Horizontal electroplating wafer conveying manipulator

Abstract

The invention discloses a horizontal electroplating wafer conveying manipulator which integrates five sets of independent motion modules, namely a lifting module, a transverse moving module, a rotating module, a straight moving module and an overturning module, five-axis linkage control is achieved, and compared with a traditional single-degree-of-freedom conveying device or a few-degree-of-freedom conveying device, the horizontal electroplating wafer conveying manipulator has the advantages that the conveying efficiency is improved; and the manipulator can achieve quick and accurate multi-dimensional movement in a complex environment, and the carrying efficiency and flexibility are greatly improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor equipment, and in particular to a horizontal electroplating wafer transfer robot. BACKGROUND

[0002] In the field of semiconductor manufacturing, wafers are the key basic materials for manufacturing semiconductor devices such as integrated circuits. With the continuous development of semiconductor technology, the integration of integrated circuits is continuously improved, and the precision and quality requirements of wafer manufacturing processes are increasingly stringent. As a key process link in wafer manufacturing, horizontal electroplating has very high requirements for the accurate transmission and positioning of wafers during electroplating.

[0003] Traditional manual wafer handling not only has low efficiency, but also easily introduces human errors during operation, leading to wafer position deviation, surface damage and other problems, affecting electroplating quality and subsequent chip manufacturing yield. At the same time, manual operation cannot avoid the pollution of dust, static electricity and other pollutants generated by the human body, which seriously interferes with the electroplating process that needs to be carried out in a high-clean environment. Currently, there are some wafer handling robots, but they are difficult to accurately grasp, stably transfer and accurately position wafers, mainly having the following shortcomings and deficiencies:

[0004] I. Precision: Although some existing robots can achieve a certain degree of wafer handling, in the process of horizontal electroplating which requires extremely high precision, due to manufacturing errors of mechanical structures, wear of transmission components and limitations of control systems, it is difficult to achieve high-precision positioning requirements at the sub-micron level, and cannot meet the needs of advanced semiconductor manufacturing processes.

[0005] II. Cleanliness: During the movement of some robots, friction and collision between mechanical components may generate small particles, polluting the electroplating environment and wafer surface. Moreover, the surface treatment and sealing design of some robots are not perfect enough to effectively prevent the intrusion of external dust and impurities, affecting the stability of the electroplating process and product quality.

[0006] III. Efficiency: The movement speed and response time of existing robots are limited, and in large-scale production, they cannot meet the fast and efficient wafer transmission requirements, resulting in limited overall production capacity of the electroplating production line. At the same time, the loading and unloading time of the robot is long, reducing the utilization rate of the equipment and the production efficiency. And the current robot is single wafer picking and placing, which is low in efficiency and cannot flexibly meet the requirements of complex processes, and cannot meet the demand of large-scale production.

[0007] Four, compatibility: with the development of semiconductor industry, the size, shape and material of the wafer are changing. The existing wafer handling robot is mostly designed for a specific type of wafer, and the compatibility of different specifications of wafer is poor. When a new specification of wafer needs to be processed, the robot often needs to be greatly modified or replaced, increasing the production cost and technical difficulty of the enterprise. SUMMARY

[0008] Therefore, the present application provides a horizontal electroplating wafer conveying robot to solve the above problems.

[0009] A horizontal electroplating wafer conveying robot, comprising a vertically arranged lifting module, a horizontally arranged transverse module arranged on the lifting module and movable up and down along the lifting module, a rotating module arranged on the transverse module and movable left and right along the transverse module, a straight module arranged on the rotating module and movable in a circumferential direction under the driving of the rotating module, two groups of turnover modules arranged on the straight module and movable forward and backward under the driving of the straight module, and a wafer clamping finger fixed at the front end of the turnover module for clamping the wafer and realizing the up-down turnover of the wafer under the driving of the turnover module.

[0010] The wafer clamping finger comprises a wafer finger body, a linear drive mechanism arranged on the wafer finger body, a clamping jaw and a supporting assembly. The linear drive mechanism is fixed at the end of the wafer finger body, and the movable push rod thereof is fixed with the clamping jaw. The clamping jaw is slidably arranged between the linear drive mechanism and the supporting assembly. The clamping jaw and the supporting assembly are connected through a buffer assembly. The buffer assembly is used to slow down the clamping motion inertia of the clamping jaw. The supporting assembly is used to physically limit the movement distance of the clamping jaw and to clamp the wafer in cooperation with the clamping jaw in the state of lifting the wafer to avoid the contact between the wafer and the surface of the wafer finger.

[0011] Preferably, the straight module comprises a cover shell, two groups of handling modules symmetrically arranged in the cover shell,

[0012] The cover shell has two notches opened along the length direction of the cover shell. The two ends of the inner side of the side plate of the cover shell are provided with limiting protrusions for limiting the movement stroke of the turnover module. The bottom plate of the cover shell is provided with a photoelectric switch for detecting the position of the turnover module. The handling module is provided with a photoelectric sensing sheet for mutual induction with the photoelectric switch.

[0013] Each carrying module comprises a motor fixed on a motor mounting plate, a first synchronous pulley fixed on the output end of the motor, a second synchronous pulley connected with the first synchronous pulley through a synchronous belt, a ball screw connected with the screw fixing seat and the second synchronous pulley respectively, a moving bearing seat arranged on the ball screw, and a sliding block fixed on the moving bearing seat and slidingly arranged on a guide rail arranged on the inner side of the side plate.

[0014] Preferably, the turnover module comprises a housing, a turnover motor fixed in the housing,

[0015] The rotation shaft of the turnover motor is connected with a motor connecting shaft, one end of the motor connecting shaft extends out of the housing and is connected with the wafer finger body through the actuator connecting assembly.

[0016] Preferably, the turnover module comprises a housing, a turnover motor fixed in the housing,

[0017] The rotation shaft of the turnover motor is connected with a motor connecting shaft, one end of the motor connecting shaft extends out of the housing and is connected with the wafer finger body through the actuator connecting assembly.

[0018] Preferably, the housing is provided with a sealing strip at the joint between the bottom plate, the top plate, the left side plate, the right side plate, the front side plate and the rear side plate.

[0019] Preferably, the supporting assembly comprises a supporting block, a first supporting pad and a second supporting pad, the supporting block is arranged at the wrist of the wafer finger body, the supporting block is connected with the clamping jaw through a buffer assembly, the first supporting pad and the second supporting pad are arranged at the finger end of the wafer finger body, and the supporting surfaces of the supporting block, the first supporting pad and the second supporting pad are located in the same plane and are higher than the surface of the wafer finger body.

[0020] Preferably, the supporting block is a block structure with a ladder-shaped longitudinal section, and the vertical surface at the step of the supporting block is a first circular arc surface inclined upwardly;

[0021] The first supporting pad and the second supporting pad are the same in structure, are block structures with a ladder-shaped longitudinal section, and the vertical surface at the step of the first supporting pad and the second supporting pad is a second circular arc surface inclined upwardly, and a circular arc protrusion with a gradually-thinning thickness from top to bottom is extended on the second circular arc surface.

[0022] Preferably, the clamping jaw comprises a clamping jaw body, a clamping head arranged on the left and right sides of the clamping jaw body and capable of shuttling on the left and right sides of the supporting block, an arc-shaped clamping groove capable of achieving bilinear contact with the edge of the wafer is arranged on the clamping head, a roller is fixed on the bottom of the clamping jaw body through a roller shaft, a containing groove is arranged on the side of the clamping jaw body facing the supporting block, a connecting block is embedded on the clamping jaw body, and the movable push rod of the linear driving mechanism is fixed with the connecting block.

[0023] Preferably, the buffer assembly comprises a buffer spring, one end of the buffer spring is fixed on the side of the clamping jaw, and the other end is fixed on the side of the supporting block.

[0024] Or the buffer assembly comprises a guide shaft, a guide sleeve and a buffer spring, one end of the guide shaft is fixed on the linear driving mechanism, the other end penetrates through the clamping jaw and extends into the clamping groove fixed on the supporting block, the guide sleeve is sleeved on the guide shaft and penetrates through the clamping jaw and is fixed with the clamping jaw, one end of the guide sleeve extends into the clamping groove and the end portion is fixed with the buffer spring, and the other end of the buffer spring is fixed on the groove surface of the clamping groove.

[0025] Preferably, the lifting module comprises a vertically arranged lifting module bottom plate, a lifting transmission mechanism fixed on the lifting module bottom plate, and a lifting sliding group fixed on the lifting transmission mechanism, and the upper and lower ends of the lifting module bottom plate are both provided with a first photoelectric switch assembly for detecting the lifting position of the horizontal movement module.

[0026] The horizontal movement module comprises a horizontally arranged horizontal movement module bottom plate fixed on the lifting sliding group, a horizontal movement transmission mechanism fixed on the horizontal movement module bottom plate, and a horizontal movement sliding group fixed on the horizontal movement transmission mechanism, and the rotary module is fixed on the horizontal movement sliding group, and the left and right ends of the horizontal movement module bottom plate are both provided with a second photoelectric switch assembly for detecting the left and right positions of the rotary module.

[0027] The beneficial effects of the present application are:

[0028] 1、The horizontal electroplating wafer conveying manipulator integrates five independent motion modules, i.e., a lifting module, a horizontal movement module, a rotary module, a straight movement module and a turnover module, realizes five-axis linkage control, compared with a traditional single or a small number of degree-of-freedom conveying device, can realize rapid and accurate multidimensional motion of the manipulator in a complex environment, and greatly improves the carrying efficiency and flexibility.

