Laser processing device for processing a workpiece, use of a laser processing device, method for laser processing a workpiece, and corresponding computer program product

Abstract

A laser machining device (100) for machining a workpiece (12), in particular for laser cutting or laser welding, is disclosed. The device (100) has: an interface (14) for coupling to a laser beam source for machining a laser beam (15); an outlet opening (11) for processing the laser beam (15); and an optical system (20) located between the interface and the outlet opening (11). The optical system (20) has at least one laser beam guiding device (25) for guiding the machining laser beam (15) in the beam path to the outlet opening (11). The laser beam guiding device (25) comprises at least two high-frequency laser scanners (30) connected in series in the beam path in the propagation direction z of the processing laser beam (15). The high-frequency laser scanners (30) each provide a maximum setting angle for deflecting the machining laser beam in a first setting plane xz. The series connection of the high-frequency laser scanners (30) achieves a maximum total set angle on a first set plane xz.

Description

Technical Field

[0001] This invention relates to a laser processing apparatus for processing workpieces, the uses of the laser processing apparatus, a method for laser processing workpieces, and a computer program product. Background Technology

[0002] Laser processing apparatuses are used to perform laser processing on workpieces, for example in methods such as laser cutting, which involves the thermal separation of materials using a laser beam, or in laser welding. Such laser processing apparatuses may have a laser processing head. The laser processing apparatus or laser processing head guides and shapes the laser beam tool, i.e., the processing laser beam, onto the workpiece in the most efficient manner possible.

[0003] Depending on the type of workpiece, such as sheet thickness and material, the type of processing, such as laser cutting or laser welding, and the desired processing outcome, such as maximizing cutting speed or avoiding porosity during welding, different laser beams may be optimal for the processing objective. Known laser processing apparatuses typically provide an invariant optical aspect ratio for the processing laser beam. However, in practice, this represents a trade-off: the invariant aspect, particularly for medium to large sheet thicknesses, is associated with losses in, for example, cut quality, i.e., losses related to roughness and burr adhesion, and lower feed rates.

[0004] In recent years, various laser processing equipment manufacturers have developed zoom optics to adapt the spot size of the focused processing laser beam to the corresponding application, such as the sheet thickness and sheet material during laser cutting.

[0005] A further step in adapting laser beam tools to the machining process is a method in which the intensity distribution and / or beam quality, such as the product of beam parameters, can also be adapted to laser applications. Various solutions in this direction are known from the prior art, see US 8781269 B2, US 9250390 B2, US 9346126 B2, EP 2730363 A1, EP2762263 A1, DE2821883 B1, DE102015116033 A1, EP2778746 B1, DE102015101263 A1, DE102008053397 B4.

[0006] High-frequency beam oscillation is a technique in dynamic beam forming (DBS) technology, and its advantage is that almost any intensity distribution and temperature field can be generated in the processing area, thus allowing maximum flexibility in adapting to workpiece type, such as sheet thickness and / or sheet quality. It is also known that significantly better processing results can be obtained by adjusting the processing laser beam in this way, for example, see Goppold et al.: Chanden und Herausforderungen der dynamischen Strahlformung, Deutscher Schneidkongress, 2018; Goppold et al.: Dynamic Beam Shaping Improves Laser Cutting of Thick Steel Plates, Industrial Photonics, 2017; Goppold et al.: Laserschmelzschneiden mit dynamischer Strahlformung, Fraunhofer IWSJahresbericht, 2015; Mahrle et al.: theoretical aspects of fiber laser cutting, Journal of Physics D Applied Physics, 2009. US2022 / 0143756 A1 describes a processing apparatus for laser processing of a workpiece, the processing apparatus having a first laser beam guide device arranged and designed such that it guides the processing laser beam to a second laser beam guide device and causes the processing laser beam to move dynamically, particularly to be dynamically shaped.

[0007] Various techniques are employed for the lateral deflection of the processing laser beam—also known as scanning the laser beam. Examples include galvanometer scanners, piezoelectric scanners, voice coil scanners, and MEMS scanners. The aim of these techniques is to deflect the processing laser beam as quickly as possible, for example, at high frequencies and laterally in a plane parallel to the workpiece surface, and to make the processing laser beam as wide as possible, i.e., with a large angle over a large lateral scanning range. The deflection frequency is also called the set frequency, and the deflection angle is also called the set angle. However, due to physical and technical reasons, high deflection frequencies such as 10 kHz and large deflection angles such as >±5 mrad for processing laser beams cannot be simultaneously achieved with known laser scanners used for laser processing of workpieces. These physical and technical reasons arise from, for example, the inherent frequencies and mechanical stability of the components of the processing apparatus, resulting in the acceleration of moving elements and the forces required for motion. Summary of the Invention

[0008] The purpose of this invention is to provide a laser processing apparatus and a method for laser processing workpieces, which provides a processing laser beam in a simple and optimized manner.

