Multifunctional integrated heat dissipation structure of low-energy-consumption wireless ad hoc network communication equipment

Abstract

The invention provides a multifunctional integrated heat dissipation structure of low-energy-consumption wireless ad hoc network communication equipment, and belongs to the field of communication equipment. Comprising a shell and a communication host, the communication host is arranged in the shell, a bottom plate is installed on the rear side of the shell, a flat plate is installed on the rear side of the shell, two matched heat conduction grooves are formed in the opposite sides of the flat plate and the shell, and a plurality of movable heat conduction assemblies are evenly distributed in the heat conduction grooves in the shell. Through the arrangement of the movable heat conduction assembly, sufficient contact between the heat conduction plate and the mainboard can be ensured, the contact heat dissipation efficiency is improved, cooling liquid can circularly move in the heat conduction groove under the operation of the pump machine, absorption of heat on the shell and absorption of heat on the heat conduction pipe are accelerated, and the water-cooling heat dissipation function is achieved; and in combination with heat dissipation of the heat dissipation pipe by the heat dissipation plate, integration of multiple heat dissipation measures is realized, and the heat dissipation efficiency of the communication equipment can be effectively improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of communication equipment, in particular to a multifunctional integrated heat dissipation structure of low-energy wireless self-organizing network communication equipment. BACKGROUND

[0002] With the rapid development of the fields of Internet of Things, smart city and emergency communication, low-energy wireless self-organizing network communication equipment has been widely applied due to its advantages of not needing to rely on fixed infrastructure, being able to be quickly deployed, and self-cooperative communication between nodes. This kind of equipment usually needs to be operated for a long time in outdoor complex environments, such as high-temperature exposure, rain and snow attack, wind and sand impact, etc., and its working stability and service life directly depend on the heat dissipation performance, protection capability and reliability of the supporting structure. In terms of heat dissipation, although the equipment itself has low-energy characteristics, electronic components will still generate a certain amount of heat under long-time high-load operation or high-temperature environment. If the heat cannot be dissipated in time, the internal temperature of the equipment will rise, thereby affecting the stability of the communication signal, the data transmission rate, and even causing component aging, short circuit and other faults, which seriously restricts the normal work of the equipment. At present, the heat dissipation mode of the existing equipment is mainly natural heat conduction, that is, the internal heat is conducted to the outside through the metal shell or heat dissipation fins. This kind of heat dissipation efficiency is low, which is not conducive to the stable use of the equipment. Moreover, some low-energy wireless self-organizing network communication equipment will dissipate heat through the opening of a ventilation opening, at this time, the internal equipment is easy to be affected by rain or dust impurities in the external environment, resulting in damage to the equipment, which is not conducive to the stable and safe use of the low-energy wireless self-organizing network communication equipment outdoors.

[0003] Based on the above reasons, the present application provides a multifunctional integrated heat dissipation structure of low-energy wireless self-organizing network communication equipment, which can combine multiple heat dissipation measures to effectively improve the heat dissipation effect of the equipment, and has high-efficiency protection and convenient support functions to ensure the safe and stable operation of the equipment in outdoor environments. SUMMARY

[0004] The technical problem to be solved by the present application is to provide a multifunctional integrated heat dissipation structure of low-energy wireless self-organizing network communication equipment, which has the advantages of good heat dissipation effect and easy use.

[0005] To solve the above technical problems, the present application provides the following technical solutions: The utility model provides a multifunctional integrated heat dissipation structure of low energy consumption wireless self-organizing network communication equipment, including the shell, be provided with communication host computer in the shell, the back side of shell is installed with bottom plate and rear side is installed with flat plate, the side of flat plate and shell is opposite and is all seted up with two matched and is provided with heat conduction groove, evenly distribute and set up a plurality of movable heat conduction components in the heat conduction groove on the shell, the front side wall of flat plate is provided with two radiators symmetrically, both ends of radiator are fixedly connected with pump machine, and the pump machine is through arrangement with heat conduction groove, a plurality of radiating plates are evenly distributed and fixedly connected on two radiators, two movable plates are movably connected on the radiating plate and are symmetrically, the movable plate is provided with positioning assembly, and the bottom surface of two movable plates is fixedly connected with the same bottom shell, and the bottom surface of bottom shell is provided with adjustable support assembly.

