simulation of the present application is shown.

[0056] As shown in Figure 1 The first aspect of the present application provides an analog IC synchronous test optimization method based on crosstalk simulation, comprising:

[0057] S102, acquiring position layout data in an analog IC synchronous test process and test signal data of each analog IC, determining electromagnetic crosstalk information of each analog IC according to the test signal data, and constructing a crosstalk schematic diagram according to the position layout data and the electromagnetic crosstalk information;

[0058] S104, performing a clustering operation on the crosstalk schematic diagram based on a spectral clustering algorithm, and identifying a crosstalk path in the analog IC synchronous test process;

[0059] S106, constructing an electromagnetic crosstalk signal isolation barrier for the analog IC synchronous test according to the crosstalk schematic diagram and the crosstalk path;

[0060] S108, deploying the electromagnetic crosstalk signal isolation barrier in an analog IC synchronous test environment, constructing a crosstalk simulation signal, injecting the crosstalk simulation signal into an analog IC for independent test to perform crosstalk simulation, and evaluating a crosstalk isolation effect of the crosstalk signal isolation barrier according to the crosstalk simulation;

[0061] S110, optimizing the crosstalk signal isolation barrier according to the isolation effect to obtain an optimized crosstalk signal isolation barrier.

[0062] It should be noted that by acquiring the position layout data in the simulation IC synchronous test process and the test signal data of each simulation IC, the spatial layout and signal characteristics of each measured device can be accurately restored at the beginning of the test; based on the test signal data, electromagnetic crosstalk information is extracted and combined with the position layout to construct a crosstalk diagram, which intuitively presents the coupling relationship and interference strength between different simulation ICs, and realizes the visualization of crosstalk distribution; the spectrum clustering algorithm is used for clustering analysis of the crosstalk diagram, so as to effectively identify the device group with high coupling degree and the main crosstalk path, thereby accurately positioning the interference propagation channel; according to the crosstalk diagram and path information, an electromagnetic crosstalk signal isolation barrier is constructed, and isolation measures are set in the key coupling area, unnecessary shielding structures are reduced, and the effectiveness and economy of the isolation design are improved; the isolation barrier is deployed in the test environment and an equivalent crosstalk simulation signal is injected into the simulation IC for independent test, without affecting the normal production test, the electromagnetic interference process is truly reproduced, the inhibition effect of the isolation barrier is quantitatively measured through simulation evaluation; finally, the isolation barrier is optimized according to the evaluation result, the isolation structure parameters and position are adjusted, so that the isolation barrier can maintain a high crosstalk suppression rate under different test batches and layout conditions, thereby significantly improving the precision and consistency of the simulation IC synchronous test.

[0063] According to the embodiment of the application, the position layout data in the simulation IC synchronous test process and the test signal data of each simulation IC are acquired, the electromagnetic crosstalk information of each simulation IC is determined according to the test signal data, and the crosstalk diagram is constructed according to the position layout data and the electromagnetic crosstalk information, specifically:

[0064] Based on the target simulation IC tester's board layout information, the test physical coordinates of each simulation IC in the simulation IC synchronous test process are extracted, and the position layout data of the simulation IC is established through three-dimensional space mapping;

[0065] The test signal data of each simulation IC in the simulation IC synchronous test process is acquired, the test signal data includes time domain waveform data and frequency domain spectrum data, the wavelet transform processing is performed on the test signal data, the crosstalk noise component of the time domain waveform signal is extracted, and the instantaneous amplitude and instantaneous frequency of the crosstalk noise component are calculated through Hilbert transform;

[0066] The frequency domain spectrum data is divided into windows based on a sliding time window, the electromagnetic crosstalk frequency points of the frequency domain spectrum data in each division window are calculated based on Fourier transform, and the power spectral density of each crosstalk frequency point is calculated;

[0067] The electromagnetic crosstalk strength and electromagnetic crosstalk frequency between each simulation IC are calculated according to the instantaneous amplitude and instantaneous frequency of the crosstalk noise component and the power spectral density of the crosstalk frequency point, and the electromagnetic crosstalk information of each simulation IC is obtained;

[0068] mapping electromagnetic crosstalk information of each analog IC into the location layout data to construct a crosstalk diagram of the analog IC synchronous test.