[0009] This objective is achieved by the laser processing apparatus for processing workpieces according to claim 1, the application according to claim 7, the method for laser processing workpieces according to claim 8, and the computer program product according to claim 13.

[0010] One embodiment relates to a laser processing apparatus, particularly a laser processing head, for processing workpieces, especially for laser cutting or laser welding, the laser processing apparatus having:

[0011] - An interface for connecting to a laser beam source used to process laser beams;

[0012] - An exit opening for the laser beam used in this processing; and

[0013] - An optical system located between the interface and the exit opening, the optical system having at least one laser beam guiding device for guiding the processing laser beam in the beam path to the exit opening;

[0014] The laser beam guiding device includes at least two high-frequency laser scanners connected in series in the propagation direction of the processing laser beam in the beam path, each of which is designed to deflect the processing laser beam by at least a set angle.

[0015] Each high-frequency laser scanner in the high-frequency laser scanner is designed to provide a maximum set angle in a first set plane for deflecting the processing laser beam, and the maximum total set angle in the first set plane is achieved by the series connection of the high-frequency laser scanners.

[0016] The above-described embodiment allows the setting angle of each high-frequency laser scanner to be set within a range up to a maximum setting angle. This setting angle allows the processing laser beam of the laser processing apparatus to be deflected in a first setting plane for processing the workpiece. Specifically, the first setting plane can be the plane containing the relevant setting angle and propagation direction of the processing laser beam. The setting angles of each high-frequency laser scanner in the first setting plane can be added together in series to obtain the total setting angle. In this way, the scanning range—that is, the range in which the processing laser beam can be deflected on the workpiece—can be advantageously expanded in a first direction extending in the first setting plane, while maintaining the high frequency of the high-frequency laser scanner.

[0017] Therefore, the above implementation allows for a generally increased maximum set angle, despite the use of a high-frequency laser scanner. This is possible rather than optimizing the set frequency and deflection (i.e., the set angle) of a single multi-axis scanner, and thus only a compromise between set frequency and deflection can be achieved, in which the frequency cannot be high if the set angle is large. A large deflection, i.e., a large scanning range, is achieved by cascading at least two or more high-frequency laser scanners (i.e., set frequencies of at least 500 Hz) in the propagation direction of the processing laser beam, thereby enabling a larger scanning range while simultaneously having a high-frequency set frequency.

[0018] Furthermore, the set angle of the laser beam movement can be optimized independently of the set frequency. Additionally, a higher set frequency can provide a larger scanning range because multiple high-frequency laser scanners, such as more than two, can be connected in series. This allows for the expansion of the aforementioned physical and technical limitations of high-frequency laser scanners. Moreover, previously unsolvable hardware problems related to the aforementioned physical and technical limitations of high-frequency laser scanners can be solved through optimized operation of multiple high-frequency laser scanners, for example, through software, such as one or more program modules. In this way, workpiece processing and processing efficiency can be optimized.

[0019] In one modification, at least one high-frequency laser scanner in the high-frequency laser scanner can be designed to provide another maximum setting angle in a second setting plane. In this way, the scanning range can be expanded not only in the first direction but also in the second direction, particularly in a direction perpendicular to the first setting plane. Alternatively, each high-frequency laser scanner in the high-frequency laser scanner can be designed to provide another maximum setting angle in the second setting plane. This also allows the scanning range to be maximized. In other modifications, at least one high-frequency laser scanner in the high-frequency laser scanner can be designed to provide a maximum setting angle in a setting plane other than the first and second setting planes. In particular, the second setting plane can be the plane containing the relevant setting angle and propagation direction of the processing laser beam.

[0020] The first and second setting planes can be arranged at an angle and / or perpendicular to each other. This means that a wide scanning range can be flexibly obtained on both the first and second setting planes by processing the combined deflection of the laser beam. Due to the tandem connection of the high-frequency laser scanners, another maximum total setting angle can be achieved on the second setting plane. In this way, the scanning range can be significantly expanded on both the first and second setting planes by processing the deflection of the laser beam.

[0021] At least two high-frequency laser scanners in a high-frequency laser scanner can be designed to deflect the processing laser beam by the same or different set angles. Furthermore, at least two high-frequency laser scanners in a high-frequency laser scanner can be designed to provide a maximum set angle and another maximum set angle, such that the maximum set angle and the other maximum set angle are the same or different. This allows for flexible setting of the scanning range.

