Vertical and horizontal hybrid packaged double-receiving-in-one TO optical assembly and optical module

Abstract

The invention relates to the technical field of optical communication, in particular to a vertical and horizontal hybrid packaged double-in-one TO optical assembly and an optical module, which comprises a TO seat, a TO cap, a plurality of optical chips and a light refraction unit, the plurality of optical chips and the light refraction unit are fixedly arranged on the TO seat; the TO seat is provided with at least one mounting column, the mounting column is fixedly connected with the TO seat, each mounting column is fixedly provided with an optical chip, the surface of the TO seat is provided with an optical chip, and the light refraction unit is used for transmitting an optical signal into each optical chip; one of a spherical lens and a flat window mirror is arranged in the center of the top of the TO cap, the spherical lens is used for transmitting converged light to the light refraction unit, and the flat window mirror is used for transmitting parallel light to the light refraction unit.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of optical communication technology, in particular to a vertical and horizontal hybrid packaged dual-receiving integrated TO optical assembly and optical module. BACKGROUND

[0002] In the current communication field, COMBOPON OLT / ONU Bidirectional Optical Sub-Assembly (BOSA) coaxial devices play a crucial role, especially in fiber access networks. These devices are responsible for transmitting optical signals from an Optical Network Unit (ONU) to an Optical Line Terminal (OLT), as well as the reverse transmission from the Optical Line Terminal to the Optical Network Unit. For existing conventional COMBOPON OLT / ONU BOSA coaxial devices, the uplink wavelength design usually adopts two independent Transistor Outline Can (TO-CAN) packaging forms.

[0003] Specifically, these two TO-CAN packages each contain an optical chip for two different uplink wavelengths. These packages are coupled and cured step by step during the manufacturing process, and finally integrated into the BASE (Base bond signal) of the device, forming a four-way device. Although this design meets the communication requirements to some extent, it also brings many challenges. To address these challenges, some manufacturers have attempted to package chips that originally receive two uplink wavelengths into one TO-CAN, thereby simplifying the packaging process and reducing the overall size of the device, ultimately forming a three-way device.

[0004] However, despite the many advantages of this design, there are still some problems that cannot be ignored. First, since the chips are packaged in one TO-CAN, the packaging technology requirements are higher, increasing the difficulty and cost of manufacturing. Second, due to the reduction in device size, it becomes difficult to arrange more components in a limited space (i.e., placing chips on the surface of the TO seat), leading to insufficient space for mounting. And since the chips are placed on the surface of the TO seat, multiple spherical lenses need to be set on the TO cap to form a multi-ball cap, making it difficult to seal the cap, and the chips cannot share the same optical path. In addition, the use of more advanced technology and materials also makes the overall cost relatively high.

[0005] Therefore, overcoming the defects of the existing technology is a problem that needs to be solved in this technical field. SUMMARY

[0006] The technical problem solved by the present application is that the chip packaging of the existing optical device using TO packaging is in a TO-CAN, which causes insufficient patch space, cannot share optical paths, and has relatively high cost.

[0007] The present application adopts the following technical solutions:

[0008] In a first aspect, the present application provides a vertical and horizontal hybrid packaged dual-receiving integrated TO optical assembly, comprising: a TO base 1, a TO cap 2, a plurality of optical chips 3, and an optical refractive unit 4; the plurality of optical chips 3 and the optical refractive unit 4 are fixedly installed on the TO base 1;

[0009] At least one mounting column 10 is arranged on the TO base 1, the mounting column 10 is fixedly connected with the TO base 1, an optical chip 3 is fixedly installed on each mounting column 10, the surface of the TO base 1 is provided with an optical chip 3, and the optical refractive unit 4 is used for transmitting optical signals to each optical chip 3;

[0010] A spherical lens 20 or a flat window mirror 21 is arranged at the top center of the TO cap 2, the spherical lens 20 is used for transmitting converging light to the optical refractive unit 4, and the flat window mirror 21 is used for transmitting parallel light to the optical refractive unit 4.

[0011] Preferably, when one mounting column 10 is arranged, the optical chip 3 comprises a first optical chip 30 and a second optical chip 31, the first optical chip 30 is installed on the surface of the mounting column 10, and the second optical chip 31 is installed on the surface of the TO base 1.

[0012] Preferably, the optical refractive unit 4 comprises a first bracket 400, a first transmission glass 401, a second transmission glass 402, and a first light splitting glass 403, the first transmission glass 401, the second transmission glass 402, and the first light splitting glass 403 are fixedly installed on the first bracket 400;

[0013] The first transmission glass 401 is arranged in parallel with the first optical chip 30, the second transmission glass 402 is arranged in parallel with the second optical chip 31, the first light splitting glass 403 is arranged directly below the light transmission port of the TO cap 2, the first light splitting glass 403 is installed on a first inclined surface 4000 of the first bracket 400, the inclination angle of the first inclined surface 4000 is 45°±0.01°, so that the light wavelength received by the first optical chip 30 in the optical signal is reflected to the first optical chip 30, and the light wavelength received by the second optical chip 31 in the optical signal is transmitted to the second optical chip 31.

[0014] Preferably, when the light signal is convergent light, the top of the TO cap 2 is provided with the spherical lens 20, and the center point of the spherical lens 20 is collinear with the center point of the first light splitting glass 403.

