A polar plate stamping die

Abstract

The application provides a polar plate stamping die, which comprises a die core and an attached plate, the die core is movable along the height direction of the polar plate stamping die, and the attached plate is connected to the outer periphery of the die core. Wherein, the attached plate can vibrate with the movement of the die core. The attached plate of the application can vibrate during the movement of the die core, which can effectively prolong the impact time of vibration on the die core, thereby reducing the instantaneous stress peak of the die core, and playing the role of vibration buffering. That is, the polar plate stamping die of the application has the role of active vibration suppression and energy dissipation, and improves the positioning accuracy of the die core to the metal polar plate during stamping.

Description

Technical Field

[0001] This invention relates to the field of fuel cell technology, and in particular to a plate stamping die. Background Technology

[0002] In the fuel cell industry, electrode stamping dies are mainly used to manufacture metal electrode plates in batteries. They are formed by high-precision stamping processes to shape the flow channel structure, mesh or outer contour, ensuring the conductivity, gas distribution and structural strength of the electrode assembly.

[0003] However, the main structure of the die core in traditional electrode stamping dies vibrates to a certain extent during the electrode stamping process, which in turn causes fluctuations. This makes it impossible to guarantee the stability of the main structure of the die core during the forming process, and consequently, it is impossible to guarantee the stability of the stamping dimensions and forming accuracy of the electrode. Summary of the Invention

[0004] This application provides an electrode stamping die that can alleviate vibration loss of the die core and improve the stability and forming accuracy of the electrode stamping die.

[0005] This application provides an electrode stamping die, which includes a die core and an auxiliary plate. The die core is movable along the height direction of the die, and the auxiliary plate is connected to the outer periphery of the die core. The auxiliary plate is capable of vibrating with the movement of the die core.

[0006] In this solution, the auxiliary plate will bend or swing during the vibration of the mold core. This elastic deformation can effectively prolong the impact time of the vibration on the mold core, thereby reducing the instantaneous peak force of the mold core and playing a role in vibration buffering. That is, the electrode stamping die of this application has the function of active vibration suppression and energy dissipation, which improves the positioning accuracy of the mold core on the metal electrode plate during the stamping process.

[0007] Optionally, the electrode stamping die includes a plurality of spaced-apart auxiliary plates that extend outward relative to the die core.

[0008] Optionally, the attachment plate includes a connecting end and a moving end that are connected to each other. The connecting end is installed on the mold core, and the cross-sectional area of ​​the moving end gradually decreases along the direction away from the mold core.

[0009] Optionally, the outer contour of the moving end is arc-shaped.

[0010] Optionally, the mold core has two first sidewalls arranged opposite each other along the length direction and two second sidewalls arranged opposite each other along the width direction. The length of the first sidewall is less than the length of the second sidewall. The attachment plate installed on the first sidewall is the first attachment plate, and the attachment plate installed on the second sidewall is the second attachment plate.

[0011] The length of the first sidewall is L1, and the minimum distance between two adjacent first plates is T1. The length of the second sidewall is L2, and the minimum distance between two adjacent second plates is T2, satisfying: 0.05≤T1 / L1≤0.5, and / or, 0.05≤T2 / L2≤0.5.

[0012] Optionally, the first attachment plate has a length dimension of L3 and the second attachment plate has a width dimension of L4, satisfying: 0.08≤L3 / L2≤0.2, and / or, 0.08≤L4 / L1≤0.2.

[0013] Optionally, each of the first attachment plates is evenly distributed, and / or each of the second attachment plates is evenly distributed.

[0014] Optionally, the thickness W of the auxiliary plate satisfies 5mm≤W≤20mm and the thickness direction of the auxiliary plate is perpendicular to the height direction of the electrode stamping die.

[0015] Optionally, the attachment plate is integrally formed or welded to the mold core.

[0016] Optionally, the electrode stamping die further includes a frame and a back plate, the frame and the back plate forming a receiving cavity, the die core and the auxiliary plate being located within the receiving cavity, and the die core being fixedly connected to the back plate, with a gap between the auxiliary plate and the frame.

