Epoxy resin homogenizing device and homogenizing method thereof

Abstract

The invention is suitable for the technical field of epoxy resin processing, and particularly relates to an epoxy resin homogenizing device which comprises a shell, a stirring device and at least two sensors, the stirring device is rotatably connected to the shell, and the two sensors are arranged on the bottom wall of the shell and the stirring device respectively. The stirring device comprises a stirring rod, two stirring blade groups and a driving mechanism, and the driving mechanism is connected to the stirring rod. The stirring blade comprises a fixing part and an adjusting assembly, the fixing part is connected to the stirring rod, a circulation hole is formed in the end, away from the stirring rod, of the fixing part, and the adjusting assembly is located in the circulation hole. According to the epoxy resin homogenizing device and the homogenizing method thereof provided by the invention, the problem of low homogenizing efficiency in the stirring process of epoxy resin can be improved.

Description

Technical Field

[0001] This application belongs to the field of epoxy resin processing technology, and particularly relates to an epoxy resin homogenization device and its homogenization method. Background Technology Epoxy resin is a high-performance polymer material with excellent adhesion, insulation, and corrosion resistance, making it widely used in electronic packaging, composite materials, coatings, and many other fields. In practical applications, epoxy resin often needs to be mixed with components such as curing agents and fillers. The mixing process is crucial for ensuring uniform dispersion of the components and guaranteeing the performance of the final product. Currently, epoxy resin mixing is mainly divided into two methods: manual mixing and mechanical mixing. Manual mixing involves hand-held tools, which is simple to operate but less efficient, while mechanical mixing utilizes a mixing device and is relatively more efficient.

[0002] In the process of stirring and homogenizing epoxy resin using a mixing device, a motor typically drives the stirring rod to rotate, causing the stirring blades fixed on the stirring rod to rotate within the epoxy resin. This stirring process, after a certain period of time, allows the epoxy resin to reach homogenization. Traditional mixing devices usually only have one or more sets of stirring blades at different fixed heights in the same direction. The stirring process relies on the shearing and thrust generated by the rotating blades in fixed positions for homogenization. However, the overall flow direction of the epoxy resin is relatively unidirectional, resulting in limited homogenization efficiency.

[0003] In some related technologies, the mixing efficiency is improved by adding a oscillating stirring mechanism to the mixing device and enabling the stirring mechanism to move up and down, thereby stirring the epoxy resin at different positions in the mixing device from all directions and at multiple angles.

[0004] However, the solutions adopted in the aforementioned related technologies are merely to make the mixing process more complex by setting up one or more stirring devices at different angles and adjusting the stirring height, thereby improving the mixing effect. But in this type of technical solution, the fundamental technical effect is simply to blindly complicate the mixing process, causing the epoxy resin in various parts of the stirring device to move irregularly. There is a lack of purposeful control over the mixing process of epoxy resin, which may lead to low homogenization efficiency. Summary of the Invention

[0005] This application provides an epoxy resin homogenization device and method, which can improve the problem of low homogenization efficiency in the stirring process of epoxy resin.

[0006] In a first aspect, embodiments of this application provide an epoxy resin homogenization device, the epoxy resin homogenization device comprising: The shell has a stirring chamber; A stirring device, rotatably connected to the housing and located within the stirring chamber; and At least two sensors are respectively installed on the bottom wall of the housing and on the stirring device; The stirring device includes: A stirring rod, which is rotatably connected to the housing and located in the stirring chamber; Two sets of stirring blades are connected to the stirring rod, one set of stirring blades being located at one end of the stirring rod near the bottom of the housing, and the other set of stirring blades being located in the middle of the stirring rod, each set of stirring blades comprising at least two stirring blades; and A drive mechanism is located outside the housing and is connected to the stirring rod; The stirring blades include: A fixing part, connected to the stirring rod, has a flow hole at the end of the fixing part away from the stirring rod, the flow hole passing through the fixing part along the axial direction of the stirring rod; the sensor is disposed on the side of the fixing part near the bottom of the housing; and An adjustment component is located within the flow hole and is movably connected to the fixing part; The adjustment component has a first state in which it is completely located inside the flow hole, and a second state in which both ends are located outside the flow hole.

[0007] The epoxy resin homogenization device provided in this application provides a stirring blade with a flow channel and the flow channel can be controlled by setting a through hole on each stirring blade and setting a controllable adjustment component at the through hole on each stirring blade via a rotating shaft. The front of the stirring blade directly pushes the epoxy resin, resulting in higher pressure on the front and lower pressure on the back. When the regulating component is not rotating, the stirring blade exists in two states. When the regulating component is not rotating, it forms a straight "I" shape with a through hole on the blade. Due to the stirring motion, the epoxy resin flows from the high-pressure area to the low-pressure area through this through hole, instead of flowing around the edge of the blade to the low-pressure area on the back. This directly opens a shortcut between the high-pressure area on the front and the low-pressure area on the back, driving the axial flow of the epoxy resin through the pressure difference, fundamentally optimizing the stirring effect. When the regulating component rotates, it forms an "X" shape with the stirring blade. This not only increases the flow path size of the through hole but also enhances the flow effect between different layers. By controlling the rotation angle and direction of the regulating component, the homogenization process of the epoxy resin can be purposefully adjusted, thereby accelerating the homogenization efficiency.

[0008] In some embodiments, the adjustment component includes: A connector, located within the flow hole, is rotatably connected to the fixing part; An adjusting element, located within the flow hole, is connected to the connecting element; and A driving component, the output end of which is connected to the connecting component, the driving component being used to drive the connecting component to rotate; The adjusting member has a first state in which it is completely located inside the flow hole, and a second state in which both ends are located outside the flow hole. When the adjusting member is in the first state, there is a gap between the adjusting member and the fixing part.

[0009] Secondly, embodiments of this application also provide an epoxy resin homogenization method, applied to the epoxy resin homogenization apparatus, the method comprising: Acquire first pressure distribution information and second pressure distribution information; wherein, the first pressure distribution information is used to reflect the pressure distribution on the lower surface of the stirring blade, and the second pressure distribution information is used to reflect the pressure distribution at the bottom of the stirring chamber; Based on the first pressure distribution information, adjustment information corresponding to each of the adjustment components is obtained so that the adjustment components can be adjusted according to the corresponding adjustment information; wherein, the adjustment information includes the adjustment direction of the adjustment component and the adjustment angle of the adjustment component. Based on the second pressure distribution information, a homogenization result is obtained, and based on the homogenization result, the control valve is controlled to open and close; wherein, the homogenization result is used to reflect whether the epoxy resin has reached a homogenized state in the epoxy resin homogenization device.

[0010] The technical solutions described in this application embodiment have at least the following technical effects: The epoxy resin homogenization method provided in this application firstly acquires first pressure distribution information reflecting the pressure distribution on the lower surface of the stirring blades and second pressure distribution information reflecting the pressure distribution at the bottom of the stirring chamber when using the epoxy resin homogenization device. Then, based on the first pressure distribution information, adjustment information corresponding to each adjustment component is obtained, including adjustment direction and adjustment angle of the adjustment component, so that the adjustment component can be adjusted according to the corresponding adjustment information. Then, based on the second pressure distribution information, a homogenization result reflecting whether the epoxy resin has reached a homogenization state in the epoxy resin homogenization device is obtained, and the opening and closing of the control valve is controlled based on the homogenization result.

[0011] This method can effectively obtain adjustment information about the regulating component based on the pressure distribution on the lower surface of different groups of stirring blades during the stirring process. The control device then controls the regulating component to rotate at different angles and directions based on this information, thereby forming flow channels for different layers of epoxy resin. During stirring, the different layers of epoxy resin flow through these channels, and under the centrifugal force, the flow of epoxy resin is purposefully guided, accelerating the homogenization process and reducing the time required for homogenization. This improves the homogenization efficiency of the epoxy resin homogenization device. Furthermore, by using second pressure distribution information to constantly monitor whether the epoxy resin in the homogenization device has reached a homogenized state, energy consumption during epoxy resin homogenization can be reduced.

[0012] In one possible implementation of the second aspect, obtaining the first pressure distribution information and the second pressure distribution information includes: When the epoxy resin homogenization device starts stirring, it acquires first pressure distribution information. When the system power reaches a stable state, it stops acquiring the first pressure distribution information and starts acquiring the second pressure distribution information.

[0013] In one possible implementation of the second aspect, obtaining adjustment information corresponding to the adjustment component based on the first pressure distribution information includes: Obtain homogenized density; wherein, the homogenized density is used to reflect the density of the epoxy resin after it has reached uniformity; Based on the first pressure distribution information and the homogenized density, the interlayer density and the interlayer density relationship are obtained; wherein, the interlayer density is used to reflect the density of epoxy resin in different layers, and the interlayer density relationship is used to reflect the magnitude relationship between the epoxy resin density in different layers and the homogenized density. Based on the interlayer density relationship and the interlayer density, adjustment information is obtained.