[0015] Preferably, when the light signal is parallel light, the top of the TO cap 2 is provided with the flat window lens 21, and an external lens 22 is arranged above the flat window lens 21, the central axis of the external lens 22 is collinear with the center of the first light splitting glass 403, and the external lens 22 is used to converge the parallel light and transmit it into the flat window lens 21.

[0016] Preferably, when the light signal is parallel light, the TO cap 2 is provided with the flat window lens 21.

[0017] The light refraction unit 4 includes a second bracket 404, a first convex lens 405 and a second convex lens 406, the first convex lens 405 and the second convex lens 406 are fixedly installed on the second bracket 404, the first convex lens 405 is arranged in parallel with the first optical chip 30, the first convex lens 405 is used to converge the light signal into the first optical chip 30, and the second convex lens 406 is used to converge the light signal into the second optical chip 31.

[0018] The light refraction unit 4 further includes a third transmission glass 407, a second light splitting glass 408 and a first reflection glass 409, the third transmission glass 407 is arranged in parallel with the first convex lens 405, the second light splitting glass 408 is arranged directly below the flat window lens 21, the second light splitting glass 408 is installed on a second inclined surface 4040 of the second bracket 404, the inclination angle of the second inclined surface 4040 is 13°±0.01°, and the first reflection glass 409 is installed on a third inclined surface 4041 of the second bracket 404, the inclination angle of the third inclined surface 4041 is 32°±0.01°.

[0019] Preferably, when the three mounting columns 10 are arranged, the optical chip 3 includes a third optical chip 32, a fourth optical chip 33, a fifth optical chip 34 and a sixth optical chip 35, the third optical chip 32, the fourth optical chip 33 and the fifth optical chip 34 are respectively installed on the mounting column 10, and the sixth optical chip 35 is installed on the surface of the TO seat 1.

[0020] The light refraction unit 4 comprises a third support 410 and a light splitting prism 411, the light splitting prism 411 is fixedly connected with the third support 410, the light splitting prism 411 is vertically placed, the light splitting prism 411 comprises a first plane 4110, a second plane 4111 and a third plane 4112, the first plane 4110 is parallel to the third optical chip 32, the second plane 4111 is parallel to the fourth optical chip 33, and the third plane 4112 is parallel to the fifth optical chip 34.

[0021] The light splitting prism 411 is internally provided with a first light splitting film 4113, a second light splitting film 4114 and a third light splitting film 4115, the first light splitting film 4113, the second light splitting film 4114 and the third light splitting film 4115 all pass through the center position of the light splitting prism 411, the first light splitting film 4113 is inclined at an angle of 45°±0.01° with the first plane 4110, the second light splitting film 4114 is inclined at an angle of 45°±0.01° with the second plane 4111, and the third light splitting film 4115 is inclined at an angle of 45°±0.01° with the third plane 4112.

[0022] Preferably, the first plane 4110 is attached with a first filter film, the light wavelength that can be received by the third optical chip 32 can pass through the first filter film, and the light of other wavelengths is reflected; the second plane 4111 is attached with a second filter film, the light wavelength that can be received by the fourth optical chip 33 can pass through the second filter film, and the light of other wavelengths is reflected; and the third plane 4112 is attached with a third filter film, the light wavelength that can be received by the fifth optical chip 34 can pass through the third filter film, and the light of other wavelengths is reflected.

[0023] The upper surface of the light splitting prism 411 is attached with an anti-reflection film, and the lower surface of the light splitting prism 411 is attached with a fourth filter film, the fourth filter film allows the light wavelength that can be received by the sixth optical chip 35 to pass through, and the light of other wavelengths is reflected.

[0024] Preferably, when the optical signal is convergent light, the top of the TO cap 2 is provided with the spherical lens 20; when the optical signal is parallel light, the top of the TO cap 2 is provided with the flat window lens 21, and the outer portion of the TO cap 2 is provided with an external lens 22, the external lens 22 is used for converging the optical signal

[0025] In the second aspect, the application provides a vertical and horizontal mixed packaging double-receiving-in-one optical module, comprising the vertical and horizontal mixed packaging double-receiving-in-one TO optical assembly of the first aspect.

[0026] Compared with the prior art, the beneficial effects of the present application are that: compared with the prior art that multiple optical chips 3 are attached to the TO seat 1 to form a three-way device, the present application is provided with mounting columns 10 on the TO seat 1, and the optical chips 3 can be attached to the mounting columns 10 and the surface of the TO seat 1, thereby increasing the attachable area and solving the problem of tight space caused by the simultaneous attachment of multiple optical chips 3 on the surface of the TO seat 1; then the optical signal is reflected or refracted to the receiving area of each optical chip 3 through the optical refraction unit 4, a vertical double-receiving structure is adopted, the optical chips 3 located on the mounting columns 10 and the optical chips 3 located on the surface of the TO seat 1 share one optical path, and only one spherical lens 20 needs to be installed on the TO cap 2, thereby effectively solving the problem of the difficulty in sharing one spherical lens 20 and the difficulty in sealing the cap due to the limitation of the optical path in the prior art. BRIEF DESCRIPTION OF DRAWINGS

[0027] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments of the present application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor on the basis of these drawings.

