A heating aging test fixture

Abstract

The application relates to the technical field of wafer testing equipment, in particular to a heating aging test tool, which comprises a storage rack, a wafer clamp placed on the storage rack, a detection assembly comprising a plurality of elastic probes and a heating disc located on one side of the storage rack, and a hot air flow guide assembly comprising an air outlet male head arranged on one side of the heating disc, a heat conduction cover provided with an air guide pipe away from one side of the air outlet male head, and a cavity with gradually increased air volume and gradually reduced air flow rate from the inside to the outside of the air guide pipe. The hot air flow guide assembly is arranged on the conveying frame, the heat of the heating disc is guided to the upper side of the wafer through the air flow of the heat conduction cover, the space above the wafer is divided into a plurality of cavities, the space size and the space shape of each cavity are set, the air flow rate and the hot air volume of each space are adjusted, the influence of heat loss in the air flow process is reduced, the heating effect of each part of the wafer is similar, and the detection effect is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of wafer testing equipment, in particular to a heating aging test tool. BACKGROUND

[0002] Wafer aging test is a key technology for evaluating chip reliability and stability in semiconductor manufacturing process, which accelerates the screening of potential defects by simulating extreme environmental conditions.

[0003] High temperature working life test: apply rated working voltage at 125-150℃ high temperature, continue accelerated aging, evaluate the influence of thermal stress on devices;

[0004] Temperature cycle test: simulate the mechanical stress of environmental temperature difference on chips through rapid temperature change from-55℃ to 150℃.

[0005] The existing test tool generally uses a heater to heat the bottom of the wafer. Unilateral heating affects the accuracy of the test. Some test equipment uses air heating test method, but considering the heat loss in the process of air flow, the heating effect of different positions of the wafer is different, which also affects the test accuracy. SUMMARY

[0006] In view of the above shortcomings of the prior art, the present application provides a heating aging test tool, which can effectively solve the problems in the prior art.

[0007] To achieve the above purpose, the present application realizes the following technical scheme:

[0008] The present application provides a heating aging test tool, which comprises a storage rack, and further comprises:

[0009] A wafer clamp is placed on the storage rack, and the wafer clamp clamps a wafer;

[0010] A detection assembly comprises a plurality of elastic probes located on one side of the storage rack and a heating disc, and the plurality of elastic probes are symmetrically installed around the heating disc;

[0011] A conveying assembly comprises a conveying frame slidingly installed above the storage rack, and the wafer clamp is conveyed to the elastic probes by the conveying frame;

[0012] A hot air flow guide assembly comprises an air outlet male head arranged on one side of the heating disc and a heat conduction cover installed below the conveying frame, a plurality of cavities are arranged in the heat conduction cover, a wind guide pipe is arranged on the side of the heat conduction cover away from the air outlet male head, hot air is guided to the upper surface of the wafer through the wind guide pipe, and the air volume inside the cavities gradually increases and the air flow rate gradually decreases from the near to the far of the wind guide pipe.

[0013] A heat balance assembly is used to detect the temperature of both ends of a wafer and adjust the air intake of both ends according to the temperature difference.

[0014] Further, the storage rack is provided with a positioning pin, and the wafer clamp is provided with a positioning hole matched with the positioning pin.

[0015] Further, the storage rack is provided with a first guide rail, the first guide rail is slidably provided with a second guide rail, the second guide rail is provided with a third guide rail, the conveying frame is slidably arranged on the third guide rail, one side of the storage rack is provided with a first air cylinder for driving the second guide rail to slide, and a second air cylinder for driving the third guide rail to slide, and the sliding directions of the second guide rail and the third guide rail are the same and perpendicular to the sliding direction of the conveying frame.

[0016] Further, the conveying frame is symmetrically provided with two third air cylinders, the output end of the third air cylinder is provided with a suction cup, the wafer clamp is provided with a suction area matched with the suction cup, and the output end of the third air cylinder is further provided with a sealing plate.

[0017] Further, two adapter plates are symmetrically arranged on one side of the storage rack, the elastic probes are provided in two groups, the two groups of elastic probes are one-to-one correspondingly arranged on the two adapter plates, and one side of each of the two adapter plates is electrically connected with a circuit driving plate.

[0018] Further, a circuit back plate and a circuit wood plate are arranged between the adapter plate and the circuit driving plate.

[0019] Further, one side of the adapter plate is provided with a mounting frame, the circuit driving plate is slidably arranged in the mounting frame, a handle is rotatably arranged on the mounting frame, and the circuit driving plate is pressed by rotating the handle.

