Electronic device and control method for controlling speaker temperature, and storage medium

Abstract

An electronic device for controlling a temperature of a speaker and a control method are disclosed. The electronic device includes: a sensor for sensing an outside air temperature; the loudspeaker is used for outputting sound; and at least one processor. The at least one processor predicts an energy of the sound. The at least one processor uses a thermal model to predict an amount of increase or decrease in temperature of the speaker from the predicted energy of the sound. The at least one processor predicts a temperature of the speaker based on the outside air temperature and a temperature increase or decrease amount of the speaker. The at least one processor maintains a temperature of the speaker at or below a threshold temperature based on the predicted temperature of the speaker and the threshold temperature.

Description

TECHNICAL FIELD

[0001] Embodiments of the present document relate to an electronic device and a control method for controlling a temperature of a speaker. BACKGROUND

[0002] An electronic device can output a sound signal, such as a sound source, through a speaker. The speaker can include a permanent magnet and a coil, and a diaphragm can be attached to the coil. The coil adjacent to the permanent magnet can reciprocate depending on the polarity and the change in voltage of the electrical sound signal. The diaphragm can generate a sound wave signal by vibrating air in response to the reciprocation of the coil. With the above-described process, the speaker can convert an electrical sound signal into a sound wave and output the sound wave. When the speaker performs the operation of converting an electrical signal into a sound wave and outputting the sound wave, the temperature of the speaker can increase.

[0003] The above-described information can be provided as related art for the purpose of enhancing the understanding of the present disclosure. There is no assertion or determination of the applicability of any one of the above-described information as prior art related to the present disclosure. SUMMARY

[0004] TECHNICAL PROBLEM

[0005] Various embodiments of the present document can protect a speaker by controlling a temperature of the speaker.

[0006] SOLUTION TO PROBLEM

[0007] According to an aspect of the present disclosure, an electronic device is provided, including a sensor configured to detect an outside air temperature, a speaker configured to output a sound, and at least one processor, wherein the at least one processor is configured to predict an energy of the sound, predict an increase or decrease in a temperature of the speaker according to the predicted energy of the sound, predict a predicted temperature of the speaker based on the outside air temperature and the increase or decrease in the temperature of the speaker, and maintain the temperature of the speaker at or below a threshold temperature based on the predicted temperature of the speaker and the threshold temperature. The increase or decrease in the temperature of the speaker according to the predicted energy of the sound can be predicted using a thermal model.

[0008] In an embodiment, the at least one processor is configured to maintain the temperature of the speaker at or below the threshold temperature by controlling the output of the sound when it is identified that the predicted temperature exceeds the threshold temperature.

[0009] In an embodiment, the at least one processor is configured to control the output of the sound based on at least one of a difference between the predicted temperature and the threshold temperature, the outside air temperature, and a gradient of the increase or decrease in the temperature.

[0010] In an embodiment, the at least one processor is configured to control the output of the sound by adjusting a gain of the output of the sound via use of proportional-integral-derivative (PID) control.

[0011] In an embodiment, the thermal model includes an equivalent resistor and an equivalent capacitor of the speaker.

[0012] In an embodiment, the at least one processor is configured to predict the amount of increase or decrease in the temperature based on an equivalent resistor value, an equivalent capacitor value, and the energy of the predicted sound.

[0013] In an embodiment, the at least one processor is configured to divide the sound into sound portions by a preset unit of time, and to predict the energy of the sound portions before the sound portions divided by the preset unit of time are output.

[0014] According to an aspect of the disclosure, there is provided a method of controlling an electronic device, the method including: obtaining an energy of a sound; obtaining an amount of increase or decrease in a temperature of a speaker according to the energy of the predicted sound by using a thermal model; obtaining a predicted temperature of the speaker based on a detected outside air temperature and the amount of increase or decrease in the temperature of the speaker; and maintaining the temperature of the speaker at or below a threshold temperature based on the predicted temperature of the speaker and the threshold temperature.

[0015] In an embodiment, in maintaining the temperature of the speaker at or below the threshold temperature, the method includes controlling the output of the sound to maintain the temperature of the speaker at or below the threshold temperature when it is identified that the predicted temperature exceeds the threshold temperature.

[0016] In an embodiment, in maintaining the temperature of the speaker at or below the threshold temperature, the method includes controlling the output of the sound based on at least one of a difference between the predicted temperature and the threshold temperature, the outside air temperature, and a gradient of the amount of increase or decrease in the temperature.

[0017] In an embodiment, in maintaining the temperature of the speaker at or below the threshold temperature, the method includes controlling the output of the sound by adjusting a gain of the output of the sound via use of proportional-integral-derivative (PID) control.

[0018] In an embodiment, the thermal model includes an equivalent resistor and an equivalent capacitor of the speaker.

[0019] In an embodiment, in obtaining the amount of increase or decrease in the temperature of the speaker, the amount of increase or decrease in the temperature is predicted based on an equivalent resistor value, an equivalent capacitor value, and the energy of the predicted sound.

[0020] In an embodiment, obtaining the energy of the sound includes: dividing the sound into sound portions by a preset unit of time; and obtaining the energy of the sound portions before the sound portions divided by the preset unit of time are output.

[0021] According to an aspect of the disclosure, there is provided a transitory or non-transitory computer readable storage medium having stored thereon instructions, which, when executed by a processor, cause the processor to perform the method of any foregoing aspect of the method of the embodiments. BRIEF DESCRIPTION OF DRAWINGS

[0022] The subject matter of the present disclosure can be best understood with reference to the following drawings and detailed description.