[0028] Figure 1 is a schematic view of a TO cap of a vertical and horizontal mixed packaging double-receiving integrated TO optical assembly provided by the embodiments of the present application, and the TO cap is a spherical lens;

[0029] Figure 2 is a schematic view of a TO cap of a vertical and horizontal mixed packaging double-receiving integrated TO optical assembly provided by the embodiments of the present application, and the TO cap is a flat window mirror; Figure 1 is a schematic view of a TO cap without a TO cap;

[0030] Figure 3 is a schematic view of a TO cap of a vertical and horizontal mixed packaging double-receiving integrated TO optical assembly provided by the embodiments of the present application, and the TO cap is a flat window mirror; Figure 2 is a schematic view of a TO cap without an optical refraction unit;

[0031] Figure 4 is a schematic view of a TO cap of a vertical and horizontal mixed packaging double-receiving integrated TO optical assembly provided by the embodiments of the present application, and the TO cap is a flat window mirror;

[0032] Figure 5 is a schematic view of a TO cap of a vertical and horizontal mixed packaging double-receiving integrated TO optical assembly provided by the embodiments of the present application, and the TO cap is a flat window mirror;

[0033] Figure 6 is a schematic view of a first optical refraction unit of a vertical and horizontal mixed packaging double-receiving integrated TO optical assembly provided by the embodiments of the present application;

[0034] Figure 7This is a schematic diagram of the first beam-splitting glass of a vertical and horizontal hybrid packaged dual-collection TO optical module provided in an embodiment of the present invention.

[0035] Figure 8 This is a schematic diagram of an external lens of a vertical and horizontal hybrid packaged dual-collector TO optical component provided in an embodiment of the present invention.

[0036] Figure 9 This is a cross-sectional schematic diagram of the second type of light refraction unit of a vertical and horizontal hybrid packaged dual-integrated TO optical component provided in an embodiment of the present invention.

[0037] Figure 10 This is a schematic diagram of the first reflective glass sheet of a vertical and horizontal hybrid packaged dual-receiver TO optical module provided in an embodiment of the present invention.

[0038] Figure 11 This is a schematic diagram of the second and third inclined surfaces of a vertical and horizontal hybrid packaged dual-integrated TO optical module provided in an embodiment of the present invention.

[0039] Figure 12 This is a schematic diagram of the optical path of the first optical chip of a dual-integrated TO optical component with vertical and horizontal hybrid packaging provided in an embodiment of the present invention.

[0040] Figure 13 This is a schematic diagram of the optical path of the second optical chip of a dual-integrated TO optical component with vertical and horizontal hybrid packaging provided in an embodiment of the present invention.

[0041] Figure 14 This is a schematic diagram of the third type of light refraction unit of a vertical and horizontal hybrid packaged dual-integrated TO optical component provided in an embodiment of the present invention.

[0042] Figure 15 This is a schematic diagram of an optical chip for a dual-integrated TO optical component with vertical and horizontal hybrid packaging provided in an embodiment of the present invention.

[0043] Figure 16 This is a schematic diagram of the beam splitter of a dual-collector TO optical module with hybrid vertical and horizontal packaging provided in an embodiment of the present invention.

[0044] Figure 17 This is a perspective view of the beam-splitting film of a vertically and horizontally hybrid packaged dual-collector TO optical module provided in an embodiment of the present invention.

[0045] Figure 18 This is a schematic diagram of the optical path of a dual-collector TO optical component with a hybrid vertical and horizontal package provided in an embodiment of the present invention.

[0046] The attached figures are labeled as follows:

[0047] 1-TO base, 10-mounting post, 2-TO cap, 20-spherical lens, 21-flat window mirror, 22-external lens, 3-optical chip, 30-first optical chip, 31-second optical chip, 32-third optical chip, 33-fourth optical chip, 34-fifth optical chip, 35-sixth optical chip, 4-light refraction unit, 400-first bracket, 4000-first inclined plane, 401-first transmission slide, 402-second transmission slide, 403-first beam splitter slide, 404-second bracket 4040 - Second inclined plane, 4041 - Third inclined plane, 405 - First convex lens, 406 - Second convex lens, 407 - Third transmission glass slide, 408 - Second beam splitting glass slide, 409 - First reflection glass slide, 410 - Third support, 411 - Beam splitting prism, 4110 - First plane, 4111 - Second plane, 4112 - Third plane, 4113 - First beam splitting film, 4114 - Second beam splitting film, 4115 - Third beam splitting film, 5 - Transimpedance amplifier, 6 - High voltage capacitor. Detailed Implementation

[0048] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0049] Unless the context otherwise requires, throughout the specification and claims, the term "comprising" is interpreted as openly inclusive, meaning "including, but not limited to." In the description of the specification, terms such as "one embodiment," "some embodiments," "exemplary embodiment," "example," "specific example," or "some examples" are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of this disclosure. The illustrative representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics mentioned may be included in any suitable manner in any one or more embodiments or examples; that is, although they may be incorporated into embodiments or examples using the above terms for reasons such as order and position, it does not limit them to be incorporated in combination by a single embodiment or example.

[0050] In the description of this invention, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this disclosure.

