An intermediate processing apparatus for a negative photoresist coating process

Abstract

The application discloses a kind of intermediate processing equipment for negative photoresist coating process, it is related to chip production with photoresist coating related auxiliary equipment technical field, including first solidification tunnel, second solidification tunnel, a pair of detection components, a pair of translation components, turnover component.First solidification tunnel is equipped with multiple silicon wafer in-out components.Second solidification tunnel is parallelly arranged in the side of first solidification tunnel.Detection component is used to measure the thickness of photoresist on silicon wafer.Translation component is used to move silicon wafer between first solidification tunnel and second solidification tunnel.Turnover component is used to transfer silicon wafer from the delivery end of second conveyor to the delivery starting end of first conveyor and turn over silicon wafer at the same time.The application can detect the thickness of more number of silicon wafers with completed front photoresist coating while solidifying, and translate or turn over between two solidification tunnels, timely return silicon wafer to photoresist coating machine for back photoresist coating.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of auxiliary equipment for photoresist coating in chip production, and particularly relates to an intermediate processing equipment for negative photoresist coating process. BACKGROUND

[0002] The production process of chips includes many process flows, and different processes are used according to different chip types. In some common chip production processes, photoresist needs to be coated on the front and back surfaces of a silicon wafer before photoetching, the photoresist on the front surface is used to form a circuit pattern later, and the photoresist on the back surface mainly plays a protective and anti-fouling role.

[0003] After the front surface of the silicon wafer is coated with photoresist, the photoresist needs to be dried first, which is usually referred to as pre-baking in the semiconductor process. When a solid mask needs to be made on the silicon wafer or deep etching needs to be performed, negative photoresist is usually coated on both surfaces. However, the pre-baking time of negative photoresist is relatively long. For example, for 200 mu m thick SU-8 glue, the pre-baking condition is usually 95 degrees C for 1 hour. Therefore, the intermediate processing of photoresist coating needs more manual operations, including taking the silicon wafer from the photoresist coating machine, transporting it to the oven, opening the oven, putting in the silicon wafer, closing the oven, waiting for the silicon wafer to solidify, opening the oven, closing the oven, and putting the solidified silicon wafer back into the photoresist coating machine. When a large number of continuous production is performed, the solidification start time of the silicon wafer in each position in the oven needs to be recorded on the recording board beside the oven, so more manpower is consumed. SUMMARY

[0004] In view of the above defects, the present application provides an intermediate processing equipment for negative photoresist coating process, which can detect the thickness of a large number of silicon wafers with front photoresist coating while solidifying, translate or flip between two solidification tunnels, and timely send the silicon wafers that can be coated with back photoresist back to the photoresist coating machine.

[0005] In order to achieve the purpose of the present application, the following technologies are adopted:

[0006] An intermediate processing equipment for negative photoresist coating process is arranged on one side of a plurality of photoresist coating machines arranged in an array, and comprises:

[0007] A first solidification tunnel is provided with a plurality of hot air blowers blowing hot air into the inside thereof, a first conveying belt conveyor is arranged inside the first solidification tunnel and extends to the outside of the inlet and outlet of the first solidification tunnel at both ends, a plurality of side openings are formed in the side surface of the first solidification tunnel towards the photoresist coating machine for the silicon wafer to enter and exit the first solidification tunnel, and a plurality of silicon wafer entering and exiting assemblies are further arranged on the first solidification tunnel for transferring the silicon wafer between the first solidification tunnel and the photoresist coating machine;

[0008] A second curing tunnel is arranged in parallel to the first curing tunnel on the side away from the photoresist coating machine, and a plurality of air blowers are arranged at the upper end of the second curing tunnel. A second conveying belt conveyor is arranged inside the second curing tunnel, and the conveying direction of the second conveying belt conveyor is opposite to that of the first conveying belt conveyor. The two ends of the second conveying belt conveyor extend outward by a predetermined distance from the inlet and outlet of the second curing tunnel, respectively.

