A bonding wire and light emitting device

Abstract

The application relates to the technical field of light-emitting devices, and discloses a bonding wire and a light-emitting device, wherein the bonding wire comprises a conductive first part and a conductive second part; the second part has a containing cavity, and an end of the second part away from the first part is electrically connected with a circuit on a substrate; a first end of the first part is limited in the containing cavity and is electrically connected with an inner side wall of the second part, and a second end is electrically connected with a light-emitting chip; the first part is configured to move in the containing cavity when the sealing glue or the lens expands or shrinks, and is always electrically connected with the second part. The first part and the second part of the bonding wire are movably connected, when the sealing glue of the light-emitting device expands or shrinks to drive the sealed bonding wire to stretch or shrink, since the first part and the second part are not physically fixedly connected, stress can be released at the electrically connected position of the first part and the second part, so that the problem of bonding wire breakage caused by the expansion and shrinkage of the sealing glue is avoided.

Description

Technical Field

[0001] This invention relates to the field of light-emitting device technology, and specifically to a bonding wire and a light-emitting device. Background Technology

[0002] A light-emitting diode (LED) device generally includes a substrate, a light-emitting chip on the substrate, bonding wires, and sealant. The bonding wires are used to conduct electricity between the light-emitting chip and the positive and / or negative circuits on the substrate, and the sealant is used to seal the bonding wires to prevent external moisture from corroding them.

[0003] When LED light-emitting devices are placed in the external environment and there is a large temperature difference between day and night, the sealant may expand and contract with the temperature, which will also cause the bonded wires to stretch and contract. Since the thermal expansion coefficient of the bonded wires is less than that of the sealant, stress will be concentrated on the bonded wires during the thermal expansion and contraction process. Long-term stretching and contraction can easily lead to the breakage of the bonded wires, which in turn leads to the failure of the light-emitting device. Summary of the Invention

[0004] In view of this, the present invention provides a bonding wire and a light-emitting device to solve the problem that the bonding wire breaks during thermal expansion and contraction, which leads to the failure of the light-emitting device.

[0005] In a first aspect, the present invention provides a bonding wire comprising a conductive first portion and a conductive second portion; the second portion having a receiving cavity, the end of the second portion away from the first portion being electrically connected to a circuit on a substrate; the first portion having a first end confined within the receiving cavity and electrically connected to the inner sidewall of the second portion, and a second end electrically connected to a light-emitting chip; the first portion being configured such that, during thermal expansion and contraction of the sealant or lens, the first end moves within the receiving cavity and remains electrically connected to the second portion.

[0006] The bonding wire provided by this invention includes a first portion and a second portion that are movably connected. The first end of the first portion is confined within a receiving cavity. When the sealant or lens of the light-emitting device expands or contracts, causing the sealed bonding wire to stretch and contract, since the first portion and the second portion do not form a physically fixed connection, the stress will be released at the electrical connection point between the first portion and the second portion. Moreover, when there is relative movement between the first portion and the second portion, the electrical connection between the first portion and the second portion can still be maintained, which will not cause the light-emitting device to fail. This reduces the probability of the bonding wire breaking due to expansion and contraction, and improves the reliability of the light-emitting device.

[0007] In one alternative embodiment, a groove is provided on the inner wall of the second section, and the first end moves within the groove when the sealant or lens expands or contracts due to heat.

[0008] In this embodiment, by setting a groove on the inner sidewall of the second part, the movement trajectory of the first part can be accurately guided, so that the first part and the second part maintain a relatively stable and reliable electrical connection during the movement.

[0009] In one alternative embodiment, a conductive spring structure is provided on the inner sidewall of the second portion, the spring structure electrically connecting the first end of the first portion and the second portion.

[0010] In this embodiment, during the movement of the first part relative to the second part, the spring structure continuously applies an elastic force to the first part. By utilizing the elastic deformation of the spring structure to generate continuous and controllable pressure, the first end of the first part and the sleeve can be reliably electrically connected, so that the first part and the second part maintain a relatively stable and reliable electrical connection during the movement.

[0011] In one alternative implementation, the preset area of ​​the first segment is curved.