[0020] Further, a lifting air cylinder is arranged on one side of the adapter plate away from the storage rack, and two buffer springs are symmetrically arranged on two sides of the lifting air cylinder.

[0021] Further, the hot air flow guide assembly further comprises an air inlet formed in the bottom of the heat conduction cover, the air inlet covers the air outlet male head by driving the heat conduction cover to move downward, and the gas discharged from the air outlet male head is inert gas.

[0022] Further, the chamber comprises a first chamber, a second chamber and a third chamber, each of the chambers is located above the wafer, a partition plate is arranged between adjacent chambers, a first flow guide chamber is arranged between the first chamber and the wafer, a second flow guide chamber is arranged between the second chamber and the wafer, and a third flow guide chamber is arranged between the third chamber and the wafer.

[0023] Further, the first flow guide chamber is in the shape of a ladder with narrow top and wide bottom, the second flow guide chamber is in the shape of a cuboid, the third flow guide chamber is in the shape of a ladder with wide top and narrow bottom, the first flow guide chamber is provided with a first air-permeable plate at the bottom, the second flow guide chamber is provided with a second air-permeable plate at the bottom, the third flow guide chamber is provided with a third air-permeable plate at the bottom, and the air-permeable areas of the first, second and third air-permeable plates gradually increase.

[0024] Further, the first chamber and the first flow guide chamber are provided with a first air inlet plate, the second chamber and the second flow guide chamber are provided with a second air inlet plate, and the third chamber and the third flow guide chamber are provided with a third air inlet plate, the total air-permeable areas of the first, second and third air inlet plates gradually increase, and the hole diameters of the through holes on the first, second and third air inlet plates gradually decrease.

[0025] Further, the heat balance assembly comprises a detection box mounted on one side of the heat guide cover, an adjusting frame is slidingly mounted in the detection box, a connecting bracket is fixedly mounted on the adjusting frame, a first adjusting plate and a second adjusting plate are fixedly mounted on the connecting bracket, the first adjusting plate is located directly below the first air-permeable plate, the second adjusting plate is located directly below the third air-permeable plate, and a shielding plate is arranged on the connecting bracket to prevent air in the heat guide cover from entering the detection box.

[0026] Further, the detection box is provided with a first detection air bag and a second detection air bag, and the first detection air bag and the second detection air bag are provided with heat conduction plates close to the heat guide cover, the heat conduction plates are in contact with the edges of the wafer, the adjusting frame is located between the first detection air bag and the second detection air bag, and elastic rods are mounted on the sides close to each other of the first detection air bag and the second detection air bag.

[0027] Compared with the known prior art, the technical scheme provided by the present application has the following beneficial effects:

[0028] The hot air flow guide assembly is arranged on the conveying frame, the heat of the heating disc is guided to the upper side of the wafer through the air flow by the heat guide cover, the space above the wafer is divided into multiple cavities, the size and shape of each cavity are set, the air flow rate and the amount of hot air contained in each cavity are adjusted, the influence of heat loss in the air flow process is reduced, the heating effect of each part of the wafer is similar, and the detection effect is improved. BRIEF DESCRIPTION OF DRAWINGS

[0029] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed in the embodiments or prior art description. Obviously, the drawings in the following description only show some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained from these drawings without any creative effort.

[0030] Figure 1 It is a whole schematic diagram of the present application.

[0031] Figure 2 It is a structural schematic diagram of the heat conduction cover part.

[0032] Figure 3 It is a structural schematic diagram of the heat conduction cover.

[0033] Figure 4 It is a structural schematic diagram of the output shaft end part of the third cylinder.

[0034] Figure 5 It is a structural schematic diagram of the heat balance assembly part.

[0035] Figure 6 It is a structural schematic diagram of the first and second adjusting plates.

[0036] The numbers in the drawings respectively represent: 1, lifting cylinder; 2, elastic probe; 3, heating disc; 4, adapter plate; 5, wafer clamp; 6, first guide rail; 7, second guide rail; 8, first cylinder; 9, second cylinder; 10, third cylinder; 11, circuit driving plate; 12, handle; 13, air vent male head; 14, circuit back plate; 15, circuit wood plate; 16, buffer spring; 17, mounting frame; 18, storage rack; 19, suction cup; 20, sealing plate; 21, heat conduction cover; 22, air inlet; 23, air duct; 24, first chamber; 25, second chamber; 26, third chamber; 27, first flow guide chamber; 28, second flow guide chamber; 29, third flow guide chamber; 30, first air inlet plate; 31, second air inlet plate; 32, third air inlet plate; 33, first air permeable plate; 34, second air permeable plate; 35, third air permeable plate; 36, detection box; 37, first detection air bag; 38, second detection air bag; 39, heat conduction plate; 40, elastic rod; 41, adjusting frame; 42, connecting support; 43, first adjusting plate; 44, second adjusting plate. DETAILED DESCRIPTION

[0037] In order to make the purposes, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some but not all of the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present application.