[0051] In the description of this invention, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this disclosure, unless otherwise stated, "a plurality of" means two or more. Furthermore, for example, the description may use the prefix "A" or "B" to describe the same type of nouns as two independent entities. In this case, the corresponding features defined with "A" and "B" are used only to distinguish between similar entities and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features.

[0052] In describing some embodiments, the terms "coupled," "coupled," and "connected," and their derivative expressions, may be used. For example, the term "connected" may be used in describing some embodiments to indicate that two or more components have direct physical or electrical contact with each other. Similarly, the term "coupled" may be used in describing some embodiments to indicate that two or more components have direct physical or electrical contact. However, the terms "connected" or "coupled" may also refer to two or more components that do not have direct contact with each other but still cooperate or interact with each other, such as "optical coupling," "wireless connection," etc. The embodiments disclosed herein are not necessarily limited to the scope of this invention.

[0053] In the description of this invention, the expression “A and / or B” (where A and B are used to formally represent specific features) will be used. The corresponding expression includes the following three combinations: only A, only B, and a combination of A and B.

[0054] As used in this invention, “about,” “approximately,” or “approximately” includes the stated value and the average value within an acceptable range of deviation from a particular value, wherein the acceptable range of deviation is determined by a person skilled in the art taking into account the measurement under discussion and the error associated with the measurement of the particular quantity (i.e., the limitations of the measurement system).

[0055] Furthermore, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0056] Example 1:

[0057] Embodiment 1 of the present invention provides a dual-integrated TO optical module with hybrid vertical and horizontal packaging, such as... Figure 1 and Figure 2As shown, it includes: a TO base 1, a TO cap 2, multiple optical chips 3, and an optical refraction unit 4; the multiple optical chips 3 and the optical refraction unit 4 are fixedly mounted on the TO base 1. In addition to the above structure, as... Figure 3 As shown, the optical component also includes a transimpedance amplifier 5 and a high-voltage capacitor 6. The transimpedance amplifier 5 converts the current signal generated by the avalanche photodiode (APD) on the optical chip 3 into a voltage signal, facilitating the detection and measurement of photoelectric signals. The high-voltage capacitor 6 is used for power supply stabilization, reducing electromagnetic interference, improving operational stability, protecting the circuit, and improving the signal-to-noise ratio, ensuring that the optical module can operate stably and reliably in complex environments. In this embodiment, the TO socket 1 is provided with 9 pins, which are used to realize the electrical connection between the optoelectronic device and the external circuit, signal transmission, and the installation and positioning of the optical device on the TO socket 1.

[0058] like Figure 2 As shown, at least one mounting post 10 is provided on the TO base 1, and the mounting post 10 is fixedly connected to the TO base 1. An optical chip 3 is fixedly mounted on each mounting post 10. An optical chip 3 is mounted on the surface of the TO base 1. The light refraction unit 4 is used to transmit optical signals to the optical chip 3. The mounting post 10 can be an arc-shaped post or a square post. Figure 2 The image shows the mounting post 10 of the arc-shaped column. The optical chip 3 is attached to the planar area of ​​the arc-shaped column. In one embodiment, each optical chip 3 is electrically connected to other optical devices by flip-wire bonding, which makes the connection between the optical chip 3 and other devices more stable and more accurate.

[0059] like Figure 1 and Figure 4 As shown, a spherical lens 20 or a flat window mirror 21 is installed at the center of the top of the TO cap 2. The spherical lens 20 is used to transmit converging light to the light refraction unit 4, and the flat window mirror 21 is used to transmit parallel light to the light refraction unit 4. Specifically, whether a spherical lens 20 or a flat window mirror 21 is installed on the top of the TO cap 2 depends on whether the light signal is converging light or parallel light.

[0060] Compared to the existing technology of attaching multiple optical chips 3 onto the TO base 1 to form a three-way device, the present invention provides a mounting post 10 on the TO base 1, allowing the optical chips 3 to be attached to the surfaces of the mounting post 10 and the TO base 1, increasing the area available for mounting and solving the problem of limited mounting space caused by attaching multiple optical chips 3 simultaneously to the surface of the TO base 1. Furthermore, the light signal is reflected or refracted to the receiving area of ​​each optical chip 3 through the light refraction unit 4. The vertical double-receiving structure allows the optical chips 3 located on the mounting post 10 and the optical chips 3 located on the surface of the TO base 1 to share a single optical path. Only one spherical lens 20 needs to be installed on the TO cap 2, effectively solving the problems in the existing technology where it is impossible to share a single spherical lens 20 due to optical path limitations and the difficulty of sealing multiple spherical caps.

[0061] Based on the above scheme, subsequent embodiments will provide a more detailed description of the structures mentioned in the above scheme, especially the structural interaction between the optical chip 3, the mounting post 10 and the optical refraction unit 4. Multiple schemes will be provided in the subsequent implementation of the present invention.