[0014] In one possible implementation of the second aspect, obtaining the interlayer density and the interlayer density relationship based on the first pressure distribution information and the homogenized density includes: A first pressure data set is extracted from the first pressure distribution information, and first pressure data is obtained based on the analysis of the first pressure data set; wherein, the first pressure data set is used to reflect the set of pressure information of the lower surface of each stirring blade of the first stirring blade group, and the first pressure data is used to reflect the average value of the first pressure data set; A second pressure data set is extracted from the first pressure distribution information, and second pressure data is obtained based on the analysis of the second pressure data set; wherein, the second pressure data set is used to reflect the set of pressure information of the lower surface of each stirring blade of the second stirring blade set, and the second pressure data is used to reflect the average value of the second pressure data set; Based on the first pressure data, the second pressure data, and the homogenized density, the interlayer density and the relationship between interlayer densities are obtained.

[0015] In one possible implementation of the second aspect, obtaining the interlayer density and the interlayer density relationship based on the first pressure data, the second pressure data, and the homogenized density includes: Based on the first pressure data, a first layer density is obtained; wherein, the first layer density is used to reflect the average density of the epoxy resin above the first stirring blade group; The second layer density is obtained based on the pressure difference data; wherein the pressure difference data is used to reflect the difference between the first pressure data and the second pressure data, and the second layer density is used to reflect the average density of the epoxy resin between the first stirring blade group and the second stirring blade group. Based on the first layer density and the second layer density, a third layer density is obtained; wherein, the third layer density is used to reflect the average density of the epoxy resin located below the second stirring blade group; The density of the first layer, the density of the second layer, and the density of the third layer are identified as the interlayer density; The interlayer density relationship is obtained by comparing the density of the first layer, the density of the second layer, and the density of the third layer with the homogenized density.

[0016] In one possible implementation of the second aspect, obtaining the adjustment information based on the interlayer density relationship and the interlayer density includes: Based on the analysis of the interlayer density relationship, the adjustment direction of the adjustment information is obtained; wherein, the adjustment direction includes the first rotation direction of the first set of adjustment components and the second rotation direction of the second set of adjustment components; The adjustment angle is obtained based on the interlayer density and the adjustment direction, which provides the adjustment information.

[0017] In one possible implementation of the second aspect, the adjustment angle for obtaining adjustment information based on the interlayer density and the adjustment direction includes: Based on the first layer density, the second layer density, and the third layer density in the interlayer density and the first rotation direction and the second rotation direction in the adjustment direction, a first angular relationship is obtained; wherein, the first angular relationship is used to reflect the relationship between the adjustment angle of the first group of adjustment components and the adjustment angle of the second group of adjustment components when the first layer density and the second layer density reach the homogenized density; A second angular relationship is obtained based on the first and second layer densities in the interlayer density and the first and second rotation directions in the adjustment direction; wherein, the second angular relationship is used to reflect the relationship between the adjustment angles of the first group of adjustment components and the adjustment angles of the second group of adjustment components when the first layer density and the third layer density reach the homogenized density; The adjustment angle is obtained based on the first angular relationship and the second angular relationship.

[0018] In one possible implementation of the second aspect, obtaining the homogenization result based on the second pressure distribution information includes: Based on the second pressure distribution information, multiple pressure frequency signals are obtained through analysis. Based on the stirring cycle, a set of characteristic peaks corresponding to the stirring cycle is extracted from multiple pressure frequency signals; wherein, the stirring cycle is used to reflect the time required for the epoxy resin to complete one full rotation after the acquisition of the second pressure distribution information begins, and the set of characteristic peaks is used to reflect a set of peaks associated with the stirring cycle in each pressure frequency signal; Analysis is performed based on multiple characteristic peak sets to obtain homogenized results.

[0019] In one possible implementation of the second aspect, the analysis based on multiple sets of characteristic peaks to obtain the averaging result includes: Based on the analysis of multiple characteristic peak sets, multiple frequency values ​​and multiple amplitude changes corresponding to the characteristic peak sets are obtained; wherein, the frequency values ​​are used to reflect the frequency value of each characteristic peak in the characteristic peak set, and the amplitude changes are used to reflect the intensity value of each characteristic peak in the characteristic peak set; When the multiple frequency values ​​corresponding to each of the characteristic peak sets are the same and the multiple amplitude changes are all less than a preset threshold, the homogenization result is confirmed as the epoxy resin reaching the homogenization state.

[0020] Thirdly, embodiments of this application provide an epoxy resin homogenization system, comprising: The acquisition unit is used to acquire first pressure distribution information and second pressure distribution information; wherein, the first pressure distribution information is used to reflect the pressure distribution detected by the pressure sensor installed on the lower surface of the stirring blade, and the second pressure distribution information is used to reflect the pressure distribution detected by the pressure sensor installed on the inner surface of the bottom of the stirring chamber; A first analysis and control unit is configured to obtain adjustment information corresponding to the adjustment component based on the first pressure distribution information, and control the adjustment component to adjust according to the corresponding adjustment information; wherein, the adjustment information includes the adjustment direction of the adjustment component and the adjustment angle of the adjustment component; The second analysis and control unit is used to obtain the homogenization result based on the second pressure distribution information, and to control the opening and closing of the valve based on the homogenization result; wherein the homogenization result is used to reflect whether the epoxy resin has reached a homogenized state in the epoxy resin homogenization device.

[0021] Fourthly, embodiments of this application provide a computer-readable storage medium storing a computer program that, when executed by a processor, implements the method described in any of the first aspects above.

[0022] Fifthly, embodiments of this application provide a computer program that, when run on an epoxy resin homogenizing apparatus, causes the epoxy resin homogenizing apparatus to perform the epoxy resin homogenizing method described in any one of the first aspects.

[0023] It is understood that the beneficial effects of the second to fifth aspects mentioned above can be found in the relevant descriptions in the first aspect mentioned above, and will not be repeated here. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of the structure of an epoxy resin homogenization device provided in an embodiment of this application; Figure 2 This is a schematic diagram of the internal structure of the adjusting component of the epoxy resin homogenization device provided in an embodiment of this application in the first state; Figure 3 This is a schematic diagram of the internal structure of the adjusting component of the epoxy resin homogenization device provided in an embodiment of this application in the second state; Figure 4 This is a schematic diagram of the first state of the adjusting component of an epoxy resin homogenization device provided in an embodiment of this application; Figure 5 This is a schematic diagram of the second state of the adjusting component of the epoxy resin homogenization equipment provided in an embodiment of this application; Figure 6 This is a schematic diagram of the stirring device structure of an epoxy resin homogenization apparatus provided in an embodiment of this application; Figure 7 This is a schematic flowchart of an epoxy resin homogenization method provided in an embodiment of this application; Figure 8 This is a schematic diagram illustrating the implementation process of an epoxy resin homogenization method provided in an embodiment of this application; Figure 9 This is a schematic diagram of the structure of an epoxy resin homogenization system provided in an embodiment of this application; Figure 10 This is a schematic diagram of the structure of the control device of an epoxy resin homogenization equipment according to an embodiment of this application. The following are the labeling elements in the figure: 100. Epoxy resin homogenization device; 10. Shell; 12. Inlet; 13. Outlet; 11. Mixing chamber; 20. Mixing device; 21. Mixing rod; 22. Drive mechanism; 23. Mixing blade; 231. Fixing part; 232. Adjusting component; 2321. Connecting part; 2322. Adjusting component; 223. Gap. Detailed Implementation

[0026] In the following description, specific details such as particular system architectures and techniques are set forth for illustrative purposes and not for limitation, in order to provide a thorough understanding of the embodiments of this application. However, those skilled in the art will understand that this application may also be implemented in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, apparatuses, circuits, and methods have been omitted so as not to obscure the description of this application with unnecessary detail.

[0027] It should be understood that, when used in this application specification and the appended claims, the term "comprising" indicates the presence of the described features, integrals, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or a collection thereof.

[0028] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0029] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0030] It should also be understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0031] As used in this application specification and the appended claims, the term "if" may be interpreted, depending on the context, as "when," "once," "in response to determination," or "in response to detection." Similarly, the phrase "if determined" or "if detected [the described condition or event]" may be interpreted, depending on the context, as meaning "once determined," "in response to determination," "once detected [the described condition or event]," or "in response to detection [the described condition or event]."

[0032] Furthermore, in the description of this application and the appended claims, the terms "first," "second," "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0033] References to "one embodiment" or "some embodiments" as described in this specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0034] In related technologies, epoxy resin is a high-performance polymer material with excellent adhesion, insulation, and corrosion resistance, making it widely used in electronic packaging, composite materials, coatings, and many other fields. In practical applications, epoxy resin often needs to be mixed with components such as curing agents and fillers, and the stirring process is crucial for ensuring uniform dispersion of the components and guaranteeing the performance of the final product. Currently, epoxy resin stirring is mainly divided into two methods: manual stirring and mechanical stirring. Manual stirring involves mixing with hand tools, which is simple to operate but less efficient, while mechanical stirring utilizes a stirring device and is relatively more efficient.