[0038] The present application will be further described below with reference to the embodiments.

[0039] Embodiment 1

[0040] Reference Figure 1 A heating aging test tool includes a rack 18, and further includes a wafer clamp 5 placed on the rack 18, the rack 18 is provided with positioning pins, the wafer clamp 5 is provided with positioning holes matched with the positioning pins, the wafer clamp 5 clamps a wafer, the rack 18 is provided with a first guide rail 6, the first guide rail 6 is slidably provided with a second guide rail 7, the second guide rail 7 is provided with a third guide rail, a conveying frame is slidably arranged on the third guide rail, one side of the rack 18 is provided with a first cylinder 8 for driving the second guide rail 7 to slide, and a second cylinder 9 for driving the third guide rail to slide, and the sliding directions of the second guide rail 7 and the third guide rail are the same and perpendicular to the sliding direction of the conveying frame, a double guide rail (the first guide rail 6 and the second guide rail 7) design is adopted, so that the moving stroke can be enlarged, the moving speed can be accelerated, and the detection efficiency can be improved. The conveying frame moves to the upper side of the rack 18, a suction cup 19 at the bottom is used to suck the wafer clamp 5 through a third cylinder 10, and the wafer clamp 5 and the wafer are carried together to the upper side of the elastic probe 2 following the movement of the conveying frame.

[0041] Reference Figure 1 A detection assembly includes a plurality of elastic probes 2 and a heating disc 3 arranged on one side of a rack 18, and the plurality of elastic probes 2 are symmetrically arranged around the heating disc 3, two adapter plates 4 are symmetrically arranged on one side of the rack 18, the elastic probes 2 are arranged in two groups, and the two groups of elastic probes 2 are correspondingly arranged on the two adapter plates 4, the two adapter plates 4 are electrically connected with circuit driving plates 11 on one side, circuit back plates 14 and circuit wood plates 15 (the functions of the circuit wood plates 15 include but are not limited to heat insulation, insulation and air isolation) are arranged between the adapter plates 4 and the circuit driving plates 11, the adapter plates 4 are provided with mounting frames 17 on one side, the circuit driving plates 11 are slidably arranged in the mounting frames 17, and handles 12 are rotatably arranged on the mounting frames 17, the circuit driving plates 11 are pressed away from the rack 18 by rotating the handles 12, a lifting cylinder 1 is arranged on one side of the adapter plate 4 away from the rack 18, and two buffer springs 16 are symmetrically arranged on two sides of the lifting cylinder 1. A conveying assembly includes a conveying frame slidably arranged above the rack 18, and the wafer clamp 5 is conveyed to the elastic probe 2 by the conveying frame.

[0042] The wafer clamp 5 is placed on the elastic probe 2 by the third cylinder 10, and two buffer springs 16 are symmetrically installed on both sides of the lifting cylinder 1, and a buffer plate is further arranged at the output end of the third cylinder 10, which will be used to buffer the wafer by the extrusion force between the buffer plate and the buffer spring 16 when driving the wafer clamp 5 to move downward, so as to prevent the wafer from colliding with the elastic probe 2 due to too fast moving speed or the wafer being separated from the elastic probe 2.

[0043] Embodiment 2:

