Optical transceiver assembly, optical module and related packaging method

Abstract

The application discloses an optical transceiver assembly, an optical module and a related packaging method. The optical transceiver assembly comprises a support, a first optical filter, a second optical filter, a third optical filter, a base, a light excitation chip and a light receiving chip. The light excitation chip and the light receiving chip are arranged on the top surface of the base. The support is arranged above the top surface of the base. The first optical filter, the second optical filter and the third optical filter are connected with the support. The first optical filter is arranged corresponding to the light excitation chip. The light transmission wavelength of the first optical filter is consistent with the emission light wavelength of the light excitation chip. The reflection wavelength of the first optical filter is consistent with the receiving light wavelength of the light receiving chip. The second optical filter is arranged corresponding to the light receiving chip. The light transmission wavelength of the second optical filter is consistent with the receiving light wavelength of the light receiving chip. The third optical filter is arranged above the second optical filter. The reflection wavelength of the third optical filter is consistent with the receiving light wavelength of the light receiving chip. The optical module size can be effectively reduced, the process is simplified, and the cost control purpose is achieved.

Description

Technical Field

[0001] This invention relates to the field of optical communication device technology, and in particular to an optical transceiver component, an optical module, and a related packaging method. Background Technology

[0002] Optical modules, as the most widely used optical transmission devices in the current communication field, play a crucial role in information transmission. Essentially, they are optoelectronic devices capable of bidirectional conversion between photoelectric signals and electro-optical signals, providing core support for high-speed data transmission through a precise photoelectric conversion mechanism.

[0003] Structurally, optical modules typically consist of independently packaged optical transmitter and receiver components, which are electrically connected and exchange signals via a printed circuit board (PCB). The core component of the optical transmitter is the photoexcitation chip, which generates a specific wavelength of optical signal through electrical drive and transmits it via optical fiber. This process converts electrical signals into optical signals, a crucial step in enabling long-distance transmission in optical communication systems. The core component of the optical receiver is the optical receiver chip, whose primary function is to convert the optical signal transmitted through the optical fiber back into an electrical signal. When the optical signal enters the optical receiver, the receiver chip converts it back into an electrical signal.

[0004] Currently, optical modules have been widely used in scenarios such as data center interconnection, 5G base station construction, and backbone network transmission, becoming an indispensable component of modern communication infrastructure. Summary of the Invention

[0005] To achieve centralized design of optical excitation chips and optical receiving chips, this invention provides an optical transceiver component, an optical module, and related packaging methods, which can effectively reduce the size of the optical module, simplify the process, and achieve the goal of cost control.

[0006] In a first aspect, embodiments of the present invention provide an optical transceiver assembly, comprising: a bracket, a first filter, a second filter, a third filter, a base, a photoexcitation chip, and a photoreceiving chip;

[0007] Both the light excitation chip and the light receiving chip are located on the top surface of the base;

[0008] The bracket is located above the top surface of the base;

[0009] The first filter, the second filter, and the third filter are all connected to the bracket;

[0010] The first filter is configured correspondingly to the photoexcitation chip, the transmittance wavelength of the first filter is consistent with the emission wavelength of the photoexcitation chip, and the reflection wavelength of the first filter is consistent with the reception wavelength of the photoreceiving chip.

[0011] The second filter is configured correspondingly to the light receiving chip, and the transmission wavelength of the second filter is consistent with the receiving wavelength of the light receiving chip;

[0012] The third filter is disposed above the second filter, and the reflected wavelength of the third filter is consistent with the received wavelength of the light receiving chip.

[0013] Optionally, the second filter is arranged parallel to the horizontal plane;

[0014] The first filter and the third filter are both inclined and parallel to each other;

[0015] The reflective surface of the first filter is positioned opposite to the reflective surface of the third filter.

