Acoustic module and acoustic equipment

Abstract

The invention provides an acoustic module and acoustic equipment, and relates to the technical field of electronic equipment. The acoustic module comprises a base, a first waterproof assembly and a first acoustic assembly. The base comprises a base side wall, a base bottom wall and a first sound through hole, the base side wall and the base bottom wall form a first accommodating cavity, and the first sound through hole penetrates through the base bottom wall and is communicated with the first accommodating cavity; the first waterproof assembly is arranged in the first accommodating cavity and covers the first sound through hole to prevent liquid from entering the first accommodating cavity through the first sound through hole; the first acoustic assembly comprises a first acoustic sensor and a first circuit board, the first acoustic sensor is arranged on the side, away from the bottom wall of the base, of the first waterproof assembly, and the first circuit board is arranged between the first acoustic sensor and the first waterproof assembly and mechanically connected with the first acoustic sensor. By using the acoustic module, the sensitivity difference between different acoustic devices can be within the deviation range, so that the consistency of the acoustic devices is ensured.

Description

Acoustic module and acoustic device Technical Field

[0001] The present invention relates to the technical field of electronic equipment, and in particular to an acoustic module and an acoustic device. Background Art

[0002] Acoustic devices typically contain multiple acoustic sensors. When used outdoors or in humid environments, liquids can easily enter the device through the sound holes. For example, when a user wears wireless headphones while engaging in underwater activities (such as swimming), water can enter the headphones through the sound holes. Therefore, acoustic devices designed for use in humid environments need to be moisture-resistant and waterproof.

[0003] Since the sensitivity of the acoustic sensor will be affected during the assembly process of the acoustic equipment, and because of the moisture and liquid resistance requirements, the acoustic sensor needs to be installed in the shell with a waterproof structure and sealed, which makes it difficult to disassemble and adjust. As a result, the sensitivity of the acoustic sensor is also difficult to adjust, making it difficult to ensure that the sensitivity difference of the acoustic equipment in the same batch is within the ideal deviation range, resulting in a low yield of the acoustic equipment in the same batch.

[0004] Therefore, it is necessary to design an acoustic device and an acoustic module accessory for the acoustic device, the structure of which takes into account waterproofness and can solve the above-mentioned problem of low yield of acoustic devices in the same batch.

[0005] Summary of the Invention

[0006] In a first aspect, this specification provides an acoustic module. The acoustic module includes a base, a first waterproof component, and a first acoustic component. The base includes a base sidewall, a base bottom wall, and a first sound hole. The base sidewall and the base bottom wall form a first accommodating cavity. The first sound hole passes through the base bottom wall and communicates with the first accommodating cavity. The first waterproof component is within the first accommodating cavity and covers the first sound hole to prevent liquid from entering the first accommodating cavity through the first sound hole. The first acoustic component includes a first acoustic sensor and a first circuit board. The first acoustic sensor is positioned on a side of the first waterproof component away from the base bottom wall. The first circuit board is positioned between the first acoustic sensor and the first waterproof component and is mechanically connected to the first acoustic sensor.

[0007] In some embodiments, the first waterproof component includes a first waterproof membrane and a first buffer member; the first buffer member is provided with a first central hole, and the first buffer member abuts against an edge area of ​​the first waterproof membrane.

[0008] In some embodiments, the first waterproof component has a first adhesive surface and a second adhesive surface; the first adhesive surface is sticky so that the first waterproof component can be adhered to the bottom wall surface of the first accommodating cavity after being subjected to external pressure; and the second adhesive surface is sticky so that the first waterproof component and the first acoustic component can be adhered when in contact with the first acoustic component.

[0009] In some embodiments, the first circuit board abuts against the top surface of the base side wall; the first circuit board includes a plurality of first positioning holes; and a plurality of first positioning protrusions are provided on the top surface of the base side wall, and the plurality of first positioning protrusions correspond one-to-one to the plurality of first positioning holes.

[0010] In some embodiments, the first acoustic component further includes a reinforcement member, which is located between the first circuit board and the waterproof component and abuts against the top surface of the base side wall; the reinforcement member includes a plurality of first positioning holes; and a plurality of first positioning protrusions are provided on the top surface of the base side wall, and the plurality of first positioning protrusions correspond one-to-one to the plurality of first positioning holes.

[0011] In some embodiments, each of the first positioning protrusions includes a first column and an enlarged first column head, and the first column is inserted into the corresponding first positioning hole.

[0012] In some embodiments, the plurality of first positioning protrusions are a plurality of first heat-melting columns, and the first column heads are formed by deformation of top portions of the first heat-melting columns after being heat-melted.

[0013] In some embodiments, a first limiting portion is provided on the bottom wall of the base so as to be coupled with a second limiting portion on the inner wall of the acoustic device when assembled on the acoustic device.

[0014] In a second aspect, the present specification provides an acoustic device. The acoustic device comprises the acoustic module described in any one of the first aspects and a shell assembly; the shell assembly comprises a shell, a second waterproof assembly, and a second acoustic assembly; the shell comprises a second accommodating chamber, a second sound hole, a third accommodating chamber, and a third sound hole, the second sound hole passing through the shell and communicating with the second accommodating chamber, the third sound hole passing through the shell and communicating with the third accommodating chamber; the second waterproof assembly, within the third accommodating chamber, is sealedly connected to the third accommodating chamber and covers the third sound hole to prevent the liquid from entering the third accommodating chamber through the third sound hole; the second acoustic assembly comprises a second acoustic sensor, the second acoustic assembly covers the third accommodating chamber and is positioned on a side of the second waterproof assembly away from the shell, wherein the acoustic module is mounted within the second accommodating chamber, the base is sealedly connected to the second accommodating chamber, and the first sound hole is communicated with the second sound hole.