[0044] With reference to Figure 3 , the hot air guiding assembly comprises a venting male head 13 arranged on one side of the heating disc 3 and a heat conduction cover 21 installed below the conveying frame, two third cylinders 10 are symmetrically installed on the conveying frame, and a suction disc 19 is arranged at the output end of the third cylinder 10, the wafer clamp 5 is provided with a suction area matched with the suction disc 19, and a sealing plate 20 is further arranged at the output end of the third cylinder 10, the heat conduction cover 21 is provided with a plurality of cavities, and a wind guide pipe 23 is arranged on the side of the heat conduction cover 21 away from the venting male head 13, the hot air is guided to the upper surface of the wafer through the wind guide pipe 23, the air volume inside the cavities gradually increases and the air flow rate gradually decreases from near to far to the wind guide pipe 23, the hot air guiding assembly further comprises an air inlet 22 arranged at the bottom of the heat conduction cover 21, the air inlet 22 covers the venting male head 13 by driving the heat conduction cover 21 to move downward, the gas discharged from the venting male head 13 is inert gas, the cavities include a first cavity 24, a second cavity 25 and a third cavity 26, each cavity is located above the wafer, and a partition plate is arranged between adjacent cavities, a first flow guide chamber 27 is arranged between the first cavity 24 and the wafer, a second flow guide chamber 28 is arranged between the second cavity 25 and the wafer, and a third flow guide chamber 29 is arranged between the third cavity 26 and the wafer, the first flow guide chamber 27 is in the shape of a ladder with a narrow top and a wide bottom, the second flow guide chamber 28 is in the shape of a cuboid, and the third flow guide chamber 29 is in the shape of a ladder with a wide top and a narrow bottom, a first air permeable plate 33 is arranged at the bottom of the first flow guide chamber 27, a second air permeable plate 34 is arranged at the bottom of the second flow guide chamber 28, and a third air permeable plate 35 is arranged at the bottom of the third flow guide chamber 29, the air permeable area of the first air permeable plate 33, the second air permeable plate 34 and the third air permeable plate 35 gradually increases, a first air inlet plate 30 is arranged between the first cavity 24 and the first flow guide chamber 27, a second air inlet plate 31 is arranged between the second cavity 25 and the second flow guide chamber 28, and a third air inlet plate 32 is arranged between the third cavity 26 and the third flow guide chamber 29, the total air permeable area of the first air inlet plate 30, the second air inlet plate 31 and the third air inlet plate 32 gradually increases, and the hole diameter of the through holes on the first air inlet plate 30, the second air inlet plate 31 and the third air inlet plate 32 gradually decreases.

[0045] The heat conduction cover 21 is installed on the output shaft of the two third cylinders 10 and moves up and down with the output shaft of the third cylinder 10, and further strengthens the covering during the process of sucking the wafer clamp 5 (as shown inFigure 3 The output end of the third cylinder 10 is provided with a sealing plate 20, the inner wall of which is matched with the adsorption area on the wafer chuck 5, so that the normal adsorption is not affected and the subsequent air guide is sealed.

[0046] As shown in Figure 2 and Figure 4 , the output end of the third cylinder 10 is provided with a sealing plate 20, the inner wall of which is matched with the adsorption area on the wafer chuck 5, so that the normal adsorption is not affected and the subsequent air guide is sealed.

[0047] The specific air flow mode is shown in Figure 3 , the air inlet 22 of the heat conduction cover 21 is placed on the air public head 13 after the heat conduction cover 21 is lowered, and the wafer chuck 5 is placed in the heat conduction cover 21, at this time the heating disc 3 is in full contact with the bottom of the wafer chuck 5, and the wafer is connected with each elastic probe 2, the air public head 13 continuously blows out inert gas, the heat of the heating disc 3 is conducted from the bottom of the wafer to the chamber located above the wafer through the air guide pipe 23, as shown in Figure 3 , according to the distance from the air guide pipe 23, they are the first chamber 24, the second chamber 25 and the third chamber 26 from near to far. The volume of the three chambers gradually increases, so that the hot air retained in the first chamber 24, the second chamber 25 and the third chamber 26 gradually increases. Because heat is lost in the process of heat transfer, the heat of the hot air reaching the third chamber 26 is less than that of the first chamber 24. By changing the volume, the amount of hot air in the third chamber 26 is greater than that in the first chamber 24, which makes up for the difference in heat.

[0048] Further, the first flow guide chamber 27 is in the shape of a ladder with narrow top and wide bottom, so that the flow rate of air will be reduced, and the wafer in this area can exchange heat with less hot air, while the impact of air flow is reduced. The second flow guide chamber 28 is in the shape of a cuboid, and the third flow guide chamber 29 is in the shape of a ladder with wide top and narrow bottom, so that the flow rate of hot air will be accelerated, and the wafer in this area can exchange heat with more air, increasing the impact of hot air. The air permeation area of the first air permeation plate 33, the second air permeation plate 34 and the third air permeation plate 35 gradually increases, the total air permeation area of the first air inlet plate 30, the second air inlet plate 31 and the third air inlet plate 32 gradually increases. The above-mentioned air permeation plate also changes the effect of hot air flow rate, and the hole diameter of the through hole on the first air inlet plate 30, the second air inlet plate 31 and the third air inlet plate 32 gradually decreases. As shown in Figure 2 , a plurality of air outlets are provided outside the heat conduction cover 21 for discharging hot air, and other flow guide devices can be provided here to prevent hot air from affecting other components.

