Chip module housing preparation method based on pre-welding riveting and riveting equipment

Abstract

The application discloses a kind of based on before welding riveting pressure chip module shell preparation method and riveting pressure equipment, processing steps include: support middle is inserted into body;Middle holds support middle and is laterally supported;Start riveting press, the riveting needle in the upper and lower pressing plate is carried out to two cover plate and body and is riveted to two sides, and riveting position is set around the inner side of weld position, and lower cover plate, body and upper cover plate are combined to form shell prefabricated member;Remove shell prefabricated member after riveting with support middle, and remove support middle;Shell prefabricated member is friction welded around weld;Surface machining is carried out to shell prefabricated member after friction welding, to prepare chip module shell;First riveting, support middle bears riveting pressure, solve the problem that thin-walled shell is easily collapsed or deformed when being subjected to opposite riveting pressure.

Description

Technical Field

[0001] This invention relates to the technical field of die casting processing, and in particular to a method for preparing a chip module housing based on pre-welding riveting and riveting equipment. Background Technology

[0002] like Figure 1 A flat, die-cast aluminum cavity housing is shown. This housing can be a chip module housing 100, with an opening 1001 on its height side through which the chip module is inserted and packaged. The chip module housing is a critical but often overlooked component in electronic devices. It not only provides physical protection but also plays a vital role in ensuring the functional integrity and reliability of the entire module.

[0003] This type of shell is small in size, flat in shape, thin in wall, and requires high precision. It is a one-piece molded shell with a deep cavity and complex structure. The mold is very complex, the core pulling mechanism is difficult, resulting in extremely high mold costs and potentially low yield. Not to mention the difficulty in controlling the dimensional accuracy.

[0004] Therefore, this casing is formed by combining a body and two cover plates. Both the body and the cover plates are die-cast aluminum parts. The body has a frame structure, and the cover plates typically have heat dissipation protrusions on both sides, such as fins, ridges, or pillars. The body and cover plates are joined together by friction welding.

[0005] Typically, in friction welding, the cover plate and the body are fitted with a clearance fit, and the cover plate is pressed tightly against the body by the clamping plate of the fixture. However, in the actual friction welding process, relative displacement still occurs between the cover plate and the body. When the weld size is small, the relative displacement between the cover plate and the body can lead to significant defects in the friction welding process. Summary of the Invention

[0006] To address the displacement problem that easily occurs during the friction welding process in the fabrication of chip module housings, this invention provides a method and equipment for fabricating chip module housings based on pre-welding riveting, thereby improving the yield rate of chip module housings.

[0007] The technical solution adopted by the present invention to solve the above-mentioned technical problems is: a method for preparing a chip module shell based on pre-welding riveting, the processing objects including: a lower cover plate, a body and an upper cover plate;

[0008] The main body is in the shape of a rectangular frame, and both its front and back sides are provided with annular resting edges and annular convex surfaces that are hollowed out around the central rectangle.

[0009] The edges of the lower cover plate and the upper cover plate rest on the annular resting edge, and a weld bead for friction welding is formed between the outer edge and the annular convex surface of the body.

[0010] The processing steps include:

[0011] Step 1: Place the lower cover plate on the lower pressure plate of the riveting seat;

[0012] Step 2: Insert the supporting neutron into the body;

[0013] Step 3: Place the body with the supporting neutron on top of the lower cover plate;

[0014] Step 4: Place the top cover plate on the main body;

[0015] Step 5: The neutron holding member laterally supports the supporting neutron;

[0016] Step 6: Start the riveting machine. The upper and lower pressure plates of the riveting machine are closed in place. The rivets inside the upper and lower pressure plates rivet the two cover plates and the body in both directions. The riveting position is set inside the weld bead position. The lower cover plate, the body and the upper cover plate are combined to form the shell preform.

[0017] Step 7: Remove the precast housing component with the support neutron after riveting, and remove the support neutron;

[0018] Step 8: Perform friction welding on the prefabricated shell component around the weld bead;

[0019] Step 9: Perform surface machining on the prefabricated housing after friction welding to prepare the chip module housing.