[0062] Example 2:

[0063] This embodiment provides a structural scheme for the first optical chip 3, mounting post 10, and optical refraction unit 4 based on embodiment 1, such as... Figure 5 As shown, when one mounting post 10 is provided, the optical chip 3 includes a first optical chip 30 and a second optical chip 31. The first optical chip 30 is mounted on the surface of the mounting post 10, and the second optical chip 31 is mounted on the surface of the TO seat 1. Figure 6 As shown, the light refraction unit 4 includes a first support 400, a first transmission glass plate 401, a second transmission glass plate 402, and a first beam-splitting glass plate 403. The first transmission glass plate 401, the second transmission glass plate 402, and the first beam-splitting glass plate 403 are fixedly mounted on the first support 400. The first beam-splitting glass plate 403 is used to reflect light of a specific wavelength in the optical signal and allow light of other wavelengths to pass through, so that the optical signal enters the optical chip 3. The first transmission glass plate 401 is arranged parallel to the first optical chip 30, the second transmission glass plate 402 is arranged parallel to the second optical chip 31, and the first beam-splitting glass plate 403 is located directly below the light-transmitting opening of the TO cap 2. Figure 7As shown, the first beam-splitting glass plate 403 is mounted on the first inclined surface 4000 of the first support 400. The inclined angle of the first inclined surface 4000 is 45°±0.01°, so that the light wavelength received by the first optical chip 30 in the optical signal is reflected back to the first optical chip 30, and the light wavelength received by the second optical chip 31 in the optical signal is transmitted back to the second optical chip 31. The center of the first beam-splitting glass plate 403 is aligned with the centers of the first transmission glass plate 401 and the second transmission glass plate 402, respectively. The center of the first transmission glass plate 401 is aligned with the center of the APD on the first optical chip 30, and the center of the second transmission glass plate 402 is aligned with the center of the APD on the second optical chip 31. Furthermore, the first support 400 has notches in the areas where the first transmission glass plate 401, the second transmission glass plate 402, and the first beam-splitting glass plate 403 are mounted, allowing light to pass through.

[0064] A beam-splitting film is attached to the first beam-splitting glass slide 403. The beam-splitting film can reflect the light wavelength that the first optical chip 30 can receive, and allow the light wavelength that the second optical chip 31 can receive to be transmitted. An anti-reflection film is attached to the surface of the first transmissive glass slide 401 and the second transmissive glass slide 402.

[0065] In one embodiment, taking the first optical chip 30 receiving light with a wavelength of 1270nm and the second optical chip 31 receiving light with a wavelength of 1290nm as an example, the beam splitting film attached to the first beam splitting glass 403 can reflect the 1270nm light in the optical signal into the first optical chip 30, so that the 1290nm light passes through and enters the second optical chip 31.

[0066] When the optical signal is a converging light, refer to Figure 6 As shown, a spherical lens 20 is mounted on the top of the TO cap 2, and the center point of the spherical lens 20 is collinear with the center point of the first beam-splitting glass plate 403. Specifically, since the center point of the spherical lens 20 is located on the central axis of the TO cap 2, the center point of the spherical lens 20 is collinear with the center point of the first beam-splitting glass plate 403, taking the central axis of the TO cap 2 as a reference. Taking the above embodiment as an example, the optical path of the focused light entering the first optical chip 30 is as follows: the light source emits a light signal containing wavelengths of 1270nm and 1290nm, the light signal is focused onto the first beam-splitting glass plate 403 by the spherical lens 20, the first beam-splitting glass plate 403 reflects the 1270nm wavelength light, the 1270nm light passes through the first transmission glass plate 401 and enters the first optical chip 30; the 1290nm light passes through the first beam-splitting glass plate 403 and the second transmission glass plate 402 and enters the second optical chip 31.

[0067] When the optical signal is parallel light, such as Figure 8As shown, a flat window mirror 21 is installed on the top of the TO cap 2, and an external lens 22 is disposed above the flat window mirror 21. The central axis of the external lens 22 is collinear with the center of the first beam splitter 403. The external lens 22 is used to converge the parallel light and transmit it into the flat window mirror 21. Due to the small area of ​​the spherical lens 20 and the limitations of the optical path structure, it is not possible to directly use the spherical lens 20 to converge the parallel light into the interior of the TO. In order to meet the optical path design requirements, a structure design of flat window mirror 21 and external lens 22 must be used. The external lens 22 has a larger area and can converge a wide range of parallel light, replacing the function of the spherical lens 20 in converging light. Therefore, when the light signal is parallel light, the light signal first passes through the external lens 22 for convergence, and then passes through the flat window mirror 21 to the first beam splitter 403. The subsequent optical path is the same as the optical path using the spherical lens 20 mentioned above, and will not be described again here.

