Device and method for desorbing and separating substances in material

Abstract

The invention discloses a desorption and separation device and a desorption and separation method for substances in a material, and belongs to the technical field of impurity desorption, and the desorption and separation method comprises the following steps: obtaining absorption wavelengths, half-peak widths and relative intensities of all binding bonds between a target material and a specific substance, and obtaining binding bond energy between the target material and the specific substance; an irradiation generating device is adopted to irradiate a target material, energy emitted by the irradiation generating device is radiation or radiation combination equal to binding bond energy between the target material and a specific substance, and the specific substance and the target material are removed. According to the method for desorbing and separating the substances in the material, the energy of the binding bond between the target material and the specific substance is obtained, the radiation energy is accurately provided by utilizing the radiation generation device, the accurate cutting of the binding bond between the target material and the specific substance is realized, and on the premise that the phase change of the material is not influenced and the performance of the material is not damaged, the separation efficiency is improved. And efficient desorption of a target material and a specific substance is realized.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of separation engineering, and particularly relates to a material substance desorption separation device and a desorption separation method. BACKGROUND

[0002] In the fields of material processing, separation and purification, and environmental protection, there is often a need to separate substances connected by van der Waals forces, hydrogen bonds and coordination bonds, such as extracting salts dissolved in water, removing excess moisture from wood and grain, and removing residual organic solvents, water and oxygen from perovskite batteries produced by the solution method.

[0003] In order to improve the efficiency of separation between two or more substances combined together, there are mainly ways to reduce the binding force between substances, increase the free path of molecular motion, and increase the directionality of molecular motion. Among them, reducing the molecular binding force includes heating, supercritical state, solvent replacement and bond destruction; methods to increase the molecular free path include reducing the particle size of the substance, vacuuming, etc.; increasing the speed of directional motion of molecules includes electrophoresis, concentration gradient, pressure gradient diffusion, etc., among which the concentration gradient includes polyethylene glycol covering, activated carbon adsorption, copper high-temperature adsorption of oxygen, nitrogen purging and vacuuming, etc., and the pressure gradient diffusion includes Malan Goni drying and reverse osmosis, etc.

[0004] Among many desorption processes, heating is one of the most effective means of decomposing and separating substances. By heating, the average kinetic energy of the molecules can be increased, making it easier for the molecules to overcome the bond energy barrier and accelerating the decomposition and separation of the substances. At the same time, as the speed of molecular motion increases, the diffusion speed of the separated molecules also increases, further improving the efficiency of the separation of the substances. Common heating methods include thermal radiation, heat conduction, convection, microwaves, magnetic heating, phase change, etc. As a common heating method, thermal radiation is usually required to select a radiation wavelength that matches the absorption spectrum of the heated substance in order to improve the effect of radiation heating. When the radiation wavelength matches the energy level of the covalent bond or hydrogen bond between the two phases, the radiation will correspondingly destroy the combination between the substances, thereby achieving the separation of the two-phase substances.

[0005] However, heating can destroy certain systems, especially in many cases where a solution method is used to prepare a thin film of material B by using solvent A, which takes advantage of the fact that the action of solvent molecules A on solute molecules B exceeds the interaction between solute molecules, thereby dissolving the solute. During the evaporation of the solvent, high temperatures can accelerate the evaporation of the solvent A while destroying the structure of the solute B thin film, such as Figure 1As shown in the figure. When the precursor of CH3NH3PbI3 perovskite material is dissolved in organic solvent DMF, a thin film is prepared by spin coating or printing method, and then a thin film with perovskite structure is obtained by heating to volatilize most of the solvent and phase transition of the material. However, a small amount of residual solvent, water and oxygen in the thin film can hardly be further removed, and these residual substances can accelerate the destruction of the material during the use of the perovskite device, eventually leading to the failure of the device.

