Full-color display device and manufacturing method thereof

Abstract

The invention relates to a full-color display device and a manufacturing method, a blue light LED chip and a TFT driving system are integrated, and a pixel-level light path isolation structure is constructed by adopting a black glass substrate. A through hole array matched with an LED chip is formed through synchronous laser drilling, a quantum rod solution modified by an olefine acid ligand and photo-cured by a multi-sulfydryl cross-linking agent is filled, and ordered arrangement and submicron patterning of quantum rods are achieved. And in combination with the top wavelength selective filtering reflector and the absorption of stray light by the black glass substrate, the light crosstalk is reduced, and the color saturation and the lighting effect are improved. Further, light-proof glass can be used as a substrate, the substrate and the black glass matrix adopt a homogeneous glass formula, the risk of thermal stress deformation is eliminated, and the preparation process is simplified by a back exposure curing process. The device has the characteristics of high color gamut, wide viewing angle polarization and high resolution, is short in manufacturing period and high in material utilization rate, and is suitable for the field of ultra-high-definition Micro LED full-color display.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a full-color display device and its manufacturing method. Background Technology

[0002] In the field of display technology, full-color display devices are core components enabling high-quality visual experiences. In recent years, quantum rods, as an emerging nanomaterial for luminescence, have demonstrated enormous application potential in optoelectronic devices, especially in the display field, thanks to their unique optical properties. The aspect ratio (length / diameter) of quantum rods can be flexibly adjusted according to requirements, enabling them to simultaneously achieve broad-spectrum absorption, thereby effectively improving light capture efficiency while maintaining narrow-band emission, resulting in higher color saturation and contrast for display devices. Furthermore, the anisotropic optical properties of quantum rods, such as polarized emission, can further broaden their application range in specific scenarios.

[0003] However, despite the theoretical advantages of quantum rods, their patterning in practical applications faces a series of technical challenges. First, the oriented alignment of quantum rods is crucial for achieving their polarized light emission characteristics, but current processes struggle to precisely control the orientation of quantum rods in thin films, making it difficult to maintain polarization properties and severely impacting the overall device performance. Second, the surface state of the quantum rod is vital to its stability and luminous efficiency, but it is easily damaged by ultraviolet light irradiation and developing solvents, leading to a decrease in luminous efficiency and limiting its applications, especially in full-color displays. Furthermore, existing techniques have significant limitations in the resolution of quantum rod patterning, making it difficult to achieve sub-100nm patterning precision, thus restricting the application of quantum rods in ultra-high-definition display devices.

[0004] To address the aforementioned issues, it is crucial to develop a quantum rod solution system and specific processing method that can be directly used for photolithography. This system must effectively prevent the shedding of ligands from the quantum rod surface and the aggregation of quantum rods in the solution, while reducing the generation of surface defects during patterning. This will maintain the luminescent performance and stability of the quantum rods, providing support for the realization of quantum rods in high-resolution pixelation and ultra-high-definition display applications. Summary of the Invention

[0005] The purpose of this application is to provide a full-color display device and its manufacturing method. By using photocrosslinking to achieve ordered arrangement and direct patterning of quantum rods, the polarization characteristics are preserved and device performance is improved. This simplifies the process and reduces damage. Simultaneously, a black glass substrate is used to solve the problems of thermal mismatch and blue light leakage, improving the stability, accuracy, and color perception effect of the display device, and achieving full-color display on an all-glass substrate. The full-color display device of this application includes: A substrate, on which blue LED chips are mounted; A color conversion layer, comprising a black glass substrate and a through-hole penetrating the black glass substrate, wherein a quantum rod film is included in the through-hole, and a bottom insulating layer and a top reflector are respectively included on both sides of the quantum rod film, wherein the quantum rod film includes red quantum rods, green quantum rods or blue quantum rods; The vias in the black glass substrate correspond to the positions of the blue LED chips on the substrate, and the quantum rods in the quantum rod film are arranged in an orderly manner.

[0006] In one embodiment, the substrate is made of the same material as the black glass substrate.

[0007] In one embodiment, the quantum rods in the quantum rod film include olefinic acid ligands.

[0008] In one embodiment, the quantum rod film is obtained by photocuring a mixture of quantum rods and crosslinking agent molecules containing multiple thiol functional groups.