[0068] For parallel light, in addition to the above-mentioned method of using an external lens 22 for focusing, such as... Figure 9 As shown, when the light signal is parallel light, a flat window mirror 21 is provided on the TO cap 2, allowing the parallel light to directly enter the interior of the TO through the flat window mirror 21. The light refraction unit 4 includes a second bracket 404, a first convex lens 405, and a second convex lens 406. The first convex lens 405 and the second convex lens 406 are fixedly mounted on the second bracket 404. The first convex lens 405 is used to converge the light signal into the first optical chip 30, and the second convex lens 406 is used to converge the light signal into the second optical chip 31. The focal point of the first convex lens 405 is located on the photosensitive surface of the APD of the first optical chip 30, and the focal point of the second convex lens 406 is located on the photosensitive surface of the APD of the second optical chip 31. The light refraction unit 4 also includes a third transmission glass plate 407, a second beam-splitting glass plate 408, and a first reflection glass plate 409. The third transmission glass plate 407 is arranged parallel to the first convex lens 405, and the second beam-splitting glass plate 408 is located directly below the flat window mirror 21. Figure 10As shown, the second beam-splitting glass plate 408 is mounted on the second inclined surface 4040 of the second support 404, with an inclination angle of 13°±0.01°. The first reflective glass plate 409 is mounted on the third inclined surface 4041 of the second support 404, with an inclination angle of 32°±0.01°. The centers of the APD on the second optical chip 31, the optical center of the first convex lens 405, the third transmission glass plate 407, and the first reflective glass plate 409 are collinear; the optical center of the second convex lens 406 and the center of the second beam-splitting glass plate 408 are collinear. To ensure that the light signal is collimated and enters the first optical chip 30 after reflection by the second beam-splitting glass plate 408 and the first reflective glass plate 409, as follows... Figure 10 and Figure 11 As shown in the figure, taking the direction shown in the figure as an example, the second inclined surface 4040 of the second beam splitter 408 is at 13° to the horizontal direction, and the third inclined surface 4041 of the first reflective glass 409 is at 32° to the vertical direction, so that the light signal can be collimated and reflected into the first optical chip 30.

[0069] Specifically, the third transmissive glass slide 407 is fitted with an antireflective film, the second beam-splitting glass slide 408 is fitted with a filter film, and the first reflective glass slide 409 is fitted with a reflective film. Based on the above structure, taking the first optical chip 30 receiving light with a wavelength of 1270nm and the second optical chip 31 receiving light with a wavelength of 1290nm as an example, the optical path for the optical signal to be transmitted into the first optical chip 30 is as follows: Figure 12 As shown, the light source emits light signals with wavelengths of 1270nm and 1290nm. These light signals pass through the flat window mirror 21 and illuminate the second beam-splitting glass plate 408. The second beam-splitting glass plate 408 reflects the 1270nm wavelength light onto the first reflective glass plate 409. The 1290nm light passes through the second beam-splitting glass plate 408, and the first reflective glass plate 409 reflects the 1270nm light again onto the third transmission glass plate 407. The 1270nm light then passes through the third transmission glass plate 407 and the first convex lens 405, converging the light signal into the APD of the first optical chip 30. Similarly, the light path for the light signal to enter the second optical chip 31 is as follows: Figure 13 As shown, the light source emits light signals with wavelengths of 1270nm and 1290nm. The light signals pass through the flat window mirror 21 and illuminate the second beam splitter 408. The second beam splitter 408 reflects the light with a wavelength of 1270nm, and the light with a wavelength of 1290nm passes through the second beam splitter 408 and illuminates the second convex lens 406. The second convex lens 406 focuses the light signals into the APD of the second optical chip 31.

[0070] Example 3:

[0071] Based on Embodiments 1 and 2, this invention provides a second structural scheme for the optical chip 3, mounting post 10, and light refraction unit 4, such as... Figure 14 and Figure 15 As shown, when three mounting posts 10 are provided, the optical chip 3 includes a third optical chip 32, a fourth optical chip 33, a fifth optical chip 34, and a sixth optical chip 35. The third optical chip 32, the fourth optical chip 33, and the fifth optical chip 34 are respectively mounted on the mounting posts 10, and the sixth optical chip 35 is mounted on the surface of the TO base 1. Figure 14 As shown in the figure, in this embodiment, the mounting post 10 is square. In addition, the mounting post 10 can also be an arc-shaped post.

[0072] like Figure 14 and Figure 16 As shown, the light refraction unit 4 includes a third support 410 and a beam splitter 411. The beam splitter 411 is fixedly connected to the third support 410 and is placed vertically. The beam splitter 411 includes a first plane 4110, a second plane 4111, and a third plane 4112. The first plane 4110 is parallel to the third optical chip 32, the second plane 4111 is parallel to the fourth optical chip 33, and the third plane 4112 is parallel to the fifth optical chip 34. The beam splitter 411 is internally provided with a first beam splitter 4113, a second beam splitter 4114, and a third beam splitter 4115, as shown. Figure 17 As shown, the first beam splitter 4113, the second beam splitter 4114, and the third beam splitter 4115 all pass through the center of the beam splitter prism 411. The first beam splitter 4113 is inclined at an angle of 45°±0.01° to the first plane 4110, the second beam splitter 4114 is inclined at an angle of 45°±0.01° to the second plane 4111, and the third beam splitter 4115 is inclined at an angle of 45°±0.01° to the third plane 4112. Specifically, the first beam splitter 4113 is used to reflect light of wavelengths that can be received by the third optical chip 32 into the third optical chip 32, while allowing light of other wavelengths to pass through; the second beam splitter 4114 is used to reflect light of wavelengths that can be received by the fourth optical chip 33 into the fourth optical chip 33, while reflecting light of other wavelengths; the third beam splitter 4115 is used to reflect light of wavelengths that can be received by the fifth optical chip 34 into the fifth optical chip 34, while reflecting light of other wavelengths. In practical applications, the center of the light source, the center of the beam splitter 411, and the center of the APD of the sixth optical chip 35 are on the same straight line, and the center of the beam splitter 411 and the centers of the APDs of the third optical chip 32, the fourth optical chip 33, and the fifth optical chip 34 are on the same horizontal plane.