[0006] Correspondingly, the laser cleaning technology is a new pollution-free surface cleaning technology, which realizes the cleaning purpose of desorption of surface pollutants during laser irradiation. The laser cleaning process is very complex, and there may be multiple mechanisms during the cleaning process, including various physical and chemical changes, such as ablation, decomposition, ionization, degradation, melting, combustion, vaporization, vibration, spatter, expansion, contraction, explosion, peeling and shedding. Therefore, although laser desorption can cut off the binding between the pollutants and the substrate, it will also damage the substrate. The laser wavelength used by the conventional laser cleaning device is fixed, and it does not have selectivity for material separation. For example, the Chinese patent with publication number CN1078415A discloses a method for removing surface contaminants by irradiation, which proposes a method for removing contaminants by using single photon energy twice the binding energy between the contaminants and the device. The patent points out that the binding energy of common contaminants (such as carbon and oxygen) on the surface of common substrates (such as silicon, titanium, iron, aluminum) is generally 2-7eV, so the patent selects the laser single photon energy range of 4-14eV. This patent technology has two shortcomings: 1. The absorption of radiation by matter follows the Fermi golden rule, only the laser with energy matching the binding energy will be absorbed by the binding, and the separation effect of the two substances is very limited by using the laser twice the binding energy; 2. The patent only points out a relatively wide range of binding energy between the contaminants and the device, and does not disclose the selection method of the specific laser wavelength or frequency (single photon energy), so it cannot effectively cut off the binding between different substances and does not damage the structure of the material. SUMMARY

[0007] In view of one or more of the above defects or improvement needs of the prior art, the present application provides a material desorption separation method for solving the problems of low desorption efficiency and damage to the target material in the existing irradiation desorption process.

[0008] To achieve the above-mentioned purpose, the present application provides a material desorption separation method for separating specific substances adsorbed in or on the target material, which comprises the following steps: Obtain the absorption wavelength, half peak width and relative intensity of all the binding energies between the target material and the specific substance, and obtain the binding energy between the target material and the specific substance; The irradiation device is used to irradiate the target material, and the energy emitted by the irradiation device is radiation or radiation combination which is equal to the bond energy between the target material and the specific substance, so as to remove the specific substance from the target material.

[0009] As a further improvement of the present application, the absorption wavelength, half-peak width and relative intensity of all the bond between the target material and the specific substance are obtained by numerical calculation method and experimental method.

[0010] As a further improvement of the present application, the experimental method comprises: The target material is irradiated by using the radiation source with continuous change of wavelength, half-peak width and intensity; The overflow amount of the specific substance in the target material and the material quality and phase change state of the target material are monitored, so as to determine the desorption amount of the specific substance and whether the target material is damaged; The wavelength, half-peak width and intensity when the desorption amount of the specific substance is maximum and the target material is not damaged are obtained.

[0011] As a further improvement of the present application, the energy emitted by the irradiation device comprises one or more of gamma rays, X-rays, ultraviolet rays, visible light, infrared rays, microwaves, neutrons and beta rays.

[0012] As a further improvement of the present application, the polarization state of the energy emitted by the irradiation device comprises one or more of left-handed light, right-handed light, partial polarization light, elliptical polarization light, circular polarization light and natural light.

[0013] As a further improvement of the present application, the irradiation device is one of a frequency-adjustable laser, a combination of a light source and a selective filtering device, a combination of a light source and a selective reflecting device, a multi-frequency light source and a multi-radiation coupling device.

[0014] As a further improvement of the present application, the radiation or radiation combination emitted by the irradiation device covers the absorption wavelength, waveform and intensity of all the bond between the target material and the specific substance and does not damage the target material.

[0015] As a further improvement of the present application, when the target material is irradiated by the irradiation device, one or more of ultrasonic, supercritical, vacuum and heating methods are used to treat the target material.

[0016] As a further improvement of the present application, when the target material is treated by vacuum, the target material is located in a vacuum cavity, the irradiation device is located outside the vacuum cavity, and the irradiation energy of the irradiation device is introduced into the vacuum cavity through a transparent material.

[0017] The application also comprises a material-substance desorption separation device for the desorption separation of the material-substance desorption separation method, which comprises: A reaction cavity, wherein a first communication hole and a second communication hole are arranged on the reaction cavity, the first communication hole is provided with an irradiation generating device, and the second communication hole is used for communication between the inside and outside of the reaction cavity and is provided with an opening and closing device.

[0018] The above technical features can be combined with each other as long as they do not conflict with each other.