[0009] In one embodiment, the size of the through-hole is the same as the size of the blue LED chip.

[0010] In one embodiment, the bottom insulating layer, the top reflector, and the quantum rod film are completely housed within the through-hole.

[0011] In one embodiment, the substrate also includes a TFT driving system.

[0012] This application further provides a method for manufacturing a full-color display device, comprising: The preparation of a photocrosslinkable quantum rod solution specifically includes: dissolving the quantum rod in an organic solvent, adding an olefinic acid for ligand exchange, adding an antisolvent for purification, dissolving the purified quantum rod in an organic solvent again, and then adding a crosslinking agent molecule containing multiple thiol functional groups. Fabricating blue LED chips on a substrate; A black glass plate including through holes is bonded to the substrate on which blue LED chips are formed; A photocrosslinkable quantum rod solution is coated and photocured on the location of a blue LED chip to form a quantum rod film on the blue LED chip.

[0013] In one embodiment, the method further includes the steps of depositing a bottom insulating layer on a blue LED chip, photocuring a quantum rod solution on the bottom insulating layer, and forming a top reflector on a patterned quantum rod film.

[0014] In one embodiment, an encapsulation step is also included to form an encapsulation layer covering the surface.

[0015] Compared with the prior art, this application has the following beneficial effects: Quantum rod thin films are fabricated using photopolymerization, enabling the ordered arrangement and direct patterning of quantum rods. This preserves the polarization characteristics of the quantum rods, improving the luminous efficiency and color purity of the device. The photocrosslinking process has a short reaction time, low light energy, and requires no catalyst, ensuring the stability of the quantum rods' luminescent performance. Direct photolithography patterning simplifies the process, reduces damage and performance degradation to the quantum rods, thus achieving highly stable, high-precision, and low-damage direct patterning of quantum rods.

[0016] This application uses a black glass substrate as the basic structure of the color conversion layer, with through-holes corresponding to the positions of the blue LED chips. These through-holes are filled with orderly arranged quantum rod films, achieving full-color display on a glass substrate. This solves the substrate warping problem caused by thermal mismatch between different substrate materials, improving the structural stability and reliability of the display device. By setting a bottom insulating layer and a top reflector on both sides of the quantum rod film, ensuring they are completely contained within the through-holes, this application further optimizes the optical path design, improves light utilization efficiency, reduces light loss, and achieves higher brightness and contrast while maintaining high color purity.

[0017] Furthermore, the substrate material in this application is the same as that of the black glass substrate, which further enhances the overall structural consistency of the device and helps reduce problems such as stress concentration and thermal expansion coefficient mismatch caused by material differences, thereby improving the long-term stability and service life of the device. Finally, the manufacturing method of this application also includes fabricating a TFT driving system on the substrate and forming an encapsulation layer covering the surface. The formation of the encapsulation layer effectively protects the internal structure of the device from external environmental factors such as moisture and oxygen, further improving the reliability and durability of the device.

[0018] In summary, this application achieves improvements in stability, accuracy, color perception, and lifespan of display devices through several innovations, including ordered arrangement and direct patterning of photocrosslinked quantum rods, full-color display design on black glass substrate, and optimization of optical path structure. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of the full-color display device of this application; Figure 2 This is a flowchart illustrating the manufacturing method of the full-color display device of this application; Figure 3 This is a schematic diagram of the process structure in the manufacturing method of the full-color display device of this application.

[0020] Explanation of reference numerals in the attached figures: 100, substrate; 110, blue LED chip; 200, color conversion layer; 210, bottom insulating layer; 220, quantum rod film; 230, top reflector. Detailed Implementation

[0021] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, it should be noted that, for ease of description, only the parts relevant to this application are shown in the accompanying drawings, not the entire structure. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this application.

[0022] The terms “comprising” and “having”, and any variations thereof, used in this application are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the steps or units listed, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to such process, method, product, or apparatus.

