Insulation board as well as raw material composition, preparation method and application thereof

Abstract

The invention provides an insulation board and a raw material composition, a preparation method and application thereof. The insulation board raw material composition comprises a first component and a second component, the first component comprises polyol and isocyanate, and the second component comprises siliceous hollow microspheres, a siliceous substance and a calcareous substance; the calcium substance comprises calcium oxide and / or calcium hydroxide; the content of the siliceous hollow microbeads is 30%-90%; the particle size of the siliceous hollow microbeads is 10 to 150 meshes; the mass ratio of the first component to the second component is (2-18): (82-98). The insulation board prepared from the insulation board raw material composition meets the requirement of light weight, has excellent thermal insulation performance, fireproof performance and physical strength (compression strength and tensile strength), and has excellent comprehensive performance; in addition, the durability of the obtained insulation board is good.

Description

Technical Field

[0001] This invention relates to an insulation board, its raw material composition, preparation method, and application. Background Technology

[0002] With the continuous improvement of building energy efficiency standards and increasingly stringent fire safety requirements, higher demands are being placed on the performance of thermal insulation materials. While traditional polyurethane insulation boards possess excellent thermal insulation properties, their fire resistance remains insufficient, making it difficult to meet the fire safety requirements of some special scenarios. Currently, existing technologies for improving the flame-retardant properties of polyurethane insulation boards mainly employ the following methods:

[0003] (1) Adding flame retardants: Common flame retardants include halogenated flame retardants, phosphorus-based flame retardants, and inorganic flame retardants. Although halogenated flame retardants can effectively improve the flame retardant properties of polyurethane, they produce a large amount of toxic fumes and corrosive gases during combustion, which are harmful to the environment and human health. Phosphorus-based flame retardants have relatively good flame retardant effects and are non-toxic or low-toxic, but they have certain limitations in improving the oxygen index of polyurethane. Inorganic flame retardants such as aluminum hydroxide and magnesium hydroxide have good smoke suppression properties and environmental friendliness, but when added in large quantities, they will cause a decrease in the physical properties of polyurethane materials.

[0004] (2) Using inorganic insulation materials combined with polyurethane: For example, polyurethane can be combined with inorganic insulation materials such as rock wool and glass wool to improve its fire resistance. However, this method of combination will affect the insulation performance and construction convenience of the materials to a certain extent, and the cost is relatively high.

[0005] (3) Structural modification of polyurethane: By introducing flame-retardant elements such as phosphorus and silicon or rigid structures into the polyurethane molecular chain, its flame-retardant properties can be improved. However, this method has high requirements for the synthesis process and may affect other properties of polyurethane.

[0006] Therefore, existing polyurethane insulation boards either have poor thermal insulation performance, poor mechanical strength, fail to meet the requirements for lightweighting, or have poor fire resistance, and cannot simultaneously achieve the above-mentioned performance. Summary of the Invention

[0007] The technical problem to be solved by the present invention is to overcome the shortcomings of existing polyurethane insulation boards in that they cannot simultaneously achieve excellent thermal insulation performance, mechanical strength, lightweight and excellent fire resistance, and to provide an insulation board, its raw material composition, preparation method and application.

[0008] The present invention solves the above-mentioned technical problems through the following technical solution:

[0009] This invention provides a thermal insulation board raw material composition comprising a first component and a second component. The first component comprises a polyol and an isocyanate, and the second component comprises silica hollow microspheres, silica materials, and calcium materials; the calcium materials comprise calcium oxide and / or calcium hydroxide.

[0010] The content of the hollow silica microspheres is 30%-90%, and the percentage is the mass percentage of the hollow silica microspheres in the second component; the particle size of the hollow silica microspheres is 10-150 mesh.

[0011] The mass ratio of the first component to the second component is (2-18):(82-98).

[0012] In this invention, the first component forms a polyurethane matrix, while the silica and calcium compounds in the second component undergo a chemical reaction under certain temperature and pressure to generate inorganic cementitious substances such as calcium silicate. These inorganic cementitious substances fill the voids in the polyurethane matrix formed by the silica hollow microspheres and the first component, forming a dense inorganic cementitious structure. The polyurethane matrix, the inorganic cementitious structure, and the silica hollow microspheres work synergistically, as specifically: ① The three-dimensional network structure of the polyurethane matrix provides the insulation board with good elasticity and toughness, buffering the stress caused by external mechanical impacts and temperature changes; ② The inorganic cementitious structure fills the space between the polyurethane matrix and the silica hollow microspheres, enhancing the integrity and strength of the insulation board and improving its fire resistance and durability; ③ The silica hollow microspheres act as lightweight aggregate, reducing the density of the insulation board, which is beneficial for achieving lightweight requirements and improving insulation performance. Simultaneously, their high strength and fire resistance provide good support and fire protection for the insulation board. This synergistic effect significantly improves the performance of the resulting insulation board in terms of insulation, fire resistance, strength, and other aspects.