[0012] In this embodiment, the bending design can buffer the expansion and contraction of the bond wire, so that the stress generated by thermal expansion and contraction is no longer concentrated at one point, but is evenly distributed along the bending area, reducing the risk of bond wire breakage.

[0013] In one alternative implementation, the first section is a linear structure or a tubular structure.

[0014] In this embodiment, the hollow structure enhances the flexibility of the tubular bonding wire, allowing it to absorb stress through greater bending deformation when the sealant or lens expands or contracts, further reducing the risk of bonding wire breakage.

[0015] In a second aspect, the present invention also provides a light-emitting device, including a substrate, a light-emitting chip, and bonding wires provided in any of the first aspects; the light-emitting chip is located on the substrate, a circuit is disposed on the substrate, and the light-emitting chip is electrically connected to the circuit through the bonding wires.

[0016] In one alternative embodiment, the light-emitting device further includes a lens that encapsulates the light-emitting chip and bonding wires, and the lens is used to shape the light beam formed by the light-emitting chip.

[0017] In one alternative embodiment, the light-emitting device further includes a lens and a sealant; the sealant encapsulates the light-emitting chip and the bonding wire, and the lens encapsulates the sealant, the lens being used to shape the light beam formed by the light-emitting chip.

[0018] In one alternative embodiment, the lens has a cavity structure located above the light-emitting chip, and the cavity structure is used to adjust the emission direction of the light beam.

[0019] In one alternative embodiment, a light-emitting structure is provided on the light-emitting surface of the light-emitting chip. The light-emitting structure is located inside the cavity structure and is used to focus the light beam. Attached Figure Description

[0020] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0021] Figure 1 This is a schematic diagram of the structure of a common light-emitting device;

[0022] Figure 2 This is a schematic diagram of the structure of a bonding wire according to an embodiment of the present invention;

[0023] Figure 3 This is a schematic diagram showing the position of the first part relative to the second part before and after the movement according to an embodiment of the present invention;

[0024] Figure 4 This is a schematic diagram of another bonding wire structure according to an embodiment of the present invention;

[0025] Figure 5 This is a schematic diagram of another bonding wire structure according to an embodiment of the present invention;

[0026] Figure 6 This is a schematic diagram of another bonding wire structure according to an embodiment of the present invention;

[0027] Figure 7 This is a schematic diagram of the structure of the first light-emitting device according to an embodiment of the present invention;

[0028] Figure 8 This is a schematic diagram of the structure of a second type of light-emitting device according to an embodiment of the present invention;

[0029] Figure 9 This is a schematic diagram of the structure of a third type of light-emitting device according to an embodiment of the present invention;

[0030] Figure 10 This is a schematic diagram of the structure of the fourth type of light-emitting device according to an embodiment of the present invention;

[0031] Figure 11 This is a schematic diagram of the structure of the fifth type of light-emitting device according to an embodiment of the present invention.

[0032] Explanation of reference numerals in the attached figures:

[0033] 110. Substrate; 120. Light-emitting chip; 130. Bonding wire; 131. First section; 132. Second section; 1321. Receiving cavity; 1322. Slide groove; 1323. Spring structure; 140. Sealant; 150. Lens; 151. Cavity structure; 160. Concentrating structure. Detailed Implementation

[0034] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0035] LED light-emitting devices are solid-state light sources based on the electroluminescence effect of semiconductor PN junctions. They have significant advantages such as high efficiency, energy saving, long life and environmental protection, and have been widely used in many fields such as lighting, display, backlighting, and sensing.

[0036] like Figure 1 As shown, the LED light-emitting device may include a substrate 110, a light-emitting chip 120 located on the substrate 110, a bonding wire 130, a sealant 140, and a lens 150. The bonding wire 130 conducts the positive and / or negative circuits on the light-emitting chip 120 and the substrate 110, and the sealant 140 can prevent external moisture from corroding the bonding wire 130.

[0037] When an LED light-emitting device is placed in an external environment, the sealant 140 may expand during the day and shrink at night due to temperature changes. As mentioned in the background section, during prolonged thermal expansion and contraction, stress will concentrate on the bonding wire 130, which may cause the bonding wire 130 to break, leading to the failure of the light-emitting device.