[0006] Preferably, the communication host includes a mainboard, the mainboard is fixedly installed on the front side wall of the bottom plate, the top surface of the shell is fixedly connected with an antenna, and the bottom surface of the shell is fixedly connected with a plug connector, and the antenna and the plug connector are electrically connected with the mainboard.

[0007] Preferably, the movable heat conduction component includes a heat conduction pipe, the heat conduction pipe penetrates through the front side wall of the shell and extends into the heat conduction groove, a connecting rod is movably connected in the heat conduction pipe, a first spring is sleeved on the connecting rod, and both ends of the first spring are fixedly connected with the connecting rod and the inner wall of the heat conduction pipe.

[0008] Preferably, the rear end of the connecting rod is fixedly connected with a connecting plate, a plurality of round rods are movably connected on the connecting plate, a round plate and a heat conduction plate are fixedly connected at both ends of the round rod, a second spring is sleeved on the round rod, both ends of the second spring are fixedly connected with the round plate and the connecting plate, and the heat conduction plate is tightly arranged on the mainboard.

[0009] Preferably, the positioning assembly includes a fixed plate, a fixed plate is fixedly connected to the bottom surface of the lowermost radiating plate, a positioning rod is movably connected to the fixed plate, one end of the positioning rod is fixedly connected with a side plate, a third spring is sleeved on the positioning rod, both ends of the third spring are fixedly connected with the side plate and the movable plate, a plurality of positioning grooves are formed in the side wall of the movable plate, and the end of the positioning rod away from the side plate is inserted into one of the positioning grooves.

[0010] Preferably, the adjustable support assembly includes a support plate, four support plates are symmetrically arranged on the bottom surface of the bottom shell, a circular shaft is fixedly connected to the side wall of the support plate, the circular shaft is movably connected with the bottom surface of the bottom shell, and a plurality of mounting holes are formed in the support plate.

[0011] Preferably, the heat conduction groove is arranged in a plurality of S-shaped curves, and the shape of the radiator is the same as that of the heat conduction groove.

[0012] Preferably, the bottom plate and the flat plate are movably connected with fixing bolts near the four corners, and the fixing bolts are in threaded connection with the shell.

[0013] Preferably, a fixing frame is fixedly connected to the front side wall of the bottom plate, an inner groove is formed in the inner cavity side wall of the shell, the fixing frame is arranged in matching with the inner groove, and the fixing frame is inserted into the inner groove.

[0014] Preferably, two handles are symmetrically fixedly connected to the top surface of the shell, and the handles are in inverted L-shaped cross section.

[0015] Compared with the prior art, the present application has at least the following beneficial effects: The first spring can drive the connecting rod to move the connecting plate, so that the heat-conducting plate is attached to the main plate. The second spring can drive the heat-conducting plate to move in accordance with the structure on the main plate, so that the heat-conducting plate is in full contact with the main plate, the efficiency of heat dissipation is improved, the cooling liquid can circulate in the heat-conducting groove when the pump is running, the absorption of heat on the shell is accelerated, the heat on the heat-conducting pipe is absorbed through the contact between the cooling liquid and the heat-conducting pipe, the function of water-cooling heat dissipation is realized, the heat dissipation of the heat dissipation pipe is realized through the heat dissipation plate, various heat dissipation measures are integrated, and the heat dissipation efficiency of the communication equipment is effectively improved. The positioning assembly can position the position of the movable plate, so that the fixing and installation operation of the device is facilitated. The support plates are unfolded under the bottom shell by rotating around the circular shaft. The stable placement and use of the device can be realized through the arrangement of the plurality of support plates. The device can be fixed and installed through the mounting holes in the support plates and fasteners, so that the convenience of installation and the stability of use of the device are improved. The fixing screws can realize the fixing and installation operation of the bottom plate, the flat plate and the shell. The fixing of the bottom plate, the flat plate and the shell can realize the protection of the two sides of the shell, reduce the damage to the main plate in the shell, avoid the entry of impurities, and improve the protection effect. BRIEF DESCRIPTION OF DRAWINGS

[0016] The drawings incorporated herein and forming part of the specification illustrate embodiments of the present disclosure and, together with the specification, further serve to explain the principles of the present disclosure and to enable one skilled in the pertinent art to practice and use the same.

