High-frequency electronic circuit experiment signal processing device based on FPGA

Abstract

The invention belongs to the technical field of high-frequency electronic circuit experiment equipment, and particularly relates to a high-frequency electronic circuit experiment signal processing device based on an FPGA, the high-frequency electronic circuit experiment signal processing device comprises a shell, a cover plate and a heat dissipation mechanism, and a protection pad is installed on the inner bottom wall of the shell. A heat dissipation window matched with the cover plate forms an efficient heat dissipation channel; meanwhile, a first dustproof net and a second dustproof net can prevent external dust from entering the shell and prevent dust from being attached to influence the performance of the module, a temperature sensor can monitor the temperature in the shell in real time, a heat dissipation strategy can be adjusted in time, a protection pad in the shell can buffer vibration and protect core components such as the signal acquisition module, and the service life of the signal acquisition module is prolonged. A USB interface, an Ethernet interface and the like are designed to adapt to connection of different devices, and all the modules are electrically connected in order through wires, so that the smooth flow of signal acquisition, processing, storage and display is ensured, and the reliability and operation convenience of experimental signal processing are improved.

Description

Technical Field

[0001] This invention relates to the field of high-frequency electronic circuit experimental equipment technology, specifically to a high-frequency electronic circuit experimental signal processing device based on FPGA. Background Technology

[0002] In high-frequency electronic circuit experiments, accurate and efficient processing of acquired signals is crucial. Traditional signal processing devices often suffer from slow processing speed, low accuracy, and poor flexibility when processing high-frequency signals. With the continuous development of electronic technology, the performance requirements for signal processing devices in high-frequency electronic circuit experiments are becoming increasingly stringent, necessitating a device that can process high-frequency signals quickly and accurately, while also possessing high flexibility and scalability.

[0003] Field Programmable Gate Arrays (FPGAs) have advantages such as strong parallel processing capabilities and reconfigurability, which can meet the needs of high-frequency electronic circuit experimental signal processing. However, current FPGA-based high-frequency electronic circuit experimental signal processing suffers from low resource utilization, complex algorithm implementation, and lack of automatic heat dissipation mechanisms. Working in high-temperature environments for extended periods will significantly reduce the lifespan of electrical components. Summary of the Invention

[0004] To address the shortcomings of existing technologies, this invention provides a high-frequency electronic circuit experimental signal processing device based on FPGA. It solves the problem that while FPGA has advantages such as strong parallel processing capability and reconfigurability, which can meet the needs of high-frequency electronic circuit experimental signal processing, current FPGA-based high-frequency electronic circuit experimental signal processing suffers from low resource utilization, complex algorithm implementation, and lack of automatic heat dissipation mechanism. Working in a high-temperature environment for a long time will significantly reduce the service life of electrical components.

[0005] To achieve the above objectives, the present invention provides the following technical solution: including a housing, a cover plate, and a heat dissipation mechanism, wherein a protective pad is installed on the inner bottom wall of the housing, and a signal acquisition module, an FPGA processing module, a data storage module, a communication module, and a display module are respectively installed on the upper surface of the protective pad, and a USB port, an Ethernet port, and an SPI port are respectively opened on the back of the housing, the back of the display module is connected to the housing, and a temperature sensor is installed on the bottom surface of the cover plate.

[0006] As a preferred embodiment of the present invention, the upper surface of the cover plate is provided with two sets of mounting holes, and each mounting hole is provided with a mounting screw.

[0007] As a preferred embodiment of the present invention, the upper surface of the cover plate is provided with a heat dissipation window, and the inner wall of the heat dissipation window is equipped with a first dustproof net.

[0008] As a preferred embodiment of the present invention, the bottom surface of the housing is connected to two sets of support legs, and one end of each support leg is connected to a base.

[0009] As a preferred embodiment of the present invention, the heat dissipation mechanism includes two circular tubes, the outer surfaces of which are in communication with the housing.

[0010] As a preferred embodiment of the present invention, the inner walls of both circular tubes are connected to a second dustproof net, the inner walls of both circular tubes are connected to a fixing frame, and a fan is installed on one side of each fixing frame that is close to the other.

[0011] In a preferred embodiment of the present invention, the signal acquisition module is electrically connected to the FPGA processing module via a wire, and the FPGA processing module is electrically connected to the data storage module via a wire.

[0012] In a preferred embodiment of the present invention, the data storage module is electrically connected to the communication module via a wire, and the communication module is signal-connected to the display module.