[0022] In another modification, at least one or each of the high-frequency laser scanners can be designed to deflect the processing laser beam in at least one set plane, wherein the set frequency is in the range of 0.5 kHz or greater, preferably between 1 kHz and 10 kHz. Furthermore, the maximum set angle can be less than or equal to 50 mrad, preferably between 1 mrad and 30 mrad, more preferably between 2 mrad and 20 mrad. The other maximum set angle can be less than or equal to 50 mrad, preferably between 1 mrad and 30 mrad, more preferably between 2 mrad and 20 mrad.

[0023] At least one or each of the high-frequency laser scanners may have at least one movable surface that at least partially reflects the processing laser beam and at least one controllable actuator for moving the surface. The at least one reflective movable surface may be selected from: dynamically oriented mirrors, dynamically tiltable mirrors, segmented mirrors with multiple dynamically oriented mirror segments, dynamically deformable mirrors, dynamically deformable mirrors with a variable radius of curvature (VRM), dual piezoelectric crystal dynamically deformable mirrors, dynamically deformable mirrors based on MEMS or MOEMS technology, and voice coil dynamically deformable mirrors. The at least one controllable actuator may be selected from piezoelectric actuators, electric motors, pneumatic motors, eccentrics, devices for generating oscillating electromagnetic fields, MEMS oscillators, voice coils, electrostatically movable actuators, galvanometer drivers, and multiple and / or combinations thereof. Preferably, the high-frequency laser scanner is a piezoelectric high-frequency laser scanner.

[0024] At least one or each of the high-frequency laser scanners may have at least one movable surface that at least partially reflects the processing laser beam and at least one controllable actuator for moving the surface, wherein each reflective movable surface is designed to be tilted by the actuator about at least one axis—also referred to as a tilting axis—located in a plane of the respective surface. A surface with one tilting axis is called a uniaxial surface. A surface with two tilting axes is called a biaxial surface. A surface with multiple tilting axes is called a multiaxial surface.

[0025] In one embodiment of the high-frequency laser scanner combination, a total of two reflective tiltable surfaces connected in series in the propagation direction of the processing laser beam can be provided. Each of these two reflective tiltable surfaces has an axis, and the two reflective tiltable surfaces differ in at least one parameter selected from a set frequency at which they can be tilted and a set angle at which they can be tilted. In this embodiment, two uniaxial surfaces are combined in series. In an alternative embodiment of the high-frequency laser scanner combination, at least two reflective tiltable surfaces connected in series in the propagation direction of the processing laser beam can be provided, wherein one or more uniaxial surfaces and one or more multiaxial surfaces are combined in series, more than two uniaxial surfaces are combined in series, or at least two multiaxial surfaces are combined in series. At least two of the surfaces in the alternative embodiments may be the same or different in at least one parameter selected from: the number of axes of each surface, a set frequency at which the surface can be dynamically tilted, and a set angle at which the surface can be dynamically tilted.

[0026] In a modification of the device with a tiltable surface featuring a high-frequency laser scanner, the following implementation can be achieved: the axes of each surface can be arranged at an angle to each other, for example, 90° or less. At least some of the surfaces connected in series can be arranged parallel to each other or at an angle. If a total of two reflective tiltable surfaces of a high-frequency laser scanner connected in series in the propagation direction of the processing laser beam are provided, one of the two surfaces can be configured with a set frequency higher than the other surface. Furthermore, the other surface can be configured with a set angle larger than the first surface.

[0027] In a combination of high-frequency laser scanners, at least two reflective tiltable surfaces are connected in series in the propagation direction of the processing laser beam. This combination of one or more uniaxial surfaces and one or more multiaxial surfaces, more than two uniaxial surfaces, or at least two multiaxial surfaces can achieve the following implementation: at least one high-frequency laser scanner can be configured to have a set frequency greater than at least one other high-frequency laser scanner. Furthermore, at least one high-frequency laser scanner can be configured to have a set angle greater than at least one other high-frequency laser scanner. At least two high-frequency laser scanners can be configured to have the same set frequency. The number of surfaces can be at least three, and each surface can have one axis. One surface can have at least two axes per surface, and another surface can have one axis per surface.

[0028] The following combinations of high-frequency laser scanners can be implemented in a laser beam guiding device: two equally fast multi-axis scanners can be combined, where the highest possible frequency can be achieved. Two equally fast multi-axis scanners can be connected in series, where the maximum possible scanning range is achieved. A multi-axis scanner with the highest possible frequency and a multi-axis scanner with the highest possible deflection can be arranged in series. Furthermore, a multi-axis scanner can be connected in series with a single-axis scanner. Two single-axis scanners can be combined in series, where one single-axis scanner is optimized for a set frequency, and the other single-axis scanner is optimized for a large set angle.