[0069] It should be noted that, in the analog IC synchronous test process, since multiple tested ICs work simultaneously in adjacent positions, their pins and internal circuits will generate electromagnetic radiation when transmitting high-speed or high-frequency signals, and form parasitic capacitance and parasitic inductance through test carrier board wiring, common power / ground plane and space coupling, thereby generating electromagnetic crosstalk between different ICs. Such crosstalk is not only related to the physical distance and relative layout between ICs, but also closely related to the frequency component, amplitude variation and spectral overlap degree of the working signals of the ICs, and is easy to cause distortion, noise superposition or frequency offset of the test signals of adjacent ICs, thereby affecting the test accuracy. By extracting the three-dimensional physical coordinates of each IC based on the carrier board layout information and combining the time domain and frequency domain characteristics of the test signals, the electromagnetic crosstalk strength and frequency distribution are calculated, and the electromagnetic crosstalk diagram is constructed by mapping the electromagnetic crosstalk strength and frequency distribution to the location layout, which can directly reveal the coupling relationship, interference strength and frequency characteristics between the ICs.

[0070] According to the embodiment of the present application, the spectral clustering algorithm is used to perform clustering operation on the crosstalk diagram to identify the crosstalk path in the analog IC synchronous test process, specifically comprising:

[0071] According to the location layout data, the spatial distance between each analog IC is determined, the signal energy correlation of each analog IC at the same frequency point is calculated according to the power spectral density of the electromagnetic crosstalk frequency point, and the crosstalk coupling coefficient between each analog IC is determined by weighted calculation according to the spatial distance and the signal energy correlation;

[0072] It should be noted that the signal energy correlation is obtained by calculating the correlation coefficient between the power spectral densities of each analog IC at the same frequency point, and quantifying the signal coupling strength of the analog ICs in the electromagnetic crosstalk frequency band; the crosstalk coupling coefficient is used to quantify the electromagnetic crosstalk strength between the analog ICs, and the spatial distance attenuation effect and the signal energy coupling degree are combined by using the weighted fusion method, wherein the closer distance and the higher signal correlation will significantly increase the coupling coefficient.

[0073] According to the crosstalk coupling coefficient, the crosstalk relationship between the analog ICs is determined, each analog IC is taken as a graph node, a connection edge is established between the analog IC nodes with the crosstalk relationship, the connection weight of the connection edge is determined according to the crosstalk coupling coefficient and the crosstalk strength, and a weighted adjacency matrix of the analog ICs is constructed;

[0074] The weighted adjacency matrix is normalized, a degree matrix is calculated and a symmetric normalized Laplacian matrix is constructed, a feature vector corresponding to the first k largest eigenvalues is obtained by eigenvalue decomposition, and the feature vector is grouped into a feature matrix by rows;

[0075] K-means clustering is performed on the row vectors of the feature matrix to divide the analog ICs into k crosstalk coupling clusters, the average crosstalk strength between the analog ICs in each crosstalk coupling cluster is calculated, and the analog IC pairs with an average crosstalk strength exceeding an inter-cluster crosstalk threshold are marked as strongly coupled node pairs;

[0076] It should be noted that the analog IC pairs with an average crosstalk strength exceeding an inter-cluster crosstalk threshold are marked as strongly coupled node pairs because such node pairs exhibit significantly higher crosstalk strength within the same cluster than other inter-cluster connections, indicating that they have a significant electromagnetic interference coupling relationship, and such strong coupling relationship usually represents the main interference path in actual synchronous testing and is a key target for locating and suppressing crosstalk. The crosstalk relationship refers to whether crosstalk exists between two analog ICs.

[0077] Based on the strongly coupled node pairs, a crosstalk propagation directed graph is constructed, a depth-first search is performed on the crosstalk propagation directed graph, and a path with the maximum cumulative crosstalk strength is identified as a main crosstalk path;

[0078] According to the position layout data of each analog IC on the main crosstalk path, a correlation coefficient between the spatial distance and the crosstalk strength between adjacent analog ICs on the path is calculated, a path segment with a correlation coefficient exceeding a distance influence threshold is marked as a distance-sensitive crosstalk path, and a set of analog IC synchronous test crosstalk paths is constructed in combination with the main crosstalk path and the distance-sensitive crosstalk path.