[0013] As a preferred embodiment of the present invention, the FPGA processing module is an FRGA chip, and the data storage module consists of input / output devices such as a display screen, buttons, and knobs.

[0014] Compared with the prior art, the present invention provides an experimental signal processing device for high-frequency electronic circuits based on FPGA, which has the following beneficial effects:

[0015] 1. This FPGA-based high-frequency electronic circuit experimental signal processing device accelerates the circulation of hot air inside the housing by setting a fan inside the circular tube, which, together with the heat dissipation window of the cover plate, forms an efficient heat dissipation channel. At the same time, the first and second dustproof nets can block external dust from entering the housing, preventing dust from affecting the performance of the module. The temperature sensor can monitor the temperature inside the housing in real time, which facilitates timely adjustment of the heat dissipation strategy, effectively solving the problem of module overheating during high-frequency signal processing and ensuring the stable operation of the device for a long time.

[0016] 2. This FPGA-based high-frequency electronic circuit experimental signal processing device can buffer vibration and protect core components such as the signal acquisition module by setting a protective pad inside the housing. The mounting holes and mounting screws facilitate the disassembly and maintenance of the cover plate. The multi-interface design includes USB ports, Ethernet ports, etc., to adapt to the connection of different devices. All modules are connected in an orderly manner by wires to ensure a smooth process of signal acquisition, processing, storage and display, thereby improving the reliability and ease of operation of experimental signal processing. Attached Figure Description

[0017] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0018] Figure 2 This is a rear view of the present invention;

[0019] Figure 3 This is a top view of the present invention;

[0020] Figure 4 This is a top sectional view of the present invention;

[0021] Figure 5 This is a cross-sectional view of the present invention;

[0022] Figure 6 This is a system diagram of the present invention.

[0023] In the diagram: 1. Housing; 2. Cover plate; 3. Heat dissipation mechanism; 301. Round tube; 302. Second dustproof mesh; 303. Fixing bracket; 304. Fan; 4. Signal acquisition module; 5. FPGA processing module; 6. Data storage module; 7. Communication module; 8. Display module; 9. First dustproof mesh; 10. Temperature sensor; 11. Mounting hole; 12. Mounting screw; 13. Protective pad; 14. Heat dissipation window; 15. USB port; 16. Ethernet port; 17. SPI port; 18. Support leg; 19. Base. Detailed Implementation

[0024] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0025] Example

[0026] Please see Figure 1-6 This implementation scheme includes a housing 1, a cover plate 2, and a heat dissipation mechanism 3. A protective pad 13 is installed on the inner bottom wall of the housing 1. A signal acquisition module 4, an FPGA processing module 5, a data storage module 6, a communication module 7, and a display module 8 are respectively installed on the upper surface of the protective pad 13. A USB port 15, an Ethernet port 16, and an SPI port 17 are respectively provided on the back of the housing 1. The back of the display module 8 is connected to the housing 1. A temperature sensor 10 is installed on the bottom surface of the cover plate 2. This not only enables the device to automatically dissipate heat from electrical components, but also ensures a smooth process of signal acquisition, processing, storage, and display, thereby improving the reliability and ease of operation of experimental signal processing.

[0027] In this embodiment, the upper surface of the cover plate 2 is provided with two sets of mounting holes 11, and each mounting hole 11 is provided with a mounting screw 12. The upper surface of the cover plate 2 is provided with a heat dissipation window 14, and the inner wall of the heat dissipation window 14 is provided with a first dustproof net 9. The bottom surface of the housing 1 is connected with two sets of support legs 18, and one end of each support leg 18 is connected to a base 19. This not only provides effective support for the equipment, but also allows people to disassemble and assemble the cover plate 2, thereby facilitating daily maintenance of the electrical components inside the equipment.

[0028] The heat dissipation mechanism 3 includes two circular tubes 301. The outer surfaces of the two circular tubes 301 are connected to the housing 1. The inner walls of the two circular tubes 301 are connected to a second dustproof net 302. The inner walls of the two circular tubes 301 are connected to a fixing bracket 303. A fan 304 is installed on the side of the two fixing brackets 303 that are close to each other. This enables the equipment to automatically dissipate heat from the internal electrical components, thereby greatly increasing the service life of the electrical components.