[0023] Figure 1 is a block diagram of an electronic device in a network environment according to various embodiments;

[0024] Figure 2 is a block diagram for explaining a configuration of an electronic device according to various embodiments;

[0025] Figure 3 is a flowchart for explaining a process of outputting sound according to various embodiments;

[0026] Figure 4A and Figure 4B is a view for explaining a thermal model according to various embodiments; and

[0027] Figure 5 is a flowchart for explaining a method of controlling an electronic device according to various embodiments. DETAILED DESCRIPTION

[0028] Hereinafter, embodiments of the disclosure will be described in detail with reference to the accompanying drawings such that a person of ordinary skill in the art to which the disclosure pertains can easily perform the embodiments. The disclosure may, however, be implemented in various different ways and is not limited to the embodiments described herein. In the description of the drawings, the same or similar components can be designated by the same or similar reference numerals.

[0029] Figure 1 is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments. Referring to Figure 1The electronic device 101 in the network environment 100 can communicate with an electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or an electronic device 104 or a server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, the electronic device 101 can communicate with the electronic device 104 via the server 108. According to an embodiment, the electronic device 101 can include a processor 120, a memory 130, an input module 150, a sound output module 155, a display module 160, an audio module 170, a sensor module 176, an interface 177, a connection terminal 178, a haptic module 179, a camera module 180, a power management module 188, a battery 189, a communication module 190, a subscriber identification module (SIM) 196, or an antenna module 197. In some embodiments, at least one (e.g., the connection terminal 178) of the above components can be omitted from the electronic device 101, or one or more other components can be added in the electronic device 101. In some embodiments, some of the above components (e.g., the sensor module 176, the camera module 180, or the antenna module 197) can be implemented as a single integrated component (e.g., the display module 160).

[0030] The processor 120 can execute, for example, software (e.g., a program 140) to control at least one other component (e.g., a hardware or software component) of the electronic device 101 coupled with the processor 120 and can perform various data processing or computation. According to one embodiment, as at least part of the data processing or computation, the processor 120 can store a command or data received from another component (e.g., the sensor module 176 or the communication module 190) in the volatile memory 132, process the command or data stored in the volatile memory 132, and store processed results in the non-volatile memory 134. According to an embodiment, the processor 120 can include a main processor 121 (e.g., a central processing unit (CPU) or an application processor (AP)), or an auxiliary processor 123 (e.g., a graphics processing unit (GPU), a neural processing unit (NPU), an image signal processor (ISP), a sensor hub processor, or a communication processor (CP)) that is operable independently from, or in conjunction with, the main processor 121. For example, when the electronic device 101 includes the main processor 121 and the auxiliary processor 123, the auxiliary processor 123 can be adapted to consume less power than the main processor 121, or to be specialized for a specific function. The auxiliary processor 123 can be implemented as separate from, or as part of the main processor 121.

[0031] The auxiliary processor 123 (not the main processor 121) can control at least some of the functions or states related to at least one component (for example, the display module 160, the sensor module 176, or the communication module 190) among the components of the electronic device 101 while the main processor 121 is in an inactive (for example, sleep) state, or together with the main processor 121, control at least some of the functions or states related to at least one component (for example, the display module 160, the sensor module 176, or the communication module 190) among the components of the electronic device 101 while the main processor 121 is in an active state (for example, executing an application). According to an embodiment, the auxiliary processor 123 (for example, an image signal processor or a communication processor) can be implemented as part of another component (for example, the camera module 180 or the communication module 190) functionally related to the auxiliary processor 123. According to an embodiment, the auxiliary processor 123 (for example, a neural processing unit) can include a hardware structure dedicated to artificial intelligence model processing. The artificial intelligence model can be generated by machine learning. For example, such learning can be performed by the electronic device 101 where artificial intelligence is performed or via a separate server (for example, the server 108). The learning algorithm can include, but is not limited to, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model can include multiple artificial neural network layers. The artificial neural network can be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q-network, or a combination of two or more thereof, but is not limited thereto. Additionally or alternatively, the artificial intelligence model can include a software structure other than a hardware structure.

[0032] The memory 130 can store various data used by at least one component (for example, the processor 120 or the sensor module 176) of the electronic device 101. The various data can include, for example, software (for example, a program 140) and input data or output data for a command related thereto. The memory 130 can include the volatile memory 132 or the non-volatile memory 134. The non-volatile memory 134 can include at least one of the internal memory 136 and the external memory 138.

[0033] The program 140 can be stored in the memory 130 as software, and can include, for example, an operating system (OS) 142, middleware 144, or an application 146.

[0034] The input module 150 can receive a command or data to be used by other component (e.g., the processor 120) of the electronic device 101, from the outside (e.g., a user) of the electronic device 101. The input module 150 can include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0035] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 can include, for example, a speaker or a receiver. The speaker can be used for general purposes, such as playing multimedia or playing record, and the receiver can be used for receiving an incoming call. According to an embodiment, the receiver can be implemented as separate from the speaker, or can be implemented as part of the speaker.

[0036] The display module 160 can visually provide information to the outside (e.g., a user) of the electronic device 101. The display module 160 can include, for example, a display, a hologram device, or a projector and a control circuit for controlling a corresponding one of the display, the hologram device, and the projector. According to an embodiment, the display module 160 can include a touch sensor adapted to detect a touch, or a pressure sensor adapted to measure the intensity of force incurred by the touch.

[0037] The audio module 170 can convert a sound into an electrical signal and vice versa. According to an embodiment, the audio module 170 can obtain the sound via the input module 150, or output the sound via the sound output module 155 or a headphone of an external electronic device (e.g., an electronic device 102) directly (e.g., wiredly) or wirelessly coupled with the electronic device 101.