[0029] 2、The straight module of the application has double carrying modules, and the inner side of the side plate of the cover is provided with a limiting protrusion for limiting the moving stroke of the wafer picking robot, and a photoelectric switch is arranged on the bottom plate of the cover, and a photoelectric sensor sheet is arranged on the carrying mechanism and is in response to the photoelectric switch, so that double positioning detection of the wafer picking robot position can be realized, the positioning precision of the wafer picking robot position is effectively improved, no operation is avoided, and the wafer carrying efficiency is also improved; and the cover is a closed cover, has good structural stability, can provide good protection and stable support for the carrying module inside, prevent external factors from interfering with the internal motor, the moving module and the like, mounting strips are arranged at the joints of the cover plates, the joints of the front end plate, the rear end plate, the side plate and the cover plate can be sealed, the motor can be protected from the influence of the external environment, the structural strength of the cover can be improved, and the structural reliability of the whole mechanism can be improved.

[0030] 3、The structures of the two carrying modules of the straight module are completely consistent, and the two carrying modules can be controlled independently, so that the carrying mechanism can be more flexible in actual application to cope with different material carrying requirements. For example, when processing wafers of different sizes, weights or shapes, the motion parameters such as speed, acceleration and positioning position of the left and right carrying modules can be adjusted respectively to achieve optimal carrying effect. At the same time, the two carrying modules can work simultaneously to improve work efficiency, or work independently according to production requirements to adapt to different specifications of wafers or special process requirements of carrying tasks, thereby increasing the applicability and flexibility of the equipment.

[0031] 4、The turnover module is used for turning over the wafer to realize two-side electroplating of the wafer, can realize efficient transportation of the wafer, and forms a stable transmission structure by arranging the two ends of the motor connecting shaft in the fixed bearing and the guide bearing, so that vibration and impact in the transportation process of the wafer can be effectively reduced, and the stability of the whole device is improved; a wiring groove is formed in the bottom of the motor connecting shaft, the wiring groove is arranged as a semicircular groove, and in the rotating process of the motor connecting shaft, the signal line of the optical fiber sensor arranged in the motor connecting shaft and the connecting shaft mounting bottom plate can be prevented from being wound, so as to affect the grabbing effect of the wafer clamping finger or the signal transmission effect of the optical fiber sensor.

[0032] 5、Sealing strips are arranged at the joints of all plate pieces of the composition shell of the turnover module, the sealing strips can not only effectively prevent dust and moisture from entering the shell, protect the internal components such as the turnover motor and the bearing, prolong the service life of the turnover motor and the bearing, but also have a certain damping effect; the surface of the sealing strip is subjected to hard anodizing treatment, so that the wear resistance and corrosion resistance of the plate piece can be improved.

[0033] 6、The wafer clamping finger of the present application sets a supporting assembly on the wafer finger body to increase the contact area of the wafer being lifted, and uses the supporting assembly to linearly clamp the wafer from different positions of the wafer circumference in cooperation with the clamping groove of the clamping jaw, so as to ensure that the wafer does not shake during clamping and transportation, and avoid damage to the wafer.

[0034] 7、The wafer clamping finger uses the Hall position sensor to monitor and control the advancing distance of the electric cylinder, that is, to real-time monitor the moving distance of the clamping jaw, and also uses the supporting stopper to physically limit the clamping position of the clamping jaw. Under the double control of the clamping jaw position accuracy, the wafer can be stably clamped, and the wafer does not shake during clamping and transportation, thereby improving the stability of wafer clamping and transportation.

[0035] 8、The supporting assembly of the wafer clamping finger is composed of three supporting stoppers made of polyether ether ketone material, a first supporting pad and a second supporting pad. The supporting surfaces of the supporting stoppers, the first supporting pad and the second supporting pad are 0.5mm higher than the surface of the wafer finger body. When clamping the wafer, they will jointly lift the wafer from different positions to avoid the contact between the center position of the wafer and the surface of the wafer finger body. Not only can the lifting contact area of the wafer be reasonably enlarged, but also the wafer edge can be protected to further ensure that the wafer is not damaged during clamping and transportation.

[0036] 9、The clamping head of the clamping jaw of the wafer clamping finger is set to be arc-shaped, and a circular arc-shaped V-shaped clamping groove is arranged thereon. When the clamping head clamps the wafer, the clamping head can wrap the wafer edge by a large margin, and the V-shaped clamping groove forms two linear contacts with the wafer edge, so that the wafer edge is limited by the V-shaped clamping groove and does not move up and down, thereby improving the stability of wafer clamping. At the same time, the V-shaped clamping groove is suitable for wafers of different thicknesses, and can clamp wafers of various thicknesses in the range of 0.5mm-1mm.

[0037] 10、The vertical surface of the first supporting pad and the second supporting pad at the step is set to be a circular arc surface. When the clamping jaw clamps the wafer, the first supporting pad and the second supporting pad can also linearly contact the wafer at their respective positions, so as to increase the area of the wafer circumference edge clamping force and avoid damage to the wafer due to stress concentration at a point or a few points.

[0038] 11. The bottom of the wafer clamping fingers is equipped with multiple rollers. The rollers can guide or support the clamping fingers during movement. At the same time, the guide shaft and guide sleeve of the buffer assembly can also guide the clamping fingers to avoid slight displacement of the clamping fingers during linear movement, which would affect the clamping effect. This effectively ensures the stability of the clamping fingers' linear movement and further guarantees the clamping effect. Attached Figure Description

[0039] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0040] Figure 1 This is a schematic diagram of the structure of the horizontal electroplating wafer transfer robot of the present invention.

[0041] Figure 2 This is a structural diagram of the lifting module.

[0042] Figure 3 This is a schematic diagram of the transverse module.

[0043] Figure 4 This is a schematic diagram of the rotating module.

[0044] Figure 5 This is a schematic diagram of the structure connecting the support plate.

[0045] Figure 6 This is a schematic diagram of the internal structure of the straight-line module.

[0046] Figure 7 This is a schematic diagram of the three-dimensional structure of the straight-line module.

[0047] Figure 8 This is a structural diagram of the transport module in the straight-line module.

[0048] Figure 9 This is a schematic diagram of the removal of the left side plate and top plate of the flip module in Embodiment 1.

[0049] Figure 10 This is a schematic diagram of the flipping module in Embodiment 3.

[0050] Figure 11 This is a schematic diagram of the structure of a clamping wafer finger.

[0051] Figure 12 This is a bottom view of the clamping wafer fingers.

[0052] Figure 13 This is a schematic diagram of the linear drive mechanism for a hidden clamping wafer finger.

[0053] Figure 14 This is a longitudinal sectional view of the clamping wafer finger of the present invention in Embodiment 1.

[0054] Figure 15 This is a schematic diagram showing the relative positions of the gripper and the supporting block from the initial position to the clamping position.

[0055] Figure 16 This is a schematic diagram of the buffer assembly connecting the gripper and the supporting block in Embodiment 1.

[0056] Figure 17 This is a three-dimensional structural diagram of the supporting block.

[0057] Figure 18 This is a top view of the block supporting the stop.

[0058] Figure 19 This is a structural diagram of the first or second support pad.

[0059] Figure 20 This is a schematic diagram of the clamping groove on the gripper.

[0060] Figure 21 This is a longitudinal sectional view of the clamping wafer finger of the present invention in Embodiment 2.

[0061] The meanings of the labels in the diagram are as follows:

[0062] 1 is the lifting module; 1-1 is the lifting module base plate; 1-2 is the lifting transmission mechanism; 1-3 is the lifting slide block; 1-4 is the lifting motor; 1-5 is the pulley; 1-6 is the synchronous belt; 1-7 is the synchronous belt pressure plate; 1-8 is the slide rail mounting plate.

[0063] 2 is the transverse movement module; 2-1 is the base plate of the transverse movement module; 2-2 is the transverse movement transmission mechanism; 2-3 is the transverse movement slide block; 2-4 is the transverse movement motor; 2-5 is the pulley; 2-6 is the synchronous belt; 2-7 is the synchronous belt pressure plate.

[0064] 3 is the rotating module, 3-1 is the connecting bracket, 3-2 is the motor mounting plate, 3-3 is the rotary motor, and 3-4 is the controller.