[0023] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0024] Traditional display devices are gradually facing technical bottlenecks in color performance, resolution improvement, and process stability, especially in the field of ultra-high-definition displays. Achieving pixel-level patterning with high color purity, high stability, and low damage remains a challenge, as existing technologies struggle to meet the demands of ultra-high-definition displays in terms of pixel size, luminous stability, and efficiency. To address these issues, this application proposes a novel full-color display device and its manufacturing method. By introducing a photocrosslinked quantum rod solution system and a black glass substrate structure, the technical bottleneck of quantum rod patterning is overcome. Using a blue LED chip as the light source, combined with a quantum rod thin film positioned by through-holes within the black glass substrate, the ordered arrangement of quantum rods and direct photolithographic patterning are achieved, improving luminous efficiency and color purity while preserving polarization characteristics. The manufacturing method rapidly solidifies the quantum rods through a photocrosslinking reaction, simplifying the process and reducing damage to the quantum rods. Combined with the all-glass substrate design of the black glass substrate, it effectively avoids substrate warping and blue light leakage problems caused by thermal mismatch, providing technical assurance for the high stability, high precision, and long lifespan of the full-color display device. The following will provide a detailed introduction to the device's structural design, material innovation, and manufacturing process. Please refer to [link to relevant documentation]. Figure 1 A full-color display device in one embodiment of this application includes: Substrate 100, on which blue LED chip 110 is included; A color conversion layer 200 includes a black glass substrate and a through hole penetrating the black glass substrate. The through hole includes a quantum rod film 220. A bottom insulating layer 210 and a top reflector 230 are respectively included on both sides of the quantum rod film 220. The quantum rod film 220 includes red quantum rods, green quantum rods or blue quantum rods. The positions of the through holes in the black glass substrate correspond to the positions of the blue LED chip 110 on the substrate 100, and the quantum rods in the quantum rod film 220 are arranged in an orderly manner.

[0025] The substrate 100, serving as the supporting structure for the display device, can be made of a material with high thermal conductivity and high flatness. A blue LED chip 110 is integrated on it, serving as the excitation light source and emitting high-purity blue light to provide reliable light energy input for subsequent color conversion. Full-color display is achieved using the photoluminescence principle. The color conversion layer 200 is the key layer for achieving full-color display. Its core structure consists of a black glass substrate and an array of through-holes running through it. The black glass substrate not only serves as the carrier for the through-holes but also effectively reduces crosstalk and leakage of light within the device due to its strong absorption characteristics for stray light, thereby improving the contrast and color purity of the image. Each through-hole corresponds to the position of a blue LED chip 110 on the substrate 100.

[0026] The through-hole is filled with a quantum rod film 220, which is composed of red, green, or blue quantum rods (selected according to display requirements) arranged in an ordered manner. The ordered arrangement of the quantum rods is achieved through a photocrosslinking process, which automatically guides the quantum rods to align in a specific direction during the film curing process, thereby preserving their anisotropic optical properties, such as polarized light emission, and bringing higher color saturation and a wider viewing angle to the display device.

[0027] On both sides of the quantum rod film 220, a bottom insulating layer 210 and a top reflector 230 are respectively disposed. The bottom insulating layer 210 can be closely attached to the blue LED chip 110, and can reflect the blue light emitted by the chip and the light that is not completely absorbed in the quantum rod film 220 back into the film for secondary or multiple uses, thereby improving the light energy utilization rate. The top reflector 230 is located on the light-emitting side of the quantum rod film 220, and can control the reflection of light of specific wavelengths, ensuring the efficient transmission of the desired color light and further reducing light loss.

[0028] The ordered arrangement of quantum rods in the quantum rod thin film 220, combined with its narrowband emission characteristics, allows for precise control of the wavelength range of emitted light, thereby achieving precise regulation of high-purity red, green, and blue primary color displays. Simultaneously, the absorption of stray light by the black glass substrate further reduces color aliasing and enhances color saturation. The ordered arrangement of the quantum rods preserves their polarized light emission characteristics, enabling the display device to maintain stable color performance and contrast over a wide viewing angle. Furthermore, the structural design of this full-color display device fully considers compatibility with existing manufacturing processes, facilitating large-scale production based on existing manufacturing methods.

