Multi-surface adhesion device with angular tolerance and its adhesion testing system
By employing a multi-layered structure design of mushroom-shaped biomimetic nanoarray layers and flexible buffer layers, combined with a single pendulum collision testing system, the performance issues of adhesion technology under multiple materials and dynamic conditions are resolved. This achieves non-destructive, reversible adhesion and performance evaluation, making it suitable for various engineering surfaces.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
- Filing Date
- 2025-10-11
- Publication Date
- 2026-06-09
AI Technical Summary
Existing adhesion technologies are difficult to achieve non-destructive, reusable, and applicable to a variety of material surfaces in complex environments, and lack performance verification methods under dynamic impact conditions.
A multi-layer structure design combining a mushroom-shaped biomimetic nanoarray layer and a flexible buffer layer was adopted, and a collision adhesion test system based on the pendulum principle was used to verify the angle tolerance and dynamic adhesion performance.
It achieves non-destructive and reversible adhesion under different materials and angular deviations, can work stably in complex environments, and its adhesion performance can be quantitatively evaluated through a testing system. It is suitable for a variety of engineering surfaces.
Smart Images
Figure CN121068465B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of biomimetic adhesion technology, and in particular to a multi-surface adhesion device with angular tolerance and its adhesion testing system. Background Technology
[0002] In complex environments, the demand for surface fixation, temporary installation, and flexible clamping is increasing. However, traditional mechanical clamping, magnetic adsorption, and electrostatic adsorption methods have certain limitations. For example, mechanical clamping may damage the target surface, magnetic adsorption is only suitable for metallic materials, and electrostatic adsorption is greatly affected by environmental humidity and surface charge distribution. Therefore, developing an efficient, stable, and versatile adhesion device applicable to various material surfaces is of great significance. Existing novel adhesion technologies include vacuum adsorption, electromagnetic adsorption, and adhesive fixation, but all have limitations. Vacuum adsorption requires a specific airtight environment and is difficult to use in open environments; electromagnetic adsorption is only effective for metals; and adhesives limit reusability due to aging and contamination issues. Therefore, there is an urgent need for a non-destructive, reusable adhesion solution applicable to different materials.
[0003] In nature, geckos, insects, and other organisms utilize the microstructure of their feet to achieve controllable and efficient adhesion through van der Waals forces, and these adhesions are reusable. Inspired by this, biomimetic nanoadhesion technology has become a research hotspot. Patent document CN221921597U discloses a biomimetic microstructure adhesion device, including a rigid support layer and a microstructure layer on its surface, achieving surface adhesion through van der Waals forces. This device can provide a certain adhesive force to the surface under static conditions.
[0004] However, the above invention has the following shortcomings: when there is a deviation in the angle of the target surface or a change in roughness, the microstructure does not make sufficient contact with the surface, resulting in a decrease in adhesion. In addition, the performance verification of this device mainly relies on static pull-off tests, and there is a lack of standardized test methods for dynamic impact or collision conditions, making it impossible to accurately evaluate the adhesion effect of the device under instantaneous impact in practical applications. Summary of the Invention
[0005] The purpose of this invention is:
[0006] 1. A multi-surface adhesion device with angular tolerance is provided, which can achieve non-destructive and reversible adhesion under different materials and contact angles.
[0007] 2. A collision adhesion test system based on the principle of a simple pendulum is provided, which can simulate the dynamic collision process in actual applications and quantitatively verify the performance of the device.
[0008] To achieve the above objectives, the present invention adopts the following technical solution:
[0009] The aforementioned adhesion device includes an upper substrate layer (1), a lower substrate layer (2), a buffer layer (3), a biomimetic nanoarray layer (4), and a connection structure (5).
[0010] The upper substrate layer (1) and the lower substrate layer (2) are made of high-strength, lightweight materials (such as carbon fiber composites or aluminum alloys) to ensure the structural stability and lightweight of the device and facilitate its integrated application.
[0011] The aforementioned buffer layer (3) is disposed between the upper base layer (1) and the lower base layer (2), and is made of flexible polymer material or open-cell foam material. It is used to absorb impact and provide deformation space so that the device can adapt to surface angle deviation of 0-15°.
[0012] The aforementioned biomimetic nanoarray layer (4) is disposed on the outer surface of the upper substrate layer (1) and fixed by flexible adhesion technology. This layer is composed of mushroom-shaped microstructures and utilizes van der Waals forces to achieve efficient and reversible adhesion.