[0016] Optionally, the bracket has a mounting slot;

[0017] The mounting slot is provided with a first mounting platform, a second mounting platform and a third mounting platform;

[0018] The surfaces of the first mounting platform and the third mounting platform are inclined and parallel to each other;

[0019] The second mounting platform is located below the third mounting platform, and the surface of the second mounting platform is arranged parallel to the horizontal plane;

[0020] The bottom of the mounting groove is provided with light-transmitting holes corresponding to the first mounting platform and the second mounting platform, respectively;

[0021] The surface of the first mounting platform is used to fix the first filter;

[0022] The surface of the second mounting stage is used to fix the second filter;

[0023] The surface of the third mounting platform is used to fix the third filter.

[0024] Optionally, the optical transceiver assembly further includes a first lens and a second lens respectively fixed to the light-transmitting hole;

[0025] The first lens is disposed between the first filter and the photoexcitation chip;

[0026] The second lens is disposed between the second filter and the light receiving chip.

[0027] Optionally, both the first lens and the second lens are collimating lenses, used to collimate the emitted light and the received light, respectively.

[0028] Optionally, the optical transceiver assembly further includes at least two pillars disposed on the top surface of the base;

[0029] The bracket is fixed to the column.

[0030] Optionally, the photoexcitation chip is located at the center of the top surface of the base.

[0031] In a second aspect, embodiments of the present invention provide an optical module, including: a cap and the optical transceiver assembly described in the first aspect.

[0032] Thirdly, embodiments of the present invention provide a packaging method for an optical transceiver component, wherein the top surface of the base is provided with a PIN circuit and at least two pillars;

[0033] The bracket has a mounting slot, and the mounting slot is provided with a first mounting platform, a second mounting platform and a third mounting platform;

[0034] The bottom of the mounting groove is provided with light-transmitting holes corresponding to the first mounting platform and the second mounting platform, and a first lens and a second lens are fixed in the light-transmitting holes respectively.

[0035] The encapsulation method includes:

[0036] The light excitation chip and the light receiving chip are attached to the base and cured with conductive silver paste;

[0037] The photoexcitation chip and the photoreceiving chip are respectively connected to the PIN circuit;

[0038] Attach each post to the top surface of the base;

[0039] Fix the bracket to each of the columns, and ensure that the position of the first lens corresponds to the position of the photoexcitation chip and the position of the second lens corresponds to the position of the photoreceiving chip;

[0040] The first filter, the second filter, and the third filter are respectively fixed to the corresponding first mounting platform, the second mounting platform, and the third mounting platform.

[0041] Fourthly, embodiments of the present invention provide a method for packaging an optical module, wherein the top surface of the base is provided with a PIN circuit and at least two pillars;

[0042] The bracket has a mounting slot, and the mounting slot is provided with a first mounting platform, a second mounting platform and a third mounting platform;

[0043] The bottom of the mounting groove is provided with light-transmitting holes corresponding to the first mounting platform and the second mounting platform, and a first lens and a second lens are fixed in the light-transmitting holes respectively.

[0044] The encapsulation method includes:

[0045] The light excitation chip and the light receiving chip are attached to the base and cured with conductive silver paste;

[0046] The photoexcitation chip and the photoreceiving chip are respectively connected to the PIN circuit;

[0047] Attach each post to the top surface of the base;

[0048] Fix the bracket to each of the columns, and ensure that the position of the first lens corresponds to the position of the photoexcitation chip and the position of the second lens corresponds to the position of the photoreceiving chip;

[0049] The first filter, the second filter, and the third filter are respectively fixed to the corresponding first mounting platform, the second mounting platform, and the third mounting platform;

[0050] Place the cap on top of the bracket and weld the cap to the base.

[0051] The beneficial effects of the above-mentioned technical solutions provided in the embodiments of the present invention include at least the following:

[0052] This invention provides an optical transceiver component that can be used in an optical module. This component simultaneously houses an optical excitation chip and an optical receiver chip on the top surface of a base, achieving a centralized design for both. Only one optical transceiver component needs to be assembled in the optical module to realize the functions of both the optical transmitter and receiver devices in a traditional optical module. This changes the traditional design where optical modules require separate optical transmitters and receivers, effectively saving space and reducing costs. It also enables miniaturization and integration of the optical module. Furthermore, since both the optical excitation chip and the optical receiver chip are located on the base, they do not require separate packaging, effectively simplifying the manufacturing process and controlling costs.