[0029] Both the substrate 100 and the black glass substrate are made of opaque glass materials. Through glass doping processes, they achieve a transmittance of less than 1% in the visible light range, ensuring that light can only exit through pre-designed vias in the black glass substrate. Specifically, the substrate 100, as the carrier structure for the blue LED chip 110, completely shields lateral light leakage from the chip, preventing light crosstalk between adjacent pixels. The black glass substrate controls the light path through an array of vias. The aperture and depth of the vias are optimized according to the light-emitting requirements of the quantum rod film 220, and the inner walls of the vias can be polished to reduce light scattering. The material consistency between the substrate 100 and the black glass substrate is reflected in the use of the same glass formulation, with a thermal expansion coefficient difference of less than 0.05% within a temperature range of -40℃ to 120℃, thereby eliminating the risk of structural deformation caused by thermal stress.

[0030] Pixel-level optical path isolation and zero crosstalk are achieved by using the opacity of the substrate 100 and the black glass substrate to create a closed optical environment, completely confining the light emitted by the blue LED chip 110 to propagate in the vertical direction. The through-hole in the black glass substrate serves as the sole light-emitting channel, with its aperture corresponding to the light-emitting area of ​​the quantum rod film 220, ensuring that red, green, and blue light are emitted only from designated pixel positions. Actual measurement data shows low optical crosstalk between adjacent pixels, superior to the traditional semi-transparent substrate 100 structure.

[0031] The substrate 100 and the black glass substrate, made of the same material, exhibit consistent thermal expansion behavior. During temperature cycling tests, no visible cracks or peeling were observed at the interface. The opaque substrate 100 eliminates lateral light leakage from the blue LED chip 110, allowing the excitation light energy to be concentrated onto the quantum rod film 220. Material consistency simplifies the bonding process between the substrate 100 and the black glass substrate, achieving a seamless connection and high bonding strength. Through-hole processing utilizes synchronous laser drilling technology, enabling the formation of an array of through-holes in a single process. Furthermore, the driving electrode can be directly deposited on the surface of the substrate 100 without concerns about light leakage interference.

[0032] The quantum rods in the quantum rod film 220 have a specially chemically modified surface containing alkenoic acid ligands (such as oleic acid, linoleic acid, and other unsaturated fatty acid ligands). These ligands form stable chemical bonds with the quantum rod surface and can also include carboxylic acid groups (-COOH), giving the quantum rods excellent solution dispersibility and interfacial compatibility. Simultaneously, steric hindrance can prevent aggregation between quantum rods. The carbon-carbon double bonds (C=C) in the alkenoic acid ligands can participate in thiol-alkene chemical reactions under ultraviolet light (365nm) or visible light (405nm). The inner walls of the through-holes in the black glass substrate can be pre-coated with a thiol silane coupling agent, forming a three-dimensional network structure through covalent cross-linking, thereby improving the adhesion of the quantum rod film 220. The photocrosslinking activity of the acrylic acid ligands allows the quantum rod film 220 to directly participate in the photolithography process. During the exposure stage, ultraviolet light initiates a crosslinking reaction between the ligand double bonds and mercaptosilane, forming a network structure with adjustable crosslinking density (controlled by the light dose). The unexposed areas of the quantum rods retain their solution dispersion and can be quickly removed with a solution (such as isopropanol), achieving submicron-level direct pixel patterning. The quantum rod film 220 can be prepared using low-cost processes such as spin coating, spray coating, or slot coating, improving material utilization. At the same time, the rapid curing characteristics of the photocrosslinking reaction shorten the manufacturing time of monolithic devices, improving yield and reducing costs.

[0033] The quantum rod film 220 is prepared by photocuring through a solution blending system of quantum rods and multi-thiol crosslinking agent molecules, combined with a UV / visible light-induced thiol-alkene click chemical reaction. Specifically, the surface of the quantum rods is pre-modified with alkenoic acid ligands containing carbon-carbon double bonds (C=C). The crosslinking agent used is a multi-thiol crosslinking agent, such as pentaerythritol tetramercaptoacetate (PETM) or 3-mercaptopropyltrimethoxysilane (MPTMS). After solution blending, the mixture is filled into the through-holes of a black glass substrate by spin coating or slot coating. Under UV or visible light irradiation, the thiol groups react chemically with the double bonds. Unreacted thiol groups or double bonds can be further crosslinked by subsequent heat treatment (80~100℃, 5 minutes) to eliminate residual stress. During the photocuring process, the multi-thiol crosslinking agent molecules form an anisotropic crosslinking network. The guiding effect of its chain segments causes the quantum rods to preferentially align along the double bond alignment direction (i.e., the long axis direction of the quantum rod). Polarization luminescence testing shows that the polarization ratio of the crosslinked quantum rod film 220 is improved.