[0009] A pair of detection assemblies are arranged at the outlet ends of the first and second curing tunnels, respectively. The detection assembly comprises an interferometric thickness sensor for measuring the thickness of the photoresist on the silicon wafer.

[0010] A pair of translation assemblies are arranged at the two ends of the first curing tunnel, respectively, for moving the silicon wafer between the first and second curing tunnels.

[0011] A turnover assembly is arranged between the first and second curing tunnels for transferring the silicon wafer from the conveying end of the second conveying belt conveyor to the conveying start end of the first conveying belt conveyor and simultaneously turning over the silicon wafer.

[0012] Further, the side of the first curing tunnel facing the photoresist coating machine is also provided with a plurality of vertical first linear mechanisms. The output end of the first linear mechanism is provided with an L-shaped side cover, and the vertical side of the L-shaped side cover is used to open and close the opposite side opening by sliding.

[0013] Further, the silicon wafer in-out assembly comprises a second linear mechanism arranged at the upper end of the first curing tunnel and having an output direction pointing to the photoresist coating machine. The output end of the second linear mechanism is vertically provided with a third linear mechanism, and the output end of the third linear mechanism is provided with an inverted L-shaped block. The vertical lower end of the inverted L-shaped block is provided with a horizontal rod parallel to the output axis of the second linear mechanism. One side of the horizontal rod is provided with a pair of limiting rods, and the limiting rods extend from the side of the horizontal rod in a direction opposite to the conveying direction of the first conveying belt conveyor.

[0014] Further, the length of the limiting rod is greater than the radius of the silicon wafer and less than the diameter of the silicon wafer.

[0015] Further, the detection assembly comprises a control box assembled on one side of the first or second curing tunnel, and a ring frame assembled on the outlet end surface of the first or second curing tunnel. The interferometric thickness sensor is vertically arranged in the ring frame.

[0016] Further, one translation assembly is used to move the silicon wafer from the delivery end of the first conveyor to the delivery start end of the second conveyor, and another translation assembly is used to move the silicon wafer from the delivery end of the second conveyor to the delivery start end of the first conveyor, the translation assembly comprises a pair of L-shaped frames, the upper end of the L-shaped frame is provided with a fourth linear mechanism parallel to the second linear mechanism, the sliding end of the fourth linear mechanism is provided with a fifth linear mechanism parallel to the conveying direction of the silicon wafer in the first curing tunnel or the second curing tunnel, the output end of the fifth linear mechanism is provided with a pair of L-shaped supporting plates arranged symmetrically, and the vertical parts of the two L-shaped supporting plates are used to limit the silicon wafer.

[0017] Further, the upper end surface of the horizontal part of the L-shaped supporting plate, the conveying plane of the first conveyor and the conveying plane of the second conveyor are located on the same horizontal plane.

[0018] Further, the translation assembly comprises a first rotary motor located between the delivery start end of the first conveyor and the delivery end of the second conveyor, the output end of the first rotary motor is provided with a second rotary motor, one side of the output end of the second rotary motor is provided with a pair of sixth linear mechanisms with opposite output directions, the output end of the sixth linear mechanism is provided with a hanging plate, the lower end of the side face of the hanging plate facing the sixth linear mechanism is provided with a clamping block, one side face of the clamping block is formed with a circular arc surface, and the circular arc surface is provided with a circular arc groove matched with the outer circumferential side of the silicon wafer.

[0019] Further, the output end of the second rotary motor is provided with a rotating plate, one side face of the rotating plate is provided with an L-shaped supporting rod, the short edge of the L-shaped supporting rod is provided with a mounting seat at one end, and the two sixth linear mechanisms are arranged at the two ends of the mounting seat.

