A modularly designed semiconductor tube furnace device

Abstract

The application relates to the technical field of semiconductor process equipment, and discloses a modularly designed semiconductor furnace tube device which comprises a shell unit and a furnace body unit, the shell unit comprises a furnace bottom and a quartz tube arranged on the furnace bottom, a furnace shell is arranged on the furnace bottom and located outside the quartz tube, and a thermocouple sensor is arranged on the furnace shell; the furnace body unit comprises a modular furnace body assembly and a sealing assembly arranged on the modular furnace body assembly, and a furnace wire fixing assembly is arranged on the inner side of the modular furnace body assembly; the modular furnace body assembly comprises a first furnace body and a second furnace body arranged on one side of the first furnace body; the problems that the furnace body in the prior art is not easy to disassemble, needs to be completely replaced after partial structure damage, and is inconvenient for manufacturing, installation and replacement in the production process are solved; meanwhile, the unreasonable distribution of furnace wires causes uneven heat in the furnace body, and the problem that the temperature consistency cannot be guaranteed.

Description

Technical Field

[0001] This invention relates to the field of semiconductor process equipment technology, and more specifically to a modularly designed semiconductor furnace tube device. Background Technology

[0002] High-temperature, medium-temperature, and low-temperature processes in semiconductor manufacturing, such as thin film growth, diffusion annealing, oxidation, and chemical vapor deposition, all rely on semiconductor furnace equipment to provide the reaction chamber. Temperature control is paramount within this reaction chamber. The furnace body in the equipment maintains a high temperature, typically between 300°C and 1400°C, to ensure uniformity, prevent heat loss, and guarantee the stability and repeatability of the furnace equipment and the process.

[0003] Existing semiconductor furnace tube equipment is difficult to disassemble independently during production, and all parts need to be replaced after some parts are damaged, resulting in high costs; it is also difficult to manufacture, install, and replace during production; and it cannot achieve precise control of process temperature. Summary of the Invention

[0004] To address the problems in the prior art where the furnace body is difficult to disassemble during production, requires complete replacement after partial structural damage, and is inconvenient for manufacturing, installation, and replacement during production; and where the unreasonable distribution of heating wires leads to uneven heat distribution inside the furnace body, making it impossible to guarantee temperature consistency, this invention provides a modularly designed semiconductor furnace tube device. This invention is achieved through the following technical solutions.

[0005] A modular semiconductor furnace tube device includes a shell unit and a furnace body unit. The shell unit includes a furnace bottom and a quartz tube disposed on the furnace bottom. The furnace body shell is installed on the furnace bottom and located outside the quartz tube. A furnace top is installed on the upper side of the furnace body shell. A thermocouple sensor is disposed on the furnace body shell.

[0006] The furnace body unit includes a modular furnace body assembly and a sealing assembly installed on the modular furnace body assembly. A furnace wire fixing assembly is provided on the inner side of the modular furnace body assembly.

[0007] As a preferred embodiment of the modular semiconductor furnace tube device described in this invention, the thermocouple sensors are evenly distributed on the furnace shell, with one end of the thermocouple sensor in contact with the furnace unit and the other end exposed outside the furnace shell.

[0008] As a preferred embodiment of the modular semiconductor furnace tube device described in this invention, the modular furnace body assembly includes a first furnace body and a second furnace body installed on one side of the first furnace body, and a third furnace body can be installed between the first furnace body and the second furnace body.

[0009] As a preferred embodiment of the modular semiconductor furnace tube device described in this invention, the first furnace body and the second furnace body can be connected by a snap-fit ​​connection, and the third furnace body can also be connected between the first furnace body and the second furnace body by a snap-fit ​​connection.

[0010] As a preferred embodiment of the modular semiconductor furnace tube device described in this invention, the first furnace body includes a furnace body and a tenon connected to one end of the furnace body, and a tenon groove is provided at the other end of the furnace body.

[0011] As a preferred embodiment of the modular semiconductor furnace tube device described in this invention, the structure of the second furnace body is the same as that of the first furnace body, so that the tenon structure on the second furnace body can be engaged in the interior of the insertion tenon groove.

[0012] As a preferred embodiment of the modular semiconductor furnace tube device described in this invention, the sealing assembly includes a concave buckle and a sealing ring installed inside the concave buckle. One end of the concave buckle is connected to a first fixing member, and the other end of the concave buckle is connected to a second fixing member.

[0013] As a preferred embodiment of the modular semiconductor furnace tube device described in this invention, the first fixing member includes a fixing rod and a fixing plate fixedly connected to one end of the fixing rod, and the other end of the fixing rod is provided with a threaded structure and connected with a first fixing nut.