[0017] It should be understood that the above general description and the following detailed description are merely exemplary and do not limit this application. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of a mold core in the prior art;

[0019] Figure 2 This is a schematic diagram of the structural connection between the mold core and the attachment plate in one embodiment of this application;

[0020] Figure 3 This is a schematic diagram of the structural connection between the mold core and the attachment plate in another embodiment of this application;

[0021] Figure 4 This is a structural schematic diagram of the plate attached to this application;

[0022] Figure 5 for Figure 3 A top-view structural diagram;

[0023] Figure 6 This is a schematic diagram of the electrode stamping die of this application;

[0024] Figure 7This is a schematic diagram of the electrode stamping die of this application, in which the die core and the auxiliary plate have been removed.

[0025] Explanation of reference numerals in the attached figures:

[0026] 1- Mold core;

[0027] 1a - First sidewall;

[0028] 1b - Second sidewall;

[0029] 2- Attached plate;

[0030] 2a-First Attachment Plate;

[0031] 2b - Second Attachment Plate;

[0032] 21-Connection end;

[0033] 22-Motion end;

[0034] 3- Border;

[0035] 4- Back panel;

[0036] 5- Receiving cavity;

[0037] 6- Gap.

[0038] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application. Detailed Implementation

[0039] To better understand the technical solution of this application, the embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0040] It should be understood that the described embodiments are merely some, not all, of the embodiments in this application. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.

[0041] The terminology used in the embodiments of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. The singular forms “a,” “the,” and “the” used in the embodiments of this application and the appended claims are also intended to include the plural forms unless the context clearly indicates otherwise.

[0042] It should be understood that the term "and / or" used in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this article generally indicates that the preceding and following related objects have an "or" relationship.

[0043] In the field of fuel cell technology, hydrogen energy, as a green energy source, naturally possesses the advantages of energy conservation and emission reduction. Proton exchange membrane (PEM) hydrogen fuel cells, due to their high energy density, have broad prospects for development in hydrogen-powered transportation applications. In PEM hydrogen fuel cells, electrode plates are the main components, primarily including metal and graphite plates. Graphite plates, due to processing limitations, cannot be mass-produced quickly; while metal plates can be mass-produced rapidly through processes such as stamping and rolling. During the rapid development of hydrogen fuel cell passenger and commercial vehicles, stamping technology, with its mature technology and low cost, is considered a commonly used forming process for existing metal plate preparation. Stamping dies plastically form thin metal sheets (such as titanium, stainless steel, and carbon alloys) under a press, achieving mass production of metal plates with high efficiency and high precision. However, when using automated stamping equipment to prepare fine, large-area electrode plates, not only are there high requirements for the forming dimensions of the plates, but also for the stability of those dimensions. Furthermore, large-area electrode plates also increase the required forming tonnage.

[0044] Increasing the forming tonnage can also lead to a decrease in the stability of the die core during the stamping process. Therefore, in the case of high speed and large tonnage in an automated system, ensuring the stability of the die core is of great value to the dimensional accuracy and stability of the electrode plate.

[0045] During the electrode stamping process, the main structure of the die core vibrates in the plane perpendicular to the stamping direction, which cannot guarantee the stability of the main structure of the die core during the forming process, and thus cannot guarantee the stability of the stamping dimensions and forming accuracy of the electrode. Figure 1 This is a schematic diagram of the die core 1 in the electrode stamping die. In the process of stamping the electrode, the die core 1 is prone to vibration along the direction perpendicular to the height of the die, which reduces the positioning accuracy of the die core 1 when stamping the metal electrode and is not conducive to the production efficiency of the electrode stamping die when stamping the metal electrode.

[0046] To solve this technical problem, such as Figure 2 or Figure 3 As shown in the figure, this application provides an electrode stamping die, which includes a die core 1 and an auxiliary plate 2. The die core 1 can move along the height direction of the die to achieve stamping. The auxiliary plate 2 is connected to the outer periphery of the die core 1 and can vibrate with the movement of the die core 1.

[0047] Specifically, due to the whiplash effect of the structure, the vibration response of the protruding part is increased. Therefore, by taking advantage of the increased vibration response of the protruding part, an auxiliary plate 2 can be added to the mold core 1, which adds a vibration damping and energy dissipation structure to the main structure of the mold core 1. When the structure of the mold core 1 is subjected to vibration fluctuations, the auxiliary plate 2 can dissipate energy through violent vibration, reduce the vibration of the structure of the mold core 1, and achieve vibration damping and energy dissipation of the mold core 1, thereby ensuring the stability of the mold core 1 and ensuring the stability of the stamping dimensions and forming accuracy of the electrode plate.