[0020] The beneficial effects of the technical scheme are as follows:

[0021] After the photoresist coating machine completes the coating of the photoresist on the front surface of the silicon wafer, the silicon wafer can be transported into the first curing tunnel through the silicon wafer in-out assembly. In mass production, more silicon wafers can be circulated and moved in the first curing tunnel and the second curing tunnel, and heated by hot air to cure the silicon wafers. Since the silicon wafers are moving continuously, it is not necessary to provide an interferometric thickness sensor for each silicon wafer for detection. The number of detection assemblies is set to two, and they are respectively arranged at the conveying ends of the first conveying belt conveyor and the second conveying belt conveyor, so as to detect the thickness variation of the photoresist on the silicon wafer. Although the photoresist is coated by using an automatic equipment, the thickness of the photoresist is difficult to control, so the thickness variation of the photoresist is detected instead of simply detecting the thickness, which can better determine whether the curing is completed. If the thickness no longer changes or the variation is less than a preset value, the silicon wafer can be flipped by the flipping assembly, and then the silicon wafer is sent back to the photoresist coating machine from the first curing tunnel. Through the intermediate processing equipment of the negative photoresist coating process, the manual operation steps in the intermediate stage of the negative photoresist coating process can be greatly reduced, and the manpower can be saved. BRIEF DESCRIPTION OF DRAWINGS

[0022] Figure 1 A perspective view of the whole embodiment of the present application is shown when it is located at one side of the photoresist coating machine.

[0023] Figure 2 A part A enlarged view of the embodiment of the present application is shown. Figure 1

[0024] A perspective view of the whole embodiment of the present application is shown. Figure 3 Figure 1 A part B enlarged view of the embodiment of the present application is shown.

[0025] Figure 4 Figure 3 A perspective view of the whole embodiment of the present application is shown.

[0026] Figure 5 A perspective view of the whole embodiment of the present application is shown. Figure 2

[0027] A part C enlarged view of the embodiment of the present application is shown. Figure 6 Figure 5 A part D enlarged view of the embodiment of the present application is shown.

[0028] Figure 7 Figure 5 A perspective view of the whole embodiment of the present application is shown.

[0029] Figure 8 A perspective view of the whole embodiment of the present application is shown. Figure 3

[0030] A part E enlarged view of the embodiment of the present application is shown. Figure 9 Figure 8 ​​​​​Enlarged view of part E.

[0031] Figure 10 The diagram shows a partial exploded view of the first solidification tunnel, the first conveyor belt, the first linear mechanism, and the L-shaped side cover according to an embodiment of this application.

[0032] The diagram shows the following components: First curing tunnel 1, First conveyor belt 11, Side opening 12, First linear mechanism 13, L-shaped side cover 14, Second linear mechanism 15, Third linear mechanism 16, Inverted L-shaped block 17, Crossbar 18, Limiting rod 19, Second curing tunnel 2, Second conveyor belt 21, Hot air blower 3, Detection assembly 4, Control box 41, Ring frame 42, Interference thickness sensor 43, Connecting line 44, Translation assembly 5, L-shaped frame 51, Fourth linear mechanism 52, Fifth linear mechanism 53, End plate 54, L-shaped support plate 55, Tilting assembly 6, Side plate 61, First rotary motor 62, Second rotary motor 63, Turning plate 64, L-shaped support rod 65, Mounting base 66, Sixth linear mechanism 67, Hanging plate 68, Clamping block 69, Photoresist coating machine 7, Feed port 71, Semiconductor robot 72, Tray 73. Detailed Implementation

[0033] The present application will be further described below with reference to the accompanying drawings and embodiments.

[0034] like Figures 1-10 The intermediate processing equipment shown is located on one side of multiple photoresist coating machines 7 arranged in an array, and includes a first curing tunnel 1, a second curing tunnel 2, a detection component 4, a translation component 5, and a flipping component 6.