[0034] The via adopts a micro-nano structure that matches the size of the blue LED chip 110. Its aperture is the same as the chip's light-emitting area, allowing the light emitted by the blue LED chip 110 to directly enter the via without generating additional waste and improving energy efficiency. In a further technical solution, the bottom insulating layer 210, the top reflector 230, and the quantum rod film 220 are completely housed within the via. The overall structure is within the via structure, and the reflector and quantum rod film 220 structure are not affected by the thermal expansion of the black glass substrate 100, thereby ensuring uniformity and maintaining dimensional stability, and avoiding misalignment between the quantum rod film 220 and the reflector due to thermal expansion and contraction.

[0035] Furthermore, the substrate 100 also includes a TFT driving system. The TFT array is formed on the surface of the substrate 100 formed of black glass, and the driving circuit and the through-hole array are arranged in an alternating layout. A TFT pixel unit is disposed below each through-hole to achieve independent driving.

[0036] In addition, this application further provides a method for manufacturing a full-color display device, comprising: The preparation of a photocrosslinkable quantum rod solution specifically includes: dissolving the quantum rod in an organic solvent, adding an olefinic acid for ligand exchange, adding an antisolvent for purification, dissolving the purified quantum rod in an organic solvent again, and then adding a crosslinking agent molecule containing multiple thiol functional groups. A blue LED chip 110 is fabricated on a substrate 100; A black glass including through holes is attached to the substrate 100 on which the blue LED chip 110 is formed; A photocrosslinkable quantum rod solution is coated and photocured on the position of the blue LED chip 110 to form a quantum rod thin film 220 on the blue LED chip 110.

[0037] The specific steps include dispersing quantum rods corresponding to red, green, and blue light in an organic solvent, adding olefinic ligands, stirring, and replacing the original surface ligands through ligand exchange to form a quantum rod solution. An antisolvent is then added dropwise to the solution to induce quantum rod aggregation and precipitation. Centrifugation is performed, and this process is repeated three times to remove unreacted ligands and impurities. Red quantum rods can convert light emitted by a blue LED into red light, green quantum rods can convert light emitted by a blue LED into green light, and blue quantum rods can convert non-defined wavelength blue light emitted by a blue LED into defined wavelength blue light. In a further embodiment, when the wavelength of the blue LED directly meets the requirements, it can be used directly without conversion. In this case, blue quantum rods are not needed; the position of the blue quantum rod is left empty, and a top reflector 230 is formed within the through-hole to filter the light emitted by the blue LED.

[0038] The purified quantum rods were redispersed in an organic solvent (specifically toluene), and pentaerythritol tetramercaptoacetate was added. Its tetramercapto structure can form a three-dimensional network with the C=C double bond of oleic acid on the surface of the quantum rod through a mercapto-alkene click chemical reaction, thus forming red light quantum rod solution, green light quantum rod solution and blue light quantum rod solution.

[0039] Black, high thermal conductivity borosilicate glass is selected as the substrate 100 for the blue LED chip 110. The blue LED chip 110 can be flip-chip bonded to the substrate 100 using a eutectic bonding process.

[0040] A through-hole array is formed on black glass using synchronous laser drilling. The black glass and substrate 100 are then bonded together to form a seamless connection. A quantum rod solution is then applied to fill the through-holes in the black glass using a coating process. The through-hole areas are exposed to ultraviolet light, which triggers a cross-linking reaction of the ligands on the quantum rods. The unexposed areas of the quantum rods are dissolved, forming a display device with a quantum dot film filled within the through-holes.

[0041] The process also includes the steps of depositing a bottom insulating layer 210 on the blue LED chip 110, photocuring the quantum rod solution on the bottom insulating layer 210, and forming a top reflector 230 on the patterned quantum rod film 220. A composite reflector is deposited on the surface of the blue LED chip 110, and reflector units aligned with the via array are formed by etching. The size of the bottom insulating layer 210 corresponds to the size of the blue LED chip 110 and the vias. Since it corresponds to different wavelengths of light, corresponding reflectors need to be deposited at different positions. After the bottom insulating layer 210 is formed, a black glass substrate 100 is placed on the substrate 100 on which the bottom insulating layer 210 is formed. The positions of the vias of different colors correspond to the bottom insulating layer 210 of the corresponding colors. The bottom insulating layer 210 and the top reflector 230 include alternatingly deposited multi-period optical film layers, with center wavelengths corresponding to red, green, and blue, respectively. The top reflector 230 acts as a wavelength-selective filter, allowing only the target color light to pass through. By optimizing the three-layer structure of reflector-quantum rod-reflector, improvements in light efficiency, color, and reliability are achieved.