[0065] 4 is a straight module, 4-1 is a cover, 4-11 is a cover plate, 4-12 is a side plate, 4-13 is a bottom plate, 4-14 is a notch, 4-15 is a limiting protrusion, 4-16 is a photoelectric switch, 4-17 is a front end plate, 4-18 is a rear end plate, 4-19 is a mounting strip, 4-110 is a wire hole, 4-2 is a carrying module, 4-21 is a motor, 4-22 is a first synchronous pulley, 4-23 is a second synchronous pulley, 4-24 is a synchronous belt, 4-25 is a screw rod fixing seat, 4-26 is a ball screw rod, 4-27 is a moving bearing seat, 4-28 is a sliding block, 4-29 is a motor mounting plate, 4-210 is a guide rail, 4-3 is a photoelectric sensing sheet,

[0066] 5 is a turnover module, 5-1 is a shell, 5-2 is a turnover motor, 5-5 is a motor connecting shaft or a turnover shaft, 5-7 is a connecting shaft mounting bottom plate, 5-8 is a connecting shaft cover, 5-9 is a connecting shaft mounting cover plate, 5-11 is a motor mounting plate, 5-12 is a bearing mounting plate, 5-13 is a fixed bearing, 5-14 is a guide bearing, 5-15 is a first gear, 5-16 is a second gear, 5-17 is a rotating shaft mounting plate,

[0067] 6 is a wafer clamping finger, 6-1 is a wafer finger body, 6-2 is a supporting stopper, 6-21 is a first arc surface, 6-3 is a first supporting pad, 6-31 is a second arc surface, 6-32 is an arc protrusion, 6-4 is a second supporting pad, 6-5 is a clamping jaw, 6-51 is a chuck, 6-52 is a clamping jaw body, 6-53 is a clamping groove, 6-54 is a accommodating groove, 6-6 is an electric linear actuator, 6-7 is a stopper fixing plate, 6-8 is a connecting block, 6-9 is a buffer spring, 6-10 is a Hall position sensor, 6-11 is a roller, 6-12 is a roller shaft, 6-13 is an actuator fixing seat, 6-14 is a fixed upper cover, 6-15 is a guide shaft, 6-16 is a guide sleeve, 6-17 is a finger, 6-18 is a wrist arm,

[0068] 7 is a wafer,

[0069] 8 is a connecting support plate. DETAILED DESCRIPTION

[0070] In order to make the objects, technical solutions and advantages of the present application clearer, the present application will be described below in detail with specific embodiments shown in the drawings. However, it should be understood that these descriptions are only exemplary and are not intended to limit the scope of the present application. In addition, in the following description, the description of known structures and technologies is omitted to avoid unnecessary confusion of the concept of the present application.

[0071] In order to better understand the technical solutions of the present application, the present application will be described in detail below with reference to the drawings.

[0072] As Figure 1The application provides a horizontal electroplating wafer conveying manipulator, which comprises a lifting module 1, a horizontal moving module 2, a rotating module 3, a straight moving module 4, a turnover module 5 and a wafer clamping finger 6.

[0073] The lifting module 1 is vertically arranged and serves as a fixing base of the horizontal moving module 2, the rotating module 3, the straight moving module 4, the turnover module 5 and the wafer clamping finger 6.

[0074] The horizontal moving module 2 is horizontally arranged and fixed on the lifting module 1 and can move up and down along the lifting module 1, the rotating module 3, the straight moving module 4, the turnover module 5 and the wafer clamping finger 6 are directly or indirectly fixed on the horizontal moving module 2, and when the horizontal moving module 2 moves up and down, the horizontal moving module 2 can synchronously move the rotating module 3, the straight moving module 4, the turnover module 5 and the wafer clamping finger 6.

[0075] The rotating module 3 is directly fixed on the horizontal moving module 1 and can move left and right along the horizontal moving module 1, the straight moving module 4, the turnover module 5 and the wafer clamping finger 6 are directly or indirectly fixed on the horizontal moving module 2, and when the rotating module 3 moves left and right, the rotating module 3 can synchronously move the straight moving module 4, the turnover module 5 and the wafer clamping finger 6.

[0076] The straight moving module 4 is directly fixed on the rotating module 3 and can rotate in a circumferential direction under the driving of the rotating module 3, the turnover module 5 is fixed on the straight moving module 4, and the wafer clamping finger 6 is fixed at the front end of the turnover module 5, when the straight moving module 4 rotates in the horizontal circumferential direction, the straight moving module 4 can synchronously rotate the turnover module 5 and the wafer clamping finger 6 at the front end of the turnover module 5.

[0077] The straight moving module 4 is provided with two turnover modules 5, the turnover modules 5 can move forward and backward under the driving of the straight moving module 4, and the turnover modules 5 can synchronously rotate the wafer clamping finger 6 to realize wafer overturning.

[0078] The wafer clamping finger 6 is fixed at the front end of the turnover module 5 and is used for clamping a wafer and can realize wafer overturning up and down under the driving of the turnover module 5.

[0079] In the first embodiment, the horizontal electroplating wafer conveying manipulator comprises the lifting module 1, the horizontal moving module 2, the rotating module 3, the straight moving module 4, the turnover module 5 and the wafer clamping finger 6.

[0080] As Figure 2As shown, the lifting module 1 comprises a vertically arranged lifting module base plate 1-1, a lifting transmission mechanism 1-2 fixed on the lifting module base plate 1-1, and a lifting slide group 1-3 fixed on the lifting transmission mechanism 1-2, and the upper and lower ends of the lifting module base plate 1-1 are provided with first photoelectric switch assemblies for detecting the lifting position of the horizontal movement module 2.

[0081] Specifically, the lifting transmission mechanism 1-2 is a synchronous belt transmission mechanism, comprising two lifting motors 1-4 fixed on the lifting module base plate 1-1, pulleys 1-5 fixed on the rotating shafts of the lifting motors 1-4, and a synchronous belt 1-6 connected with the two pulleys. The synchronous belt 1-6 is fixed with a synchronous belt pressing plate 1-7, and the side of the synchronous belt pressing plate 1-7 facing the lifting module base plate 1-1 is fixed with two slide rail mounting plates 1-8, which are fixed with sliding blocks clamped on linear slides vertically fixed in the rail groove on the lifting module base plate 1-1. The synchronous belt pressing plate 1-7, the synchronous belt pressing plate 1-7, and the slide rail mounting plate 1-8 form the lifting slide group 1-3, and the horizontal movement module 2 is fixed on the side of the synchronous belt pressing plate 1-7 away from the lifting module base plate 1-1 by fasteners.

[0082] When the two lifting motors 1-4 operate synchronously according to the pulse signals sent by the control system, the pulleys 1-5 on the lifting motors 1-4 can drive the synchronous belt 1-6 to rotate synchronously, and the synchronous belt 1-5 can drive the synchronous belt pressing plate 1-7 to move up and down, and the synchronous belt pressing plate 1-7 can drive the horizontal movement module 2 to move up and down synchronously. At the same time, the synchronous belt pressing plate 1-7 can also make the sliding block slide along the linear slide rail, and the sliding block and the linear slide rail can provide precise motion guidance for the entire lifting module. At the same time, the synchronous belt pressing plate 1-7 is connected with the sliding block through the slide rail mounting plate 1-8, which can ensure the stability and reliability of power transmission during high-speed linear motion.

[0083] At the same time, the first photoelectric switch assemblies arranged on the lifting module base plate 1-1 can detect the lifting position of the horizontal movement module 2 in real time. That is, the photoelectric switch is installed on the lifting module base plate 1-1, and the photoelectric sensing sheet is fixed on the horizontal movement module. When the photoelectric sensing sheet blocks the light of the photoelectric switch, the photoelectric switch generates an electrical signal change and feeds back the electrical signal to the control system, realizing accurate lifting position control. In this embodiment, the upper, middle and lower three different positions on the left side of the lifting module base plate 1-1 are fixed with photoelectric switches, and the photoelectric switches are selected as the transmitting type photoelectric sensor. In other embodiments, the number and position of the photoelectric switches can be adjusted according to actual needs.

[0084] A drag chain is also mounted on the right side of the lifting module base plate 1-1, which is made of high-strength engineering plastic and has good flexibility and fatigue resistance. The drag chain mounting plate is tightly connected to the lifting module base plate 1-1 by bolts. During the operation of the lifting module 1, the cable and pipeline inside the module can be effectively protected from external force pulling or wear and tear, ensuring the stability of the electrical connection of the entire device during complex movement.

[0085] As shown in Figure 3 The horizontal movement module 2 includes a horizontally arranged horizontal movement module base plate 2-1 fixed on the lifting slide group 1-3, a horizontal movement transmission mechanism 2-2 fixed on the horizontal movement module base plate 2-1, and a horizontal movement slide group 2-3 fixed on the horizontal movement transmission mechanism 2-2. The left and right ends of the horizontal movement module base plate 2-1 are provided with second photoelectric switch assemblies for detecting the left and right positions of the rotary module 3.

[0086] Specifically, the horizontal movement transmission mechanism 2-2 is also a synchronous belt transmission mechanism, which has the same structure as the lifting transmission mechanism and includes two horizontal movement motors 2-4 fixed on the horizontal movement module base plate 2-1, pulleys 2-5 fixed on the rotating shafts of the horizontal movement motors 1-4, and a synchronous belt 2-6 connected to the two pulleys. The synchronous belt 2-6 is fixed with a synchronous belt pressing plate 2-7, and the side of the synchronous belt pressing plate 2-7 facing the horizontal movement module base plate 2-1 is fixed with two slide rail mounting plates. The slide rail mounting plates are fixed with sliding blocks that are slidingly arranged on linear slide rails, and the linear slide rails are horizontally fixed in the rail grooves on the lifting module base plate 1-1. The synchronous belt pressing plate 2-7, the synchronous belt pressing plate 2-7, and the slide rail mounting plates form the horizontal movement slide group 2-3. The rotary module 3 is fixed on the side of the synchronous belt pressing plate 2-7 away from the horizontal movement module base plate 1-1 by fasteners.

[0087] When the two horizontal movement motors 2-4 operate synchronously according to the pulse signals sent by the control system, the pulleys 2-5 on the horizontal movement motors 2-4 can drive the synchronous belt 2-6 to rotate synchronously. When the synchronous belt 2-6 rotates, it can drive the synchronous belt pressing plate 2-7 to move left and right, and the synchronous belt pressing plate 2-7 can drive the rotary module 3 to move left and right synchronously. At the same time, the synchronous belt pressing plate 2-7 can also make the sliding blocks slide along the linear slide rails. The sliding blocks and the linear slide rails can provide precise movement guidance for the entire horizontal movement module. At the same time, the synchronous belt pressing plate 2-7 is connected to the sliding blocks through the slide rail mounting plates, which can ensure the stability and reliability of power transmission during high-speed linear movement.