[0020] The preferred technical solution adopted by the present invention to solve the above-mentioned technical problems is as follows: the four corners of the lower cover plate, the body and the upper cover plate are all rounded, and the four corner riveting points are exactly the midpoints of the arcs.

[0021] The preferred technical solution adopted by the present invention to solve the above-mentioned technical problems is: the riveting dotting depth range is 0.2±0.1mm.

[0022] The preferred technical solution adopted by the present invention to solve the above-mentioned technical problems is: the spacing range of riveting dots is 7.0±0.2mm.

[0023] The preferred technical solution adopted by the present invention to solve the above-mentioned technical problems is: a riveting device for chip module housing based on pre-welding riveting, including a worktable with slide rails, a riveting seat, a lower pressure plate, a lifting seat, an upper pressure plate, a supporting neutron and a neutron abutment assembly;

[0024] The riveting seat is slidably mounted on the slide rail and can slide horizontally into or out of the working area opposite to the lifting seat.

[0025] The lower pressure plate is positioned above the rivet base, and the upper pressure plate is positioned below the lifting base and moves up and down to achieve closing and opening with the lower pressure plate;

[0026] The supporting neutron includes a supporting body and an operating end. The supporting body is used to insert into the body of the chip module housing to be riveted to support the upper and lower cover plates. The operating end is used to realize the insertion and removal of the supporting neutron.

[0027] The neutron holding assembly includes a first cylinder and a neutron holding member. The first cylinder drives the neutron holding member to move closer to and away from the exposed side of the supporting neutron inserted into the body to position the supporting neutron.

[0028] The preferred technical solution adopted by the present invention to solve the above-mentioned technical problems is as follows: the upper surface of the lower pressure plate is provided with two positioning protrusions, a corner support, and a lateral positioning support;

[0029] The lower pressure plate includes opposing first and second sides, as well as opposing third and fourth sides;

[0030] The positioning protrusion is located on the first side of the lower pressure plate;

[0031] The corner backrest is located at the corner of the first and third sides of the lower pressure plate, and it has an oblique backrest surface facing the corner of the first and third sides.

[0032] The lateral positioning backrest is located on the fourth side of the lower pressure plate and close to the second side of the lower pressure plate, and it has a positive backrest surface facing the third side of the lower pressure plate.

[0033] The preferred technical solution adopted by the present invention to solve the above-mentioned technical problems is as follows: the supporting neutron includes a horizontal connecting arm and vertically extending supporting arms located at both ends of the horizontal connecting arm, the operating end is a protruding handle on the outside of the connecting arm, and the neutron holding member applies pressure to the outside of the connecting arm.

[0034] The preferred technical solution adopted by the present invention to solve the above-mentioned technical problems is as follows: it further includes a lateral positioning component that cooperates with the lateral positioning backing; the lateral positioning component includes a second cylinder and a lateral pressing component, and the lateral pressing component is driven by the second cylinder to move closer to or away from the lateral positioning backing to achieve abutment positioning of the chip module housing to be riveted.

[0035] The preferred technical solution adopted by the present invention to solve the above-mentioned technical problems is as follows: an outer guide buffer assembly is provided between the riveting seat and the lifting seat, and an inner guide buffer assembly is provided between the upper pressure plate and the lower pressure plate;

[0036] The external guide buffer assembly includes an annular positioning sleeve located below the lifting seat and a guide post located on the riveting seat. The guide post is mounted on the riveting seat by a damping spring.

[0037] The inner guide buffer assembly includes a positioning post located below the upper pressure plate, a positioning hole located on the upper pressure plate, and an elastic telescopic post located within the positioning hole.

[0038] The preferred technical solution adopted by the present invention to solve the above-mentioned technical problems is as follows: the lower pressure plate includes an outer substrate and an inner body; the outer substrate has a hollow portion in the middle for the inner body to extend into;

[0039] There is a height difference between the upper surface of the inlay and the upper surface of the outer substrate, forming a recessed portion, which is used to avoid the protruding structure of the lower cover plate surface;

[0040] The outer substrate has a longitudinal slot on the side facing the neutron support component, and the inlay has a longitudinal groove that matches the longitudinal slot. The longitudinal slot and the longitudinal groove together form a channel that can enter the bottom of the chip module housing to be processed.