[0017] Figure 1 is a whole front perspective structural schematic diagram of the present application; Figure 2 is a whole side perspective structural schematic diagram of the present application; Figure 3 is an internal cross-sectional perspective structural schematic diagram of the present application; Figure 4 is a schematic view of the three-dimensional structure of the movable plate of the present application; Figure 5 is a schematic view of the three-dimensional structure of the movable heat-conducting component of the present application; Figure 6 is a schematic view of the three-dimensional structure of the front of the shell of the present application; Figure 7 is a schematic view of the three-dimensional structure of the side of the shell of the present application; Figure 8 is a schematic view of the three-dimensional structure of the flat plate of the present application; Figure 9 is a schematic view of the three-dimensional structure of the bottom plate of the present application; Figure 10 is a schematic view of the three-dimensional structure of the heat-dissipating pipe of the present application.

[0018] Reference signs 1, shell; 2, communication host; 3, bottom plate; 4, flat plate; 5, heat-conducting groove; 6, movable heat-conducting component; 7, heat-dissipating pipe; 8, pump; 9, heat-dissipating plate; 10, movable plate; 11, positioning component; 12, bottom shell; 13, adjustable support component; 14, main plate; 15, antenna; 16, plug; 17, heat-conducting pipe; 18, connecting rod; 19, first spring; 20, connecting plate; 21, round rod; 22, round plate; 23, heat-conducting plate; 24, second spring; 25, fixed plate; 26, positioning rod; 27, side plate; 28, third spring; 29, positioning groove; 30, support plate; 31, round shaft; 32, mounting hole; 33, fixed bolt; 34, fixed frame; 35, inner groove; 36, handle.

[0019] As shown in the drawings, in order to clearly realize the structure of the embodiments of the present application, specific structures and devices are marked in the drawings, but this is only for the need of illustration and is not intended to limit the present application in the specific structures, devices and environments, and those skilled in the art can adjust or modify these devices and environments according to specific needs, and the adjustment or modification still falls within the scope of the appended claims. DETAILED DESCRIPTION

[0020] The multifunctional integrated heat-dissipating structure of the low-energy-consumption wireless self-organizing network communication device provided by the present application is described in detail below in combination with the drawings and specific embodiments. It should be noted that, in order to make the embodiments more detailed, the following embodiments are the best and preferred embodiments, and other alternative ways can also be adopted by those skilled in the art to implement some known technologies; and the drawings are only used to more specifically describe the embodiments and are not intended to specifically limit the present application.

[0021] It should be noted that the use of terms such as "an embodiment," "an embodiment," "an exemplary embodiment," and "some embodiments" in the specification indicates that the described embodiment may include a specific feature, structure, or characteristic, but not every embodiment necessarily includes that specific feature, structure, or characteristic. Furthermore, when a specific feature, structure, or characteristic is described in connection with an embodiment, implementing such a feature, structure, or characteristic in conjunction with other embodiments (whether explicitly described or not) should be within the knowledge of those skilled in the art.

[0022] Generally, terms can be understood at least partly from their use in context. For example, depending at least partly on the context, the term "one or more" as used herein can be used to describe any feature, structure, or characteristic in a singular sense, or a combination of features, structures, or characteristics in a plural sense. Additionally, the term "based on" can be understood not necessarily to convey an exclusive set of factors, but rather, alternatively, depending at least partly on the context, to allow for the presence of other factors that are not necessarily explicitly described.

[0023] It is understood that the meanings of “on”, “above” and “above” in this disclosure should be interpreted in the broadest sense, such that “on” means not only “directly on” something, but also includes something with an intermediary feature or layer, and that “above” or “above” means not only “on” something, but also includes something “above” or “above” without an intermediary feature or layer.

[0024] Furthermore, spatially related terms such as “below,” “under,” “lower,” “above,” and “upper” are used herein for convenience to describe the relationship of one element or feature to one or more other elements or features, as illustrated in the accompanying drawings. Spatially related terms are intended to cover different orientations in the use or operation of the device other than those depicted in the accompanying drawings. The device may be oriented in other ways, and the spatially related descriptive terms used herein can be interpreted similarly.