[0035] In the process of stirring and homogenizing epoxy resin using a mixing device, a motor typically drives the stirring rod to rotate, causing the stirring blades fixed on the stirring rod to rotate within the epoxy resin. This stirring process, after a certain period of time, allows the epoxy resin to reach homogenization. Traditional mixing devices usually only have one or more sets of stirring blades at different fixed heights in the same direction. The stirring process relies on the shearing and thrust generated by the rotating blades in fixed positions for homogenization. However, the overall flow direction of the epoxy resin is relatively unidirectional, resulting in limited homogenization efficiency.

[0036] In some related technologies, the mixing efficiency is improved by adding a oscillating stirring mechanism to the mixing device and enabling the stirring mechanism to move up and down, thereby stirring the epoxy resin at different positions in the mixing device from all directions and at multiple angles.

[0037] However, the solutions adopted in the aforementioned related technologies are merely to make the mixing process more complex by setting up one or more stirring devices at different angles and adjusting the stirring height, thereby improving the mixing effect. But in this type of technical solution, the fundamental technical effect is simply to blindly complicate the mixing process, causing the epoxy resin in various parts of the stirring device to move irregularly. There is a lack of purposeful control over the mixing process of epoxy resin, which may lead to low homogenization efficiency.

[0038] Based on this, in order to improve the problem of low homogenization efficiency of stirring devices in related technologies, this application provides an epoxy resin homogenization device.

[0039] Please refer to the following: Figure 1 , Figure 2 as well as Figure 6 The epoxy resin homogenizing device 100 provided in the embodiments of this application will now be described. The epoxy resin homogenizing device 100 includes a housing 10, a stirring device 20, and at least two sensors, wherein: The housing 10 has a stirring chamber 11 for holding and stirring epoxy resin. A stirring device 20 is rotatably connected to the housing 10 and located within the stirring chamber 11. The stirring device 20 is used to stir the epoxy resin within the stirring chamber 11. At least one sensor is provided on the bottom wall of the housing 10, and at least one sensor is provided on the stirring device 20.

[0040] The stirring device 20 includes a stirring rod 21, two sets of stirring blades 23, and a drive mechanism 22. The stirring rod 21 is rotatably connected to the housing 10 and located in the stirring chamber 11. Both sets of stirring blades 23 are connected to the stirring rod 21, with one set located at the end of the stirring rod 21 near the bottom of the housing 10 and the other set located in the middle of the stirring rod 21. Each set of stirring blades 23 includes at least two stirring blades 23. The drive mechanism 22 is located outside the housing 10 and is connected to the stirring rod 21.

[0041] The stirring blade 23 includes a fixing part 231 and an adjusting assembly 232. The fixing part 231 is connected to the stirring rod 21. A flow hole is provided at the end of the fixing part 231 away from the stirring rod 21, and the flow hole extends through the fixing part 231 along the axial direction of the stirring rod 21. A sensor is disposed on the side of the fixing part 231 near the bottom of the housing 10. The adjusting assembly 232 is located inside the flow hole and is movably connected to the fixing part 231. The adjusting assembly 232 has a first state in which it is completely located inside the flow hole, and a second state in which both ends are located outside the flow hole.

[0042] It is understood that during the process of stirring epoxy resin using the epoxy resin homogenization device 100, the epoxy resin inside the shell 10 is driven by the drive mechanism 22 to rotate the stirring rod 21, thereby causing the stirring blades 23 fixed on the stirring rod 21 to rotate. This allows the stirring blades 23 of a certain size to cut, squeeze, and push the epoxy resin in the stirring chamber 11, stirring it within the stirring chamber 11. With the cumulative effect of stirring time, the epoxy resin becomes uniform throughout. During this stirring process, the shell 10 is a structure capable of supporting the epoxy resin and providing a mounting base for the stirring device 20. For example, the shell 10 can be a cylindrical cavity structure, a square container structure, or other irregularly shaped cavity structure. Its inner wall can be provided with an anti-corrosion coating to adapt to the chemical properties of the epoxy resin, but it is not limited to these. The stirring rod 21 is a rod-shaped structure capable of transmitting power and mounting the stirring blades 23. For example, it can be a solid metal rod, a hollow metal rod, or a composite material rod. Its diameter can be designed according to the stirring load requirements, but it is not limited to these. The shape of the stirring blade 23 can be straight, curved, spiral, or toothed, and can be adjusted according to the required stirring intensity and flow field characteristics, but is not limited to these. The drive mechanism 22 is a mechanism that can provide rotational power, such as a servo motor, stepper motor, geared motor, or a power unit composed of a motor, reducer, and transmission components, but is not limited to these. The adjustment component 232 is a component that can move along the flow hole, such as a rod-shaped structure, plate-shaped structure, or sleeve-shaped structure, and its movement can be adjusted manually or electrically, but is not limited to these. The sensor is a pressure sensor that can detect the pressure parameters of the epoxy resin. The sensor can be installed on any one of the stirring blades 23 in the stirring blade group 23, or one sensor can be installed on each stirring blade 23 in the stirring blade group 23.

[0043] As can be seen from the above, the epoxy resin homogenizing device 100 provided in this application embodiment provides a stable stirring environment for epoxy resin in the stirring chamber 11 of the housing 10. The double-blade group (bottom and middle) design of the stirring device 20 can cover most of the chamber space, reducing stirring dead zones and improving the overall homogenization. The flow holes of the stirring blades 23 cooperate with the adjustable component 232 to adapt to the stirring requirements of epoxy resins with different viscosities, taking into account both low resistance and energy saving and high stirring efficiency homogenization. The combined monitoring method of the sensor (fixed to the bottom wall) and the sensor (rotating with the blades) can realize comprehensive and accurate acquisition of epoxy resin parameters inside the chamber (especially the bottom area where it is easy to deposit), which is convenient for real-time judgment of the homogenization status and adjustment of stirring parameters. Through the synergistic effect of the above structures, the epoxy resin homogenizing device 100 can effectively improve the homogenization quality of epoxy resin, reduce subsequent processing defects (such as uneven coating, curing cracking, etc.) caused by insufficient homogenization, and adapt to various working conditions, reduce manual intervention costs, and improve processing efficiency.

[0044] In some embodiments, please refer to the following: Figure 4 , Figure 5 as well as Figure 6 The adjustment component 232 includes a connector 2321, an adjustment component 2322, and a drive component, wherein: Connector 2321 is located within the flow hole and is rotatably connected to fixed part 231. Adjusting member 2322 is located within the flow hole and is connected to connector 2321. The output end of driving member is connected to connector 2321, and driving member is used to drive connector 2321 to rotate. Adjusting member 2322 has a first state where it is completely located within the flow hole (e.g., ...). Figure 4 As shown), and a second state with both ends located outside the flow hole (as shown). Figure 5 As shown), when the adjusting member 2322 is in the first state, there is a gap 223 between the adjusting member 2322 and the fixing part 231.

[0045] It is understandable that during the stirring of epoxy resin, the rotation direction and angle of the adjusting member 2322 can be controlled by the control device, so that the adjusting member 2322 has two states. When the adjusting member 2322 is in the first state, there is a gap 223 on the stirring blade 23. When the adjusting member 2322 is in the second state, the gap 223 on the stirring blade 23 will be widened due to the rotation of the adjusting member 2322, ultimately forming a flow channel for the epoxy resin to move between different layers. The connecting member 2321 is a component that can transmit rotational motion, such as a stepped shaft structure, a cylindrical structure with a shoulder, or a bushing structure that cooperates with a bearing, but is not limited to these. The adjusting member 2322 is a component that can change its posture by rotation, such as a straight rod structure, a flat plate structure, or a rod structure with arc transitions at both ends. Its length can be designed according to the diameter of the flow hole and the required extension length, but is not limited to these. The driving component is a device that can provide rotational driving force. For example, it can be a micro servo motor, a stepper motor, or a drive unit consisting of a motor and a reduction gear set. It can be integrated inside the fixed part 231 or extended into the stirring rod 21 through a transmission rod, but is not limited thereto.

[0046] As can be seen from the above, in the epoxy resin homogenization device 100 provided in this application embodiment, the adjustment component 232 of the stirring blade 23 achieves dynamic adjustment of the stirring area through the coordinated cooperation of the connector 2321, the adjustment component 2322 and the drive component. When the adjustment component 2322 is in the first state (completely housed in the flow hole), the gap 223 between the adjustment component 2322 and the fixed part 231 reduces motion interference and provides a channel for fluid flow, effectively reducing stirring resistance. When the adjustment component 2322 switches to the second state (both ends extend out of the flow hole), it can significantly increase the effective working area of ​​the stirring blade 23, enhance the shearing and pushing effect on the high viscosity epoxy resin, ensure sufficient homogenization, and expand the flow area of ​​the flow channel. Under the technical solution of the epoxy resin homogenization method, the epoxy resin is intentionally oriented towards a homogenized state. This adjustable design allows the stirring device 20 to flexibly adapt to the processing needs of epoxy resins with different properties (viscosity, flowability, etc.), enabling switching of stirring intensity without changing the blades, thus improving the versatility and ease of operation of the device. Simultaneously, the drive unit can precisely control the posture of the adjusting component 2322 by controlling the rotation angle of the connecting component 2321. Combined with real-time monitoring data from sensors, dynamic optimization of stirring parameters can be achieved, further improving the homogenization efficiency of the epoxy resin.