[0079] It should be noted that the spectral clustering algorithm can automatically find highly correlated node clusters in a complex network by combining graph theory and linear algebra, abstract the crosstalk relationship between simulation ICs as a weighted graph structure, regard each simulation IC as a node, establish a connection edge between the simulation IC pairs with crosstalk, and take the crosstalk coupling coefficient considering the spatial distance and signal energy correlation as the connection weight to form a weighted adjacency matrix. Through normalization processing and construction of a symmetric normalized Laplacian matrix, and then performing eigenvalue decomposition, the original complex network can be projected into a low-dimensional feature space, so that the coupling strength between simulation ICs is expressed as geometric clustering separability in the space. Then, the simulation ICs can be divided into multiple crosstalk coupling clusters by using K-means clustering, and the strong coupling node pairs are screened out combined with the average crosstalk strength in the cluster. These node pairs reflect the possible high-energy crosstalk channels. Further, the strong coupling node pairs are constructed into a crosstalk propagation directed graph, and the main crosstalk path that is most likely to cause interference in actual testing is identified by searching for the path with the maximum cumulative crosstalk strength through depth-first search; finally, the distance-sensitive path significantly affected by the spatial distance is marked by analyzing the correlation between the distance and the crosstalk strength of adjacent ICs in the main crosstalk path, so as to obtain a complete crosstalk path set. The spectral clustering is to cluster the simulation IC nodes with strong coupling relationship, high signal energy correlation and close spatial position in electromagnetic crosstalk. The node in the crosstalk propagation directed graph represents the simulation IC, the direction of the directed edge is from the simulation IC with a larger crosstalk coupling coefficient to the simulation IC with a smaller crosstalk coupling coefficient, and the edge weight represents the crosstalk strength; the k is a preset value.

[0080] According to the embodiment of the present application, the electromagnetic crosstalk signal isolation barrier for simulation IC synchronous test is constructed according to the crosstalk schematic diagram and the crosstalk path, specifically:

[0081] According to the electromagnetic crosstalk information of each simulation IC in the crosstalk schematic diagram, the crosstalk strength distribution characteristics are extracted, the propagation direction of the main crosstalk path in the crosstalk path set is determined, and the signal coverage range of each simulation IC in the three-dimensional space is calculated based on the electromagnetic field radiation main lobe direction;

[0082] According to the spatial superposition analysis of the signal coverage range and the position layout data, the simulation IC pairs with the electromagnetic field overlapping region are identified, and the center point of the electromagnetic field overlapping region is taken as the reference anchor point of the isolation barrier;

[0083] Based on the reference anchor point, an initial isolation barrier plane is constructed, the normal vector direction of the isolation barrier plane is adjusted according to the spatial correlation coefficient of the distance-sensitive crosstalk path in the crosstalk path set, the adjusted isolation barrier plane forms the maximum angle with the distance-sensitive crosstalk path;

[0084] It should be noted that the adjusted isolation barrier plane forms the maximum angle with the distance-sensitive crosstalk path, which can maximize the reduction of electromagnetic crosstalk along the distance-sensitive path. The distance-sensitive crosstalk path refers to those crosstalk paths whose crosstalk strength is closely related to the spatial distance and is significantly affected by the physical position. By making the isolation barrier plane form the maximum angle with these paths, it is equivalent to making the barrier perpendicular or approximately perpendicular to the crosstalk signal propagation direction, thereby enhancing the barrier's blocking effect on electromagnetic waves, effectively blocking or weakening the crosstalk signal propagation path, and improving the shielding performance and overall crosstalk suppression effect of the isolation barrier. The main lobe direction refers to the main direction with the strongest magnetic energy and the highest radiation power, that is, the direction with the most concentrated electromagnetic energy and the most significant propagation.

[0085] The intersection length of the isolation barrier plane corresponding to the maximum angle and the coverage range of each analog IC signal is obtained, and when the intersection length exceeds the intersection threshold, a high crosstalk region and a low crosstalk region are divided on both sides of the isolation barrier plane according to the electromagnetic crosstalk strength distribution characteristics, and a metal shielding layer distribution strategy of the isolation barrier is generated based on the position coordinates of the high crosstalk region.

[0086] It should be noted that the intersection refers to the intersection line segment of the isolation barrier plane and the analog IC signal coverage range in three-dimensional space, representing the actual contact or overlapping part of the barrier and the electromagnetic signal propagation area. When the intersection length exceeds the preset intersection threshold, it indicates that the isolation barrier and the signal coverage range of multiple analog ICs have a large overlapping area, and electromagnetic crosstalk may propagate through these overlapping areas. Dividing a high crosstalk region and a low crosstalk region on both sides of the isolation barrier plane based on the electromagnetic crosstalk strength distribution characteristics can accurately locate the region where the crosstalk energy is concentrated, and the metal shielding layer can be arranged on the position coordinates of the high crosstalk region, thereby effectively blocking or weakening the transmission path of electromagnetic waves.

[0087] When the intersection length is not greater than the intersection threshold, the electromagnetic crosstalk frequency point power spectral density of adjacent analog ICs on the main crosstalk path is re-extracted, the frequency point energy difference value is calculated and the energy dominant frequency band is identified, the dielectric material parameters of the isolation barrier plane are determined based on the energy dominant frequency band, and a frequency band-matched isolation barrier impedance optimization strategy is generated.

[0088] An electromagnetic crosstalk signal isolation barrier for analog IC synchronous testing is constructed according to the metal shielding layer distribution strategy or the isolation barrier impedance optimization strategy.