[0013] In this invention, the second component is an inorganic filler, such as biomass materials, polymer fibers, etc., which are not within the scope of the "second component" of this invention. Preferably, the content of the second component is 82%-98%, more preferably 85%-98%, for example 82.5%, 92%, or 95%, where the percentage is the mass percentage of the second component in the insulation board raw material composition.

[0014] In this invention, the mass ratio of the silica hollow microspheres, silica and calcium in the second component is preferably (30-90):(5-45):(5-45), for example 50:5:45, 50:35:15, 80:8:12, 80:10:10 or 50:45:5.

[0015] In this invention, the hollow silicon microspheres can be spheres with open surfaces and several independent cavities, which are conventionally used in the art and have silicon dioxide as the main component. The silicon dioxide content is more than 70%, and the percentage is the mass percentage of silicon dioxide in the hollow silicon microspheres.

[0016] In this invention, the tap density of the silicon hollow microspheres is preferably 190-400 kg / m³. 3 .

[0017] In this invention, the bulk density of the silicon hollow microspheres is preferably 140-330 kg / m³. 3 The bulk density is also known as the "volume density".

[0018] In some embodiments, the silicon hollow microspheres have a particle size of 10 mesh and a tap density of 190 kg / m³. 3 The bulk density is 140 kg / m³ 3 .

[0019] In some embodiments, the silica hollow microspheres have a particle size of 150 mesh and a tap density of 400 kg / m³. 3 The bulk density is 330 kg / m³ 3 .

[0020] In some embodiments, the particle size of the hollow silica microspheres is between 10 and 150 mesh, and the hollow silica microspheres satisfy the following condition: tap density of 190-400 kg / m³. 3 The bulk density is between 140-330 kg / m³. 3 between.

[0021] In this invention, the content of the silica hollow microspheres in the second component is preferably 50%-80%, for example, 55%, 60%, 65%, 70% or 75%.

[0022] In this invention, the silicon material refers to the material containing active silicon dioxide that is conventionally used in the art.

[0023] Preferably, the siliceous material includes one or more of the following: silica fume, microsilica powder, slag powder, fly ash, quartz powder, kaolin, bentonite, water glass, and diatomaceous earth. Any conventional siliceous material that can provide silicon element capable of reacting with calcium oxide and / or calcium hydroxide can be used in this invention.

[0024] In this invention, the content of the silicon material in the second component is preferably 5%-45%, for example 8%, 10%, 15%, 20%, 25%, 30%, 35% or 40%, where the percentage is the mass percentage of the silicon material in the second component.

[0025] In this invention, the content of calcium in the second component is preferably 5%-45%, for example 8%, 10%, 12%, 15%, 20%, 25%, 30%, 35% or 40%, where the percentage is the mass percentage of calcium in the second component.

[0026] In this invention, the mass ratio of the silica and the calcium in the second component is preferably (1-9):(1-9), for example, 8:2, 7:3, 6:4, 5:5, 4:6, 3:7 or 2:8.

[0027] In this invention, the preferred mass ratio of the first component to the second component is (5-18):(82-95), for example, 8:92, 10:90, 15:85 or 17.5:82.5.

[0028] In this invention, the content of the first component is preferably 2%-18%, more preferably 2%-15%, for example 5%, 8% or 17.5%, and the percentage is the mass percentage of the first component in the insulation board raw material composition.

[0029] In this invention, the polyol and the isocyanate in the first component do not come into contact before use.

[0030] In this invention, the mass ratio of the polyol to the isocyanate in the first component is preferably 1:(1-2), for example, 1:1.1, 1:1.5 or 1:1.8.

[0031] In this invention, the polyol can be a raw material conventionally used in the art for synthesizing polyurethane, preferably including polyether polyol and / or polyester polyol.

[0032] In this invention, the content of the polyol is preferably 35%-47%, for example 39%, 40%, 44% or 46%, where the percentage is the mass percentage of the polyol to the first component.