[0047] To improve the low homogenization efficiency of stirring devices in related technologies, this application also provides an epoxy resin homogenization method, applied to the epoxy resin homogenization device 100 described in any of the above embodiments. In this method, firstly, when using the epoxy resin homogenization device 100, first pressure distribution information reflecting the pressure distribution on the lower surface of the stirring blade 23 and second pressure distribution information reflecting the pressure distribution at the bottom of the stirring chamber 11 are obtained. Then, based on the first pressure distribution information, adjustment information corresponding to each adjustment component 232 is obtained, including information reflecting the adjustment direction and adjustment angle of the adjustment component 232, so that the adjustment component 232 is adjusted according to the corresponding adjustment information. Then, based on the second pressure distribution information, a homogenization result reflecting whether the epoxy resin has reached a homogenized state in the epoxy resin homogenization device 100 is obtained. Finally, based on the homogenization result, the opening and closing of the control valve is controlled. This method can effectively obtain adjustment information about the adjustment component 232 based on the pressure distribution on the lower surface of different groups of stirring blades 23 during the stirring process. The control device then controls the adjustment component 232 to rotate at different angles and in different directions based on this adjustment information, thereby forming flow channels for different layers of epoxy resin. During stirring, the epoxy resin flows through these channels, and under the centrifugal force, the flow of different layers of epoxy resin is purposefully guided, accelerating the homogenization process and reducing the time required for the epoxy resin to reach homogenization. This improves the homogenization efficiency of the epoxy resin homogenization device 100. Furthermore, by using the second pressure distribution information to constantly monitor whether the epoxy resin in the epoxy resin homogenization device 100 has reached a homogenized state, energy consumption during epoxy resin homogenization can be reduced.

[0048] To better understand the epoxy resin homogenization method provided in the embodiments of this application, the specific implementation process of the epoxy resin homogenization method provided in the embodiments of this application will be described by way of example below.

[0049] Figure 7 and Figure 8 A schematic flowchart of the epoxy resin homogenization method provided in this application embodiment is shown. Please refer to [link / reference]. Figure 7 and Figure 8 The epoxy resin homogenization method includes: S100, acquire first pressure distribution information and second pressure distribution information; wherein, the first pressure distribution information is used to reflect the pressure distribution detected by the pressure sensor installed on the lower surface of the stirring blade, and the second pressure distribution information is used to reflect the pressure distribution detected by the pressure sensor installed on the inner surface of the bottom of the stirring chamber.

[0050] It is understandable that the stirring blade 23, as the core component that directly acts on the material, has its lower surface in direct contact and collision with the epoxy resin during rotation, thus propelling the material. The pressure distribution on this surface directly reflects the intensity of the interaction between the blade and the epoxy resin. The bottom of the stirring chamber 11 is the main load-bearing area for the epoxy resin under gravity, and also an important area where the epoxy resin tumbles and collides after being stirred by the blade. The pressure distribution on this surface indirectly reflects the stacking height, distribution uniformity, and flow state of the epoxy resin within the chamber.

[0051] In one possible implementation, step S100, obtaining the first pressure distribution information and the second pressure distribution information, includes: S110: When the epoxy resin homogenization device starts stirring, the first pressure distribution information is acquired. When the system power reaches a stable state, the acquisition of the first pressure distribution information is stopped, and the acquisition of the second pressure distribution information begins.

[0052] It is understandable that the system power reaching a stable state indicates that the output power of the drive mechanism of the stirring device no longer fluctuates due to the drastic changes in the state of the epoxy resin. At this time, the interaction strength between the stirring blade 23 and the epoxy resin tends to be stable.

[0053] With this setup, the first pressure distribution information focuses on the dynamic transition stage from the start of stirring to the point where the power stabilizes, with the core monitoring of the initial interaction state between the blades and the epoxy resin, corresponding to the key steps of initial material crushing and dispersion in epoxy resin homogenization. The second pressure distribution information focuses on the steady-state stage after the power stabilizes, with the core monitoring of the stable distribution and flow state of the epoxy resin at the bottom of the chamber, corresponding to the key steps of continuous mixing and homogenization of the epoxy resin homogenized material.

[0054] S200: Based on the first pressure distribution information, obtain adjustment information corresponding to the adjustment component, and control the adjustment component to adjust according to the corresponding adjustment information; wherein, the adjustment information includes the adjustment direction and adjustment angle of the adjustment component.

[0055] It can be understood that the function of the adjusting component 232 is to create flow channels for different layers of epoxy resin by rotating the adjusting component 232, thereby purposefully driving the epoxy resin to a state with a higher degree of uniformity. The density of the epoxy resin between different layers will affect the adjusting direction and angle of the adjusting component 232.

[0056] For example, the amount of epoxy resin added to the epoxy resin mixing device during the mixing process can be used to determine the density of the epoxy resin in a homogeneous state. Then, by analyzing the first pressure distribution information and the homogenized density, the density of the epoxy resin in the three layers separated by the two mixing blades in the epoxy resin mixing device can be obtained, as well as the relationship between the densities of the epoxy resin in different layers. The adjustment information can be determined by analyzing the density of the epoxy resin in different layers and the relationship between the densities of the epoxy resin in different layers. Alternatively, the first pressure distribution information can be input into a learning model, which outputs corresponding adjustment information. The training process of the learning model can use the data obtained after processing the first pressure distribution information and the corresponding adjustment information as the training dataset, and then input the training dataset into the learning model for training, ultimately obtaining the learning model. And so on, but not limited to these examples.

[0057] In one possible implementation, in step S200, adjustment information corresponding to the adjustment component is obtained based on the first pressure distribution information, including: S210, obtain homogenized density; wherein, homogenized density is used to reflect the density of epoxy resin after it has reached uniformity.

[0058] It is understandable that the homogenization density can be calculated by the mass and volume of the epoxy resin added to the epoxy resin homogenization device 100. Alternatively, the homogenization density can be obtained by manual input.

[0059] S220, based on the first pressure distribution information and homogenized density, the interlayer density and interlayer density relationship are obtained; wherein, the interlayer density is used to reflect the density of epoxy resin in different layers, and the interlayer density relationship is used to reflect the magnitude relationship between the epoxy resin density in different layers and the homogenized density.

[0060] It can be understood that the first pressure distribution information is the pressure detected in the stirring blade assembly. That is, the first pressure distribution information includes two types of pressure: one is the pressure information of the two stirring blade assemblies at the upper stirring blade 23, and the other is the pressure information of the two stirring blade assemblies at the lower stirring blade 23.

[0061] For example, by separately analyzing the pressure information at the upper stirring blade 23 and the lower stirring blade 23 of the two stirring blade groups, the average pressure at the upper stirring blade 23 and the average pressure at the lower stirring blade 23 of the two stirring blade groups can be obtained. Then, by analyzing these two average pressures and the homogenized density, the interlayer density can be obtained, and the interlayer density relationship can be determined by comparing the interlayer densities. Alternatively, the first pressure distribution information and the homogenized density can be input into a learning model, and the learning model can output the corresponding interlayer density. The training process of the learning model can use the data obtained after processing the first pressure distribution information, the homogenized density, and the corresponding interlayer density as the training dataset for the learning model, and then input the training dataset into the learning model for training, ultimately obtaining the learning model. And so on, but not limited to these examples.

[0062] In one possible implementation, in step S220, based on the first pressure distribution information and the homogenized density, the interlayer density and the interlayer density relationship are obtained, including: S221, extract the first pressure data set from the first pressure distribution information, and analyze the first pressure data set to obtain the first pressure data; wherein, the first pressure data set is used to reflect the set of pressure information of the lower surface of each stirring blade 23 of the first stirring blade group, and the first pressure data is used to reflect the average value of the first pressure data set.

[0063] It is understandable that when a sensor is installed on any one of the stirring blades 23 in the stirring blade assembly, since the sensor on the stirring blade 23 is constantly rotating, the sensor collects the pressure magnitude on the lower surface of the stirring blade 23 multiple times during this rotation. The pressure data collected multiple times constitutes the first pressure data set. If a sensor is installed on each stirring blade 23 in the stirring blade assembly, then there are two first pressure data sets, and the first pressure data is the average of these two first pressure data sets.