[0015] In some embodiments, the inner wall of the shell forms a second accommodating side wall and a second accommodating bottom wall of the second accommodating cavity, the second accommodating bottom wall includes a first step, the first step divides the second accommodating bottom wall into a first bottom wall and a second bottom wall, and the second sound hole passes through the first bottom wall and is connected to the second accommodating cavity.

[0016] In some embodiments, a first sealing member is further included, the base abuts against the second bottom wall; and a first gap is formed between the base and the first bottom wall, and the first sealing member is in the first gap and seals the first gap.

[0017] In some embodiments, the bottom wall of the base is provided with a first limiting portion along the circumference of the first sound hole, and the first bottom wall is provided with a second limiting portion along the circumference of the second sound hole, and the first limiting portion and the second limiting portion cooperate and abut against each other.

[0018] In some embodiments, the first sealing member is a fluid sealing material obtained by solidification; and the first limiting portion and the second limiting portion cooperate and abut against each other to prevent the fluid sealing material from flowing into the second sound hole.

[0019] In some embodiments, the first limiting portion includes a groove on the bottom wall of the base arranged along the circumference of the first sound hole; and the second limiting portion includes a second step on the first bottom wall arranged along the circumference of the second sound hole.

[0020] In some embodiments, the first limiting portion and the second limiting portion form a second gap, and the second gap is sealed by the first sealing member.

[0021] In some embodiments, the base and the second accommodating cavity are sealed and connected via a first sealing member, and the first sealing member is a prefabricated sealing gasket.

[0022] In some embodiments, the diameter of the second sound hole on the inner wall of the shell is smaller than the diameter of the second sound hole on the outer wall of the shell; and / or the diameter of the third sound hole on the inner wall of the shell is smaller than the diameter of the third sound hole on the outer wall of the shell.

[0023] In some embodiments, the central axis of the second sound hole is tilted relative to the second bottom wall of the second accommodating cavity; and / or the central axis of the third sound hole is tilted relative to the third bottom wall of the third accommodating cavity.

[0024] In some embodiments, a second sealing member is further included, and the inner wall of the shell forms a second accommodating side wall of the second accommodating cavity; the height of the second accommodating side wall is higher than the upper surface of the first circuit board, thereby forming an accommodating space to accommodate the second sealing member.

[0025] In some embodiments, the second acoustic component includes a second circuit board; the first circuit board and the second circuit board are connected, the first circuit board passes over the second accommodating side wall from a target section of the second accommodating side wall, wherein the first circuit board is a flexible circuit board; and the target section of the second accommodating side wall has a flatter design compared to other parts of the second accommodating side wall to reduce the degree of bending of the first circuit board in the second accommodating side wall section.

[0026] In some embodiments, the target section includes a guide opening and an inclined guide surface opened on the second accommodating side wall, and the guide opening is connected to the inner wall of the shell through the guide surface to support the first circuit board.

[0027] In some embodiments, the second waterproof component includes a second waterproof membrane and a second buffer member; the second buffer member is provided with a second center hole that abuts against an edge area of ​​the second waterproof membrane.

[0028] It can be seen from the above technical solution that the acoustic device provided in this specification adopts an acoustic sensor installation structure with a liquid-proof effect. Since the sensitivity of the acoustic sensor will be affected during the assembly process of the acoustic device, and because of the moisture-proof and liquid-proof requirements, the acoustic sensor needs to be sealed and installed in the shell in combination with the waterproof component, which is difficult to disassemble and adjust, resulting in that the sensitivity of the acoustic sensor is also difficult to adjust. Therefore, it is difficult to ensure that the sensitivity difference of the acoustic devices of the same batch is within the ideal range, thereby affecting the yield of the acoustic device. In this specification, the acoustic sensor and the waterproof component are placed in a prefabricated acoustic module, and then the acoustic module is installed in the acoustic device. The acoustic module adapted to the acoustic device is adjusted according to the preset sensitivity difference requirements, and then the sensitivity difference of multiple acoustic sensors in the same acoustic device is flexibly adjusted, thereby ensuring that the sensitivity difference of the acoustic devices of the same batch is within the ideal range, thereby ensuring the yield of the acoustic device.

[0029] Other functions of the acoustic device provided by this specification will be partially listed in the following description. The creative aspects of the acoustic device provided by this specification can be fully explained by practicing or using the methods, devices and combinations described in the following detailed examples. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the technical solutions in the embodiments of this specification, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of this specification. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0031] FIG1A shows a schematic structural diagram of an acoustic device according to some embodiments of this specification;

[0032] FIG1B shows a schematic diagram of a portion of the internal structure of the acoustic device shown in FIG1A of this specification;

[0033] FIG2A shows a schematic diagram of the structure of the accommodating cavity of a housing assembly according to some embodiments of this specification;

[0034] FIG2B shows a schematic structural diagram of a housing assembly according to some embodiments of this specification;

[0035] FIG2C shows a partial cross-sectional view taken along line AA of a housing assembly according to some embodiments of the present specification;

[0036] FIG3A shows a schematic diagram of the shape of a second hot melt column before hot melting according to some embodiments of the present application;

[0037] FIG3B shows a schematic diagram of the shape of the second hot melt column after hot melting shown in FIG3A of the present application;

[0038] FIG4A is a schematic diagram showing an acoustic module installed in a second accommodation cavity according to some embodiments of this specification;