[0013] The aforementioned connection structure (5) penetrates the buffer layer (3) and is made of fine and soft steel wire rope, elastic fiber or high-strength polymer fiber. Both ends are specified to penetrate the upper fixing hole (11) and the lower fixing hole (21), and are mechanically fixed to the upper base layer (1) and the lower base layer (2) to ensure that when subjected to tensile stress, the upper base layer (1), the buffer layer (3) and the lower base layer (2) form a stable whole, maintain the structural integrity of the device and provide high tensile strength.
[0014] To verify the performance of the above-mentioned adhesion device, this invention also proposes a collision adhesion test system based on the principle of a simple pendulum, which includes:
[0015] Fixture (6): Used to mount the adhesive object to be tested;
[0016] Suspended pendulum structure (7): connected to an adhesive device via a suspension rope, used to simulate the free collision process in space operation;
[0017] First angle adjustment mechanism (8): controls the collision impulse by adjusting the initial height of the pendulum;
[0018] Second angle adjustment mechanism (9): used to change the contact angle between the adhesive device and the target surface to achieve angle tolerance performance testing;
[0019] This testing system can perform standardized verification of the performance of the adhesion device under controllable impulse and angle conditions, and realistically simulate dynamic adhesion conditions.
[0020] Compared with the prior art, the technical solution of the present invention has the following advantages:
[0021] Highly efficient and reliable adaptive adhesion capability. The device of this invention achieves non-destructive and reversible adhesion under angular deviations of 0–15° through the synergistic effect of a biomimetic mushroom-shaped microstructure and a flexible buffer layer. It is suitable for a variety of materials and complex surfaces, and has the advantages of being lightweight and having high strength.
[0022] Standardized verification of impact adhesion performance. The proposed test system is based on the principle of simple pendulum impulse, which can quantitatively evaluate adhesion performance under controllable impulse and angle conditions. The experimental conditions are repeatable, the data are accurate, and it can realistically simulate the actual working conditions of dynamic operation.
[0023] Excellent environmental adaptability and promising engineering applications. The adhesion device maintains stable performance even in extreme temperatures ranging from -120℃ to 150℃. Combined with the environmental simulation function of the testing system, it provides an integrated technical solution for tasks such as surface fixation, temporary component installation, and flexible clamping in complex environments. Attached Figure Description
[0024] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.
[0025] Figure 1 A schematic diagram of the adhesive device structure provided by the present invention;
[0026] Figure 2 This is a schematic diagram of the collision adhesion testing system provided by the present invention;
[0027] Figure 3 This is a schematic diagram of the single pendulum collision test principle provided by the present invention;
[0028] Figure 4 The image shows the test results of the adhesion device provided by the present invention on the glass surface under a pendulum test;
[0029] Figure 5 The image shows the test results of the adhesion device provided by the present invention on the glass surface under high and low temperature cycling tests of -120℃ to 150℃.
[0030] Figure 6 This is a schematic diagram of the main body of the adhesion device provided by the present invention. Detailed Implementation
[0031] The present invention will now be described in detail, and the technical solutions in the embodiments of the present invention will be clearly and completely described. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0032] 1. Fabrication of biomimetic adhesion microarrays
[0033] In preparing the biomimetic adhesive microarray, this invention references existing patented methods (CN113148944A, CN112590083A) and employs a dipping method for fabricating biomimetic microstructures. This method involves repeatedly dipping a high-viscosity elastomer precursor solution onto a low-surface-energy elastomer template and curing it at a set temperature to obtain a regularly arranged microstructure array.
[0034] During the preparation process, by controlling the surface characteristics of the template and the curing conditions of the precursor, various microstructural units with different morphologies can be obtained, including cylindrical, conical, and mushroom-shaped units. Among them, the mushroom-shaped microstructure, due to its larger apical diameter than that of the cylinder, can more effectively increase the actual contact area during contact, thereby significantly improving adhesion strength and reversibility.
[0035] Therefore, this invention ultimately selected a mushroom-shaped biomimetic microstructure as the adhesion unit from a variety of candidate structures, and used it for the subsequent construction and performance testing of the multi-surface adhesion device.
[0036] 2. Construction of a multi-surface adaptive adhesion device
[0037] refer to Figure 1 Based on the biomimetic adhesive microarray provided by this invention, a multi-surface adhesive device with angular tolerance function is further constructed. Its specific structural composition and assembly method are as follows:
[0038] Upper substrate layer (1): 1 mm thick carbon fiber plate, used to set the biomimetic nanoarray layer, providing lightweight and high-strength support.