[0089] It should be noted that when the intersection line length is not greater than the intersection line threshold, it indicates that the overlap area of the isolation barrier plane and the analog IC signal coverage range is small, and the traditional metal shielding layer is difficult to fully cover or block the main crosstalk path. At this time, by re-extracting the electromagnetic crosstalk frequency point power spectrum density of the adjacent analog IC on the main crosstalk path, the frequency point energy difference value is calculated and the energy dominant frequency band is identified, the main frequency range of the interference signal can be accurately determined. Based on the energy dominant frequency band, the dielectric material parameters of the isolation barrier plane are determined, so that it has good electromagnetic wave absorption or impedance matching characteristics in a specific frequency band. The generation of the frequency band matched isolation barrier impedance optimization strategy can effectively reduce the reflection and penetration of electromagnetic waves in the frequency band, improve the suppression ability of the barrier to the electromagnetic crosstalk in the specific frequency band, and thus optimize the overall isolation effect.

[0090] Figure 2 A flow chart for evaluating the crosstalk isolation effect of the crosstalk signal isolation barrier of the application is shown.

[0091] According to the embodiment of the application, the electromagnetic crosstalk signal isolation barrier is deployed in the analog IC synchronous test environment, a crosstalk simulation signal is constructed, the crosstalk simulation signal is injected into an independently tested analog IC for crosstalk simulation, and the crosstalk isolation effect of the crosstalk signal isolation barrier is evaluated according to the crosstalk simulation. Specifically,

[0092] S202, based on the strong coupling node pairs and the corresponding electromagnetic crosstalk frequency points identified in the crosstalk schematic diagram, the power spectrum density characteristics of each frequency point are extracted, the time domain crosstalk signal waveform is reconstructed through inverse Fourier transform, the time delay and attenuation coefficient of the crosstalk signal on the transmission path are calculated according to the spatial position relationship of the analog IC on the main crosstalk path, and a crosstalk simulation signal equivalent to the synchronous test environment is generated;

[0093] S204, a single analog IC is deployed in sequence at each board position of the target analog IC tester for independent simulation test, the crosstalk simulation signal is injected into the simulation test analog IC through the signal injection port of the tester, and the output signal data of the simulation test analog IC is obtained;

[0094] S206, the output signal data is subjected to band-pass filtering processing, a signal component matched with the crosstalk simulation signal frequency band is extracted, and the energy proportion of the signal component is calculated as the crosstalk coupling strength of the current test position;

[0095] S208, according to the deployment position of the electromagnetic crosstalk signal isolation barrier, the analog IC regions on both sides of the isolation barrier are divided, the crosstalk coupling strengths of the analog ICs on both sides of the barrier are calculated respectively, the crosstalk suppression rate is determined according to the difference value, and the crosstalk isolation effect is determined according to the crosstalk suppression rate.

[0096] It should be noted that by constructing a crosstalk simulation signal highly consistent with the actual synchronous test environment, injecting the signal into an independently tested analog IC, the real simulation and reproduction of electromagnetic crosstalk in the test process can be realized, which can accurately reflect the change of crosstalk coupling strength at different test positions; the frequency band matching energy proportion of the simulation output signal is used to quantify the influence degree of the crosstalk signal on the tested IC, and then by comparing the difference of crosstalk coupling strength of the analog ICs on both sides of the isolation barrier, the crosstalk suppression effect of the isolation barrier can be accurately evaluated.

[0097] Figure 3 A flowchart of the optimized crosstalk signal isolation barrier of the application is shown.

[0098] According to the embodiment of the application, the crosstalk signal isolation barrier is optimized according to the isolation effect, and an optimized crosstalk signal isolation barrier is obtained, specifically:

[0099] S302, a crosstalk isolation effect distribution map is constructed according to the crosstalk isolation effect of the analog IC independently tested at each carrier plate position, and a region with a crosstalk suppression rate lower than a threshold in the crosstalk isolation effect distribution map is extracted as an optimization target region;

[0100] S304, the electromagnetic field radiation main lobe direction of the main crosstalk path is recalculated according to the crosstalk path set of the optimization target region, the orthogonal relationship between the isolation barrier plane normal vector and the updated radiation main lobe direction is adjusted, and the adjustment angle of the isolation shielding plane is determined;

[0101] S306, frequency domain feature analysis is performed on the crosstalk simulation signal of the optimization target region, residual crosstalk frequency bands that are not effectively suppressed are identified, the required shielding layer thickness is calculated based on the power spectral density characteristics of the frequency bands, and the crosstalk signal isolation barrier is optimized according to the adjustment angle of the isolation shielding plane and the increased thickness of the shielding layer, and an optimized crosstalk signal isolation barrier is obtained.