[0035] like Figures 1-10As shown, the first curing tunnel 1 has multiple hot air blowers 3 at its upper end that blow hot air into it. A first conveyor belt 11 is installed inside the first curing tunnel 1, with both ends extending a predetermined distance outwards from the entrance and exit of the first curing tunnel 1, respectively. Multiple side openings 12 for silicon wafers to enter and exit the first curing tunnel 1 are provided on the side facing the photoresist coating machine 7. Multiple vertical first linear mechanisms 13 are also provided on the side. The output end of each first linear mechanism 13 has an L-shaped side cover 14, which slides to open and close the side openings 12. The first curing tunnel 1 also has multiple silicon wafer entry / exit components for transferring silicon wafers between the first curing tunnel 1 and the photoresist coating machine 7. Each silicon wafer entry / exit component includes components located on the upper surface of the first curing tunnel 1 with an output direction pointing towards light. The second linear mechanism 15 of the resist coating machine 7 has a third linear mechanism 16 vertically arranged at its output end. The output end of the third linear mechanism 16 has an inverted L-shaped block 17. The lower vertical part of the inverted L-shaped block 17 has a horizontal bar 18 parallel to the output axis of the second linear mechanism 15. A pair of limiting rods 19 are provided on one side of the horizontal bar 18. The two limiting rods 19 are used to limit the silicon wafer between their opposite faces. The limiting rods 19 extend from the side of the horizontal bar 18 in the opposite direction to the conveying direction of the first conveyor belt 11. This allows the silicon wafer to be blocked by the horizontal bar 18 and limited by the limiting rods 19 without additional silicon wafer tracking components such as cameras. The length of the limiting rods 19 is greater than the radius of the silicon wafer and less than the diameter of the silicon wafer. When the side opening 12 is opened, the limiting rods 19 can pass through the side opening 12 when moving.

[0036] like Figure 1 , Figure 3 , Figures 5-9 As shown, the second curing tunnel 2 is arranged parallel to one side of the first curing tunnel 1 and is relatively farther away from the photoresist coating machine 7 than the first curing tunnel 1. Multiple hot air blowers 3 are also provided at the upper end of the second curing tunnel 2. Specifically, multiple air ducts are opened at the upper ends of both the first curing tunnel 1 and the second curing tunnel 2, which are connected to the air outlet of the hot air blowers 3. The second curing tunnel 2 is equipped with a second conveyor belt 21 that is opposite to the first conveyor belt 11 in terms of conveying direction during operation. The two ends of the second conveyor belt 21 extend a predetermined distance to the outside of the entrance and exit of the second curing tunnel 2, respectively.

[0037] like Figure 1 , Figure 3 , Figures 5-9As shown, there is a pair of detection components 4, which are respectively located at the exit ends of the first curing tunnel 1 and the second curing tunnel 2. The detection component 4 includes a control box 41 mounted on one side of the first curing tunnel 1 or the second curing tunnel 2, and a ring frame 42 mounted on the exit end face of the first curing tunnel 1 or the second curing tunnel 2. An interferometric thickness sensor 43 is vertically mounted on the ring frame 42 for measuring the thickness of the photoresist on the silicon wafer. The connecting line 44 of the interferometric thickness sensor 43 is connected to the control box 41.

[0038] like Figure 1 , Figure 3 , Figures 5-9 As shown, there is a pair of translation components 5, which are respectively located at both ends of the first curing tunnel 1, and can also be said to be located at both ends of the second curing tunnel 2. The translation components 5 include a pair of L-shaped frames 51 fixed to one end of the first curing tunnel 1 and one end of the second curing tunnel 2. The upper end of the L-shaped frame 51 is provided with a fourth linear mechanism 52 parallel to the second linear mechanism 15. The sliding end of the fourth linear mechanism 52 is provided with a fifth linear mechanism 53 parallel to the conveying direction of the silicon wafer in the first curing tunnel 1 or the second curing tunnel 2. The output end of the fifth linear mechanism 53 is provided with an end plate 54. One side of the end plate 54 is provided with a pair of symmetrically arranged L-shaped support plates 55. The upper horizontal surface of the L-shaped support plate 55, the conveying plane of the first conveyor belt 11, and the second conveyor belt 21 are all located on the same horizontal plane. The vertical opposite surfaces of the two L-shaped support plates 55 are used to limit the silicon wafer.