[0033] In this invention, the isocyanate can be a raw material conventionally used in the art for the synthesis of polyurethane, preferably including toluene diisocyanate and / or polymethylene polyphenyl isocyanate.

[0034] In this invention, the content of the isocyanate is preferably 51%-63%, for example 55%, 57%, 59% or 60%, where the percentage is the mass percentage of the isocyanate in the first component.

[0035] In this invention, the first component may further include additives. The additives may be those conventionally used in the preparation of polyurethane in the art, preferably including one or more of water, foaming agents, catalysts, foam stabilizers, surfactants, antioxidants, anti-aging agents, antifungal agents, toughening agents, and flame retardants.

[0036] The content of the auxiliary agent is preferably 0.5%-5%, and the percentage is the mass percentage of the auxiliary agent to the polyol.

[0037] The catalyst is preferably one or more of organic amine catalysts, metal salt catalysts, and metal alkyl compound catalysts.

[0038] In some embodiments, the organic amine catalyst includes one or more of triethanolamine (TEA), triethylenediamine (TEDA or DABCO) and its derivatives, bis(dimethylaminoethyl) ether (BDMAEE), N-methylmorpholine (NMM), N,N,N',N'-tetramethyl-1,4-butanediamine (TMBDA), 2,4,6-tris(dimethylaminomethyl)phenol, N,N-dimethylcyclohexylamine (DMCHA), N,N-dimethylbenzylamine (BDMA), a mixture of pentamethyldiethylenetriamine and dimethylcyclohexylamine, tris(dimethylaminopropyl)amine, and potassium acetate ethylene glycol solution. The commercial model of the 2,4,6-tris(dimethylaminomethyl)phenol is, for example, DMP-30; the commercial model of the "compound mixture of pentamethyldiethylenetriamine and dimethylcyclohexylamine" is, for example, Polycat 5 or Polycat 8; the commercial model of the tris(dimethylaminopropyl)amine is, for example, JeffcatTAP; the commercial model of the triethylenediamine derivative is, for example, DABCO 33LV; and the commercial model of the potassium acetate ethylene glycol solution is, for example, PC-46.

[0039] In some embodiments, the metal salt catalyst includes one or more of stannous octoate, potassium octoate, potassium acetate ethylene glycol, potassium neodecanoate, bismuth isooctanoate, bismuth neodecanoate, zinc isooctanoate, and zinc octoate. The commercial model of stannous octoate is, for example, DABCO T-9; the commercial model of potassium octoate is, for example, DABCO K-15; the commercial model of potassium acetate ethylene glycol is, for example, Polycat 46; the commercial model of potassium neodecanoate is, for example, MYK-10; the commercial model of bismuth isooctanoate is, for example, DY-20; the commercial model of bismuth neodecanoate is, for example, Borchi Kat 315; the commercial model of zinc isooctanoate is, for example, MYZN-9 or MYZN-18; and the commercial model of zinc octoate is, for example, Coscat Z-22.

[0040] In some embodiments, the metal alkyl compound catalyst includes one or more of the following: dibutyltin dilaurate, stannous octoate, dibutyltin thiolate, bismuth isooctanoate, bismuth neodecanoate, zinc isooctanoate, tetrabutyl titanate, potassium acetate ethylene glycol, and potassium octanoate. The commercially available models of the dibutyltin dilaurate are, for example, T-12 or Dabco T-12; the commercially available models of the stannous octoate are, for example, T-9 or Dabco T-9; the commercially available models of the dibutyltin thiolate are, for example, T-120 or Dabco 120; and the commercially available models of the tetrabutyl titanate are, for example, TBT or TYZOR TnBT.

[0041] The catalyst content is preferably 0.1%-4%, where the percentage is the mass percentage of the catalyst to the polyol.

[0042] The foaming agent is preferably one or more of HCFC-141b, HFC-245fa, HFC-365mfc, HFO-1233zd, HFO-1336mzz, pentane compounds, water, and carbon dioxide. The pentane compounds refer to alkane compounds containing five carbon atoms, such as cyclopentane or n-pentane.

[0043] The foaming agent content is preferably 0.5%-5%, where the percentage is the mass percentage of the foaming agent to the polyol.

[0044] The foam stabilizer may be a foam stabilizer commonly used in the art.

[0045] The surfactant may be a surfactant commonly used in the art.

[0046] The antioxidant may be any antioxidant commonly used in the art.

[0047] The antioxidant may be any antioxidant commonly used in the art.

[0048] The antifungal agent may be a conventional antifungal agent used in the art.

[0049] The toughening agent may be a toughening agent conventionally used in the art.