[0053] By setting a first filter, a second filter, and a third filter, the emitted light from the photoexcitation chip can pass through the first filter and be transmitted to the outside of the optical transceiver assembly because the transmission wavelength of the first filter matches the emission wavelength of the photoexcitation chip. The optical signal transmitted outside the optical transceiver assembly (including at least the received light that the optical receiver chip can receive) is transmitted to the first filter. Since the reflection wavelength of the first filter matches the received wavelength of the optical receiver chip, the first filter reflects the received light to the third filter, while other wavelengths are not reflected. Similarly, the third filter reflects the received light to the second filter. Since the transmission wavelength of the second filter matches the received wavelength of the optical receiver chip, the second filter transmits the received light to the optical receiver chip for reception. By utilizing the transmission and reflection characteristics of each filter for different wavelengths of light, effective isolation between the emitted and received light is achieved, reducing crosstalk between the emitted and received light and improving the accuracy and stability of optical signal transmission.

[0054] Other features and advantages of the invention will be set forth in the following description, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of the invention may be realized and obtained by means of the structures particularly pointed out in the written description and the accompanying drawings.

[0055] The technical solution of the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. Attached Figure Description

[0056] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used in conjunction with embodiments of the invention to explain the invention and do not constitute a limitation thereof. In the drawings:

[0057] Figure 1 This is a schematic diagram of the overall structure of the optical transceiver component provided in an embodiment of the present invention;

[0058] Figure 2 This is a top view of the base provided in an embodiment of the present invention;

[0059] Figure 3 This is a perspective view of the base provided in an embodiment of the present invention;

[0060] Figure 4 This is a schematic diagram of the receiving optical path provided in an embodiment of the present invention;

[0061] Figure 5 This is a schematic diagram of the connection between the bracket and the base provided in an embodiment of the present invention;

[0062] Figure 6 This is a flowchart of the packaging method for the optical transceiver component provided in an embodiment of the present invention;

[0063] Figure 7 This is a flowchart of the optical module packaging method provided in an embodiment of the present invention;

[0064] Explanation of reference numerals in the attached figures:

[0065] 1. Base; 2. Photoexcitation chip; 3. Photoreceiving chip; 4. Bracket; 401. Mounting slot; 402. First mounting platform; 403. Second mounting platform; 404. Third mounting platform; 5. First filter; 6. Second filter; 7. Third filter; 8. First lens; 9. Second lens; 10. Post; 11. Pin circuit. Detailed Implementation

[0066] Exemplary embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0067] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," "outer," "far," "near," "front," and "rear," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0068] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0069] The applicant discovered that in existing optical module designs, the optical transmitter and receiver are typically located in different physical positions, directly resulting in a large overall size of the optical module. Furthermore, because the optical transmitter and receiver are separate designs, they require independent packaging, leading to high process complexity and significantly increasing the production cost of the optical module.

[0070] To address the aforementioned issues, the applicant has developed an optical transceiver component, an optical module, and a related packaging method. This optical transceiver component enables the centralized design of optical excitation and optical receiving chips. By assembling only one optical transceiver component within the optical module, the functions of optical emitting and receiving devices in existing technologies can be achieved. This effectively reduces the size of the optical module, simplifies the manufacturing process, and controls costs.

