A device for detecting the surface flatness of semiconductors using lasers

Abstract

This invention discloses a device for detecting the flatness of a semiconductor surface using laser, relating to the field of semiconductor laser detection technology. It includes a base, with a laser detector hinged to one side of the top of the base, and an electric track mounted on the other side of the top of the base. A movable stage is mounted on the electric track, and a detection stage is hinged to the middle of the upper surface of the movable stage. A bracket is mounted in the middle of the upper surface of the base, and a light-shielding transmission assembly is mounted on the bracket. This application uses the light-shielding transmission assembly for transmission and synchronous light-shielding operations. An electric telescopic rod pushes a connecting block to move, thereby causing a light-shielding plate to move downwards until it blocks the detection stage. Simultaneously, as the connecting block moves, a pressure rod on its side presses against a hydraulic rod, causing the hydraulic rod to rotate the laser detector, bringing the laser detector into contact with the light-shielding plate, and then performing semiconductor surface flatness detection.

Description

Technical Field

[0001] This invention relates to the field of semiconductor laser inspection technology, and in particular to a device for inspecting the surface flatness of semiconductors using lasers. Background Technology

[0002] Semiconductors are materials whose conductivity lies between that of conductors and insulators. Common semiconductor materials include silicon, germanium, and gallium arsenide. They are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, and high-power power conversion. During the manufacturing process, the surface flatness of semiconductors has a crucial impact on the performance and reliability of semiconductor devices. Surface unevenness can lead to a decrease in photolithography precision. For multilayer semiconductor devices, surface unevenness can affect the quality of interlayer connections. Therefore, after grinding and polishing, it is necessary to quickly and accurately check whether the surface has achieved the expected flatness.

[0003] The invention patent with announcement number CN119573618A discloses a device for detecting the flatness of a semiconductor surface using laser, which relates to the field of semiconductor testing technology. It includes a base, with a mounting seat fixedly connected to the upper end of the base, and a through groove opened on the upper surface of the base. The laser emitter is mounted on the mounting seat, and a fixed seat is mounted on the upper surface of the base, with a transmission mechanism installed inside the fixed seat.

[0004] The existing testing equipment still has some shortcomings. It requires a lot of manual intervention during the testing process, which introduces certain errors. It is not convenient to conduct comprehensive testing of semiconductors. Furthermore, when changing semiconductor materials, it takes a lot of time to locate and recalibrate the refraction angle between the laser emitter and the detector, which makes it difficult to compare the repeatability of test results and reduces the overall testing efficiency. Summary of the Invention

[0005] The purpose of this invention is to solve the problems in the existing technology that require a lot of manual intervention, have certain errors, are not convenient for comprehensive testing of semiconductors, and require a lot of time for positioning and recalibrating the refraction angle between the laser emitter and the detector when changing semiconductor materials, which makes it difficult to compare the repeatability of test results and reduces the overall testing efficiency. Therefore, this invention proposes a device for testing the flatness of semiconductor surfaces using laser.

[0006] To achieve the above objectives, the present invention adopts the following technical solution:

[0007] A device for detecting the flatness of a semiconductor surface using laser includes a base, a laser detector hinged to one side of the top of the base, an electric track mounted on the other side of the top of the base, a movable stage mounted on the electric track, and a detection stage hinged to the middle of the upper surface of the movable stage.

[0008] A bracket is mounted on the center of the upper surface of the base. A light-shielding transmission assembly is mounted on the bracket. The light-shielding transmission assembly includes an electric telescopic rod mounted in the center of the bracket and a bracket two fixed inside the base. A connecting block is mounted at the bottom of the movable rod of the electric telescopic rod. A light-shielding plate is fixed to one side of the connecting block, and a pressure rod is fixed to the other side of the connecting block. A hydraulic chamber is fixed on the bracket two. A hydraulic rod is slidably connected to one end of the hydraulic chamber, and a hydraulic rod is slidably connected to the other end. This application uses a light-shielding transmission assembly for transmission and synchronous light-shielding operations. The electric telescopic rod pushes the connecting block to move, thereby causing the light-shielding plate to move downwards until it covers the detection stage. Simultaneously, as the connecting block moves, the pressure rod on its side presses against the hydraulic rod one, causing the hydraulic rod two to push the laser detector to rotate, bringing the laser detector into contact with the light-shielding plate, and then performing semiconductor surface flatness detection.