[0029] A control unit may be included in the laser processing apparatus for controlling the high-frequency laser scanner and / or the laser processing apparatus. The control unit may have one or more program modules for optimizing the set frequency and / or set angle and / or maximizing the set frequency and / or set angle. The laser processing apparatus and / or control unit may have a memory device. One or more components of the laser processing apparatus may be designed to be controllable and connected to the control unit via wired or wireless data transmission. One or more of the high-frequency laser scanners, particularly each high-frequency laser scanner, may be designed to be controllable, particularly individually controllable.

[0030] The laser processing apparatus can be designed as a processing head, and can be provided with means for moving the processing head. The laser beam source for processing the laser beam, particularly a laser beam source with a laser power greater than or equal to 1 kW, preferably between 1 kW and 100 kW, can be connected to the interface.

[0031] Another embodiment relates to the use of a laser processing apparatus according to the above embodiments and modifications thereof, the laser processing apparatus being used to perform at least one procedure selected from the following:

[0032] - Use at least one set frequency greater than or equal to 0.5 kHz, preferably in the range between 1 kHz and 10 kHz, and / or use at least one total set angle (∑α; ∑β), especially the maximum total set angle (∑α). 最大 ;∑β 最大 At least one of the maximum total set angles, and / or a laser beam source with a laser power greater than or equal to 1 kW, preferably between 1 kW and 100 kW, is used to process the workpiece;

[0033] - Using a laser processing apparatus designed as a processing head, the workpiece is processed by optimizing the motion trajectory of the processing laser beam on at least one workpiece plane, in particular according to at least one predetermined contour of the workpiece part to be cut or the weld seam, by means of redundant division of the motion trajectory of the processing laser beam between the device for moving the processing head and the high-frequency laser scanner.

[0034] - Concentrate the processing laser beam into the exit opening;

[0035] - Laser cutting is performed using a cutting gas beam that is eccentric to the processing laser beam, particularly for laser cutting to produce beveled cuts or for laser cutting of tubes.

[0036] - Laser cleaning;

[0037] - Laser hardening;

[0038] - Using a processing laser beam to remove filler materials, especially glass fibers, from CFRP materials; and

[0039] - Laser welding.

[0040] Another embodiment relates to a method for laser processing a workpiece using a laser processing apparatus according to the above embodiment and its modifications, particularly a method for laser cutting or laser welding; the method includes the following steps:

[0041] A processing laser beam is generated by a laser beam source;

[0042] The processing laser beam is guided in the beam path to the exit opening by at least one laser beam guiding device; and

[0043] By connecting at least two high-frequency laser scanners in series in the beam path along the propagation direction of the processing laser beam, the processing laser beam is deflected by at least one predetermined angle in each case.

[0044] Each high-frequency laser scanner in the high-frequency laser scanner provides a maximum setting angle in the first setting plane for deflecting the processing laser beam, and the maximum total setting angle in the first setting plane is achieved by the series connection of the high-frequency laser scanners.

[0045] In this method, at least one or each of the high-frequency laser scanners can provide another maximum setting angle in a second setting plane. Due to the cascading connection of the high-frequency laser scanners, another maximum total setting angle can be achieved in the second setting plane. The first and second setting planes can be arranged such that they are angular to each other and / or perpendicular. At least two of the high-frequency laser scanners can deflect the processing laser beam by the same or different setting angles. At least two of the high-frequency laser scanners can provide a maximum setting angle and / or another maximum setting angle, such that they are the same or different. At least one or each of the high-frequency laser scanners can deflect the processing laser beam in at least one setting plane, wherein the setting frequency is greater than or equal to 0.5 kHz, preferably between 1 kHz and 10 kHz. The maximum setting angle can be set in the range of less than or equal to 50 mrad, preferably from 1 mrad to 30 mrad, more preferably from 2 mrad to 20 mrad. Furthermore, another maximum setting angle can be set in the range of less than or equal to 50 mrad, preferably from 1 mrad to 30 mrad, more preferably from 2 mrad to 20 mrad.

[0046] In this method, the workpiece can be processed using at least one parameter selected from the following:

[0047] - At least one set frequency in the range of 0.5 kHz or greater, preferably between 1 kHz and 10 kHz;

[0048] - At least one set angle in the corresponding set angle in the set plane, in particular at least one maximum total set angle; and

[0049] - A laser beam source with a laser power greater than or equal to 1 kW, preferably between 1 kW and 100 kW.

[0050] Another embodiment relates to a computer program product comprising one or more program modules that cause an apparatus according to the foregoing embodiments and modifications thereof to perform the steps of the methods and modifications according to the foregoing embodiments and / or, particularly when the program modules are loaded into the memory device of the apparatus, to perform at least one program of the purpose according to the foregoing embodiments.