[0039] like Figure 1 , Figure 3 , Figure 5 , Figure 6 , Figure 8 , Figure 9 As shown, the flipping assembly 6 is located between the first curing tunnel 1 and the second curing tunnel 2, and includes a side plate 61 fixed to one side of the first curing tunnel 1. A first rotary motor 62 is located above one end of the side plate 61 between the starting end of the first conveyor belt 11 and the ending end of the second conveyor belt 21. A second rotary motor 63 is located at the output end of the side plate 62. A rotating plate 64 is located at the output end of the second rotary motor 63. An L-shaped support rod 65 is located on one side of the rotating plate 64. A mounting base 66 is located at one end of the short side of the rotating plate 64. A sixth linear mechanism 67 with opposite output directions is located at both ends of the mounting base 66. A hanging plate 68 is located at the output end of the sixth linear mechanism 67. A clamping block 69 is located at the lower end of the side of the hanging plate 68 facing the sixth linear mechanism 67. A circular arc surface is formed on one side of the clamping block 69. The circular arc surface has a circular arc groove that matches the outer periphery of the silicon wafer.

[0040] Preferably, a central control device can also be provided that is electrically connected to the detection component 4, the translation component 5, and the flipping component 6. Obviously, the translation component 5 should always move the silicon wafer at the end of the first conveyor belt 11 to the beginning of the second conveyor belt 21. As for the other end, that is, the end of the second conveyor belt 21, after receiving the information from the detection component 4, the central control device determines whether the flipping component 6 flips the silicon wafer and then places the silicon wafer at the beginning of the first conveyor belt 11, or whether the other translation component 5 moves the silicon wafer. The information and judgment method of the detection component 4 will be explained later.

[0041] In this embodiment, the first linear mechanism 13, the second linear mechanism 15, the third linear mechanism 16, the fifth linear mechanism 53, and the sixth linear mechanism 67 all use single-axis linear cylinders, while the fourth linear mechanism 52 uses a rodless linear cylinder.

[0042] Work style:

[0043] First, such as Figure 1 The intermediate processing equipment for the negative photoresist coating process is arranged as shown. It should be noted that, due to the different sizes of various photoresist coating machines 7, the intermediate processing equipment for the negative photoresist coating process may block the feeding position of the photoresist coating machine 7. If it is not possible to manually feed the photoresist coating machine 7 at the beginning of photoresist coating, the silicon wafer can be placed at the starting end of the first conveyor belt 11, and then fed through the silicon wafer entering and exiting the assembly.

[0044] After the photoresist coating on the front side of the silicon wafer is completed by the photoresist coating machine 7, the feed port 71 is opened, the semiconductor robot 72 extends out of the feed port 71, the upper surface of the tray 73 is on the same horizontal plane as the conveying plane of the first conveyor belt 11, and then the limiting rod 19 is moved by the second linear mechanism 15 and the third linear mechanism 16 of the silicon wafer entry and exit assembly, the L-shaped side cover 14 is lowered by the first linear mechanism 13 to open the side opening 12, and then the silicon wafer is moved onto the first conveyor belt 11 by the second linear mechanism 15, and then the limiting rod 19 is raised by the third linear mechanism 16 to release the limitation on the silicon wafer, so that the silicon wafer can start to be conveyed, and then the silicon wafer entry and exit assembly is moved out of the first curing tunnel 1 and the side opening 12 is closed.