[0009] Preferably, the first hydraulic rod is located on the movement trajectory of the pressure rod, and the top end of the second hydraulic rod is fixed to the bottom of the laser detector.

[0010] Preferably, a protruding pressure block is fixed to the bottom of the inner wall of the light-shielding plate.

[0011] Preferably, an adjustment assembly is installed between the movable stage and the testing stage.

[0012] Preferably, the adjustment assembly includes a hydraulic chamber two, a hollow frame, and an arc-shaped rod. A hydraulic rod three is slidably connected to one end of the interior of the hydraulic chamber two, and a hydraulic rod four is slidably connected to the other end of the interior of the hydraulic chamber two. The hollow frame is fixed to the side of the testing platform, and a counterweight is slidably connected inside the hollow frame. An air reservoir is fixed inside the hollow frame, and a pressure chamber communicating with the air reservoir is fixed to the outside of the hollow frame. A fixing rod one is slidably connected to the piston inside the pressure chamber. This application sets the adjustment assembly so that the hydraulic rod three is compressed, causing the hydraulic rod four to push the testing platform upwards. This, in conjunction with a rotating laser detector, allows for semiconductor testing. Simultaneously, to ensure the stability of the semiconductor on the testing platform after lifting, the counterweight slides and compresses the air reservoir under gravity, causing the fixing rod one to extend and secure both sides of the semiconductor. Furthermore, as the testing platform rises, the fixing rod two is squeezed by the arc-shaped rod, pressing down on the left side of the semiconductor, thus improving the stability of the semiconductor during testing.

[0013] Preferably, the hydraulic rod four has an overall arc-shaped structure and is fixed to the bottom of the testing platform. The arc-shaped rod is fixed to the upper surface of the movable platform. The testing platform is internally connected to a fixed rod two, and a spring is fixed between the fixed rod two and the testing platform.

[0014] Preferably, the outer side of the light-shielding plate is equipped with two symmetrically arranged dust removal components.

[0015] Preferably, the dust removal assembly includes an elastic airbag, a one-way valve is fitted at the bottom of the elastic airbag, an adapter is fitted at the top of the elastic airbag, an air supply pipe is fitted at the top of the adapter, a nozzle is rotatably connected to the bottom of the air supply pipe via a rotary joint, multiple fan blades are fitted on the outside of the nozzle, and an air jet pipe is fitted on the side of the adapter. This application removes dust from the semiconductor surface caused by static electricity or natural adhesion by setting up a dust removal assembly. As the light-shielding plate moves downward, the elastic airbag is compressed, and the gas inside enters the air supply pipe through the adapter and is then ejected through the nozzle for dust removal. Simultaneously, some gas is ejected through the air jet pipe, and the resulting airflow impacts the fan blades, causing them to rotate and thus rotating the nozzle, increasing its air jet coverage.

[0016] Preferably, the jet direction of the jet pipe is adapted to the rotation direction of the fan blade.

[0017] Compared with the prior art, the present invention has the following advantages:

[0018] 1. This application uses a light-shielding transmission assembly for transmission and synchronous light-shielding operation. The connecting block is moved by an electric telescopic rod, which in turn moves the light-shielding plate down until it covers the detection table. At the same time, as the connecting block moves, the pressure rod on its side will squeeze the hydraulic rod one, which will cause the hydraulic rod two to push the laser detector to rotate, so that the laser detector is in contact with the light-shielding plate, and then the flatness of the semiconductor surface is detected.

[0019] 2. This application sets up an adjustment component that first compresses the hydraulic rod three, causing the hydraulic rod four to push the detection stage to rise. This, in conjunction with the rotating laser detector, performs semiconductor detection. At the same time, to ensure the stability of the semiconductor on the detection stage after the stage is raised, the counterweight will slide and compress the air storage bladder under the action of gravity, causing the fixing rod one to extend and be used to fix both sides of the semiconductor. Meanwhile, as the detection stage rises, the fixing rod two will be squeezed by the arc-shaped rod, pressing down on the left side of the semiconductor to improve the stability of the semiconductor during detection.