[0019] Overall, compared with the prior art, the above technical solutions conceived by the application have the beneficial effects including: (1) The material-substance desorption separation method of the application can accurately obtain the absorption wavelength, half-peak width and relative intensity of the binding bond between the target material and the specific substance, so as to obtain the binding bond energy between the target material and the specific substance, accurately provide the radiation energy by using the irradiation generating device, accurately cut the binding bond between the target material and the specific substance, and realize the efficient desorption of the target material and the specific substance without affecting the phase change of the material itself and damaging the performance of the material. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 is a schematic diagram of the relationship between the interaction and the condensation state of the solution and the solute in the prior art; Figure 2 is a schematic diagram of the overall structure of the material-substance desorption separation device in the embodiment of the application; Figure 3 is a graph of the relationship between the residual solvent content and the desorption time of the target material in the material-substance desorption separation device in the embodiment of the application under solvent desorption, normal temperature and pressure nitrogen desorption, normal temperature vacuum desorption and high temperature vacuum desorption.

[0021] In all the drawings, the same reference signs represent the same technical features, specifically: 1, reaction cavity; 2, first communication hole; 3, second communication hole; 4, third communication hole; 5, irradiation generating device; 6, vacuumizing equipment; 7, article tray. DETAILED DESCRIPTION

[0022] In order to make the purpose, technical solutions and advantages of the application clearer, the application will be further described in detail below with reference to the drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the application and do not limit the application. In addition, the technical features involved in each embodiment of the application described below can be combined with each other as long as they do not conflict with each other.

[0023] In the description of the present application, it is to be understood that the orientations or positional relationships indicated by the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements indicated thereby must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0024] In addition, unless otherwise specified, the terms "first", "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated thereby. Therefore, the features defined with "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise specifically limited.

[0025] In the present application, unless otherwise specifically specified and limited, the terms "mounting", "connecting", "connecting", "fixing" and the like should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise specifically limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0026] In the present application, unless otherwise specifically specified and limited, the first feature is "on" or "under" the second feature, which can be direct contact between the first and second features, or indirect contact between the first and second features through an intermediate medium. Moreover, the first feature "above", "above" and "above" the second feature can be directly above or obliquely above the first feature, or only indicate that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" the second feature can be directly below or obliquely below the first feature, or only indicate that the horizontal height of the first feature is less than that of the second feature.

[0027] Embodiment: Please refer to Figure 2 , Figure 3 The material substance desorption separation method in the preferred embodiment of the present application is used to separate specific substances adsorbed inside or on the surface of the target material, which comprises the following steps: Obtain the absorption wavelength, half-peak width and relative intensity of all the binding bonds between the target material and the specific substance, and obtain the binding bond energy between the target material and the specific substance; The irradiation generating device 5 is used to irradiate the target material, and the energy emitted by the irradiation generating device 5 is radiation or a radiation component that is equal to the binding bond energy between the target material and the specific substance, so as to remove the specific substance from the target material.

[0028] In the material substance desorption separation method, the absorption wavelength, half-peak width and relative intensity of all the binding bonds between the target material and the specific substance are accurately obtained, so as to obtain the binding bond energy between the target material and the specific substance, and the irradiation generating device 5 is used to accurately provide the radiation energy, so as to accurately cut the binding bond between the target material and the specific substance, and realize the efficient desorption of the target material and the specific substance without affecting the phase change of the material itself and damaging the performance of the material.

[0029] Further, as an optional embodiment of the present application, the method for obtaining the absorption wavelength, half-peak width and relative intensity of all the binding bonds between the target material and the specific substance in the present application includes a numerical calculation method and an experimental method.

[0030] The experimental method includes: A radiation source with continuous changes in wavelength, half-peak width and intensity is used to irradiate the target material; The overflow amount of the specific substance in the target material and the material quality and phase change state of the target material are monitored, so as to determine the desorption amount of the specific substance and whether the target material is damaged; The wavelength, half-peak width and intensity when the desorption amount of the specific substance is maximum and the target material is not damaged are obtained.

[0031] Further, as an optional embodiment of the present application, the energy emitted by the irradiation generating device 5 in the present application includes one or more of gamma rays, X-rays, ultraviolet rays, visible light, infrared rays, microwaves, neutrons and beta rays.

