Laboratory equipment with heating function

Abstract

The invention relates to a laboratory device (1) having a heating plate arrangement (3), comprising: a placement plate (5) made of glass ceramic, on which a heatable placement surface (4) for at least one container is formed; a thermal insulation layer (6); a heating element (7), in particular a heating foil; and a thermally conductive layer (8), in particular made of an aluminum sheet; wherein the heating element (7) is arranged between the placement plate (5) and the heat insulating layer (6), and the heat insulating layer (6) is arranged between the heating element (7) and the heat conducting layer (8).

Description

[0001] The invention relates to a laboratory device with a heating function.

[0002] In practice, such laboratory devices are known in various embodiments, for example as magnetic stirrers with a placeable heating surface or also as laboratory hot plates, and are used for heating a medium located in a container.

[0003] Laboratory devices known in practice with a high heating power are built relatively high in order to protect the respective electronics contained in the laboratory device from thermal overload.

[0004] In view of the potential risk of thermal overload of the electronics of such laboratory devices, the heating power of laboratory devices with a heating function that are built relatively compact has had to be limited accordingly to date.

[0005] It is therefore the task of the invention to provide a laboratory device of the type mentioned at the outset with a heating function, which can have a compact design despite a relatively high heating power.

[0006] In order to solve this task, a laboratory device is provided with the means and features of the independent claims relating to the laboratory device. In particular, in order to solve this task, a laboratory device is provided with a hot plate structure, which comprises a placeable plate made of glass ceramic, on which a placeable heating surface for at least one container is formed, a thermal insulation layer, a heating element, in particular a heating foil, and a heat-conducting layer, in particular a heat-conducting layer made of aluminum plate, wherein the heating element is arranged between the placeable plate and the thermal insulation layer, and the thermal insulation layer is arranged between the heating element and the heat-conducting layer.

[0007] In order to prevent the laboratory device from being thermally overloaded as a result of the heating function, it is therefore provided that the hot plate structure has a placeable plate made of glass ceramic, on which a placeable heating surface is formed, a thermal insulation layer, a heating element, in particular a heating foil, and a heat-conducting layer, in particular a heat-conducting layer made of aluminum plate. The heating element is arranged between the placeable plate and the thermal insulation layer, and the thermal insulation layer is arranged between the heating element and the heat-conducting layer.

[0008] The heating element, in particular the heating foil, not only transfers heat in the direction of the placeable heating surface, but also in the opposite direction, i.e. here in the direction of the base body of the laboratory device, which can contain temperature-sensitive electronics and / or temperature-sensitive mechanical components. The layer sequence of the hot plate structure prevents the components of the laboratory device arranged below the hot plate structure from overheating.

[0009] The thermal insulation layer arranged below the heating element, in particular below the heating foil, reduces the heat transfer from the heating element of the hot plate structure to the components on the other side of the thermal insulation layer of the laboratory device.

[0010] The additional thermally conductive layer of the heating plate structure arranged below the thermal insulation layer can make it possible for heat to be conducted through the thermal insulation layer, thus contributing to the protection of the magnetic stirrer from thermal overload.

[0011] In one embodiment of the laboratory device, there can also be a tolerance compensation layer arranged between the thermal insulation layer and the thermally conductive layer. The tolerance compensation layer enables the thermal insulation layer to reliably rest on the thermally conductive layer and can also act as additional thermal insulation. For example, a high-temperature-resistant fiber mat can be used as the tolerance compensation layer.

[0012] In order to reliably dissipate heat and thus as reliably as possible to protect temperature-sensitive components of the laboratory device, it can be advantageous if the heating plate structure has a thermally conductive profile. The thermally conductive profile can be made of a thermally conductive material, for example aluminum. The thermally conductive profile can be connected to the thermally conductive layer, so that heat absorbed by the thermally conductive layer can be transferred to the thermally conductive profile by the connection to the thermally conductive profile. In particular, when the thermally conductive profile has a larger volume and / or a larger heat capacity relative to the thermally conductive layer, it is also possible to transfer larger amounts of heat to the thermally conductive profile and to keep the thermally conductive profile away from temperature-sensitive components of the laboratory device. In this case, the thermally conductive profile can act as a heat sink for the heating plate structure.