[0073] In addition to the first beam splitter 4113, the second beam splitter 4114, and the third beam splitter 4115, to prevent light of wavelengths other than those that can be received by the optical chip 3 from entering the optical chip 3, the first plane 4110 is covered with a first filter film, allowing light wavelengths that can be received by the third optical chip 32 to pass through the first filter film, while other wavelengths are reflected; the second plane 4111 is covered with a second filter film, allowing light wavelengths that can be received by the fourth optical chip 33 to pass through the second filter film, while other wavelengths are reflected; the third plane 4112 is covered with a third filter film, allowing light wavelengths that can be received by the fifth optical chip 34 to pass through the fifth filter film, while other wavelengths are reflected; the upper surface of the beam splitter prism 411 is covered with an anti-reflection film, and the lower surface of the beam splitter prism 411 is covered with a fourth filter film, which allows light wavelengths that can be received by the sixth optical chip 35 to pass through, while other wavelengths are reflected.

[0074] Similar to that described in Example 2, when the light signal is converging light, the spherical lens 20 is installed on the top of the TO cap 2; when the light signal is parallel light, the flat window mirror 21 is installed on the top of the TO cap 2, and an external lens 22 is provided on the outside of the TO cap 2, which is used to converge the light signal.

[0075] like Figure 18As shown, taking the third optical chip 32 receiving 1290nm light, the fourth optical chip 33 receiving 1310nm light, the fifth optical chip 34 receiving 1330nm light, and the sixth optical chip 35 receiving 1270nm light as an example, the first beam splitter 4113 can reflect 1290nm light, the second beam splitter 4114 can reflect 1310nm light, and the third beam splitter 4115 can reflect 1330nm light; the first filter film only allows 1290nm light to pass through, the second filter film only allows 1310nm light to pass through, the third filter film only allows 1330nm light to pass through, and the fourth filter film only allows 1290nm light to pass through. Based on this, the optical paths for receiving optical signals by the third optical chip 32, the fourth optical chip 33, the fifth optical chip 34, and the sixth optical chip 35 are as follows: the light source emits a mixed beam of light with wavelengths of 1270nm, 1290nm, 1310nm, and 1330nm. The beam passes through the TO cap 2 and converges onto the first beam splitter 4113, the second beam splitter 4114, and the third beam splitter 4115 at the center of the beam splitter 411. The first beam splitter 4113 reflects the 1290nm light, while the 1270nm, 1310nm, and 1330nm light passes through. The reflected 1290nm light passes through the first filter and is transmitted into the APD of the third optical chip 32; the second beam splitter 4114... The optical film 4114 reflects 1310nm light, while 1270nm, 1290nm, and 1330nm light pass through. The reflected 1310nm light passes through the second filter film and is transmitted into the APD of the fourth optical chip 33. The third beam splitter 4115 reflects 1330nm light, while 1270nm, 1290nm, and 1310nm light pass through. The reflected 1330nm light passes through the third filter film and is transmitted into the APD of the fifth optical chip 34. The 1270nm light in the optical signal passes through the first beam splitter 4113, the second beam splitter 4114, the third beam splitter 4115, and the fourth filter film and is transmitted to the APD of the sixth optical chip 35.

[0076] Example 4:

[0077] This invention provides a dual-integrated optical module with a hybrid vertical and horizontal package, based on embodiments 1-3, including the dual-integrated TO optical component with a hybrid vertical and horizontal package described in embodiments 1-3. Therefore, it also possesses all the advantages of the aforementioned optical components, allowing all optical chips 3 located within the TO to share a single optical path, and features a simple structure, low cost, and overcomes the packaging difficulties of existing packaging structures.

[0078] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A dual-integrated TO optical module with hybrid vertical and horizontal packaging, characterized in that, include: TO base (1), TO cap (2), multiple optical chips (3) and optical refraction unit (4); the multiple optical chips (3) and the optical refraction unit (4) are fixedly installed on the TO base (1); The TO base (1) is provided with at least one mounting post (10), the mounting post (10) and the TO base (1) are fixedly connected, each mounting post (10) is fixedly mounted with an optical chip (3), the surface of the TO base (1) is mounted with an optical chip (3), and the light refraction unit (4) is used to transmit light signals to each optical chip (3); The top center of the TO cap (2) is provided with either a spherical lens (20) or a flat window mirror (21). The spherical lens (20) is used to transmit converging light to the light refraction unit (4), and the flat window mirror (21) is used to transmit parallel light to the light refraction unit (4).

2. The dual-integrated TO optical module with vertical and horizontal hybrid packaging according to claim 1, characterized in that, When one mounting post (10) is provided, the optical chip (3) includes a first optical chip (30) and a second optical chip (31). The first optical chip (30) is mounted on the surface of the mounting post (10), and the second optical chip (31) is mounted on the surface of the TO seat (1).

