Small imaging module and thermal imaging equipment

Abstract

The invention discloses a small-sized imaging module and thermal imaging equipment, and relates to the technical field of imaging equipment, the small-sized imaging module comprises a mainboard, a detector and a light incoming component, the back surface of the detector is assembled on the front surface of the mainboard, and the detector is electrically connected with the mainboard to realize electric signal transmission; the back face of the light inlet component is fixedly assembled on the front face of the detector, the light is obtained by the detector through the light inlet component, the light inlet component does not make contact with the mainboard, the light inlet component does not need to be arranged on the periphery of the detector in a covering mode, the occupied area size is reduced, and therefore the boundary dimension of the whole infrared imaging module is further reduced. The small-sized imaging module is mounted in the thermal imaging equipment, so that a larger mounting space is reserved for other elements, and miniaturization design of the thermal imaging equipment is facilitated.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of imaging equipment, and further relates to a small imaging module and a thermal imaging device. BACKGROUND

[0002] An infrared imaging module is a core component for converting invisible infrared radiation emitted by a measured object into a visible temperature distribution image.

[0003] The infrared imaging module comprises a main board, a sensor and a lens module, the sensor is mounted on the main board, the lens module is mounted on the main board, and the lens module needs to completely seal the sensor to ensure that the sensor is in a sealed space.

[0004] Since the sensor is covered in the lens module, the size of the current infrared imaging module is limited by the size of the lens module, and it is difficult to further reduce the size.

[0005] For those skilled in the art, how to further reduce the size of the entire infrared imaging module is a technical problem to be solved at present. SUMMARY

[0006] The core of the present application is to provide a small imaging module, which installs a light inlet member on the front surface of a detector, the light inlet member no longer surrounds the four sides of the detector, thereby reducing the area size occupied by the light inlet member, and further reducing the size of the entire infrared imaging module, and the specific scheme is as follows:

[0007] A small imaging module comprises a main board, a detector and a light inlet member.

[0008] The back surface of the detector is assembled on the front surface of the main board, and the detector and the main board are electrically connected.

[0009] The back surface of the light inlet member is fixedly assembled on the front surface of the detector, and light passes through the light inlet member and is acquired by the detector.

[0010] Optionally, a sealing ring is arranged between the detector and the light inlet member.

[0011] Optionally, the back surface of the detector and the front surface of the main board are respectively provided with contacts for signal transmission for electrical connection.

[0012] Optionally, the projection of the main board along the light inlet direction falls within the projection range of the detector along the light inlet direction.

[0013] Optionally, the back surface of the detector and the front surface of the main board are connected by any one of the following modes: soldering through a solder pad, pin insertion and soldering, and connector insertion.

[0014] Optionally, the front surface of the detector leads out several wires;

[0015] The main board projects along the light-in direction larger than the detector, the wires are connected to the front surface of the main board, and the connecting points of the wires are located outside the projection range of the detector along the light-in direction.

[0016] Optionally, one side edge of the main board for connecting the wires protrudes from the detector, and the other side edges of the main board are flush with the detector.

[0017] Optionally, the projection edge of the light-in component along the light-in direction coincides with the edge of the main board.

[0018] Optionally, a sealing gel is arranged outside the wires, and the sealing gel fills the gap between the main board and the light-in component.

[0019] Optionally, the main board and the detector are fixed by welding or gluing.

[0020] Optionally, the main board, the detector, and the light-in component are press-fitted by a sheet metal component along the light-in direction.

[0021] Optionally, the detector is an infrared detector.

[0022] The application further provides a thermal imaging device comprising the small-sized imaging module.

[0023] The application provides a small-sized imaging module comprising a main board, a detector, and a light-in component. The back surface of the detector is assembled to the front surface of the main board, and the detector and the main board are electrically connected to realize electrical signal transmission. The back surface of the light-in component is fixedly assembled to the front surface of the detector, light is acquired by the detector through the light-in component, and the light-in component, the detector, and the main board are sequentially and layerwisely arranged. The light-in component does not need to be covered outside the detector, so that an additional thickness is not needed outside the detector, the occupied area size is reduced, and the overall appearance size of the infrared imaging module is further reduced. BRIEF DESCRIPTION OF DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or the prior art description. Obviously, the drawings in the following description only show some embodiments of the application, and for those skilled in the art, other drawings can also be obtained without creative labor based on these drawings.