[0025] like Figures 1-10 As shown, an embodiment of the present invention provides a multi-functional integrated heat dissipation structure for a low-power wireless self-organizing network communication device, including a housing 1, a communication host 2 disposed inside the housing 1, the communication host 2 including a motherboard 14, the motherboard 14 being fixedly mounted on the front side wall of a base plate 3, an antenna 15 being fixedly connected to the top surface of the housing 1, and a connector 16 being fixedly connected to the bottom surface of the housing 1. The antenna 15 and the connector 16 are both electrically connected to the motherboard 14, and are connected to external devices through the connector 16. The wireless self-organizing network communication function can be realized through the movement of the antenna 15 and the motherboard 14. Further, the top surface of the shell 1 is symmetrically fixed with two handles 36, which are in inverted L-shaped cross section, facilitating the operation of taking the wireless ad hoc network communication device; The rear side of the shell 1 is mounted with the bottom plate 3 and the rear side is mounted with the flat plate 4, both sides of the flat plate 4 and the shell 1 are provided with two matching heat conduction grooves 5, the heat conduction grooves 5 on the shell 1 are uniformly provided with a plurality of movable heat conduction assemblies 6, the movable heat conduction assembly 6 comprises a heat conduction pipe 17, the heat conduction pipe 17 penetrates the front side wall of the shell 1 and extends into the heat conduction groove 5, the heat conduction pipe 17 is movably connected with a connecting rod 18, the connecting rod 18 is sleeved with a first spring 19, the two ends of the first spring 19 are fixedly connected with the connecting rod 18 and the inner wall of the heat conduction pipe 17, the rear end of the connecting rod 18 is fixedly connected with a connecting plate 20, the connecting plate 20 is movably connected with a plurality of round rods 21, the two ends of the round rod 21 are fixedly connected with a round plate 22 and a heat conduction plate 23, and the round rod 21 is sleeved with a second spring 24, the two ends of the second spring 24 are fixedly connected with the round plate 22 and the connecting plate 20, and the heat conduction plate 23 is tightly arranged on the main plate 14; In the technical solution, when in use, after the main plate 14 is installed, under the elastic force of the first spring 19, the connecting rod 18 drives the connecting plate 20 to move, so that the heat conduction plate 23 is attached to the main plate 14, and under the elastic force of the second spring 24, the heat conduction plate 23 moves in adaptation with the structure on the main plate 14, ensuring sufficient contact between the heat conduction plate 23 and the main plate 14, so that the heat generated by the main plate 14 during operation is efficiently transferred to the heat conduction plate 23, and through the heat transfer of the connecting plate 20, the connecting rod 18 and the heat conduction pipe 17, the heat dissipation efficiency of the main plate 14 can be effectively improved; The bottom plate 3 and the flat plate 4 are movably connected with fixing bolts 33 near the four corners, the fixing bolts 33 are threadedly connected with the shell 1, so as to realize the fixed installation of the bottom plate 3 and the flat plate 4 with the shell 1, and the fixation between the bottom plate 3 and the flat plate 4 and the shell 1 can realize the protection of the two sides of the shell 1, reduce the damage to the main plate 14 in the shell 1, avoid the entry of impurities, and improve the protection effect; The front side wall of the bottom plate 3 is fixedly connected with a fixed frame 34, an inner groove 35 is formed in the side wall of the inner cavity of the shell 1, the fixed frame 34 is matched with the inner groove 35, and the fixed frame 34 is inserted into the inner groove 35, so as to effectively improve the sealing and firmness of the installation between the bottom plate 3 and the shell 1, improve the protection of the internal main plate 14, and have good use effect; The front side wall of the flat plate 4 is symmetrically provided with two heat dissipation pipes 7, the two ends of the heat dissipation pipe 7 are fixedly connected with a pump 8, the pump 8 is throughly arranged with the heat conduction groove 5, a plurality of heat dissipation plates 9 are uniformly distributed and fixedly connected on the two heat dissipation pipes 7, the heat conduction groove 5 is arranged in multiple S-shaped curves, and the heat dissipation pipe 7 is arranged in the same shape as the heat conduction groove 5. In the technical scheme, the heat dissipation pipe 7 is filled with a certain amount of cooling liquid, the cooling liquid is input into the heat conduction groove 5 through the lower pump 8, and the cooling liquid is extracted from the heat conduction groove 5 through the operation of the upper pump 8, so that the cooling liquid can circulate in the heat conduction groove 5, accelerate the absorption of heat on the shell 1, and through the contact of the cooling liquid with the heat conduction pipe 17, the heat on the heat conduction pipe 17 can be absorbed, the water cooling and heat dissipation function is realized, and the heat dissipation efficiency of the communication equipment can be effectively improved through the heat dissipation of the heat dissipation plate 9 on the heat dissipation pipe 7. The two movable plates 10 are symmetrically movably connected on the heat dissipation plate 9, the movable plate 10 is provided with a positioning assembly 11, the positioning assembly 11 comprises a fixed plate 25, the bottom surface of the lowermost heat dissipation plate 9 is fixedly connected with the fixed plate 25, the fixed plate 25 is movably connected with a positioning rod 26, one end of the positioning rod 26 is fixedly connected with a side plate 27, and a third spring 28 is sleeved on the positioning rod 26, the two ends of the third spring 28 are fixedly connected with the side plate 27 and the movable plate 10 respectively, a plurality of positioning grooves 29 are formed in the side wall of the movable plate 10, and the end of the positioning rod 26 away from the side plate 27 is inserted into one of the positioning grooves 29. In the technical scheme, during installation or use, the side plate 27 is pulled to drive the positioning rod 26 to move and the third spring 28 is stretched, at this time, the movable plate 10 can be pulled out from the two sides of the heat dissipation plate 9 to a proper length, then the side plate 27 is released, and under the elastic force of the third spring 28, the positioning rod 26 is inserted into the positioning groove 29, so that the movable plate 10 can be positioned and fixed, which facilitates the connection of the plug-in connector 16 and the installation operation. The bottom surface of the two movable plates 10 is fixedly connected with the same bottom shell 12, the bottom surface of the bottom shell 12 is provided with an adjustable supporting assembly 13, the adjustable supporting assembly 13 comprises a supporting plate 30, four supporting plates 30 are symmetrically arranged on the bottom surface of the bottom shell 12, a circular shaft 31 is fixedly connected to the side wall of the supporting plate 30, the circular shaft 31 is movably connected to the bottom surface of the bottom shell 12, and a plurality of mounting holes 32 are formed in the supporting plate 30. In the technical scheme, during installation or use, the supporting plate 30 is rotated around the circular shaft 31 to expand the supporting plate 30 under the bottom shell 12, the plurality of supporting plates 30 can be used to stably place and use the device, and the mounting holes 32 in the supporting plate 30 can be locked by fasteners, so that the device can be conveniently fixed and installed, and the convenience of installation and the stability of use of the device are improved.