[0048] In this embodiment, when the electrode stamping die stamps the metal electrode plate along the height direction, it drives the die core 1 to move along the height direction of the die. During the movement, the die core 1 will vibrate in a plane perpendicular to the height direction of the die, which in turn causes the auxiliary plate 2 to vibrate with the movement of the die core 1. During the vibration, the auxiliary plate 2 will bend or swing. This elastic deformation can effectively prolong the impact time of the vibration on the die core 1, thereby reducing the instantaneous peak force of the die core 1 and playing a role in vibration buffering. That is, the electrode stamping die of this application has the function of active vibration suppression and energy dissipation, reducing the amplitude of the vibration of the die core 1 and improving the positioning accuracy of the die core 1 on the metal electrode plate during the stamping process.

[0049] in, Figure 2 This is a schematic diagram of the structural connection between the mold core 1 and the attachment plate 2 in one embodiment of this application. Figure 3 This is a schematic diagram showing the structural connection between the mold core 1 and the attachment plate 2 in another embodiment of this application. In other embodiments, the mold core 1 and the attachment plate 2 may also be connected in other ways, which are not limited in this application.

[0050] In some embodiments, such as Figure 2 or Figure 3 As shown, the auxiliary plate 2 and the mold core 1 are integrally formed or welded together. Specifically, the auxiliary plate 2 and the mold core 1 can be integrally formed or fixedly connected by bolts, welding, or other methods.

[0051] In this embodiment, when the auxiliary plate 2 and the mold core 1 are integrally formed, the structural integrity of the electrode stamping die can be improved, thereby improving the structural strength, overall rigidity and impact resistance of the electrode stamping die; when the auxiliary plate 2 and the mold core 1 are welded together, a combination of complex structures can be achieved, that is, the mold core 1 can be adapted to the connection of auxiliary plates 2 of different materials and shapes.

[0052] In some embodiments, such as Figure 2 or Figure 3 As shown, the electrode stamping die includes multiple spaced-apart plates 2, which extend outward relative to the die core 1.

[0053] When multiple attachment plates 2 are connected to the mold core 1, the attachment plates 2 generate friction and internal loss to disperse energy as the mold core 1 moves, thus converting the mechanical energy of vibration into heat energy and achieving energy dissipation. In addition, the synergistic effect of the group composed of multiple attachment plates 2 can significantly reduce the overall vibration energy of the plate stamping die.

[0054] In some embodiments, such as Figure 4 As shown, the auxiliary plate 2 includes a connecting end 21 and a moving end 22 that are connected to each other. The connecting end 21 is installed on the mold core 1, and the cross-sectional area of ​​the moving end 22 gradually decreases in the direction away from the mold core 1. Specifically, the connecting end 21 is used to connect with the mold core 1, and the moving end 22 can undergo elastic deformation to dissipate energy through vibration.

[0055] In this embodiment, the specific shape of the moving end 22 can be square. When the moving end 22 is set to square, the energy dissipation effect of the vibration of the moving end 22 is ensured, while reducing the manufacturing complexity and manufacturing cost of the auxiliary plate 2. The specific shape of the moving end 22 can also be conical. When the moving end 22 is set to conical, the conical end of the moving end 22 can focus energy transfer, that is, the conical end can be used as an excitation point to improve the vibration suppression and energy dissipation effect on the mold core 1.

[0056] Preferably, in some embodiments, such as Figure 4 As shown, the outer contour of the moving end 22 is arc-shaped, meaning that the specific shape of the moving end 22 can also be arc-shaped. When the moving end 22 is set to arc-shaped, the arc-shaped end of the moving end 22 can achieve uniform diffusion, that is, the arc-shaped design of the moving end 22 can make the vibration wave of the attached plate 2 propagate uniformly along the curved surface, reduce reflection and scattering, and improve the vibration suppression and energy dissipation effect on the mold core 1.