[0064] S222, extract the second pressure data set from the first pressure distribution information, and analyze the second pressure data based on the second pressure data set; wherein, the second pressure data set is used to reflect the set of pressure information of the lower surface of each stirring blade 23 of the second stirring blade group, and the second pressure data is used to reflect the average value of the second pressure data set.

[0065] It is understandable that the process of obtaining the second pressure data can be obtained through a similar process to obtaining the first pressure data in step S221, and will not be described in detail here.

[0066] S223, based on the first pressure data, the second pressure data and the homogenized density, the relationship between interlayer density and interlayer density is obtained.

[0067] It is understandable that the first pressure data can reflect the pressure generated by the epoxy resin above the first set of stirring blades at the height of the first set of stirring blades when it is in a stirring state, and the second pressure data can reflect the pressure generated by the epoxy resin above the second set of stirring blades at the height of the second set of stirring blades when it is in a stirring state.

[0068] For example, the first layer density can be obtained from the first pressure data by analyzing the static and dynamic pressures. Then, the second layer density can be obtained from the difference between the first and second pressure data, again by analyzing the static and dynamic pressures. Since the average density between the first, second, and third layer densities is the homogenized density, the third layer density can be directly obtained from the first, second, and homogenized densities. Alternatively, after obtaining the first layer density by analyzing the first pressure data, the average density between the first and second epoxy resin layers can be obtained from the second pressure data using the same steps. The average density between the first and second epoxy resin layers is then processed with the first layer density to obtain the second layer density. Finally, the third layer density can be directly obtained from the first, second, and homogenized densities.

[0069] This setup allows for real-time monitoring of the dynamic changes in material density during the mixing process, providing precise data support for judging the uniformity of mixing and adjusting mixing parameters (such as rotation speed and blade angle). It effectively reduces material quality problems caused by uneven mixing, ultimately improving the stability of the mixing process and the quality of material processing.

[0070] In one possible implementation, in step S223, based on the first pressure data, the second pressure data, and the homogenized density, the interlayer density and the interlayer density relationship are obtained, including: S2231, Based on the first pressure data, the first layer density is obtained; wherein, the first layer density is used to reflect the average density of the epoxy resin above the first stirring blade group.

[0071] It is understandable that, since the epoxy resin is in a stirring state, the pressure generated by the first layer of epoxy resin at the first stirring blade group is the sum of static pressure and dynamic pressure.

[0072] For example, the average flow velocity at the height of the first stirring blade group can be obtained, and the total pressure can be obtained by processing the first pressure data and the effective pressure-bearing area of ​​the pressure sensor set in the first stirring blade group. Then, the density of the first layer can be directly obtained by using the calculation formulas for static pressure and dynamic pressure. The calculation formulas for static pressure and dynamic pressure are as follows: Where ρ is the density of the first layer, P is the total pressure, H is the vertical height between the epoxy resin liquid surface and the first stirring blade group in the epoxy resin homogenization device 100, g is the acceleration due to gravity, and V is the average flow velocity. Because the average flow velocity of the fluid is proportional to the linear velocity of the blade tip when the stirring blade 23 drives the fluid to rotate, the average flow velocity can be derived using parameters obtained in the previous process (such as blade geometric parameters, stirring speed, and system power) combined with empirical formulas or theoretical models in fluid mechanics. The process of calculating the average flow velocity can be achieved by first calculating the linear velocity of the blade tip during blade rotation, and then processing the proportionality coefficient obtained from a proportionality coefficient database or by manual input with the linear velocity of the blade tip to directly obtain the average flow velocity. The proportionality coefficient is the proportionality coefficient between the average flow velocity and the linear velocity of the blade tip.

[0073] S2232, based on the pressure difference data, the second layer density is obtained; wherein, the pressure difference data is used to reflect the difference between the first pressure data and the second pressure data, and the second layer density is used to reflect the average density of the epoxy resin between the first stirring blade group and the second stirring blade group.

[0074] It is understandable that, since the epoxy resins are all in a stirred state, the pressure generated by the first and second layers of epoxy resin at the second stirring blade group is the sum of static and dynamic pressures. Furthermore, the pressure generated by the first layer of epoxy resin at the first stirring blade group is the sum of static and dynamic pressures, meaning the pressure generated by the second layer of epoxy resin at the second stirring blade group is a pressure difference.

[0075] For example, the second layer density can be obtained through a process similar to that used in step S2231 to obtain the first layer density. Alternatively, the average density between the first and second epoxy resin layers can be obtained through a process similar to that used in step S2231 to obtain the first layer density, and then the average density between the first and second epoxy resin layers can be processed with the first layer density to obtain the second layer density. Further details will not be elaborated here.

[0076] S2233, based on the first layer density and the second layer density, the third layer density is obtained; wherein, the third layer density is used to reflect the average density of the epoxy resin located below the second stirring blade group.

[0077] It is understood that after obtaining the first layer density and the second layer density, the homogenized density of the total amount of epoxy resin added to the mixing chamber 11 is known, and the homogenized density is the average value among the first layer density, the second layer density, and the third layer density. For example, it can be directly obtained by the formula: third layer density = 3 × homogenized density - (first layer density + second layer density).

[0078] S2234, the density of the first layer, the density of the second layer and the density of the third layer are identified as the interlayer density.

[0079] It is understandable that interlayer density is not an independent density index, but a density set composed of "first layer density, second layer density, and third layer density". Its essence is a quantitative summary of the density of the three key longitudinal regions of the mixing chamber 11 divided according to "blade group position + material spatial distribution".

[0080] S2235, based on the comparison of the density of the first layer, the density of the second layer and the density of the third layer with the homogenized density, respectively, the interlayer density relationship is obtained.

[0081] It can be understood that the interlayer density relationship is the relationship between the density of different layers and the homogenized density. The interlayer density relationship includes a first relationship and a second relationship. The first relationship reflects that the interlayer density is less than the homogenized density, and the second relationship reflects that the interlayer density is greater than the homogenized density.

[0082] For example, the density relationship between different layers can be reflected by symbols. For instance, if the density of the first layer is greater than the homogenized density, the first relationship can be "+", and if the density of the first layer is less than the homogenized density, the first relationship can be "-", etc.

[0083] S230, based on the interlayer density relationship and interlayer density, obtains the adjustment information.

[0084] It is understandable that the interlayer density relationship is directly related to the adjustment direction, and the adjustment direction is directly related to the interlayer density and the adjustment angle.

[0085] For example, the adjustment direction can be determined by the interlayer density relationship between two adjacent layers. Then, the relationship between the adjustment angles of the first set of adjustment components 232 and the second set of adjustment components 232, reflecting the homogenized density of the first and second layers, can be determined by the density of different layers in the interlayer density and the adjustment direction. Furthermore, the relationship between the adjustment angles of the first set of adjustment components 232 and the second set of adjustment components 232, reflecting the homogenized density of the first and third layers, can be determined by the first and second layer densities in the interlayer density relationship and the adjustment angle. Finally, the adjustment information of the adjustment components 232 of the first stirring blade group and the second stirring blade group is determined by these two angular relationships.

[0086] This setup ensures that the accurate acquisition of homogenized density provides a "standard scale" for all subsequent density-related analyses. Whether it's calculating interlayer density or judging the relationship between interlayer densities, this benchmark serves as an anchor point, reducing density evaluation bias caused by a lack of a unified reference. This enhances the objectivity and accuracy of subsequent analysis results. By combining pressure distribution information with homogenized density, not only can the actual density (interlayer density) of different layers of epoxy resin be accurately calculated, but the relationship between the density of each layer and the homogenized density can also be clearly defined.

[0087] In one possible implementation, in step S230, adjustment information is obtained based on the interlayer density relationship and interlayer density, including: S231, based on the analysis of the interlayer density relationship, the adjustment direction of the adjustment information is obtained; wherein, the adjustment direction includes the first rotation direction of the first group of adjustment components and the second rotation direction of the second group of adjustment components.

[0088] It is understandable that the adjustment logic for the direction of adjustment is determined based on the interlayer density relationship. Since the ultimate goal of the stirring device is to homogenize the epoxy resin, the adjustment direction needs to be adjusted with the aim of homogenizing the density, moving from a direction greater than the homogenized density to a direction less than the homogenized density.

[0089] For example, if the density of the first layer is less than the homogenization density and the density of the second layer is greater than the homogenization density, then the first rotation direction of the first set of adjustment components 232 needs to be counterclockwise. Conversely, if the density of the first layer is greater than the homogenization density and the density of the second layer is less than the homogenization density, then the first rotation direction of the first set of adjustment components 232 needs to be clockwise. In addition, if the density of the first layer is greater than the homogenization density, the density of the second layer is greater than the homogenization density and the density of the third layer is less than the homogenization density, then the first rotation direction of the first set of adjustment components 232 and the second rotation direction of the second set of adjustment components 232 both need to be clockwise, and so on.

[0090] S232, based on interlayer density and adjustment direction, obtains the adjustment angle of the adjustment information.