[0045] This process is repeated, allowing multiple silicon wafers to be circulated and transported within the first curing tunnel 1 and the second curing tunnel 2. When the silicon wafers are transported below the interferometric thickness sensor 43, the photoresist thickness on them is detected. Optionally, depending on the actual situation, the detection can be performed at the center point of the upper surface of each silicon wafer, or at the midpoint between the center point and the edge. When the photoresist thickness on the silicon wafer no longer changes or the change is less than the preset value set in the overall control device, it is processed by the flipping assembly 6.

[0046] Specifically, in the above embodiment, the translation component 5 is used for translation in the following manner: the fifth linear mechanism 53 is moved by the fourth linear mechanism 52 to the end of the first conveyor belt 11 or the second conveyor belt 21; then the L-shaped pallet 55 is pushed by the fifth linear mechanism 53 to receive the silicon wafer; then the silicon wafer is retracted by the fifth linear mechanism 53; the silicon wafer is moved by the fourth linear mechanism 52; and then pushed to the beginning of the first conveyor belt 11 or the second conveyor belt 21. The specific working method of the flipping component 6 is as follows: the first rotary motor 62 rotates each component so that the clamping block 69 is horizontally positioned on both sides of the second conveyor belt 21. After the silicon wafer is in place, the clamping block 69 clamps the silicon wafer through the sixth linear mechanism 67. Then, the first rotary motor 62 rotates, and during the rotation, the second rotary motor 63 flips the silicon wafer. Before the silicon wafer reaches the first conveyor belt 11, the silicon wafer is flipped 180° along the output shaft of the second rotary motor 63. Then, the clamping is released, and the silicon wafer is transported by the first conveyor belt 11.

[0047] The silicon wafer that has been flipped is transported by the first conveyor belt 11. When the silicon wafer is about to arrive, the crossbar 18 of the silicon wafer entry and exit assembly is in place in advance and blocks the silicon wafer. Then the silicon wafer is sent back to the photoresist coating machine 7 through the silicon wafer entry and exit assembly.

[0048] The above are only some of the embodiments listed in this application and are not intended to limit this application.

Claims

1. An intermediate processing device for a negative photoresist coating process, characterized in that, Located on one side of multiple photoresist coating machines (7) arranged in an array, including: The first curing tunnel (1) is equipped with multiple hot air blowers (3) at its upper end that blow hot air into it. The first curing tunnel (1) is equipped with a first conveyor belt (11) at its two ends, which extend outwards to the entrance and exit of the first curing tunnel (1) respectively. The first curing tunnel (1) is provided with multiple side openings (12) for silicon wafers to enter and exit the first curing tunnel (1) on the side facing the photoresist coating machine (7). The first curing tunnel (1) is also provided with multiple silicon wafer entry and exit components for transferring silicon wafers between the first curing tunnel (1) and the photoresist coating machine (7). The second curing tunnel (2) is parallel to the side of the first curing tunnel (1) facing away from the photoresist coating machine (7). Multiple hot air blowers (3) are also provided at the upper end of the second curing tunnel (2). Inside the second curing tunnel (2) is a second conveyor belt (21) whose conveying direction is opposite to that of the first conveyor belt (11) during operation. Its two ends extend a predetermined distance to the outside of the entrance and exit of the second curing tunnel (2). A pair of detection components (4) are respectively located at the exit ends of the first curing tunnel (1) and the second curing tunnel (2). The detection components (4) include an interferometric thickness sensor (43) for measuring the thickness of the photoresist on the silicon wafer. A pair of translation components (5) are respectively disposed at both ends of the first curing tunnel (1) for moving the silicon wafer between the first curing tunnel (1) and the second curing tunnel (2); The flipping assembly (6) is located between the first curing tunnel (1) and the second curing tunnel (2) for transferring the silicon wafer from the end of the second conveyor belt (21) to the beginning of the first conveyor belt (11) and flipping the silicon wafer at the same time.