[0013] In one embodiment of the thermally conductive profile, the profile is designed as a closed-loop profile. The thermally conductive profile can be frame-shaped and / or have, for example, heat dissipation structures. As heat dissipation structures, for example, fins and / or channels and / or openings and / or drillings and / or perforations and / or grooves can be provided in the thermally conductive profile, by means of which the surface area of the thermally conductive profile can be enlarged, whereby the ability of the thermally conductive profile to dissipate heat to the surroundings can be increased. Furthermore, the thermally conductive profile can form at least a part of the outer contour of the heating plate structure. In this way, heat introduced into the thermally conductive profile can be released to the surroundings via the outer side of the thermally conductive profile. This leads to particularly effective temperature management and thus to particularly effective protection of the laboratory device equipped with the heating plate structure from thermal overload. In this case, the thermally conductive profile can act as a heat exchanger.

[0014] In one particularly advantageous embodiment of the laboratory device, the placement plate is bonded to the thermally conductive profile. The placement plate can be connected to the thermally conductive profile, for example, by means of a high-temperature-resistant, preferably double-sided adhesive tape, a high-temperature-resistant adhesive and / or a high-temperature-resistant silicone. In this way, a particularly compact construction of the heating plate structure and simple manufacture are possible. Then, separate fasteners, for example, clips or screws, for fixing the placement plate to the thermally conductive profile can be dispensed with.

[0015] The heating elements of the heating plate structure can be arranged and / or designed such that only the internal area of ​​the plate with the placement surface is heated. If the connection between the placement plate and the thermally conductive profile is achieved by bonding in the edge area of ​​the placement plate, which, for example, surrounds the placement surface on the placement plate in a closed manner, the bonding between the placement plate and the thermally conductive profile (i.e., preferably double-sided high-temperature resistant tape) can be protected from thermal overload.

[0016] In a preferred embodiment of the laboratory equipment, the heatable surface of the heating element is positioned at a certain distance from the heat-conducting profile. This avoids direct contact between the heat-conducting surface and the profile, preventing heat from directly entering the profile.

[0017] The heatable surface can be surrounded by the non-heated edge region of the heating element. The non-heatable edge region can be made, for example, of a mica material with good thermal insulation properties. By using the non-heatable edge region of the heating element, heat can be at least reduced or at least largely prevented from directly entering the thermally conductive profile from the plane of the heating plate structure where the heating element is located. If too much heat is transferred into the thermally conductive profile in this plane, it will negatively affect the efficiency of the thermally conductive profile as a heat exchanger.

[0018] For example, a heating wire or heating strip can be arranged within the heatable surface. The heating element can have at least one material-free cutout on one edge side. This is to avoid direct contact between the heating element and the thermally conductive profile. At least one material-free cutout on one edge side can be adjacent to the heatable surface of the heating element.

[0019] In one embodiment of the laboratory equipment, the heating element may be specified to have support surfaces only in its corner regions, particularly the four corner regions. These support surfaces may be made of mica material. The heating element can contact the thermally conductive profile via these support surfaces when in use. The previously mentioned material-free cutouts can be formed between the support surfaces in the corner regions of the heating element. Therefore, the contact area between the heating element and the thermally conductive profile is minimized. Furthermore, the four support surfaces formed in the corner regions facilitate the centralization of the heatable surface of the heating element within the heating plate structure.

[0020] The thermally conductive profile can have a geometry in which the projection of the thermally conductive profile onto the placement plate surrounds the placement surface of the placement plate in a closed manner to form a placement surface for the container.

[0021] The insulation layer can be made of, for example, microporous insulation materials, polyurethane, rock wool and / or glass wool.

[0022] As mentioned earlier, the thermally conductive profile can be designed in a frame shape. The thermally conductive profile can also define an internal space in which the heating elements and / or insulation and / or tolerance compensation layers of the heating plate structure are arranged. Thus, the thermally conductive profile can both accommodate the aforementioned layers of the heating plate structure and absorb heat emitted from the heating elements but not transferred to the mounting plate. The thermally conductive profile can be positioned between the mounting plate and the thermally conductive layer.

[0023] The heating plate structure may also have a heat shielding layer, particularly a heat shielding layer made of stainless steel. The heat shielding layer may be arranged on the heat-conducting layer. Specifically, the heat shielding layer may be arranged on the side of the heat-conducting layer opposite to the heating element and / or the heat-conducting profile. The heat shielding layer can serve as an additional thermal protection component to prevent thermal overload of laboratory equipment equipped with a heating plate structure.