[0039] FIG4B shows a schematic diagram of an acoustic module according to some embodiments of the present specification;

[0040] FIG4C shows a BB cross-sectional view of the acoustic module shown in FIG4B of the present application;

[0041] FIG5 shows a schematic structural diagram of another acoustic module provided according to an embodiment of this specification;

[0042] FIG6 shows a positional relationship diagram of a second accommodating side wall and a first circuit board according to some embodiments of the present application;

[0043] FIG7 shows a schematic diagram of a second accommodating side wall provided according to some embodiments of the present application;

[0044] FIG8A shows a CC cross-sectional view of the acoustic device shown in FIG1 according to this specification;

[0045] FIG8B shows another CC cross-sectional view of the acoustic device shown in FIG1 according to this specification;

[0046] FIG8C shows an enlarged view of the portion D shown in FIG8B provided in accordance with the present specification;

[0047] FIG9A shows a line graph of acoustic sensor sensitivity under solution A according to some embodiments of this specification; and

[0048] FIG. 9B shows some embodiments according to the present invention. DETAILED DESCRIPTION

[0049] The following description provides specific application scenarios and requirements for this specification, with the goal of enabling those skilled in the art to make and use the contents of this specification. Various modifications to the disclosed embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other embodiments and applications without departing from the spirit and scope of this specification. Therefore, this specification is not limited to the embodiments shown, but is intended to be accorded the broadest scope consistent with the claims.

[0050] The terms used herein are for the purpose of describing specific example embodiments only and are not intended to be limiting. For example, as used herein, the singular forms "a," "an," and "the" may also include the plural forms unless the context clearly indicates otherwise. When used in this specification, the terms "comprise," "include," and / or "contain" are intended to refer to the presence of the associated integers, steps, operations, elements, and / or components, but do not preclude the presence of one or more other features, integers, steps, operations, elements, components, and / or groups or the addition of other features, integers, steps, operations, elements, components, and / or groups in the system / method.

[0051] In this application, terms such as "upper," "lower," "left," "right," "front," "back," "top," "bottom," "inner," "outer," "vertical," "horizontal," "transverse," and "longitudinal" indicate positions or locations based on the positions or locations shown in the accompanying drawings. These terms are primarily intended to better describe this application and its embodiments and are not intended to limit the devices, elements, or components indicated to having a specific orientation, or to being constructed or operated in a specific orientation.

[0052] Furthermore, some of the above terms may be used to express other meanings besides indicating a position or location. For example, the term "on" may also be used to indicate a dependency or connection in certain circumstances. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0053] Furthermore, the terms "installed," "disposed," "provided with," "connected," and "connected" should be interpreted broadly. For example, they can refer to fixed connections, removable connections, or integral structures; mechanical connections or electrical connections; direct connections, indirect connections through an intermediary, or internal communication between two devices, elements, or components. Those skilled in the art will understand the specific meanings of these terms in this application based on the specific circumstances.

[0054] In this specification, "X includes at least one of A, B, or C" means that X includes at least A, or X includes at least B, or X includes at least C. In other words, X may include only any one of A, B, and C, or any combination of A, B, and C, as well as other possible contents / elements. Any combination of A, B, and C may be A, B, C, AB, AC, BC, or ABC.

[0055] In this specification, unless otherwise specified, the association relationship between structures can be a direct association relationship or an indirect association relationship. For example, when describing "A is connected to B", unless it is clearly stated that A is directly connected to B, it should be understood that A can be directly connected to B or indirectly connected to B; for another example, when describing "A is above B", unless it is clearly stated that A is directly above B (AB are adjacent and A is above B), it should be understood that A can be directly above B or indirectly above B (AB is separated by other elements and A is above B). And so on.

[0056] These and other features of this specification, as well as the operation and function of the associated elements of the structure, and the economical assembly and manufacture of the components, can be significantly improved with consideration of the following description. Reference is made to the accompanying drawings, all of which form a part of this specification. However, it should be expressly understood that the drawings are for illustration and description purposes only and are not intended to limit the scope of this specification. It should also be understood that the drawings are not drawn to scale.

[0057] The present application is described in detail below through specific embodiments:

[0058] This specification provides an acoustic device and an acoustic module used as an accessory in the acoustic device. By placing an acoustic sensor and a waterproof component in a prefabricated acoustic module, and then installing the acoustic module in the acoustic device, the acoustic module adapted to the acoustic device is adjusted according to the preset sensitivity difference requirements, so that the sensitivity difference of multiple acoustic sensors in the same acoustic device can be flexibly adjusted, thereby ensuring that the sensitivity difference of the acoustic devices in the same batch is within the ideal range and the yield of the acoustic device is guaranteed. In addition, the acoustic device and acoustic module provided in this specification have a liquid-proof effect, and the liquids here include but are not limited to water, oil, sweat and other liquids. For the convenience of description, water is used as an example below to first introduce the waterproof structure of the acoustic device 01.

[0059] Figure 1A shows a schematic diagram of the structure of an acoustic device 01 provided according to some embodiments of this specification. Figure 1B shows a schematic diagram of a portion of the internal structure of the acoustic device 01 shown in Figure 1A of this specification. The acoustic device 01 shown in Figure 1A is a wireless headset, and the following description is based on the example of the acoustic device 01 being a wireless headset (referred to as headset). The headset can be a bone conduction headset, an air conduction headset, or a bone-air conduction headset. It is understood that the acoustic device 01 can also be other acoustic devices such as wired headsets, mobile phones, computers, recorders, etc. As shown in Figure 1B, the acoustic device 01 may include a shell assembly 10 and an acoustic module 20.