[0038] In view of this, the present invention provides a bonding wire and a light-emitting device. The bonding wire includes a first portion and a second portion, which are movably connected. When the sealant of the light-emitting device expands and contracts, causing the sealed bonding wire to stretch and contract, since the first portion and the second portion do not form a physical fixed connection, the stress can be released at the electrical connection point between the first portion and the second portion, thereby avoiding the bonding wire breakage problem caused by the expansion and contraction of the sealant and improving the reliability of the light-emitting device.

[0039] The bonding wire provided by this invention can be applied to light-emitting devices or other products that use sealant and bonding wire and are prone to breakage due to expansion and contraction.

[0040] The following is combined Figures 2 to 11The following describes embodiments of the present invention.

[0041] According to an embodiment of the present invention, in one aspect, a bonding wire is provided, such as... Figure 2 As shown, the bonding wire 130 provided by the present invention includes a conductive first portion 131 and a conductive second portion 132, that is, the materials of the first portion 131 and the second portion 132 can be copper, silver or other metal materials.

[0042] The second portion 132 has a receiving cavity 1321, and one end of the second portion away from the first portion is electrically connected to a circuit on the substrate. A first end of the first portion 131 is confined within the receiving cavity 1321 and electrically connected to the inner wall of the second portion 132, while a second end is electrically connected to a light-emitting chip. The first portion 131 is configured such that, during thermal expansion and contraction of the sealant or lens, the first end moves within the receiving cavity 1321 while remaining electrically connected to the second portion 132.

[0043] Specifically, such as Figure 2 As shown, the second portion 132 has a sleeve-type structure, with a hollow internal area serving as a receiving cavity 1321. The first portion 131 is fitted inside the sleeve of the second portion 132, and the first portion 131 and the second portion 132 are dynamically electrically connected. That is, when the sealant or lens expands or contracts, it causes the sealed bonding wire 130 to stretch and contract, resulting in relative movement between the first portion 131 and the second portion 132. During this movement, the first portion 131 and the second portion 132 maintain an electrical connection at all times.

[0044] The first portion 131 and the second portion 132 can be electrical connections between points and lines, points and surfaces, or lines and lines, lines and surfaces, or surfaces that can move relative to each other. Specifically, a point, a line segment, or a surface on the first portion 131 can form a relatively movable electrical connection with a line segment or a surface on the second portion 132. The end of the first portion 131 away from the second portion 132 (i.e., the second end) is the first solder point A, and the end of the second portion 132 away from the first portion 131 is the second solder point B. The first portion 131 and the second portion 132 are electrically connected at position C, which can be a point, a line, or a surface. Through the first solder point A, the bonding wire 130 is soldered to the electrode of the light-emitting chip, and through the second solder point B, the bonding wire 130 is soldered to the pad of the substrate, forming a current path of the light-emitting chip electrode-bonding wire-substrate circuit, ensuring a stable input of power from the external power supply to the light-emitting chip.

[0045] It should be understood that Figure 2Taking a circular cross-sectional shape as an example, but not limited to this, the cross-sectional shape of the sleeve-type structure can also be rectangular, elliptical, hexagonal, or other shapes. When the sealant or lens expands or contracts, the relative movement between the first portion 131 and the second portion 132 may be multidirectional, and the circular cross-section can better accommodate the movement of the first end.

[0046] Figure 3 The dynamic process of the first part 131 moving relative to the second part 132 is shown, such as... Figure 3 As shown, when the bonding wire 130 contracts, the first portion 131 changes from a solid line to a dashed line, and the electrical connection between the first portion 131 and the second portion 132 also moves from the first position C1 to the second position C2. Typically, the first position C1 and the second position C2 are different positions. A portion of the structure of the first portion 131 moves relative to the second portion 132, and the first portion 131 and the second portion 132 remain electrically connected during this movement. It should be understood that the first position C1 and the second position C2 are not limited to a single point; they can be a point, a line, or a surface.

[0047] The bonding wire provided by the present invention includes a first portion 131 and a second portion 132 that are movably connected. The first end of the first portion 131 is located within the receiving cavity 1321. When the sealant or lens of the light-emitting device expands or contracts, causing the sealed bonding wire to stretch and contract, since the first portion 131 and the second portion 132 do not form a physical fixed connection, the stress will be released at the electrical connection point between the first portion 131 and the second portion 132. Moreover, when there is relative movement between the first portion 131 and the second portion 132, the electrical connection between the first portion 131 and the second portion 132 can still be maintained, which will not cause the light-emitting device to fail. This reduces the probability of the bonding wire breaking due to expansion and contraction and improves the reliability of the light-emitting device.