2. The intermediate processing equipment for negative photoresist coating process according to claim 1, characterized in that, The first curing tunnel (1) is also provided with multiple vertical first linear mechanisms (13) on the side facing the photoresist coating machine (7). The output end of the first linear mechanism (13) is provided with an L-shaped side cover (14). The L-shaped side cover (14) opens and closes its vertical part to the side opening (12) by sliding.

3. The intermediate processing equipment for negative photoresist coating process according to claim 1, characterized in that, The silicon wafer inlet and outlet assembly includes a second linear mechanism (15) located on the upper surface of the first curing tunnel (1) and pointing in the output direction toward the photoresist coating machine (7). The output end of the second linear mechanism (15) is vertically provided with a third linear mechanism (16). The output end of the third linear mechanism (16) is provided with an inverted L-shaped block (17). The lower end of the vertical part of the inverted L-shaped block (17) is provided with a crossbar (18) parallel to the output axis of the second linear mechanism (15). A pair of limiting rods (19) are provided on one side of the crossbar (18), and the limiting rods (19) extend from the side of the crossbar (18) in the opposite direction to the conveying direction of the first conveyor belt (11).

4. The intermediate processing equipment for negative photoresist coating process according to claim 3, characterized in that, The length of the limiting rod (19) is greater than the radius of the silicon wafer and less than the diameter of the silicon wafer.

5. The intermediate processing equipment for negative photoresist coating process according to claim 1, characterized in that, The detection component (4) includes a control box (41) mounted on one side of the first curing tunnel (1) or the second curing tunnel (2), and a ring frame (42) mounted on the exit end face of the first curing tunnel (1) or the second curing tunnel (2). An interferometric thickness sensor (43) is vertically inserted through the ring frame (42).

6. The intermediate processing equipment for negative photoresist coating process according to claim 3, characterized in that, One translation component (5) is used to move the silicon wafer from the end of the first conveyor belt (11) to the beginning of the second conveyor belt (21). Another translation component (5) is used to move the silicon wafer from the end of the second conveyor belt (21) to the beginning of the first conveyor belt (11). The translation component (5) includes a pair of L-shaped frames (51). The upper end of the L-shaped frame (51) is provided with a fourth linear mechanism (52) parallel to the second linear mechanism (15). The sliding end of the fourth linear mechanism (52) is provided with a fifth linear mechanism (53) parallel to the conveying direction of the silicon wafer in the first curing tunnel (1) or the second curing tunnel (2). The output end of the fifth linear mechanism (53) is provided with a pair of L-shaped trays (55) symmetrically arranged. The vertical opposite surfaces of the two L-shaped trays (55) are used to limit the silicon wafer.

7. The intermediate processing equipment for negative photoresist coating process according to claim 6, characterized in that, The upper horizontal surface of the L-shaped pallet (55), the conveying plane of the first conveyor belt (11), and the second conveyor belt (21) are all located on the same horizontal plane.

8. The intermediate processing equipment for negative photoresist coating process according to claim 1, characterized in that, The flipping assembly (6) includes a first rotary motor (62) located between the starting end of the first conveyor belt (11) and the ending end of the second conveyor belt (21). The output end of the first rotary motor (62) is provided with a second rotary motor (63). A pair of sixth linear mechanisms (67) with opposite output directions are provided on one side of the output end of the second rotary motor (63). The output end of the sixth linear mechanism (67) is provided with a hanging plate (68). The hanging plate (68) has a clamping block (69) at the lower end of the side facing the sixth linear mechanism (67). One side of the clamping block (69) is formed with an arc surface. The arc surface is provided with an arc groove that matches the outer periphery of the silicon wafer.

9. The intermediate processing equipment for negative photoresist coating process according to claim 8, characterized in that, The output end of the second rotary motor (63) is provided with a rotating plate (64), and one side of the rotating plate (64) is provided with an L-shaped support rod (65), and one end of its short side is provided with a mounting base (66). Two sixth linear mechanisms (67) are respectively located at both ends of the mounting base (66).

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