[0024] For example, if the heat-conducting layer is interrupted in some areas or its thickness is reduced, it is advantageous to use a heat-shielding layer, particularly one made of stainless steel. This may be the case when minimizing the magnetic shielding effect of the heat-conducting layer, which could impair the magnetic coupling between the stirring position of laboratory equipment and the magnetic absorber (e.g., a stirring magnet). In such cases, the heat-shielding layer acts as an additional barrier to block heat that could more easily pass through the heat-conducting layer at these locations.

[0025] In one embodiment of the laboratory equipment, the heating plate structure has a support plate on its underside opposite to the placement plate. The support plate can be made of, for example, plastic and forms an enclosed portion of the heating plate structure. The plastic support plate also provides additional insulation, thus contributing to thermal protection of the laboratory equipment equipped with the heating plate structure. The support plate can be connected to the thermally conductive profile of the heating plate structure, particularly by screws. The screw connection between the support plate and the thermally conductive profile presses the various layers of the heating plate structure, as well as the aforementioned tolerance-compensating layer, together.

[0026] Laboratory equipment may have at least one light source, such as an LED, particularly an RGB LED, for generating luminous indicators on a placement plate. Thus, luminous indicators for status indication can be generated on the placement plate (e.g., near the placement surface of the placement plate) using such LEDs.

[0027] In one embodiment of the laboratory equipment, a light source is positioned on a heating plate structure, for example, on the aforementioned support plate of the heating plate structure. The light source is preferably oriented such that it radiates in the direction of the placement plate. To generate a luminous indication on the top side of the placement plate, the placement plate may be at least partially transparent or translucent. Thus, the placement plate can be illuminated from below to generate the desired luminous indication on the top side of the placement plate.

[0028] The heating plate structure can, for example, have a light shield on the support plate for each light source to prevent light from escaping from the sides. Using this light shield, light leakage through the gap between the support plate and the heat-conducting profile can be minimized or even completely prevented from escaping from the sides. The gap between the support plate and the heat-conducting profile can be sealed opaquely to prevent light leakage through the gap. The light shield can act as a reflector and can be provided with a reflective coating for this purpose, particularly a highly reflective coating, such as a white paint finish. In one embodiment, the laboratory equipment can have multiple light sources for generating luminous indicators. These multiple light sources can be, for example, LEDs, preferably RGB LEDs and / or pixel LEDs, and / or connected to each other via a data bus. Using pixel LEDs as light sources (which can be connected to each other via a data bus) simplifies the wiring of the light sources and also facilitates targeted control of the light sources to produce particularly clear luminous indicators on the placement plate of the laboratory equipment. For example, multiple light sources can be arranged on a single circuit board.

[0029] In particular, when at least one light source is arranged on the aforementioned support plate of the heating plate structure, it is advantageous if the thermally conductive profile has at least one light-transmitting opening, through which light from the at least one light source can be guided to and through a placement plate that is preferably at least partially transparent or translucent. Thus, the thermally conductive profile thermally separates the at least one light source from the heating element of the heating plate structure, while simultaneously generating the aforementioned luminous indication on the placement plate.

[0030] In one embodiment of the laboratory equipment, the thermally conductive profile is provided with a plurality of such light-transmitting openings, which preferably surround the placement surface in a ring-like manner. In this way, an luminous indicator can be generated that surrounds the placement surface of the laboratory equipment in a ring-like manner on the placement plate.

[0031] At least one light-transmitting opening in the thermally conductive profile can form a luminous segment for the luminous indicator. The thermally conductive profile can reliably protect at least one light source from thermal overload caused by heat released from the heating element of the heating plate structure. Therefore, the thermally conductive profile serves as a spacer between at least one light source and the heating element, and can also absorb and dissipate heat generated by at least one light source. If the placement plate is at least partially transparent or translucent in at least the area of ​​at least one light-transmitting opening in the thermally conductive profile, and / or particle-free, and / or has frosted glass and / or filters and / or coloring layers, it can help to form a visually appealing luminous indicator on the placement plate. In particular, the use of frosted glass, filters, and / or coloring layers can help to form a uniform and therefore particularly attractive luminous indicator on the surface of the placement plate.

[0032] A seal can be disposed between the mounting plate and the thermally conductive profile. The seal prevents moisture ingress. The seal can have at least one light-transmitting segment that defines the effective light emission cross-section of at least one light-transmitting opening in the thermally conductive profile. Therefore, the seal can serve as an aperture to give the desired shape to the light segment generated by means of the light-transmitting opening in a particularly simple manner.