[0032] Further, as an optional embodiment of the present application, the polarization state of the energy emitted by the irradiation generating device 5 in the present application includes one or more of left-handed light, right-handed light, partially polarized light, elliptical polarized light, circular polarized light and natural light.

[0033] Further, as an optional embodiment of the present application, the irradiation generating device 5 in the present application is one of a frequency-adjustable laser, a combination of a light source and a selective filtering device, a combination of a light source and a selective reflecting device, a multi-frequency light source and a plurality of radiation coupling devices.

[0034] Further, as an optional embodiment of the present application, the radiation or radiation combination emitted by the irradiation generating device 5 covers the absorption wavelength, wave form and intensity of all the binding bonds between the target material and the specific substance, and does not destroy the target material. The radiation or radiation combination can cover the absorption wavelength, wave form and intensity of all the binding bonds between the target material and the specific substance, so as to ensure that the radiation energy can cut off all the binding bonds between the target material and the specific substance, so as to realize the separation of the target material and the specific substance. The radiation energy does not destroy the material, which means that the radiation energy does not cause the phase change of the target material, and does not cause structural damage or reaction to generate other substances to the target material.

[0035] Further, as an optional embodiment of the present application, when the target material is irradiated by the irradiation generating device 5, one or more of ultrasonic, supercritical, vacuum or heating methods are used to treat the target material. The ultrasonic, supercritical, vacuum or heating can assist in enhancing the separation efficiency between the target material and the specific substance. In the actual desorption process, one or more of the ultrasonic, supercritical, vacuum or heating methods are selectively used according to the characteristics of the target material and the specific substance.

[0036] Further, as an optional embodiment of the present application, when the target material is treated by vacuum, the target material is located in a vacuum chamber, the irradiation generating device is located outside the vacuum chamber, and the irradiation energy of the irradiation generating device 5 is introduced into the vacuum chamber through a transparent material.

[0037] Further, as shown in Figure 2 the present application also includes a material substance desorption and separation device for the desorption and separation of the material substance desorption and separation method, which comprises: a reaction cavity 1, the reaction cavity 1 is provided with a first communication hole 2 and a second communication hole 3, the first communication hole 2 is provided with an irradiation generating device 5, and the second communication hole 3 is used to communicate between the inside and outside of the reaction cavity 1, so as to put and take out the target material from the reaction cavity 1, and the second communication hole 2 is provided with an opening and closing device.

[0038] Optionally, the reaction cavity 1 is also provided with a third communication hole 4, and the third communication hole 4 is also connected with a vacuum pumping device 6. The vacuum pumping device 6 is used to form a vacuum environment, so as to assist the separation of the target material and the specific substance.

[0039] Optionally, the reaction cavity 1 is also provided with an article tray 7, and the article tray 7 is used to place the target material. The placement surface of the article tray 7 has a certain height difference with the bottom surface of the reaction cavity 1.

[0040] Optionally, the first communication hole 2 in the application is also provided with a partition plate, which is made of transparent material, so that the irradiation generating device 5 is not directly communicated with the reaction cavity 1, and the irradiation energy can be transmitted into the inside of the reaction cavity 1 to act on the target material and the specific substance.

[0041] Next, the residual organic solvent, water and oxygen in the perovskite solar cell prepared by the solution method are removed, and water molecules are taken as an example, which is specifically as follows: The quantum chemistry software MOPAC is combined with CP2K to calculate all hydrogen bond and van der Waals bond energies of a single water molecule in the material, so as to obtain the infrared absorption energy of the water molecule in the material. The way of calculating all hydrogen bond and van der Waals bond energies of a single water molecule in the material by combining quantum chemistry software MOPAC with CP2K belongs to the conventional form in the art, which will not be expanded here.

[0042] As an optional embodiment of the application, the way of calculating all hydrogen bond and van der Waals bond energies of a single water molecule in the material is as follows: constructing a surface model of the material, pre-screening water molecule adsorption sites of the material, using MOPAC to calculate the binding energy of a single water molecule, and using CP2K first principle to calculate the absorption position of all binding bonds between the material and the water molecule.

[0043] Specifically, the surface model of the material specifically includes: According to the existing literature, the crystal structure of the material is obtained, and the active site is exposed by cutting or crystal face through Materials Studio or VESTA software; and the bottom 2-3 layers of atoms are fixed to simulate the bulk phase constraint, and the surface layer atoms are allowed to relax.