[0020] 3. This application removes dust from the semiconductor surface due to static electricity or natural adhesion by setting up a dust removal component. As the light shield moves down, the elastic airbag is squeezed, and the gas inside enters the air supply pipe through the adapter and is then sprayed out through the nozzle to perform the dust removal operation. At the same time, some gas is sprayed out through the jet pipe, and the resulting airflow impacts the fan blades to rotate, causing the nozzle to rotate and increasing its jet coverage. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the overall structure of the present invention. Figure 1 ;

[0022] Figure 2 This is a schematic diagram of the overall structure of the present invention. Figure 2 ;

[0023] Figure 3 This is a cross-sectional structural diagram of the present invention;

[0024] Figure 4 This is a schematic diagram of the structure of the light-shielding transmission component of the present invention;

[0025] Figure 5 This is a schematic diagram of the structure of the regulating component of the present invention. Figure 1 ;

[0026] Figure 6 This is a schematic diagram of the structure of the regulating component of the present invention. Figure 2 ;

[0027] Figure 7 This is a schematic diagram of the structure of the regulating component of the present invention. Figure 3 ;

[0028] Figure 8 This is a schematic diagram showing the positional relationship of the dust removal components of the present invention;

[0029] Figure 9 This is a schematic diagram of the structure of the dust removal component of the present invention;

[0030] Figure 10 This is a partial structural schematic diagram of the dust removal component of the present invention.

[0031] In the diagram: 100, base; 200, laser detector; 300, electric track; 400, movable platform; 500, detection platform; 600, support bracket one;

[0032] 700. Light-shielding transmission assembly; 701. Electric telescopic rod; 702. Connecting block; 703. Light-shielding plate; 704. Pressure rod; 705. Bracket II; 706. Hydraulic chamber I; 707. Hydraulic rod I; 708. Hydraulic rod II;

[0033] 800. Adjustment component; 801. Hydraulic chamber two; 802. Hollow frame; 803. Arc rod; 804. Hydraulic rod three; 805. Hydraulic rod four; 806. Counterweight; 807. Air storage bladder; 808. Air pressure chamber; 809. Fixing rod one; 810. Fixing rod two;

[0034] 900. Dust removal assembly; 901. Elastic airbag; 902. One-way valve; 903. Adapter; 904. Air supply pipeline; 905. Air jet pipeline; 906. Rotary joint; 907. Nozzle; 908. Fan blade. Detailed Implementation

[0035] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0036] In the description of this invention, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0037] Example 1, refer to Figure 1-4 A device for detecting the flatness of a semiconductor surface using laser includes a base 100, a laser detector 200 hinged to one side of the top of the base 100, an electric track 300 mounted on the other side of the top of the base 100, a movable stage 400 mounted on the electric track 300, and a detection stage 500 hinged to the middle of the upper surface of the movable stage 400.

[0038] A bracket 600 is mounted on the center of the upper surface of the base 100. A light-shielding transmission assembly 700 is mounted on the bracket 600. The light-shielding transmission assembly 700 includes an electric telescopic rod 701 mounted in the center of the bracket 600 and a second bracket 705 fixed inside the base 100. A connecting block 702 is mounted at the bottom of the movable rod of the electric telescopic rod 701. A light-shielding plate 703 is fixed to one side of the connecting block 702. The light-shielding plate 703 is made entirely of light-shielding material, and its overall structure can completely fit the laser detector 200. A pressure rod 704 is fixed to the other side of the connecting block 702. A hydraulic chamber 706 is fixed to the second bracket 705. Hydraulic rod 707 is slidably connected to one end of the piston inside the 6, and hydraulic rod 708 is slidably connected to the other end of the piston inside the hydraulic chamber 706. As the connecting block 702 moves the light shield 703 downward, the pressure rod 704 on its side will squeeze the hydraulic rod 707, which will increase the internal pressure of the hydraulic chamber 706, thereby pushing the hydraulic rod 708 to extend. Through the extension of the hydraulic rod 708, the laser detector 200 will rotate slightly. The hydraulic rod 707 is located on the movement trajectory of the pressure rod 704. The top of the hydraulic rod 708 is fixed to the bottom of the laser detector 200. A protruding pressure block is fixed to the bottom of the inner wall of the light shield 703. The light-shielding operation is carried out by setting up a light-shielding transmission assembly 700. The electric telescopic rod 701 pushes the connecting block 702 to move, thereby driving the light-shielding plate 703 to move down until it covers the detection table 500. At the same time, as the connecting block 702 moves, the pressure rod 704 on its side will squeeze the hydraulic rod 707, causing the hydraulic rod 708 to push the laser detector 200 to rotate, so that the laser detector 200 is in contact with the light-shielding plate 703, and then the flatness of the semiconductor surface is detected.