[0026] The present application encompasses any alternatives, modifications, equivalent methods and solutions made to the spirit and scope of the present application. In order to make the public have a thorough understanding of the present application, specific details are described in the following preferred embodiments of the present application, and the present application can also be completely understood without the description of these details to those skilled in the art. In addition, in order to avoid unnecessary confusion to the essence of the present application, well-known methods, processes, procedures, elements and circuits, etc. are not described in detail.

[0027] Those skilled in the art can understand that all or part of the steps in the above-mentioned embodiment methods can be completed by programs instructing the relevant hardware, and the programs can be stored in computer-readable storage media, such as ROM / RAM, magnetic disc, optical disc, etc.

[0028] The above is only the preferred embodiment of the present application, and it should be pointed out that for those skilled in the art, without departing from the principles of the present application, a number of improvements and refinements can also be made, and these improvements and refinements should also be considered as the protection scope of the present application.

Claims

1. A multi-functional integrated heat dissipation structure for a low-power wireless self-organizing network communication device, comprising a housing (1), characterized in that, The housing (1) is equipped with a communication host (2). A base plate (3) is installed on the rear side of the housing (1) and a flat plate (4) is installed on the rear side. Two matching heat conduction grooves (5) are opened on the side of the flat plate (4) and the housing (1) facing each other. Several movable heat conduction components (6) are evenly distributed in the heat conduction grooves (5) on the housing (1). Two heat dissipation pipes (7) are symmetrically arranged on the front side wall of the flat plate (4). Pumps (8) are fixedly connected to both ends of the heat dissipation pipes (7). The pumps (8) are connected to the heat conduction grooves (5). Several heat dissipation plates (9) are evenly distributed and fixedly connected on the two heat dissipation pipes (7). Two movable plates (10) are symmetrically connected to the heat dissipation plates (9). Positioning components (11) are provided on the movable plates (10). The same bottom shell (12) is fixedly connected to the bottom surface of the two movable plates (10). An adjustable support component (13) is provided on the bottom surface of the bottom shell (12).