[0102] It should be noted that, in the process of analog IC synchronous test, due to the complex propagation path and environmental changes of electromagnetic crosstalk, the crosstalk signal isolation barrier initially constructed may have insufficient crosstalk suppression effect in some areas, resulting in that the test signal is still disturbed, and the accuracy and reliability of the test are affected; by constructing a crosstalk isolation effect distribution map based on independent test of each carrier plate position, accurately positioning the optimization target area with a suppression rate lower than a threshold, combining the crosstalk path set of the optimization area, recalculating the electromagnetic field radiation main lobe direction of the main crosstalk path, and adjusting the normal vector of the isolation barrier to realize the orthogonal relationship with the radiation main lobe direction, the blocking ability of the barrier to the main crosstalk path is effectively enhanced; in addition, through frequency domain feature analysis, the residual crosstalk frequency band that is not sufficiently suppressed is identified, the thickness of the shielding layer is reasonably calculated based on the power spectral density of the frequency band, and the shielding effect of the barrier on the crosstalk of the specific frequency band is further improved; the optimization strategy comprehensively adjusts the spatial direction and the thickness of the material, and significantly enhances the crosstalk suppression performance of the isolation barrier.

[0103] According to the embodiment of the application, the method further comprises:

[0104] The high-frequency crosstalk signal on the main crosstalk path in the process of analog IC synchronous test is acquired, the instantaneous phase information of the high-frequency crosstalk signal is extracted through Hilbert transform, the phase offset between adjacent windows is calculated based on a sliding time window, and a phase drift trend model is constructed according to the phase offset.

[0105] The direction of phase change of the next time window is predicted according to the phase drift trend model, the deviation value of the predicted phase from the impedance matching frequency band of the barrier is calculated in combination with the dielectric constant-frequency characteristic curve of the current medium material of the isolation barrier.

[0106] When the deviation value exceeds a phase tolerance threshold, a dielectric constant adjustment instruction is generated according to the size and direction of the deviation value, the equivalent dielectric constant of the isolation barrier is adjusted in real time through a voltage-controlled dielectric material layer, and the impedance matching frequency band of the barrier dynamically tracks the phase drift of the high-frequency crosstalk signal.

[0107] According to the embodiment of the application, the equivalent dielectric constant of the isolation barrier is adjusted in real time through a voltage-controlled dielectric material layer, specifically: a voltage-controlled voltage signal is generated according to the dielectric constant adjustment instruction, the voltage-controlled voltage signal is applied to the barium strontium titanate film layer of the isolation barrier, the dielectric constant is continuously adjusted by changing the film lattice polarization rate through the electric field intensity, and the impedance matching frequency band of the barrier dynamically tracks the phase drift of the high-frequency crosstalk signal.

[0108] The measured value of the adjusted barium strontium titanate film dielectric constant is synchronously collected, compared with the target dielectric constant, and the adjustment error is calculated, and the amplitude of the voltage-controlled voltage signal is corrected by using a PID control algorithm according to the adjustment error.

[0109] The dielectric constant adjustment amount and the phase drift compensation effect mapping relationship table is established according to the dielectric constant adjustment amount and the phase drift compensation effect mapping relationship table, and the generation strategy of the subsequent dielectric constant adjustment instruction is optimized based on the mapping relationship table, so that the high-frequency phase drift and the barrier impedance are dynamically matched in sub-millisecond.

[0110] It should be noted that in the simulation IC synchronous test process, the phase drift problem of the high-frequency crosstalk signal seriously affects the impedance matching effect of the isolation barrier, and the isolation barrier with fixed parameters cannot adapt to the dynamic change of the signal characteristics, resulting in continuous interference of the residual crosstalk to the test result. Since the high-frequency signal is affected by factors such as transmission line delay, temperature change and nonlinear dielectric characteristics of the material in the transmission process, its phase characteristics will drift unpredictably over time, so that the originally designed isolation barrier impedance matching frequency band gradually deviates from the actual signal frequency band, causing the barrier isolation efficiency to decrease. By extracting the instantaneous phase information of the signal and establishing a phase drift trend model, the direction of phase change is predicted in advance through a prediction algorithm, and then the impedance matching deviation is calculated in real time in combination with the frequency characteristics of the dielectric material. When the deviation exceeds the allowed range, the dielectric constant adjustment mechanism is triggered immediately. By using the electric field sensitive characteristics of the voltage-controlled dielectric material, the continuous adjustment of the dielectric constant is realized through precise voltage control, and the adjustment accuracy is ensured by cooperating with the closed-loop feedback system, so as to finally form a dynamic matching system of phase drift and barrier impedance. The adaptability of the isolation barrier to the high-frequency phase drift signal is significantly improved, and the stable crosstalk suppression effect can be maintained under different test environments and signal conditions.