[0048] The first end of the first portion 131 is confined within the receiving cavity 1321. This application does not specifically limit the confining method, as long as it can ensure that the first end does not come out of the second portion 132 when the sealant or lens expands or contracts with heat, and always maintains an electrical connection with the second portion 132.

[0049] In some alternative embodiments, such as Figure 4 As shown, a groove 1322 is provided on the inner side wall of the second part 132, and the first end of the first part 131 is limited in the groove 1322. When the sealant or lens expands or contracts due to heat, the first end moves in the groove 1322.

[0050] Specifically, before the bonding line 130 contracts, the first portion 131 is located Figure 4As shown by the solid line, the electrical connection point between the first portion 131 and the second portion 132 is C1. When the sealant or lens shrinks, causing the bonding wire to shrink, the first end of the first portion 131 moves along the groove 1322, and the final position of the first portion 131 may change to... Figure 4 At the position indicated by the dashed line, the electrical connection position of the first part 131 and the second part 132 is also changed to C2.

[0051] In this embodiment, by providing a groove 1322 on the inner sidewall of the second part 132, the movement trajectory of the first part 131 can be accurately guided, so that the first part 131 and the second part 132 maintain a relatively stable and reliable electrical connection during the movement.

[0052] Furthermore, a conductive slider (not shown in the figure) can also be provided in the groove 1322. The first end of the first part 131 is welded and fixed to the slider. When the sealant or lens expands and contracts due to heat, the first part 131 is subjected to external force. Under the action of external force, the first end drives the slider to move in the groove 1322.

[0053] In this embodiment, by introducing a conductive slider, the contact area of ​​the first part 131 and the second part 132 can be increased, further ensuring that the first part 131 and the second part 132 maintain a relatively stable and reliable electrical connection during movement.

[0054] For example, the conductive slider may be made of materials such as copper, silver-plated copper, or elastic alloy.

[0055] In other embodiments, the second portion of the bonding wire may also include a positioning pin structure, which limits the first end of the first portion 131 to prevent the first end from coming out of the receiving cavity 1321 when the first portion moves, so that the first portion 131 and the second portion 132 maintain a relatively stable and reliable electrical connection during the movement.

[0056] In other implementations, such as Figure 5 As shown, a conductive spring structure 1323 is provided on the inner wall of the second part 132, and the spring structure 1323 electrically connects the first end of the first part 131 and the sleeve.

[0057] The conductive spring structure 1323 is a conductive metal component with elastic deformation capability. The spring structure can be a commonly used spring structure in the mechanical field, and its size and receiving cavity are adapted. During the movement of the first part 131 relative to the second part 132, the spring structure 1323 continuously applies an elastic force to the first part 131. By utilizing the elastic deformation of the spring structure to generate continuous and controllable pressure, the first end of the first part 131 and the sleeve can be reliably electrically connected.

[0058] Specifically, the first portion 131 can be electrically connected to the inner wall of the sleeve via a spring-loaded structure 1323, whereby the spring-loaded structure 1323 is fixed to the inner wall of the sleeve, and the first end of the first portion 131 abuts against the spring-loaded structure 1323. Alternatively, the spring-loaded structure 1323 can provide elastic force to the first portion 131, causing the first end of the first portion 131 to directly and stably abut against the inner wall of the sleeve.

[0059] Specifically, when the sealant or lens expands or contracts, causing the first section 131 to move, the contact point between the spring structure 1323 and the first section 131 will move synchronously with the first section. Since the spring is elastic, its contact end can undergo slight deformation with the movement of the first section (such as slight stretching or compression of the spring), always maintaining close contact with the first section, neither hindering the movement nor losing the limiting function, so that the first section 131 and the second section 132 maintain a relatively stable and reliable electrical connection state during the movement.

[0060] Optionally, the preset area of ​​the first section 131 is curved. The preset area can be the middle area of ​​the first section 131 or the thinnest area of ​​the first section 131.