[0041] Compared with existing technologies, the advantages of this invention are: It adopts a riveting-then-welding approach, precisely aligning the three separate parts before welding and forming a mechanical interlock through riveting. This prevents relative displacement between the parts due to thermal stress or equipment vibration during subsequent high-energy friction welding. The weld gap is fixed after riveting, providing stable and uniform process conditions for welding.

[0042] During the riveting process, the supporting neutron bears the riveting pressure, providing rigid support from the inside for the upper and lower cover plates and the main body, thus solving the problem of thin-walled shells easily collapsing or deforming under opposing riveting pressure. The neutron holding assembly is a key safeguard; through lateral support, it eliminates the fit gap between the supporting neutron and the internal cavity of the main body, preventing any micro-movement under riveting impact. This ensures the consistency of the depth and shape of each riveting point, as well as the dimensional accuracy of the entire shell intermediate.

[0043] The riveting points are located inside the weld bead, effectively creating multiple rigid constraint points near the heat source. These constraint points effectively suppress the tendency of the base material to shrink and deform due to localized high temperatures during welding. This rigid fixing strategy reduces warping and deformation after welding. Furthermore, the riveting process is rapid, pre-fixing the three parts into a single unit, facilitating transfer and clamping between welding stations and reducing pre-welding alignment adjustment time. Simultaneously, due to minimal deformation and a low scrap rate, overall production efficiency and product consistency are significantly improved. Attached Figure Description

[0044] The present invention will be further described in detail below with reference to the accompanying drawings and preferred embodiments. However, those skilled in the art will understand that these drawings are drawn only for the purpose of explaining the preferred embodiments and therefore should not be construed as limiting the scope of the invention. Furthermore, unless specifically indicated, the drawings are only schematic representations of the composition or structure of the described objects and may contain exaggerated depictions, and the drawings are not necessarily drawn to scale.

[0045] Figure 1 This is a schematic diagram of the chip module housing;

[0046] Figure 2 This is an exploded view of the chip module housing;

[0047] Figure 3 A schematic diagram of a riveting device for chip module housings based on pre-soldering riveting. Figure 1 ;

[0048] Figure 4 A schematic diagram of a riveting device for chip module housings based on pre-soldering riveting. Figure 2 ;

[0049] Figure 5 A schematic diagram of a riveting device for chip module housings based on pre-soldering riveting. Figure 3 ;

[0050] Figure 6 A schematic diagram of a riveting device for chip module housings based on pre-soldering riveting. Figure 4 ;

[0051] Figure 7 A schematic diagram supporting the neutron;

[0052] Figure 8 A schematic diagram showing the fit between the neutron and chip module housings;

[0053] Figure 9 This is a schematic diagram of the lower pressure plate in a riveting device;

[0054] Figure 10 This is an exploded view of the lower pressure plate in the riveting equipment.

[0055] Figure label:

[0056] Chip module housing 100; opening 1001; lower cover plate 1; body 2; upper cover plate 3; rectangular cutout 4; annular rest edge 5; annular convex surface 6; worktable 7 with slide rail 8; riveting seat 9; lower pressure plate 10; lifting seat 11; upper pressure plate 12; supporting neutron 13; neutron abutment assembly 14; rivet 15; support body 131; operating end 132; connecting arm 31; support arm 32; through hole 310; outer substrate 101; inlay 102; recess 17; longitudinal slot 18; longitudinal groove 19; positioning protrusion 20; corner backrest 21; lateral positioning backrest 22; oblique backrest surface 211; front backrest surface 221; lateral positioning assembly 23; second cylinder 231; lateral extrusion part 232; annular positioning sleeve 24; guide post 25 located on riveting seat 9; positioning post 26; positioning hole 27. Detailed Implementation

[0057] Preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings. Those skilled in the art will appreciate that these descriptions are merely descriptive and exemplary and should not be construed as limiting the scope of the invention.

[0058] It should be noted that similar labels in the following figures indicate similar items; therefore, once an item is defined in one figure, it will not be further defined and explained in subsequent figures.