[0050] The flame retardant may be a flame retardant conventionally used in the art.

[0051] This invention provides a method for preparing a thermal insulation board, which uses the thermal insulation board raw material composition described above. The preparation method includes the following steps:

[0052] The raw materials of the insulation board raw material composition are mixed to obtain a mixture, which is then foamed to obtain an insulation board.

[0053] In this invention, the foaming temperature can be the foaming temperature conventionally used in the preparation of polyurethane insulation boards in the art, preferably 50-100℃, for example 55±5℃, 65±5℃, 75±5℃, 85±5℃ or 95±5℃.

[0054] In this invention, the foaming process typically takes place within the cavity of a mold. The cavity of the mold serves to confine the foaming process.

[0055] In some embodiments, the method for mixing the raw materials of the insulation board raw material composition includes the following steps: premixing the raw materials of the first component to obtain a first mixture, premixing the raw materials of the second component to obtain a second mixture; and then mixing the first mixture and the second mixture to obtain the final product.

[0056] In some embodiments, the method for mixing the raw materials of the insulation board raw material composition includes the following steps: premixing the raw materials of the first component to obtain a first mixture, premixing the silica and calcium substances in the second component to obtain a second mixture; then mixing the first mixture and the second mixture, and finally adding the silica hollow microspheres in the second component for mixing, thereby obtaining the final product.

[0057] In some embodiments, the method for mixing the raw materials of the insulation board raw material composition includes the following steps: premixing the raw materials of the first component to obtain a first mixture; and sequentially adding the silica, calcium and silica hollow microspheres of the second component to the first mixture and mixing them to obtain the final product.

[0058] In this invention, any one of the three methods for mixing the raw materials of the insulation board raw material composition described above is acceptable.

[0059] The present invention also provides an insulation board, which is prepared by the insulation board preparation method described above.

[0060] The present invention also provides an insulation board comprising a polyurethane matrix, calcium silicate, and hollow silica microspheres, wherein the hollow silica microspheres are dispersed in the polyurethane matrix, and the calcium silicate fills the space between the polyurethane matrix and the hollow silica microspheres.

[0061] In this invention, the insulation board may further include unreacted silica and calcium compounds. The silica and calcium compounds are as described above.

[0062] In this invention, the insulation board may further include byproducts from the reaction of silica and calcium compounds. The silica and calcium compounds are as described above.

[0063] In this invention, the insulation board may also include unavoidable impurities.

[0064] In this invention, the content of the polyurethane matrix is ​​preferably 2%-18%, where the percentage is the mass percentage of the polyurethane matrix in the insulation board.

[0065] In this invention, the polyurethane matrix can be obtained by polymerizing polyols and isocyanates. The polyols and isocyanates are as described above.

[0066] In this invention, the content of the hollow silicon microspheres is preferably 25%-80%, and the percentage is the mass percentage of the hollow silicon microspheres in the insulation board.

[0067] In this invention, the hollow silicon microspheres are as described above.

[0068] In this invention, the content of calcium silicate is preferably 8%-60%, where the percentage is the mass percentage of calcium silicate in the insulation board.

[0069] In this invention, the calcium silicate may be an inorganic compound composed of calcium, silicon and oxygen, and may include calcium orthosilicate (CaSiO3) and / or dicalcium silicate (Ca2SiO4).

[0070] In this invention, the inorganic gel structure can be obtained by reacting silica and calcium compounds.

[0071] In this invention, the dry density of the insulation board can be 190 kg / m³. 3 The preferred values ​​are 100-190 kg / m³. 3 The preferred value is 103-147 kg / m³. 3 For example, 115 kg / m 3 116 kg / m 3 120 kg / m 3 122 kg / m 3 123 kg / m 3 128 kg / m 3 132 kg / m 3 142 kg / m 3 146 kg / m 3 147 kg / m 3 163 kg / m 3 182 kg / m 3 Or 188 kg / m 3 .

[0072] In this invention, the thermal conductivity of the insulation board can be below 0.040 W / (m∙K), preferably 0.020-0.040 W / (m∙K), and more preferably 0.024-0.035 W / (m∙K), for example 0.025 W / (m∙K), 0.0256 W / (m∙K), 0.026 W / (m∙K), 0.0263 W / (m∙K), 0.0268 W / (m∙K), 0.028 W / (m∙K), 0.031 W / (m∙K), 0.033 W / (m∙K), 0.038 W / (m∙K), or 0.039 W / (m∙K).