[0039] An adjustment assembly 800 is installed between the movable table 400 and the testing table 500. The adjustment assembly 800 includes a hydraulic chamber 2 801, a hollow frame 802, and an arc-shaped rod 803. A hydraulic rod 3 804 is slidably connected to one end of the hydraulic chamber 2 801 by a piston. A protruding pressure block is located directly above the hydraulic rod 3 804. A hydraulic rod 4 805 is slidably connected to the other end of the hydraulic chamber 2 801 by a piston. The hydraulic rod 4 805 has an arc-shaped structure and is fixed to the bottom of the testing table 500. The protruding pressure block fixed to the bottom of the inner wall of the light-shielding plate 703 will squeeze the hydraulic rod 3 804. At this time, the internal pressure of the hydraulic chamber 2 801 increases, causing the hydraulic rod 4 805 to push the testing table 500 to rotate slightly to accommodate the laser detector 200. The hollow frame 802 is fixed to the side of the testing table 500. A counterweight 806 is slidably connected inside the hollow frame 802. An air storage bladder 807 is fixed inside the hollow frame 802. An air pressure chamber 808, which communicates with the air storage bladder 807, is fixed to the outside of the hollow frame 802. A fixed rod 809 is slidably connected to the piston inside the air pressure chamber 808. As the testing platform 500 rotates, the counterweight 806 slides and squeezes the air storage bladder 807 under the action of gravity, causing the gas inside the air storage bladder 807 to be squeezed into the air pressure chamber 808, which increases the pressure inside the air pressure chamber 808, causing the fixed rod 809 to extend. An arc-shaped rod 803 is fixed to the upper surface of the movable platform 400. A fixed rod 810 is slidably connected through the inside of the testing platform 500, and a spring is fixed between the fixed rod 810 and the testing platform 500. The adjustment component 800 is first compressed by the hydraulic rod 3 804, causing the hydraulic rod 4 805 to push the detection stage 500 to rise. This, in conjunction with the rotating laser detector 200, performs semiconductor detection. At the same time, to ensure the stability of the semiconductor on the detection stage 500 after the rise, the counterweight 806 slides and compresses the air storage bladder 807 under the action of gravity, causing the fixing rod 1 809 to extend and be used to fix both sides of the semiconductor. Meanwhile, as the detection stage 500 rises, the fixing rod 2 810 is squeezed by the arc rod 803, pressing down on the left side of the semiconductor to improve the stability of the semiconductor during detection.

[0040] The specific working principle of this embodiment is as follows: First, the movable stage 400 and the detection stage 500 are moved to the left area by the electric track 300. Then, the semiconductor chip to be tested is placed inside the detection stage 500. Then, the movable stage 400 and the detection stage 500 are moved to the right area by the electric track 300. Then, the electric telescopic rod 701 is activated. The electric telescopic rod 701 pushes the connecting block 702 downward. As the connecting block 702 moves downward, it will drive the light shield 703 downward until the light shield 703 is in contact with the detection stage 500.