[0088] The second photoelectric switch assemblies on the horizontal movement module base plate 2-1 are the same as the first photoelectric switch assemblies on the lifting module 1, which use a pair of photoelectric sensors and photoelectric sensing sheets for position detection. The number and position of the photoelectric switches can be adjusted according to actual needs.

[0089] The horizontal movement module base plate 2-1 is also provided with a drag chain, which is made of high-strength engineering plastic and has good flexibility and fatigue resistance. The drag chain mounting plate is tightly connected to the horizontal movement module base plate 2-1 through bolts. When the horizontal movement module 2 is working, it can effectively protect the cables and pipelines inside the module from being pulled or worn by external forces, thereby ensuring the stability of the electrical connection of the entire device during complex movements. In this embodiment, the lifting module base plate 1-1 and the horizontal movement module base plate 2-1 are both supported by high-quality carbon structural steel, which has been heat treated to improve its structural strength and rigidity.

[0090] As shown in Figure 4 The rotating module 3 includes a connecting bracket 3-1, a motor mounting plate 3-2 fixed on the connecting bracket 3-1, a rotating motor 3-3 fixed on the motor mounting plate 3-2, and a controller 3-4 fixed on the connecting bracket 3-1 below the motor mounting plate 3-2. The rotating shaft of the rotating motor 3-3 extends upward through the motor mounting plate 3-2, and the straight movement module 4 is fixed on the top of the rotating shaft of the rotating motor 3-3. The controller 3-4 is electrically connected to the control system.

[0091] When the controller 3-4 receives a rotating instruction from the control system, it sends a corresponding electrical signal to the rotating motor 3-3 to drive the rotor inside the rotating motor 3-3 to rotate, thereby driving the straight movement module 4 connected to the rotor to rotate 360° in the horizontal circumferential direction.

[0092] In this embodiment, the motor mounting plate 3-2 is made of stainless steel, which has good rust resistance and mechanical strength. The rotating motor 3-3 is a hollow rotating motor, which has the characteristics of high precision, high torque, and low backlash, and can realize accurate rotation of the wafer picking module. The cables of the straight movement module 4, the flipping module 5, and the wafer clamping fingers 6 can pass through the middle hole of the rotating motor 3-3 and be connected to the controller 3-4, so as to avoid winding and wear of the cables during rotation.

[0093] As shown in Figures 6-8 The straight movement module 4 includes a housing 4-1 and two groups of carrying modules 4-2 symmetrically arranged in the housing 4-1.

[0094] The housing 4-1 is used to accommodate the carrying modules 4-2. The housing 4-1 is provided with two flipping modules 5 on the top. The two flipping modules 5 are fixed on the connecting support plate 8, and the lower ends of the connecting support plate 8 extend into the housing 4-1 and are connected to the corresponding carrying modules 4-2. The carrying modules 4-2 are used to drive the flipping modules 5 on the top of the housing 4-1 to move forward and backward, so that the wafer clamping fingers 6 can pick up and transport the wafer.

[0095] The cover 4-1 is a rectangular shell composed of a bottom plate 4-13, left and right side plates 4-12, a front end plate 4-17, a rear end plate 4-18, and a cover plate 4-11.

[0096] The base plate 4-13 has a wiring hole 4-110 in the center for motor wiring. The base plate 4-13 is made of aluminum alloy. The high hardness of the aluminum alloy gives it high strength, which can effectively support the weight of the entire handling module 4-2 during handling and ensure the stability of the entire mechanism. At the same time, the high hardness of the aluminum alloy has good machinability, which facilitates the precise machining of structures such as the wiring hole. In addition, the corrosion resistance of the aluminum alloy also helps it to be used for a long time in the complex environment of the electroplating workshop.

[0097] The side plate 4-12 is vertically fixed to the left and right sides of the base plate 4-13 by fasteners such as bolts or screws. A guide rail groove is laterally formed on the side plate 4-12 for mounting the guide rail 4-210. The guide rail groove ensures the straightness and installation accuracy of the guide rail 4-210, providing precise guidance for the linear movement of subsequent moving parts. Limiting protrusions 4-15 are provided at both ends of the inner side of the side plate 4-12 to limit the travel of the flipping module 5 (i.e., the wafer clamping finger 6). In this embodiment, the limiting protrusions 4-15 are limiting pins. Limiting screws can be fixed by forming pin limiting holes on the side plate 4-12. The limiting pins limit the travel range of the slider 4-28 to prevent the slider 4-28 from exceeding its normal movement range, effectively preventing the slider from falling and ensuring the safe operation of the entire mechanism.

[0098] Both the front end plate 4-17 and the rear end plate 4-18 are made of 2mm thick sheet metal, serving to connect the base plate 4-13, the side plate 4-12, and the cover plate 4-11. In this embodiment, both the front end plate 4-17 and the rear end plate 4-18 are designed in a U-shape. The bent portions of the front end plate 4-17 and the rear end plate 4-18 are fixed to the side plate 4-12 by bolts or screws. The linear motor 4-21 of the conveying module 4-2 can be accommodated in the space formed by the protruding portion in the middle. By designing the front end plate 4-17 and the rear end plate 4-18 in a U-shape, the overall connectivity and stability of the cover can be enhanced, allowing the cover to maintain structural integrity when subjected to external impacts and internal component vibrations.

[0099] In a preferred embodiment, mounting strips 4-19 are provided at the positions where the front end plate 4-17 and the rear end plate 4-18 meet the side plate 4-12 and the cover plate 4-11. The two ends of the mounting strips 4-19 are fixed to the side plate 4-12 by bolts. The mounting strips 4-19 can not only seal the joints where the front end plate 4-17 and the rear end plate 4-18 meet the side plate 4-12 and the cover plate 4-11, but also protect the motor from the influence of the external environment. At the same time, it can also improve the structural strength of the cover and improve the structural reliability of the entire mechanism.

[0100] The aforementioned side plate 4-12, bottom plate 4-13, front end plate 4-17, and rear end plate 4-18 form an upper-opening housing. A cover plate 4-11 is magnetically fixed to the top of this upper-opening housing to create a closed protective space. Specifically, a magnetic strip (not shown in the figure) can be provided at the edge of the lower surface of the cover plate 4-11 to magnetically fix the cover plate 4-11 to the top of the upper-opening housing. The magnetic strip is preferably a neodymium iron boron magnetic strip.

[0101] The cover plate 4-11 has two slots 4-14 along its length. The bottoms of the two connecting support plates 8 extend into the cover 4-1 from the two slots 4-14 and are connected to the corresponding transport module 4-2.

[0102] like Figure 8 As shown, the conveying module 4-2 includes a linear motor 4-21 fixed on a motor mounting plate 4-29, a first synchronous pulley 4-22 fixed on the output end of the linear motor 4-21, a second synchronous pulley 4-23 connected to the first synchronous pulley 4-22 via a synchronous belt 4-24, a ball screw 4-26 connected to the lead screw fixing seat 4-25 and the second synchronous pulley 4-23 respectively, a motion bearing seat 4-27 disposed on the ball screw 4-26, and a slider 4-28 fixed on the motion bearing seat 4-27. The slider 4-28 is slidably disposed on a guide rail 4-210, and the guide rail 4-210 is disposed on the inner side of the side plate 4-12.

[0103] The motor mounting plate 4-29 is an L-shaped plate, fixed to the base plate 4-13 by bolts or screws and other fasteners; the lead screw fixing seat 4-25 is also fixed to the base plate 4-13 by bolts or screws and other fasteners, and the lead screw fixing seat 4-25 is arranged opposite to the motor mounting plate 4-29. In this embodiment, the motor mounting plate 4-29 is fixed to the rear side of the base plate 4-13, and the lead screw fixing seat 4-25 is fixed to the front side of the base plate 4-13.

[0104] In a preferred embodiment, a photoelectric switch 4-16 for detecting the position of the flip module 5 (i.e., the wafer clamping finger 6) is provided on the base plate 4-13, and a photoelectric sensor 4-3 that interacts with the photoelectric switch 4-16 is installed at the bottom of the motion bearing seat 4-27.

[0105] In this embodiment, the photoelectric switch 4-16 can be a through-beam photoelectric switch.

[0106] When the straight motor 4-21 is started, the output shaft of the straight motor 4-21 can drive the first synchronous pulley 4-22 to rotate, and the first synchronous pulley 4-22 drives the second synchronous pulley 4-23 to rotate synchronously through the synchronous belt 4-24. Since the second synchronous pulley 4-23 is fixedly connected with the ball screw 4-26, the rotating power of the synchronous pulley can be converted into screw transmission. The ball screw 4-26 stably rotates under the support of the screw fixed seat 4-25. The moving bearing seat 4-27 on the screw moves back and forth along the axial direction with the rotation of the screw. The moving bearing seat 4-27 drives the sliding block 4-28 to slide back and forth along the guide rail 4-210, and the sliding block 4-28 drives the turnover module 5 to move back and forth through the connecting support plate 8, so as to realize the reciprocating linear motion and complete the wafer carrying work.

[0107] When the carrying module 2 moves with the turnover module 5, the photoelectric sensing sheet triggers the photoelectric switch 4-16, and the photoelectric switch 4-16 feeds back a position signal to the control system. The control system adjusts the running state of the stepping motor in time according to the signal, so as to realize accurate control of the position of the turnover module 5 and ensure that the wafer can be accurately carried to the predetermined position.