[0033] The seal may also have a sealing lip, preferably arranged in a closed manner, formed on one side of the seal, which faces the placement plate of the heating plate structure when the seal is in use. The sealing lip can contribute to the sealing effect of the seal. The seal may preferably be made of rubber or silicone.

[0034] In one embodiment of the laboratory apparatus, the heat-conducting layer of the heating plate structure may be interrupted in at least one region, particularly at least in the region of the stirring position of the laboratory apparatus, and / or filled with an inlay that does not provide magnetic shielding (e.g., a stainless steel inlay), and / or the thickness of the heat-conducting layer may be reduced, for example from 2 mm to 0.5 mm, 0.4 mm, or 0.3 mm. Therefore, magnetic shielding can be minimized or completely avoided through the heat-conducting layer between the stirring position and the magnetic receiver (e.g., a stirring magnet).

[0035] In one embodiment of the laboratory apparatus, the apparatus is designed as a magnetic stirrer with heating functionality and at least one stirring position. In another embodiment, the apparatus is designed as a laboratory heating plate.

[0036] The invention is described in more detail below based on embodiments, but the invention is not limited to these embodiments. Further embodiments are obtained by combining features of one or more claims with each other and / or by combining one or more features of the embodiments. In the drawings: Figure 1 A cross-sectional side view of a laboratory apparatus designed as a heatable magnetic stirrer is shown, which has a heating plate structure according to the invention. Figure 2 An exploded view of the heating plate structure is shown for illustration. Figure 1 The components and layer sequence of the heating plate structure of the laboratory equipment shown, and Figure 3 A cross-sectional side view of a heating plate structure with a frame-shaped thermally conductive profile made of aluminum is shown to illustrate a light-transmitting opening formed in the thermally conductive profile, which allows for the generation of an luminous indicator on the top side of the placement plate of the heating plate structure. Figure 4 An isometric view of the heating plate structure is shown to illustrate the luminous indication comprising multiple luminous segments on the surface of the plate.

[0037] All the accompanying drawings show at least a portion of the laboratory equipment, generally indicated by 1, which is designed as a magnetic stirrer 2 with heating function.

[0038] To provide heating functionality, laboratory equipment 1 includes a heating plate structure 3 having a heatable placement surface 4 for at least one container.

[0039] according to Figure 2 The heating plate structure 3 includes a placement plate 5 made of glass ceramic, which is at least partially transparent or translucent at least on its edge sides, and a placement surface 4 is formed on the placement plate 5. Furthermore, the heating plate structure 3 includes a heat insulation layer 6, a heating element 7 in the form of heating foil, and a heat-conducting layer 8 formed of an aluminum plate.

[0040] The heating element 7 is arranged below the placement plate 5, and therefore between the placement plate 5 and the insulation layer 6. The insulation layer 6 itself is arranged below the heating element 7, and therefore between the heating element 7 and the heat-conducting layer 8. Between the insulation layer 6 and the heat-conducting layer 8, the heating plate structure 3 includes a tolerance compensation layer 9 formed of a high-temperature resistant fiber pad.

[0041] The heating plate structure 3 also includes a heat-conducting profile 10, which is made of aluminum and serves as a heat sink. The heat-conducting profile 10 is connected to the heat-conducting layer 8 to facilitate the transfer of heat from the heat-conducting layer 8 to the heat-conducting profile 10.

[0042] Figure 2 The heat-conducting profile 10 is shown to be a closed, wraparound frame profile, and forms part of the outer contour of the heating plate structure 3.

[0043] according to Figure 2 The heat-conducting profile 10 is arranged between the placement plate 5 and the heat-conducting layer 8 of the heating plate structure 3. The placement plate 5 of the heating plate structure 3 is connected via... Figure 2 The high-temperature resistant double-sided adhesive tape 11 below the placement plate 5 shown is connected to the thermally conductive profile 10, i.e., bonded. The tape 11 is arranged on the underside of the placement plate 5 in the edge region of the placement plate 5. The placement surface 4 on the placement plate 5 is arranged within the projection of the tape 11 on the placement plate 5.

[0044] The heating element 7 is arranged and / or designed such that only the internal area of ​​the placement plate 5 with the placement surface 4 is heated. In this way, the bond between the placement plate 5, made of glass-ceramic, and the thermally conductive profile 10, made of aluminum, is protected from thermal overload damage.