[0041] At the same time, as the connecting block 702 moves the light shield 703 down, the pressure bar 704 on its side will squeeze the hydraulic rod 707, which will increase the internal pressure of the hydraulic chamber 706, thereby pushing the hydraulic rod 708 to extend. Through the extension of the hydraulic rod 708, the laser detector 200 will rotate slightly until it is in contact with the light shield 703.

[0042] At the same time, the protruding pressure block fixed at the bottom of the inner wall of the light shield 703 will squeeze the hydraulic rod 3 804. At this time, the internal pressure of the hydraulic chamber 2 801 increases, causing the hydraulic rod 4 805 to push the detection table 500 to rotate slightly to adapt to the laser detector 200.

[0043] As the testing stage 500 rotates, the counterweight 806 slides and compresses the air storage bladder 807 under the action of gravity, causing the gas inside the air storage bladder 807 to be squeezed into the air pressure chamber 808. This increases the internal pressure of the air pressure chamber 808, causing the first fixing rod 809 to extend until it contacts both sides of the semiconductor chip, thus fixing both sides of the semiconductor chip. At the same time, as the testing stage 500 is raised, the second fixing rod 810 is squeezed by the arc-shaped rod 803, thus fixing the left side of the semiconductor chip and improving the stability of the semiconductor chip during testing.

[0044] Example 2, refer to Figure 2 , Figure 8-10 Based on Embodiment 1, two symmetrically arranged dust removal components 900 are mounted on the outer side of the light shield 703. Each dust removal component 900 includes an elastic airbag 901. A one-way valve 902 is mounted at the bottom of the elastic airbag 901. The flow direction of the one-way valve 902 is that air enters the interior of the elastic airbag 901 from the outside. When the light shield 703 is reset, new air is replenished into the elastic airbag 901 from the outside under the action of the one-way valve 902 to replenish the gas for the next dust removal operation. An adapter 903 is mounted at the top of the elastic airbag 901. An air supply pipe 904 is mounted at the top of the adapter 903. A nozzle 907 is rotatably connected to the bottom of the air supply pipe 904 through a rotary joint 906. Multiple fan blades 908 are mounted on the outer side of the nozzle 907. An air jet pipe 905 is mounted on the side of the adapter 903. The air jet direction of the air jet pipe 905 is adapted to the rotation direction of the fan blades 908. The dust removal component 900 is used to remove dust from the surface of the semiconductor chip due to static electricity or natural adhesion. As the light shield 703 moves down, the elastic airbag 901 is squeezed, and the gas inside enters the air supply pipe 904 through the adapter 903 and is then sprayed out through the nozzle 907 to perform the dust removal operation. At the same time, some gas is sprayed out through the jet pipe 905, and the resulting airflow impacts the fan blade 908 to rotate, causing the nozzle 907 to rotate and increase its jet coverage.

[0045] The specific working principle of this embodiment is as follows: Based on the first embodiment, as the light shield 703 moves down, the elastic airbag 901 is squeezed. The gas inside enters the air supply pipe 904 through the adapter 903, then passes through the rotary joint 906, and is then sprayed out through the nozzle 907 to perform dust removal. At the same time, some gas is sprayed out through the jet pipe 905. The airflow generated impacts the fan blade 908 and causes it to rotate, which in turn causes the nozzle 907 to rotate, increasing its jet coverage.

[0046] After the test is completed, when the light shield 703 is reset, new air is introduced into the elastic airbag 901 from the outside under the action of the one-way valve 902 to replenish the gas, so as to facilitate the next dust cleaning operation.