[0108] In the embodiment, the straight motor 4-21 selects a small-torque high-precision five-phase stepping motor. The motor can accurately control the rotation of the synchronous pulley and provide stable power output for the synchronous belt. The five-phase design makes the step angle smaller and the control precision higher, which can meet the demand for micro position adjustment in the wafer carrying process. Meanwhile, the small-torque characteristic of the five-phase stepping motor makes it more stable during starting and stopping, reducing the impact of inertia on the equipment and wafers.

[0109] In the embodiment, the screw is a ball screw. The ball screw has the characteristics of high precision, high efficiency and low friction. In the process of converting rotary motion into linear motion, the ball screw greatly reduces the friction resistance through the internal rolling of the ball, and improves the transmission efficiency. The high-precision machining and assembly process of the ball screw ensures the precision of linear motion, which can meet the strict requirements of wafer carrying on position accuracy.

[0110] In the preferred embodiment, a drag chain is further arranged on the carrying module 2. The drag chain is used to arrange and protect the wires and cables connected with the straight motor 4-21, the turnover module and the control system. During the reciprocating motion of the turnover module 5, the drag chain stretches and contracts with the motion of the turnover module 5, preventing the wires and cables from being damaged due to excessive bending, stretching or winding, ensuring the stability and reliability of the electrical connection, and ensuring that the control system can accurately control the turnover module 5.

[0111] The structures of the two groups of carrying modules 2 of the present application are completely identical, and the two groups of carrying modules 2 can be controlled independently, which makes the carrying mechanism more flexible in actual application to cope with different material carrying requirements. For example, when processing wafers of different sizes, weights or shapes, the motion parameters such as speed, acceleration and positioning position of the left and right carrying modules 2 can be adjusted respectively to achieve the optimal carrying effect. At the same time, the two carrying modules 2 can work simultaneously to improve the work efficiency, or work individually according to the production requirements to adapt to the carrying tasks of wafers of different specifications or special process requirements, thereby increasing the applicability and flexibility of the equipment.

[0112] The slider 4-28 of each of the two groups of carrying modules 2 is fixed with a connecting support plate 8, and the fixed support surfaces of the two connecting support plates 8 are different in height, and the height difference between the fixed support surfaces of the two connecting support plates 8 should be greater than the overall height of the turnover module 5. When a turnover module 5 is fixed on the fixed support surface of each connecting support plate 8, the upper and lower turnover modules 5 are opposite to each other, and the front end of each turnover module 5 is fixed with a wafer clamping finger 6, so that two wafers can be carried at a time.

[0113] As shown in Figures 9-11 The turnover module 5 includes a shell 5-1 and a turnover motor 5-2 fixed in the shell 5-1.

[0114] The shell 5-1 includes a bottom plate, a top plate, a left side plate, a right side plate, a front side plate and a rear side plate.

[0115] The bottom plate is used to install the left side plate, the right side plate, the front side plate, the rear side plate and the motor mounting plate, and a plurality of fixing holes for installing the left side plate, the right side plate, the front side plate, the rear side plate and the motor mounting plate are opened at different positions on the bottom plate. In the present embodiment, the bottom plate is an L-shaped flat plate made of aluminum alloy.

[0116] The left side plate is connected with the bottom plate, the front side plate, the rear side plate and the top plate through fasteners such as bolts or screws, and the left side plate serves as the left cover plate of the shell 5-1. In the present embodiment, the left side plate is made of stainless steel sheet, and the surface thereof is subjected to electrolytic polishing treatment, which can improve the corrosion resistance and aesthetic appearance of the device.

[0117] The right side plate is the same as the left side plate and is connected with the bottom plate, the front side plate, the rear side plate and the top plate through fasteners such as bolts or screws, and the right side plate serves as the right cover plate of the shell 5-1. In the present embodiment, the right side plate is made of stainless steel sheet, and the surface thereof is subjected to electrolytic polishing treatment, which can improve the corrosion resistance and aesthetic appearance of the device.

[0118] The front side plate is connected to the bottom plate, top plate, left side plate, and right side plate by fasteners such as bolts or screws, and the front side plate serves as the front cover plate of the outer shell 5-1. Bearing mounting holes are provided on the front side plate, and guide bearings are installed in these holes. In this embodiment, the front side plate is made of aluminum alloy.

[0119] The rear side plate is connected to the bottom plate, top plate, left side plate, and right side plate by fasteners such as bolts or screws, and serves as the rear cover plate of the outer shell 5-1. In this embodiment, the rear side plate is made of aluminum alloy.

[0120] The top plate is connected to the left, right, front, and rear plates via bolts or screws, serving a sealing and locking function to ensure that the components inside the outer casing 5-1 are not affected by external dust and moisture. In this embodiment, the top plate is also an L-shaped flat plate made of aluminum alloy.

[0121] like Figure 9 , 10 As shown, the flipping motor 5-2 is disposed inside the housing 5-1, and the flipping motor 5-2 is fixed to the bottom plate of the housing 1 by a motor mounting plate 5-11. In this embodiment, the motor mounting plate 5-11 is an L-shaped plate, and its horizontal section is fixed to the bottom plate. The horizontal section of the motor mounting plate 5-11 has bolt holes for fixing it to the bottom plate, and the vertical section has side holes for installing the flipping motor and the bearing mounting plate.

[0122] The rotating shaft of the flip motor 5-2 is connected to a motor connecting shaft 5-5. One end of the motor connecting shaft 5-5 extends out of the housing 5-1 and is connected to the wafer clamping finger 6 through the actuator connecting assembly.

[0123] Specifically, a bearing mounting plate 5-12 is fixed to the front side of the motor mounting plate 5-11, and a fixed bearing 5-13 is installed in the center of the bearing mounting plate 5-12. A guide bearing 5-14 is installed on the front side of the outer casing 5-1 opposite to the bearing mounting plate 5-12. One end of the motor connecting shaft 5-5 passes through the guide bearing 5-14 and is connected to the actuator connecting assembly, while the other end is fixed inside the fixed bearing 5-13. The motor connecting shaft 5-5 has a stainless steel hollow structure. The rotating shaft of the flip motor 5-2 passes through the motor mounting plate 5-11 and is fixed to the motor connecting shaft 5-5. That is, the rotating shaft of the flip motor 5-2 passes through the motor mounting plate 5-11 and is inserted into the motor connecting shaft 5-5. The motor connecting shaft has a set screw locking thread hole, and the rotating shaft of the flip motor 5-2 is tightened and fixed by the set screw inserted in the set screw locking thread hole.

[0124] In this embodiment, the bearing mounting plate 5-12 is made of aluminum alloy, and the fixed bearing 5-13 and the guide bearing 5-14 are both double cover deep groove ball bearings, which have the characteristics of high precision and low noise. The fixed bearing 5-13 is mounted on the bearing mounting plate 5-12 and can play a guiding and damping role. The guide bearing 5-14 can ensure the stability of the motor connecting shaft during rotation and overturning. The overturning motor 5-2 is a high-precision five-phase stepping motor.

[0125] Specifically, as shown in Figure 10 the executor connection assembly includes a connecting shaft mounting bottom plate 5-7, a connecting shaft cover 5-8, and a connecting shaft mounting cover plate 5-9.

[0126] The connecting shaft mounting bottom plate 5-7 is made of aluminum alloy and plays a role in transmitting the overturning motion of the motor connecting shaft to realize the synchronous overturning of the motor connecting shaft 5-5, the wafer clamping finger 6, and the wafer.

[0127] The connecting shaft cover 5-8 is made of stainless steel sheet and is electrolytically polished on the surface.

[0128] The connecting shaft mounting cover plate 5-9 is connected to the connecting shaft mounting bottom plate 5-7 and the wafer clamping finger 6 to lock and fix the wafer clamping finger 6. The connecting shaft mounting cover plate 5-9 is made of aluminum alloy.

[0129] In the preferred embodiment, all the plates of the application, such as the bottom plate, the top plate, the left side plate, the right side plate, the front side plate, and the rear side plate, are provided with sealing strips at the joints between them. The hardness of the sealing strips is Shore A degree, which can effectively prevent dust and moisture from entering the module and also play a certain damping role. The sealing strips are preferably made of fluororubber sealing strips. The surface of the sealing strips is subjected to hard anodic oxidation treatment, which can improve the wear resistance and corrosion resistance of the plates.

[0130] When assembling the housing 5-1, appropriate sealing glue is first applied to the four connecting surfaces of the left side plate and the right side plate, then the mounting holes of the left side plate and the right side plate are aligned with the mounting holes on the bottom plate, and M6 self-tapping screws are used to fix the left side plate and the right side plate on the bottom plate. When tightening the self-tapping screws, a torque of 3-5 N·m is applied using a screwdriver. Then, the front side plate and the rear side plate are installed in place in the same way. The motor mounting plate is then fixed on the bottom plate. When installing the motor mounting plate, the bearing mounting holes on the motor mounting plate should be aligned with the bearing mounting holes on the front side plate to ensure that the motor connecting shaft can pass through smoothly and the clearance is uniform. Then, the top plate is installed. The tightening torque of the front side plate and the rear side plate should be controlled at about 6-8 N·m, and the tightening torque of the top plate should be controlled at about 8-10 N·m. Finally, the perpendicularity of each plate is checked using a right-angle ruler, and the perpendicularity error is controlled within ±0.1°.