[0042] To improve the stability of the device, an encapsulation step is also included to form an encapsulation layer covering the surface, which protects the color conversion layer 200.

[0043] In the formation method, a liquid quantum rod solution needs to be filled into a black glass substrate. After filling, photocuring is required. If curing is performed from the front, a preferred solution is to use light of the same size as the through-hole, irradiating only the through-hole location. This ensures that only the quantum rod solution within the through-hole is cured, and excess quantum rod solution can be removed subsequently using a solution method, preventing curing of the quantum rod solution outside the through-hole. In this specific method, the size and position of the curing light need to be controlled. In a further technical solution, utilizing the opaque nature of the black glass substrate, the quantum rod solution is irradiated with light from a blue LED chip after filling. This eliminates the need for an additional template and adjustment of the size of the light used for photocuring. Furthermore, because it strictly corresponds to the through-hole size, in this solution, the black glass substrate not only serves as the main body of the color conversion layer 200 but also as a template for the photocuring process. During this process, the luminous state of the blue LED chip can be detected simultaneously. This specific method greatly simplifies the fabrication process.

[0044] In an advanced technical solution, in order to control the stability of each layer of the color conversion layer 200, the black glass substrate 100 adopts an independent two-layer structure. The bottom layer structure is used alone to form the quantum rod film 220. The specific formation steps are the same as the main steps mentioned above. After being placed on the substrate 100, the quantum rod solution is filled in, and a quantum rod film 220 is formed in the bottom layer structure that is flush with the upper surface of the bottom layer structure. In a further technical solution, in order to ensure the flatness of the structure and the uniformity of the thickness of the layer, the bottom layer structure can be planarized on the upper surface after photocuring.

[0045] After the bottom layer structure is fabricated, the upper layer structure is placed on top of it. Specifically, the upper layer structure can be formed by creating a top reflective layer on a substrate, etching it, and then placing the black glass used for the upper layer structure on that substrate to form the final upper layer structure. After stacking, the substrate can be removed. In a preferred embodiment, this substrate serves as a packaging layer.

[0046] The technical solution of this application adopts a black glass substrate 100 integrating a TFT driving system, a blue LED chip 110, and a top reflector, combined with laser drilling and a quantum rod color conversion layer, to achieve a full-color display on a glass substrate, solving the problems of thermal mismatch and blue light leakage. Based on this technology, the high color gamut, high-resolution full-color Micro LED display system has superior performance in the field of ultra-high-definition display, especially in terms of polarization characteristic retention and luminous efficiency improvement. Specific Implementation The following will further introduce some specific implementation methods to provide a more detailed explanation of the technical solution of this application.

[0048] Example 1 Quantum rods were dissolved in octane to a concentration of 30 mg / mL. Then, 30 mg / mL of undecenoic acid was added to the quantum rod solution at a mass ratio of 40%, followed by ligand exchange. After stirring for 5 minutes, an equal volume of the antisolvent ethanol was added, and the mixture was purified by centrifugation at least three times. The supernatant was discarded, the solid was dried, and dissolved in toluene to form a quantum rod solution with successfully exchanged ligands.

[0049] Pentaerythritol tetramercaptoacetate (PETM, a crosslinking agent molecule containing multiple thiol functional groups) was added to a quantum rod solution with a ligand exchange success. The concentration of the solution was 10 mg / mL, and the mass ratio of the added PETM was 5%, thus forming a quantum rod solution that can be photocrosslinked.

[0050] A TFT driving system and a blue LED chip were fabricated on a black glass substrate.

[0051] A bottom insulating layer is deposited on a blue LED chip using a coating and patterning process to obtain a light source driving system.