[0045] The heat insulation layer 6 of the heating plate structure 3 is made of microporous heat insulation material.

[0046] As previously described, the thermally conductive profile 10 is designed in a frame shape. The thermally conductive profile 10 includes an internal space 12 in which the heating element 7 (i.e., heating foil), the insulation layer 6, and the tolerance compensation layer 9 are arranged. The heating plate structure 3 also includes a heat shield layer 13, which is made of stainless steel and is disposed on the thermally conductive layer 8. The heat shield layer 13 is disposed on the underside of the thermally conductive layer 8, away from the heating element 7 and the thermally conductive profile 10.

[0047] The heating plate structure 3 has a support plate 14 made of plastic on its lower side opposite to the placement plate 5. Therefore, the support plate 14 forms the lower closed portion of the heating plate structure 3. For example, the support plate 14 can be connected to the heat-conducting profile 10 by screws.

[0048] Figure 2 The laboratory apparatus 1 is shown to have a series of light sources 15, which are used to generate luminous indicators 27 on the placement plate 5 of the heating plate structure 3 and are arranged on a strip circuit board. For example, the status of the laboratory apparatus 1 (e.g., the temperature of the placement surface 4) can be output by the luminous indicators 27.

[0049] The light source 15 is an RGB LED, also known as a pixel LED, and is arranged on the heating plate structure 3, specifically on the support plate 14 of the heating plate structure 3. The pixel LEDs are connected to each other via a data bus 16. This allows the light source 15 to be easily wired and to generate a particularly attractive luminous indicator on the top side of the at least partially transparent or translucent placement plate 5 to indicate the status of the laboratory equipment 1.

[0050] In order to conduct the light emitted from the light source 15 for generating a light indication to the placement plate 5 and to allow it to pass through the placement plate 5, the thermally conductive profile 10 has a series of light-transmitting openings 17. The light emitted from the light source 15 can be guided from below through the light-transmitting openings 17 to and ultimately pass through the placement plate 5, which is at least partially transparent or translucent in at least that area. Figure 2 The heat-conducting profile 10 is shown to have a plurality of such light-transmitting openings 17, which surround the placement surface 4 on the placement plate 5 in a ring-like manner. For example, the light-transmitting openings 17 may extend in a tapered shape from bottom to top or from top to bottom. Each light-transmitting opening 17 allows a light-emitting segment to be formed on the top side of the glass-ceramic placement plate 5 of the heating plate structure 3.

[0051] The placement plate 5 is designed to be at least partially transparent or translucent and free of particles in the area of ​​the light-transmitting opening 17, and / or is provided with frosted glass and / or a filter and / or a coloring layer, so as to facilitate the formation of the various light-emitting segments of the light-emitting indicator to be generated on the top side of the placement plate 5.

[0052] Laboratory equipment 1 is designed as a magnetic stirrer 2 and has a stirring position 18.

[0053] To minimize or completely avoid magnetic shielding between the stirring position 18 of the laboratory equipment 1 and the magnetic receiver (e.g., the stirring magnet), the thermally conductive layer 8 is interrupted in at least one region (i.e., in the region of the stirring position 18) and / or filled with a suitable (i.e., non-magnetically shielding) inlay (e.g., a stainless steel inlay) and / or the thickness of the thermally conductive layer can be reduced, for example from 2 mm to 0.5 mm, 0.4 mm, or 0.3 mm.

[0054] Figure 2 The view of the heating element 7 shows that the heating element 7 has a heatable surface 19, which is arranged or formed on the heating element 7 such that when the heating element 7 is in use, the heatable surface 19 is at a certain distance from the thermally conductive profile 10. In this way, heat generated by the heatable surface 19 of the heating element 7 is prevented from being directly released onto the thermally conductive profile 10.

[0055] Figure 2 It is also shown that the heatable surface 19 of the heating element 7 is surrounded by a non-heated edge region 20 of the heating element 7. This edge region 20 can be formed of mica material, which has good thermal insulation properties, thereby preventing heat from being directly released onto the thermally conductive profile 10. In the non-heated edge region 20 of the heating element 7, the heating element 7 also has a material-free cutout 28 on the edge side. The material-free cutout 28 is adjacent to the heatable surface 19 of the heating element 7. The advantage of providing the material-free cutout 28 in the edge region 20 of the heating element 7 is that contact between the heating element 7 and the thermally conductive profile 10 in these areas can be reduced or even completely avoided. Accordingly, heat transfer from the heatable surface 19 of the heating element 7 to the thermally conductive profile 10 in this area is also minimized or even completely avoided.

