Miniature surface-mounted eight-channel ultralow-capacitance electrostatic protection chip
By designing a miniature surface-mount eight-channel ultra-low capacitance ESD protection chip, the problems of large space occupation and high cost of existing ESD protection chips in multi-signal channel devices are solved, achieving the effects of simplified wiring, space saving, cost reduction and improved signal integrity.
Patent Information
- Application Number
- CN202410732399.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-07
- Publication Date
- 2025-12-12
AI Technical Summary
Existing ESD protection chips occupy a large space, have complex wiring, and are costly in electronic devices with multiple signal channels, making it difficult to meet the needs of circuit designs with limited space.
A miniature surface-mount eight-channel ultra-low capacitance ESD protection chip is designed. By combining a metal lead frame, silver paste solder, a four-channel ultra-low capacitance unidirectional ESD protection chip, and metal wires, a simplified circuit structure is formed to achieve ESD protection for up to eight signal channels.
It simplifies circuit wiring, saves space, reduces signal distortion and interference, improves system reliability and stability, and reduces costs.
Smart Images
Figure CN121123152A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of semiconductor technology, and particularly relates to a micro surface-mounted eight-channel ultra-low-capacitance electrostatic protection chip. BACKGROUND
[0002] In the current highly integrated and fine electronic equipment, electrostatic protection has become a necessary project, and the ESD protection chip is a useful tool to ensure the stable and reliable operation of electronic equipment. The common ESD protection chip on the market is mostly single-channel, double-channel and four-channel. For some multi-signal channels, such as LVDS, TTL, HDMI, USB-C and the like, a plurality of single-channel or double-channel or four-channel ESD protection chips are needed. If the space of the circuit board is limited, the use of multiple ESD protection chips at the same time will occupy a large area of the circuit board, and the circuit wiring is complex, which is easy to cause signal distortion or interference, and the cost of multiple ESD protection chips is relatively high. Based on this, it is particularly necessary to design a new type of micro surface-mounted eight-channel ultra-low-capacitance electrostatic protection chip. SUMMARY
[0003] In view of the deficiencies in the prior art, the present application aims to provide a micro surface-mounted eight-channel ultra-low-capacitance electrostatic protection chip, which has a reasonable structure design, simplifies circuit wiring, saves circuit space, reduces signal distortion and interference, improves the reliability and stability of the system, reduces the cost, and is easy to use and promote.
[0004] In order to achieve the above-mentioned purpose, the present application is realized by the following technical scheme: a micro surface-mounted eight-channel ultra-low-capacitance electrostatic protection chip, comprising a metal lead frame, silver solder, a four-channel ultra-low-capacitance unidirectional electrostatic protection chip, a metal wire and an epoxy resin, the GND end of the metal lead frame is provided with silver solder on the left and right sides, respectively, and one four-channel ultra-low-capacitance unidirectional electrostatic protection chip is arranged on each side of the silver solder, wherein the four chip opening windows of the four-channel ultra-low-capacitance unidirectional electrostatic protection chip on the left side are respectively electrically connected to the 1 pin, the 2 pin, the 8 pin and the 9 pin of the metal lead frame through the metal wire, the four chip opening windows of the four-channel ultra-low-capacitance unidirectional electrostatic protection chip on the right side are respectively electrically connected to the 4 pin, the 5 pin, the 6 pin and the 7 pin of the metal lead frame through the metal wire, and the 3 pin of the metal lead frame is connected to the GND end; the metal lead frame, the silver solder, the four-channel ultra-low-capacitance unidirectional electrostatic protection chip and the metal wire are peripherally wrapped with the epoxy resin to form a micro surface-mounted eight-channel ultra-low-capacitance electrostatic protection chip structure.
[0005] As preferred, the 1-pin, 2-pin, 4-pin, 5-pin, 6-pin, 7-pin, 8-pin and 9-pin of the metal lead frame are eight unidirectional super-low-capacitance electrostatic protection channels, which can provide up to eight electrostatic protection channels for the interface of one device and multiple high-speed signal channels at one time by forming a ground path with the GND terminal.
[0006] As preferred, the 3-pin of the metal lead frame is connected with the GND terminal to form the grounding point of the entire micro-surface-mounted eight-channel super-low-capacitance electrostatic protection chip.
[0007] As preferred, the metal wire adopts one of silver wire and gold wire.
[0008] The device can simultaneously protect up to eight high-speed signal channels, effectively reduces signal distortion and interference, ensures the integrity and accuracy of the signal, simplifies circuit wiring, greatly saves circuit board space, and has stable and reliable system, low cost, and wide application prospect. BRIEF DESCRIPTION OF DRAWINGS
[0009] The application will be described in detail below with reference to the drawings and specific embodiments.
[0010] Fig. 1 The structure of the application is shown in the schematic diagram.
[0011] Fig. 2 The internal circuit diagram of the application is shown. DETAILED DESCRIPTION
[0012] In order to make the technical means, creative features, purposes and effects of the application easy to understand, the application will be further described below in combination with specific embodiments.