[0111] Figure 4 A block diagram of an analog IC synchronous test optimization system based on crosstalk simulation is shown.

[0112] The second aspect of the application also provides an analog IC synchronous test optimization system based on crosstalk simulation, comprising: a memory 401, a processor 402 and a communication interface 403, wherein the memory is used to store programs, the processor is used to execute the programs stored in the memory, and the communication interface is used for data connection communication between the memory and the processor. When the program stored in the memory is executed, the method for optimizing the analog IC synchronous test based on crosstalk simulation is realized.

[0113] The application discloses a simulation IC synchronous test optimization method and system based on crosstalk simulation.

[0114] In several embodiments provided in the present application, it should be understood that the disclosed devices and methods can be implemented in other manners. The described device embodiments are merely illustrative, for example, the division of units is merely a logical function division, and there can be another division manner in actual implementation, for example, a plurality of units or components can be combined or integrated into another system, or some features can be ignored or not executed. In addition, the displayed or discussed coupling, or direct coupling, or communication connection between any two components can be indirect coupling or communication connection through some interfaces, devices or units, and can be electrical, mechanical or in other forms.

[0115] The units described as separate components can or can not be physically separate, and the components shown as units can or can not be physical units; they can be located in one place or distributed on multiple network units; and part or all of the units can be selected according to actual needs to achieve the purpose of the embodiment.

[0116] In addition, each functional unit in each embodiment of the present application can be integrated into one processing unit, or each unit can be a separate unit, or two or more units can be integrated into one unit; and the integrated unit can be implemented in the form of hardware or in the form of hardware plus software functional unit.

[0117] Those skilled in the art can understand that all or part of the steps of the above-mentioned method embodiments can be completed by program instruction related hardware, the foregoing program can be stored in a computer readable storage medium, and the program executes the steps of the method embodiments when executed; and the foregoing storage medium includes a mobile storage device, a read-only memory (ROM), a random access memory (RAM), a magnetic disc or an optical disc, and various storage medium capable of storing program codes.

[0118] Alternatively, the integrated unit of the present application can be stored in a computer readable storage medium if it is realized in the form of a software function module and sold or used as an independent product. Based on such understanding, the technical solutions of the embodiments of the present application can be embodied in the form of a software product, and the computer software product is stored in a storage medium, includes a plurality of instructions for causing a computer device (which can be a personal computer, a server, or a network device, etc.) to execute all or part of the methods described in the embodiments of the present application. The foregoing storage medium includes a mobile storage device, a ROM, a RAM, a magnetic disc or an optical disc, and various storage medium capable of storing program codes.

[0119] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto, any person skilled in the art can easily think of changes or replacements within the technical range disclosed in the present application, which should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A method for optimizing synchronous testing of analog ICs based on crosstalk simulation, characterized in that, Includes the following steps: Acquire the location layout data and test signal data of each analog IC during the synchronous testing process; determine the electromagnetic crosstalk information of each analog IC based on the test signal data; and construct a crosstalk diagram based on the location layout data and the electromagnetic crosstalk information. The crosstalk diagram is clustered based on the spectral clustering algorithm to identify crosstalk paths in the simulated IC synchronous test process. Construct an electromagnetic crosstalk signal isolation barrier for simulated IC synchronous testing based on the crosstalk diagram and crosstalk path; The electromagnetic crosstalk signal isolation barrier is deployed in a synchronous test environment of an analog IC to construct a crosstalk simulation signal. The crosstalk simulation signal is injected into an independently tested analog IC to perform crosstalk simulation. The crosstalk isolation effect of the crosstalk signal isolation barrier is evaluated based on the crosstalk simulation. The crosstalk signal isolation barrier is optimized based on the isolation effect to obtain an optimized crosstalk signal isolation barrier.