[0073] In this invention, the tensile strength of the insulation board can be 0.20 MPa or higher, preferably 0.20-0.33 MPa, for example 0.21 MPa, 0.22 MPa, 0.23 MPa, 0.24 MPa, 0.25 MPa, 0.26 MPa, 0.27 MPa, 0.28 MPa, or 0.31 MPa. The tensile strength refers to the tensile strength perpendicular to the plane of the insulation board, that is, the tensile strength perpendicular to the board surface.

[0074] In this invention, the compressive strength of the insulation board can be above 0.30 MPa, preferably 0.30-0.52 MPa, for example 0.32 MPa, 0.34 MPa, 0.36 MPa, 0.35 MPa, 0.352 MPa, 0.37 MPa, 0.375 MPa, 0.39 MPa, 0.43 MPa or 0.46 MPa.

[0075] In this invention, the fire resistance rating of the insulation board may be no lower than Class A, for example, Class A2.

[0076] The present invention also provides an application of the insulation board in building structures.

[0077] In this invention, the building structure can be a conventional building structure in the art, and generally may include exterior walls, interior walls, beams, columns, floor slabs or roofs.

[0078] The positive and progressive effects of this invention are as follows:

[0079] The insulation board obtained from the insulation board raw material composition of the present invention meets the requirements of lightweighting and has excellent thermal insulation performance, fire resistance, physical strength, and overall superior performance. Specifically:

[0080] (1) Good thermal insulation performance: The large number of tiny bubbles formed by polyurethane foam effectively prevent the transfer of heat. At the same time, the low thermal conductivity of the silica hollow microspheres further enhances the thermal insulation effect, enabling the insulation board to effectively reduce the energy consumption of the building.

[0081] (2) Excellent fire resistance: The inorganic cementitious structure formed by the inorganic materials in the second component at high temperature has good fire resistance, which can effectively delay the spread of fire and improve the fire safety of the building.

[0082] (3) High physical strength: The synergistic effect of calcium silicate obtained by the reaction of silica hollow microspheres with silica and calcium substances, as well as the three-dimensional network structure of polyurethane matrix, together give the insulation board high compressive strength, tensile strength and bending strength, which can withstand its own weight and external loads, and ensure the stability of the insulation system.

[0083] In addition, the resulting insulation board has strong durability. Specifically, the addition of silica hollow microspheres as an inorganic filler, compared with other traditional inorganic fillers, further improves the weather resistance, aging resistance and chemical corrosion resistance of the insulation board, and extends the service life of the insulation board and the insulation system.

[0084] Furthermore, the preparation method of the present invention is simple, easy to operate, and easy to industrialize, and can produce fireproof polyurethane insulation boards with stable quality and reliable performance to meet the needs of different building insulation projects. Detailed Implementation

[0085] The present invention will be further illustrated by way of embodiments below, but the present invention is not limited to the scope of the embodiments described herein.

[0086] In the following examples and comparative examples, the sources of the relevant raw materials and reagents are as follows:

[0087] The polyol used is a PUR polyester polyol, purchased from Asahikawa Chemical (Suzhou) Co., Ltd.; where PUR refers to polyurethane.

[0088] The isocyanate used was toluene diisocyanate, purchased from Shanghai Dongda Chemical Co., Ltd.

[0089] The foaming agent is a pentane compound, specifically cyclopentane, purchased from Quzhou Yingfu New Materials Technology Co., Ltd.

[0090] The catalyst used was triethanolamine (99% purity), purchased from Nanjing Baojiarui Chemical Co., Ltd.

[0091] The siliceous material used was silica micro powder, purchased from Chengdu Hengruiyuan Environmental Protection Materials Co., Ltd.

[0092] The calcium material used was calcium hydroxide, purchased from Hangzhou Zhonglei New Materials Co., Ltd.

[0093] Example 1

[0094] The preparation method of the insulation board includes the following steps:

[0095] 1. Raw material preparation (by weight)

[0096] First component: 100 parts of polyol (polyester polyol for PUR), 110 parts of isocyanate (toluene diisocyanate), 2.2 parts of foaming agent (cyclopentane), and 2 parts of catalyst (triethanolamine);

[0097] Second component: Hollow silica microspheres (particle size 50 mesh, tap density 190-400 kg / m³) 3 The bulk density is between 140-330 kg / m³. 3 607 parts of (between), 61 parts of siliceous matter (silica micro powder), and 546 parts of calcareous matter (calcium hydroxide).