[0131] When the rotation shaft of the turnover motor 5-2 rotates, the rotation shaft of the turnover motor 5-2 can rotate synchronously with the motor connecting shaft 5-5, and the motor connecting shaft 5-5 can drive the wafer clamping fingers 6 to rotate synchronously in the circumferential direction.

[0132] The wafer clamping fingers 6 include a wafer finger body 6-1, a linear drive mechanism arranged at the end of the wafer finger body 6-1, and a clamping jaw 6-5,

[0133] The wafer finger body 6-1 is provided with a supporting assembly for lifting the wafer 15 to avoid contact between the wafer and the surface of the wafer finger, and the moving distance of the clamping jaw 6-5 is physically limited.

[0134] The linear drive mechanism is used to drive the clamping jaw 6-5 to move linearly to realize the wafer clamping action in cooperation with the supporting assembly. The linear drive mechanism is fixed at the end of the wafer finger body 6-1, and the movable push rod thereof is fixed with the clamping jaw 6-5.

[0135] The clamping jaw 6-5 is slidably arranged between the linear drive mechanism and the supporting assembly. The clamping jaw 6-5 is connected with the supporting assembly through a buffer assembly, which is used to slow down the inertia of the clamping movement of the clamping jaw. The clamping jaw 6-5 is provided with a chuck 6-51 that can shuttle between the left and right sides of the supporting assembly. The chuck 6-51 is provided with an arc-shaped clamping groove 6-53 that can realize double-linear contact with the edge of the wafer.

[0136] Specifically, the wafer finger body 6-1 serves as both a substrate for fixing the linear drive mechanism and the clamping jaw 6-5, and can lift the entire wafer to smoothly transport it to the target position. Figure 14 As shown in the figure, the supporting assembly arranged on the wafer finger body 1 includes a supporting stopper 6-2, a first supporting pad 6-3, and a second supporting pad 6-4.

[0137] The supporting stopper 6-2 has three functions: 1. physically limiting the moving distance of the clamping jaw 6-5; 2. lifting and protecting the wafer; and 3. fixing the buffer assembly. The supporting stopper 2 is arranged at the wrist of the wafer finger body 6-1, and the supporting stopper 6-2 is connected with the clamping jaw 6-5 through the buffer assembly. Figure 7 、 Figure 8 As shown in the figure, the supporting stopper 6-2 is a block structure with a stepped longitudinal section, and the vertical surface at the step is a first circular arc surface 6-21 that is inclined upward, and the step surface at the step is a supporting surface.

[0138] The first supporting pad 6-3 and the second supporting pad 6-4 are symmetrically arranged at the finger end of the wafer finger body 6-1, and the first supporting pad 6-3 and the second supporting pad 6-4 serve to lift and protect the wafer.

[0139] The supporting surfaces of the supporting block 6-2, the first supporting pad 6-3 and the second supporting pad 6-4 are located in the same plane and are 0.5 mm higher than the surface of the wafer finger body 6-1 to ensure that the middle position of the wafer is not in contact with the surface of the wafer finger body 6-1. The clamping groove 6-53 on the clamping jaw 6-5 is located in the same plane as the supporting surfaces of the supporting block 6-2, the first supporting pad 6-3 and the second supporting pad 6-4. As shown in the figure, the first supporting pad 6-3 and the second supporting pad 6-4 have the same structure, which are block structures with a stepped longitudinal section, and the vertical surface at the step is a second arc surface 6-31 that is inclined upward. The second arc surface 6-31 extends a circular arc protrusion 6-32 that gradually thins from top to bottom. Figure 19 The vertical surface at the step of the first supporting pad 6-3 and the second supporting pad 6-4 is set as an arc surface. When the clamping jaw 6-5 clamps the wafer, the first supporting pad 6-3 and the second supporting pad 6-4 can also achieve linear contact with the wafer at their respective positions, which can increase the area of the wafer circumference edge clamping stress and avoid the wafer clamping stress being concentrated at a point or a few points to cause damage.

[0140] The vertical surface at the step of the first supporting pad 6-3 and the second supporting pad 6-4 is set as an arc surface. When the clamping jaw 6-5 clamps the wafer, the first supporting pad 6-3 and the second supporting pad 6-4 can also achieve linear contact with the wafer at their respective positions, which can increase the area of the wafer circumference edge clamping stress and avoid the wafer clamping stress being concentrated at a point or a few points to cause damage.

[0141] As shown in the figure, one end of the wafer finger body 6-1 extends a V-shaped finger 6-17, and the other end extends two parallel wrist arms 6-18. A block fixing plate 6-7 is arranged between the two wrist arms 6-18, and the upper surface of the wrist arm 6-18 is flush with the upper surface of the block fixing plate 6-7. The supporting block 6-2 and the clamping jaw 6-5 are both located on the block fixing plate 6-7, and the supporting block 6-2 is fixed to the block fixing plate 6-7 by screws or bolts. The clamping jaw 6-5 is placed on the block fixing plate 6-7 and can slide on the block fixing plate 6-7 under the drive of the linear drive mechanism. The linear drive mechanism is placed on the wrist arm 6-18 of the wafer finger body 6-1 and the block fixing plate 6-7 and is fixed to them by screws or bolts. Figure 14 15 The vertical surface at the step of the first supporting pad 6-3 and the second supporting pad 6-4 is set as an arc surface. When the clamping jaw 6-5 clamps the wafer, the first supporting pad 6-3 and the second supporting pad 6-4 can also achieve linear contact with the wafer at their respective positions, which can increase the area of the wafer circumference edge clamping stress and avoid the wafer clamping stress being concentrated at a point or a few points to cause damage.

[0142] In other embodiments, the wafer finger body 6-1 can also have other structural forms, for example, the wafer finger body only has one end extending a V-shaped finger 6-17, and the other end is a rectangular plate (i.e., the other end is a rectangular wrist arm). The supporting block 6-2 and the linear drive mechanism are fixed to the wrist and the wrist arm of the wafer finger body 6-1 by screws or bolts, respectively, and the clamping jaw 6-5 is placed on the wrist arm plate surface between the supporting block 6-2 and the linear drive mechanism.

[0143] ​Regardless of the structure of the wafer finger body 6-1, the supporting block 6-2 is located at the wrist of the wafer finger body 6-1, the first supporting pad 6-3 and the second supporting pad 6-4 are symmetrically arranged at the finger end of the wafer finger body 6-1, and the clamping jaw 6-5 is located at the rear side of the supporting block 6-2. The clamping jaw 6-5 is driven by the linear driving mechanism to move forward to clamp the wafer edge supported by the supporting block 6-2, the first supporting pad 6-3 and the second supporting pad 6-4 in the clamping groove 6-53 of the clamping jaw 6-5. When the clamping groove 6-53 of the clamping jaw 6-5 clamps the wafer, the clamping jaw 6-5 can cooperate with the first supporting pad 6-3 and the second supporting pad 6-4 to clamp the wafer from different circumferential positions.

[0144] In the embodiment, the wafer finger body 6-1 is preferably made of alumina ceramic material coated with an anti-static coating, and the supporting block 6-2, the first supporting pad 6-3 and the second supporting pad 6-4 are preferably made of polyether ether ketone (PEEK).

[0145] As shown in Figure 18 , the clamping jaw 6-5 includes a clamping jaw body 6-52 and arc-shaped clamping heads 6-51 arranged on the left and right sides of the clamping jaw body 6-52.

[0146] As shown in Figure 19 , the bottom of the clamping jaw body 6-52 is fixed with a plurality of rollers 6-11 through a roller shaft 6-12, which can guide or support the clamping jaw 6-5 during movement. As shown in Figure 16 , the bottom of the clamping jaw body 6-52 is also provided with a rectangular groove, the rectangular groove at the bottom of the clamping body 6-52 is clamped on the wrist arm of the wafer finger body 6-1, and the rollers 6-11 are placed on the surface of the block fixing plate 6-7, which can slide on the surface of the block fixing plate 6-7, and the left and right clamping heads 6-51 are located on both sides of the wrist arm, which can shuttle through both sides of the supporting block 6-2 during movement of the clamping jaw 6-5. The side of the clamping jaw body 6-52 facing the supporting block 6-2 is provided with a receiving groove 6-54, when the clamping jaw 6-5 reaches the clamping position, a part of the supporting block 6-2 is embedded in the receiving groove 6-54 to avoid interference between the clamping jaw body 6-52 and the supporting block 6-2.

[0147] The front end surface of the clamping head 6-51 is provided with a circular arc-shaped V-shaped clamping groove 6-53, as shown in Figure 20 , the large circular arc clamping head 6-51 can wrap the wafer more greatly, and the V-shaped clamping groove 6-53 clamps the wafer and linearly contacts the upper and lower edges of the wafer, so that the wafer is firmly locked in the clamping jaw without upward and downward movement when the wafer is clamped.

[0148] In the preferred embodiment, the clamping jaw 6-5 is further embedded with a connecting block 6-8 for connecting the clamping jaw with the linear drive mechanism. In this embodiment, the top of the clamping jaw body 6-52 of the clamping jaw 6-5 is provided with a T-shaped slot, and the T-shaped connecting block 6-8 is clamped in the T-shaped slot and is threadedly connected with the movable push rod of the linear drive mechanism. The connecting block 6-8 is preferably made of PVC.