[0047] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. An apparatus for detecting flatness of a semiconductor surface using a laser, comprising a base (100), characterized in that, A laser detector (200) is hinged to one side of the top of the base (100), and an electric track (300) is mounted on the other side of the top of the base (100). A movable stage (400) is mounted on the electric track (300), and a detection stage (500) is hinged to the middle of the upper surface of the movable stage (400). A bracket (600) is mounted on the middle of the upper surface of the base (100). A light-shielding transmission assembly (700) is mounted on the bracket (600). The light-shielding transmission assembly (700) includes an electric telescopic rod (701) mounted in the middle of the bracket (600) and a bracket (705) fixed inside the base (100). A connecting block (702) is mounted at the bottom of the movable rod of the electric telescopic rod (701). A light-shielding plate (703) is fixed on one side of the connecting block (702). A pressure rod (704) is fixed on the other side of the connecting block (702), and a hydraulic chamber (706) is fixed on the second bracket (705). A hydraulic rod (707) is slidably connected to one end of the hydraulic chamber (706) by a piston, and a hydraulic rod (708) is slidably connected to the other end of the hydraulic chamber (706) by a piston. The hydraulic rod (707) is located on the movement trajectory of the pressure rod (704), and the top end of the hydraulic rod (708) is fixed to the bottom of the laser detector (200). As the connecting block (702) moves the light shield (703) down, the pressure bar (704) on its side will squeeze the hydraulic rod one (707), which will increase the internal pressure of the hydraulic chamber one (706), thereby pushing the hydraulic rod two (708) to extend. Through the extension of the hydraulic rod two (708), the laser detector (200) will rotate slightly until it is in contact with the light shield (703).

2. The apparatus for detecting flatness of a semiconductor surface using a laser according to claim 1, wherein An adjustment assembly (800) is installed between the movable platform (400) and the testing platform (500). The adjustment assembly (800) includes a hydraulic chamber two (801), a hollow frame (802), and an arc-shaped rod (803). A hydraulic rod three (804) is slidably connected to one end of the hydraulic chamber two (801) by a piston, and a hydraulic rod four (805) is slidably connected to the other end of the hydraulic chamber two (801). The hollow frame (802) is fixed to the side of the testing platform (500), and a counterweight (806) is slidably connected inside the hollow frame (802). An air storage bladder is fixed inside the hollow frame (802). (807), an air pressure chamber (808) communicating with the air storage bladder (807) is fixed on the outside of the hollow frame (802). The piston inside the air pressure chamber (808) is slidably connected to a fixed rod (809). The hydraulic rod (805) is arc-shaped and fixed to the bottom of the testing platform (500). The arc-shaped rod (803) is fixed to the upper surface of the movable platform (400). The testing platform (500) is penetrated and slidably connected to a fixed rod (810). A spring is fixed between the fixed rod (810) and the testing platform (500). A protruding pressure block is fixed to the bottom of the inner wall of the light shield (703). As the light shield (703) moves down, the protruding pressure block fixed at the bottom of the inner wall of the light shield (703) will squeeze the hydraulic rod three (804). At this time, the internal pressure of the hydraulic chamber two (801) increases, causing the hydraulic rod four (805) to push the detection table (500) to rotate slightly to adapt to the laser detector (200). As the testing stage (500) rotates, the counterweight (806) slides and squeezes the gas storage bladder (807) under the action of gravity, causing the gas inside the gas storage bladder (807) to be squeezed into the air pressure chamber (808), which will increase the pressure inside the air pressure chamber (808), causing the first fixing rod (809) to extend until it contacts both sides of the semiconductor chip, and is used to fix both sides of the semiconductor chip. At the same time, as the testing stage (500) is raised, the second fixing rod (810) will be squeezed by the arc rod (803), which is used to fix the left side of the semiconductor chip, thereby improving the stability of the semiconductor chip during testing.

3. The apparatus for detecting flatness of a semiconductor surface using a laser according to claim 1, wherein The outer side of the light-shielding plate (703) is equipped with two symmetrically arranged dust removal components (900).

4. The apparatus for detecting flatness of a semiconductor surface using a laser according to claim 3, wherein The dust removal assembly (900) includes an elastic airbag (901), a one-way valve (902) is installed at the bottom of the elastic airbag (901), an adapter (903) is installed at the top of the elastic airbag (901), an air supply pipe (904) is installed at the top of the adapter (903), a nozzle (907) is rotatably connected to the bottom of the air supply pipe (904) via a rotary joint (906), a plurality of fan blades (908) are installed on the outside of the nozzle (907), and an air jet pipe (905) is installed on the side of the adapter (903).

5. The apparatus for detecting flatness of a semiconductor surface using a laser according to claim 4, wherein The jet direction of the jet pipe (905) is adapted to the rotation direction of the fan blade (908).

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