Four-coaxial cable with wafer insulation shift contact connection

Abstract

The invention provides a tail end assembly of an electric connector. The tail end assembly comprises a cable and a coupling assembly. The cable includes a plurality of conductive wires. The coupling assembly defines an internal pitch and is coupled to the cable such that the conductive wire extends through the internal pitch. The coupling assembly is configured to detachably couple the tail end assembly to the electrical connector.

Description

[0001] Cross-citation of related applications

[0002] This application claims the benefit of U.S. Application No. 63 / 480,748, filed January 20, 2023, which is incorporated herein by reference in its entirety. Background Technology

[0003] High-speed electrical connectors transmit high-speed signals with low loss. These connectors can be used to transmit and receive various types of data, such as data relevant to defense and commercial applications. In some applications, these high-speed connectors are mounted to printed circuit boards and establish electrical connections with their circuit traces. However, the fabrication of these high-speed data connectors can be expensive and time-consuming, especially due to their high cycle times. Summary of the Invention

[0004] According to a non-limiting embodiment, the cable assembly includes an electrical connector and a tail assembly. The electrical connector includes a connector housing defining an internal region. The connector housing extends from a mating interface end defining a mating interface opening to a cable interface end defining a cable interface opening. The tail assembly is configured to couple to an IDC chip adapter assembly comprising a plurality of IDC chips. The tail assembly is configured to be detachably coupled to the cable interface end.

[0005] In addition to one or more features described above, or as an alternative, in another embodiment, the coupling assembly further includes a first mating portion and a second mating portion, the first mating portion being coupled to the cable, and the second mating portion being configured to couple the first mating portion to the electrical connector.

[0006] In addition to one or more features described above, or as an alternative, in another embodiment, the first mating portion includes a bushing coupled to the cable, and wherein the second mating portion includes a ferrule assembly coupled to the bushing.

[0007] In addition to one or more features described above, or as an alternative, in another embodiment, the bushing includes a bushing body having bushing threads configured to mate with connector threads on the electrical connector to detachably couple the bushing to the electrical connector.

[0008] In addition to one or more features described above, or as an alternative, in another embodiment, the ferrule assembly includes: a rear ferrule coupled to the bushing and configured to receive the cable; and a front ferrule coupled to the rear ferrule and configured to deliver the conductive wire to the electrical connector.

[0009] In addition to one or more features described above, or as an alternative, in another embodiment, the cable includes a cable braid covering the conductive wires and a cable sheath covering the cable braid.

[0010] In addition to one or more features described above, or as an alternative, in another embodiment, the cable braid includes a folded portion disposed on the upper surface of the cable sheath and sandwiched between the outer surface of the rear ferrule and the inner surface of the front ferrule.

[0011] In addition to one or more features described above, or as an alternative, in another embodiment, the tail assembly includes: a cable comprising a plurality of conductive wires; and a coupling assembly defining an internal spacing and coupling to the cable such that the conductive wires extend through the internal spacing. The coupling assembly is configured to detachably couple the tail assembly to the electrical connector.

[0012] In addition to one or more features described above, or as an alternative, in another embodiment, the coupling assembly further includes a first mating portion and a second mating portion, the first mating portion being coupled to the cable, and the second mating portion being configured to couple the first mating portion to the electrical connector.

[0013] In addition to one or more features described above, or as an alternative, in another embodiment, the first mating portion includes a bushing coupled to the cable, and wherein the second mating portion includes a ferrule assembly coupled to the bushing.

[0014] In addition to one or more features described above, or as an alternative, in another embodiment, the bushing includes a bushing body having bushing threads configured to mate with connector threads on the electrical connector to detachably couple the bushing to the electrical connector.

[0015] In addition to one or more features described above, or as an alternative, in another embodiment, the ferrule assembly includes: a rear ferrule coupled to the bushing and configured to receive the cable; and a front ferrule coupled to the rear ferrule and configured to deliver the conductive wire to the electrical connector.

[0016] In addition to one or more features described above, or as an alternative, in another embodiment, the cable includes a cable braid covering the conductive wires and a cable sheath covering the cable braid.

[0017] In addition to one or more features described above, or as an alternative, in another embodiment, the cable braid includes a folded portion disposed on the upper surface of the cable sheath and sandwiched between the outer surface of the rear ferrule and the inner surface of the front ferrule.

[0018] According to another non-limiting embodiment, the tail assembly of the electrical connector includes a cable and a coupling assembly. The cable includes multiple conductive wires. The coupling assembly defines an internal spacing and couples to the cable such that the conductive wires extend through the internal spacing. The coupling assembly is configured to detachably couple the tail assembly to the electrical connector.

[0019] Additional technical features and benefits are achieved through the technology disclosed herein. Embodiments and aspects of this disclosure are described in detail herein. For a better understanding, please refer to the detailed description and the accompanying drawings. Attached Figure Description

[0020] The foregoing and other features of the embodiments will become apparent from the following detailed description taken in conjunction with the accompanying drawings, wherein:

[0021] Figure 1A This is a perspective view of a cable assembly according to a non-limiting embodiment of the present disclosure;

[0022] Figure 1B This is a non-limiting embodiment according to the present disclosure. Figure 1A Disassembled view of the cable assembly shown;

[0023] Figure 1C This is a non-limiting embodiment according to the present disclosure. Figure 1B The cross-sectional view of the front connector included in the cable assembly shown is taken along line 1-1;

[0024] Figure 2A This is a non-limiting embodiment according to the present disclosure. Figure 1B A perspective view of the tail assembly included in the cable assembly shown;

[0025] Figure 2B This is a non-limiting embodiment according to the present disclosure. Figure 2A The cross-sectional view of the tail assembly shown is taken along line 2-2;

[0026] Figure 3 An assembly method according to a non-limiting embodiment of the present disclosure is shown. Figure 2A The process diagram of the coupling assembly included in the tail assembly shown;

[0027] Figure 4AThis is a schematic diagram of an assembled IDC chip adapter assembly according to a non-limiting embodiment of the present disclosure;

[0028] Figure 4B This is a non-limiting embodiment according to the present disclosure. Figure 4A The cross-sectional view of the IDC chip adapter assembly shown is taken along line 3-3;

[0029] Figure 4C This is a non-limiting embodiment according to the present disclosure. Figure 4A The cross-sectional view of the IDC chip adapter assembly shown is taken along line 4-4.