[0071] Example 1

[0072] See Figures 1-3 This embodiment proposes an optical transceiver component that can be used in an optical module. The component includes: a base 1, an optical excitation chip 2, an optical receiving chip 3, a bracket 4, a first filter 5, a second filter 6, and a third filter 7. The optical excitation chip 2 and the optical receiving chip 3 are both located on the top surface of the base 1. The optical excitation chip 2 is used to excite emitted light with a wavelength of λ1 and is the core component for emitted light. The optical receiving chip 3 is used to receive received light with a wavelength of λ2, realizing the receiving function. Here, the optical excitation chip 2 can be a VCSEL chip (vertical-cavity surface-emitting laser), a tunable laser chip, a silicon photonics integrated laser chip, etc., as used in the prior art. The optical receiving chip 3 can be a PD+TIA chip, a SiGe array receiver chip, etc., as used in the prior art. The top surface of the base 1 is provided with a pin circuit 11 for electrical connection of the optical components such as the optical excitation chip 2 and the optical receiving chip 3. The bracket 4 is located above the top surface of the base 1, and the first filter 5, the second filter 6, and the third filter 7 are all connected to the bracket 4. The first filter 5 is disposed corresponding to the photoexcitation chip 2. The transmission wavelength of the first filter 5 is the same as the emission wavelength of the photoexcitation chip 2, and the reflection wavelength of the first filter 5 is the same as the reception wavelength of the photoreceiving chip 3. The second filter 6 is disposed corresponding to the photoreceiving chip 3. The transmission wavelength of the second filter 6 is the same as the reception wavelength of the photoreceiving chip 3. The third filter 7 is disposed above the second filter 6. The reflection wavelength of the third filter 7 is the same as the reception wavelength of the photoreceiving chip 3.

[0073] Taking an optical transceiver unit used for communication as an example, the transmission optical path is as follows: The photoexcitation chip 2 emits light with a wavelength of λ1. Since the transmission wavelength of the first filter 5 is the same as the emission wavelength of the photoexcitation chip 2, the emitted light can pass through the first filter 5 and be transmitted outside the optical transceiver unit. From there, it is transmitted via optical fiber to the peer device (such as another optical module), thus realizing data transmission. (See also...) Figure 4The receiving optical path is as follows: the peer device transmits the optical signal (at least including the received light with a wavelength of λ2 that can be received by the optical receiver chip 3) to the optical transceiver component through an optical fiber. The optical signal is transmitted to the first filter 5. Since the reflection wavelength of the first filter 5 is the same as the received light wavelength of the optical receiver chip 3, the first filter 5 reflects the received light with a wavelength of λ2 to the third filter 7, while optical signals of other wavelengths will not be reflected. Similarly, the third filter 7 reflects the received light with a wavelength of λ2 to the second filter 6. Since the transmission wavelength of the second filter 6 is the same as the received light wavelength of the optical receiver chip 3, the second filter 6 transmits the received light with a wavelength of λ2 to the optical receiver chip 3, which receives the data.

[0074] In this embodiment, the photoexcitation chip 2 and the photoreceiving chip 3 are disposed on the base 1, realizing a centralized design of the photoexcitation chip 2 and the photoreceiving chip 3. Only one optical transceiver component needs to be assembled in the optical module to achieve the functions of the optical transmitter and receiver devices in a traditional optical module. This changes the traditional design that requires separate optical transmitters and receivers, effectively saving space and reducing costs, and achieving a miniaturized and integrated design of the optical module. Furthermore, since the photoexcitation chip 2 and the photoreceiving chip 3 are both disposed on the base 1, they do not require separate packaging, effectively simplifying the process and controlling costs.

[0075] Since both the optical excitation chip 2 and the optical receiving chip 3 are located on the base 1, the biggest challenge is crosstalk. To solve this problem, this embodiment uses a first filter 5, a second filter 6, and a third filter 7. By utilizing the transmission and reflection characteristics of each filter for different wavelengths of light, effective isolation between the emitted and received light is achieved, reducing crosstalk between the emitted and received light and improving the accuracy and stability of optical signal transmission.

[0076] In one specific embodiment, in an optical transceiver assembly, the emission loss of the optical excitation chip 2 and the reception loss of the optical receiver chip 3 both significantly impact the overall performance of the assembly. While the reception loss of the optical receiver chip 3 can be compensated for to some extent by optimizing the receiving circuit and improving reception sensitivity, the emission loss of the optical excitation chip 2 directly limits the transmission capability of the emitted light and the communication distance of the optical transceiver assembly, making it difficult to compensate for with simple measures. Therefore, reducing the emission loss of the optical excitation chip 2 is more important than reducing the reception loss of the optical receiver chip 3.