[0091] It is understandable that, since the final density of the epoxy resin in the mixing chamber 11 is the homogenized density, the characteristic changes of the epoxy resin in the mixing chamber 11 during the process of changing from the initial state to the final state can be directly established between the initial state and the final state.

[0092] For example, the change relationship can be directly established by analyzing the process changes: initial state - final state = mass change. Here, due to the underlying analytical logic that the volume of epoxy resin in different layers remains constant, the density change between different layers is actually the mass change between them. Alternatively, the formula can be: initial state + adjustment direction × change status = final state. Here, the initial state represents the state where the epoxy resin has not yet reached homogenization, and the final state represents the state where the epoxy resin has reached homogenization. Then, through isomass analysis, the adjustment angle can be finally obtained. Isomass analysis means that the mass of the epoxy resin remains constant throughout the entire stirring process.

[0093] With this setup, the adjustment direction is adjusted to ensure the adjustment action does not deviate, and the adjustment angle is adjusted to ensure the adjustment force is appropriate. The final output adjustment direction and adjustment angle can be directly used to control the action of the first and second adjustment components 232, thereby achieving targeted correction of the density deviation between epoxy resin layers.

[0094] In one possible implementation, in step S232, the adjustment angle of the adjustment information is obtained based on the interlayer density and the adjustment direction, including: S2321, based on the first layer density, second layer density and third layer density in the interlayer density and the first rotation direction and second rotation direction in the adjustment direction, a first angular relationship is obtained; wherein, the first angular relationship is used to reflect the relationship between the adjustment angle of the first set of adjustment components and the adjustment angle of the second set of adjustment components when the first layer density and the second layer density reach the homogenized density.

[0095] It is understandable that the first angular relationship can be obtained by analyzing the movement of epoxy resin within the entire mixing chamber 11 under the drive of the adjustment direction.

[0096] For example, the first density + first rotation direction × first change density = second density + first rotation direction × second change density + second rotation direction × third change density, where the first change density is the density change of the first layer of epoxy resin, the second change density is the density change of the second layer of epoxy resin, and the first change density is related to the first rotation direction. When the first set of adjusting components 232 rotates clockwise, and the second set of adjusting components 232 rotates clockwise, the first rotation direction is "-1", the second rotation direction is "-1", and the first change density is the first density × the first flow rate, where the first flow rate is related to the first angle, and the first angle is the first... The adjustment angle of the group adjustment component 232 is such that the second change density is the same as the first change density, and the third change density is the third density × the second flow rate. The second flow rate is related to the second angle, which is the adjustment angle of the second group adjustment component 232. In short, when the first rotation direction and the second rotation direction reflect that the first layer of epoxy resin needs to move to the second layer of epoxy resin and the second layer of epoxy resin needs to move to the third layer of epoxy resin, the density of the first layer of epoxy resin after losing the first flow rate becomes the homogenized density, the density of the third layer of epoxy resin after obtaining the second flow rate becomes the homogenized density, and the density of the second layer of epoxy resin after obtaining the first flow rate and losing the second flow rate becomes the homogenized density.

[0097] S2321, based on the first and second layer densities in the interlayer density and the first and second rotation directions in the adjustment direction, a second angular relationship is obtained; wherein, the second angular relationship is used to reflect the relationship between the adjustment angle of the first set of adjustment components and the adjustment angle of the second set of adjustment components when the first layer density and the third layer density reach the homogenized density.

[0098] For example, the step of obtaining the second angular relationship can be obtained by the step of obtaining the first angular relationship in step S2320, and will not be described again here.

[0099] S2321, based on the first angle relationship and the second angle relationship, the adjustment angle is obtained.

[0100] For example, if both the first and second rotation directions are clockwise, then the first angular relationship is: first layer density - second layer density + second layer density × second flow rate = 2 × first layer density × first flow rate; the second angular relationship is: first layer density - first layer density × first flow rate = third layer density + second layer density × second flow rate. The flow rate is related to the adjustment angle and the size of the flow channel, i.e., flow rate = 0.5 × flow velocity × adjustment component length × sinθ.

[0101] This setup breaks the limitations of traditional adjustment methods that prioritize a single level while neglecting other levels. By deriving and coupling the angle relationship twice, it finds the only adjustment angle for the first and second adjustment components 232 that can simultaneously meet the density requirements of the three epoxy resin layers.

[0102] S300, based on the second pressure distribution information, obtains the homogenization result, and controls the opening and closing of the valve based on the homogenization result; wherein, the homogenization result is used to reflect whether the epoxy resin has reached a homogenized state in the epoxy resin homogenization device.

[0103] For example, by performing time-frequency domain analysis on the second pressure distribution information, the signal of the second pressure distribution information in the frequency domain can be obtained. Then, by extracting the characteristic peaks in the frequency domain signal corresponding to the stirring cycle, and finally by analyzing the characteristic peaks, the homogenization result can be obtained.

[0104] With this configuration, the homogenization state of the epoxy resin in the axial direction of the epoxy resin homogenization device 100 is determined by the second pressure distribution information, so that the epoxy resin homogenization device 100 stops stirring the epoxy resin after the epoxy resin reaches a homogenized state, thereby reducing the energy consumption during the homogenization of epoxy resin.

[0105] In one possible implementation, in step S300, based on the second pressure distribution information, a homogenization result is obtained, including: S310, based on the second pressure distribution information, analyzes and obtains multiple pressure frequency signals.

[0106] It is understandable that the second pressure distribution information is the pressure data of the inner surface of the bottom of the stirring chamber 11 collected after the system power stabilizes. It is generated in real time by multiple pressure sensors deployed at different positions at the bottom of the chamber (such as the center, edge, front, and rear). In essence, it is a multi-channel continuous time-domain pressure signal—each sensor corresponds to a pressure curve that changes with time.

[0107] For example, the pressure distribution data on the bottom inner surface of the mixing chamber 11 is converted from time to frequency, and frequency features that reflect the material movement law and equipment operating characteristics are extracted from the pressure dynamic data that changes over time.

[0108] S320, based on the stirring cycle, extracts the characteristic peak set corresponding to the stirring cycle from multiple pressure frequency signals; wherein, the stirring cycle is used to reflect the time required for the epoxy resin to complete one complete rotation after the acquisition of the second pressure distribution information begins, and the characteristic peak set is used to reflect the set of peaks associated with the stirring cycle in each pressure frequency signal.

[0109] It is understandable that the stirring cycle is the time required for the epoxy resin to complete one full circulation motion in the stirring chamber 11 after the system power stabilizes, following the rotation of the blades. This needs to be determined through actual monitoring or parameter calculation.

[0110] For example, the stirring cycle can be manually input or obtained directly from the actual output power of the system. Based on the physical relationship between frequency and cycle (frequency = 1 / cycle), the determined stirring cycle is converted into a characteristic frequency (for example, if the stirring cycle is 2 seconds, the characteristic frequency is 0.5 Hz (1 ÷ 2 seconds); if the cycle is 2.1 seconds, the characteristic frequency is approximately 0.476 Hz). This characteristic frequency represents the reference frequency at which the epoxy resin generates pressure fluctuations at the bottom of the cavity when it completes one full rotation. Then, by traversing multiple pressure frequency signals through the stirring cycle, matching peaks are selected, and their "frequency-amplitude" spectrum is matched one by one. Frequency peaks whose frequency values ​​are consistent with the above characteristic frequency or whose deviations are within a preset range are selected. Finally, these are integrated to form a characteristic peak set.

[0111] S330, based on the analysis of multiple characteristic peak sets, yields the homogenized results.

[0112] It is understandable that by analyzing the frequency and amplitude characteristics corresponding to multiple characteristic peaks, if the frequency characteristics corresponding to each characteristic peak are the same and the amplitude characteristic variation is less than a preset threshold, it can be concluded that the epoxy resin in the epoxy resin homogenization device 100 has reached a homogenization state. Alternatively, by analyzing the coefficients of variation corresponding to multiple characteristic peaks, if the coefficients of variation for all characteristic peaks are less than a preset threshold, it can be concluded that the epoxy resin in the epoxy resin homogenization device 100 has reached a homogenization state. The coefficient of variation is the ratio between the amplitude value and the frequency value of multiple characteristic peaks. The preset threshold can be obtained through manual input.

[0113] In one possible implementation, in step 330, analysis is performed based on multiple characteristic peak sets to obtain a homogenized result, including: S331, based on the analysis of multiple characteristic peak sets, multiple frequency values ​​and multiple amplitude changes corresponding to the characteristic peak sets are obtained; among them, the frequency values ​​are used to reflect the frequency value of each characteristic peak in the characteristic peak set, and the amplitude changes are used to reflect the intensity value of each characteristic peak in the characteristic peak set.

[0114] It is understandable that the peak average of the characteristic peaks is related to the stirring cycle, and its amplitude value directly reflects the change in the impact intensity of the material on the bottom of the chamber at that frequency.