[0014] As a preferred embodiment of the modular semiconductor furnace tube device described in this invention, the furnace wire fixing assembly includes an insulating base and a second fixing nut connected to the insulating base, wherein a heating furnace wire is mounted on the insulating base.

[0015] As a preferred embodiment of the modular semiconductor furnace tube device described in this invention, the insulating base includes an insulating retaining ring and a retaining groove formed on the insulating retaining ring, and an installation rod is fixedly connected to one side of the insulating retaining ring.

[0016] The present invention has the following beneficial effects:

[0017] 1. By setting up modular furnace body components, the first, second, and third furnace bodies can be spliced ​​together, which helps to solve the problem of difficulty in disassembly during production and the need to replace all parts when some structures are damaged, thus reducing production costs; timely disassembly and replacement can improve the production efficiency of chip production lines; at the same time, the modular furnace body components have a separate heating system, which can achieve precise temperature control of the temperature zone.

[0018] 2. Through the setting of the sealing components, the sealing ring surrounds and seals the gap between the first furnace body and the second furnace body, and is effectively fixed by the concave buckle, the first fixing part and the second fixing part. The sealing ring of high heat insulation material can effectively prevent the entry of external gas and the loss of internal heat caused by the small gap between the first furnace body and the second furnace body, so as to achieve the same internal temperature of the furnace body and prevent the sealing ring from loosening and causing heat loss.

[0019] 3. The heating wire fixing assembly secures the heating wire to the inner wall of the modular furnace body assembly, preventing the heating wire from falling off and providing the heat required for the process inside the furnace tube. It minimizes damage to the integrity of the insulation layer, which is beneficial to improving insulation performance. At the same time, the reasonable distribution of the heating wire can effectively prevent uneven heat distribution caused by the inability to install the heating wire at the connection between the modular furnace body components and heat loss caused by gaps, thus ensuring the temperature consistency inside the furnace body. Attached Figure Description

[0020] To more clearly illustrate the technical solution of the present invention, the accompanying drawings used in the description of the specific embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 : A cross-sectional structural diagram of the outer shell unit in this invention;

[0022] Figure 2 : A schematic cross-sectional view of the furnace body unit in this invention;

[0023] Figure 3 : A schematic diagram of the modular furnace body assembly in this invention;

[0024] Figure 4 : A cross-sectional structural diagram of the furnace wire fixing assembly in this invention;

[0025] Figure 5 : A schematic diagram of the sealing assembly in this invention;

[0026] Figure 6 This invention Figure 2 Enlarged structural diagram at point A;

[0027] Figure 7 : A schematic diagram of the structure of the furnace wire fixing assembly in this invention;

[0028] Figure 8 This invention Figure 4 A magnified structural diagram at point B in the middle.

[0029] The attached figures are labeled as follows:

[0030] 10. Outer shell unit; 11. Furnace bottom; 12. Quartz tube; 13. Furnace body outer shell; 14. Thermocouple sensor; 15. Furnace top; 20. Furnace body unit; 21. Modular furnace body assembly; 211. First furnace body; 2111. Furnace body; 2112. Insert tenon; 2113. Insert tenon groove; 212. Second furnace body; 213. Third furnace body; 22. Sealing assembly; 221. Concave buckle; 222. Sealing ring; 223. First fixing component; 2231. Fixing rod; 2232. Fixing plate; 2233. First fixing nut; 224. Second fixing component; 23. Heating wire fixing assembly; 231. Insulating seat; 2311. Insulating retaining ring; 2312. Slot; 2313. Mounting rod; 232. Second fixing nut; 233. Heating wire. Detailed Implementation

[0031] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0032] Example

[0033] Reference Figures 1 to 8 As shown in the first embodiment of the present invention, a modular semiconductor furnace tube device is provided, including a housing unit 10 and a furnace body unit 20. The housing unit 10 includes a furnace bottom 11 and a quartz tube 12 disposed on the furnace bottom 11. A furnace body shell 13 is mounted on the furnace bottom 11 and located outside the quartz tube 12. A furnace top 15 is mounted on the upper side of the furnace body shell 13. A thermocouple sensor 14 is disposed on the furnace body shell 13. The furnace body unit 20 includes a modular furnace body assembly 21 and a sealing assembly 22 mounted on the modular furnace body assembly 21. A furnace wire fixing assembly 23 is disposed on the inner side of the modular furnace body assembly 21.

[0034] Thermocouple sensors 14 are evenly distributed on the furnace shell 13, with one end of the thermocouple sensor 14 in contact with the furnace unit 20 and the other end exposed outside the furnace shell 13.