[0051] The embodiments and modifications of this laser processing apparatus can be used in the embodiments and modifications of the method for laser processing a workpiece. The workpiece may include at least one metal, i.e., it is metallic, and / or in the form of a metal plate. Using the above embodiments of the method for laser processing a workpiece, the same advantages and functions as the embodiments of the laser processing apparatus can be achieved, in particular, having the same and / or similar features.

[0052] It should be understood that the features described above and those explained below can be used not only in the specified combinations, but also in other combinations or individually, without departing from the scope of the invention. Attached Figure Description

[0053] The invention will now be described in more detail with reference to the accompanying drawings, which also disclose features essential to the invention. These exemplary embodiments are for illustrative purposes only and should not be construed as limiting. For example, the description of an exemplary embodiment having a large number of elements or components should not be construed as implying that all of these elements or components are necessary for the implementation. Rather, other exemplary embodiments may also include alternative elements and components, fewer elements or components, or additional elements or components. Unless otherwise stated, elements or components of different exemplary embodiments may be combined with each other. Modifications and variations described for one exemplary embodiment may also be applied to other exemplary embodiments. To avoid repetition, identical or corresponding elements are indicated by the same reference numerals in different figures and are not described multiple times. In the drawings:

[0054] Figure 1An example of a laser processing device is shown schematically;

[0055] Figure 2a An example of a laser beam guiding device is shown schematically;

[0056] Figure 2b schematically shown Figure 2a A modification of an example of a laser beam guiding device;

[0057] Figure 3a An example of a laser beam guiding device is shown schematically;

[0058] Figure 3b schematically shown Figure 3a A modification of an example of a laser beam guiding device;

[0059] Figure 4 A modified example of a laser processing device is shown schematically. Detailed Implementation

[0060] In the current context, the terms "high frequency," "high frequency," or "dynamic" can refer to frequencies greater than or equal to 0.5 kHz. This also applies to grammatical variations of the terms.

[0061] Figure 1 An example of a laser processing apparatus 100 for processing workpiece 12, particularly for laser cutting or laser welding, is schematically shown. The laser processing apparatus 100 is also referred to below as apparatus 100. In this example, the laser processing apparatus 100 is designed as a laser processing head. Apparatus 100 has: an interface 14 for connection to a laser beam source for processing laser beam 15; an exit opening 11 for processing the laser beam; and an optical system 20 located between the interface and the exit opening. The optical system 20 has at least one laser beam guiding device 25 for guiding the processing laser beam 15 to the exit opening in the beam path. The laser beam guiding device 25 includes at least two high-frequency laser scanners 30 connected in series in the beam path along the propagation direction z of the processing laser beam. Figure 1 As shown, the processing laser beam 15, after passing through the laser beam guide 25, i.e., behind the laser beam guide 25, can be deflected by the optical system 20 in the direction of the exit opening 11. Alternatively, the processing laser beam 15 can be guided in a straight line to the exit opening 11 (not shown) in the optical system 20 behind the laser beam guide 25.

[0062] Figure 2aThe laser beam guiding device 25 is schematically shown. Each of the high-frequency laser scanners 30 is designed to deflect the processing laser beam 15 by at least a predetermined angle α, which lies within a first predetermined plane xz. In this example, the first predetermined plane xz is spanned by the propagation direction z and a direction x orthogonal to the propagation direction z. Each of the high-frequency laser scanners 30 is designed to provide a maximum predetermined angle α within the first predetermined plane xz. 最大 This is used to deflect the processing laser beam 15. The series connection of the high-frequency laser scanner 30 provides the maximum total set angle ∑α in the first set plane xz. 最大 .

[0063] During the operation of the laser processing apparatus 100, the laser beam source connected to interface 14 (in) Figure 1 (Not shown) to generate a processing laser beam 15. The processing laser beam 15 is guided in the beam path to the exit opening 11 by an optical system 20. The processing laser beam 15 is deflected by a predetermined angle α in the beam path along the propagation direction z of the processing laser beam 15 by two high-frequency laser scanners 30 connected in series by a laser beam guiding device 25. Each of the high-frequency laser scanners 30 provides a maximum predetermined angle α in the first predetermined plane xz. 最大 This is used to deflect the processing laser beam. The cascaded connection of the high-frequency laser scanners achieves the maximum total set angle ∑α in the first set plane xz. 最大 .