[0060] Figure 2A illustrates a schematic diagram of the partial internal structure of a housing assembly 10 according to some embodiments of the present specification. Figure 2B illustrates a schematic diagram of the structure of a housing assembly 10 according to some embodiments of the present specification. Figure 2C illustrates a partial cross-sectional view taken along line AA of a housing assembly 10 according to some embodiments of the present specification. As shown in Figures 2B and 2C, the housing assembly 10 may include a housing 110, a second waterproof assembly 120, and a second acoustic assembly 130.

[0061] The shell 110 can be an installation component of the acoustic device 01, and other components of the acoustic device 01 (such as the second waterproof component 120, the second acoustic component 130 and the acoustic module 20, etc.) can be installed with the shell 110 as a carrier. The shell 110 may include a shell side wall 110-A and a shell bottom wall 110-B. The shell side wall 110-A and the shell bottom wall 110-B together enclose an internal space, and other components of the acoustic device 01 can be arranged in the internal space. The shape of the shell 110 can be any shape, for example, it can be a runway shape (rounded rectangle) or a circle. In some embodiments, when the acoustic device 01 is a wireless headset, the shell 110 can be a shape that conforms to the contour of the human ear, so that the wireless headset can be worn more firmly on the user's ear. The material of the shell 110 can be any material, such as metal, plastic, polymer, etc. This specification does not limit the shape and material of the shell 110. As shown in FIG. 2A , the housing 110 may include a second accommodating chamber 111 and a third accommodating chamber 112 to accommodate different components.

[0062] The inner wall of the housing 110 can form the second accommodating sidewall 111-A and the second accommodating bottom wall 111-B of the second accommodating cavity 111. For example, the housing bottom wall 110-B of the housing 110 can form the second accommodating sidewall 111-A and the second accommodating bottom wall 111-B. Alternatively, the housing bottom wall 110-B can form a portion of the second accommodating sidewall 111-A and the second accommodating bottom wall 111-B, and the housing sidewall 110-A can form another portion of the second accommodating sidewall 111-A. In some embodiments, the second accommodating cavity 111 can also be a space enclosed by other components.

[0063] The second accommodating cavity 111 may be provided with a second sound hole 111-C. For example, a second sound hole 111-C may be provided on the second accommodating bottom wall 111-B of the second accommodating cavity 111. The second sound hole 111-C may pass through the shell 110 and be connected to the second accommodating cavity 111. In some embodiments, the aperture of the second sound hole 111-C on the inner wall of the shell 110 may be smaller than the aperture of the second sound hole 111-C on the outer wall of the shell 110. The aperture here refers to the opening diameter of the sound hole on the wall. In other words, the second sound hole 111-C may be in the shape of a trumpet that is larger on the outside and smaller on the inside. By designing the second sound hole 111-C into a trumpet shape, on the one hand, it can make it easier for users to clean foreign matter such as solids or liquids that enter the second sound hole 111-C, and on the other hand, it can make the demolding process of the second sound hole 111-C smooth.

[0064] In some embodiments, the central axis of the second sound hole 111-C can be tilted relative to the second bottom wall 111-B to prevent water from entering the interior of the shell 110 through the second sound hole 111-C. The central axis of the second sound hole 111-C can be a line connecting the center of the first opening of the second sound hole 111-C on the inner wall of the shell 10 and the center of the second opening on the outer wall of the shell 10. The central axis of the second sound hole 111-C and the central axis have an intersection on the outer wall (or inner wall) of the shell 10. Taking the cross-section of the intersection as a reference, the inclination angle of the central axis described in this specification is the angle of the central axis relative to the cross-section. The inclination angle of the central axis of the second sound hole 111-C relative to the second bottom wall 111-B can be selected according to the design and processing requirements of the product, under the premise of not affecting the acoustic performance of the acoustic device 01. In some embodiments, the value range of the inclination angle can be [30, 90) degrees. Among them, when the inclination angle is [60, 90) degrees, while ensuring a certain degree of inclination, the processing difficulty of the second sound hole 111-C is also reduced. When the inclination angle is [30, 60] degrees, ensuring that the inclination angle is within this range can further enhance the ability to prevent water from entering the interior of the shell 10 through the second sound hole 111-C. In some application scenarios, such as swimming, by tilting the second sound hole 111-C, when the acoustic device 01 is subjected to dynamic water pressure, the water flow will not directly flow into the second sound hole 111-C, thereby enhancing the waterproof ability of the acoustic device 01 under dynamic water pressure. The shape of the second sound hole 111-C can be any shape such as circular, elliptical, square, rectangular, etc. This specification does not limit the shape of the second sound hole 111-C.

[0065] In some embodiments, the second sound hole 111-C can also be a through hole. That is to say, the sound path of the second sound hole 111-C is bent, so that the overall shape is similar to an "L". Among them, with the bending point as the boundary, there is a non-zero angle between the central axis before the bending and the central axis after the bending. The angle can be 90 degrees, thus forming the above-mentioned "L" shape; the angle can also be non-90 degrees, for example, greater than 90 degrees. The second sound hole 111-C is designed as a through hole. The design of the angle of the second sound hole 111-C can prevent the water from directly flowing into the second sound hole 111-C and then entering the interior of the acoustic device 01 when the acoustic device 01 is subjected to dynamic water pressure, thereby increasing the dynamic waterproof capability of the acoustic device 01.