[0115] For example, the abscissa value corresponding to the vertex of each characteristic peak in the characteristic peak set can be obtained by extracting the two values ​​as multiple frequency values ​​corresponding to the characteristic peak set. For example, if there are two peaks in the spectrum of a certain edge characteristic peak set, and the abscissas of the vertices are 0.49Hz and 0.51Hz respectively, then these two values ​​can be directly extracted. The peak number corresponding to each frequency value can be recorded (for example, peak 1: 0.49Hz, peak 2: 0.51Hz). This ensures that the frequency values ​​correspond one-to-one with the specific characteristic peaks. Then, the ordinate value (i.e., amplitude value, representing the intensity of pressure fluctuation) corresponding to the vertex of each characteristic peak can be read synchronously. These amplitude values ​​are defined as "amplitude changes" (for example, in the above edge characteristic peak set, the amplitude value of peak 1 (0.49Hz) is 0.32MPa, and the amplitude value of peak 2 (0.51Hz) is 0.28MPa, then the amplitude changes corresponding to the characteristic peak set are {0.32MPa, 0.28MPa}).

[0116] S332, when multiple frequency values ​​corresponding to each characteristic peak set are the same and multiple amplitude changes are all less than the preset threshold, the homogenization result is confirmed as the epoxy resin has reached the homogenization state.

[0117] For example, each frequency value within a characteristic peak set is checked individually (e.g., the frequency values ​​of the characteristic peak set at the bottom edge of the cavity are {0.49Hz, 0.49Hz}, the central characteristic peak set is {0.49Hz, 0.49Hz}, and the front characteristic peak set is {0.49Hz, 0.49Hz}). It must be ensured that all frequency values ​​within the same characteristic peak set are completely consistent (or the deviation is within a very small range, such as ±0.005Hz, which can be considered the same), and that the frequency values ​​of different characteristic peak sets also remain uniform. This indicates that the material in all areas of the cavity bottom moves at a uniform frequency that matches the stirring cycle, with no localized frequency shifts caused by material agglomeration or flow obstruction, and the overall material movement synchronization meets the standard.

[0118] Next, check the amplitude changes corresponding to each characteristic peak set one by one (for example, if the preset threshold is 0.05 MPa, and the amplitude changes of the edge characteristic peak sets are {0.32 MPa, 0.30 MPa} (difference 0.02 MPa < 0.05 MPa), the center characteristic peak set is {0.25 MPa, 0.24 MPa} (difference 0.01 MPa < 0.05 MPa), and the front characteristic peak set is {0.29 MPa, 0.27 MPa} (difference 0.02 MPa < 0.05 MPa)). It is necessary to ensure that the amplitude changes within each characteristic peak set (the differences in amplitude values ​​within the same peak set) are all less than the preset threshold. This indicates that the impact intensity fluctuations of the material on the cavity bottom in each region are minimal, and the material density distribution is uniform (without high amplitudes caused by local density or low amplitudes caused by local sparseness), meeting the homogenization standard.

[0119] With this configuration, by controlling the adjustment angle and direction of the adjustment component 232 during the stirring process, flow channels for different layers of epoxy resin are formed on the stirring blade 23. During the stirring process, the different layers of epoxy resin flow through these flow channels, and under the action of centrifugal force, the flow of different layers of epoxy resin is purposefully guided, accelerating the homogenization process and reducing the time for the epoxy resin to reach homogenization, thereby improving the homogenization efficiency of the epoxy resin homogenization device 100.

[0120] It should be understood that the sequence number of each step in the above embodiments does not imply the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

[0121] Corresponding to the epoxy resin homogenization method described in the above embodiments, this application also provides an epoxy resin homogenization system, wherein each module of the epoxy resin homogenization system can implement each step of the epoxy resin homogenization method. Figure 9 A structural block diagram of the epoxy resin homogenization system provided in the embodiments of this application is shown. For ease of explanation, only the parts related to the embodiments of this application are shown.

[0122] Reference Figure 9 The epoxy resin homogenization system includes: The acquisition unit is used to acquire first pressure distribution information and second pressure distribution information; wherein, the first pressure distribution information is used to reflect the pressure distribution detected by the pressure sensor installed on the lower surface of the stirring blade, and the second pressure distribution information is used to reflect the pressure distribution detected by the pressure sensor installed on the inner surface of the bottom of the stirring chamber.

[0123] The first analysis and control unit is used to obtain adjustment information corresponding to the adjustment component based on the first pressure distribution information, and to control the adjustment component to adjust according to the corresponding adjustment information; wherein, the adjustment information includes the adjustment direction and adjustment angle of the adjustment component.

[0124] The second analysis and control unit is used to obtain the homogenization result based on the second pressure distribution information, and to control the opening and closing of the valve based on the homogenization result; wherein, the homogenization result is used to reflect whether the epoxy resin has reached a homogenized state in the epoxy resin homogenization device.

[0125] It should be noted that the information interaction and execution process between the above systems / units are based on the same concept as the method embodiments of this application. For details on their specific functions and technical effects, please refer to the method embodiments section, and they will not be repeated here.

[0126] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the above-described division of functional units and modules is merely an example. In practical applications, the above functions can be assigned to different functional units and modules as needed, that is, the internal structure of the system can be divided into different functional units or modules to complete all or part of the functions described above. The functional units and modules in the embodiments can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit. Furthermore, the specific names of the functional units and modules are only for easy differentiation and are not intended to limit the scope of protection of this application. The specific working process of the units and modules in the above system can be referred to the corresponding process in the foregoing method embodiments, and will not be repeated here.

[0127] The epoxy resin homogenization apparatus 100 also includes a control device 8. The control device 8 is used to monitor and control the stirring process of the epoxy resin and the rotation of the adjusting components of the stirring apparatus.

[0128] For example, the control device can be a microcontroller, mobile phone, tablet computer, laptop computer, ultra-mobile personal computer (UMPC), netbook, smart screen, smart TV, handheld device with wireless communication function, desktop computer, handheld device with wireless communication function, computer, laptop computer, handheld computing device, etc. Figure 10 This is a schematic diagram of the structure of a control device 8 provided in an embodiment of this application. Figure 10 As shown, the control device 8 of this embodiment includes: at least one processor 80 ( Figure 10 Only one is shown in the image), at least one memory 81 ( Figure 10 (Only one is shown in the image) and a computer program 82 stored in the at least one memory 81 and executable on the at least one processor 80, wherein when the processor 80 executes the computer program 82, it causes the control device 8 to perform the steps in any of the above-described epoxy resin homogenization method embodiments, or causes the control device 8 to perform the functions of each module / unit in the above-described system embodiments.

[0129] For example, the computer program 82 may be divided into one or more modules / units, which are stored in the memory 81 and executed by the processor 80 to complete this application. The one or more modules / units may be a series of computer program instruction segments capable of performing a specific function, which describe the execution process of the computer program 82 in the control device 8.

[0130] The control device 8 can be a desktop computer, laptop, handheld computer, or cloud server, etc. The control device 8 may include, but is not limited to, a processor 80 and a memory 81. Those skilled in the art will understand that... Figure 10 This is merely an example of the control device 8 and does not constitute a limitation on the control device 8. It may include more or fewer components than shown, or combine certain components, or different components, such as input / output devices, network access devices, buses, etc.

[0131] The processor 80 can be a Central Processing Unit (CPU), or it can be other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The general-purpose processor can be a microprocessor or any conventional processor.

[0132] In some embodiments, the memory 81 may be an internal storage unit of the control device 8, such as a hard disk or memory of the control device 8. In other embodiments, the memory 81 may be an external storage device of the control device 8, such as a plug-in hard disk, smart media card (SMC), secure digital (SD) card, flash card, etc., equipped on the control device 8. Furthermore, the memory 81 may include both internal storage units and external storage devices of the control device 8. The memory 81 is used to store operating systems, applications, bootloaders, data, and other programs, such as the program code of computer programs. The memory 81 can also be used to temporarily store data that has been output or will be output.

[0133] This application also provides a computer-readable storage medium storing a computer program that, when executed by a processor, implements the steps in any of the above method embodiments.

[0134] This application provides a computer program product that, when run on an epoxy resin homogenization device, causes the epoxy resin homogenization device to perform the steps described in any of the above method embodiments.

[0135] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, all or part of the processes in the methods of the above embodiments of this application can be implemented by a computer program instructing related hardware. The computer program can be stored in a computer-readable storage medium, and when executed by a processor, it can implement the steps of the various method embodiments described above. The computer program includes computer program code, which can be in the form of source code, object code, executable files, or certain intermediate forms. The computer-readable medium can include at least: any entity or device capable of carrying the computer program code to the epoxy resin homogenization equipment, a recording medium, a computer memory, a read-only memory (ROM), a random access memory (RAM), an electrical carrier signal, a telecommunication signal, and a software distribution medium, such as a USB flash drive, a portable hard drive, a magnetic disk, or an optical disk.