[0052] Using black glass as the substrate for the quantum rod color conversion layer, through-holes approximately the same size as the LED chip light source were created through laser drilling and etching processes, and then attached to the aforementioned light source driving sample. Subsequently, a photocrosslinkable quantum rod solution was formed within the through-holes using inkjet printing. Under a mask, the image was exposed to ultraviolet light for 120 seconds, and finally developed with a developer to obtain a patterned quantum rod film.

[0053] A top reflector is deposited in all the holes using a coating and patterning process. The top reflector also uses photonic crystals, DBRs, etc., and its reflectivity is lower than that of the bottom insulating layer to ensure front light emission. Finally, it is encapsulated to obtain a complete high color gamut, high resolution micro LED display system, resulting in an all-glass micro LED display system.

[0054] Example 2 Quantum rods were dissolved in hexane to a concentration of 30 mg / mL. Then, 30 mg / mL of undecenoic acid was added to the quantum rod solution at a mass ratio of 1%-80%, followed by ligand exchange. After stirring for 5 minutes, an equal volume of the antisolvent ethanol was added, and the mixture was purified by centrifugation at least three times. The supernatant was discarded, the solid was dried, and dissolved in toluene to form a quantum rod solution with successfully exchanged ligands.

[0055] 3-Mercaptopropyltrimethoxysilane (MPTMS) was added to the quantum rod solution after successful ligand exchange at a concentration of 10 mg / mL and a mass ratio of 8% to form a photocrosslinkable quantum rod solution.

[0056] A TFT driving system and a blue LED chip were fabricated on a black glass substrate.

[0057] A bottom insulating layer is deposited on a blue LED chip using a coating and patterning process to obtain a light source driving system.

[0058] Black glass was used as the color conversion layer for the quantum rods. Through-holes, approximately the same size as the LED chip light source, were created through laser drilling and etching processes and then attached to the aforementioned light source driving sample. Subsequently, a photocrosslinkable quantum rod solution was used to form a quantum rod thin film using inkjet printing and photolithography. Under a mask, the film was exposed to ultraviolet light for 120 seconds and finally developed with a developer to obtain a patterned quantum rod thin film.

[0059] A top reflector is deposited in all the holes using a coating and patterning process. The top reflector also uses DBR, which has a lower reflectivity than the bottom insulating layer, ensuring light emission from the front. Finally, it is encapsulated to obtain a complete micro LED display system with high color gamut and high resolution.

[0060] Example 3 Quantum rods were dissolved in toluene to a concentration of 30 mg / mL. Then, 30 mg / mL of dodecenoic acid was added to the quantum rod solution at a mass ratio of 1%-80%, followed by ligand exchange. After stirring for 5 minutes, an equal volume of the antisolvent ethanol was added, and the mixture was purified by centrifugation at least three times. The supernatant was discarded, the solid was dried, and dissolved in toluene to form a quantum rod solution with successfully exchanged ligands.

[0061] Pentaerythritol tetramercaptoacetate (PETM) was added to the quantum rod solution after successful ligand exchange at a concentration of 10 mg / mL and a mass ratio of 0.1%-10% to form a photocrosslinkable quantum rod solution.

[0062] A TFT driving system and a blue LED chip were fabricated on a black glass substrate.

[0063] A bottom insulating layer is deposited on a blue LED chip using a coating and patterning process to obtain a light source driving system.

[0064] Black glass was used as the color conversion layer for the quantum rods. Through-holes, approximately the same size as the LED chip light source, were created through laser drilling and etching processes and then attached to the aforementioned light source driving sample. Subsequently, a photocrosslinkable quantum rod solution was used to form a quantum rod thin film using inkjet printing and photolithography. Under a mask, the film was exposed to ultraviolet light for 120 seconds and finally developed with a developer to obtain a patterned quantum rod thin film.

[0065] A top reflector is deposited in all the holes using a coating and patterning process. The top reflector also uses a grating, and its reflectivity is lower than that of the bottom insulating layer to ensure front light emission. Finally, it is encapsulated to obtain a complete high color gamut, high resolution micro LED display system, resulting in an all-glass micro LED display system.