[0044] Specifically, the pre-screening of the water molecule adsorption sites of the material includes: The PM6-D3H4X method of MOPAC is used to quickly scan the possible adsorption sites of the water molecule; MOZYME is used for accelerated calculation, and an implicit solvent model (EPS=78.3) is set.

[0045] Further, the MOPAC is used to calculate the binding energy of a single water molecule, which includes: The parameters of the material and the water molecule are set; The D3 dispersion correction is used to process the van der Waals interaction; The optimization range is limited (only the atoms within 5 Å of the surface layer are allowed to relax); The binding energy is calculated preliminarily.

[0046] Further, the CP2K first principle is used to calculate the absorption position of all binding bonds between the material and the water molecule, which includes: Input file parameters: input basis set, pseudopotential, functional and K point setting parameters; The material and water molecule model structure are optimized, and the electronic structure is analyzed to calculate the differential charge density.

[0047] Through the above numerical calculation, the general position of all the binding bond absorption between the material and the water molecule can be obtained, so as to obtain the specific information of the absorption peak through the experimental method. It is worth noting that the above method of calculating the specific information of the absorption peak by combining the quantum chemistry software MOPAC with CP2K belongs to the calculation method of MOPAC in the conventional chemical software, and the specific calculation steps and data selection should not be regarded as a specific limitation of the material substance desorption separation method of the present application.

[0048] Optionally, the radiation device is a tunable infrared radiation generator, which is obtained by coupling the radiation frequency and half-peak width of a plurality of external chamber tunable semiconductor lasers and free electron lasers together through an optical fiber.

[0049] The material adsorbed with a small amount of water molecules is sent to the article tray 7 in the reaction cavity 1 through the second communication hole 3, the reaction cavity 1 is vacuumized, and the tunable infrared radiation generator is started at the same time, and the infrared radiation is irradiated on the surface of the material through the partition plate. Then, the absorption peak of all the water molecules and the material binding bond is found by the following method: S1, first, according to the range of all the water and material binding bonds given by the theoretical calculation, the radiation frequency of the laser is slowly and continuously adjusted (the half-peak width is the minimum value or smaller value obtained by theoretical calculation). On the one hand, we monitor the temperature of the material by spectrometer or thermocouple; at the same time, we monitor the water content in the gas discharged by the vacuumizing equipment by spectrometer or chromatograph. Combined with the experimental and theoretical calculation results of the material and water molecules, when the desorption rate of water molecules from the material exceeds the background value, and the material temperature rises obviously, it can be basically determined that the laser radiation at this time heats the water or the material; when the desorption rate of water molecules from the material exceeds the background value, and the material temperature does not rise obviously, it can be basically determined that this time the laser radiation only cuts off the binding bond between the water molecules and the material B, without heating them; S2, on the basis of S1, for the determined water molecule and material binding bond energy, the half-peak width of the specific laser radiation is continuously adjusted to find the maximum half-peak width of the laser radiation that does not significantly increase the material temperature and can maximize the desorption of water molecules; S3, on the basis of S2, the intensity of the laser is continuously adjusted (that is, the output power of the laser), to obtain the maximum intensity of the laser that maximizes the desorption of water molecules from the material and does not significantly increase the temperature of the material.

[0050] It should be noted that the material used in the present application has a strong coordination bond with water molecules, and the bond energy is in the crystal absorption peak of the material. The laser that destroys this coordination bond will be absorbed by the material, which will increase the problem of the material and reduce the penetration depth of the laser in the material (about 1 μm). Therefore, the wavelength intensity needs to be carefully adjusted so that it can increase the desorption efficiency of water molecules from the material without significantly increasing the material temperature, avoiding the destruction of the crystal structure of the material.

[0051] After finding the absorption peak position, half-peak width and intensity of all the binding bonds of water molecules in the material by the above method, in the desorption separation device, a plurality of tunable lasers are coupled together by a light coupling device, and the emission wavelength, half-peak width and power of all the lasers are adjusted so that the final outgoing radiation of the device matches the absorption peak determined by the above method.