[0049] Example 3:

[0050] Referring to Figure 5 and Figure 6 , the heat balance assembly is used to detect the temperature of both ends of the wafer and adjust the air intake of both ends according to the temperature difference.

[0051] Specifically, the heat balance assembly comprises a detection box 36 mounted on one side of the heat conduction cover 21, a regulating frame 41 is slidingly mounted in the detection box 36, a connecting bracket 42 is fixedly mounted on the regulating frame 41, a first adjusting plate 43 and a second adjusting plate 44 are respectively fixedly mounted on the connecting bracket 42, the first adjusting plate 43 is located directly below the first air-permeable plate 33, the second adjusting plate 44 is located directly below the third air-permeable plate 35, and a shielding plate is arranged on the connecting bracket 42 to prevent air in the heat conduction cover 21 from entering the detection box 36.

[0052] The first detection air bag 37 and the second detection air bag 38 are respectively arranged in the detection box 36, and the first detection air bag 37 and the second detection air bag 38 are provided with a heat conduction plate 39 close to the heat conduction cover 21, and the heat conduction plate 39 is in contact with the edge of the wafer, the regulating frame 41 is located between the first detection air bag 37 and the second detection air bag 38, and the first detection air bag 37 and the second detection air bag 38 are respectively provided with an elastic rod 40.

[0053] On the basis of the heat balance in the above-mentioned embodiment 2, the temperature of the two ends of the upper surface of the wafer is further balanced, that is, the wafer parts below the first air-permeable plate 33 and the third air-permeable plate 35 are heat balanced.

[0054] The first detection air bag 37 and the second detection air bag 38 are respectively arranged at the positions of the first air-permeable plate 33 and the third air-permeable plate 35, and the temperature of the corresponding position of the wafer is detected by the two heat conduction plates 39, and the temperature is transmitted to the two detection air bags, wherein an evaporation liquid is arranged in the detection air bag, that is, preheating evaporation, and the higher the temperature, the higher the evaporation amount and the evaporation efficiency, and the higher the temperature, the higher the expansion degree of the detection air bag, and the farther the distance that the elastic rod 40 can push. The elastic rod 40 can be provided with a spring outside or inside, as long as it can guarantee the pushing action and the contraction reset ability, the elastic rod 40 pushes the regulating frame 41 to slide, the regulating frame 41 and the connecting bracket 42 slide together, as shown in Figure 6 The first adjusting plate 43 and the second adjusting plate 44 are driven to slide by the connecting bracket 42, and different sliding directions will change the air permeability of the first air-permeable plate 33 and the third air-permeable plate 35 at the same time. It is worth noting that when the expansion degree of the first detection air bag 37 is greater than that of the second detection air bag 38, the air outlet of the first air-permeable plate 33 becomes larger, and the air outlet of the third air-permeable plate 35 becomes smaller; when the expansion degree of the first detection air bag 37 is smaller than that of the second detection air bag 38, the air outlet of the first air-permeable plate 33 becomes smaller, and the air outlet of the third air-permeable plate 35 becomes larger.

[0055] The above examples are only used to illustrate the technical solutions of the present application, and are not intended to limit the present application; although the present application has been described in detail with reference to the foregoing examples, those skilled in the art should understand that the technical solutions recorded in the foregoing examples can be modified, or some technical features can be replaced by equivalent features; and these modifications or replacements will not cause the essence of the corresponding technical solutions to deviate from the protection scope of the technical solutions of the embodiments of the present application.

Claims

1. A heat aging test fixture comprising a rack, characterized by, Also include: The wafer clamp is placed on the shelf, the wafer clamp clamps the wafer; Detection assembly, comprising a plurality of elastic probes located on one side of the shelf and a heating disc, and a plurality of elastic probes are symmetrically installed around the heating disc; Conveying assembly, comprising a conveying frame slidingly installed above the shelf, conveying the wafer clamp to the elastic probe through the conveying frame; Hot air flow component, comprising a vent male head arranged on one side of the heating disc, and a heat conducting cover installed below the conveying frame, a plurality of chambers are arranged in the heat conducting cover, and a wind guide pipe is arranged on the side of the heat conducting cover away from the vent male head, the hot air is guided to the upper surface of the wafer through the wind guide pipe, the air volume in the chamber gradually increases and the air flow rate gradually decreases from the inside to the outside of the wind guide pipe; Heat balance assembly for detecting the temperature of both ends of the wafer and adjusting the air intake of both ends according to the temperature difference; The hot air flow component further comprises an air inlet opening in the bottom of the heat conducting cover, the air inlet opening covers the vent male head by driving the heat conducting cover to move downward, and the gas discharged from the vent male head is inert gas.