[0030] Figure 4D This is a non-limiting embodiment according to the present disclosure. Figure 4A The disassembled view of the IDC chip adapter assembly shown;

[0031] Figure 4E This is a non-limiting embodiment according to the present disclosure. Figure 4D The diagram shows a pre-assembled view of the cable management unit included in the IDC chip adapter assembly;

[0032] Figure 4F A non-limiting embodiment according to the present disclosure is depicted. Figure 4E The cable organizer shown has the adapter plug removed from it.

[0033] Figure 4G This is a non-limiting embodiment according to the present disclosure. Figure 4E The cable organizer shown is a cross-sectional view taken along line 5-5;

[0034] Figure 4H This is a non-limiting embodiment according to the present disclosure. Figure 4E The rear view of the cable organizer shown;

[0035] Figure 4I An IDC chip according to a non-limiting embodiment of the present disclosure is depicted;

[0036] Figures 5A to 5C This is a series of diagrams illustrating the process flow for assembling IDC chip adapter assemblies using corresponding lines, where:

[0037] Figure 5A A disassembled IDC chip adapter assembly according to a non-limiting embodiment of the present disclosure is shown, wherein multiple wires are inserted into a cable organizer to provide a first differential pair and a second differential pair;

[0038] Figure 5B This illustrates a non-limiting embodiment according to the present disclosure, after inserting the first differential IDC chip pair to establish an electrical connection with the first differential line pair. Figure 5A The IDC chip adapter assembly shown; and

[0039] Figure 5C This illustrates a non-limiting embodiment according to the present disclosure, after inserting a second differential IDC chip pair to establish an electrical connection with a second differential line pair. Figure 5B The IDC chip adapter assembly shown.

[0040] Figure 6A This is a disassembled view of an IDC chip adapter assembly according to a non-limiting embodiment of the present disclosure; and

[0041] Figure 6B This is a non-limiting embodiment according to the present disclosure. Figure 6A A perspective view of the IDC chip adapter assembly shown.

[0042] Figures 7A to 7D It is a series of diagrams showing the assembly process. Figure 1A The process drawing for the cable assembly shown includes:

[0043] Figure 7A A cable assembly is depicted according to a non-limiting embodiment of the present disclosure after the tail assembly is coupled to the cable organizer;

[0044] Figure 7B The following is depicted according to a non-limiting embodiment of the present disclosure: after inserting an IDC chip into a cable organizer to establish electrical connections with multiple cables... Figure 7A Cable assemblies;

[0045] Figure 7C A non-limiting embodiment according to this disclosure is depicted after the assembled IDC chip adapter assembly is coupled to the front connector. Figure 7B Cable assemblies; and

[0046] Figure 7D A non-limiting embodiment according to this disclosure is depicted after the assembled IDC chip adapter assembly is inserted into the connector housing and the connector housing is coupled to the tail assembly. Figure 7C Cable assemblies.

[0047] Figures 8A to 8D This is a series of diagrams showing the process diagrams used to manufacture a pair of IDC chips, in which:

[0048] Figure 8A A pair of electrical terminals following a metal stamping process according to a non-limiting embodiment of the present disclosure is depicted, the pair of electrical terminals having a first end coupled to a contact and an opposing second end coupled to a blade;

[0049] Figure 8BThe process following a metal electroplating process according to a non-limiting embodiment of the present disclosure is described. Figure 8A The contact points shown;

[0050] Figure 8C The present disclosure describes a non-limiting embodiment of an overmolding process for forming a pair of IDC wafers, followed by... Figure 8B The pair of electrical terminals shown;

[0051] Figure 8D The image depicts a non-limiting embodiment of the present disclosure after cutting a carrier strip to separate a first IDC wafer from a second IDC wafer. Figure 8C The pair of IDC chips shown; and

[0052] Figure 8E A first IDC wafer having a first length and a second IDC wafer having a second length greater than the first length are depicted according to a non-limiting embodiment of the present disclosure, and a carrier strip is removed from the first IDC wafer and the second IDC wafer.

[0053] The figures depicted herein are illustrative. Many variations may be made to the figures or the operations described therein without departing from the spirit of this disclosure. For example, operations may be performed in different orders, or operations may be added, deleted, or modified. Furthermore, the term "coupling" and its variations describe a communication path between two elements and may include a direct connection between elements (without intermediate elements or connections between them), or an indirect connection with, for example, one or more intermediate elements or connections. All such variations are considered part of this specification. It should also be understood that features from one embodiment may be combined with features from one or more other embodiments described herein.

[0054] In the accompanying drawings and the following detailed description, the various elements shown in the drawings have two or three reference numerals. Detailed Implementation

[0055] Various embodiments are described herein with reference to the accompanying drawings. Alternative embodiments may be designed without departing from the scope of this disclosure. Various connections and positional relationships (e.g., above, below, adjacent, first direction, second direction, etc.) between elements are illustrated in the following description and drawings. Unless otherwise specified, these connections and / or positional relationships may be direct or indirect, and this disclosure is not intended to be limiting in this respect. Thus, coupling of entities may refer to direct or indirect coupling, and positional relationships between entities may be direct or indirect positional relationships. Furthermore, the various tasks and process steps described herein may be incorporated into a more comprehensive program or process with additional steps or functions not described in detail herein.

[0056] The following definitions and abbreviations are used to interpret the claims and the specification. As used herein, the terms “comprises,” “comprising,” “includes,” “including,” “has,” “having,” “contains,” or “containing,” or any other variations thereof, are intended to cover a non-exclusive inclusion. For example, a composition, mixture, process, method, article, or apparatus that comprises a list of elements is not necessarily limited to those elements, but may include other elements not expressly listed, or inherent to such composition, mixture, process, method, article, or apparatus.