[0066] Similarly, the inner wall of the housing 110 may also form the third accommodating sidewall 112-A and the third accommodating bottom wall 112-B of the third accommodating cavity 112. In some embodiments, for example, the housing bottom wall 110-B of the housing 110 forms the third accommodating sidewall 112-A and the third accommodating bottom wall 112-B. Alternatively, the housing bottom wall 110-B forms a portion of the third accommodating sidewall 112-A and the third accommodating bottom wall 112-B, while the housing sidewall 110-A forms another portion of the third accommodating sidewall 112-A. In some embodiments, the third accommodating cavity 112 may also be a space enclosed by other components.

[0067] The third accommodating chamber 112 may define a third sound hole 112-C. For example, the third accommodating bottom wall 112-B of the third accommodating chamber 112 may define the third sound hole 112-C. The third sound hole 112-C may extend through the housing 110 and communicate with the third accommodating chamber 112. The shape, inclination angle, and other features of the third sound hole 112-C may be similar to those of the second sound hole 111-C and will not be further described here.

[0068] As shown in Figure 2A, the second accommodating cavity 111 can be disposed on the housing bottom wall 110-B, and the third accommodating cavity 112 can be disposed on the housing side wall 110-A, so that the sound holes in the different accommodating cavities can receive sound from different directions or transmit sound in different directions. In some embodiments, the second accommodating cavity 111 and the third accommodating cavity 112 can both be disposed on the housing bottom wall 110-A or the housing side wall 110-B to enhance the ability of their sound holes to receive sound from the same direction or transmit sound in the same direction.

[0069] The shapes of the accommodation spaces of the second accommodation chamber 111 and the third accommodation chamber 112 can be the same. The shapes of the accommodation spaces of the second accommodation chamber 111 and the third accommodation chamber 112 can also be different. As shown in Figure 2A, the shapes of the accommodation spaces of the second accommodation chamber 111 and the third accommodation chamber 112 are different. The cross-section of the second accommodation chamber 111 is partially runway-shaped (waisted circle), and the cross-section of the third accommodation chamber 112 is circular. The shape of the accommodation space can be adapted to the shape of the components that need to be accommodated, so as to reduce the consumables of the shell 110 or other components that form the accommodation chamber while meeting the accommodation requirements. The components accommodated in the second accommodation chamber 111 and the third accommodation chamber 112 are introduced below.

[0070] As shown in Figures 2B and 2C, the second waterproof assembly 120 can be installed in the third accommodating chamber 112, sealedly connected to the third accommodating chamber 112 and covering the third sound hole 112-C, thereby preventing liquid (water) from entering the third accommodating chamber 112 through the third sound hole 112-C, thereby avoiding damage to other components within the housing. The second acoustic assembly 130 can be placed on the side of the second waterproof assembly 120 away from the housing 110.

[0071] In some embodiments, the second waterproof assembly 120 may include a second waterproof membrane 121 and a second buffer member 122. The second waterproof membrane 121 allows air to pass through while blocking water. The second buffer member 122 may have a second central hole 122-A. The second buffer member 122 may abut against an edge region of the second waterproof membrane 121. Specifically, the edge region of the non-opening region of the second buffer member 122 may abut against an edge region of the second waterproof membrane 121. In some embodiments, the second central hole 122-A and the opening of the third sound hole 112-C on the inner wall of the housing 110 are not coaxial. In some embodiments, the second central hole 122-A and the opening of the third sound hole 112-C on the inner wall of the housing 110 are coaxial. This allows the second waterproof membrane 121 to be evenly subjected to the water pressure flowing from the third sound hole 112-C. This reduces the risk of damage to the second waterproof membrane 121 due to uneven water pressure, which could reduce or even render the waterproofing effectiveness of the second waterproof assembly 120 ineffective. The shape of the second center hole 122-A can be any shape such as circular, elliptical, square, rectangular, etc., and this specification does not limit the shape of the second center hole 122-A. In some embodiments, the shape of the second center hole 122-A can be adapted to the shape of the third sound hole 112-C, and the aperture of the third sound hole 112-C can be less than or equal to the aperture of the second center hole 122-A, so that the second waterproof membrane 121 has a larger area that can withstand water pressure and is less likely to be damaged. Among them, the aperture can refer to the diameter of the hole. In some embodiments, the aperture of the third sound hole 112-C can be 0.6mm-1.2mm, and the aperture is made smaller to reduce the possibility of liquid entering the interior of the shell 110 without affecting the sound pickup of the acoustic device 01. In some embodiments, the aperture of the second center hole 122-A can be 0.8mm-1.8mm. While adapting to the accommodating space of the third accommodating cavity 112 and the aperture of the third sound hole 112-C, the aperture of the second center hole 122-A is enlarged to increase the area of ​​the second waterproof membrane 121 that withstands water pressure.

[0072] In some embodiments, the second waterproof component 120 may have an adhesive surface, allowing the adhesive surface to adhere to the third bottom wall 112-B after the second waterproof component 120 is placed in the third accommodating cavity 112, thereby achieving a sealed connection between the two and securing the second waterproof component 120. For example, the second waterproof component 120 may have a third adhesive surface 122-B and a fourth adhesive surface 122-C. The third adhesive surface 122-B can adhere the second waterproof component 120 to the third accommodating cavity 112 after being subjected to external pressure. The external pressure can be the weight of the second acoustic component 130 or the pressure applied by a pressure jig. The fourth adhesive surface 122-C can ensure that the second waterproof component 120 and the second acoustic component 130 are sealed and bonded together when they come into contact. Specifically, the second waterproof component 120 can have two second buffer members 122, one located on either side of the second waterproof membrane 121. The second buffer member 122 may have adhesive surfaces on both sides facing the third accommodating cavity 112 and the second acoustic assembly 130. By providing adhesive surfaces, the second waterproof assembly 120 is fixed in the third accommodating cavity 112 by adhesive bonding, achieving a waterproof effect while ensuring ease and convenience of operation.