[0149] The linear drive mechanism comprises an actuator fixing seat 6-13, a fixing upper cover 6-14 covering the actuator fixing seat 6-13, and a plurality of electric linear actuators 6-6 fixed in the actuator fixing seat 6-13. In this embodiment, the actuator fixing seat 6-13 is placed on the wrist arm 6-18 of the wafer finger body 6-1 and the stop block fixing plate 6-7 and is fixed with the two by means of bolts or screws and the like, and two electric linear actuators 6-6 are arranged in the actuator fixing seat 6-13, and the movable push rods of the two electric linear actuators 6-6 extend out of the actuator fixing seat 6-13 and are threadedly connected with the connecting block 6-8.

[0150] The electric linear actuators 6-6 can be selected from electric cylinders and linear motors, and in this embodiment, the electric linear actuators 6-6 are selected to be linear cylinders. The linear cylinders drive the clamping jaw 6-5 to move linearly and reciprocally, and the electric cylinders have the following advantages: 1. small size; 2. low thrust during high-speed movement, and the thrust range is 0-20 N; 3. high precision and no vibration, and the repeat positioning accuracy is ±0.02 mm; and 4. universal servo interface.

[0151] By using the double electric cylinders to drive the clamping jaw 6-5 to move to clamp the wafer, the double electric cylinders can not only ensure that the transportation movement of the clamping jaw 6-5 after clamping the wafer has sufficient power to ensure smooth transportation without shaking, but also can avoid the risk of damage to the wafer.

[0152] In the preferred embodiment, in order to control the movement stroke of the movable push rod of the electric linear actuator 6-6 and accurately control the position of the clamping jaw 6-5, a Hall position sensor 6-10 is further arranged in the actuator fixing seat 6-13 and is fixedly connected with the actuator fixing seat 6-13 by means of screws or bolts and the like.

[0153] Since there is instantaneous movement inertia when the electric cylinder 6-6 drives the clamping jaw 6-5 to move from the initial position to the clamping position, in order to avoid the instantaneous inertial force of the clamping jaw 6-5 from impacting the wafer and causing damage to the wafer, two sets of buffer assemblies are arranged between the clamping jaw 6-5 and the supporting stop block 6-2 to slow down and offset the instantaneous inertial force.

[0154] In the embodiment, the buffer assembly comprises buffer springs 6-9, one end of which is fixed on the front side of the clamping jaw 6-5 and the other end of which is fixed on the rear side of the bearing stopper 6-2, as shown in Figure 19

[0155] When the clamping jaw 6-5 moves forward from the initial position to reach the clamping position, the buffer springs 6-9 are compressed, so that the buffer springs 6-9 generate a backward elastic force to reduce the speed of the forward movement of the clamping jaw 6-5; when the clamping jaw 6-5 reaches the clamping position, the elastic force of the buffer springs 6-9 can completely offset the instantaneous inertial force generated by the stop of the movement of the clamping jaw, so that the clamping jaw 6-5 can stably clamp the wafer. In the embodiment, the clamping force of the clamping jaw 6-5 on the wafer is controlled to be 4-4.5 N.

[0156] The wafer electroplating carrying and conveying process using the mechanical hand of the present application is as follows:

[0157] S1, initialization: after the horizontal electroplating equipment is started, the lifting module 1, the horizontal moving module 2, the rotating module 3, the straight moving module 4, the overturning module 5 and the wafer clamping finger 6 are initialized, and the wafer clamping finger 6 is moved to the initial position;

[0158] S2, the control system controls the lifting motor of the lifting module 1 to start, and drives the whole mechanical hand to move in the vertical direction by using the lifting transmission mechanism, and in the moving process, the first photoelectric switch assembly detects the height position of the horizontal moving module 2 in real time, and when the horizontal moving module 2 moves to be in line with the loading port, the lifting motor stops running;

[0159] S3, the control system controls the horizontal moving motor of the horizontal moving module 2 to start, and drives the rotating module 3 and the straight moving module 4, the overturning module 5 and the wafer clamping finger 6 thereon to move in the horizontal direction by using the horizontal moving transmission mechanism, and in the moving process, the second photoelectric switch assembly detects the left and right positions of the rotating module 3 in real time, and when the rotating module 3 moves to the position that the wafer clamping finger 6 is aligned with the wafers in the wafer box (the wafer clamping finger 6 is aligned with the wafers in the horizontal direction), the horizontal moving motor stops running;

[0160] S4, the control system controls the straight moving module 4 to move the wafer clamping finger 6 forward to grab two wafers, and after the wafer clamping finger 6 grabs the wafers, the straight moving module 4 moves the wafer clamping finger 6 backward to make the wafer clamping finger 6 retract to the original position;

[0161] S5, the control system controls the lifting module 1 to move again to drive the whole mechanical hand to move in the vertical direction, so that the wafers clamped by the wafer clamping finger 6 are in line with the height of the pre-wetting cavity of the wafer electroplating equipment;

[0162] ​When the whole mechanical hand moves to the specified height, the horizontal moving module 2 and the rotating module 3 work cooperatively, first, the horizontal moving module 2 horizontally carries the grabbed wafers to the position where the pre-wetting cavity is located, then the rotating module 3 rotates to make the wafer clamping fingers 6 clamped wafers align with the pre-wetting cavity, then the straight moving module 4 makes the wafer clamping fingers 6 move forward again to accurately place the grabbed two wafers into the pre-wetting cavity, and the single-side wetting operation is performed in the pre-wetting cavity (i.e. the wetting operation is performed on the side of the wafer to be plated, for example, the wetting operation is performed on the upper surface of the wafer) ;

[0163] After the wetting operation is completed, the wafer is turned over 180° by the turnover module 5 to turn over the wafer (for example, the wetted side of the wafer is turned to face downward), then the straight moving module 4 makes the wafer clamping fingers 6 move backward to take out the wafer from the pre-wetting cavity;

[0164] Then, the lifting module 1, the horizontal moving module 2, the rotating module 3 and the straight moving module 4 cooperate to send the wafer into the plating cavity, and the plating mechanical hand clamped with the wafer performs the plating treatment in the plating cavity (for example, the wafer is moved by the lifting module 1 and the horizontal moving module 2 to align with the plating cavity in the horizontal direction and the vertical direction, if the plating cavity is located adjacent to the pre-wetting cavity and the two cavities are arranged at the same height, the lifting module 1 and the horizontal moving module 2 can not act, and the wafer can be directly rotated to align with the plating cavity by the rotating module 3, then the wafer is sent into the plating cavity by the straight moving module 4) ;

[0165] Then, after the wafer is plated in the current plating cavity, according to the process requirement, if other metal needs to be plated, the lifting module 1, the horizontal moving module 2, the rotating module 3 and the straight moving module 4 cooperate to continue to send the wafer into other plating cavities for plating;

[0166] After the whole wafer plating operation is completed, the mechanical hand of the application grabs the wafer again, and the lifting module 1, the horizontal moving module 2, the rotating module 3 and the straight moving module 4 cooperate to carry the wafer back to the wafer box.

[0167] In the embodiment two, the structure of the horizontal wafer plating conveying mechanical hand is basically the same as that of the embodiment one, and the specific difference is that the structure of the buffer assembly of the wafer clamping fingers 6 in the embodiment two is different from that of the buffer assembly in the embodiment one.

[0168] The buffer assembly in the embodiment two includes a guide shaft 6-15, a guide sleeve 6-16 and a buffer spring 6-9, two clamping grooves 6-21 are formed on the rear side of the supporting block 6-2 along the axial direction of the guide shaft, as shown in Figure 21

[0169] ​One end of the guide shaft 6-15 is fixed on the actuator fixing seat 6-13 of the linear driving mechanism, and the other end passes through the jaw body 6-52 of the jaw 6-5 and extends into the clamping groove 6-21 fixed on the supporting stopper 6-2.

[0170] The guide sleeve 6-16 is sleeved on the guide shaft 6-15 and penetrates the jaw 6-5 and is fixed as a whole with the jaw 6-5. One end of the guide sleeve 6-16 extends into the clamping groove 6-21, and the end is fixed with the buffer spring 6-9, and the other end of the buffer spring 6-9 is fixed on the groove surface of the clamping groove 21.

[0171] When the electric cylinder 6-6 moves forward with the jaw 6-5 from the initial position, the guide sleeve 6-16 moves synchronously with the jaw 6-5 on the guide shaft 6-15, and when the jaw 6-5 is about to reach the clamping position, the buffer spring 6-9 is compressed, so that the buffer spring 6-9 generates a backward elastic force to reduce the speed of the forward movement of the jaw 6-5; when the jaw 6-5 reaches the clamping position, the elastic force of the buffer spring 6-9 can completely offset the instantaneous inertia force generated by the stop of the jaw, and the jaw 6-5 can stably clamp the wafer.

[0172] The guide shaft 6-15 and the guide sleeve 6-16 mainly play a guiding role to avoid the influence of the slight deviation of the position of the jaw 6-5 on the clamping effect when the jaw 6-5 moves linearly, and effectively ensure the stability of the linear movement of the jaw 6-5. At the same time, the guide sleeve can also be used to fix the buffer spring 6-9.

[0173] The other specific embodiments and examples are the same as example one, and will not be described in detail here.

[0174] In example three, the structure of the horizontal electroplating wafer conveying manipulator is basically the same as that of example one, and the specific difference is that the structure of the turnover module 5 in this example is different from that of the turnover module 5 in example one.

[0175] As shown in Figure 12 , 13 The turnover module of the present example includes a shell 5-1 and a turnover motor 5-2 fixed in the shell 5-1.

[0176] The shell 5-1 includes a bottom plate, a top plate, a left side plate, a right side plate, a front side plate and a rear side plate.