[0057] Furthermore, the curved moving end 22, compared to the square moving end 22, can reduce wear on the right-angled edges caused by the external environment, reduce local extrusion deformation, and thus reduce the risk of cracking of the attached plate 2 due to local stress. The curved moving end 22 also reduces sensitivity to processing errors, offering better manufacturing and assembly advantages.

[0058] In other embodiments, the moving end 22 can also be configured as a sawtooth shape, teardrop shape, irregular shape, or other shapes. Provided that the vibration dissipation effect of the moving end 22 is ensured, this application does not limit the specific shape of the moving end 22.

[0059] In some embodiments, such as Figure 2 , Figure 3 and Figure 5As shown, the mold core 1 has two first sidewalls 1a arranged opposite each other along the length direction and two second sidewalls 1b arranged opposite each other along the width direction. The length of the first sidewall 1a is less than the length of the second sidewall 1b. The attachment plate 2 installed on the first sidewall 1a is the first attachment plate 2a, and the attachment plate 2 installed on the second sidewall 1b is the second attachment plate 2b.

[0060] The length of the first sidewall 1a is L1, and the minimum distance between two adjacent first attachment plates 2a is T1. The length of the second sidewall 1b is L2, and the minimum distance between two adjacent second attachment plates 2b is T2, satisfying: 0.05 ≤ T1 / L1 ≤ 0.5, and / or, 0.05 ≤ T2 / L2 ≤ 0.5. For example, T1 / L1 can specifically be 0.05, 0.1, 0.15, 0.2, 0.25, 0.3, 0.35, 0.4, 0.45, 0.5, etc., and T2 / L2 can specifically be 0.05, 0.1, 0.15, 0.2, 0.25, 0.3, 0.35, 0.4, 0.45, 0.5, etc.

[0061] Specifically, in one embodiment, the electrode stamping die satisfies 0.05≤T1 / L1≤0.5; in another embodiment, the electrode stamping die satisfies 0.05≤T2 / L2≤0.5; in yet another embodiment, the electrode stamping die satisfies both 0.05≤T1 / L1≤0.5 and 0.05≤T2 / L2≤0.5.

[0062] On the one hand, the ratio between the minimum distance T1 between two adjacent first attachment plates 2a and the length L1 of the first sidewall 1a should not be too large or too small. If the ratio between the minimum distance T1 between two adjacent first attachment plates 2a and the length L1 of the first sidewall 1a is too large (for example, T1 / L1 is greater than 0.5), then the number of first attachment plates 2a on the first sidewall 1a will be relatively small, or the distance between adjacent first attachment plates 2a will be large. The arrangement of the first attachment plates 2a will be insufficient to alleviate the vibration fluctuations of the die core 1, reducing the vibration damping and energy dissipation effect of the first attachment plates 2a, reducing the stability of the die core 1 during operation, and is not conducive to the stamping process of the electrode stamping die. The positioning accuracy of the metal electrode plate during the process; if the ratio between the minimum distance T1 between two adjacent first attachment plates 2a and the length L1 of the first sidewall 1a is too small (for example, T1 / L1 is less than 0.05), then the number of first attachment plates 2a on the first sidewall 1a will be relatively large, or the distance between adjacent first attachment plates 2a will be small. During the process of the first attachment plate 2a vibrating and consuming energy with the movement of the mold core 1, the two adjacent first attachment plates 2a are likely to affect each other, thereby reducing the vibration damping and energy consumption effect of the first attachment plate 2a, reducing the stability of the mold core 1 during the working process, and is not conducive to the positioning accuracy of the metal electrode plate by the electrode plate stamping die during the stamping process.

[0063] Therefore, as Figure 5As shown, the ratio between the minimum distance T1 between two adjacent first attachment plates 2a and the length L1 of the first sidewall 1a should be selected within a suitable range. That is, when the ratio between the minimum distance T1 between two adjacent first attachment plates 2a and the length L1 of the first sidewall 1a satisfies 0.05≤T1 / L1≤0.5, the number of first attachment plates 2a on the first sidewall 1a is relatively moderate, and the distance between adjacent first attachment plates 2a is moderate. During the process of the first attachment plate 2a vibrating and consuming energy with the movement of the mold core 1, the risk of mutual influence between two adjacent first attachment plates 2a is reduced, the vibration damping and energy consumption effect of the first attachment plate 2a is improved, the stability of the mold core 1 during the working process is improved, and it is beneficial to the positioning accuracy of the metal electrode plate in the stamping process of the electrode plate stamping die.