2. The method for optimizing synchronous testing of analog ICs based on crosstalk simulation according to claim 1, characterized in that, The process of acquiring the location layout data and test signal data of each analog IC during synchronous testing, determining the electromagnetic crosstalk information of each analog IC based on the test signal data, and constructing a crosstalk diagram based on the location layout data and electromagnetic crosstalk information, specifically involves: Based on the carrier board layout information of the target analog IC tester, the test physical coordinates of each analog IC during the synchronous test of the analog IC are extracted, and the position layout data of the analog IC is established through three-dimensional spatial mapping. The test signal data of each analog IC during the synchronous test of the analog IC is acquired. The test signal data includes time-domain waveform data and frequency-domain spectrum data. Wavelet transform processing is performed on the test signal data to extract the crosstalk noise component of the time-domain waveform signal. The instantaneous amplitude and instantaneous frequency of the crosstalk noise component are calculated by Hilbert transform. The frequency domain spectrum data is divided into windows based on a sliding time window, and the electromagnetic crosstalk frequency points of the frequency domain spectrum data within each divided window are calculated based on Fourier transform. The power spectral density of each crosstalk frequency point is then calculated. The electromagnetic crosstalk intensity and frequency between each analog IC are calculated based on the instantaneous amplitude and frequency of the crosstalk noise component and the power spectral density of the crosstalk frequency point, so as to obtain the electromagnetic crosstalk information of each analog IC. The electromagnetic crosstalk information of each analog IC is mapped to the location layout data to construct a crosstalk diagram for synchronous testing of analog ICs.

3. The method for optimizing synchronous testing of analog ICs based on crosstalk simulation according to claim 1, characterized in that, The clustering operation on the crosstalk diagram based on the spectral clustering algorithm to identify crosstalk paths in the simulated IC synchronization test process is specifically as follows: The spatial distance between each analog IC is determined based on the location layout data. The signal energy correlation of each analog IC at the same frequency point is calculated based on the power spectral density of the electromagnetic crosstalk frequency point. The crosstalk coupling coefficient between each analog IC is determined by weighted calculation based on the spatial distance and the signal energy correlation. The crosstalk relationship between the simulated ICs is determined based on the crosstalk coupling coefficient. Each simulated IC is treated as a graph node. Connection edges are established for simulated IC nodes with crosstalk relationships. The connection weights of the connection edges are determined based on the crosstalk coupling coefficient and the crosstalk strength. A weighted adjacency matrix of the simulated ICs is then constructed. The weighted adjacency matrix is ​​normalized, the degree matrix is ​​calculated and a symmetric normalized Laplacian matrix is ​​constructed, the eigenvectors corresponding to the first k largest eigenvalues ​​are obtained through eigenvalue decomposition, and the eigenvectors are arranged into a feature matrix by row. K-means clustering is performed on the row vectors of the feature matrix to divide the simulated IC into k crosstalk coupling clusters. The average crosstalk intensity between simulated ICs in each crosstalk coupling cluster is calculated. Simulated IC pairs with average crosstalk intensity exceeding the inter-cluster crosstalk threshold are marked as strongly coupled node pairs. Based on the strongly coupled node pair, a crosstalk propagation directed graph is constructed. A depth-first search is performed on the crosstalk propagation directed graph to identify the path with the maximum cumulative crosstalk intensity as the main crosstalk path. Based on the location layout data of each analog IC on the main crosstalk path, the correlation coefficient between the spatial distance between adjacent analog ICs on the path and the crosstalk intensity is calculated. Path segments with correlation coefficients exceeding the distance influence threshold are marked as distance-sensitive crosstalk paths. Combining the main crosstalk path and the distance-sensitive crosstalk path, a set of analog IC synchronous test crosstalk paths is constructed.

4. The method for optimizing synchronous testing of analog ICs based on crosstalk simulation according to claim 1, characterized in that, The construction of an electromagnetic crosstalk signal isolation barrier for simulated IC synchronous testing based on the crosstalk diagram and crosstalk path specifically includes: Based on the electromagnetic crosstalk information of each analog IC in the crosstalk diagram, the crosstalk intensity distribution characteristics are extracted. The propagation direction of the main crosstalk path in the crosstalk path set is combined with the propagation direction of the main crosstalk path to determine the electromagnetic field radiation main lobe direction. Based on the electromagnetic field radiation main lobe direction, the signal coverage range of each analog IC in three-dimensional space is calculated. Based on the signal coverage and location map data, spatial overlay analysis is performed to identify analog IC pairs with overlapping electromagnetic fields, and the center point of the overlapping electromagnetic field region is used as the reference anchor point of the isolation barrier. An initial isolation barrier plane is constructed based on the reference anchor point. The normal vector direction of the isolation barrier plane is adjusted according to the spatial correlation coefficient of the distance-sensitive crosstalk path in the crosstalk path set. The adjusted isolation barrier plane forms the maximum angle with the distance-sensitive crosstalk path. Obtain the intersection length between the isolation barrier plane corresponding to the maximum included angle and the coverage area of ​​each analog IC signal. When the intersection length exceeds the intersection threshold, divide the isolation barrier plane into high crosstalk area and low crosstalk area according to the electromagnetic crosstalk intensity distribution characteristics. Generate the metal shielding layer distribution strategy of the isolation barrier based on the position coordinates of the high crosstalk area. When the intersection length is not greater than the intersection threshold, the electromagnetic crosstalk frequency power spectral density of adjacent analog ICs on the main crosstalk path is re-extracted, the frequency energy difference is calculated and the energy-dominant frequency band is identified, the dielectric material parameters of the isolation barrier plane are determined based on the energy-dominant frequency band, and a frequency band matching isolation barrier impedance optimization strategy is generated. An electromagnetic crosstalk signal isolation barrier for analog IC synchronous testing is constructed based on the metal shielding layer distribution strategy or the isolation barrier impedance optimization strategy.