[0039] The lower base layer (2) is a 5 mm thick aluminum alloy plate, which serves as a rigid support and fixing interface.
[0040] Buffer layer (3): 10 mm thick open-cell polyurethane foam, which is bonded to the upper and lower base layers with high-strength double-sided adhesive. It has good flexibility and elastic recovery ability and can achieve 0–15° angle tolerance adjustment.
[0041] Bionic nanoarray layer (4): It is fixed to the outer surface of the upper substrate layer by silicone adhesive and is composed of mushroom-shaped microstructures, which can achieve efficient and reversible adhesion to the surface of various space materials.
[0042] Connection structure (5): 0.3mm high-strength steel wire rope, which passes through the upper fixing hole (11), the buffer layer and the lower fixing hole (21) in sequence. The two ends are knotted and glued to ensure that the overall structure is stable and has high tensile strength.
[0043] Through the synergistic design of the aforementioned multi-layered composite structure, the device significantly improves its adaptability to different surface morphologies and angular deviations, while also possessing excellent reusability and spatial environment stability. It can be widely used in tasks such as surface fixation, temporary component installation, and flexible clamping in complex environments.
[0044] 3. Design of a single pendulum collision test system
[0045] To comprehensively evaluate the effectiveness of this adhesion device, refer to Figure 2 and Figure 3 A dedicated pendulum test system was designed, with the following features:
[0046] Fixture (6): Used to install the adhesive object and ensure the target position is stable during the test;
[0047] Suspended pendulum structure (7): It is connected to the adhesion device by a suspension rope to eliminate the interference of gravity on the adhesion test;
[0048] First angle adjustment mechanism (8): Adjusts the initial height of the pendulum to achieve different collision impulses;
[0049] Second angle adjustment mechanism (9): Adjusts the contact angle between the adhesive device and the target surface to simulate an angle deviation of 0–15° and realize angle tolerance test.
[0050] The system mounts the object to be bonded onto a fixed frame and maintains perpendicular contact with the bonding device below via a suspension rope to eliminate the interference of gravity on the adhesion test. The suspension rope is 1.005m long, and the bonding device weighs 1.204kg. The impact impulse can be adjusted by changing the suspension angle α to test the bonding performance of the device on different materials. Adjusting the fixed frame angle β can simulate contact angle variations from 0–15°, thereby verifying its angle tolerance capability.
[0051] Different surface tests
[0052] refer to Figure 4 Under a 1kg load, a pendulum impact adhesion test was conducted using a glass surface as the typical adhesion target. The initial height was controlled by adjusting the suspension angle α to obtain different impact impulses. The fixing frame angle β was adjusted in 5° intervals within the range of 0° to 10° to simulate contact angle deviation. The test results show that the device can achieve stable adhesion when the impulse is 0.76 Ns, 1.22 Ns, and 2.41 Ns, as shown in the table below:
[0053] Adhesive Object Test conditions Suspension angle Fixed frame angle impulse size glass surface 1 11.5 0 Impulse 0.76 Ns 2 18 0 Impulse 1.22 Ns 3 18 5 Impulse 1.22 Ns 4 18 10 Impulse 1.22 Ns 5 36 0 Impulse 2.41 Ns 6 36 5 Impulse 2.41 Ns 7 36 10 Impulse 2.41 Ns
[0054] The results show that the device can maintain stable performance in a typical impulse range of 0.76 Ns to 2.41 Ns, and has the ability to adapt to a wider range of impulse conditions, thus meeting the adhesion requirements under different intensity impacts.
[0055] Furthermore, although this embodiment only uses glass surfaces as the test object, this device is also applicable to a variety of engineering surfaces such as metal plates, phased array antennas, and coated structures, demonstrating good multi-surface adaptability and application value.
[0056] 5. High-temperature cycling test
[0057] In addition, to examine the performance stability of the adhesion device under extreme environments, reference was made. Figure 5 High and low temperature cycling tests were conducted. Within a temperature range of -120°C to 150°C, the temperature was varied in 20°C increments, with each temperature point held for 5 minutes, and adhesion tests were performed on the glass surface. The test results show that the adhesion performance of the device remains stable throughout the entire temperature range without significant degradation, verifying its good adaptability to high and low temperature environments.
[0058] Furthermore, this device is not only suitable for glass surfaces, but also maintains reliable adhesion performance under alternating hot and cold conditions on various surfaces such as metal plates, phased array antennas, and coated structures.