[0025] Figure 1 The exploded view of the first embodiment of the small-sized imaging module of the application;

[0026] Figure 2 The schematic diagram of the main plate and the detector of the first embodiment of the small-sized imaging module of the present application;

[0027] Figure 3 The axonometric view of the first embodiment of the small-sized imaging module of the present application;

[0028] Figure 4 The exploded view of the second embodiment of the small-sized imaging module of the present application;

[0029] Figure 5 The axonometric view of the second embodiment of the small-sized imaging module of the present application;

[0030] Figure 6 The schematic diagram of the third embodiment of the small-sized imaging module of the present application;

[0031] Figure 7 The schematic diagram of the fourth embodiment of the small-sized imaging module of the present application.

[0032] The drawings include:

[0033] The main plate 10, the detector 20, the wire 201, the light inlet member 30, the sealing ring 40, the sealing glue 50, the sheet metal member 60. DETAILED DESCRIPTION

[0034] In order to make the skilled in the art better understand the technical solutions of the present application, the small-sized imaging module and the thermal imaging device of the present application will be introduced and explained in detail below in combination with the drawings and specific embodiments.

[0035] In combination with Figure 1 , Figure 3 , the present application provides a small-sized imaging module, which comprises a main plate 10, a detector 20, a light inlet member 30 and the like structures. The front side referred to herein is the side facing the light inlet, and the back side is the side facing away from the light inlet.

[0036] The main plate 10 is the basic structure of the whole small-sized imaging module, and is provided with circuits and related components on the main plate 10 for performing electrical signal processing. The detector 20 is used for receiving light and converting optical signals into electrical signals. For the infrared imaging module, the detector 20 is an infrared detector. The light inlet member 30 comprises a lens or a lens + shutter structure, and is located on the light path of the detector 20. Light is irradiated to the detector 20 through the light inlet member 30, and the light is acquired by the detector 20.

[0037] In combination with Figure 2 , Figure 3As shown, the back of the detector 20 is assembled to the front of the main board 10, and the detector 20 is electrically connected to the main board 10. The detector 20 converts optical signals into electrical signals, and the main board 10 receives the electrical signals and processes them by related components.

[0038] The back of the light inlet member 30 is fixedly assembled to the front of the detector 20, and the light inlet member 30 can be welded or bonded to the detector 20. The light inlet member 30 is not in direct contact with the main board 10, and the main board 10, the detector 20, and the light inlet member 30 are sequentially stacked along the light inlet direction.

[0039] For an infrared imaging module, the area of the detector 20 is difficult to further reduce, and the areas of the light inlet member 30 and the main board 10 can match the design of the detector 20. In a conventional structure, the light inlet member 30 is directly mounted to the main board 10, and the light inlet member 30 is covered around the detector 20. Therefore, the light inlet member 30 must be larger than the detector 20 by one circle, and the main board 10 must also be larger than the detector 20 by one circle due to the mounting relationship, which makes it difficult to further reduce the size of the entire imaging module.

[0040] In the structure design of the present application, the light inlet member 30 is no longer directly mounted to the main board 10, and the housing structure of the light inlet member 30 no longer needs to surround the detector 20. Therefore, the size of the light inlet member 30 can be reduced. The light inlet member 30 is directly fixed to the front of the detector 20, and the detector 20 is fixedly assembled to the front of the main board 10. The light inlet member 30 is not directly connected to the main board 10, so the light inlet member 30 does not need to be larger than the detector 20 around. The projection area of the light inlet member 30 along the light inlet direction can be equal to or slightly smaller than the detector 20, or one side of the projection of the light inlet member 30 along the light inlet direction is located outside the range of the detector 20. Compared with the conventional packaging structure, the present application further reduces the size of the entire infrared imaging module.

[0041] It should be noted that the projections of the main board 10, the detector 20, and the light inlet member 30 along the light inlet direction in the drawings of the present application are all rectangular edges. The structure design of the present application can also be used for structures with other shapes.

[0042] On the basis of the above scheme, a sealing ring 40 can be arranged between the detector 20 and the light inlet member 30. The sealing ring 40 is an annular sealing structure. The area outside the light sensing area of the detector 20 is a frame. The sealing ring 40 contacts the frame of the detector 20. The sealing ring 40 seals the contact position of the light inlet member 30 and the detector 20, thereby preventing dust. The sealing ring 40 can be an annular structure of an elastic body such as silica gel or rubber. The sealing ring 40 can also be in the form of glue, double-sided adhesive tape, or the like. The sealing ring 40 can also be sealed by welding or the like. Any form that can achieve sealing is acceptable.