[0029] The signal acquisition module 4 is electrically connected to the FPGA processing module 5 via wires, and the FPGA processing module 5 is electrically connected to the data storage module 6 via wires. The signal acquisition module 4 uses a high-speed A / D converter, which can realize fast and accurate acquisition of high-frequency signals. In order to improve the quality of the acquired signal, an anti-aliasing filter is set at the front end of the A / D converter to effectively filter out noise and clutter in the high-frequency signal. The signal acquisition module 4 is also equipped with a gain adjustment circuit, which can adjust the gain of the acquired signal according to the strength of the actual signal to ensure that the acquired signal is within the dynamic range of the A / D converter.

[0030] The data storage module 6 is electrically connected to the communication module 7 via wires. The communication module 7 is signal-connected to the display module 8. The data storage module 6 uses a large-capacity high-speed memory, such as DDR3 memory, which can quickly store the processed signal data. To improve the reliability of data storage, data verification and error correction technology is adopted to ensure that the stored data is accurate. The display module 8 uses a high-resolution display screen, such as an LCD or OLED display, which can clearly display the processed signal waveform, spectrum, etc. To facilitate user operation, the display module 8 is also equipped with a human-machine interface, allowing users to control the device and set parameters by touching the screen or using buttons.

[0031] FPGA processing module 5 is an FPGA chip, and data storage module 6 consists of input / output devices such as a display screen, buttons, and knobs. FPGA processing module 5 uses a high-performance FPGA chip, utilizing its abundant logic resources and high-speed parallel processing capabilities to achieve efficient processing of high-frequency signals. Multiple functional modules are designed in the FPGA chip, including a digital down-conversion module, a filtering module, a spectrum analysis module, and a modulation / demodulation module. The digital down-conversion module converts high-frequency signals into intermediate-frequency or low-frequency signals for subsequent processing. The filtering module uses various filtering algorithms, such as FIR filtering and IIR filtering, to filter signals according to different needs, removing noise and interference from the signals. The spectrum analysis module uses the Fast Fourier Transform (FFT) algorithm to perform spectrum analysis on the signals and obtain the spectral characteristics of the signals. The modulation / demodulation module can perform modulation and demodulation of signals to meet the needs of different communication systems.

[0032] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. FPGA-based high-frequency electronic circuit experiment signal processing device, characterized in that: Including casing (1), cover plate (2) and heat dissipation mechanism (3), the inner bottom wall of casing (1) is installed with protective pad (13), the upper surface of protective pad (13) is installed with signal acquisition module (4), FPGA processing module (5), data storage module (6), communication module (7) and display module (8) respectively, the back of casing (1) is provided with USB socket (15), Ethernet socket (16) and SPI socket (17) respectively, the back of display module (8) is connected with casing (1), the bottom of cover plate (2) is installed with temperature sensor (10).

2. The FPGA-based high-frequency electronic circuit experiment signal processing device according to claim 1, characterized in that: The upper surface of cover plate (2) is provided with two groups of mounting holes (11), each mounting hole (11) is provided with mounting screw (12) inside.

3. The FPGA-based high-frequency electronic circuit experiment signal processing apparatus according to claim 1, characterized in that: The upper surface of cover plate (2) is provided with heat dissipation window (14), the inner wall of heat dissipation window (14) is installed with first dustproof net (9).

4. The FPGA-based high-frequency electronic circuit experiment signal processing apparatus according to claim 1, characterized in that: The bottom of casing (1) is connected with two groups of supporting legs (18), one end of each supporting leg (18) is connected with base (19).

5. The FPGA-based high-frequency electronic circuit experiment signal processing apparatus according to claim 1, characterized in that: The heat dissipation mechanism (3) includes two circular pipes (301), the outer surfaces of two circular pipes (301) are communicated with casing (1).

6. The FPGA-based high-frequency electronic circuit experiment signal processing apparatus according to claim 5, characterized in that: The inner walls of two circular pipes (301) are connected with second dustproof net (302), the inner walls of two circular pipes (301) are connected with fixed frame (303), and the sides of two fixed frames (303) close to each other are installed with fan (304).

7. The FPGA-based high-frequency electronic circuit experiment signal processing apparatus according to claim 1, characterized in that: The signal acquisition module (4) is electrically connected with FPGA processing module (5) through wires, and the FPGA processing module (5) is electrically connected with data storage module (6) through wires.

8. The FPGA-based high-frequency electronic circuit experiment signal processing apparatus according to claim 1, characterized in that: The data storage module (6) is electrically connected with communication module (7) through wires, and the communication module (7) is signal connected with display module (8).

9. The FPGA-based high-frequency electronic circuit experiment signal processing apparatus according to claim 1, characterized in that: The FPGA processing module (5) is FRGA chip, and the data storage module (6) is composed of display screen, key, knob and other input and output devices.

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