[0073] Furthermore, the second buffer member 122 can also be elastic. The second buffer member 122 can evenly distribute the physical pressure (impact energy) applied to the second waterproof assembly 120. Furthermore, during installation of the second waterproof assembly 120, the second buffer member 122 can protect the second waterproof membrane 121 from wrinkling due to significant impact, thereby affecting its waterproof and acoustic performance. In some embodiments, the second buffer member 122 can be made of foam adhesive, elastic acrylic adhesive, or a combination of foam and elastic acrylic adhesive. In some embodiments, the thickness of the second buffer member 122 ranges from 0.1 mm to greater than or equal to 0.1 mm. A certain thickness of the second buffer member 122 can increase the height / thickness of the second waterproof assembly 120, allowing the waterproof assembly to fit within the reserved assembly space of the housing 110, such as the depth of the third accommodating chamber 112. Furthermore, the height of the second waterproof assembly 120 matches and is higher than the height of the third accommodating chamber sidewall 112-A, ensuring that the second waterproof assembly 01 can be compressed by the second acoustic assembly 130 after being assembled into the third accommodating chamber 112. Furthermore, when the second buffer member 122 has a certain thickness, the deformability of the second waterproof component 120 can be increased, thereby being able to adapt to the manufacturing errors of different third accommodating cavities 112 and making it easier to assemble the second waterproof component 120 into the third accommodating cavity 112 .

[0074] In some embodiments, the second waterproof component 120 may further include a gauze. The gauze may be positioned on the side of the second waterproof component 120 away from the third sound hole 112-C. When the second waterproof membrane 121 encounters high water pressure, it may deform. In this case, the gauze can act as a support or barrier behind the second waterproof membrane 121, preventing excessive deformation of the second waterproof membrane 121, which could in turn alter its acoustic properties and enhance its waterproof capability. In this case, the fourth bonding surface 122-C may be bonded to the gauze, and the side of the gauze facing the second acoustic component 120 may be bonded to the second acoustic component 120. In some embodiments, the gauze may also be positioned on the side of the second waterproof component 120 closer to the third sound hole 112-C. When a user wears the headphones for underwater activities, water entering the acoustic device 01 through the third sound hole 112-C may first flow through the gauze. The gauze can disperse the water flow through the mesh, so that the impact force on the second waterproof membrane 121 can be more dispersed, so that the force on each part of the second waterproof membrane 121 is relatively small, and the second waterproof membrane 121 is not easily deformed, thereby increasing the waterproof ability of the second waterproof membrane 121 (second waterproof component 120).

[0075] 2C , the second acoustic assembly 130 may include a second acoustic sensor 131 and a second circuit board 132 . The second acoustic assembly 130 covers the third accommodating cavity 112 .

[0076] The second acoustic sensor 131 may include a second sound transmission hole 131-A. In some embodiments, the second acoustic sensor 131 may include at least one microphone. The microphone may receive ambient sound transmitted through the second waterproof component 120 through the second sound transmission hole 131-A. In some embodiments, the second acoustic sensor 131 may include at least one speaker. The speaker may emit a target sound when in operation. The target sound may pass through the second sound transmission hole 131-A and then pass through the second waterproof component 120 to exit the acoustic device 01. The second waterproof component 120 covers the third sound transmission hole 112-C to prevent water from passing through the second waterproof component 120 and contacting the second acoustic sensor 131. In some embodiments, the second sound transmission hole 131-A and the second center hole 122-A of the second buffer 122 may be arranged so that their central axes coincide, thereby ensuring that the sound transmission path is shortest and that the acoustic device 01 has good acoustic performance. In some embodiments, the second sound transmission hole 131-A and the second center hole 122-A of the second buffer member 122 can be set so that the central axes do not overlap, that is, they are set eccentrically, so as to adapt to the situation where the storage space in the shell 110 is insufficient or too small.

[0077] The second circuit board 132 can be mechanically connected to the second acoustic sensor 131. The mechanical connection mentioned herein may include bonding, SMT patching, manual soldering, seam connection, riveting, and the like. For example, the second acoustic sensor 131 can be fixed to the second circuit board 132 using an SMT patch. The second circuit board 132 can be located between the second acoustic sensor 131 and the second waterproof component 120. As previously described, the second acoustic component 130 can be bonded to the fourth bonding surface 122-C of the second buffer 122. Specifically, the second circuit board 132 can be bonded to the fourth bonding surface 122-C of the second buffer 122, thereby connecting the second acoustic component 130 to the second waterproof component 120. In some embodiments, further pressure can be applied to the second acoustic component 130 to further securely bond the second circuit board 132 to the fourth bonding surface 122-C. For example, pressure can be applied by pressing down on the second acoustic component 130 using a pressure jig. For another example, a weight may be placed on the second acoustic assembly 130 to apply pressure thereto.

[0078] In some embodiments, the second circuit board 132 may be at least partially located within the third accommodating cavity 112. In some embodiments, the second circuit board 132 may also be located outside the third accommodating cavity 112. For example, the second circuit board 132 may abut against the top surface of the third accommodating sidewall 112-A of the third accommodating cavity 112.