[0098] 2. Preparation of the mixture

[0099] The raw materials of the first component are premixed to obtain a first mixture, and the raw materials of the second component are premixed to obtain a second mixture; the first mixture and the second mixture are then mixed to obtain a final mixture, wherein the mass ratio of the first component to the second component is 15:85.

[0100] 3. Foaming

[0101] The resulting mixture is transferred to the cavity of the mold and foamed at 65±5℃ to obtain the insulation board.

[0102] During the foaming process, the polyol and isocyanate in the first component react to form a polyurethane matrix, and the decomposition of the foaming agent generates gas that drives the system to expand and foam, forming a foam-like polyurethane insulation material. In the second component, the silica and calcium compounds undergo a chemical reaction, and the resulting reaction products, such as calcium silicate, interact with the polyurethane matrix to improve the overall physical properties (compressive strength, tensile strength) of the resulting insulation board. Hollow silica microspheres are uniformly encapsulated within the reaction products of the polyurethane matrix and the silica and calcium compounds, playing a role in insulation and reinforcement.

[0103] 4. Post-processing

[0104] After foaming, the insulation board is removed from the mold and subjected to necessary post-processing, such as curing, cutting and trimming.

[0105] Example 2-21

[0106] Except for some parameters in Tables 1 and 2, the other conditions and steps are the same as in Example 1.

[0107] Comparative Example 1

[0108] The difference between this comparative example and Example 1 is that the second component does not contain silicon, and the amount of calcium is 607 parts. The other conditions and steps are the same as in Example 1.

[0109] Comparative Example 2

[0110] The difference between this comparative example and Example 1 is that the second component does not contain calcium, the amount of silicon is 607 parts, and the other conditions and steps are the same as in Example 1.

[0111] Comparative Example 3

[0112] The difference between this comparative example and Example 1 is that the second component does not contain hollow silica microspheres, the amount of silica is 850 parts, the amount of calcium is 364 parts, and the other conditions and steps are the same as in Example 1.

[0113] Comparative Example 4

[0114] The difference between this comparative example and Example 8 is that in the second component, the amount of silicon is 755 parts, the amount of calcium is 324 parts, and the amount of silicon hollow microspheres is 120 parts (content is 10%). The other conditions and steps are the same as in Example 8.

[0115] Comparative Example 5

[0116] The difference between this comparative example and Example 7 is that the content of the second component is 80%, the amount of silicon is 129 parts, the amount of calcium is 193 parts, and the amount of silicon hollow microspheres is 1288 parts (content is 80%). The other conditions and steps are the same as in Example 7.

[0117] Comparative Example 6

[0118] The difference between this comparative example and Example 5 is that the content of the first component is 1%, the mass ratio of polyol to isocyanate is 1:1.1, the content of the second component is 99%, and the remaining conditions and steps are the same as in Example 5.

[0119] Comparative Example 7

[0120] The difference between this comparative example and Example 5 is that the content of silicon hollow microspheres is 25%, which is too low. The other conditions and steps are the same as in Example 5.

[0121] Comparative Example 8

[0122] The difference between this comparative example and Example 5 is that the content of silicon hollow microspheres is 95%, which is too high. The other conditions and steps are the same as in Example 5.

[0123] Comparative Example 9

[0124] The difference between this comparative example and Example 5 is that the particle size of the silicon hollow microspheres is 5 mesh, which is too large. The other conditions and steps are the same as in Example 5.

[0125] Comparative Example 10

[0126] The difference between this comparative example and Example 5 is that the particle size of the silicon hollow microspheres is 180 mesh, which is too small. The other conditions and steps are the same as in Example 5.

[0127] The raw material composition and dosage of the insulation boards of Examples 1-21 and Comparative Examples 1-10, as well as the relevant parameters in the preparation process, are shown in Tables 1 and 2 below.

[0128]

[0129]

[0130] Effect Example

[0131] Performance tests were conducted on the samples prepared in Examples 1-21 and Comparative Examples 1-10. The testing standards are as follows: dry density was tested according to GB / T 5486-2008 "Test Methods for Inorganic Rigid Thermal Insulation Products"; compressive strength was tested according to GB / T 8813-2020 "Determination of Compressive Properties of Rigid Foamed Plastics"; tensile strength perpendicular to the board surface was tested according to GB / T 29906-2013 "Materials for Molded Polystyrene Board Thin Plaster Exterior Wall Insulation System"; thermal conductivity was tested according to GB / T 10294-2008 "Determination of Steady-State Thermal Resistance and Related Properties of Thermal Insulation Materials - Protective Hot Plate Method"; and flammability rating was tested according to GB 8624-2012 "Classification of Burning Performance of Building Materials and Products". The test results are shown in Table 3 below.