[0066] As described above, this application proposes a full-color display device and its manufacturing method. The device uses opaque, high-thermal-conductivity borosilicate glass as a substrate, integrating a blue LED chip and a TFT driving system. A pixel-level optical path isolation structure is constructed through a black glass substrate. A through-hole array matching the LED chip is formed in the black glass substrate using synchronous laser drilling technology. A photocrosslinkable quantum rod solution system, through alkanoic acid ligand modification and a thiol-alkene click chemical reaction with a multi-thiol crosslinking agent (such as PETM, MPTMS), achieves the ordered arrangement and sub-micron-level patterning of the quantum rods within the through-holes, thereby improving the polarization ratio of the quantum rod film. A three-layer optical structure consisting of a bottom reflector, a quantum rod, and a top reflector is constructed. The bottom insulating layer is tightly attached to the LED chip to achieve total internal reflection of blue light. The top reflector acts as a wavelength-selective filter, and combined with the strong absorption characteristics of the black glass substrate for stray light, the crosstalk rate between adjacent pixels is reduced compared to traditional structures, resulting in improved color saturation. The substrate and the black glass substrate use the same glass composition and have a small difference in thermal expansion coefficient, achieving a seamless connection through bonding technology and eliminating the risk of structural deformation caused by thermal stress. In addition, a back-side exposure curing process can be used, utilizing the opaque nature of the black glass substrate as a natural photomask. Precise curing of the quantum rod solution within the through-hole can be achieved simply by irradiating from the back, simplifying the fabrication process. This device, through the synergistic effect of the narrow-band emission characteristics and polarized light emission characteristics of the quantum rod, combined with an all-glass substrate encapsulation structure, maintains wide viewing angle color stability while improving luminous efficiency, shortening manufacturing time, and increasing material utilization. It is particularly suitable for the field of ultra-high-definition Micro LED displays and can be fabricated using low-cost processes such as spin coating / slit coating. It is also fully compatible with existing TFT driving technology, providing a mass-producible solution for high color gamut and high-resolution full-color displays.

[0067] The above is only one specific implementation of this application, and any other improvements made based on the concept of this application shall be considered within the scope of protection of this application.

Claims

1. A full-color display device, characterized in that, include: A substrate, on which blue LED chips are mounted; A color conversion layer, comprising a black glass substrate and a through-hole penetrating the black glass substrate, wherein a quantum rod film is included in the through-hole, and a bottom insulating layer and a top reflector are respectively included on both sides of the quantum rod film, wherein the quantum rod film includes red quantum rods, green quantum rods or blue quantum rods; The vias in the black glass substrate correspond to the positions of the blue LED chips on the substrate, and the quantum rods in the quantum rod film are arranged in an orderly manner.

2. The full-color display device according to claim 1, characterized in that, The substrate is made of the same material as the black glass substrate.

3. The full-color display device according to claim 1, characterized in that, The quantum rods in the quantum rod film include olefinic acid ligands.

4. The full-color display device according to claim 3, characterized in that, The quantum rod film is obtained by photocuring a mixture of quantum rods and crosslinking agent molecules containing multiple thiol functional groups.

5. The full-color display device according to claim 1, characterized in that, The size of the through hole is the same as the size of the blue LED chip.

6. The full-color display device according to claim 5, characterized in that, The bottom insulating layer, the top reflector, and the quantum rod film are completely housed within the through-hole.

7. The full-color display device according to claim 1, characterized in that, The substrate also includes a TFT driving system.

8. A method for manufacturing a full-color display device, characterized in that, include: The preparation of a photocrosslinkable quantum rod solution specifically includes: dissolving the quantum rod in an organic solvent, adding an olefinic acid for ligand exchange, adding an antisolvent for purification, dissolving the purified quantum rod in an organic solvent again, and then adding a crosslinking agent molecule containing multiple thiol functional groups. Fabricating blue LED chips on a substrate; A black glass plate including through holes is bonded to the substrate on which blue LED chips are formed; A photocrosslinkable quantum rod solution is coated and photocured on the location of a blue LED chip to form a quantum rod film on the blue LED chip.

9. The method for manufacturing a full-color display device according to claim 8, characterized in that, It also includes the steps of depositing a bottom insulating layer on a blue LED chip, photocuring a quantum rod solution on the bottom insulating layer, and forming a top reflector on a patterned quantum rod film.

10. The method for manufacturing a full-color display device according to claim 9, characterized in that, It also includes an encapsulation step to form an encapsulation layer covering the surface.

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