[0061] In this embodiment, the bending design can buffer the expansion and contraction of the bond wire, so that the stress generated by thermal expansion and contraction is no longer concentrated at one point, but is evenly distributed along the bending area, reducing the risk of bond wire breakage.

[0062] For example, the bending shape of the first portion 131 in the preset area can be an arc, an S-shape, or a U-shape. The continuous curvature of the arc allows stress to be transmitted evenly along the arc, with a smooth transition from the straight segment to the arc, without any stress abrupt changes caused by sharp angles. The S-shape buffers both tensile and compressive stresses through two opposite bends. When the bond line elongates due to heat, the first half of the arc of the S-shape expands; when it contracts due to cold, the second half of the arc tightens, thus dispersing stress in both directions.

[0063] In some alternative embodiments, the first portion may be Figures 2 to 5 The linear structure shown can also be as follows: Figure 6 The tubular structure shown.

[0064] The first section being a linear structure means that the first section is a solid metal wire, made of a single metal or alloy material (such as gold, copper, or palladium-plated copper), and the cross-section is mostly circular. The first section being a tubular structure means that the first section is a hollow metal tube, made of rolled or electroplated metal material, and the cross-section is annular (with a hollow channel inside).

[0065] In this embodiment, the hollow structure enhances the flexibility of the tubular bonding wire, allowing it to absorb stress through greater bending deformation when the sealant or lens expands or contracts, further reducing the risk of bonding wire breakage.

[0066] According to an embodiment of the present invention, another aspect provides a light-emitting device, which includes a substrate 110, a light-emitting chip 120, and a bonding wire 130 provided in any of the above embodiments.

[0067] The light-emitting chip 120 is located on the substrate 110, and the substrate 110 is provided with circuits. The light-emitting chip 120 is electrically connected to the circuits through bonding wires 130.

[0068] Specifically, the light-emitting chip 120 is fixedly disposed on the surface of the substrate 110 by conductive adhesive or welding process. The surface of the substrate 110 is printed with metal circuits (such as copper or silver paste lines). One end is connected to the electrode of the light-emitting chip 120 through bonding wire 130, and the other end is connected to the power supply through external pins or solder joints, forming a complete current loop to power the light-emitting chip 120.

[0069] In some embodiments, such as Figure 7 As shown, the light-emitting device includes a substrate 110, a light-emitting chip 120, a bonding wire 130 provided in any of the above embodiments, and a lens 150. The lens 150 encapsulates the light-emitting chip 120 and the bonding wire 130, and is used to shape the light beam formed by the light-emitting chip 120. In this embodiment, the lens 150 seals the light-emitting chip 120 and the bonding wire 130 to prevent external moisture from corroding the bonding wire 130.

[0070] Specifically, the light-emitting chip 120 can be an LED chip. The light emitted from the light-emitting chip 120 is usually divergent and irregular, which makes it difficult to directly meet the needs of lighting, display and other scenarios. By setting the lens 150, the propagation direction, angle and spot shape of the light beam formed by the light-emitting chip 120 can be adjusted.

[0071] By changing the geometry of the lens, the direction of light propagation can be altered. By frosting or texturing the lens surface, direct glare can be reduced, resulting in a more uniform brightness distribution of the emitted light spot.

[0072] For example, the material of lens 150 may be polycarbonate (PC) or polymethyl methacrylate (PMMA), etc.

[0073] In some embodiments, such as Figure 8 As shown, the light-emitting device includes a substrate 110, a light-emitting chip 120, a bonding wire 130 provided in any of the above embodiments, a sealant 140, and a lens 150. The sealant 140 encapsulates the light-emitting chip 120 and the bonding wire 130, and the lens 150 encapsulates the sealant 140. The lens 150 is used to shape the light beam formed by the light-emitting chip 120.

[0074] Specifically, the sealant 140 can be transparent silicone, epoxy resin, or other transparent insulating materials. The sealant 140 completely encapsulates the light-emitting chip 120 and the bonding wire 130, which can prevent moisture from seeping in and causing oxidation of the chip electrodes and corrosion of the bonding wires. It can also prevent dust from adhering to the chip surface and blocking light, or from entering the circuit and causing a short circuit.