[0079] In some embodiments, the extension direction of the second circuit board 132 can be designed according to connection requirements. As shown in Figure 2B, the second circuit board 132 extends from the housing side wall 110-A to the housing bottom wall 110-B, and is on the same wall as the second accommodating cavity 111, thereby facilitating connection with the acoustic module 20.

[0080] In some embodiments, the second circuit board 132 may be provided with multiple second positioning holes 132-A, and the housing 110 may be provided with multiple second positioning protrusions 132-B distributed along the opening of the third accommodating cavity 112, corresponding one-to-one with the second positioning holes 132-A. The provision of these second positioning holes 132 and second positioning protrusions 132-B facilitates alignment of the second sound transmission hole 131-A with the second center hole 122-A of the second buffer member 122, thereby minimizing the sound transmission path and ensuring good acoustic performance of the acoustic device 01. For example, the second circuit board 132 may have four second positioning holes 132-A, and the housing 110 may have four second positioning protrusions 132-B. This specification does not limit the number of positioning protrusions or positioning holes. In some embodiments, there may be multiple second positioning protrusions 132-B. These multiple second positioning protrusions 132-B are distributed around the second acoustic sensor 131. In some embodiments, these multiple second positioning protrusions 132-B are unevenly distributed around the second waterproof component 120 or the second acoustic sensor 131. In some embodiments, multiple second positioning protrusions 132-B are evenly or approximately evenly distributed around the second waterproof component 120 or the second acoustic sensor 131 to facilitate positioning. For example, a line connecting four second positioning protrusions 132-B forms a square evenly distributed around the second acoustic sensor 131.

[0081] In some embodiments, the second positioning protrusion 132-B may be cylindrical. In some embodiments, the second positioning protrusion 132-B may also be truncated cone-shaped with a narrow top and a wide bottom, so as to avoid interference with the second positioning hole 132-A during installation.

[0082] In some embodiments, the second circuit board 132 may be a printed circuit board (PCB). PCB is not easily bent and has a certain degree of rigidity, and thus can well support the second acoustic sensor 131.

[0083] In some embodiments, the second circuit board 132 may be a flexible printed circuit (FPC). The FPC is flexible and can be bent. By bending the FPC, the space occupied by the housing 110 can be reduced. In order to increase the local thickness or hardness of the FPC and ensure the flatness of the FPC, the FPC may be partially or overall reinforced. For example, the second acoustic component 130 may include a steel plate or PI (Polymide, PI for short) material as a second reinforcing plate 133 to reinforce the FPC. PI material is an engineering plastic with excellent mechanical properties, and has the characteristics of light weight, thin thickness, and good bendability. The second reinforcing plate 133 may be located between the second circuit board 132 and the second waterproof component 120. The second reinforcing plate 133 may abut against the top surface 112-D of the side wall 112-A of the third accommodating cavity, as shown in FIG2C . At this time, the second positioning hole 132-A may be opened on the second reinforcing plate 133. As shown in Figure 2B , the second reinforcement plate 133 may be provided with three second positioning holes 132-A, which are arranged in a triangular shape and approximately evenly distributed around the second acoustic sensor 131. In some embodiments, the housing 110 may be provided with four second positioning protrusions 132-B, and the second reinforcement plate 133 may be provided with four second positioning holes 132-A. The four second positioning holes 132-A and the four second positioning protrusions 132-B may be arranged in a rectangular shape around the second acoustic sensor 131.

[0084] As mentioned above, the second buffer component 122 can be elastic and can be compressed. And the adhesion and sealing properties of the second buffer component 122 are related to the degree of compression (compression ratio). Take the second buffer component 122 as foam glue as an example for explanation. The sealing property of the foam glue, that is, the waterproof property and its adhesion are positively correlated with the compression ratio of the foam to a certain extent. In other words, the higher the compression amount of the foam glue, the higher the compression ratio, the better the sealing property of the foam and the stronger the bonding. Therefore, keeping the compression ratio of the foam glue above the preset value can ensure the good and stable waterproof performance of the acoustic device 01. Among them, the compression ratio of the second buffer component 122 can be expressed by

[0085] (Original thickness - thickness after compression) / original thickness x 100%

[0086] For example, the original thickness of the second cushioning member 122 is first recorded. When the second cushioning member 122 is pressed downward, its thickness after compression is recorded, thereby obtaining the compression ratio of the second cushioning member 122. The preset value may depend on the material of the second cushioning member 122. For example, when the second cushioning member 122 is made of foam adhesive, the preset value of the compression ratio may range from 10% to 60%, for example, 50%, to ensure the sealing and bonding properties of the foam adhesive.

[0087] As previously mentioned, second cushioning member 122 can also be constructed from a foam base and acrylic adhesive. Similarly, the higher the compression ratio of the foam base and acrylic adhesive, the better the seal and the stronger the bond. Maintaining the compression ratio of the foam base and acrylic adhesive between 10% and 60% ensures good and stable waterproof performance for acoustic device 01.

[0088] Since the second acoustic component 130 is relatively light, when the second acoustic component 130 is placed on the second waterproof component 120, the compression ratio of the second buffer 122 may not reach the above-mentioned preset value. Therefore, in some embodiments, in order to make the compression ratio of the second buffer 122 reach the above-mentioned preset value, a heavy object can be placed on the second acoustic component 130. For example, a heavy object is placed on the second circuit board 132. The gravity of the heavy object causes the second circuit board 132 to press down the second buffer 122, so that its compression ratio remains above the preset value. In some embodiments, a hot melt process can be used to achieve compression of the second buffer 122. Specifically, the gravity of the hot-melted plastic part is used to press down the second acoustic component 130, thereby achieving compression of the second buffer 122.