[0057] Furthermore, the term "exemplary" is used herein to mean "serving as an example, instance, or illustration." The various non-limiting embodiments or designs described herein are "exemplary" and are not necessarily to be construed as preferentially superior to other embodiments or designs. The terms "at least one / at least one" and "one or more / one or more" include any number greater than or equal to one, such as one, two, three, four, etc. The term "multiple / a plurality of" includes any number greater than or equal to two, such as two, three, four, five, etc. The term "connection" includes both indirect connections and direct connections.

[0058] The terms “about,” “basically,” “approximately,” and their variations are intended to include the degree of error associated with measuring a particular quantity based on the equipment available at the time of application.

[0059] Turning now to an overview of the technology relevant to this disclosure, traditionally, quad coaxial (Quadrax) connectors can employ differentially machined contact pairs, where each machined contact in a respective differential pair is arranged diagonally opposite to each other. Manufacturing methods for establishing differential contact pairs involve stamping one or more contacts, crimping the contacts to a wire, covering and overlaying a molded dielectric wafer body around and above the contacts, leaving the contact tail uncovered, cutting and removing a carrier strip from the molded wafer body, inserting the crimped wire into a ferrule and inserting the ferrule into a connector housing, and crimping the connector housing to the ferrule. However, the overmolding process can permanently fix the contacts and wire within the dielectric wafer body. Additionally, the connector crimping process can permanently fix the ferrule to the connector housing and deform the connector housing. If one or more contacts are damaged, the entire cable assembly may need to be replaced.

[0060] As discussed herein, one or more non-limiting embodiments provide a cable assembly implementing an Insulated Displaced Contact (IDC) connection. The cable assembly includes an electrical connector, an IDC chip adapter assembly, and a tail assembly. The IDC chip adapter assembly utilizes a cable organizer that arranges multiple wires bundled in the tail assembly in a quadcoaxial arrangement, providing a fully symmetrical connection between quadcoaxial differential contact pairs. For example, a fully symmetrical connection is defined as arranging contacts within differential pairs that are equidistant from a central axis along the entire length of the connector assembly. The cable organizer houses multiple individual IDC chips, each having IDC contacts that establish IDC connections with corresponding wires. The electrical connector is detachably coupled to the IDC chip adapter assembly and the tail assembly. This detachability eliminates the need to replace the entire cable assembly if one or more of the front contacts fail.

[0061] Now for reference Figure 1A and Figure 1B The image shows a cable assembly 100 according to a non-limiting embodiment of the present disclosure. Figure 1A It is a perspective view showing the outer components of the cable assembly 100 including the electrical connector and the outer portion of the tail assembly 300 including the cable 350. Figure 1B This is a disassembled view showing the external components of the cable assembly 100 and various internal components, including the front contact assembly 500 which can be detachably coupled to the IDC chip adapter assembly 400, and the coupling assembly 301 which allows the IDC chip adapter assembly 400 to be coupled to the tail assembly 300.

[0062] Electrical connector 200 includes connector housing 202. Connector housing 202 is shown as having a cylindrical profile, but it should be understood that connector housing 202 may have other profile shapes (e.g., box-shaped profile) without departing from the scope of the invention. Connector housing 202 extends from mating interface end 204 to cable interface end 206, mating interface end 204 defining a mating interface opening 208, and cable interface end 206 defining a cable interface opening 210. Cable interface opening 210 is configured to receive a portion of front contact assembly 500, IDC chip adapter assembly 400, and tail assembly 300 (e.g., coupling assembly).

[0063] Cable interface 206 is configured to be detachably coupled to tail assembly 300. In one or more non-limiting embodiments, cable interface 206 includes connector threads formed on its inner surface. The connector threads are configured to engage with threads formed on coupling assembly 301. In this way, connector housing 202 can be tightened (e.g., coupled) and loosened (decoupled) from tail assembly 300. Although at least one non-limiting embodiment of this disclosure describes a threaded connection as a mechanism that facilitates coupling and decoupling of connector housing 202 and tail assembly 300, it should be understood that coupling / decoupling mechanisms may employ other techniques, including but not limited to press-fitting connector housing 202 to tail assembly 300, clamp and hook assemblies for tightening and loosening connector housing 202 and tail assembly 300, etc.

[0064] Cable 350 is coupled to one end of coupling assembly 301. Cable 350 includes a cable sheath 302 and an inner cable braid 303. Cable sheath 302 bundles together multiple conductive wires 304a, 304b, 304c, and 304d (collectively referred to as 304a-304d). Each conductive wire 304a-304d includes an insulation layer that electrically insulates each conductive wire among the conductive wires 304a-304d from each other. The inner cable braid 303 shields the multiple conductive wires 304a-304d from electrical crosstalk noise and / or electromagnetic (EM) interference.

[0065] The coupling assembly 301 is configured to couple the cable 350 and the IDC chip adapter assembly 400 together. The coupling assembly 301 includes a first mating portion 306 coupled to the cable 350 and a second mating portion 308 coupled to the IDC chip adapter assembly 400. Therefore, coupling the first mating portion 306 to the second mating portion 308 couples the cable 350 and the IDC chip adapter assembly 400 together.

[0066] The IDC chip adapter assembly 400 includes multiple IDC chips 404a, 404b, 404c, and 404d (collectively referred to as IDC chips 404a-404d – see [link]). Figure 4A Each IDC chip in IDC chips 404a-404d establishes an IDC connection with the corresponding line 304a-304d, which in turn establishes conductivity between the line 304a-304d and the corresponding connector pins 402a-402d formed on the IDC chips 404a-404d.

[0067] The front contact assembly 500 includes a front portion 501 and a rear portion 503. The front portion 501 has a plurality of front contacts 502a, 502b, 502c, and 502d (collectively referred to as front contacts 502a-502d). The rear portion 503 is configured to receive connector pins 402a-402d of the IDC chip adapter assembly 400, such that each connector pin 402a-402d physically contacts a corresponding contact 502a-502d. Therefore, the front contact assembly 500 establishes conductivity between the connector pins 402a-402d and the plurality of contacts 502a-502d.