[0059] In the description of this invention, it should be noted that the terms "upper," "lower," "front," "rear," "left," "right," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the die-cast parts of this invention are in use. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention. Similarly, "first" and "second" are only for ease of understanding and have no other directional meaning, and should not be considered as limitations on this invention.

[0060] This embodiment provides a method for manufacturing a chip module housing 100 based on pre-soldering riveting and a riveting device for the chip module housing based on pre-soldering riveting. The object processed is the chip module housing 100, such as... Figure 1-2 As shown, the chip module housing 100 includes: a lower cover plate 1, a body 2, and an upper cover plate 3.

[0061] Among them, such as Figure 2 As shown, the body 2 is a rectangular frame, with annular resting edges 5 and annular convex surfaces 6 surrounding the central rectangular cutout 4 on both its front and back sides. The edges of the lower cover plate 1 and the upper cover plate 3 rest on the annular resting edges 5, and a weld bead for friction welding is formed between the outer edges and the annular convex surfaces 6 of the body 2.

[0062] This embodiment innovatively employs a riveting pre-fixing process before welding, riveting the cover plate and the body 2 together using a riveting machine to prevent displacement during friction welding and thus prevent defects.

[0063] like Figure 3-6 As shown, a riveting device for a chip module housing based on pre-welding riveting includes a worktable 8 with a slide rail 7, a riveting seat 9, a lower pressure plate 10, a lifting seat 11, an upper pressure plate 12, a supporting neutron 13, and a neutron abutment assembly 14.

[0064] like Figure 3-6 As shown, the movable riveting base 9 is slidably mounted on the slide rail 7, and slides horizontally into or out of the working area opposite to the lifting base 11. The lower pressure plate 10 is positioned above the riveting base 9, and the upper pressure plate 12 is positioned below the lifting base 11, and can move up and down to achieve opening and closing with the lower pressure plate 10. The upper pressure plate 12 and the lower pressure plate 10 face each other, and integrate rivet pins 15 inside; when closed, they rivet the workpiece to be processed.

[0065] like Figure 2 , 3 As shown in Figure 4, when the riveting seat 9 slides out of the working area, the robot or operator can place the lower cover plate 1, the body 2, and the upper cover plate 3 to be processed onto the lower pressure plate 10, and insert the support neutron 13 into the body 2. Then, after the riveting seat 9 slides into the working area to complete the riveting, the riveting seat 9 slides out of the working area again, which facilitates loading and unloading and improves the degree of automation.

[0066] like Figure 7-8 As shown, the support neutron 13 includes a support body 131 and an operating end 132. The support body 131 is used to insert into the body 2 of the chip module housing to be riveted to support the upper and lower cover plates. The operating end 132 is used to realize the insertion and removal of the support neutron 13.

[0067] And such Figure 4 As shown, the neutron holding assembly 14 includes a first cylinder 141 and a neutron pressing member 142. The first cylinder 141 drives the neutron pressing member 142 to approach and move away from the exposed side of the supporting neutron 13 inserted into the body 2. Before riveting, it presses the supporting neutron 13 from the side to prevent it from shifting during the riveting process, so as to position the supporting neutron 13.

[0068] Based on this equipment, the processing steps of a method for fabricating a chip module housing based on pre-soldering riveting include:

[0069] Step 1: Place the lower cover plate 1 on the lower pressure plate 10 of the rivet seat 9.

[0070] Step 2: Insert the support neutron 13 into the body 2.

[0071] Step 3: Place the main body 2 with the supporting neutron 13 on top of the lower cover plate 1.

[0072] Step 4: Place the top cover 3 on the main body 2.

[0073] Step 5: Neutron holding member 142 laterally supports neutron 13.

[0074] Step Six: Start the riveting machine. The upper pressure plate 12 and lower pressure plate 10 of the riveting machine are closed in place. The rivet pins inside the upper pressure plate 12 and lower pressure plate 10 act simultaneously against the upper and lower cover plates and the body 2, riveting them together on the inner side around the weld bead position. This step firmly combines the three into a single prefabricated shell component.