[0038] The sensor module 176 can detect an operational state (e.g., power or temperature) of the electronic device 101 or an environmental state (e.g., a state of a user) external to the electronic device 101, and then generate an electrical signal or data value corresponding to the detected state. According to an embodiment, the sensor module 176 can include, for example, a gesture sensor, a gyro sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0039] The interface 177 can support one or more specified protocols to be used for the electronic device 101 to be coupled with the external electronic device (e.g., the electronic device 102) directly (e.g., wiredly) or wirelessly. According to an embodiment, the interface 177 can include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, a secure digital (SD) card interface, or an audio interface.

[0040] The connection terminal 178 can include a connector via which the electronic device 101 can be physically connected with the external electronic device (e.g., the electronic device 102). According to an embodiment, the connection terminal 178 can include, for example, a HDMI connector, a USB connector, a SD card connector, or an audio connector (e.g., a headphone connector).

[0041] The haptic module 179 can convert electrical signal into a mechanical stimulus (e.g., a vibration or a movement) or electrical stimulus that can be recognized by users through their tactile sensation or kinesthetic sensation. According to an embodiment, the haptic module 179 can include, for example, a motor, a piezoelectric element, or an electrical stimuluser.

[0042] The camera module 180 can capture still images or moving images. According to an embodiment, the camera module 180 can include one or more lenses, image sensors, image signal processors, or flashes.

[0043] The power management module 188 can manage power supplied to the electronic device 101. According to an embodiment, the power management module 188 can be implemented as at least part of, for example, a power management integrated circuit (PMIC).

[0044] The battery 189 can supply power to at least one component of the electronic device 101. According to an embodiment, the battery 189 can include, for example, a primary cell which is not rechargeable, a secondary cell which is rechargeable, or a fuel cell.

[0045] The communication module 190 can support establishing a direct (e.g., wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (e.g., the electronic device 102, the electronic device 104, or the server 108) and performing communication between the electronic devices 101 and the external electronic device via the established communication channel. The communication module 190 can include one or more communication processors that are operable independently from the processor 120 (e.g., an application processor (AP)) and supports a direct (e.g., wired) communication or a wireless communication. According to an embodiment, the communication module 190 can include a wireless communication module 192 (e.g., a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (e.g., a local area network (LAN) communication module or a power line communication (PLC) module). A corresponding one of these communication modules can communicate with the external electronic device via the first network 198 (e.g., a short-range communication network, such as Bluetooth, wireless-fidelity (Wi-Fi) direct, or infrared data association (IrDA)) or the second network 199 (e.g., a long-range communication network, such as a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN)). These various types of communication modules can be implemented as a single component (e.g., a single chip) or multiple components (e.g., multiple chips) separate from each other. The wireless communication module 192 can identify and authenticate the electronic device 101 in a communication network, such as the first network 198 or the second network 199, using subscriber information (e.g., an international mobile subscriber identity (IMSI)) stored in the subscriber identification module 196.

[0046] The wireless communication module 192 can support 5G networks and next-generation communication technologies (e.g., new radio (NR) access technology) after 4G networks. The NR access technology can support enhanced mobile broadband (eMBB), massive machine type communications (mMTC), or ultra-reliable low-latency communications (URLLC). The wireless communication module 192 can support a high frequency band (e.g., a millimeter wave band) to achieve, for example, high data transmission rates. The wireless communication module 192 can support various technologies for securing performance on a high frequency band, such as, for example, beamforming, massive multiple input multiple output (massive MIMO), full dimensional MIMO (FD-MIMO), array antenna, analog beamforming, or large scale antenna. The wireless communication module 192 can support various requirements designated in the electronic device 101, an external electronic device (e.g., the electronic device 104), or a network system (e.g., the second network 199). According to an embodiment, the wireless communication module 192 can support a peak data rate of eMBB (e.g., 20 Gbps or more) for implementation, a loss coverage (e.g., 164 dB or less) for mMTC implementation, or a U-plane latency (e.g., 0.5 ms or less for each of downlink (DL) and uplink (UL), or 1 ms or less for round trip) for URLLC implementation.

[0047] The antenna module 197 can transmit or receive a signal or power to or from the outside (e.g., an external electronic device) of the electronic device 101. According to an embodiment, the antenna module 197 can include an antenna including a radiating element composed of a conductive material or a conductive pattern formed in or on a base (e.g., a printed circuit board (PCB)). According to an embodiment, the antenna module 197 can include a plurality of antennas (e.g., array antennas). In this case, at least one antenna suitable for a communication scheme used in a communication network, such as the first network 198 or the second network 199, can be selected from the plurality of antennas by, for example, the communication module 190 (e.g., the wireless communication module 192). Then, a signal or power can be transmitted or received between the communication module 190 and an external electronic device via the selected at least one antenna. According to an embodiment, in addition to the radiating element, another component (e.g., a radio frequency integrated circuit (RFIC)) can additionally be formed as part of the antenna module 197.

[0048] According to various embodiments, the antenna module 197 can form a millimeter wave antenna module. According to an embodiment, the millimeter wave antenna module can include a printed circuit board, a radio frequency integrated circuit (RFIC), and a plurality of antennas (e.g., array antennas), wherein the RFIC is disposed on a first surface (e.g., a bottom surface) of the printed circuit board, or adjacent to the first surface and capable of supporting a designated high frequency band (e.g., a millimeter wave band), and the plurality of antennas is disposed on a second surface (e.g., a top surface or a side surface) of the printed circuit board, or adjacent to the second surface and capable of transmitting or receiving a signal of the designated high frequency band.