[0077] See Figure 1 and Figure 2The light excitation chip 2 is placed at the center of the top surface of the base 1. The emitted light emitted by the light excitation chip 2 is transmitted to the outside of the optical transceiver assembly after being transmitted through the first filter 5. During this process, the emitted light is always transmitted vertically, which reduces the loss caused by excessive reflections, refractions and detours during transmission. This effectively reduces the emission loss of the light excitation chip 2, thereby improving the quality and transmission efficiency of the emitted light.

[0078] In one specific embodiment, see [reference] Figure 1 and Figure 4 The first filter 5 and the third filter 7 are both inclined and parallel to each other. The reflective surface of the first filter 5 is opposite to the reflective surface of the third filter 7 to ensure that the received light reflected by the first filter 5 will be transmitted towards the third filter 7, and the received light reflected by the third filter 7 will be transmitted vertically to the second filter 6. The second filter 6 is parallel to the horizontal plane, and the received light transmitted through the second filter 6 can be transmitted vertically to the light receiving chip 3 located below the second filter 6. Through the angle design of the first filter 5, the second filter 6, and the third filter 7, it can be ensured that the received light can be accurately transmitted to the light receiving chip 3. At the same time, the received light is transmitted vertically between the third filter 7 and the light receiving chip 3, which can effectively reduce the scattering and deflection of the received light during transmission, ensure stability, reduce the loss of the received light, and improve the optical path efficiency of the entire receiving optical path.

[0079] In one specific embodiment, see [reference] Figure 1 and Figure 5 The bracket 4 has a mounting groove 401 for mounting the first filter 5, the second filter 6, and the third filter 7. Specifically, the mounting groove 401 has a first mounting platform 402, a second mounting platform 403, and a third mounting platform 404. The first filter 5 is fixed to the surface of the first mounting platform 402, the second filter 6 is fixed to the surface of the second mounting platform 403, and the third filter 7 is fixed to the surface of the third mounting platform 404. To achieve the aforementioned angle design of the first filter 5, the second filter 6, and the third filter 7, the surfaces of the first mounting platform 402 and the third mounting platform 404 are inclined and parallel to each other; the second mounting platform 403 is located below the third mounting platform 404, and the surface of the second mounting platform 403 is parallel to the horizontal plane. The bottom of the mounting groove 401 has light-transmitting holes (not shown in the figure) corresponding to the first mounting platform 402 and the second mounting platform 403, respectively, to ensure that the received light and the emitted light can pass through the corresponding light-transmitting holes for transmission.

[0080] The design of the three mounting platforms (i.e., the first mounting platform 402, the second mounting platform 403, and the third mounting platform 404) provides stable support and accurate positioning for the installation of the three filters (i.e., the first filter 5, the second filter 6, and the third filter 7). When encapsulating the entire optical transceiver assembly, the operator only needs to fix the three filters on the corresponding mounting platforms, eliminating the need for angle adjustments, reducing encapsulation errors and adjustment time, and improving production efficiency. The rational design of the mounting slot 401 and the three mounting platforms effectively utilizes the space of the bracket 4, achieving a compact structure and improving the integration of the entire optical transceiver assembly.

[0081] In one specific embodiment, see [reference] Figures 1-3 and Figure 5 The optical transceiver assembly of this embodiment also includes a first lens 8 and a second lens 9, which are respectively fixed to the light-transmitting hole. The first lens 8 is disposed between the first filter 5 and the photoexcitation chip 2, and the second lens 9 is disposed between the second filter 6 and the light receiving chip 3. The first lens 8 and the second lens 9 can be focusing lenses in the prior art to focus the emitted light and the received light, respectively. Specifically, for the emitted light, the first lens 8 can efficiently converge the emitted light emitted by the photoexcitation chip 2, so that the emitted light is focused into a very small light spot, which greatly reduces the loss of the emitted light during transmission. For the received light, the second lens 9 can accurately focus the received light transmitted through the second filter 6 onto the light receiving chip 3, thereby enhancing the light receiving chip 3's ability to capture the received light.