[0059] In summary, the biomimetic adhesion device proposed in this invention significantly improves adhesion performance under different surface morphologies and angular deviations through the synergistic design of a mushroom-shaped microstructure and a flexible buffer layer. Experimental results show that the device not only maintains stable operation under typical impulse conditions of 0.76 Ns–2.41 Ns, but also has the ability to adapt to a wider impulse range. Furthermore, its adhesion performance remains stable under high and low temperature cycling conditions from -120℃ to 150℃, demonstrating excellent environmental adaptability and durability.
[0060] Furthermore, this device is non-destructive, reversible, and reusable, making it suitable for a variety of typical surfaces, including glass, metal plates, phased array antennas, and coated structures. In practical applications, this device can be widely used for temporary fixing and surface mounting of engineering structures; flexible clamping and handling operations in complex environments; reversible connection and disassembly between surfaces of multiple materials; and stable surface adhesion under high and low temperature conditions.
[0061] In summary, the adhesion device proposed in this invention has good environmental adaptability, structural compatibility and applicability to multiple scenarios, and has broad application prospects in fields such as industrial manufacturing, testing and maintenance, automated fixtures and flexible operation.
[0062] The foregoing description enables those skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims
1. A multi-surface adhesion device with angular tolerance, characterized in that: The adhesion device includes an upper substrate layer (1), a lower substrate layer (2), a buffer layer (3) disposed between the two, a biomimetic nanoarray layer (4) located on the upper substrate layer (1) away from the buffer layer (3), and a connection structure (5) penetrating the buffer layer (3). The upper base layer (1) is composed of 1 mm thick carbon fiber, which is used to set the biomimetic nanoarray layer and provide lightweight and high-strength support; the lower base layer (2) is composed of 5 mm thick aluminum alloy plate, which serves as rigid support and fixed interface. The buffer layer (3) is made of flexible polymer or open-cell foam material, which can absorb impact and generate controllable deformation when there is an angular deviation of 0 to 15° on the target surface, so as to maintain full contact between the biomimetic nanolayer (4) and the target surface. The biomimetic nanoarray layer (4) is composed of mushroom-shaped microstructures with a top diameter larger than the diameter of the column, which increases the actual contact area and achieves non-destructive and reversible adhesion by means of van der Waals forces. The connecting structure (5) is made of steel wire rope, elastic fiber or high fiber strength reinforced material, penetrates the buffer layer (3) and is connected to the upper base layer (1) and the lower base layer (2) respectively, so as to form a stable whole when subjected to tensile stress; The multi-surface adhesion device with angular tolerance is characterized in that the device can maintain repeatable adhesion function within a temperature range of -120℃ to 150℃.
2. The multi-surface adhesion device with angular tolerance according to claim 1, characterized in that: The buffer layer (3) is connected to the upper base layer (1) and the lower base layer (2) by one of the following methods: adhesive bonding, hot pressing or mechanical fixation.
3. The multi-surface adhesion device with angular tolerance according to claim 1, characterized in that: The upper base layer (1) and the lower base layer (2) are respectively provided with an upper fixing hole (11) and a lower fixing hole (21). The two ends of the connecting structure (5) pass through the upper fixing hole (11) and the lower fixing hole (21) respectively and are fixed.
4. The multi-surface adhesion device with angular tolerance according to claim 1, characterized in that: The biomimetic nanoarray layer (4) is fixed to the surface of the upper substrate layer (1) by flexible adhesion technology. It is composed of mushroom-shaped microstructures and can be prepared by dip-taking, etching or 3D printing.
5. The multi-surface adhesion device with angular tolerance according to claim 1, characterized in that: The upper substrate layer (1) and the lower substrate layer (2) are made of carbon fiber composite material or aluminum alloy, and the buffer layer is made of flexible polymer or open-cell foam material.
6. A collision adhesion testing system for evaluating the performance of a multi-surface adhesion device with angular tolerance as described in claim 1, characterized in that: The aforementioned testing system includes Fixture (6) is used to mount the object to be adhered; The suspended pendulum structure (7) is connected to the adhesive device by a suspension rope; The first angle adjustment mechanism (8) is used to adjust the initial height and impulse of the suspension. The second angle adjustment mechanism (9) is used to adjust the contact angle between the adhesive device and the adhesive object.
7. The testing system according to claim 6, characterized in that: The system includes an angle adjustment mechanism and an impulse control structure. The angle adjustment mechanism can precisely adjust the contact angle between the adhesive device and the target surface within the range of 0° to 15°. The impulse control structure can adjust the impact impulse within the range of 0.1Ns to 3Ns to quantitatively test the adhesive performance of the adhesive device under different angles and impact conditions.