[0075] Step 7: Remove the prefabricated shell component with support neutron 13 after riveting, and remove support neutron 13.

[0076] Step 8: Perform friction welding on the precast shell components around the weld bead.

[0077] Step 9: Perform surface machining on the prefabricated housing after friction welding to obtain the final dimensions and surface finish, thereby preparing the chip module housing.

[0078] In this processing method that employs a riveting-then-welding approach, the three separate parts are precisely aligned and mechanically interlocked by riveting before welding. This prevents relative displacement between the parts due to thermal stress or equipment vibration during subsequent high-energy friction welding. The weld gap is fixed after riveting, providing stable and uniform process conditions for welding.

[0079] During the riveting process, the lower cover plate 1 is placed on the lower pressure plate 10 of the riveting equipment. A specially designed support neutron 13 is inserted into the internal cavity of the body 2. The body 2 assembly with the support neutron 13 is then placed on the lower cover plate 1. Finally, the upper cover plate 3 is closed. The support neutron 13 bears the riveting pressure during the riveting process. At this time, the support neutron 13 provides rigid support for the upper and lower cover plates and the body 2 from the inside. The support neutron 13 solves the problem of thin-walled shells being prone to collapse or deformation under opposing riveting pressure. The neutron holding assembly 14 is the key guarantee. Through lateral support, it eliminates the fitting gap between the support neutron 13 and the internal cavity of the body 2, so that it will not make any micro-movement under the riveting impact, thereby ensuring the consistency of the depth and shape of each riveting point and the dimensional accuracy of the entire shell intermediate body.

[0080] The riveting points are located inside the weld bead, effectively creating multiple rigid constraint points near the heat source. These constraint points effectively suppress the shrinkage and deformation of the base material caused by localized high temperatures during welding. This rigid fixing strategy reduces warping and deformation after welding. Furthermore, the riveting process is rapid, pre-fixing the three parts into a single unit, facilitating transfer and clamping between welding stations and reducing pre-welding alignment adjustment time. Simultaneously, due to minimal deformation and a low scrap rate, overall production efficiency and product consistency are significantly improved.

[0081] like Figure 1-2 As shown, the four corners of the lower cover plate 1, the body 2, and the upper cover plate 3 are all rounded. Preferably, in this embodiment, instead of multiple rivet points on each rounded corner, only one rivet point is set at the midpoint of the arc that best balances the force on the rounded corner. It should be understood that the rounded corners of a rectangular shell are areas where stress deformation is most likely to concentrate. If multiple or improperly positioned rivet points are set on the rounded corners, new sources of stress concentration may be introduced. Precisely setting the rivet point at the midpoint of the arc is equivalent to applying a constraint on the axis of symmetry of the rounded corner. This position can most effectively balance the stress from the two adjacent right-angled sides, allowing the constraint force to be evenly transmitted, thereby maximizing the suppression of torsional deformation of the rounded corner during the welding process. This one-point-to-center strategy achieves optimal rounded corner stability control with the fewest rivet points.

[0082] Preferably, the riveting depth range is 0.2 ± 0.1 mm. If the depth is too shallow, the mechanical interlocking force formed by the riveting will be insufficient, failing to effectively secure the parts under the strong impact and thermal stress of subsequent welding, potentially leading to riveting failure. If the depth is too deep, it may cause excessive material deformation, resulting in microcracks, or excessive thinning of the upper and lower cover plates, weakening their structural strength, or even creating protrusions on the back of the riveting point, affecting the flatness of the inner cavity of the housing and potentially interfering with the installation of internal chips. A depth range of 0.2 mm ± 0.1 mm provides sufficient plastic deformation for a secure connection while ensuring that the part body 2 is not damaged.

[0083] The spacing between rivet points is a key parameter determining the uniformity of the constraint effect. If the spacing is too large, a weak constraint zone will form between two rivet points, making this area prone to warping or fluctuations during welding, thus compromising the straightness of the weld bead. If the spacing is too small, it results in over-constraint, which not only reduces production efficiency but also causes localized material hardening due to dense rivet points, potentially increasing the risk of welding deformation due to cumulative heat input. In this embodiment, the preferred rivet point spacing range is 7.0 ± 0.2 mm. This creates a continuous and uniform constraint field throughout the entire weld bead, ensuring highly consistent stability at all points along the welding path.