[0068] As described herein, the front contact assembly 500 is inserted into the connector housing 202, and the connector housing 202 is coupled to the tail assembly 300 such that the front contacts 502a-502d extend through the connector housing 202 and are exposed through the mating interface opening 208. Therefore, the mating interface end 204 can be connected to a corresponding mating connector (not shown) mounted on a separate electrical connector (not shown) or a circuit board (not shown).

[0069] If one or more of the front contacts in front contact assembly 500 and / or front contacts 502a-502d are damaged, the electrical connector 200 can be detached from the tail assembly 300. The damaged front contact assembly 500 can be replaced with a new front contact assembly 500, and the electrical connector 200 can be reattached to the tail assembly 300. In this way, the cable assembly 100 provides the desired maintainability characteristics.

[0070] Figure 1C It is along Figure 1B The cable assembly 100 shown is illustrated in a cross-sectional view taken along line 2-2 of a front contact assembly 500. The front contact assembly 500 includes a front receptacle 505 and a rear opening 507. Each front receptacle 505 supports a corresponding front contact 502a-502d disposed therein. Each rear opening in the rear opening 507 is configured to receive a corresponding connector pin 402a-402d insertable therein. In one or more non-limiting embodiments, the front contact assembly 500 may include a clip 509 disposed in the corresponding rear opening 507. The clip 509 may be spring-loaded or resiliently biased to press against the connector pin 402a-402d inserted into the corresponding rear opening 507. Therefore, when the front contact assembly 500 is attached to the IDC chip adapter assembly 400, the clip 509 can be secured to the connector pins 402a-402d in the rear opening 507, while still allowing the front contact assembly 500 to be decoupled from the IDC chip adapter assembly 400 when necessary, for example, when maintaining the cable assembly 100 as described herein.

[0071] Turn now Figure 2Aand Figure 2B The tail assembly 300 is shown in more detail. The tail assembly 300 includes a cable 350, a coupling assembly 301, and a collar 310. As described herein, the coupling assembly 301 includes a first mating portion 306 and a second mating portion 308. According to a non-limiting embodiment, the first mating portion 306 is implemented as a bushing 306, and the second mating portion is implemented as a collar assembly 308.

[0072] The bushing 306 allows the tail assembly 300 to be detachably coupled to the electrical connector 200. The bushing 306 includes a bushing head 305 and a bushing body 307. The bushing head 305 includes an opening that receives and allows the cable sheath 302 to pass through to the hollow bushing body 307. The bushing body 307 has a plurality of bushing threads 309 formed on its outer surface and may also include a hollow profile allowing the cable sheath 302 to pass through to the ferrule assembly 308. The bushing threads 309 mate with connector threads formed on the inner surface of the cable interface end 206 of the connector housing 202.

[0073] The ferrule assembly 308 is configured to couple bushing 306 to IDC chip adapter assembly 400. The ferrule assembly 308 includes a rear ferrule 311 and a front ferrule 313. The rear ferrule 311 is coupled to bushing body 307 and configured to house cable sheath 302. The front ferrule 313 is coupled to rear ferrule 311 and configured to pass wires 304a-304d from cable sheath 302 to IDC chip adapter assembly 400.

[0074] The collar 310 may be implemented to further support the coupling between the coupling assembly 301 and the IDC chip adapter assembly 400. In one or more non-limiting embodiments, the collar 310 may include, but is not limited to, adhesives or epoxy resins, the collar having a first portion coupled to the collar assembly 308 (e.g., the front collar 313) and a second portion coupled to the IDC chip adapter assembly 400.

[0075] Turn Figure 2B According to a non-limiting embodiment, it is shown Figure 2A The diagram shows a cross-sectional view of the tail assembly 300 taken along line 2-2. As described herein, the bushing 306 and the ferrule assembly 308 pass through the cable sheath 302, obstructing the delivery of wires 304a-304d from the cable 350 to the IDC chip adapter assembly 400. According to a non-limiting embodiment, the coupling assembly 301 is configured to constrain the cable 350 and suppress the ability of said cable to unintentionally shift.

[0076] According to a non-limiting embodiment, a portion of the cable sheath 302 is removable to expose the braided layer 303, which can then be inserted into the bushing 306 to deliver the end through the front ferrule 313. The excess portion of the braided layer 303 is then folded back over the outer surface of the rear ferrule 311, and the front ferrule 313 can slide on the outer surface of the rear ferrule 311 such that the folded portion of the braided layer 303 can wedge or clamp between the inner surface of the front ferrule 313 and the outer surface of the rear ferrule 311. In one or more non-limiting embodiments, the outer surface of the rear ferrule 311 includes serrations 315 configured to "pierce" into the cable braided layer 303 and abut against the rear ferrule 311 for fixation. Coupling the connector housing 202 to the coupling assembly 301 also applies tension to the cable braided layer 303, which further constrains the braided layer 303 in place and prevents the cable 350 from shifting from the coupling assembly 301.

[0077] although Figure 2A and Figure 2B Describing the first mating portion 306 of the coupling assembly 301 as a bushing 306 and the second mating portion 308 as a collar assembly 305, it should be understood that other types of coupling assemblies 301 may be used to couple the cable 350 and the IDC chip adapter assembly 400 together without departing from the scope of the invention. For example, one or more non-limiting embodiments may implement the first mating portion 306 as a clip or fastener, and the second mating portion 308 may be implemented as a hook or slot configured to engage with the clip or fastener to couple the cable 350 to the IDC chip adapter assembly 400 when the clip or fastener is fastened or clamped together.

[0078] Turn now Figure 3 According to a non-limiting embodiment of this disclosure, a process diagram for preparing cable 350 for assembly is provided. The process begins at operation 362, where a portion of the cable sheath is removed (e.g., stripped) to expose a portion of the underlying cable braid 303. At operation 364, a rear loop 311 and a bushing 306 are coupled to a portion of the braid 303. At operation 366, a portion of the uncovered braid 303 is trimmed to expose wires 304a-304d. At operation 368, the remaining portion of the braid 303 is folded over and over the top of the outer surface of the rear loop 311. At operation 370, a front loop 313 slides over the folded braid 303 and the rear loop 311, thereby securing the braid 303 in place.