[0049] At least some of the above-described components can be connected to each other via an inter-peripheral communication scheme (e.g., a bus, a general purpose input output (GPIO), a serial peripheral interface (SPI), or a mobile industry processor interface (MIPI)) and communicate information (e.g., commands or data) between them.

[0050] According to an embodiment, commands or data can be transmitted or received between the electronic device 101 and the external electronic device 104 via the server 108 coupled with the second network 199. Each of the electronic devices 102 and 104 can be a device of a same type as or different from the electronic device 101. According to an embodiment, all or some of the operations to be executed at the electronic device 101 can be executed at one or more of the external electronic devices 102, 104, or 108. For example, if the electronic device 101 is to perform a function or a service automatically, or in response to a request from a user or another device, the electronic device 101, instead of, or in addition to, executing the function or the service, can request the one or more external electronic devices to perform at least part of the function or the service. The one or more external electronic devices receiving the request can perform the requested at least part of the function or the service, or an additional function or an additional service related to the request, and transfer an outcome of the performing to the electronic device 101. The electronic device 101 can provide the outcome, with or without further processing of the outcome, as a functional or service response of the request. To that end, a cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology can be used, for example. The electronic device 101 can use, for example, distributed computing or mobile edge computing to provide an ultra-low-latency service. In another embodiment, the external electronic device 104 can include an Internet-of-Things (IoT) device. The server 108 can be an intelligent server using machine learning and / or a neural network. According to an embodiment, the external electronic device 104 or the server 108 can be included in the second network 199. The electronic device 101 can be applied to a smart service (e.g., a smart home, a smart city, a smart car, or a health care) based on a 5G communication technology or an IoT-related technology.

[0051] An electronic device according to various embodiments can be one of various types of electronic devices. The electronic devices can include, for example, a portable communication device (e.g., a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. According to an embodiment of the disclosure, the electronic devices are not limited to those described above.

[0052] Figure 2 is a block diagram for explaining constituent elements of an electronic device according to various embodiments.

[0053] Reference Figure 2The electronic device 101 can include the sensor 176, the processor 120, and the speaker 155. The sensor 176 can detect an external air temperature. For example, the sensor 176 can include a temperature sensor, and be referred to as a sensor portion, a sensor module, or a sensor device. The speaker 155 can output sound (e.g., audio, voice, beeps, etc.). The speaker 155 can be an example of a sound output module.

[0054] The processor 120 can control components of the electronic device 101. The processor 120 can be a single processor 120 or a plurality of processors 120. The processor 120 can predict (or acquire) an energy of sound based on a waveform of the sound, regardless of sound output from the speaker. The energy of sound can be an intensity of sound. For example, when the waveform of sound is a sine wave, the waveform of the intensity of sound can be a square of the sine wave. Also, the intensity of sound can be an average value of the square of the sine wave. Accordingly, the energy of sound can be an average value of a waveform made by squaring the waveform of sound. The phrase "energy of sound" can mean an energy associated with a sound signal or a sound wave input to the speaker.

[0055] The processor 120 can predict an amount of increase or decrease in temperature of the speaker 155 according to the predicted energy of sound by using a thermal model. The thermal model can be a model for acquiring or predicting thermal information from an electrical characteristic of the speaker 155. For example, the thermal model can include an equivalent resistor and an equivalent capacitor of the speaker 155. The processor 120 can predict (or acquire) the amount of increase or decrease in temperature of the speaker 155 based on the equivalent resistor value and the equivalent capacitor value of the thermal model and the predicted energy of sound.

[0056] The processor 120 can predict (or acquire) a predicted temperature of the speaker 155 based on the amount of increase or decrease in temperature of the speaker 155 predicted by using the thermal model and the external air temperature detected by the sensor 176. In one embodiment, when the external air temperature detected by the sensor 176 is 25 degrees and the amount of increase or decrease in predicted temperature is 0.3 degrees, the processor 120 can determine that the predicted temperature of the speaker 155 is 25.3 degrees.

[0057] The processor 120 can maintain the temperature of the speaker 155 at or below the threshold temperature based on the predicted temperature of the speaker 155 and the threshold temperature. For example, when the processor 120 identifies that the predicted temperature exceeds the threshold temperature, the processor 120 can maintain the temperature of the speaker 155 at or below the threshold temperature by controlling the output of the sound. The processor 120 can control the output of the sound using a closed-loop control. More specifically, the processor 120 can control the output of the sound by adjusting a gain of the output of the sound using a proportional-integral-derivative (PID) control. The processor 120 can perform the PID control based on a difference between the predicted temperature and the threshold temperature, an outside air temperature, and / or a gradient of an amount of increase or decrease in the temperature.

[0058] According to an embodiment, the electronic device 101 can predict the energy of the sound before outputting the sound, and maintain the temperature of the speaker 155 at or below the threshold temperature based on the predicted energy, thereby protecting the speaker 155 from damage caused by generated heat.

[0059] According to an embodiment, the processor 120 can divide the sound into sound portions in a preset unit time, and predict the energy of the sound when the processor 120 predicts the energy of the sound. For example, the preset unit time can be 0.5 ms. In this case, the processor 120 can predict the energy of the sound before a portion of the sound in a 0.5 ms unit is output, and the processor 120 can predict the predicted temperature of the speaker 155. First, the processor 120 can predict the energy of a first portion of the sound (e.g., 0 ms to 0.5 ms) before the first portion of the sound is output. When the first portion of the sound is output, the processor 120 can predict the predicted temperature of the speaker 155. If the processor 120 determines that the predicted temperature of the speaker 155 related to the energy of the first portion of the sound exceeds the threshold temperature, the processor 120 can control the output of the first portion. A portion of the sound can mean a partial section that is separated from a total time section (or a total playback time) of the sound by a unit time. In one embodiment, when a total time section of the sound a is 5 seconds and is divided by a unit time of 0.5 seconds, the sound a can be divided into ten sound portions by a unit time of 0.5 seconds. Next, the processor 120 predicts the energy of a second portion of the sound (e.g., 0.5 ms to 1 ms) before the second portion of the sound is output. When the second portion of the sound is output, the processor 120 can predict the predicted temperature of the speaker 155. If the processor 120 determines that the predicted temperature of the speaker 155 related to the energy of the second portion of the sound exceeds the threshold temperature, the processor 120 can control the output of the second portion. The processor 120 can repeat the above-described process for a third portion (e.g., 1 ms to 1.5 ms), a fourth portion (e.g., 1.5 ms to 2 ms), and an n-th portion of the sound.