[0136] In the above embodiments, the descriptions of each embodiment have different focuses. For parts that are not described in detail or recorded in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0137] Those skilled in the art will recognize that the units and algorithm steps of the various examples described in conjunction with the embodiments disclosed herein can be implemented in electronic hardware, or a combination of computer software and electronic hardware. Whether these functions are implemented in hardware or software depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered beyond the scope of this application.

[0138] In the embodiments provided in this application, it should be understood that the disclosed epoxy resin homogenization system can be implemented in other ways. For example, the epoxy resin homogenization system embodiments described above are merely illustrative. For instance, the division of modules or units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the mutual coupling or direct coupling or communication connection shown or discussed may be indirect coupling or communication connection through some interfaces, devices, or units, and may be electrical, mechanical, or other forms.

[0139] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0140] The above-described embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application, and should all be included within the protection scope of this application.

Claims

1. An epoxy resin homogenization device, characterized in that, include: The shell has a stirring chamber; A stirring device, rotatably connected to the housing and located in the stirring chamber; as well as At least two sensors are respectively installed on the bottom wall of the housing and on the stirring device; The stirring device includes: A stirring rod, which is rotatably connected to the housing and located in the stirring chamber; Two sets of stirring blades are connected to the stirring rod, one set of stirring blades being located at one end of the stirring rod near the bottom of the housing, and the other set of stirring blades being located in the middle of the stirring rod, each set of stirring blades comprising at least two stirring blades; and A drive mechanism is located outside the housing and is connected to the stirring rod; The stirring blades include: A fixing part, connected to the stirring rod, has a flow hole at the end of the fixing part away from the stirring rod, the flow hole passing through the fixing part along the axial direction of the stirring rod; the sensor is disposed on the side of the fixing part near the bottom of the housing; and An adjustment component is located within the flow hole and is movably connected to the fixing part; The adjustment component has a first state in which it is completely located inside the flow hole, and a second state in which both ends are located outside the flow hole.

2. The epoxy resin homogenization device as described in claim 1, characterized in that, The adjustment component includes: A connector, located within the flow hole, is rotatably connected to the fixing part; An adjusting element, located within the flow hole, is connected to the connecting element; and A driving component, the output end of which is connected to the connecting component, the driving component being used to drive the connecting component to rotate; The adjusting member has a first state in which it is completely located inside the flow hole, and a second state in which both ends are located outside the flow hole. When the adjusting member is in the first state, there is a gap between the adjusting member and the fixing part.

3. An epoxy resin homogenization method, applied to the epoxy resin homogenization apparatus according to any one of claims 1 to 2, characterized in that, The method includes: Acquire first pressure distribution information and second pressure distribution information; wherein, the first pressure distribution information is used to reflect the pressure distribution detected by the pressure sensor installed on the lower surface of the stirring blade, and the second pressure distribution information is used to reflect the pressure distribution detected by the pressure sensor installed on the inner surface of the bottom of the stirring chamber; Based on the first pressure distribution information, adjustment information corresponding to the adjustment component is obtained, and the adjustment component is controlled to adjust according to the corresponding adjustment information; wherein, the adjustment information includes the adjustment direction of the adjustment component and the adjustment angle of the adjustment component; Based on the second pressure distribution information, a homogenization result is obtained, and based on the homogenization result, the valve is controlled to open and close; wherein, the homogenization result is used to reflect whether the epoxy resin has reached a homogenized state in the epoxy resin homogenization device.

4. The epoxy resin homogenization device and homogenization method as described in claim 3, characterized in that, The acquisition of the first pressure distribution information and the second pressure distribution information includes: When the epoxy resin homogenization device starts stirring, the first pressure distribution information is acquired. When the system power reaches a stable state, the acquisition of the first pressure distribution information is stopped, and the acquisition of the second pressure distribution information begins. And / or, obtaining adjustment information corresponding to the adjustment component based on the first pressure distribution information includes: Obtain homogenized density; wherein, the homogenized density is used to reflect the density of the epoxy resin after it has reached uniformity; Based on the first pressure distribution information and the homogenized density, the interlayer density and the interlayer density relationship are obtained; wherein, the interlayer density is used to reflect the density of epoxy resin in different layers, and the interlayer density relationship is used to reflect the magnitude relationship between the epoxy resin density in different layers and the homogenized density. Based on the interlayer density relationship and the interlayer density, adjustment information is obtained.

5. The epoxy resin homogenization device and homogenization method as described in claim 4, characterized in that, The step of obtaining the interlayer density and the interlayer density relationship based on the first pressure distribution information and the homogenized density includes: A first pressure data set is extracted from the first pressure distribution information, and first pressure data is obtained based on the analysis of the first pressure data set; wherein, the first pressure data set is used to reflect the set of pressure information of the lower surface of each stirring blade of the first stirring blade group, and the first pressure data is used to reflect the average value of the first pressure data set; A second pressure data set is extracted from the first pressure distribution information, and second pressure data is obtained based on the analysis of the second pressure data set; wherein, the second pressure data set is used to reflect the set of pressure information of the lower surface of each stirring blade of the second stirring blade set, and the second pressure data is used to reflect the average value of the second pressure data set; Based on the first pressure data, the second pressure data, and the homogenized density, the interlayer density and the relationship between interlayer densities are obtained.

6. The epoxy resin homogenization device and homogenization method as described in claim 5, characterized in that, The step of obtaining the interlayer density and its relationship based on the first pressure data, the second pressure data, and the homogenized density includes: Based on the first pressure data, a first layer density is obtained; wherein, the first layer density is used to reflect the average density of the epoxy resin above the first stirring blade group; The second layer density is obtained based on the pressure difference data; wherein the pressure difference data is used to reflect the difference between the first pressure data and the second pressure data, and the second layer density is used to reflect the average density of the epoxy resin between the first stirring blade group and the second stirring blade group. Based on the first layer density and the second layer density, a third layer density is obtained; wherein, the third layer density is used to reflect the average density of the epoxy resin located below the second stirring blade group; The density of the first layer, the density of the second layer, and the density of the third layer are identified as the interlayer density; The interlayer density relationship is obtained by comparing the density of the first layer, the density of the second layer, and the density of the third layer with the homogenized density.

7. The epoxy resin homogenization apparatus and homogenization method as described in claim 6, characterized in that, The process of obtaining adjustment information based on the interlayer density relationship and the interlayer density includes: Based on the analysis of the interlayer density relationship, the adjustment direction of the adjustment information is obtained; wherein, the adjustment direction includes the first rotation direction of the first set of adjustment components and the second rotation direction of the second set of adjustment components; The adjustment angle is obtained based on the interlayer density and the adjustment direction, which provides the adjustment information.

8. The epoxy resin homogenization apparatus and homogenization method as described in claim 7, characterized in that, The adjustment angle, which is used to obtain adjustment information based on the interlayer density and the adjustment direction, includes: Based on the first layer density, the second layer density, and the third layer density in the interlayer density and the first rotation direction and the second rotation direction in the adjustment direction, a first angular relationship is obtained; wherein, the first angular relationship is used to reflect the relationship between the adjustment angle of the first group of adjustment components and the adjustment angle of the second group of adjustment components when the first layer density and the second layer density reach the homogenized density; A second angular relationship is obtained based on the first and second layer densities in the interlayer density and the first and second rotation directions in the adjustment direction; wherein, the second angular relationship is used to reflect the relationship between the adjustment angles of the first group of adjustment components and the adjustment angles of the second group of adjustment components when the first layer density and the third layer density reach the homogenized density; The adjustment angle is obtained based on the first angular relationship and the second angular relationship.

9. The epoxy resin homogenization apparatus and homogenization method as described in claim 3, characterized in that, The process of obtaining the homogenization result based on the second pressure distribution information includes: Based on the second pressure distribution information, multiple pressure frequency signals are obtained through analysis. Based on the stirring cycle, a set of characteristic peaks corresponding to the stirring cycle is extracted from multiple pressure frequency signals; wherein, the stirring cycle is used to reflect the time required for the epoxy resin to complete one full rotation after the acquisition of the second pressure distribution information begins, and the set of characteristic peaks is used to reflect a set of peaks associated with the stirring cycle in each pressure frequency signal; Analysis is performed based on multiple characteristic peak sets to obtain homogenized results.

10. The epoxy resin homogenization apparatus and homogenization method as described in claim 9, characterized in that, The analysis based on multiple characteristic peak sets yields a homogenized result, including: Based on the analysis of multiple characteristic peak sets, multiple frequency values ​​and multiple amplitude changes corresponding to the characteristic peak sets are obtained; wherein, the frequency values ​​are used to reflect the frequency value of each characteristic peak in the characteristic peak set, and the amplitude changes are used to reflect the intensity value of each characteristic peak in the characteristic peak set; When the multiple frequency values ​​corresponding to each of the characteristic peak sets are the same and the multiple amplitude changes are all less than a preset threshold, the homogenization result is confirmed as the epoxy resin reaching the homogenization state.

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