[0079] Turn now Figures 4A to 4IThis illustration shows an IDC chip adapter assembly 400 according to a non-limiting embodiment of the present disclosure. The IDC chip adapter assembly 400 includes a cable organizer 401 and a plurality of IDC chips 404a-404d. The cable organizer 401 extends from a front end 403 to a rear end 405 and includes a plurality of cable holes 408a, 408b, 408c, and 408d, collectively referred to as cable trays 408a-408d (see, for example,...). Figure 4B Each of the wire holes 408a-408d houses the corresponding wire 304a-304d. That is, each wire hole 408a-408d houses the corresponding wire 304a-304 included in the cable 350.

[0080] Cable organizer 401 is configured to arrange conductive wires 304a-304d in a quad coaxial arrangement (e.g., multiple differential pairs). According to a non-limiting embodiment, a first differential pair includes a first wire 304a arranged along a first axis (Ac1) and an opposing second wire 304b, and a second differential pair includes a third wire 304c arranged along a second axis (Ac2) extending perpendicularly to the first axis (Ac1) and an opposing fourth wire 304d.

[0081] like Figure 4F As shown, the cable organizer 401 includes an insertable adapter plug 412 with stops 413a and 413b, which are respectively insertable into corresponding wire holes 408a and 408b. Therefore, stops 413a and 413b partially block wire holes 408a and 408b to prevent wires 304a-304d from contacting each other (i.e., short-circuiting). In one or more non-limiting embodiments, the adapter plug 412 may further include one or more guide pins 417, which are insertable into corresponding pin holes 419 to guide the insertable plug 412 into the cable organizer 401.

[0082] According to a non-limiting embodiment of this disclosure, wafer spaces 410a-410d include a first differential wafer space pair (e.g., 410a and 410b) and a second differential wafer space pair (e.g., 410c and 410d). The first differential wafer space pair includes a first differential wafer space 410a configured to house a first IDC wafer 404a and a second differential wafer space 410b configured to house a second IDC wafer 404b. Similarly, the second differential wafer space pair includes a third differential wafer space 410c configured to house a third IDC wafer 404c and a fourth differential wafer space 410d configured to house a fourth IDC wafer 404d.

[0083] The cable organizer 401 may further include a plurality of supports 414a-414d, which are respectively disposed in wafer spaces 410a-410d. Each support 414a-414d includes IDC slots 416a-416d. According to a non-limiting embodiment of the present disclosure, the supports 414a-414d include a first differential support pair (e.g., 414a and 414b) and a second differential support pair (e.g., 414c and 414d). The first differential support pair includes a first support 414a disposed in a first wafer space 410a and a second support 414b disposed in a second wafer space 410b. The first support 414a and the second support 414b each extend from a first end to an opposite end that contacts a shoulder portion 415 of the cable organizer 401 to define a first support length. The second differential support pair includes a third support 414c disposed in a third wafer space 410c and a fourth support 414d disposed in a fourth wafer space 410d. The third bracket 414c and the fourth bracket 414d each extend from the first end to the opposite end that connects to the rear end of the cable organizer 401, thereby defining a second bracket length that is greater than the length of the first bracket.

[0084] like Figures 4A to 4D As shown, each IDC chip in IDC chips 404a-404d establishes an IDC connection with the corresponding line 304a-304d arranged in the corresponding cable tray 408a-408d. Figure 4I Examples of a first IDC wafer 404a (e.g., a short IDC wafer) and a second IDC wafer 404c (e.g., a long IDC wafer) are shown. Although IDC wafers 404a and 404c are shown, it should be understood that IDC wafer 404a can also represent IDC wafer 404b, and IDC wafer 404c can represent IDC wafer 404d. Each IDC in IDC wafers 404a-404d includes a conductive IDC connection assembly to establish a physical IDC connection with a corresponding line 304a-304d. According to a non-limiting embodiment, the number of IDC connections matches the number of IDC wafers 404a-404d. Figure 4D As shown, for example, each of the four individual IDC chips 404a-404d establishes its own IDC connection with a given corresponding line 304a-304d. Therefore, the number of four IDC connections matches the number of individual IDC chips 404a-404d (e.g., four IDC chips 404a-404d).

[0085] The IDC connection assembly includes conductive connector pins 402a-402d, conductive terminals 407a-407d, and conductive blades 406a-406d. A first end of the conductive terminal is coupled to the connector pin 402a-402d, and the conductive blade is coupled to the opposite second end of the conductive terminal 407a-407d.

[0086] Conductive blades 406a-406d are configured to directly contact corresponding lines 304a-304d and establish an electrical connection between the corresponding conductive lines 304a-304d and corresponding connector pins 402a-402d. According to a non-limiting embodiment, each conductive blade 406a-406d includes a pair of opposing tips 409a-409d spaced apart from each other to define a blade slot 411, the blade slot being configured to receive a wire inserted therein. Thus, if necessary, the tips 409a-409d can penetrate the wire insulation layer and establish physical contact with the corresponding lines 304a-304d. In one or more non-limiting embodiments, each IDC chip 404a-404d includes a single blade 406a-406d that establishes an IDC connection with a single line 304a-304d disposed in the cable organizer 401.

[0087] According to a non-limiting embodiment, a plurality of IDC chips 404a-404d include a first differential IDC chip pair and a second differential IDC chip pair. The first differential IDC chip pair includes a first IDC chip 404a configured to contact a first line 304a and a second IDC chip 404b configured to contact a second line 304b. The second differential IDC chip pair includes a third IDC chip 404c configured to contact a third line 304c and a fourth IDC chip 404d configured to contact a fourth line 304d. Therefore, complete symmetry is established between differential connector pin pairs (e.g., connector pins 402a and 402b, and 402c and 402d), and consequently, complete symmetry is achieved between front contact pairs 502a and 502b and front contact pairs 502c and 502d.