[0082] In another embodiment, both the first lens 8 and the second lens 9 are collimating lenses, used to collimate the emitted light and the received light, respectively. For the emitted light, the first lens 8 can convert the emitted light emitted by the photoexcitation chip 2 into approximately parallel light, so that the emitted light propagates in a more concentrated manner, reducing the divergence loss of the emitted light during transmission and improving the stability of the emitted light; for the received light, the second lens 9 can collimate and adjust the received light after passing through the second filter 6, making it easier for the received light to be efficiently coupled with the photoreceiving chip 3, thereby improving the coupling efficiency.

[0083] In one specific embodiment, see [reference] Figures 1-3 and Figure 5 The optical transceiver assembly in this embodiment also includes at least two pillars 10 disposed on the top surface of the base 1. The bracket 4 is fixed to the pillars 10. The height design of the pillars 10 should ensure that the coupling efficiency of the first lens 8 and the photoexcitation chip 2, as well as the coupling efficiency of the second lens 9 and the photoreceiving chip 3, both reach their maximum. The pillars 10 connect the bracket 4 to the base 1 and maintain the stability of the bracket 4, avoiding the problem of bracket 4 shifting during the use of the optical transceiver assembly, thus ensuring the transmission stability of the transmitting and receiving optical paths.

[0084] Example 2

[0085] Based on the same inventive concept, this embodiment proposes an optical module, which includes: a cap and an optical transceiver assembly as described in Embodiment 1, with the cap covering and connecting to the base.

[0086] Example 3

[0087] Based on the same inventive concept, this embodiment proposes a packaging method for an optical transceiver component, see reference. Figure 6 The specific process may include the following steps:

[0088] Step S101: Attach the photoexcitation chip and the photoreceiving chip to the base and cure them with conductive silver paste;

[0089] Step S102: Connect the light excitation chip and the light receiving chip to the PIN circuit respectively;

[0090] Step S103: Attach each post to the top surface of the base;

[0091] Step S104: Fix the bracket to each column and ensure that the position of the first lens corresponds to the position of the photoexcitation chip and the position of the second lens corresponds to the position of the photoreceiving chip;

[0092] Step S105: Fix the first filter, the second filter and the third filter to the corresponding first mounting platform, the second mounting platform and the third mounting platform respectively.

[0093] Example 4

[0094] Based on the same inventive concept, this embodiment proposes a method for packaging an optical module, see reference. Figure 7 The specific process may include the following steps:

[0095] Step S201: Attach the photoexcitation chip and the photoreceiving chip to the base and cure them with conductive silver paste;

[0096] Step S202: Connect the light excitation chip and the light receiving chip to the PIN circuit respectively;

[0097] Step S203: Attach each column to the top surface of the base;

[0098] Step S204: Fix the bracket to each column and ensure that the position of the first lens corresponds to the position of the light excitation chip and the position of the second lens corresponds to the position of the light receiving chip;

[0099] Step S205: Fix the first filter, the second filter, and the third filter to the corresponding first mounting platform, second mounting platform, and third mounting platform, respectively;

[0100] Step S206: Place the pipe cap on top of the bracket and weld the pipe cap to the base.

[0101] Obviously, those skilled in the art can make various modifications and variations to this invention without departing from its spirit and scope. This disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims. Thus, if these modifications and variations of the invention fall within the scope of the claims of the invention and their equivalents, the invention is also intended to include these modifications and variations.

Claims

1. An optical transceiver subassembly, comprising: include: The device comprises a support frame, a first filter, a second filter, a third filter, a base, a photoexcitation chip, and a photoreceiving chip. Both the light excitation chip and the light receiving chip are located on the top surface of the base; The bracket is located above the top surface of the base; The first filter, the second filter, and the third filter are all connected to the bracket; The first filter is configured correspondingly to the photoexcitation chip, the transmittance wavelength of the first filter is consistent with the emission wavelength of the photoexcitation chip, and the reflection wavelength of the first filter is consistent with the reception wavelength of the photoreceiving chip. The second filter is configured correspondingly to the light receiving chip, and the transmission wavelength of the second filter is consistent with the receiving wavelength of the light receiving chip; The third filter is disposed above the second filter, and the reflected wavelength of the third filter is consistent with the received wavelength of the light receiving chip.