[0132]

[0133]

[0134] As shown in Table 3, the insulation boards obtained using the insulation board raw material compositions in Examples 1-21 of this invention meet the following requirements: dry density of 190 kg / m³. 3 The following properties have a thermal conductivity of less than 0.040 W / (m∙K), a tensile strength of more than 0.20 MPa, a compressive strength of more than 0.30 MPa, and a fire rating of more than A2. They meet the requirements of lightweighting and have excellent physical strength (tensile strength, compressive strength), thermal insulation performance and fire resistance performance, with excellent overall performance.

[0135] Compared with Example 1, the raw material compositions in Comparative Examples 1-3 either lacked silica, calcium, or silica hollow microspheres, resulting in insulation boards with significantly reduced physical strength or poorer insulation performance, failing to achieve excellent overall performance.

[0136] Compared with Example 8, the amount of silica hollow microspheres in the raw material composition of Comparative Example 4 was too low, and the resulting insulation board either had significantly poorer insulation performance, failing to meet the actual application requirements of the insulation board.

[0137] Compared with Example 7, the relative amount of the second component in the raw material composition of Comparative Example 5 was too low, and the fire rating of the resulting insulation board was only B1, with significantly worse fire resistance.

[0138] Compared with Example 5, the relative amount of the first component in the raw material composition of Comparative Example 6 was too low, resulting in a significant increase in the dry density and thermal conductivity of the obtained insulation board, which could not meet the requirements of lightweighting, and the insulation performance was significantly worse.

[0139] Compared with Example 5, the relative amount of the second component in the raw material composition of Comparative Examples 7-8 is too low, or the relative amount of the first component is too low. As a result, the physical strength of the insulation board is significantly worse, or the dry density is significantly increased, making it impossible to achieve lightweighting.

[0140] Compared with Example 5, the particle size of the silica hollow microspheres in the raw material compositions of Comparative Examples 9-10 is either too large or too small, resulting in insulation boards that either cannot be formed or have a significantly increased dry density, making it impossible to achieve lightweighting.

[0141] While specific embodiments of the present invention have been described above, those skilled in the art should understand that these are merely illustrative examples, and the scope of protection of the present invention is defined by the appended claims. Those skilled in the art can make various changes or modifications to these embodiments without departing from the principles and essence of the present invention, but all such changes and modifications fall within the scope of protection of the present invention.

Claims

1. A composition of insulation board raw materials, characterized in that, It comprises a first component and a second component. The first component comprises a polyol and an isocyanate, and the second component comprises silica hollow microspheres, silica materials, and calcium materials; the calcium materials include calcium oxide and / or calcium hydroxide. The content of the hollow silica microspheres is 30%-90%, and the percentage is the mass percentage of the hollow silica microspheres in the second component; the particle size of the hollow silica microspheres is 10-150 mesh. The mass ratio of the first component to the second component is (2-18):(82-98).

2. The insulation board raw material composition as described in claim 1, characterized in that, The tap density of the silicon hollow microspheres is 190-400 kg / m³. 3 ; And / or, the bulk density of the silica hollow microspheres is 140-330 kg / m³. 3 ; And / or, in the second component, the content of the silica hollow microspheres is 50%-80%, for example 55%, 60%, 65%, 70% or 75%.

3. The insulation board raw material composition as described in claim 1, characterized in that, The mass ratio of the first component to the second component is (5-18):(82-95), for example, 8:92, 10:90, 15:85 or 17.5:82.5; And / or, in the second component, the content of the silicon material is 5%-45%, for example 8%, 10%, 15%, 20%, 25%, 30%, 35% or 40%, where the percentage is the mass percentage of the silicon material in the second component; And / or, in the second component, the siliceous material includes one or more of the following: silica fume, microsilica fume, slag fume, fly ash, quartz powder, kaolin, bentonite, water glass, and diatomaceous earth; And / or, in the second component, the content of the calcium substance is 5%-45%, for example 8%, 10%, 12%, 15%, 20%, 25%, 30%, 35% or 40%, the percentage being the mass percentage of the calcium substance in the second component; And / or, in the second component, the mass ratio of the silica to the calcium is (1-9):(1-9), for example, 8:2, 7:3, 6:4, 5:5, 4:6, 3:7 or 2:8; And / or, the content of the second component is 82%-98%, preferably 85%-98%, for example 82.5%, 92% or 95%, where the percentage is the mass percentage of the second component in the insulation board raw material composition; And / or, in the second component, the mass ratio of the silica hollow microspheres, silica and calcium is (30-90):(5-45):(5-45), for example 50:5:45, 50:35:15, 80:8:12, 80:10:10 or 50:45:

5.