[0056] The heating element 7 can be powered by the power connector 21.

[0057] The accompanying drawing also shows a seal 22 disposed between the placement plate 5 and the thermally conductive profile 10. The seal 22 has a surrounding sealing lip 23 facing the placement plate 5 and prevents moisture from entering between the placement plate 5 and the thermally conductive profile 10.

[0058] The seal 22 is equipped with a series of light-transmitting segments 24. These segments 24 define and form the effective light emission cross-section of the light-transmitting openings 17 in the heat-conducting profile 10. In this way, the light-transmitting openings 17 can be formed in the heat-conducting profile 10, for example, using a milling cutter. By using a milling cutter, the light-transmitting openings 17 within the heat-conducting profile 10 acquire a specific shape, namely a rounded shape. If it is desired to form angular or rectangular light-emitting segments 25 on the mounting plate 5, this can be achieved in a particularly simple manner using light-transmitting segments 24 of corresponding shapes within the seal 22.

[0059] Therefore, the seal 22 and its light-transmitting section 24 serve as a shaped aperture, which ultimately determines the shape of the light-emitting section 25 on the placement plate 5 of the laboratory equipment 1.

[0060] To prevent light from escaping from the side of the contact plane between the support plate 14 and the thermally conductive profile 10, the heating plate structure 3 has a light shield 26 on the support plate 14 for each light source 15. The light shield 26 extends into the light-transmitting opening 17 of the thermally conductive profile 10, preventing the light source 15 arranged within the light shield 26 from emitting light from the side through the gap that may exist between the support plate 14 and the thermally conductive profile 10, which could affect the appearance of the laboratory equipment 1.

[0061] The light shield 26 may have a reflective coating, for example, in the form of a white paint finish, and is designed to match the emission angle of the light source 15 so as not to impair upward light emission. This facilitates the formation of a bright light-emitting segment 25 on the top side of the placement plate 5 as a light indicator 27.

[0062] Reference tag list 1. Laboratory equipment 2. Magnetic stirrer 3. Heating plate structure 4 Placement surface 5. Placement board 6. Insulation layer 7 Heating element 8 Thermal conductive layer 9 Tolerance Compensation Layer 10 Thermally conductive profiles 11. Adhesive tape 12 10 interior space 13. Heat shielding layer 14 Support Plate 15 Light Sources 16 Data Bus 17 Light-transmitting openings Stirring position on 18 1 19 7 heatable noodles 20 7 unheated edge area 21 Power connector for 7 22 Seals 23 22 sealing lip The light-transmitting sections in 24 and 22 25 light-emitting segments 26 14 for use with 15 sunshade 27 Illuminated Indicator Incisions in 28 and 20 29. Support surface.

Claims

1. Laboratory apparatus (1) with a heating function, wherein The laboratory device (1) has a hotplate structure (3) comprising a placing plate (5) made of glass ceramic, on which a heatable placing surface (4) for at least one container is formed, a heat insulation layer (6), a heating element (7), in particular a heating foil, and a heat conduction layer (8), in particular made of aluminum plate, wherein the heating element (7) is arranged between the placing plate (5) and the heat insulation layer (6) and the heat insulation layer (6) is arranged between the heating element (7) and the heat conduction layer (8).

2. Laboratory equipment (1) according to the preceding claim, wherein The hotplate structure (3) has a tolerance compensation layer (9), in particular a high-temperature-resistant fiber mat, between the heat insulation layer (6) and the heat conduction layer (8).

3. Laboratory equipment (1) according to any one of the preceding claims, wherein The hotplate structure (3) has a heat-conducting profile (10), in particular made of aluminum, which is connected to the heat conduction layer (8).

4. Laboratory equipment (1) according to the preceding claim, wherein The heat-conducting profile (10) is a closed-loop profile and / or has a heat-dissipating structure and / or forms at least a part of the outer contour of the hotplate structure (3) and / or is arranged between the placing plate (5) and the heat conduction layer (8).

5. Laboratory equipment (1) according to either of the two preceding claims, wherein The placing plate (5) is bonded to the heat-conducting profile (10), for example by means of a high-temperature-resistant, preferably double-sided adhesive tape (11) and / or a high-temperature-resistant adhesive and / or by means of a high-temperature-resistant silicone.