[0060] In one embodiment, the amount of increase or decrease in temperature related to the first part of the sound predicted by the processor 120 can be 0.5 degrees. When the threshold temperature of the speaker 155 is 30 degrees and the outside air temperature is 29 degrees, the predicted temperature of the speaker 155 can be 29.5 degrees, which is equal to or lower than the threshold temperature. The processor 120 can output the first part of the sound without performing temperature control. The amount of increase or decrease in temperature related to the second part of the sound predicted by the processor 120 can be 0.7 degrees. In this case, the processor 120 can predict the predicted temperature of the speaker 155 based on the outside air temperature, the immediately preceding amount of increase or decrease in temperature, and the amount of increase or decrease in temperature. Alternatively, at a part following the second part of the sound, the processor 120 can predict the predicted temperature of the speaker 155 based on the previously predicted temperature of the speaker 155 and the currently predicted amount of increase or decrease in temperature. When the processor 120 outputs the second part of the sound, the processor 120 can predict the predicted temperature of the speaker 155 to be 31.2 degrees (29 degrees + 0.5 degrees + 0.7 degrees or 29.5 degrees + 0.7 degrees). Because the predicted temperature of the speaker 155 can exceed the threshold temperature, the processor 120 can control the output of the second part of the sound.

[0061] Figure 3 is a flowchart for explaining a process of outputting a sound according to various embodiments.

[0062] In the embodiments to be described below, respective operations can be sequentially performed. However, the operations need not necessarily be sequentially performed. For example, the order of the individual operations can be changed, and at least two operations can be performed in parallel.

[0063] According to an embodiment, steps 310 to 370 can be understood as being performed by a processor (e.g., the processor 120 in the electronic device 101 of Figure 2 ). Figure 2

[0064] Referring to Figure 3 , the electronic device 101 can include a sound signal (310). For example, the sound signal can include an audio signal, a voice signal, and a beep sound. The sound signal can be stored in a memory (e.g., the memory 130 in the electronic device 101 of Figure 1 ) and received from the outside through a communication module (e.g., the communication module 190 in the electronic device 101 of Figure 1 ).

[0065] According to an embodiment, the electronic device 101 can predict a speaker (e.g., the speaker 155 in the electronic device 101 of Figure 2 ​The electronic device 101 can predict the temperature rise or fall of the speaker 155 (320). For example, the electronic device 101 can predict the energy of the sound signal. Furthermore, the electronic device 101 can use a thermal model and predict the amount of temperature rise or fall of the speaker 155 based on the predicted energy of the sound signal. Additionally, the electronic device 101 can predict external air temperature information using sensor 176 (330). The electronic device 101 can predict the predicted temperature of the speaker 155 based on the external air temperature information and the amount of temperature rise or fall of the speaker 155 (340).

[0066] Electronic device 101 can protect speaker 155 from damage caused by generated heat (350). According to an embodiment, electronic device 101 can compare a predicted temperature with a threshold temperature for speaker 155. When the predicted temperature is equal to or below the threshold temperature, electronic device 101 may not perform the operation to protect speaker 155. When the predicted temperature exceeds the threshold temperature, electronic device 101 can perform the operation to protect speaker 155. For example, electronic device 101 can control the sound output by adjusting the gain of the sound output using PID control. Electronic device 101 can perform PID control based on the difference between the predicted temperature and the threshold temperature, the ambient air temperature, and / or the gradient of the amount of temperature increase or decrease.

[0067] According to an embodiment, when it has been determined that the operation to protect the speaker 155 will be performed, the electronic device 101 can attenuate the amplitude of the sound (360) by using an amplifier based on an adjusted gain, and output the sound through the speaker 155 (370). Because the temperature of the speaker 155 can be equal to or lower than the predicted temperature as the gain of the sound output is adjusted, the speaker 155 can be protected.

[0068] Figure 4A and Figure 4B This is a view used to explain the thermal model according to various embodiments.

[0069] loudspeakers (e.g., Figure 2 The loudspeaker 155 may include a coil. When voltage is supplied to the coil, the coil can reciprocate. Sound wave signals and heat can be generated by the reciprocating motion of the coil.

[0070] Figure 4AA thermal model of the loudspeaker 155 is shown. As described above, the reciprocating motion performed by the coil due to the supplied voltage can be connected to a part of the electromechanical model 1. The heat generated from the coil by the energy generated from the electromechanical model 1 can correspond to a part of the thermal model 3. The displacement can be predicted by means of the thermal model 3 of the loudspeaker 155. For example, the displacement can be an amount of increase or decrease of temperature. The amount of increase or decrease of temperature of the loudspeaker 155 can be the amount of increase or decrease of temperature of the coil. The electromechanical model can model the displacement of the coil with respect to the input voltage. The electromechanical model can also generate a power value to be input to the thermal model and receive a temperature or a temperature change (e.g., temperature increase or decrease) from the thermal model. The electromechanical model 1 and the thermal model 3 can each be implemented in an electronic device (e.g., an analog electronic device), or can be implemented as, for example, a numerical model.