[0064] On the other hand, the ratio between the minimum distance T2 between two adjacent second attachment plates 2b and the length L2 of the second sidewall 1b should not be too large or too small. If the ratio between the minimum distance T2 between two adjacent second attachment plates 2b and the length L2 of the second sidewall 1b is too large (e.g., T2 / L2 is greater than 0.5), then the number of second attachment plates 2b on the second sidewall 1b will be relatively small, the distance between the second attachment plates 2b will be large, and the arrangement of the second attachment plates 2b will be insufficient to alleviate the vibration fluctuations of the die core 1, reducing the vibration damping and energy dissipation effect of the second attachment plates 2b, reducing the stability of the die core 1 during operation, and is not conducive to the stamping process of the electrode stamping die. The positioning accuracy of the metal electrode plate during the process; if the ratio between the minimum distance T2 between two adjacent second attachment plates 2b and the length L2 of the second sidewall 1b is too small (for example, T2 / L2 is less than 0.05), then the number of second attachment plates 2b on the second sidewall 1b will be relatively large, and the distance between the second attachment plates 2b will be small. During the process of the second attachment plates 2b vibrating and consuming energy with the movement of the mold core 1, the two adjacent second attachment plates 2b are likely to affect each other, thereby reducing the vibration damping and energy consumption effect of the second attachment plates 2b, reducing the stability of the mold core 1 during the working process, and is not conducive to the positioning accuracy of the metal electrode plate by the electrode plate stamping die during the stamping process.

[0065] Therefore, as Figure 5 As shown, the ratio between the minimum distance T2 between two adjacent second attachment plates 2b and the length L2 of the second sidewall 1b should be selected within a suitable range. That is, when the ratio between the minimum distance T2 between two adjacent second attachment plates 2b and the length L2 of the second sidewall 1b satisfies 0.05≤T2 / L2≤0.5, the number of second attachment plates 2b on the second sidewall 1b is relatively moderate, or the distance between the second attachment plates 2b is moderate. During the vibration and energy consumption process of the second attachment plates 2b with the movement of the mold core 1, the risk of mutual influence between two adjacent second attachment plates 2b is reduced, the vibration damping and energy consumption effect of the second attachment plates 2b is improved, the stability of the mold core 1 during the working process is improved, and it is beneficial to the positioning accuracy of the metal electrode plate in the stamping process of the electrode plate stamping die.

[0066] In some embodiments, such as Figure 5 As shown, the first attachment plate 2a has a length dimension of L3, and the second attachment plate 2b has a width dimension of L4, satisfying: 0.08 ≤ L3 / L2 ≤ 0.2, and / or, 0.08 ≤ L4 / L1 ≤ 0.2. For example, L3 / L2 can specifically be 0.08, 0.09, 0.1, 0.11, 0.12, 0.13, 0.14, 0.15, 0.16, 0.17, 0.18, 0.19, 0.2, etc., and L4 / L1 can specifically be 0.08, 0.09, 0.1, 0.11, 0.12, 0.13, 0.14, 0.15, 0.16, 0.17, 0.18, 0.19, 0.2, etc.

[0067] Specifically, in one embodiment, the electrode stamping die satisfies 0.08≤L3 / L2≤0.2; in another embodiment, the electrode stamping die satisfies 0.08≤L4 / L1≤0.2; in yet another embodiment, the electrode stamping die satisfies both 0.08≤L3 / L2≤0.2 and 0.08≤L4 / L1≤0.2.