[0052] As shown in Figure 3 When the material containing a small amount of residual solvent is placed in a pure nitrogen environment at 22°C, the residual solvent content in the material is reduced to one thousandth of the initial content after about 1400h; in a vacuum environment at 22°C, the residual solvent content is reduced to one thousandth of the initial content in about 500h; in a vacuum environment at 120°C, the residual solvent content is reduced to one thousandth of the initial content in about 65h; in a high vacuum environment at 22°C, the residual solvent content is reduced to one thousandth of the initial content in about 35h using the desorption separation device matched with the binding bond. When the residual solvent is removed, the binding force between water, oxygen and the material is weaker than the binding force between the solvent and the material. The removal of residual solvent represents that water and oxygen are also basically removed. It can be seen that using the material desorption separation device in the present application, the non-destructive removal time of residual solvent, water and oxygen in OLED devices and perovskite solar cell devices prepared by solution process is reduced from about 21 days to about 1.5 days, which can greatly improve the service life of semiconductor devices prepared by solution process, and make it possible to prepare semiconductor devices by low-cost solution process.

[0053] Those skilled in the art will readily understand that the above description is only a preferred embodiment of the present application and is not intended to limit the present application. Any modification, equivalent replacement and improvement made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A method for desorbing and separating a specific substance from a target material by using a material, which is characterized in that, Includes the following steps: The absorption wavelengths, full width at half maximum (FWHM), and relative intensities of all bonds between the target material and the specific substance are obtained, thus yielding the bond energies between the target material and the specific substance. The target material is irradiated using an irradiation generator. The energy emitted by the irradiation generator is radiation or a combination of radiation with the same bond energy between the target material and a specific substance, thereby removing the specific substance from the target material.

2. The material-to-substance desorption separation method according to claim 1, wherein, Obtaining the absorption wavelengths, full width at half maximum (FWHM), and relative intensities of all bonds between the target material and specific substances includes both numerical calculation methods and experimental methods.

3. The material-to-substance desorption separation method according to claim 2, wherein, The experimental methods include: The target material was irradiated using radiation sources with continuously varying wavelengths, full width at half maximum (FWHM), and intensity. Monitor the amount of specific substances spilled from the target material and the material properties and phase changes of the target material to determine the amount of specific substances desorbed and whether the target material is damaged. To obtain the wavelength, full width at half maximum (FWHM), and intensity when the desorption of a specific substance is maximized and the target material is undamaged.

4. The method of claim 1, wherein the material is a metal. The energy emitted by the irradiation generator includes one or more of the following: gamma rays, X-rays, ultraviolet rays, visible light, infrared rays, microwaves, neutrons, and beta rays.

5. The method according to claim 4, wherein the material is a metal oxide. The polarization state of the energy emitted by the irradiation generating device includes one or more of the following: left-handed polarized light, right-handed polarized light, partially polarized light, elliptically polarized light, circularly polarized light, and natural light.

6. The method for desorption and separation of substances in a material according to claim 5, characterized in that, The irradiation generating device is one of the following: a frequency-tunable laser, a combination of a light source and a selective filtering device, a combination of a light source and a selective reflection device, a multi-frequency light source, or a variety of radiation coupling devices.

7. The method for desorption and separation of substances in a material according to claim 1, characterized in that, The radiation or combination of radiation emitted by the irradiation generator covers the absorption wavelength, waveform, and intensity of all bonds between the target material and the specific substance without damaging the target material.

8. The method for desorption and separation of substances in a material according to claim 1, characterized in that, When irradiating a target material using an irradiation generator, the method also includes treating the target material using one or more of the following methods: ultrasound, supercritical, vacuum, or heating.

9. The method for desorption and separation of substances in a material according to claim 8, characterized in that, When a vacuum is used to process a target material, the target material is located inside the vacuum chamber, while the irradiation generating device is located outside the vacuum chamber. The irradiation energy of the irradiation generating device is introduced into the vacuum chamber through a transparent material.

10. A material desorption and separation apparatus, used for desorption and separation in the material desorption and separation method as described in any one of claims 1 to 9, characterized in that, include: The reaction chamber is provided with a first connecting hole and a second connecting hole. An irradiation generating device is provided at the first connecting hole, and the second connecting hole is used to connect the inside and outside of the reaction chamber. An opening and closing device is provided at the second connecting hole.

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