[0084] In this embodiment, the supporting neutron 13 plays a crucial role, therefore its structural design is also key to its effectiveness. Preferably, in this embodiment, as... Figure 7 As shown, the supporting neutron 13 includes a transverse connecting arm 31 and vertically extending supporting arms 32 located at both ends of the transverse connecting arm 31. The operating end 132 is a protruding handle on the outside of the connecting arm 31. The neutron holding member 142 presses against the outside of the connecting arm 31.

[0085] Generally, the inner cavity of the chip module housing is a cavity with the same width as the side opening, which facilitates the installation of chips of the same width. Therefore, in this embodiment, the support arms 32 are set on both sides to maximize support and also have a certain degree of freedom in width adjustment, so as to prevent the support neutron 13 from not being able to fit into the body 2. The connecting arm 31 not only ensures the overall rigidity, but also provides support to one side of the housing during riveting.

[0086] The protruding handle-type operating end 132 facilitates gripping by a robotic arm or operator, enabling quick insertion and removal. The width of the operating end 132 is smaller than the width of the connecting arm 31, thus the outer surface of the connecting arm 31 has a surface for the neutron holding member 142 to abut against, ensuring uniform and stable holding force.

[0087] Preferably, the device has a pair of neutron-holding components 14, which are symmetrically arranged on both sides of the convex handle-type operating end 132 to maintain force balance.

[0088] More preferably, such as Figure 7 As shown, the convex handle type operating end 132 is provided with a through hole 310, which facilitates the application of force by the tool or the installation of the fixture, thereby further facilitating the placement and removal of the support neutron 13.

[0089] like Figure 3 , 9 As shown, the lower pressure plate 10 includes an outer substrate 101 and an inner body 102. The outer substrate 101 has a hollow portion in the middle for the inner body 102 to extend into. There is a height difference between the upper surface of the inner body 102 and the upper surface of the outer substrate 101, forming a recess 17. The recess 17 is specifically designed to avoid any protruding structures that may exist on the back of the lower cover plate 1, ensuring that the lower cover plate 1 can be flat against the positioning surface without affecting positioning accuracy.

[0090] like Figure 9-10 As shown, the outer substrate 101 has a longitudinal slot 18 on the side facing the neutron support assembly 14, and the inner body 102 has a longitudinal groove 19 that matches the longitudinal slot 18. The longitudinal slot 18 and the longitudinal groove 19 together form a channel that can enter the bottom of the chip module housing to be processed, realizing the non-destructive separation of the workpiece from the equipment and solving the problem of difficult part removal caused by structural interference.

[0091] like Figure 3As shown, the upper surface of the lower pressure plate 10 is provided with two positioning protrusions 20, a corner abutment 21, and a lateral positioning abutment 22. The lower pressure plate 10 includes a first side and a second side opposite to each other, as well as a third side and a fourth side opposite to each other. The positioning protrusions 20 are located on the first side of the lower pressure plate 10. The corner abutment 21 is located at the corner between the first side and the third side of the lower pressure plate 10, and it has an oblique abutment surface 211 facing the corner of the first side and the third side. The lateral positioning abutment 22 is located on the fourth side of the lower pressure plate 10 and close to the second side of the lower pressure plate 10, and it has a positive abutment surface 221 facing the third side of the lower pressure plate 10.

[0092] In this embodiment, the lower cover plate 1 is initially positioned by the recess 17, and the two positioning protrusions 20 are high enough to limit the body 2 in one direction. Then, one corner of the body 2 contacts the inclined backing surface 211 of the corner backing 21, and combined with the limiting effect of the positioning protrusions 20, the corner backing 21 limits the body 2 in another direction.