2. The heat aging test fixture of claim 1, wherein, The shelf is provided with a positioning pin, and the wafer clamp is provided with a positioning hole matched with the positioning pin.

3. The heat aging test fixture of claim 1, wherein, The first guide rail is installed on the shelf, the second guide rail is slidingly arranged on the first guide rail, the third guide rail is installed on the second guide rail, the conveying frame is slidingly installed on the third guide rail, a first cylinder is arranged on one side of the shelf for driving the second guide rail to slide, and a second cylinder is arranged for driving the third guide rail to slide, and the sliding directions of the second guide rail and the third guide rail are the same and perpendicular to the sliding direction of the conveying frame.

4. The heat aging test fixture of claim 1, wherein, Two third cylinders are symmetrically installed on the conveying frame, and the output end of the third cylinder is provided with a suction cup, the wafer clamp is provided with a suction area matched with the suction cup, and the output end of the third cylinder is further provided with a sealing plate.

5. The heat aging test fixture of claim 1, wherein, Two adapter plates are symmetrically installed on one side of the shelf, the elastic probes are provided in two groups, the elastic probes in the two groups are correspondingly installed on the two adapter plates, and one side of each of the two adapter plates is electrically connected with a circuit driving plate.

6. The heat aging test fixture of claim 5, wherein, The circuit back plate and the circuit wood plate are arranged between the adapter plate and the circuit driving plate.

7. The heat aging test fixture of claim 5, wherein, A mounting bracket is arranged on one side of the adapter plate, the circuit driving plate is slidingly inserted into the mounting bracket, a handle is rotatably installed on the mounting bracket, and the circuit driving plate is pressed by rotating the handle.

8. The heat aging test fixture of claim 1, wherein, A lifting cylinder is installed on the side of the adapter plate away from the shelf, and two buffer springs are symmetrically installed on both sides of the lifting cylinder.

9. The heat aging test fixture of claim 1, wherein, The chamber includes a first chamber, a second chamber and a third chamber, each of the chambers is located above the wafer, and a partition plate is arranged between adjacent chambers, a first flow guide chamber is arranged between the first chamber and the wafer, a second flow guide chamber is arranged between the second chamber and the wafer, and a third flow guide chamber is arranged between the third chamber and the wafer.

10. The heat aging test fixture of claim 9, wherein, The first flow guide chamber is in the shape of a ladder with narrow top and wide bottom, the second flow guide chamber is in the shape of a cuboid, the third flow guide chamber is in the shape of a ladder with wide top and narrow bottom, the first flow guide chamber is provided with a first air-permeable plate at the bottom, the second flow guide chamber is provided with a second air-permeable plate at the bottom, the third flow guide chamber is provided with a third air-permeable plate at the bottom, and the air-permeable areas of the first, second and third air-permeable plates gradually increase.

11. The heat aging test fixture of claim 10, wherein, The first, second and third air-permeable plates are provided with through holes, and the diameters of the through holes gradually decrease.

12. The heat aging test fixture of claim 11, wherein, The heat balance assembly comprises a detection box mounted on one side of the heat conduction cover, an adjusting frame is slidingly mounted in the detection box, a connecting bracket is fixedly mounted on the adjusting frame, a first adjusting plate and a second adjusting plate are fixedly mounted on the connecting bracket, the first adjusting plate is located directly below the first air-permeable plate, the second adjusting plate is located directly below the third air-permeable plate, and a shielding plate is arranged on the connecting bracket to prevent air in the heat conduction cover from entering the detection box.

13. The heat aging test fixture of claim 12, wherein, The detection box is provided with a first detection air bag and a second detection air bag, and the first detection air bag and the second detection air bag are provided with heat conduction plates close to the heat conduction cover, the heat conduction plates are in contact with the edges of the wafer, the adjusting frame is located between the first detection air bag and the second detection air bag, and elastic rods are mounted on the sides of the first detection air bag and the second detection air bag close to each other.

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