[0075] In some embodiments, such as Figure 9 As shown, the lens 150 has a cavity structure 151, which is located above the light-emitting chip 120. The cavity structure 151 is used to adjust the emission direction of the light beam.

[0076] Specifically, the cavity structure 151 is the hollow region inside the lens 150. By setting the cavity structure 151 in the lens, the divergent light emitted by the light-emitting chip 120 can be converted into a beam of light in the target direction through the synergistic effect of total internal reflection and refraction by utilizing the difference in refractive index between air and lens materials.

[0077] Optionally, such as Figure 10 or Figure 11 As shown, a light-emitting structure 160 is provided on the light-emitting surface of the light-emitting chip 120. The light-emitting structure 160 is located inside the cavity structure and is used to focus the light beam.

[0078] In some embodiments, the light-emitting surface of the light-emitting chip 120 may also be covered with a resin layer containing phosphor, which can change the wavelength of light, that is, change the color of the light beam emitted by the light-emitting chip.

[0079] Specifically, phosphors are a class of inorganic / organic materials with photoluminescence properties. Phosphors can absorb short-wavelength light emitted by the light-emitting chip and convert it into long-wavelength light. Then, by mixing the chip light and the phosphor light, the color of LED light emission can be controlled (such as from monochromatic light to white light, from blue light to green light, etc.).

[0080] In the description of this specification, the references to terms such as "this embodiment," "an embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0081] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0082] The above description does not provide detailed explanations of the technical aspects of each layer's patterning and etching. However, those skilled in the art should understand that various technical means can be used to form layers and regions of the desired shape. Furthermore, to form the same structure, those skilled in the art can also design methods that are not entirely identical to those described above. Additionally, although various embodiments have been described above, this does not mean that the measures in the various embodiments cannot be effectively combined.

[0083] The above description is merely a preferred embodiment of the present invention and the technical principles employed. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described above, and various obvious changes, readjustments, combinations, and substitutions can be made without departing from the scope of protection of the present invention.

[0084] Although embodiments of the invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the invention, and such modifications and variations all fall within the scope defined by the appended claims.

Claims

1. A bonding wire, characterized by, The first part and the second part are electrically conductive. The second part has a receiving cavity, and an end of the second part away from the first part is electrically connected to a circuit on a substrate. The first part has a first end located in the receiving cavity and electrically connected to an inner side wall of the second part, and a second end electrically connected to the light emitting chip. The first part is configured to move within the receiving cavity while the first end is always electrically connected to the second part when the sealant or the lens expands or shrinks.

2. The bonding wire according to claim 1, wherein An inner side wall of the second part is provided with a sliding groove, and the first end moves within the sliding groove when the sealant or the lens expands or shrinks.

3. The bonding wire of claim 1, wherein An inner side wall of the second part is provided with an electrically conductive spring structure, and the spring structure electrically connects the first end of the first part and the second part.

4. The bonding wire according to any one of claims 1 to 3, wherein A preset area of the first part is curved.

5. The bonding wire according to any one of claims 1 to 3, wherein The first part is in a linear structure or a tubular structure.

6. A light emitting device, characterized by The light emitting device further comprises a lens, and the lens encapsulates the light emitting chip and the bonding wire. The light emitting chip is located on the substrate, and the substrate is provided with a circuit, and the light emitting chip is electrically connected to the circuit through the bonding wire.

7. The light emitting device of claim 6, wherein, The light emitting device further comprises a lens, and the lens encapsulates the light emitting chip and the bonding wire.

8. The light emitting device of claim 6, wherein, The light emitting device further comprises a lens and a sealant. The sealant encapsulates the light emitting chip and the bonding wire, and the lens encapsulates the sealant.

9. The light emitting device according to claim 7 or 8, characterized in that, The lens has a cavity structure located above the light emitting chip, and the cavity structure is used to adjust the emission direction of the light beam.

10. The light emitting device of claim 9, wherein, The light emitting surface of the light emitting chip is provided with a light collecting structure located in the cavity structure, and the light collecting structure is used to perform light collecting processing on the light beam. The light emitting surface of the light emitting chip is provided with a light collecting structure located in the cavity structure, and the light collecting structure is used to perform light collecting processing on the light beam.

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