[0035] The furnace bottom 11 and furnace top 15 are provided with tenon and mortise structures that can cooperate with the modular furnace body assembly 21 for installation and fixation. The furnace body shell 13 is installed between the furnace bottom 11 and furnace top 15 and can be disassembled and installed. Thermocouple sensors 14 are fixed on the furnace body shell 13 of the equipment. At least three thermocouple sensors 14 are used to detect the temperature inside the furnace body.

[0036] The modular furnace body assembly 21 includes a first furnace body 211 and a second furnace body 212 installed on one side of the first furnace body 211. A third furnace body 213 can be installed between the first furnace body 211 and the second furnace body 212. The first furnace body 211 includes a furnace body 2111 and a tenon 2112 connected to one end of the furnace body 2111. The other end of the furnace body 2111 is provided with a tenon groove 2113.

[0037] The first furnace body 211 and the second furnace body 212 can be connected by a snap-fit ​​connection, and the third furnace body 213 can also be connected between the first furnace body 211 and the second furnace body 212 by a snap-fit ​​connection. The structure of the second furnace body 212 is the same as that of the first furnace body 211, so that the tenon structure on the second furnace body 212 can be snapped into the inside of the tenon groove 2113. At the same time, the first furnace body 211, the second furnace body 212 and the third furnace body 213 are all provided with connecting holes for installing the furnace wire fixing assembly 23.

[0038] The tenon 2112 and the tenon groove 2113 are set one-to-one, and their dimensions can be matched with each other. At the same time, the tenon 2112 and the tenon groove 2113 are evenly distributed at equal angles on the furnace body 2111 to ensure the stability of the installation between the first furnace body 211 and the second furnace body 212.

[0039] The first furnace body 211 is fitted with the furnace top 15, and the second furnace body 212 is fitted with the furnace bottom 11. Therefore, an opening is provided between the first furnace body 211 and the second furnace body 212 to install the sealing component 22, which is used to seal the connection between the first furnace body 211 and the second furnace body 212. At the same time, the third furnace body 213 can be installed between the first furnace body 211 and the second furnace body 212 as needed. The equipment itself can include two or more furnace body structures, which can be installed and set as needed. The structure of the third furnace body 213 is generally the same as that of the first furnace body 211 and the second furnace body 212. However, since the third furnace body 213 needs to be sealed with the sealing component 22 when connected to the first furnace body 211 and the second furnace body 212, openings are provided on both the upper and lower sides of the third furnace body 213 to install the sealing component 22 and complete the sealing.

[0040] The furnace body 2111 consists of two parts: the outer side is the furnace structure, and the inner side is an insulation wall made of high-insulation materials, including but not limited to aluminum silicate cotton, alumina fiber blankets, etc.

[0041] The sealing assembly 22 includes a concave buckle 221 and a sealing ring 222 installed inside the concave buckle 221. One end of the concave buckle 221 is connected to a first fixing member 223, and the other end of the concave buckle 221 is connected to a second fixing member 224. The first fixing member 223 includes a fixing rod 2231 and a fixing plate 2232 fixedly connected to one end of the fixing rod 2231. The other end of the fixing rod 2231 is provided with a threaded structure and connected to a first fixing nut 2233.

[0042] The sealing ring 222 is set at the connection between the first furnace body 211 and the second furnace body 212, and the concave buckle 221 is distributed at equal angles on the sealing ring 222. The first fixing member 223 and the second fixing member 224 pass through the first furnace body 211 or the second furnace body 212 to install and fix the concave buckle 221.

[0043] The sealing ring 222 is made of high-insulation material, including but not limited to alumina fiber material. The sealing ring 222 is used to surround and seal the gap between the two modular furnace bodies to prevent external gas from entering and internal heat loss. The concave structure of the concave buckle 221 is used to fix the sealing ring 222. The first fixing member 223 and the second fixing member 224 are both made of alumina ceramic material. The fixing plate 2232 is fixedly connected to one end of the fixing rod 2231, and the other end has a threaded structure. The fixing rod 2231 and the fixing plate 2232 can also be integrally formed. The sealing ring 222 is fixed to the modular furnace body assembly 21 by the threaded connection between the fixing rod 2231 and the first fixing nut 2233, and the sealing ring 222 is installed to seal the gap between the first furnace body 211 and the second furnace body 212.

[0044] The heating element fixing assembly 23 includes an insulating base 231 and a second fixing nut 232 connected to the insulating base 231. A heating element 233 is installed on the insulating base 231. The insulating base 231 includes an insulating retaining ring 2311 and a retaining groove 2312 formed on the insulating retaining ring 2311. An installation rod 2313 is fixedly connected to one side of the insulating retaining ring 2311.