6. Laboratory equipment (1) according to any one of the preceding claims, wherein The heating element (7) is arranged and / or designed such that only the inner region of the placing plate (5) which forms the placing surface (4) is heatable.

7. The laboratory equipment (1) according to any one of claims 3 to 6, wherein The heatable surface (19) of the heating element (7) is at a distance from the heat-conducting profile (10) and / or is surrounded by a non-heating edge region (20) of the heating element (7), which is in particular formed from a mica material, and / or wherein The heating element (7) has at least one edge-side material-free cutout (28) adjacent to the heatable surface (19) of the heating element (7) and / or one support surface (29) in each case in a corner region of the heating element (7), which, in the state of use, is in contact with the heat-conducting profile (10) by means of the support surface.

8. Laboratory device (1) according to any one of the preceding claims, wherein the heat insulation layer (6) is made of a microporous insulation material, polyurethane, rock wool and / or glass wool.

9. Laboratory equipment (1) according to any one of the preceding claims, wherein The heat-conducting profile (10) is arranged between the placing plate (5) and the heat conduction layer (8) and / or is designed in a frame shape and / or defines an inner space (12) in which the heating element (7) and / or the heat insulation layer (6) and / or the tolerance compensation layer (9) are arranged.

10. Laboratory equipment (1) according to any one of the preceding claims, wherein The heating plate structure (3) has a heat shield (13), in particular a heat shield (13) made of stainless steel sheet, which is arranged on the heat-conducting layer (8), in particular on the side of the heat-conducting layer (8) facing away from the heating element (7) and / or the heat-conducting profile (10).

11. Laboratory equipment (1) according to any one of the preceding claims, wherein The heating plate structure (3) has a support plate (14), in particular a support plate made of plastic, on the underside facing away from the placement plate (5).

12. Laboratory equipment (1) according to any one of the preceding claims, wherein The laboratory device (1) has at least one light source (15), in particular an LED, for producing a light-emitting indication on the placement plate (5).

13. Laboratory equipment (1) according to the preceding claim, wherein The at least one light source (15) is arranged on the heating plate structure (3), in particular on the support plate (14) of the heating plate structure (3), preferably wherein The heating plate structure (3) preferably has one light shield (26), preferably a reflective light shield (26), for preventing lateral light emission for each light source (15) on the support plate (14).

14. Laboratory equipment (1) according to any one of the preceding claims, wherein In order to produce the light-emitting indication, the laboratory device (1) has a plurality of light sources (15) in the form of LEDs, in particular in the form of RGB LEDs and / or in the form of pixel LEDs, preferably connected to one another by a data bus (16).

15. Laboratory equipment (1) according to any one of the preceding claims, wherein The heat-conducting profile (10) has at least one light-transmissive opening (17) through which light from at least one light source (15) can be guided to the placement plate (5) and through the placement plate (5), preferably wherein The heat-conducting profile (10) has a plurality of such light-transmissive openings (17), which preferably surround the placement surface (5) in an annular manner.

16. Laboratory equipment (1) according to the preceding claim, wherein The placement plate (5) is at least partially transparent or translucent and / or is particle-free and / or has a ground glass and / or a filter and / or a colored layer at least in the region of the at least one light-transmissive opening (17).

17. Laboratory equipment (1) according to either of the two preceding claims, wherein A seal (22) is arranged between the placement plate (5) and the heat-conducting profile (10), preferably wherein the seal (22) has a sealing lip (23) facing the placement plate (5) and / or at least one light-transmissive section (24) which defines the effective light emission cross section of the at least one light-transmissive opening (17) of the heat-conducting profile (10).

18. Laboratory equipment (1) according to any one of the preceding claims, wherein The heat-conducting layer (8) is interrupted in at least one region of the laboratory device (1), in particular at least in the region of at least one stirring location (18), and / or is filled with a magnetic inlay, for example a stainless steel inlay, and / or the layer thickness of the heat-conducting layer (8) is reduced, for example from 2 mm to 0.5 mm or 0.4 mm or 0.3 mm, in order to minimize or completely avoid magnetic shielding between the stirring location (18) and a magnetic receiver, for example a magnetic bar.

19. Laboratory equipment (1) according to any one of the preceding claims, wherein The laboratory device (1) is designed as a laboratory heating plate or a magnetic stirrer (2) having a heating function and at least one stirring location (18).

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