[0177] The turnover motor 5-2 is arranged in the shell 5-1, and the turnover motor 5-2 is fixed on the bottom plate of the shell 1 through a motor mounting plate. A first gear 5-15 is arranged on the rotating shaft of the turnover motor 5-2, a second gear 5-16 is arranged on the turnover shaft 5-5 fixed on the rotating shaft mounting plate 5-17, the second gear 5-16 is engaged with the first gear 5-15, the other end of the turnover shaft 5-5 extends out of the shell 5-1 and is connected with the wafer clamping finger 6 through an actuator connecting assembly, that is, a fixed bearing 5-13 is arranged on the rotating shaft mounting plate 5-17, and a guide bearing 5-14 is arranged on the shell 5-1 at a position opposite to the fixed bearing 5-13, one end of the turnover shaft 5-5 is fixed with the fixed bearing 5-13, the other end passes through the guide bearing 5-14 and is connected with the actuator connecting assembly, and the second gear 5-16 is fixed on the turnover shaft 5-5.

[0178] In the embodiment, the fixed bearing and the guide bearing are double-cover deep groove ball bearings, which have the characteristics of high precision and low noise, the fixed bearing can play the role of guiding and damping, the guide bearing can ensure the stability of the turnover shaft 5-5 during rotation, and the turnover motor 5-2 is a high-precision five-phase stepping motor.

[0179] The turnover shaft 5-5, the actuator connecting assembly and other modules or parts are the same as those in the first embodiment in structure, material and other characteristics, and will not be described in detail here.

[0180] It should be clear that the described embodiments are only part of the embodiments of the present application, not all. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application.

Claims

1. A horizontal electroplating wafer transfer robot, characterized in that, It includes a vertically arranged lifting module (1), a horizontally arranged transverse module (2) arranged on the lifting module (1) and capable of moving up and down along the lifting module (1), a rotating module (3) arranged on the transverse module (1) and capable of moving left and right along the transverse module (1), a straight module (4) arranged on the rotating module (3) and capable of circumferential rotation under the drive of the rotating module (3), two sets of flipping modules (5) arranged on the straight module (4) and capable of moving back and forth under the drive of the straight module (4), and a wafer clamping finger (6) fixed at the front end of the flipping module (5) for clamping the wafer and capable of flipping the wafer up and down under the drive of the flipping module (5); The wafer clamping finger (6) includes a wafer finger body (6-1) and a linear drive mechanism, a gripper (6-5), and a support assembly disposed on the wafer finger body (6-1). The linear drive mechanism is fixed at the end of the wafer finger body (6-1), and its movable push rod is fixed to the gripper (6-5). The gripper (6-5) is slidably disposed between the linear drive mechanism and the support assembly. The gripper (6-5) and the support assembly are connected by a buffer assembly. The buffer assembly is used to reduce the clamping inertia of the gripper. The support assembly is used to physically limit the moving distance of the gripper (6-5) and, in the state of lifting the wafer (7), cooperates with the gripper (6-5) to clamp the wafer to avoid the wafer contacting the surface of the wafer finger.

2. The horizontal electroplating wafer transfer robot according to claim 1, characterized in that, The straight-line module (4) includes a housing (4-1) and two sets of conveying modules (4-2) symmetrically arranged inside the housing (4-1). The cover plate (4-11) of the housing (4-1) has two slots (4-14) along its length direction. The two ends of the inner side of the side plate (4-12) of the housing (4-1) are provided with limiting protrusions (4-15) to limit the movement of the flipping module (5). The bottom plate (4-13) of the housing (4-1) is provided with a photoelectric switch (4-16) to detect the position of the flipping module (5). The transport module (4-2) is provided with a photoelectric sensor (4-4) to interact with the photoelectric switch (4-16). Each handling module (4-2) includes a motor (4-21) fixed on a motor mounting plate (4-29), a first synchronous pulley (4-22) fixed at the output end of the motor (4-21), a second synchronous pulley (4-23) connected to the first synchronous pulley (4-22) via a synchronous belt (4-24), a ball screw (4-26) connected to the screw fixing seat (4-25) and the second synchronous pulley (4-23) respectively, and a ball screw (4-26) set on the ball screw (4-29). 6) The motion bearing seat (4-27) on the motion bearing seat (4-27) and the slider (4-28) fixed on the motion bearing seat (4-27) are slidably arranged on the guide rail (4-210). The guide rail (4-210) is arranged on the inner side of the side plate (4-12). The flipping module (5) is fixed on the connecting support plate (8). The lower end of the connecting support plate (8) extends into the cover (4-1) from the slot (4-14) and is fixed to the motion bearing seat (4-27).

3. The horizontal electroplating wafer transfer robot according to claim 1, characterized in that, The flipping module (5) includes a housing (5-1) and a flipping motor (5-2) fixed inside the housing (5-1). The rotating shaft of the flip motor (5-2) is connected to a motor connecting shaft (5-5). One end of the motor connecting shaft (5-5) extends out of the outer shell (5-1) and is connected to the wafer finger body (6-1) through the actuator connecting assembly.

4. The horizontal electroplating wafer transfer robot according to claim 1, characterized in that, The flipping module (5) includes a housing (5-1) and a flipping motor (5-2) fixed inside the housing (5-1). The rotating shaft of the flip motor (5-2) is equipped with a first gear (5-15), and a second gear (5-16) is installed at one end of the flip shaft (5-5) which is fixed on the rotating shaft mounting plate (5-17). The second gear (5-16) meshes with the first gear (5-15). The other end of the flip shaft (5-5) extends out of the housing (5-1) and is connected to the wafer finger body (6-1) through the actuator connection assembly.

5. The horizontal electroplating wafer transfer robot according to claim 3 or 4, characterized in that, Sealing strips are provided at the joints between the bottom plate, top plate, left side plate, right side plate, front side plate and rear side plate of the outer shell (5-1).

6. The horizontal electroplating wafer transfer robot according to claim 1, characterized in that, The support assembly includes a support block (6-2), a first support pad (6-3), and a second support pad (6-4). The support block (6-2) is disposed at the wrist of the wafer finger body (6-1). The support block (6-2) is connected to the gripper (6-5) through a buffer assembly. The first support pad (6-3) and the second support pad (6-4) are disposed at the fingertip of the wafer finger body (1). The support surfaces of the support block (6-2), the first support pad (6-3), and the second support pad (6-4) are located on the same plane and are higher than the surface of the wafer finger body (6-1).

7. The horizontal electroplating wafer transfer robot according to claim 6, characterized in that, The supporting block (6-2) is a block structure with a stepped longitudinal section, and the vertical surface at the step is a first arc surface (6-21) that is inclined upward. The first support pad (6-3) and the second support pad (6-64) have the same structure. Both are block structures with a stepped longitudinal section, and the vertical surface at the step is a second arc surface (6-31) that is inclined upward. An arc protrusion (6-32) with a thickness that gradually decreases from top to bottom extends from the second arc surface (6-31).

8. The horizontal electroplating wafer transfer robot according to claim 1, characterized in that, The gripper (6-5) includes a gripper body (6-52) and chucks (6-51) located on the left and right sides of the gripper body (6-52) that can shuttle between the left and right sides of the supporting block (6-2). The chucks (6-51) are provided with arc-shaped chuck grooves (6-53) that can achieve bilinear contact with the edge of the wafer. The bottom of the gripper body (6-52) is fixed with a roller (6-11) by a roller shaft (6-12). The gripper body (6-52) is provided with a receiving groove (6-54) on the side facing the supporting block (6-2). A connecting block (6-8) is embedded in the gripper body (6-52). The movable push rod of the linear drive mechanism is fixed to the connecting block (6-8).

9. The horizontal electroplating wafer transfer robot according to claim 1, characterized in that, The buffer assembly includes a buffer spring (6-9), one end of which is fixed to the side of the gripper (6-5) and the other end is fixed to the side of the supporting block (6-2). Alternatively, the buffer assembly may include a guide shaft (6-15), a guide sleeve (6-16), and a buffer spring (6-9). One end of the guide shaft (6-15) is fixed to the linear drive mechanism, and the other end passes through the gripper (6-5) and extends into the slot (6-21) fixed to the support block (6-2). The guide sleeve (6-16) is sleeved on the guide shaft (6-15) and passes through the gripper (6-5) and is fixed to the gripper (6-5). One end of the guide sleeve (6-16) extends into the slot (6-21) and the buffer spring (6-9) is fixed to that end. The other end of the buffer spring (6-9) is fixed to the groove surface of the slot (6-21).

10. The horizontal electroplating wafer transfer robot according to claim 1, characterized in that, The lifting module (1) includes a vertically arranged lifting module base plate (1-1), a lifting transmission mechanism (1-2) fixed on the lifting module base plate (1-1), and a lifting slide block (1-3) fixed on the lifting transmission mechanism (1-2). The upper and lower ends of the lifting module base plate (1-1) are provided with a first photoelectric switch assembly for detecting the lifting position of the transverse module (2). The transverse module (2) includes a horizontally arranged transverse module base plate (2-1) fixed on the lifting slide block (1-3), a transverse transmission mechanism (2-2) fixed on the transverse module base plate (2-1), and a transverse slide block (2-3) fixed on the transverse transmission mechanism (2-2). The rotating module (3) is fixed on the transverse slide block (2-3). The left and right ends of the transverse module base plate (2-1) are provided with second photoelectric switch components for detecting the left and right positions of the rotating module (3).

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