[0068] On the one hand, the ratio between the length L3 of the first attached plate 2a and the length L2 of the second sidewall 1b should not be too large or too small. If the ratio between the length L3 of the first attached plate 2a and the length L2 of the second sidewall 1b is too large (for example, L3 / L2 is greater than 0.2), then the length of the first attached plate 2a extending along the length of the mold core 1 will be too long, and the moving end 22 of the first attached plate 2a will be far from the mold core 1. This is not conducive to transmitting the vibration fluctuations of the mold core 1 to the moving end 22, and is not conducive to the first attached plate 2a alleviating the vibration fluctuations of the mold core 1. This reduces the vibration damping and energy dissipation effect of the first attached plate 2a, reduces the stability of the mold core 1 during operation, and is therefore not conducive to the stamping of the electrode plate stamping die. The positioning accuracy of the metal electrode plate during the pressing process; if the ratio between the length L3 of the first auxiliary plate 2a and the length L2 of the second sidewall 1b is too small (for example, L3 / L2 is less than 0.08), then the length of the first auxiliary plate 2a extending along the length direction of the mold core 1 is too short, and the moving end 22 of the first auxiliary plate 2a is too close to the mold core 1, which is not conducive to the elastic deformation of the first auxiliary plate 2a. That is, the vibration frequency of the first auxiliary plate 2a and the mold core 1 is similar, which is not conducive to the first auxiliary plate 2a alleviating the vibration fluctuation of the mold core 1, reducing the vibration damping and energy dissipation effect of the first auxiliary plate 2a, reducing the stability of the mold core 1 during the working process, and thus not conducive to the positioning accuracy of the metal electrode plate of the electrode plate stamping die during the stamping process.

[0069] Therefore, as Figure 5As shown, the ratio between the length L3 of the first attachment plate 2a and the length L2 of the second sidewall 1b should be selected within a suitable range. That is, when the ratio between the length L3 of the first attachment plate 2a and the length L2 of the second sidewall 1b satisfies 0.08≤L3 / L2≤0.2, the length of the first attachment plate 2a extending along the length direction of the mold core 1 is moderate, the distance between the moving end 22 of the first attachment plate 2a and the mold core 1 is moderate, and the first attachment plate 2a can elastically deform to transmit the vibration fluctuations of the mold core 1 to the moving end 22. This is beneficial for the first attachment plate 2a to alleviate the vibration fluctuations of the mold core 1, improve the vibration damping and energy dissipation effect of the first attachment plate 2a, improve the stability of the mold core 1 during the working process, and thus benefit the positioning accuracy of the metal electrode plate in the stamping process of the electrode plate stamping die.

[0070] On the other hand, the ratio between the width dimension L4 of the second auxiliary plate 2b and the length L1 of the first sidewall 1a should not be too large or too small. If the ratio between the width dimension L4 of the second auxiliary plate 2b and the length L1 of the first sidewall 1a is too large (for example, L4 / L1 is greater than 0.2), then the length of the second auxiliary plate 2b extending along the width direction of the mold core 1 will be too long, and the moving end 22 of the second auxiliary plate 2b will be far from the mold core 1. This is not conducive to transmitting the vibration fluctuations of the mold core 1 to the moving end 22, and is not conducive to the second auxiliary plate 2b alleviating the vibration fluctuations of the mold core 1. This reduces the vibration damping and energy dissipation effect of the second auxiliary plate 2b, reduces the stability of the mold core 1 during operation, and is therefore not conducive to the plate stamping die in operation. The positioning accuracy of the metal electrode plate during the stamping process; if the ratio between the dimension L4 of the second auxiliary plate 2b along the width direction and the length L1 of the first sidewall 1a is too small (for example, L4 / L1 is less than 0.08), then the length of the second auxiliary plate 2b extending along the width direction of the die core 1 is too short, and the moving end 22 of the second auxiliary plate 2b is too close to the die core 1, which is not conducive to the elastic deformation of the second auxiliary plate 2b. That is, the vibration frequency of the second auxiliary plate 2b and the die core 1 is similar, which is not conducive to the second auxiliary plate 2b alleviating the vibration fluctuation of the die core 1, reducing the vibration damping and energy dissipation effect of the second auxiliary plate 2b, reducing the stability of the die core 1 during the working process, and thus not conducive to the positioning accuracy of the metal electrode plate of the electrode plate stamping die during the stamping process.