[0013] REFERENCE Figs. 1-2The embodiment adopts the following technical scheme: a micro surface-mounted eight-channel ultra-low-capacitance electrostatic protection chip, comprising a metal lead frame A, silver paste solder B, four-channel ultra-low-capacitance unidirectional electrostatic protection chip C, metal wire D and epoxy resin E, the left and right sides of the GND end of the metal lead frame A are respectively provided with the silver paste solder B, one four-channel ultra-low-capacitance unidirectional electrostatic protection chip C is arranged on each side of the silver paste solder B, the four chip opening windows of the four-channel ultra-low-capacitance unidirectional electrostatic protection chip C on the left side are respectively electrically connected to the 1st pin, the 2nd pin, the 8th pin and the 9th pin of the metal lead frame A through the metal wire D, the four chip opening windows of the four-channel ultra-low-capacitance unidirectional electrostatic protection chip C on the right side are respectively electrically connected to the 4th pin, the 5th pin, the 6th pin and the 7th pin of the metal lead frame A through the metal wire D, and the 3rd pin of the metal lead frame A is connected to the GND end; the metal wire D is silver or gold wire; the metal lead frame A, the silver paste solder B, the four-channel ultra-low-capacitance unidirectional electrostatic protection chip C and the metal wire D are semi-encapsulated with the epoxy resin E, and a micro surface-mounted eight-channel ultra-low-capacitance electrostatic protection chip structure is formed.
[0014] The 1st pin, the 2nd pin, the 4th pin, the 5th pin, the 6th pin, the 7th pin, the 8th pin and the 9th pin of the metal lead frame A are eight unidirectional ultra-low-capacitance electrostatic protection channels, which can provide up to eight electrostatic protection channels for the interface of a single device for multiple high-speed signal channels through the ground path formed by the connection between the 3rd pin of the metal lead frame A and the GND end.
[0015] The two four-channel ultra-low-capacitance unidirectional electrostatic protection chips C are connected through the metal lead frame A, the silver paste solder B and the metal wire D, and then semi-encapsulated with the epoxy resin E to form an eight-channel ultra-low-capacitance electrostatic protection chip, which can provide up to eight electrostatic protection channels for the interface of a single device for multiple high-speed signal channels. Compared with multiple single-channel, double-channel and four-channel ESD protection chips, the device has the following technical advantages in the circuit with multiple high-speed data transmission signal channels and limited space:
[0016] (1) Simplified design: the use of the micro surface-mounted eight-channel ultra-low-capacitance electrostatic protection chip can reduce the number of components and the complexity of wiring, simplify the circuit design and manufacturing process.
[0017] (2) Space saving: the eight ESD protection channels with the same performance are highly integrated in the micro surface-mounted package, which greatly saves the circuit board space.
[0018] (3) Performance consistency: the micro surface-mounted eight-channel ultra-low-capacitance electrostatic protection chip is manufactured on the same chip, which has better performance consistency and batch stability.
[0019] (4) High efficiency protection: eight-channel ultra-low capacitance design can protect up to eight high-speed signal channels at the same time, and the ultra-low capacitance value can reduce signal distortion and interference, ensure the integrity and accuracy of the signal, provide more comprehensive ESD protection, and improve the reliability and stability of the system.
[0020] (5) Cost-effective: a micro surface-mounted eight-channel ultra-low capacitance electrostatic discharge protection can replace multiple traditional single-channel, double-channel and four-channel ESD protection chips, has more economic benefits, greatly reduces costs, improves market competitiveness, and has broad market application prospects.
[0021] The above shows and describes the basic principles and main features of the present application and the advantages of the present application. Those skilled in the art should understand that the present application is not limited to the above examples, and the above examples and descriptions in the specification are only to illustrate the principles of the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application, and these changes and improvements all fall within the scope of the claimed present application. The scope of protection of the present application is defined by the appended claims and their equivalents.
Claims
1. A miniature surface-mount eight-channel ultra-low capacitance electrostatic discharge (ESD) protection chip, characterized in that, The device includes a metal lead frame (A), silver solder paste (B), a four-channel ultra-low capacitance unidirectional ESD protection chip (C), metal wires (D), and epoxy resin (E). Silver solder paste (B) is placed on both sides of the GND terminal of the metal lead frame (A). Each side of the silver solder paste (B) has a four-channel ultra-low capacitance unidirectional ESD protection chip (C). The four chip windows of the four-channel ultra-low capacitance unidirectional ESD protection chip (C) on the left side are connected to pins 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19 ... Pins 8 and 9 are electrically connected. The four chip windows of the four-channel ultra-low capacitance unidirectional electrostatic discharge protection chip (C) on the right are electrically connected to pins 4, 5, 6, and 7 of the metal lead frame (A) through metal wires (D). Pin 3 of the metal lead frame (A) is connected to the GND terminal. The metal lead frame (A), silver paste solder (B), four-channel ultra-low capacitance unidirectional electrostatic discharge protection chip (C) and metal wires (D) are partially wrapped with epoxy resin (E) to form a micro surface-mount eight-channel ultra-low capacitance electrostatic discharge protection chip structure.
2. The miniature surface-mount eight-channel ultra-low capacitance electrostatic discharge protection chip according to claim 1, characterized in that, The metal lead frame (A) has eight unidirectional ultra-low capacitance electrostatic discharge (ESD) protection channels at pins 1, 2, 4, 5, 6, 7, 8, and 9, which form a ground path with the GND terminal. The single device provides eight ESD protection channels for interfaces with multiple high-speed signal channels.
3. The miniature surface-mount eight-channel ultra-low capacitance electrostatic discharge protection chip according to claim 1, characterized in that, The metal lead frame (A) has its 3rd pin connected to the GND terminal to form the grounding point of the entire micro surface-mount eight-channel ultra-low capacitance electrostatic discharge protection chip.
4. The miniature surface-mount eight-channel ultra-low capacitance electrostatic discharge protection chip according to claim 1, characterized in that, The metal conductor (D) is either silver alloy wire or gold wire.