3. The dual-integrated TO optical module with vertical and horizontal hybrid packaging according to claim 2, characterized in that, The light refraction unit (4) includes a first support (400), a first transmission glass slide (401), a second transmission glass slide (402), and a first beam splitting glass slide (403), wherein the first transmission glass slide (401), the second transmission glass slide (402), and the first beam splitting glass slide (403) are fixedly mounted on the first support (400); The first transmission glass plate (401) is arranged parallel to the first optical chip (30), the second transmission glass plate (402) is arranged parallel to the second optical chip (31), the first beam splitter glass plate (403) is arranged directly below the light-transmitting port of the TO cap (2), the first beam splitter glass plate (403) is mounted on the first inclined surface (4000) of the first bracket (400), the inclination angle of the first inclined surface (4000) is 45°±0.01°, so that the light wavelength received by the first optical chip (30) in the optical signal is reflected back to the first optical chip (30), and the light wavelength received by the second optical chip (31) in the optical signal is transmitted back to the second optical chip (31).

4. The dual-integrated TO optical module with vertical and horizontal hybrid packaging according to claim 3, characterized in that, When the light signal is a converging light, the top of the TO cap (2) is equipped with the spherical lens (20), and the center point of the spherical lens (20) is collinear with the center point of the first beam splitter (403).

5. The dual-integrated TO optical module with vertical and horizontal hybrid packaging according to claim 3, characterized in that, When the light signal is parallel light, a flat window mirror (21) is installed on the top of the TO cap (2), and an external lens (22) is provided above the flat window mirror (21). The central axis of the external lens (22) is collinear with the center of the first beam splitter (403). The external lens (22) is used to converge the parallel light and transmit it into the flat window mirror (21).

6. The dual-integrated TO optical module with vertical and horizontal hybrid packaging according to claim 2, characterized in that, When the optical signal is parallel light, a flat window mirror (21) is provided on the TO cap (2); The light refraction unit (4) includes a second bracket (404), a first convex lens (405), and a second convex lens (406). The first convex lens (405) and the second convex lens (406) are fixedly mounted on the second bracket (404). The first convex lens (405) is used to converge the light signal into the first optical chip (30), and the second convex lens (406) is used to converge the light signal into the second optical chip (31). The light refraction unit (4) further includes a third transmission glass plate (407), a second beam splitter glass plate (408), and a first reflection glass plate (409). The second beam splitter glass plate (408) is disposed directly below the flat window mirror (21). The second beam splitter glass plate (408) is mounted on the second inclined surface (4040) of the second bracket (404), and the inclination angle of the second inclined surface (4040) is 13°±0.01°. The first reflection glass plate (409) is mounted on the third inclined surface (4041) of the second bracket (404), and the inclination angle of the third inclined surface (4041) is 32°±0.01°.

7. The dual-integrated TO optical module with vertical and horizontal hybrid packaging according to claim 1, characterized in that, When three mounting posts (10) are provided, the optical chip (3) includes a third optical chip (32), a fourth optical chip (33), a fifth optical chip (34) and a sixth optical chip (35). The third optical chip (32), the fourth optical chip (33) and the fifth optical chip (34) are respectively mounted on the mounting posts (10), and the sixth optical chip (35) is mounted on the surface of the TO seat (1). The light refraction unit (4) includes a third support (410) and a beam splitter (411). The beam splitter (411) is fixedly connected to the third support (410). The beam splitter (411) is placed vertically. The beam splitter (411) includes a first plane (4110), a second plane (4111), and a third plane (4112). The first plane (4110) is parallel to the third optical chip (32), the second plane (4111) is parallel to the fourth optical chip (33), and the third plane (4112) is parallel to the fifth optical chip (34). The beam splitter (411) is internally provided with a first beam splitter (4113), a second beam splitter (4114), and a third beam splitter (4115). The first beam splitter (4113), the second beam splitter (4114), and the third beam splitter (4115) all pass through the center of the beam splitter (411). The first beam splitter (4113) is inclined at an angle of 45°±0.01° to the first plane (4110), the second beam splitter (4114) is inclined at an angle of 45°±0.01° to the second plane (4111), and the third beam splitter (4115) is inclined at an angle of 45°±0.01° to the third plane (4112).

8. The dual-integrated TO optical module with vertical and horizontal hybrid packaging according to claim 7, characterized in that, The first plane (4110) is covered with a first filter film, and the light wavelengths that the third optical chip (32) can receive can pass through the first filter film, while the light of other wavelengths is reflected; the second plane (4111) is covered with a second filter film, and the light wavelengths that the fourth optical chip (33) can receive can pass through the second filter film, while the light of other wavelengths is reflected; the third plane (4112) is covered with a third filter film, and the light wavelengths that the fifth optical chip (34) can receive can pass through the fifth filter film, while the light of other wavelengths is reflected; The upper surface of the beam splitter (411) is covered with an anti-reflection film, and the lower surface of the beam splitter (411) is covered with a fourth filter film. The fourth filter film allows light wavelengths that can be received by the sixth optical chip (35) to pass through, while other wavelengths are reflected.

9. The dual-integrated TO optical module with vertical and horizontal hybrid packaging according to claim 8, characterized in that, When the light signal is converging light, the spherical lens (20) is installed on the top of the TO cap (2); when the light signal is parallel light, the flat window mirror (21) is installed on the top of the TO cap (2), and an external lens (22) is provided on the outside of the TO cap (2), which is used to converge the light signal.

10. A dual-integrated optical module with hybrid vertical and horizontal packaging, characterized in that, Includes the dual-integrated TO optical module with vertical and horizontal hybrid packaging as described in any one of claims 1-9.

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