[0071] Therefore, as Figure 5As shown, the ratio between the dimension L4 of the second auxiliary plate 2b along the width direction and the length L1 of the first sidewall 1a should be selected within a suitable range. That is, when the ratio between the dimension L4 of the second auxiliary plate 2b along the width direction and the length L1 of the first sidewall 1a satisfies 0.08≤L4 / L1≤0.2, the length of the second auxiliary plate 2b extending along the width direction of the mold core 1 is appropriate, the distance between the moving end 22 of the second auxiliary plate 2b and the mold core 1 is appropriate, and the second auxiliary plate 2b can elastically deform to transmit the vibration fluctuation of the mold core 1 to the moving end 22. This is beneficial for the second auxiliary plate 2b to alleviate the vibration fluctuation of the mold core 1, improve the vibration damping and energy dissipation effect of the second auxiliary plate 2b, improve the stability of the mold core 1 during the working process, and thus benefit the positioning accuracy of the metal electrode plate in the stamping process of the electrode plate stamping die.

[0072] In some embodiments, such as Figure 2 and Figure 3 As shown, each of the first attachment plates 2a is evenly distributed, and / or each of the second attachment plates 2b is evenly distributed.

[0073] Specifically, in one embodiment, the electrode stamping die satisfies the uniform distribution of the first auxiliary plate 2a; in another embodiment, the electrode stamping die satisfies the uniform distribution of the second auxiliary plate 2b; and in yet another embodiment, the electrode stamping die satisfies both the uniform distribution of the first auxiliary plate 2a and the uniform distribution of the second auxiliary plate 2b.

[0074] In this embodiment, the uniformly distributed auxiliary plate 2 can evenly disperse the vibration fluctuations of the buffer mold core 1, improve the efficiency of the auxiliary plate 2 in actively suppressing vibration and consuming energy, improve the positioning accuracy of the mold core 1 on the metal electrode plate during the stamping process, reduce the risk of fatigue damage caused by local stress concentration of the auxiliary plate 2, and extend the service life of the electrode plate stamping mold.

[0075] In some embodiments, such as Figure 5 As shown, the thickness W of the auxiliary plate 2 satisfies 5mm≤W≤20mm and the thickness direction of the auxiliary plate 2 is perpendicular to the height direction of the electrode stamping die. For example, the thickness W of the auxiliary plate 2 can be 5mm, 8mm, 10mm, 12mm, 15mm, 18mm, 20mm, etc.

[0076] The thickness W of the auxiliary plate 2 should not be too large or too small. If the thickness W of the auxiliary plate 2 is too large (for example, the thickness W of the auxiliary plate 2 is greater than 20 mm), it will not be conducive to the elastic deformation of the auxiliary plate 2. That is, the vibration frequency of the auxiliary plate 2 and the mold core 1 will be similar, which will not be conducive to the auxiliary plate 2 mitigating the vibration fluctuation of the mold core 1, reducing the vibration damping and energy dissipation effect of the auxiliary plate 2, reducing the stability of the mold core 1 during the working process, and thus not conducive to the positioning accuracy of the metal electrode plate in the stamping process of the electrode plate stamping die. If the thickness W of the auxiliary plate 2 is too small (for example, the thickness W of the auxiliary plate 2 is less than 5 mm), the strength of the auxiliary plate 2 itself will be low, and it will be easy to break during the working process, reducing the vibration damping and energy dissipation efficiency of the auxiliary plate 2 and reducing the service life of the electrode plate stamping die.

[0077] Therefore, as Figure 5 As shown, the thickness W of the auxiliary plate 2 should be selected within a suitable range. That is, when the thickness W of the auxiliary plate 2 satisfies mm≤W≤20mm, while ensuring the strength of the auxiliary plate 2 itself, the auxiliary plate 2 can undergo elastic deformation to transmit the vibration fluctuation of the mold core 1 to the moving end 22. This is beneficial for the auxiliary plate 2 to alleviate the vibration fluctuation of the mold core 1, improve the vibration damping and energy dissipation effect of the auxiliary plate 2, improve the stability of the mold core 1 during the working process, and thus benefit the positioning accuracy of the metal electrode plate in the stamping process of the electrode plate stamping die.

[0078] Furthermore, the thickness direction of the auxiliary plate 2 can be perpendicular to and / or parallel to the thickness direction of the mold core 1. In this embodiment, the thickness directions of both the first auxiliary plate 2a and the second auxiliary plate 2b are perpendicular to the thickness direction of the mold core 1. In other embodiments, the thickness directions of the first auxiliary plate 2a and the second auxiliary plate 2b can be parallel to the thickness direction of the mold core 1, or the thickness direction of the first auxiliary plate 2a can be perpendicular to the thickness direction of the mold core 1 and the thickness direction of the second auxiliary plate 2b can be parallel to the thickness direction of the mold core 1, or the thickness direction of the first auxiliary plate 2a can be parallel to the thickness direction of the mold core 1 and the thickness direction of the second auxiliary plate 2b can be perpendicular to the thickness direction of the mold core 1, etc. This application does not specifically limit this.