[0093] Furthermore, such as Figure 3-6 As shown, the device also includes a lateral positioning assembly 23 that cooperates with the lateral positioning support 22. The lateral positioning assembly 23 includes a second cylinder 231 and a lateral pressing member 232. The second cylinder 231 drives the lateral pressing member 232 to move closer to and further away from the lateral positioning support 22 to achieve abutment positioning of the chip module housing to be riveted. By applying a thrust to the lateral positioning support 22 on the opposite side, the workpiece is pressed tightly against the corner support 21, thereby eliminating the translational degree of freedom in this direction, and simultaneously eliminating the rotational degree of freedom. Combined with the structural constraints imposed by the neutron support assembly 14, the entire workpiece's degree of freedom is restricted during the riveting process, resulting in stronger support tolerance and more reliable positioning.

[0094] In this embodiment, the lateral positioning component 23 and the neutron holding component 14 are driven by cylinders to automatically perform positioning and clamping actions after the workpiece is placed, ensuring that the force and position of each positioning are completely consistent, avoiding the randomness of manual placement, greatly improving the consistency of production cycle and positioning accuracy, and is a key link in realizing automated production.

[0095] like Figure 3-6 As shown, preferably, an outer guide buffer assembly is provided between the rivet seat 9 and the lifting seat 11, and an inner guide buffer assembly is provided between the upper pressure plate 12 and the lower pressure plate 10.

[0096] The outer guide buffer assembly includes an annular positioning sleeve 24 located below the lifting seat 11 and a guide post 25 located on the riveting seat 9. The guide post 25 is mounted on the riveting seat 9 by a damping spring. The inner guide buffer assembly includes a positioning post 26 located below the upper pressure plate 12, a positioning hole 27 located on the upper pressure plate 12, and an elastic telescopic post located in the positioning hole.

[0097] The outer guide assembly begins contact and guidance in the initial stage of the pressure plate closure. Its damping spring absorbs the enormous closing impact force, preventing damage to the equipment from hard collisions, while ensuring macroscopic alignment of the upper and lower die bases during large strokes. The inner guide assembly functions in the final stage before the rivet pins contact the workpiece, providing fine guidance to ensure precise alignment of the upper and lower rivet pins. The elastic telescopic column within it acts as a final buffer and compensation, accommodating minute thickness tolerances of the parts and preventing rivet pin wear, breakage, or abnormal workpiece indentation caused by misalignment or over-alignment. These two systems together ensure a smooth, precise, and reliable riveting process.

[0098] This article uses specific examples to describe the preparation method and riveting equipment of a chip module housing based on pre-soldering riveting provided by the present invention. The above description of the embodiments is only for the purpose of helping to understand the present invention and its core ideas. It should be noted that for those skilled in the art, several improvements and modifications can be made to the present invention without departing from the principle of the present invention, and these improvements and modifications also fall within the protection scope of the claims of the present invention.

Claims

1. A method for preparing a chip module shell based on pre-welding riveting, characterized in that: the processing object comprises a lower cover plate, a body and an upper cover plate; the body is a rectangular frame, and both sides of the square are provided with a ring-shaped resting along and a ring-shaped convex surface around the middle rectangular hollow; the edges of the lower cover plate and the upper cover plate are rested on the ring-shaped resting along, and the outer edge and the ring-shaped convex surface of the body form a weld for friction welding; the processing steps comprise: Step 1: placing the lower cover plate on the lower pressing plate of the riveting seat; Step 2: inserting the support nucleus into the body; Step 3: placing the body with the support nucleus above the lower cover plate; Step 4: placing the upper cover plate on the body; Step 5: laterally supporting the support nucleus with the nucleus pressing member; Step 6: starting the riveting machine, the upper pressing plate and the lower pressing plate of the riveting machine are closed in place, the riveting needle inside the upper pressing plate and the lower pressing plate is opposite to the two cover plates and the body for positive and negative two surface riveting, the riveting position is set inside the weld position, and the lower cover plate, the body and the upper cover plate are combined to form a shell preform; Step 7: taking down the shell preform with the support nucleus after riveting and removing the support nucleus; Step 8: friction welding the shell preform around the weld; Step 9: surface machining the shell preform after friction welding to prepare a chip module shell.

2. The method for preparing a chip module shell based on pre-welding riveting according to claim 1, characterized in that: the four corners of the lower cover plate, the body and the upper cover plate are all round corners, and the riveting points of the four corners have and only have the midpoints of the arcs.