[0088] Each of the first IDC wafers 404a and the second IDC wafer 404b extends from a first end of the support connector pins 402a and 402b to an opposite second end of the support conductive blades 406a and 406b to define a first wafer length. Each of the second IDC wafers 404c and the third IDC wafer 404d extends from a first end of the support connector pins 402c and 402d to an opposite second end of the support conductive blades 406c and 406d to define a second wafer length. According to a non-limiting embodiment, the second wafer lengths of the second IDC wafers 404c and the third IDC wafer 404d are greater than the first wafer lengths of the first IDC wafers 404a and 404b.

[0089] According to a non-limiting embodiment, IDC wafers 404a-404d are manufactured using a stamping process and an overmolding process. For each individual IDC wafer 404a-404d, conductive connector pins 402a-402d, conductive terminals 407a-407d, and conductive blades 406a-406d are stamped from a conductive material. According to a non-limiting embodiment, the conductive material is a metal, such as copper, brass, tin, silver, gold, etc. The stamped connector pins 402a-402d, stamped conductive terminals 407a-407d, and stamped conductive blades 406a-406d can be overmolded using a polymer material (e.g., plastic) to form multiple IDC wafers 404a-404d. In one or more non-limiting embodiments, prior to overmolding, the stamped connector pins 402a-402d, the stamped conductive terminals 407a-407d, and the stamped conductive blades 406a-406d are plated with a metallic material. For example, the plated metallic material may include gold, but it should be understood that other metals may be used. The process flow for manufacturing the IDC wafers 404a-404d is described in more detail below.

[0090] refer to Figures 5A to 5C This illustrates a process diagram of an IDC chip adapter assembly 400 having multiple lines 304a-304d, according to a non-limiting embodiment. Figure 5A In the disassembled IDC chip adapter assembly 400, multiple cables 304a-304d are inserted into the cable organizer 401. Therefore, cables 304a and 304b are arranged in a first differential pair arrangement, and cables 304c and 304d are arranged in a second differential pair arrangement.

[0091] refer to Figure 5B This demonstrates the IDC chip adapter assembly 400 after the first differential IDC chip pairs 404a and 404b are inserted into the cable organizer 401 to establish electrical connections with the first differential wire pairs 304a and 304b, respectively. (Turn) Figure 5C This demonstrates the IDC chip adapter assembly 400 after the second differential IDC chip pairs 404c and 404d are inserted into the cable organizer 401 to establish an electrical connection with the second differential wire pairs 304c and 304d. (Separately.)

[0092] Turn now Figure 6A and Figure 6BThe diagram illustrates an IDC chip adapter assembly 600 according to another non-limiting embodiment. The IDC chip adapter assembly 600 includes a cable organizer 601 and a pair of IDC chips 604a and 604b. The cable organizer 601 extends from a front end 611 to a rear end 613. The cable organizer 601 includes a plurality of cable trays 605a-605d configured to respectively accommodate a plurality of conductive wires 304a-304d and to position the wires 304a-304d into corresponding guide paths 607a-607d. IDC slots 603a-603d formed in the cable organizer 601 provide pathways to the corresponding guide paths 607a-607d.

[0093] According to a non-limiting embodiment, the cable organizer 601 facilitates the arrangement of conductive wires 304a-304d in a quad coaxial configuration. That is, the cable organizer 601 arranges the wires 304a-304d into multiple differential pairs. Each differential pair includes a first differential pair and a second differential pair. The first differential pair includes a first wire 304a arranged along a first axis Ac1 extending in a first direction and an opposing second wire 304d. The second differential pair includes a third wire 304b arranged along a second axis Ac2 extending in a direction opposite to the first axis Ac1 and an opposing fourth wire 304c.

[0094] IDC chips 604a and 604b are implemented as multi-blade IDC chips. In other words, each IDC chip 604a and 604b includes multiple blades configured to establish IDC connections with corresponding lines 304a-304d. Therefore, the first IDC chip 604a can establish an IDC connection with a first group of lines 304a and 304b among the multiple conductive lines 304a-304d, and the second IDC chip can establish an IDC connection with a second group of lines 304c and 304d among the multiple lines 304a-304d.

[0095] According to a non-limiting embodiment, a first IDC chip 604a includes a first IDC connection assembly and a second IDC connection assembly. The first IDC connection assembly includes a first conductive connector pin 602a, a first conductive terminal 608a, and a first conductive blade 610a. A first end of the first conductive terminal is coupled to the first conductive connector pin 602a, and the first conductive blade is coupled to a opposite second end of the first conductive terminal 608a. The second IDC connection assembly includes a second conductive connector pin 602b, a second conductive terminal 608b, and a second conductive blade 610b. A first end of the second conductive terminal is coupled to the second conductive connector pin 602b, and the second conductive blade is coupled to a opposite second end of the second conductive terminal 608b.

[0096] The first conductive blade 610a can be inserted into the first IDC slot 603a to connect with the first line 304a, and an electrical connection is established between the first conductive pin 602a and the first line 304a. Similarly, the second conductive blade 610b can be inserted into the second IDC slot 603b to connect with the second line 304b, and an electrical connection is established between the second conductive pin 602b and the second line 304b.

[0097] The second IDC chip 604b includes a third IDC connection assembly and a fourth IDC connection assembly. The third IDC connection assembly includes a third conductive connector pin 602c, a third conductive terminal 608c, and a third conductive blade 610c. A first end of the third conductive terminal is coupled to the third conductive connector pin 602c, and the third conductive blade is coupled to the opposite second end of the third conductive terminal 608c. The fourth IDC connection assembly includes a fourth conductive connector pin 602d, a fourth conductive terminal 608d, and a fourth conductive blade 610d. A first end of the fourth conductive terminal is coupled to the second conductive connector pin 602d, and the fourth conductive blade is coupled to the opposite second end of the fourth conductive terminal 608d.

[0098] The third conductive blade 610c can be inserted into the third IDC slot 603c to connect with the third line 304c, and an electrical connection is established between the third conductive pin 602c and the third line 304c. Similarly, the fourth conductive blade 610d can be inserted into the fourth IDC slot 603d to connect with the fourth line 304d, and an electrical connection is established between the fourth conductive pin 602d and the fourth line 304d.