[0071] Figure 4B An equivalent circuit 10 of the thermal model 3 of the loudspeaker 155 is shown. The thermal model can model the thermal behavior of the loudspeaker 155. The thermal model can receive power from the electromechanical model 1 and output a temperature or a temperature change to the electromechanical model 1. The equivalent circuit 10 of the loudspeaker 155 can include an equivalent circuit part 11 of the coil and an equivalent circuit part 12 of the magnet. The equivalent circuit part 11 of the coil can include a first equivalent resistor R1 and a first equivalent capacitor C1. The equivalent circuit part 12 of the magnet can include a second equivalent resistor R2 and a second equivalent capacitor C2.

[0072] The amount of increase or decrease of temperature of the loudspeaker 155 vc may be predicted from Equation 1 by using the equivalent circuit 10 of the thermal model 3 of the loudspeaker 155.

[0073] The amount of increase or decrease of temperature of the loudspeaker 155 vc = [{R1 + R2 + s*(R1*R2)} / {1 + s*(R1*C1 + R2*C1 + R2*C2) + s 2 *(R1*C1*R2*C2)}]*P

[0074] Equation 1 is provided only for illustration, and the present disclosure is not limited thereto. Various modifications, applications, or interpretations can be made.

[0075] In this case, P can be the power from the electromechanical model, which can be used to determine the energy of the sound using E=Pt, where E is energy and t is time.

[0076] In general, the amount of temperature change caused by the impedance change of the speaker 155 can be very large. However, the amount of temperature change caused by the change of the resistor and / or the capacitor can be very small. The thermal model 3 of the speaker 155 of the disclosure can include equivalent resistors R1 and R2 and equivalent capacitors C1 and C2. The equivalent resistors R1 and R2 and the equivalent capacitors C1 and C2 can include actual values and error values. However, because the amount of temperature change caused by the change of the resistor and / or the capacitor is very small, the electronic device 101 of the disclosure can predict the amount of increase or decrease in the temperature of the speaker 155 that rarely affects the error of the equivalent resistor and the equivalent capacitor.

[0077] The electronic device 101 can predict the amount of increase or decrease in the temperature of the speaker 155 by using the thermal model 3 of the speaker 155, and predict the predicted temperature of the speaker 155 considering the outside air temperature. Furthermore, the electronic device 101 can control the gain of the sound based on the threshold temperature and the predicted temperature.

[0078] Figure 5 is a flowchart for explaining a method of controlling an electronic device according to various embodiments.

[0079] In the embodiments to be described below, the respective operations can be sequentially performed. However, the operations do not necessarily need to be sequentially performed. For example, the order of the individual operations can be changed, and at least two operations can be performed in parallel.

[0080] According to an embodiment, 510 to 540 can be understood as being performed by a processor (e.g., the processor 120 in the electronic device 101 of Figure 2 ). Figure 2

[0081] Referring to Figure 5 , the electronic device 101 can predict the energy of the sound (510). In one embodiment, the electronic device 101 can predict the energy of the sound before outputting the sound. For example, the electronic device 101 can predict the energy of the sound by squaring the waveform of the sound and obtaining the average value of the squared waveform of the sound. In addition, the electronic device 101 can divide the sound into sound portions per a preset unit time, and sequentially predict the energy related to the separated sound portions.

[0082] The electronic device 101 can use a thermal model (e.g., the thermal model 3 in Figure 4B ) and predict the speaker (e.g., the speaker 155 in Figure 2 ​The amount of temperature rise or fall (520) of the loudspeaker 155. For example, the thermal model can be a thermal model of the loudspeaker 155. The thermal model of the loudspeaker 155 can be a thermal model of the coil included in the loudspeaker 155. For example, the thermal model of the loudspeaker 155 can be a model indicating the reciprocating motion of the coil made by the supply of voltage and indicating the heat and energy generated by the reciprocating motion of the coil. The thermal model can be represented as an equivalent circuit of the loudspeaker 155. The equivalent circuit of the loudspeaker 155 can include an equivalent resistor and an equivalent capacitor. The electronic device 101 can predict the amount of temperature rise or fall based on the equivalent resistor value, the equivalent capacitor value, and the predicted sound energy.

[0083] Electronic device 101 can predict the predicted temperature (530) of speaker 155. Electronic device 101 can predict the amount of temperature increase or decrease of speaker 155 by using a thermal model. Furthermore, electronic device 101 can predict the temperature increase or decrease of speaker 155 by using sensors (e.g., Figure 2 The sensor 176 in the middle predicts the outside air temperature. The electronic device 101 can predict the predicted temperature (530) of the speaker 155 based on the outside air temperature and the amount of temperature increase or decrease. Alternatively, the electronic device 101 can sequentially predict the energy associated with sound portions separated by preset unit time intervals. In this case, the electronic device 101 can predict the predicted temperature of the speaker 155 based on the outside air temperature, the immediately preceding amount of temperature increase or decrease, and the amount of temperature increase or decrease. Alternatively, in portions of the sound after the second portion, the electronic device 101 can predict the predicted temperature of the speaker 155 based on the previously predicted temperature of the speaker 155 and the currently predicted amount of temperature increase or decrease.

[0084] Electronic device 101 can maintain the temperature of speaker 155 at or below a threshold temperature (540). For example, when electronic device 101 detects that the predicted temperature exceeds the threshold temperature, electronic device 101 can maintain the temperature of speaker 155 at or below the threshold temperature by controlling the sound output. Electronic device 101 can control the sound output based on the difference between the predicted temperature and the threshold temperature, the ambient air temperature, and / or the gradient of the amount of temperature increase or decrease. Electronic device 101 can control the sound output by adjusting the gain of the sound output using PID control.