[0043] The detector 20 and the main board 10 are electrically connected to each other and transmit electrical signals. In a specific embodiment, the back surface of the detector 20 and the front surface of the main board 10 are respectively provided with contacts for signal transmission, and the contacts on the back surface of the detector 20 and the contacts on the front surface of the main board 10 are in contact with each other to transmit electrical signals. The specific form of the contacts is not limited.

[0044] In the structure in which the back surface of the detector 20 and the front surface of the main board 10 are respectively provided with contacts for signal transmission, the projection of the main board 10 along the light inlet direction falls within the projection range of the detector 20 along the light inlet direction. The projection area of the main board 10 is equal to the area of the detector 20, or the projection area of the main board 10 is smaller than the area of the detector 20.

[0045] The size of the light inlet member 30 can be set according to different use requirements. The projection area of the light inlet member 30 along the light inlet direction can be smaller than, equal to, or larger than the projection area of the detector 20 along the light inlet direction. This includes the following cases: the projection of the light inlet member 30 along the light inlet direction falls within the range of the detector 20, the projection area of the light inlet member 30 is equal to the area of the detector 20, or the projection area of the light inlet member 30 is smaller than the area of the detector 20. If a larger light inlet member 30 is used, the projection of the light inlet member 30 along the light inlet direction can exceed the range of the detector 20. The selection of the light inlet member 30 is more flexible, and different use requirements can be met.

[0046] In combination Figure 3 In this embodiment, the maximum area of the entire small imaging module in the transverse direction is equal to the area of the detector 20. The area of the imaging module is minimized based on the detector 20.

[0047] In combination Figure 2As shown in the figure, the back of the detector 20 and the front of the main board 10 can adopt a variety of different signal connection structures, and the back of the detector 20 and the front of the main board 10 are connected by any one of the following ways: pad welding, pin insertion and welding, and connector insertion. Pad welding is to set a plurality of pads on the back of the detector 20 and the front of the main board 10 respectively, and then weld and fix after applying solder. Pin insertion and welding is to set a plurality of pins on the back of the detector 20, and the main board 10 is provided with corresponding insertion holes, the pins are inserted into the insertion holes from the front of the main board 10, and then welded and fixed from the back of the main board 10. Connector insertion is to install a connector on the main board, the connector is provided with a plurality of insertion holes, and a plurality of pins are arranged on the back of the detector 20, which can be inserted into the connector to realize electrical connection.

[0048] In another embodiment of the present application, a plurality of wires 201 are led out from the front of the detector 20, and the wires 201 are connected to the main board 10 through the light guide member 30. Figure 4 、 Figure 5 As shown in the figure, a stepped structure is formed at one side of the detector 20, and the wires 201 are led out from the step surface of the stepped structure, and the wires 201 are connected to the front of the main board 10 by bypassing the side of the detector 20, and the electrical signals are transmitted between the detector 20 and the main board 10 through the wires 201.

[0049] Since the front of the main board 10 needs to be connected to the wires 201, the projection area of the main board 10 along the light entering direction is larger than the projection area of the detector 20 along the light entering direction, and at least one side of the main board 10 exceeds the range of the detector 20, and the connection point of the main board 10 for connecting the wires 201 is located outside the projection range of the detector 20 along the light entering direction.

[0050] In the structure connected by the wires 201, in order to ensure compact structure, the position of the main board 10 for connecting the wires 201 is close to one side of the main board 10, which protrudes from the detector 20, so that the main board 10 has space for connecting the wires 201; the other sides of the main board 10 are flush with the detector 20, and only one side of the main board 10 protrudes out of the detector 20. As shown in the figure, Figure 5 In this structure, one side of the main board 10 extends out of the range of the detector 20, and the other three sides of the main board 10 are flush with the detector 20. The area of the main board 10 is slightly larger than the area of the detector 20, but only one side of the main board 10 is larger than the detector 20.

[0051] As shown in the figure, Figure 5 The projection edge of the light guide member 30 along the light entering direction coincides with the edge of the main board 10, the area of the light guide member 30 is equal to the area of the main board 10, and the area of the light guide member 30 is slightly larger than the area of the detector 20, but only one side of the light guide member 30 is larger than the detector 20.

[0052] A sealant 50 is applied to the outside of the wire 201, sealing it after installation. Since both the light-incoming component 30 and the main board 10 have a side protruding from the detector 20, a gap is formed in the protruding portion, which the sealant 50 fills. After curing, the sealant 50 is flush with the edges of both the main board 10 and the light-incoming component 30.