3. The method for preparing a chip module shell based on pre-welding riveting according to claim 1, characterized in that: the riveting dotting depth range is 0.2±0.1mm.

4. The method for preparing a chip module shell based on pre-welding riveting according to claim 1, characterized in that: the riveting dotting interval range is 7.0±0.2mm.

5. A riveting equipment for a chip module shell based on pre-welding riveting, which is used for the method for preparing a chip module shell based on pre-welding riveting according to claim 1, characterized in that: it comprises a workbench provided with a sliding rail, a riveting seat, a lower pressing plate, a lifting seat, an upper pressing plate, a support nucleus and a nucleus resisting assembly; the riveting seat is slidably arranged on the sliding rail and enters or leaves the working area opposite to the lifting seat by horizontal sliding; the lower pressing plate is arranged above the riveting seat, and the upper pressing plate is arranged below the lifting seat and moves up and down to realize the closing and opening of the lower pressing plate; the support nucleus comprises a support body and an operating end, the support body is used for inserting into the body of the chip module shell to be riveted to support the upper cover plate and the lower cover plate, and the operating end is used for realizing the insertion and removal of the support nucleus; the nucleus resisting assembly comprises a first air cylinder and a nucleus pressing member, and the first air cylinder drives the nucleus pressing member to approach or move away from the side exposed part of the support nucleus inserted into the body to realize the positioning of the support nucleus.

6. The riveting equipment for a chip module shell based on pre-welding riveting according to claim 5, characterized in that: ​ The upper surface of the lower pressing plate is provided with two positioning convex columns, an angle abutment and a lateral positioning abutment. The lower pressing plate comprises opposite first and second sides, and opposite third and fourth sides. The positioning convex columns are located on the first side of the lower pressing plate. The angle abutment is located at the corner of the first and third sides of the lower pressing plate, and has an oblique abutment surface facing the corner of the first and third sides. The lateral positioning abutment is located on the fourth side of the lower pressing plate and close to the second side of the lower pressing plate, and has a positive abutment surface facing the third side of the lower pressing plate.

7. The riveting device for the chip module shell based on pre-welding riveting according to claim 5, characterized in that: The support sub comprises a transverse connecting arm and vertical extension support arms located at both ends of the transverse connecting arm, the operating end is a lug outside the connecting arm, and the sub-pressing member is extruded on the outside of the connecting arm.

8. The riveting device for the chip module shell based on pre-welding riveting according to claim 6, characterized in that: It further comprises a lateral positioning assembly matched with the lateral positioning abutment; the lateral positioning assembly comprises a second air cylinder and a lateral extruding member, and the lateral extruding member is driven by the second air cylinder to approach and move away from the lateral positioning abutment to realize abutting positioning of the chip module shell to be riveted.

9. The riveting device for the chip module shell based on pre-welding riveting according to claim 5, characterized in that: An outer guiding and buffering assembly is arranged between the riveting seat and the lifting seat, and an inner guiding and buffering assembly is arranged between the upper pressing plate and the lower pressing plate; The outer guiding and buffering assembly comprises a ring-shaped positioning sleeve located below the lifting seat and a guiding column located on the riveting seat, and the guiding column is arranged on the riveting seat through a damping spring; The inner guiding and buffering assembly comprises a positioning column located below the upper pressing plate, a positioning hole located on the lower pressing plate, and an elastic telescopic column located in the positioning hole.

10. The riveting device for the chip module shell based on pre-welding riveting according to claim 5, characterized in that: The lower pressing plate comprises an outer base plate and an inner embedded body; the middle of the outer base plate is provided with a hollow part for the inner embedded body to extend into; The upper surface of the inner embedded body and the upper surface of the outer base plate have a difference to form a recessed part for avoiding the protruding structure on the surface of the lower cover plate; One side of the outer base plate facing the sub-pressing assembly is provided with a longitudinal notch, and the inner embedded body is provided with a longitudinal groove matched with the longitudinal notch, and the longitudinal notch and the longitudinal groove jointly form a channel accessible to the bottom of the chip module shell to be processed.

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