[0099] According to a non-limiting embodiment, a first differential blade pair (e.g., 610a and 610d) is established including a first blade 610a on a first IDC wafer 604a and a fourth blade 610d on a fourth IDC wafer 604d. Similarly, a second differential blade pair (e.g., 610b and 610c) is established including a second blade 610b on a second IDC wafer 604b and a third blade 610c on a third IDC wafer 604c. Therefore, each blade of 610a and 610b on the first IDC wafer 604a and each blade of 610c and 610d establishes an IDC connection with lines 304a and 304b, respectively, and each blade of 610c and 610d on the second IDC wafer 604b establishes an IDC connection with lines 304c and 304d, respectively. In this way, multi-blade wafers 604a and 604b can establish at least partial symmetry between differential connector pin pairs (e.g., connector pins 602a and 602d, and 602b and 602c), and further at least partial symmetry can be achieved between front contact pairs 502a and 502d and front contact pairs 502b and 502c.

[0100] As described herein, one or more non-limiting embodiments of this disclosure provide an IDC chip adapter assembly (e.g., IDC chip adapter assembly 400 or IDC chip adapter assembly 600) that employs a plurality of individual IDC chips (e.g., IDC chips 404a-404d or IDC chips 604a-604b) to establish an IDC connection with cables 304a-304d disposed in a cable organizer (e.g., cable organizer 401 or cable organizer 601). Each IDC chip includes at least one of a first conductive connector pin (e.g., 402a or 602a), a first conductive terminal (e.g., 407a or 608a), and a first conductive blade (e.g., 406a or 610a), a first end of the first conductive terminal being coupled to the first conductive connector pin, and the first conductive blade being coupled to an opposite second end of the first conductive terminal.

[0101] refer to Figures 7A to 7D This illustrates a non-limiting embodiment of an assembly according to the present disclosure. Figure 1A The process diagram for the cable assembly is shown. Figure 7A The image depicts a cable assembly 100 after the tail assembly 300 is coupled to the cable organizer 401.

[0102] Turn Figure 7B The image depicts a cable assembly 100 after IDC chips 404a-404d are inserted into a cable organizer 401 to establish electrical connections with multiple lines 304a-304d. According to a non-limiting embodiment, a first differential IDC chip pair 404a and 404b establishes IDC connections with first pairs of lines 304a and 304b, respectively, and a second differential IDC chip pair 404c and 404d establishes IDC connections with second pairs of lines 304c and 304d, respectively.

[0103] Turn Figure 7C The image depicts a cable assembly 100 after the assembled IDC chip adapter assembly 400 is coupled to a front contact assembly 500. The rear portion 503 of the front contact assembly 500 houses the connector pins 402a-402d of the IDC chip adapter assembly 400, such that each connector pin 402a-402d physically contacts a corresponding contact 502a-502d. Therefore, the front contact assembly 500 establishes conductivity between the connector pins 402a-402d and the plurality of contacts 502a-502d.

[0104] refer to Figure 7DThis document depicts a cable assembly 100 after the assembled IDC chip adapter assembly 400 is inserted into a connector housing 202 and coupled to a tail assembly 300. As described herein, the cable interface end 206 of the cable housing 202 includes connector threads formed on its inner surface, which are configured to mate with threads formed on the coupling assembly 301 (e.g., the outer surface of the bushing 306). In this way, the connector housing 202 can be tightened (e.g., coupled) and loosened (decoupled) from the tail assembly 300 to provide maintainability features not available with conventional cable assemblies. As described herein, other techniques can be implemented in the coupling / decoupling mechanism, including but not limited to clamping the connector housing 202 and the tail assembly 300 together, and clip and hook assemblies for fastening and loosening the connector housing 202 and the tail assembly 300.

[0105] The maintainability provided by the electrical connector assembly 100 includes facilitating the replacement of the front contact assembly 500. For example, a method of maintaining the cable assembly 100 includes decoupling the connector housing 202 from the tail assembly 300 to remove the IDC chip adapter assembly 400 coupled to the tail assembly and the front contact assembly 500 from within the connector housing 202. Thereafter, the method includes removing the front contact assembly 500 from the IDC chip adapter assembly 400 and coupling another front contact assembly 500 to the IDC chip adapter assembly 400. The newly coupled front contact assembly 500 may include the same type of front contact assembly 500 excluding one or more damaged portions, or may include a different type of front contact assembly 500. The method then includes inserting the newly coupled front contact assembly 500 and the IDC chip adapter assembly 400 into the connector housing 202, thereby coupling the electrical connector housing 202 to the tail assembly 300.

[0106] Turn now Figures 8A to 8D This illustrates a process diagram for manufacturing a pair of IDC wafers 404a and 404c according to a non-limiting embodiment. (See reference...) Figure 8A The diagram shows a pair of electrical terminals 404a and 404c after being stamped from a metal sheet 800. The metal sheet 800 can be formed from any known metallic material. The first terminal 404a includes a first end coupled to a contact 402a and an opposing second end coupled to a blade 406a. Similarly, the second terminal 404c includes a first end coupled to a contact 402c and an opposing second end coupled to a blade 406c. Figures 8C to 8E In one non-limiting embodiment shown, the first terminal 404a may be formed to have a first length (L1), and the second terminal 404c may be formed to have a second length (L2) greater than the first length (L1) of the first terminal 404a.

[0107] Turn Figure 8B Contacts 402a and 402c after a metal electroplating process. According to a non-limiting embodiment, a metal material (e.g., gold) can be applied according to various application processes (including but not limited to immersing contacts 402a and 402c in liquid metal, spraying metal material onto contacts 402a and 402c, etc.). Although Figure 8B The invention demonstrates that only the metal is applied to contacts 402a and 402c. It should be understood that the metal may also be applied to terminals 407a and 407c and / or blades 406a and 406c without departing from the scope of the invention.