[0064] Since the high-frequency laser scanners 30 are arranged sequentially along the propagation direction z of the processing laser beam 15, the set angle α of each high-frequency laser scanner 30 is added together in the first set plane xz during the operation of the device 100. This is a simple method to expand the scanning range. If both high-frequency laser scanners 30 are set to the maximum set angle α... 最大 Then the maximum total set angle ∑α is reached. 最大 Furthermore, the scanning range is maximized. Additionally, the total set angle deflected by the processing laser beam 15 is optimized independently of the set frequency of the high-frequency laser scanner 30. Moreover, the higher set frequency of the high-frequency laser scanner 30 can provide a larger scanning range.

[0065] Figure 2b It shows Figure 2aA modification of the example shown. In this modification, the high-frequency laser scanner 30 is further designed to deflect the processing laser beam 15 in the second setting plane yz by at least a setting angle β. In this example, the second setting plane yz is crossed by the propagation direction z and a direction y orthogonal to the propagation direction z. Furthermore, in this example, the second setting plane yz is orthogonal to the first setting plane xz. Each of the high-frequency laser scanners 30 is designed to provide a maximum setting angle β in the second setting plane yz. 最大 This is used to deflect the processing laser beam 15.

[0066] In addition to the maximum total set angle ∑α on the first set plane xz 最大 In addition, during the operation of this modified laser beam guiding device 25, the maximum total set angle ∑α on the second set plane yz can also be achieved through the series connection of the high-frequency laser scanner 30. 最大 Maximum total set angle ∑α 最大 and ∑β 最大 The high-frequency laser scanner 30 can be positioned on two predetermined planes, xz and yz, that is, on two orthogonal directions x and y that are perpendicular to the propagation direction z of the processing laser beam 15. Therefore, during scanning, the processing laser beam 15 can be deflected along an optimized path on the plane xy spanned by the directions x and y.

[0067] In this example, each of the high-frequency laser scanners 30 is designed to deflect the processing laser beam 15 in at least one of the set planes xz and yz, wherein the set frequency is, for example, 2 kHz, and the set angle is a maximum set angle α up to 50 mrad. 最大 and / or β 最大 Within the range, for example, 10 mrad.

[0068] Figure 3a It shows Figure 2a Another example of the laser beam guiding device 25 shown. Figure 3b The diagram shows... Figure 3a A modification of the example in the example, which is similar to Figure 2b In this example, each of the high-frequency laser scanners 30 has a movable surface 17 that reflects the processing laser beam 15 and at least one controllable actuator 19 for moving the surface 17. The reflective movable surface 17 is designed as a dynamic, i.e., high-frequency tiltable mirror made of SiC (silicon carbide). Alternatively, a glass substrate (e.g., fused silica) having a dielectric layer, a metal layer (e.g., copper), or a metal oxide layer can be used as the mirror. The dimensions of the surface 17 are selected in each case such that it corresponds to the diameter of the processing laser beam 15 at the corresponding mirror position. The actuator 19 is a piezoelectric actuator.

[0069] In this example modification, a segmented mirror with multiple dynamically oriented mirror segments, a dynamically deformable mirror, a dynamically deformable mirror with a variable radius of curvature (VRM), a dual piezoelectric crystal dynamically deformable mirror, a dynamically deformable mirror based on MEMS or MOEMS technology, or a voice coil dynamically deformable mirror can be used as a reflective movable surface 17.

[0070] exist Figure 3a In the example, two reflective tiltable surfaces 17 connected in series along the propagation direction z of the processing laser beam 15 are configured as a high-frequency laser scanner 30. Each of the surfaces 17 has a first axis a, and the surface 17 can be tilted about the first axis a by an actuator 19. The first axes a are each located in the plane of the respective surface 17, arranged perpendicular to the plane xz and parallel to each other. The set frequencies at which the surfaces 17 of the two high-frequency laser scanners 30 can be tilted about the first axis a, and the set angles at which the surfaces 17 of the two high-frequency laser scanners 30 can be tilted about the first axis a, can be predetermined to be different. In this respect, one of the high-frequency laser scanners 30 is optimized for high frequencies, and the other high-frequency laser scanner 30 is optimized for large deflections. In this embodiment of the high-frequency laser scanner 30, the two uniaxial surfaces 17 are combined in series.

[0071] exist Figure 3b In the illustrated modification, the two connected surfaces 17 each have a second axis b, which is arranged perpendicular to the first axis a, and the surfaces 17 can be tilted about the second axis b. The second axes b are each located in the plane of the respective surface 17, arranged perpendicular to the plane yz and parallel to each other. The set frequency at which the surfaces 17 can be tilted about the two axes a and b, and the set angle at which the surfaces 17 can be tilted about the axes a and b, can be the same or different. In this embodiment of the high-frequency laser scanner 30, the two multi-axis surfaces 17 are combined in series.