[0085] In one embodiment, the electronic device 101 can include a sensor 176 configured to detect an external air temperature, a speaker 155 configured to output a sound, and at least one processor 120. The at least one processor 120 can predict an energy of the sound. The at least one processor 120 can predict an amount of increase or decrease in a temperature of the speaker 155 according to the predicted energy of the sound by using a thermal model. The at least one processor 120 can predict a predicted temperature of the speaker 155 based on the external air temperature and the amount of increase or decrease in the temperature of the speaker 155. The at least one processor 120 can maintain the temperature of the speaker 155 at or below a threshold temperature based on the predicted temperature of the speaker 155 and the threshold temperature.

[0086] In one embodiment, when the at least one processor 120 identifies that the predicted temperature exceeds the threshold temperature, the at least one processor 120 can maintain the temperature of the speaker 155 at or below the threshold temperature by controlling an output of the sound.

[0087] In one embodiment, the at least one processor 120 can control the output of the sound based on at least one of a difference between the predicted temperature and the threshold temperature, the external air temperature, and a gradient of the amount of increase or decrease in the temperature.

[0088] In one embodiment, the at least one processor 120 can control the output of the sound by adjusting a gain of the output of the sound via use of a proportional-integral-derivative (PID) control.

[0089] In one embodiment, the thermal model can include an equivalent resistor and an equivalent capacitor of the speaker 155.

[0090] In one embodiment, the at least one processor 120 can predict the amount of increase or decrease in the temperature based on an equivalent resistor value, an equivalent capacitor value, and the predicted energy of the sound.

[0091] In one embodiment, the at least one processor 120 can divide the sound into sound portions in a preset unit of time, and predict an energy of the sound portion before the sound portion divided in the preset unit of time is output.

[0092] In one embodiment, a method of controlling an electronic device 101 can predict an energy of a sound (510). The control method can predict an amount of increase or decrease in a temperature of a speaker 155 according to the predicted energy of the sound by using a thermal model (520). The control method can predict a predicted temperature of the speaker 155 based on a detected external air temperature and the amount of increase or decrease in the temperature of the speaker 155 (530). The control method can maintain the temperature of the speaker 155 at or below a threshold temperature based on the predicted temperature of the speaker 155 and the threshold temperature.

[0093] In one embodiment, the operation of maintaining the temperature of the speaker 155 at or below the threshold temperature can maintain the temperature of the speaker 155 at or below the threshold temperature by controlling the output of the sound when the predicted temperature exceeds the threshold temperature is identified in the operation of maintaining the temperature of the speaker 155 at or below the threshold temperature.

[0094] In one embodiment, the operation of maintaining the temperature of the speaker 155 at or below the threshold temperature can control the output of the sound based on at least one of a difference between the predicted temperature and the threshold temperature, an outside air temperature, and a gradient of an increase or decrease in the temperature.

[0095] In one embodiment, the operation of maintaining the temperature of the speaker 155 at or below the threshold temperature can control the output of the sound by adjusting a gain of the output of the sound using a proportional-integral-derivative (PID) control.

[0096] In one embodiment, the thermal model can include an equivalent resistor and an equivalent capacitor of the speaker 155.

[0097] In one embodiment, the operation of acquiring an increase or decrease in the temperature of the speaker 155 can predict the increase or decrease in the temperature based on an equivalent resistor value, an equivalent capacitor value, and a predicted energy of the sound.

[0098] In one embodiment, the operation of acquiring an energy of the sound can divide the sound into sound portions in a preset unit of time, and predict the energy of the sound portion before the sound portion divided in the preset unit of time is output.

[0099] In one embodiment, a non-transitory computer-readable storage medium having recorded thereon a program for executing a method of controlling an electronic device can perform the operation of predicting an energy of the sound. The storage medium can also use a thermal model, perform the operation of predicting an increase or decrease in a temperature of the speaker 155 from the predicted energy of the sound. The storage medium can perform the operation of predicting a predicted temperature of the speaker 155 based on the detected outside air temperature and the increase or decrease in the temperature of the speaker 155. The storage medium can perform the operation of maintaining the temperature of the speaker 155 at or below the threshold temperature based on the predicted temperature of the speaker 155 and the threshold temperature.

[0100] It should be understood that various embodiments of the present disclosure and the terms used therein are not intended to limit technically described features to particular embodiments and include various changes, equivalents, or replacements for a corresponding embodiment. With regard to the description of the drawings, like reference numerals can be used to refer to like or similar elements. It is to be understood that the singular forms "a," "an," and "the" include plural referents unless the context clearly dictates otherwise. As used herein, each of the phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B, or C," "at least one of A, B, and C," and "at least one of A, B, or C" can include all possible combinations of the items listed in the corresponding one of the phrases. As used herein, the terms "first" and "second" can be used to simply distinguish a corresponding component from another, and does not limit the components in other aspects (e.g., importance or order). It is to be understood that if an element (for example, a first element) is referred to as "including" or "comprising" another element (for example, a second element), the element can further include or comprise the other element, without excluding the other element.

[0101] As used in connection with various embodiments of the present disclosure, the term "module" can include a unit implemented in hardware, software, or firmware, and can interchangeably be used with other terms such as "logic," "logic block," "part," or "circuitry." The module can be a single integral component, or a minimum unit or part thereof, adapted to perform one or more functions. For example, according to an embodiment, the module can be implemented in a form of an application-specific integrated circuit (ASIC).