2. The multi-functional integrated heat dissipation structure for a low-power wireless self-organizing network communication device according to claim 1, characterized in that, The communication host (2) includes a motherboard (14), which is fixedly installed on the front side wall of the base plate (3). An antenna (15) is fixedly connected to the top surface of the housing (1), and a connector (16) is fixedly connected to the bottom surface of the housing (1). The antenna (15) and the connector (16) are both electrically connected to the motherboard (14).

3. The multi-functional integrated heat dissipation structure for a low-power wireless self-organizing network communication device according to claim 2, characterized in that, The active heat-conducting component (6) includes a heat-conducting pipe (17), which penetrates the front side wall of the housing (1) and extends into the heat-conducting groove (5). A connecting rod (18) is movably connected inside the heat-conducting pipe (17), and a first spring (19) is sleeved on the connecting rod (18). The two ends of the first spring (19) are fixedly connected to the connecting rod (18) and the inner wall of the heat-conducting pipe (17), respectively.

4. The multi-functional integrated heat dissipation structure for a low-power wireless self-organizing network communication device according to claim 3, characterized in that, The rear end of the connecting rod (18) is fixedly connected to a connecting plate (20). Several round rods (21) are movably connected to the connecting plate (20). The two ends of the round rods (21) are respectively fixedly connected to a round plate (22) and a heat-conducting plate (23). A second spring (24) is sleeved on the round rods (21). The two ends of the second spring (24) are respectively fixedly connected to the round plate (22) and the connecting plate (20). The heat-conducting plate (23) is pressed against the main plate (14).

5. The multi-functional integrated heat dissipation structure for a low-power wireless self-organizing network communication device according to claim 4, characterized in that, The positioning component (11) includes a fixed plate (25). The fixed plate (25) is fixedly connected to the bottom surface of the bottom heat sink (9). A positioning rod (26) is movably connected to the fixed plate (25). One end of the positioning rod (26) is fixedly connected to a side plate (27). A third spring (28) is sleeved on the positioning rod (26). The two ends of the third spring (28) are fixedly connected to the side plate (27) and the movable plate (10) respectively. Several positioning slots (29) are opened on the side wall of the movable plate (10). The end of the positioning rod (26) away from the side plate (27) is inserted into one of the positioning slots (29).

6. The multi-functional integrated heat dissipation structure for a low-power wireless self-organizing network communication device according to claim 5, characterized in that, The adjustable support assembly (13) includes a support plate (30). Four support plates (30) are symmetrically arranged on the bottom surface of the bottom shell (12). A round shaft (31) is fixedly connected to the side wall of the support plate (30). The round shaft (31) is movably connected to the bottom surface of the bottom shell (12). Several mounting holes (32) are opened on the support plate (30).

7. The multi-functional integrated heat dissipation structure for a low-power wireless self-organizing network communication device according to claim 6, characterized in that, The heat conduction groove (5) is arranged in a multi-segment S-shaped bend, and the heat dissipation pipe (7) is arranged in the same shape as the heat conduction groove (5).

8. The multi-functional integrated heat dissipation structure for a low-power wireless self-organizing network communication device according to claim 7, characterized in that, The base plate (3) and the flat plate (4) are movably connected to the four corners with fixing bolts (33), and the fixing bolts (33) are threaded to the shell (1).

9. The multi-functional integrated heat dissipation structure for a low-power wireless self-organizing network communication device according to claim 8, characterized in that, A fixing frame (34) is fixedly connected to the front side wall of the base plate (3), and an inner groove (35) is provided on the inner side wall of the housing (1). The fixing frame (34) is matched with the inner groove (35), and the fixing frame (34) is inserted into the inner groove (35).

10. The multi-functional integrated heat dissipation structure of a low-power wireless self-organizing network communication device according to claim 9, characterized in that, Two handles (36) are symmetrically fixedly connected to the top surface of the housing (1), and the handles (36) have an inverted L-shaped cross section.

Images