[0072] In another modification of this example, a high-frequency laser scanner 30 having a first axis a on its surface 17 and another high-frequency laser scanner 30 having a first axis a and a second axis b on its surface 17 are combined. The set frequency at which the surface 17 can tilt about the respective axes a and b, and the set angle at which the surface 17 can tilt about the respective axes a and b, can be the same or different. In this embodiment of the high-frequency laser scanner 30, a single-axis surface 17 and a multi-axis surface 17 are combined in series.

[0073] Figure 4 A modification of the laser processing apparatus 100 is shown. Figure 4In this embodiment, the laser processing apparatus 100 has a laser source 82 located at interface 14. Alternatively, the laser beam source 82 can be connected to interface 14 via a transmission optical fiber (not shown). A control unit 84 is connected to controllable components of the apparatus 100, particularly a high-frequency laser scanner 30 connected to the laser beam guiding device 25, via wired or wireless data transmission. The optical system 20 may include other optical elements, such as lenses (not shown). Figure 4 As shown, the optical system 20 may include a deflector 35, which deflects the processing laser beam 15 deflected by the high-frequency laser scanner 30 to the exit opening 11.

[0074] List of reference numerals

[0075] 11. Exit opening

[0076] 12 workpieces

[0077] 14 Interfaces

[0078] 15. Processing laser beams

[0079] 17 Surface

[0080] 19 Actuators

[0081] 20 Optical System

[0082] 25 Laser beam guiding device

[0083] 30 High-frequency laser scanners

[0084] 35 deflecting mirror

[0085] 82 Laser Beam Source

[0086] 84 Control Device

[0087] 100 Laser processing equipment

[0088] xz Define plane

[0089] yz sets the plane

Claims

1. Laser machining device (100), in particular a laser machining head, for machining a workpiece (12), in particular for laser cutting or laser welding, having: - an interface (14) for coupling with a laser beam source for a machining laser beam (15); - an exit opening (11) for the machining laser beam; and - an optical system (20) between the interface and the exit opening, having at least one laser beam guiding device (25) for guiding the machining laser beam in a beam path to the exit opening; wherein the laser beam guiding device comprising at least two high-frequency laser scanners (30) connected in series in the beam path in a propagation direction (z) of the machining laser beam, which are each designed for deflecting the machining laser beam by at least one set angle (a, b); characterized in that Each of the high-frequency laser scanners (30) is designed to provide a maximum set angle (a 最大 ) for deflecting the machining laser beam in a first set plane (xz) and wherein a maximum total set angle (∑a 最大 ) in the first set plane (xz) is achieved by the series connection of the high-frequency laser scanners (30).

2. The device as claimed in claim 1, wherein At least one of the high-frequency laser scanners (30) is designed to provide a further maximum set angle (β 最大 ) in a second set plane (yz).

3. The device as claimed in claim 2, wherein the first set plane (xz) and the second set plane (yz) are arranged perpendicular to one another; and / or wherein each of the high-frequency laser scanners (30) is designed to provide a further maximum set angle (β 最大 ) in the second set plane (yz); and / or wherein a further maximum total set angle (∑β 最大 ) in the second set plane (yz) is implemented by a series connection of the high-frequency laser scanners.

4. The device as claimed in one of the preceding claims, wherein each of the high-frequency laser scanners (30) is designed to deflect the machining laser beam in at least one set plane (xz; yz) with a set frequency in a range of greater than or equal to 0.5 kHz, preferably 1 kHz and 10 kHz; and / or wherein the maximum set angle (a 最大 ) is less than or equal to 50 mrad, preferably 1 mrad to 30 mrad, more preferably 2 mrad to 20 mrad; and / or wherein the further maximum set angle (β 最大 ) is less than or equal to 50 mrad, preferably 1 mrad to 30 mrad, more preferably 2 mrad to 20 mrad.

5. The device as claimed in one of the preceding claims, wherein at least one or each of the high-frequency laser scanners (30) has at least one movable surface (17) that reflects the machining laser beam and at least one controllable actuator (19) for moving the surface, and / or wherein the at least one reflective movable surface (17) is selected from the group consisting of: a dynamically orientable mirror, a dynamically tiltable mirror, a segmented mirror having a plurality of dynamically orientable mirror segments, a dynamically deformable mirror, a dynamically deformable mirror having a variable radius of curvature (VRM), a bimorph piezoelectric dynamically deformable mirror, a dynamically deformable mirror based on MEMS or MOEMS technology, and a voice coil dynamically deformable mirror, and / or wherein the at least one controllable actuator (19) is selected from the group consisting of: a piezoelectric actuator, an electric motor, a pneumatic motor, an eccentric, a device for generating an oscillating electromagnetic field, a MEMS oscillator, a voice coil, an electrostatically movable actuator, a galvanometer driver, a plurality thereof and / or a combination thereof.