4. The insulation board raw material composition as described in claim 1, characterized in that, The content of the first component is 2%-18%, preferably 2%-15%, for example 5%, 8% or 17.5%, and the percentage is the mass percentage of the first component in the insulation board raw material composition; And / or, in the first component, the mass ratio of the polyol to the isocyanate is preferably 1:(1-2), for example 1:1.1, 1:1.5 or 1:1.8; And / or, the polyols include polyether polyols and / or polyester polyols; And / or, the content of the polyol is 35%-47%, for example 39%, 40%, 44% or 46%, where the percentage is the mass percentage of the polyol to the first component; And / or, the isocyanate includes toluene diisocyanate and / or polymethylene polyphenyl isocyanate; And / or, the content of the isocyanate is 51%-63%, for example 55%, 57%, 59% or 60%, the percentage being the mass percentage of the isocyanate in the first component; And / or, the first component further includes an additive; the additive preferably includes one or more of water, foaming agent, catalyst, foam stabilizer, surfactant, antioxidant, anti-aging agent, antifungal agent, toughening agent and flame retardant; wherein, the content of the additive is preferably 0.5%-5%, and the percentage is the mass percentage of the additive to the polyol.

5. A method for preparing a thermal insulation board, characterized in that, It uses the insulation board raw material composition as described in any one of claims 1-4, and the preparation method includes the following steps: The raw materials of the insulation board raw material composition are mixed to obtain a mixture, which is then foamed to obtain an insulation board.

6. The method for preparing the insulation board as described in claim 5, characterized in that, The foaming temperature is 50-100℃, for example, 55±5℃, 65±5℃, 75±5℃, 85±5℃ or 95±5℃.

7. An insulation board, characterized in that, It is prepared by the method for preparing the insulation board as described in claim 5 or 6.

8. A thermal insulation board, characterized in that, It comprises a polyurethane matrix, calcium silicate, and hollow silica microspheres, wherein the hollow silica microspheres are dispersed in the polyurethane matrix, and the calcium silicate fills the space between the polyurethane matrix and the hollow silica microspheres.

9. The insulation board as described in claim 8, characterized in that, The content of the polyurethane matrix is ​​2%-18%, and the percentage is the mass percentage of the polyurethane matrix in the insulation board; And / or, the dry density of the insulation board is 190 kg / m³. 3 The preferred values ​​are 100-190 kg / m³. 3 For example, 103 kg / m 3 115 kg / m 3 116 kg / m 3 120 kg / m 3 122 kg / m 3 123 kg / m 3 128 kg / m 3 132 kg / m 3 142 kg / m 3 146 kg / m 3 147 kg / m 3 163 kg / m 3 182 kg / m 3 Or 188 kg / m 3 ; And / or, the thermal conductivity of the insulation board is below 0.040 W / (m∙K), preferably 0.020-0.040 W / (m∙K), for example 0.024 W / (m∙K), 0.025 W / (m∙K), 0.0256 W / (m∙K), 0.026 W / (m∙K), 0.0263 W / (m∙K), 0.0268 W / (m∙K), 0.028 W / (m∙K), 0.031 W / (m∙K), 0.033 W / (m∙K), 0.035 W / (m∙K), 0.038 W / (m∙K) or 0.039 W / (m∙K); And / or, the tensile strength of the insulation board is 0.20 MPa or above, preferably 0.20-0.33 MPa, for example 0.21 MPa, 0.22 MPa, 0.23 MPa, 0.24 MPa, 0.25 MPa, 0.26 MPa, 0.27 MPa, 0.28 MPa or 0.31 MPa; And / or, the compressive strength of the insulation board is 0.30 MPa or higher, preferably 0.30-0.52 MPa, for example 0.32 MPa, 0.34 MPa, 0.36 MPa, 0.35 MPa, 0.352 MPa, 0.37 MPa, 0.375 MPa, 0.39 MPa, 0.43 MPa or 0.46 MPa; And / or, the fire rating of the insulation board is not lower than Class A, for example, Class A2.

10. An application of an insulation board as described in any one of claims 7-9 in a building structure.

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