[0053] exist Figure 5 In the embodiment shown, since there is no signal connection between the back of the detector 20 and the front of the motherboard 10, in order to ensure structural fixation, the motherboard 10 and the detector 20 are welded or glued together to fix them as one unit.

[0054] Combination Figure 6 , Figure 7 As shown, the motherboard 10, detector 20, and light-inlet component 30 are assembled by sheet metal component 60 along the light-inlet direction. Sheet metal component 60 is pressed on the front of light-inlet component 30 and the back of motherboard 10, and is pressed and fixed in the light-inlet direction, so that the connection between motherboard 10, detector 20, and light-inlet component 30 is more stable.

[0055] The structure comprised of the motherboard 10, detector 20, and light-incoming component 30 has four sides, and the sheet metal component 60 can be located on two, three, or all four sides. The sheet metal component 60, used to press-fit the motherboard 10, detector 20, and light-incoming component 30, is a one-piece structure. The sheet metal component 60 is made of thin-walled metal sheet, and its thickness is less than the outer shell thickness of the light-incoming component 30. The thickness of the sheet metal component 60 is 0.15mm ± 0.05mm, which, relative to the light-incoming component 30 covering the outer periphery of the detector 20, still reduces space occupation.

[0056] Combination Figure 6 As shown, it represents Figure 3 The corresponding structural assembly sheet metal component is 60. Combined with... Figure 7 As shown, it represents Figure 5 The corresponding structural assembly sheet metal component 60. The main board 10 and the detector 20 use different signal connection methods, and both can be reinforced and fixed by the sheet metal component 60.

[0057] The miniature imaging module used in this invention includes an infrared detector 20, which enables infrared optical detection. However, this invention does not preclude the use of a visible light detector for the detector 20; such specific selections should be included within the scope of protection of this invention.

[0058] The application further provides a thermal imaging device, comprising the small imaging module, the thermal imaging device internally installs the small imaging module, can leave more abundant installation space for other elements, and helps small design of the thermal imaging device.

[0059] The above description of disclosed embodiments enables one of ordinary skill in the art to make or use the application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein can be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A small imaging module, characterized in that, Includes motherboard (10), detector (20), and light-gathering component (30); The back of the detector (20) is mounted on the front of the motherboard (10), and the detector (20) and the motherboard (10) are electrically connected. The back of the light-gathering component (30) is fixedly mounted on the front of the detector (20), and the light is captured by the detector (20) after passing through the light-gathering component (30).

2. The small imaging module according to claim 1, characterized in that, A sealing ring (40) is provided between the detector (20) and the light-gathering component (30).

3. The small imaging module according to claim 1, characterized in that, The back of the detector (20) and the front of the motherboard (10) are respectively provided with contacts for signal transmission for electrical connection.

4. The small imaging module according to claim 3, characterized in that, The projection of the motherboard (10) along the light-inlet direction falls within the projection range of the detector (20) along the light-inlet direction.

5. The small imaging module according to claim 3, characterized in that, The back of the detector (20) is connected to the front of the motherboard (10) by any one of the following methods: soldering with pads, inserting and soldering pins, or plugging in a connector.

6. The small imaging module according to claim 1, characterized in that, Several wires (201) are led out from the front of the detector (20). The projected area of ​​the motherboard (10) along the light-inlet direction is greater than the projected area of ​​the detector (20) along the light-inlet direction. The wire (201) is connected to the front side of the motherboard (10). The connection point of the motherboard (10) for connecting the wire (201) is located outside the projection range of the detector (20) along the light-inlet direction.

7. The small imaging module according to claim 6, characterized in that, One side of the main board (10) for connecting the wire (201) protrudes from the detector (20); the other sides of the main board (10) are flush with the detector (20).

8. The small imaging module according to claim 6, characterized in that, The projection edge of the light-introducing component (30) along the light-introducing direction coincides with the edge of the motherboard (10).

9. The small imaging module according to claim 8, characterized in that, The conductor (201) is covered with a sealing colloid (50), which fills the gap between the motherboard (10) and the light-gathering component (30).

10. The small imaging module according to claim 6, characterized in that, The motherboard (10) and the detector (20) are fixed by welding or adhesive.

11. The small imaging module according to any one of claims 1 to 10, characterized in that, The motherboard (10), the detector (20), and the light-introducing component (30) are assembled by a sheet metal component (60) along the light-introducing direction.

12. The small imaging module according to any one of claims 1 to 10, characterized in that, The detector (20) is an infrared detector.

13. A thermal imaging device, characterized in that, Includes the small imaging module as described in any one of claims 1 to 12.

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