[0102] Various embodiments as set forth herein can be implemented as software (e.g., the program 140) including one or more instructions that are stored in a storage medium (e.g., internal memory 136 or external memory 138) that are readable by a machine (e.g., electronic device 101). For example, a processor (e.g., processor 120) of the machine (e.g., electronic device 101) can invoke at least one of the one or more instructions stored in the storage medium, and execute it, with or without using one or more other components under the control of the processor. This allows the machine to be operated as a special purpose machine to perform at least one function. The one or more instructions can include a code generated by a compiler or a code that forms at least a part of a language as provided in a high-level programming language. The machine-readable storage medium can be provided in the form of a non-transitory storage medium. The term "non-transitory" simply means that the storage medium is a tangible device, and does not include a signal (e.g., an electromagnetic wave). However, the term "non-transitory" does not encompass data that is at least temporarily stored in the storage medium.

[0103] According to the embodiments, a method according to various embodiments of the disclosure can be included and provided in a computer program product. The computer program product can be traded as a product between a seller and a buyer. The computer program product can be distributed in the form of a machine-readable storage medium (e.g., compact disc read only memory (CD-ROM)), or be distributed online via an application store (e.g., PlayStore TM ). If the computer program product is distributed online, at least part of it can be temporarily stored or temporarily generated in a machine-readable storage medium such as a manufacturer's server, an application store's server, or a relay server.

[0104] According to various embodiments, each component (e.g., a module or a program) of the above-described components can include a single entity or multiple entities, and some of the multiple entities can be separately positioned in different components. According to various embodiments, one or more of the above-described components can be omitted, or one or more other components can be added. The addition or omission can be made to the number, disposition, or positions of the components. The operations of the above-described components, modules, or programs can be executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations can be executed in a different order or omitted, or one or more other operations can be added.

[0105] The effects of the present document are not limited to the foregoing effects, and other effects not mentioned above will be clearly understood by those skilled in the art from the above description.

Claims

1. An electronic device comprising: The sensor is configured to detect the outside air temperature; The speaker is configured to output sound. and At least one processor, Wherein, the at least one processor is configured to: Predict the energy of the sound; The amount of temperature rise or fall of the loudspeaker is predicted by using a thermal model based on the predicted energy of the sound. The speaker temperature is predicted based on the outside air temperature and the predicted increase or decrease in speaker temperature; and The speaker's temperature is maintained at or below the threshold temperature based on the speaker's predicted temperature and threshold temperature.

2. The electronic device according to claim 1, in, The at least one processor is configured to maintain the speaker temperature at or below the threshold temperature by controlling the sound output when it is detected that the predicted temperature exceeds the threshold temperature.

3. The electronic device according to claim 2, in, The at least one processor is configured to control the sound output based on at least one of the difference between the predicted temperature and the threshold temperature, the external air temperature, and the gradient of the amount of temperature increase or decrease.

4. The electronic device according to claim 2, in, The at least one processor is configured to control the sound output by adjusting the gain of the sound output using proportional-integral-derivative (PID) control.

5. The electronic device according to claim 1, in, The thermal model includes the equivalent resistor and equivalent capacitor of the speaker.

6. The electronic device according to claim 5, in, The at least one processor is configured to predict the amount of temperature increase or decrease based on the equivalent resistor value, the equivalent capacitor value, and the predicted energy of the sound.

7. The electronic device according to claim 1, wherein, The at least one processor is configured to divide sound into sound portions at a preset unit time, and to predict the energy of the sound portions before the sound portions divided at the preset unit time are output.

8. A method for controlling an electronic device, the method comprising: Predict the energy of the sound; The amount of temperature rise or fall of the loudspeaker is predicted by using a thermal model based on the predicted energy of the sound. The speaker temperature is predicted based on the detected outside air temperature and the predicted increase or decrease in speaker temperature. as well as The speaker's temperature is maintained at or below the threshold temperature based on the speaker's predicted temperature and threshold temperature.

9. The method according to claim 8, in, The method, when maintaining the speaker temperature at or below a threshold temperature, includes: when it is identified that the predicted temperature exceeds the threshold temperature, controlling the sound output to maintain the speaker temperature at or below the threshold temperature.

10. The method according to claim 9, in, When maintaining the speaker temperature at or below a threshold temperature, the method includes controlling the sound output based on at least one of the difference between a predicted temperature and a threshold temperature, the external air temperature, and a gradient of the amount of temperature increase or decrease.

11. The method according to claim 9, in, When maintaining the speaker temperature at or below a threshold temperature, the method includes controlling the sound output by adjusting the gain of the sound output using proportional-integral-derivative (PID) control.

12. The method according to claim 8, in, The thermal model includes the equivalent resistor and equivalent capacitor of the speaker.

13. The method according to claim 12, in, When predicting the amount of temperature rise or fall of a loudspeaker, the amount of temperature rise or fall is predicted based on the equivalent resistance value, the equivalent capacitance value, and the predicted energy of the sound.

14. The method according to claim 8, wherein, The predicted energy of the sound includes: The sound is divided into sound parts according to a preset unit of time; and Predict the energy of the sound segment before it is output, which is divided into segments according to a preset time unit.

15. A non-transitory computer-readable medium, which, when implemented by an electronic device in relation to a method of controlling an electronic device, causes the electronic device to perform operations including: Predict the energy of the sound; The amount of temperature rise or fall of the loudspeaker is predicted by using a thermal model based on the predicted energy of the sound. The speaker temperature is predicted based on the detected outside air temperature and the predicted increase or decrease in speaker temperature. as well as The speaker's temperature is maintained at or below the threshold temperature based on the speaker's predicted temperature and threshold temperature.

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