[0045] The insulating base 231 is installed through the modular furnace body assembly 21 and fixed by the second fixing nut 232. The heating wire 233 is installed on the insulating base 231. The insulating bases 231 are evenly distributed to ensure the stability of the heating wire 233 installation. The heating wire fixing assembly 23 is distributed inside the modular furnace body assembly 21. The heating wire 233 is installed by opening a groove 2312 on the insulating retaining ring 2311. The mounting rod 2313 passes through the modular furnace body assembly 21 and has a threaded structure at one end. It is fixed by the threaded connection between the second fixing nut 232 and the mounting rod 2313.

[0046] The heating element 233 is made of high-temperature resistance wire, including but not limited to high-temperature materials such as iron-chromium-aluminum alloy, tungsten-molybdenum alloy, and silicon carbide; the insulating base 231 is made of materials with good insulation and mechanical properties, including but not limited to alumina ceramic, zirconium oxide, and silicon nitride; the second fixing nut 232 is made of alumina ceramic material; the heating element 233 is fixed to the inner side of the insulation wall on the modular furnace body assembly 21 by the insulating base 231 and the second fixing nut 232.

[0047] Among them, the heating wires 233 are numerous and concentrated at the connection between the two modular furnace bodies, and are evenly distributed away from the connection between the two modular furnace bodies, so that the heat is uniform and there is no heat loss due to gaps, thus ensuring the temperature consistency inside the furnace.

[0048] The preferred embodiments of the present invention disclosed above are merely illustrative of the invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the invention to any specific implementation. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the invention, thereby enabling those skilled in the art to better understand and utilize the invention. The invention is limited only by the claims and their full scope and equivalents.

Claims

1. A modularly designed semiconductor furnace tube device, characterized in that: It includes an outer shell unit (10) and a furnace body unit (20). The outer shell unit (10) includes a furnace bottom (11) and a quartz tube (12) disposed on the furnace bottom (11). A furnace body shell (13) is installed on the furnace bottom (11) and located outside the quartz tube (12). A furnace top (15) is installed on the upper side of the furnace body shell (13). A thermocouple sensor (14) is disposed on the furnace body shell (13). The furnace body unit (20) includes a modular furnace body assembly (21) and a sealing assembly (22) installed on the modular furnace body assembly (21). A furnace wire fixing assembly (23) is provided on the inner side of the modular furnace body assembly (21). The modular furnace body assembly (21) includes a first furnace body (211) and a second furnace body (212) installed on one side of the first furnace body (211), and a third furnace body (213) can be installed between the first furnace body (211) and the second furnace body (212). The first furnace body (211) includes a furnace body (2111) and a tenon (2112) connected to one end of the furnace body (2111), and a tenon groove (2113) is provided at the other end of the furnace body (2111). The sealing assembly (22) includes a concave buckle (221) and a sealing ring (222) installed inside the concave buckle (221). One end of the concave buckle (221) is connected to a first fixing member (223), and the other end of the concave buckle (221) is connected to a second fixing member (224). The first fixing member (223) includes a fixing rod (2231) and a fixing plate (2232) fixedly connected to one end of the fixing rod (2231), and the other end of the fixing rod (2231) is provided with a threaded structure and connected with a first fixing nut (2233). The heating wire fixing assembly (23) includes an insulating base (231) and a second fixing nut (232) connected to the insulating base (231), on which a heating wire (233) is installed; The insulating seat (231) includes an insulating retaining ring (2311) and a retaining groove (2312) formed on the insulating retaining ring (2311), and an installation rod (2313) is fixedly connected to one side of the insulating retaining ring (2311).

2. The modularly designed semiconductor furnace tube equipment according to claim 1, characterized in that: The thermocouple sensors (14) are evenly distributed on the furnace shell (13), with one end of the thermocouple sensor (14) in contact with the furnace unit (20) and the other end exposed outside the furnace shell (13).

3. The modularly designed semiconductor furnace tube equipment according to claim 1, characterized in that: The first furnace body (211) and the second furnace body (212) can be connected by a snap-fit ​​method, and the third furnace body (213) can also be connected between the first furnace body (211) and the second furnace body (212) by a snap-fit ​​method.

4. The modularly designed semiconductor furnace tube equipment according to claim 3, characterized in that: The structure of the second furnace body (212) is the same as that of the first furnace body (211), so that the tenon structure on the second furnace body (212) can be engaged in the interior of the tenon groove (2113).

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