2. The optical transceiver module of claim 1, wherein the optical subassembly is configured to be mounted on a printed circuit board (PCB) of the optical transceiver module. The second filter is arranged parallel to the horizontal plane; The first filter and the third filter are both inclined and parallel to each other; The reflective surface of the first filter is positioned opposite to the reflective surface of the third filter.

3. The optical transceiver module of claim 2, wherein the optical subassembly is configured to be mounted on a printed circuit board (PCB) of the optical transceiver module. The bracket has an installation slot. The mounting slot is provided with a first mounting platform, a second mounting platform and a third mounting platform; The surfaces of the first mounting platform and the third mounting platform are inclined and parallel to each other; The second mounting platform is located below the third mounting platform, and the surface of the second mounting platform is arranged parallel to the horizontal plane; The bottom of the mounting groove is provided with light-transmitting holes corresponding to the first mounting platform and the second mounting platform, respectively; The surface of the first mounting platform is used to fix the first filter; The surface of the second mounting stage is used to fix the second filter; The surface of the third mounting platform is used to fix the third filter.

4. The optical transceiver module of claim 3, wherein the optical subassembly is configured to be mounted on a printed circuit board. It also includes a first lens and a second lens, which are respectively fixed to the light-transmitting hole; The first lens is disposed between the first filter and the photoexcitation chip; The second lens is disposed between the second filter and the light receiving chip.

5. The optical transceiver module of claim 4, wherein the optical subassembly is configured to be mounted on a printed circuit board (PCB) of the optical transceiver module. Both the first lens and the second lens are collimating lenses, used to collimate the emitted light and the received light, respectively.

6. The optical transceiver module of claim 1, wherein the optical subassembly is configured to be mounted on a printed circuit board. It also includes at least two uprights disposed on the top surface of the base; The bracket is fixed to the column.

7. The optical transceiver module of any of claims 1-6, wherein the optical transceiver module is configured to be mounted to a circuit board in a vertical orientation. The photoexcitation chip is located at the center of the top surface of the base.

8. A packaging method of an optical transceiver module, applied to the optical transceiver module of any one of claims 1-6, characterized in that, The top surface of the base is equipped with a pin circuit and at least two uprights; The bracket has a mounting slot, and the mounting slot is provided with a first mounting platform, a second mounting platform and a third mounting platform; The bottom of the mounting groove is provided with light-transmitting holes corresponding to the first mounting platform and the second mounting platform, and a first lens and a second lens are fixed in the light-transmitting holes respectively. The encapsulation method includes: The light excitation chip and the light receiving chip are attached to the base and cured with conductive silver paste; The photoexcitation chip and the photoreceiving chip are respectively connected to the PIN circuit; Attach each post to the top surface of the base; Fix the bracket to each of the columns, and ensure that the position of the first lens corresponds to the position of the photoexcitation chip and the position of the second lens corresponds to the position of the photoreceiving chip; The first filter, the second filter and the third filter are fixed on the corresponding first mounting table, the second mounting table and the third mounting table respectively.

9. A packaging method of an optical transceiver module, applied to the optical transceiver module of claim 7, characterized in that, The top surface of the base is provided with a PIN pin circuit and at least two columns; The bracket is provided with a mounting groove, and the mounting groove is provided with a first mounting table, a second mounting table and a third mounting table; The bottom of the mounting groove is provided with a light transmission hole corresponding to the first mounting table and the second mounting table, and the first lens and the second lens are fixed in the light transmission hole respectively; The packaging method comprises: The light excitation chip and the light receiving chip are pasted on the base and cured by conductive silver glue; The light excitation chip and the light receiving chip are respectively connected with the PIN pin circuit; Each column is pasted on the top surface of the base; The bracket is fixed with each column, and the position of the first lens corresponds to the position of the light excitation chip, and the position of the second lens corresponds to the position of the light receiving chip; The first filter, the second filter and the third filter are fixed on the corresponding first mounting table, the second mounting table and the third mounting table respectively.

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