5. The method for optimizing synchronous testing of analog ICs based on crosstalk simulation according to claim 1, characterized in that, The process involves deploying the electromagnetic crosstalk signal isolation barrier in a synchronous test environment for analog ICs, constructing a crosstalk simulation signal, injecting the crosstalk simulation signal into independently tested analog ICs for crosstalk simulation, and evaluating the crosstalk isolation effect of the crosstalk signal isolation barrier based on the crosstalk simulation. Specifically, this process includes: Based on the strongly coupled node pairs and their corresponding electromagnetic crosstalk frequency points identified in the crosstalk diagram, the power spectral density features of each frequency point are extracted, and the time-domain crosstalk signal waveform is reconstructed by inverse Fourier transform. According to the spatial position relationship of the simulated IC on the main crosstalk path, the time delay and attenuation coefficient of the crosstalk signal on the transmission path are calculated, and a crosstalk simulation signal equivalent to the synchronous test environment is generated. A single analog IC is deployed sequentially at each carrier board position of the target analog IC tester for independent simulation testing. The crosstalk simulation signal is injected into the simulation test analog IC through the signal injection port of the tester to obtain the output signal data of the simulation test analog IC. The output signal data is subjected to bandpass filtering to extract the signal component that matches the frequency band of the crosstalk simulation signal, and the energy ratio of the signal component is calculated as the crosstalk coupling strength at the current test position. Based on the deployment location of the electromagnetic crosstalk signal isolation barrier, the analog IC regions on both sides of the isolation barrier are divided, and the crosstalk coupling strength difference between the analog ICs on both sides of the barrier is calculated. The crosstalk suppression rate is determined based on the difference, and the crosstalk isolation effect is determined based on the crosstalk suppression rate.

6. The method for optimizing synchronous testing of analog ICs based on crosstalk simulation according to claim 1, characterized in that, The optimization of the crosstalk signal isolation barrier based on the isolation effect yields an optimized crosstalk signal isolation barrier, specifically as follows: A crosstalk isolation effect distribution map is constructed based on the crosstalk isolation effect of the simulated IC tested independently at each carrier board location. The regions in the crosstalk isolation effect distribution map with crosstalk suppression rates below a threshold are extracted as optimization target regions. Based on the set of crosstalk paths in the optimized target area, the electromagnetic field radiation main lobe direction of the main crosstalk path is recalculated, the plane normal vector of the isolation barrier is adjusted to be orthogonal to the updated radiation main lobe direction, and the adjustment angle of the isolation shielding plane is determined. Frequency domain feature analysis is performed on the crosstalk simulation signal of the optimized target region to identify residual crosstalk frequency bands that have not been effectively suppressed. The required increase in shielding layer thickness is calculated based on the power spectral density characteristics of the frequency band. The crosstalk signal isolation barrier is optimized according to the adjustment angle of the isolation shielding plane and the increase in shielding layer thickness to obtain the optimized crosstalk signal isolation barrier.

7. An optimized synchronous test system for analog ICs based on crosstalk simulation, characterized in that, include: A memory and a processor, wherein the memory is used to store a program, and the processor is used to execute the program stored in the memory, wherein when the program stored in the memory is executed, the following steps are performed: Acquire the location layout data and test signal data of each analog IC during the synchronous testing process; determine the electromagnetic crosstalk information of each analog IC based on the test signal data; and construct a crosstalk diagram based on the location layout data and the electromagnetic crosstalk information. The crosstalk diagram is clustered based on the spectral clustering algorithm to identify crosstalk paths in the simulated IC synchronous test process. Construct an electromagnetic crosstalk signal isolation barrier for simulated IC synchronous testing based on the crosstalk diagram and crosstalk path; The electromagnetic crosstalk signal isolation barrier is deployed in a synchronous test environment of an analog IC to construct a crosstalk simulation signal. The crosstalk simulation signal is injected into an independently tested analog IC to perform crosstalk simulation. The crosstalk isolation effect of the crosstalk signal isolation barrier is evaluated based on the crosstalk simulation. The crosstalk signal isolation barrier is optimized based on the isolation effect to obtain an optimized crosstalk signal isolation barrier.

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