[0108] refer to Figure 8C The diagram illustrates terminals 407a and 407c following an overmolding process for forming a pair of IDC wafers 404a and 404c. In a non-limiting embodiment, the overmolding process may include overmolding terminals 407a and 407c with a plastic or polymer material. Each IDC wafer in IDC wafers 404a and 404c includes a wafer body extending along a first direction to define a wafer length, a second direction orthogonal to the first direction to define a wafer width, and a third direction orthogonal to the first and second directions to define a wafer thickness.

[0109] Turn Figure 8D The diagram shows IDC wafers 404a and 404c after the carrier strip 802 has been cut to separate the first IDC wafer 404a from the second IDC wafer 404c. Therefore, a pair of IDC wafers 404a and 404c are provided, as... Figure 8E As shown. According to a non-limiting embodiment, a first IDC wafer 404a (e.g., a short IDC wafer) having a first length (L1) can be formed, and a second IDC wafer 404c (e.g., a long IDC wafer) having a second length (L2) greater than the first length (L1) of the first wafer 404a can be formed. In this way, short IDC wafers of a first differential pair (e.g., 404a and 404b) can be formed, and long wafers of a second differential pair (e.g., 404c and 404d) can be formed, as... Figure 4D As shown.

[0110] although Figures 8A to 8E The fabrication of a single wafer with a single IDC connection assembly (e.g., a single blade) is demonstrated. It should be understood that, without departing from the scope of the invention, Figures 8A to 8E The manufacturing process described herein can be applied to the manufacture of, for example, Figures 6A to 6B The examples shown are single wafers and multiple IDC connection assemblies (e.g., single wafers and multi-blade wafers).

[0111] As described herein, various non-limiting embodiments of this disclosure provide a cable assembly for implementing IDC connectivity. The cable assembly may include an electrical connector, an IDC chip adapter assembly, and a tail assembly. The IDC chip adapter assembly may utilize a cable organizer that arranges multiple wires bundled in the tail assembly in a quad coaxial arrangement, providing complete symmetry (e.g., perfect symmetry) between the quad coaxial arrangement of differential contact pairs. The cable organizer may also accommodate multiple individual IDC chips having IDC contacts configured to establish IDC connections with corresponding wires. The electrical connector may be further detachably coupled to the IDC chip adapter assembly and the tail assembly. In this way, if one or more contacts in the cable assembly fail, the entire cable assembly does not need to be replaced.

[0112] The teachings described herein can be implemented as devices and / or methods at any possible level of technical detail integration. Aspects of this disclosure are described herein with reference to flowchart illustrations and / or block diagrams of one or more methods. In some alternative embodiments, the functions marked in the blocks may occur in a sequence not indicated in the figures. For example, two blocks shown consecutively may actually be performed substantially in parallel, or the blocks may sometimes be performed in reverse order.

[0113] The descriptions of the various embodiments are presented for illustrative purposes and are not intended to be exhaustive or limited to the described embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is chosen to best explain the principles of the embodiments, their practical application, or technical improvements to technologies found in the market, or to enable those skilled in the art to understand the embodiments described herein.

Claims

1. A tail assembly for an electrical connector, the tail assembly comprising: A cable, the cable comprising multiple conductive wires; A coupling assembly defining an internal spacing and coupling to the cable such that the conductive wire extends through the internal spacing. The coupling assembly is configured to detachably couple the tail assembly to the electrical connector.

2. The tail assembly of claim 1, wherein the coupling assembly further comprises a first mating portion and a second mating portion, the first mating portion being coupled to the cable, and the second mating portion being configured to couple the first mating portion to the electrical connector.

3. The tail assembly of claim 2, wherein the first mating portion includes a bushing coupled to the cable, and wherein the second mating portion includes a collar assembly coupled to the bushing.

4. The tail assembly of claim 3, wherein the bushing includes a bushing body having bushing threads configured to engage with connector threads on the electrical connector to detachably couple the bushing to the electrical connector.

5. The tail end assembly according to claim 4, wherein the collar assembly comprises: A rear ferrule coupled to the bushing, the rear ferrule being configured to receive the cable; as well as A front ferrule, coupled to the rear ferrule, and configured to deliver the conductive wire to the electrical connector.

6. The tail assembly of claim 5, wherein the cable includes a cable braid covering the conductive wires and a cable sheath covering the cable braid.

7. The tail assembly of claim 6, wherein the cable braid includes a folded portion disposed on the upper surface of the cable sheath and sandwiched between the outer surface of the rear ferrule and the inner surface of the front ferrule.

8. A cable assembly comprising: An electrical connector, comprising a connector housing defining an internal region, the connector housing having a mating interface end defining a mating interface opening and a cable interface end defining a cable interface opening; and A tail assembly configured to couple to an IDC chip adapter assembly comprising multiple IDC chips, the tail assembly being configured to detachably couple to the cable interface end.

9. The cable assembly of claim 8, wherein the tail assembly comprises: A cable, the cable comprising multiple conductive wires; as well as A coupling assembly defining an internal spacing and coupling to the cable such that the conductive wire extends through the internal spacing. The coupling assembly is configured to detachably couple the tail assembly to the electrical connector.

10. The cable assembly of claim 9, wherein the coupling assembly further comprises a first mating portion and a second mating portion, the first mating portion being coupled to the cable, and the second mating portion being configured to couple the first mating portion to the electrical connector.

11. The cable assembly of claim 10, wherein the first mating portion includes a bushing coupled to the cable, and wherein the second mating portion includes a collar assembly coupled to the bushing.

12. The cable assembly of claim 11, wherein the bushing includes a bushing body having bushing threads configured to engage with connector threads on the electrical connector to detachably couple the bushing to the electrical connector.

13. The cable assembly of claim 12, wherein the collar assembly comprises: A rear ferrule coupled to the bushing, the rear ferrule being configured to receive the cable; as well as A front ferrule, coupled to the rear ferrule, and configured to deliver the conductive wire to the electrical connector.

14. The cable assembly of claim 13, wherein the cable includes a cable braid covering the conductive wires and a cable sheath covering the cable braid.

15. The cable assembly of claim 14, wherein the cable braid includes a folded portion disposed on the upper surface of the cable sheath and sandwiched between the outer surface of the rear ferrule and the inner surface of the front ferrule.

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