6. The device as claimed in one of the preceding claims, wherein a control unit (84) for controlling the high-frequency laser scanner (30) and / or the laser machining device (100) is provided, the control unit (84) having one or more program modules for optimizing and / or maximizing the set frequency and / or the set angle; and / or wherein the laser machining device (100) is designed as a machining head and is provided with means for moving the machining head; and / or wherein the interface is coupled with a laser beam source (82) for the machining laser beam, in particular a laser beam source with a laser power of greater than or equal to 1 Kw, preferably between 1 Kw and 100 Kw.

7. Use of a laser machining device (100) according to one of the preceding claims for carrying out at least one procedure selected from the group consisting of: - machining the workpiece (12) using at least one set frequency greater than or equal to 0.5 kHz, preferably in the range between 1 kHz and 10 kHz, and / or using at least one total set angle (∑α;∑β) of the total set angles, in particular at least one maximum total set angle (∑α 最大 ;∑β 最大 ) of the maximum total set angles, and / or using the laser beam source with a laser power greater than or equal to 1 Kw, preferably between 1 Kw and 100 Kw; - machining a workpiece (12) using the laser machining device (100) designed as a machining head by optimizing the movement trajectory of the machining laser beam (15) on at least one workpiece plane, in particular according to at least one predetermined contour of a workpiece part to be cut or a welding seam to be welded, by means of a redundant division of the movement trajectory of the machining laser beam between the means for moving the machining head and the high-frequency laser scanner (30); - focusing the machining laser beam (15) in the outlet opening (11); - laser cutting by means of a cutting gas beam that is eccentric with respect to the machining laser beam, in particular laser cutting for producing bevel cuts or laser cutting for tubes; - laser cleaning; - laser hardening; - removing filler material, in particular glass fibers, from CFRP material using the machining laser beam; and - laser welding.

8. A method for laser machining, in particular for laser cutting or laser welding, of a workpiece (12) by means of a laser machining device (100) according to one of claims 1 to 6; the method comprising the following steps: - generating a machining laser beam (15) by means of the laser beam source (82); - guiding the machining laser beam in the beam path to the outlet opening (11) by means of the at least one laser beam guiding device (25); and - deflecting the machining laser beam (15) by at least one set angle (a, b) in each case by means of at least two high-frequency laser scanners (30) connected in series in the beam path in the direction of propagation (z) of the machining laser beam; wherein each of the high-frequency laser scanners (30) provides a maximum set angle (a 最大 ) for deflecting the machining laser beam in a first set plane (xz) and wherein a maximum total set angle (∑a 最大 ) in the first set plane (xz) is achieved by the series connection of the high-frequency laser scanners (30).

9. The method according to claim 8, wherein At least one or each of the high frequency laser scanners (30) provides a further maximum set angle (β 最大 ) in a second set plane (yz).

10. The method according to claim 9, wherein, a further maximum total set angle (∑β 最大 ) in the second set plane (yz) is implemented by a series connection of the high-frequency laser scanners (30); and / or wherein the first set plane (xz) and the second set plane (yz) are arranged such that the first set plane (xz) and the second set plane (yz) are perpendicular to one another.

11. The method according to one of claims 8 to 10, wherein, each of the high-frequency laser scanners (30) deflects the machining laser beam (15) in at least one set plane (xz; yz) with a set frequency in a range greater than or equal to 0.5 kHz, preferably between 1 kHz and 10 kHz; and / or wherein the maximum set angle (a 最大 ) is set in a range of less than or equal to 50 mrad, preferably 1 mrad to 30 mrad, more preferably 2 mrad to 20 mrad; and / or wherein said further maximum set angle (β 最大 ) is set in a range of less than or equal to 50 mrad, preferably 1 mrad to 30 mrad, more preferably 2 mrad to 20 mrad.

12. The method according to one of claims 8 to 11, wherein, the workpiece (12) is machined using at least one parameter chosen from: - at least one set frequency in a range greater than or equal to 0.5 kHz, preferably between 1 kHz and 10 kHz; - at least one of the set angles in the respective set plane (xz; yz), in particular at least one of the maximum total set angles (∑α 最大 ;∑β 最大 ) and - a laser beam source with a laser power greater than or equal to 1 Kw, preferably between 1 Kw and 100 Kw.

13. A computer program product comprising one or more program modules causing the apparatus according to one of claims 1 to 6 to perform the method steps according to one of claims 8 to 12 and / or at least one of the programs of use according to claim 7, in particular when the program modules are loaded into a memory means of the apparatus.

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