[0079] In some embodiments, such as Figure 6 and Figure 7 As shown, the electrode stamping die also includes a frame 3 and a back plate 4. The frame 3 and the back plate 4 form a receiving cavity 5. The die core 1 and the auxiliary plate 2 are located in the receiving cavity 5, and the die core 1 is fixedly connected to the back plate 4. There is a gap 6 between the auxiliary plate 2 and the frame 3.

[0080] In this embodiment, the frame 3 can guide and limit the mold core 1 and the auxiliary plate 2. The receiving cavity 5 provides sufficient installation position for the mold core 1 and the auxiliary plate 2. During the working process where the auxiliary plate 2 vibrates with the movement of the mold core 1, the gap 6 between the auxiliary plate 2 and the frame 3 provides sufficient movement space for the vibration of the auxiliary plate 2, which improves the efficiency of the auxiliary plate 2 in buffering the vibration of the mold core 1. This is beneficial to the active vibration suppression and energy consumption of the electrode stamping die, and improves the positioning accuracy of the electrode stamping die for the metal electrode plate during the stamping process.

[0081] The above descriptions are merely specific implementations of the embodiments of this application, but the protection scope of the embodiments of this application is not limited thereto. Any changes or substitutions within the technical scope disclosed in the embodiments of this application should be covered within the protection scope of the embodiments of this application. Therefore, the protection scope of the embodiments of this application should be determined by the protection scope of the claims.

Claims

1. A plate stamping die, characterized in that, The electrode stamping die includes: The mold core is capable of moving along the height direction of the electrode stamping die; An attachment plate is connected to the outer periphery of the mold core; The attached plate is capable of vibrating with the movement of the mold core; The mold core has two first sidewalls arranged opposite each other along the length direction and two second sidewalls arranged opposite each other along the width direction. The length of the first sidewall is less than the length of the second sidewall. The attachment plate installed on the first sidewall is the first attachment plate, and the attachment plate installed on the second sidewall is the second attachment plate. Each of the first attachment plates is evenly distributed, and / or each of the second attachment plates is evenly distributed.

2. The electrode stamping die according to claim 1, characterized in that, The electrode stamping die includes a plurality of spaced-apart auxiliary plates that extend outward relative to the die core.

3. The electrode stamping die according to claim 2, characterized in that, The attachment plate includes a connecting end and a moving end that are connected to each other. The connecting end is installed on the mold core, and the cross-sectional area of ​​the moving end gradually decreases in the direction away from the mold core.

4. The electrode stamping die according to claim 3, characterized in that, The outer contour of the moving end is arc-shaped.

5. The electrode stamping die according to claim 4, characterized in that, The length of the first sidewall is L1, the minimum distance between two adjacent first plates is T1, the length of the second sidewall is L2, and the minimum distance between two adjacent second plates is T2, satisfying: 0.05≤T1 / L1≤0.5, and / or, 0.05≤T2 / L2≤0.

5.

6. The electrode stamping die according to claim 5, characterized in that, The first attachment plate has a length dimension of L3 and the second attachment plate has a width dimension of L4, satisfying: 0.08≤L3 / L2≤0.2, and / or, 0.08≤L4 / L1≤0.

2.

7. The electrode stamping die according to any one of claims 1-6, characterized in that, The thickness W of the auxiliary plate satisfies 5mm≤W≤20mm, and the thickness direction of the auxiliary plate is perpendicular to the height direction of the electrode stamping die.

8. The electrode stamping die according to any one of claims 1-6, characterized in that, The attached plate is integrally formed or welded to the mold core.

9. The electrode stamping die according to any one of claims 1-6, characterized in that, The electrode stamping die also includes a frame and a back plate, the frame and the back plate forming a receiving cavity, the die core and the auxiliary plate being located within the receiving cavity, and the die core being fixedly connected to the back plate, with a gap between the auxiliary plate and the frame.

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