[0089] In some embodiments, the second positioning protrusion 132-B may be a second heat-seal column 132-B' formed of a heat-sealable material, such as a plastic component. FIG3A illustrates a schematic diagram of the shape of the second heat-seal column 132-B' before heat-seal according to some embodiments of the present application. FIG3B illustrates a schematic diagram of the shape of the second heat-seal column 132-B' after heat-seal according to FIG3A of the present application. The second heat-seal column 132-B' is indicated by the shaded portion.

[0090] As shown in Figure 3A , before being heat-soldered, second heat-soldered post 132-B' is a column extending through second positioning hole 132-A, with a gap between it and second circuit board 132. Second heat-soldered post 132-B' can be a solid, ribbed, or hollow heat-soldered post, and this specification does not limit this. Heating can melt and reshape second heat-soldered post 132-B'. Heating can be performed by hot air, pulsed, or ultrasonic methods, and this specification does not limit this.

[0091] As shown in FIG3B , the formed second hot melt column 132-B' may include a second column 132-B1' and an enlarged second column head 132-B2'. The enlarged second column head 132-B2' is formed by the deformation of the top portion of the second hot melt column 132-B' after being hot-melted. The second column 132-B1' is passed through the corresponding second positioning hole 132-A, and the column head 132-B2' can abut against the upper surface of the second circuit board 132, thereby fixing the second acoustic component 130 on the top surface 112-D of the third accommodating side wall 112-A and pressing the second waterproof component 120 (second buffer member 122).

[0092] In some embodiments, the plurality of second positioning protrusions 132-B may all be second heat-melt columns 132-B', which are heat-melted to compress the second waterproof component 120. In some embodiments, part of the plurality of positioning protrusions 132-B is the second heat-melt column 132-B'; the remaining part only serves to position. In some embodiments, the plurality of second heat-melt columns 132-B' surround in all directions to ensure that the second waterproof component 120 is subjected to pressure at all angles. Furthermore, the plurality of second heat-melt columns 132-B' are unevenly distributed around the second acoustic sensor 131 to apply pressure to specific positions of the second waterproof component 120. In some embodiments, the second heat-melt columns 132-B' may be evenly distributed around the second acoustic sensor 131, so that the second acoustic component 120 is subjected to uniform pressure, thereby enabling the second buffer member 122 to be compressed evenly.

[0093] The second positioning protrusion 132-B is formed into a rivet-like structure by hot-melt pressure, the second buffer 122 is compressed, and the second acoustic component 130 is fixed to the shell. Not only is the operation simple and efficient, but the hot-melt material also seals the gap between the second positioning protrusion 132-B and the second positioning hole 132-A. There is no need to seal the gap between the second positioning protrusion 132-B and the second positioning hole 132-A again, which is simple to operate, efficient, and reduces costs.

[0094] In some embodiments, the surface of the second acoustic assembly 130 can be further sealed with a sealant. This sealant not only strengthens the second acoustic assembly 130's stability within the housing 110, but also prevents the second hot melt column 132-B' from falling off during long-term use, potentially altering the state of the second waterproof membrane 121 and affecting its acoustic and waterproof performance. It also further fills the gap between the second waterproof assembly 120 and the third sidewall 112-A, preventing water from entering through the layers of the second waterproof assembly 120 near the sidewall, potentially causing waterproofing failure. In some embodiments, the sealant can be ultraviolet ray glue (UV glue), silicone, hot melt glue, or the like.

[0095] When an acoustic sensor is installed in acoustic device 01, the sensitivity of the acoustic sensor before and after installation into the housing may vary due to installation errors, differences in acoustic sensor characteristics, and other factors. Specifically, in some embodiments of the present application, the sensitivity of second acoustic sensor 131 may change during installation of second waterproof assembly 120 and second acoustic assembly 130 into housing 110, as described above. In some embodiments, second acoustic sensor 131 has a first initial sensitivity when removed from third accommodating cavity 112 (not assembled into third accommodating cavity 112), and a first assembled sensitivity after installation into housing 110. Typically, the first initial sensitivity and the first assembled sensitivity differ, and the difference between the two sensitivities is less than 1.9 dB. Factors that may affect the sensitivity change of second acoustic sensor 131 may include the degree of wrinkling of second waterproof membrane 121, the degree of compression of second waterproof membrane 121, or defects in the third accommodating cavity 112. After the second acoustic sensor is installed in housing 110 using the above method, it is difficult to remove and its sensitivity is almost fixed due to assembly factors. At this point, if first acoustic sensor 231 is installed in the housing using the same method, the sensitivity difference (Sgap) between first acoustic sensor 231 and second acoustic sensor 131 is uncontrollable, resulting in uncontrollable sensitivity consistency across different acoustic devices 01.

[0096] In particular, when acoustic device 01 includes two or more acoustic sensors, differences in sensitivity (i.e., Sgap) between each acoustic sensor mounted on acoustic device 01 often occur due to the aforementioned installation errors and differences in acoustic sensor components. This results in poor consistency in the post-assembly sensitivity (also known as assembly sensitivity) between acoustic devices 01 during the assembly process, impacting the yield of acoustic device 01. Assembly sensitivity consistency is the difference in Sgap between different acoustic devices 01. Poor assembly sensitivity consistency indicates a significant difference in Sgap between acoustic devices 01. In this case, a preset algorithm can be used to modulate the sensitivity consistency between multiple acoustic devices 01. For example, the assembly sensitivity difference between multiple acoustic sensors in acoustic device A is SgapA; the assembly sensitivity difference between multiple acoustic sensors in acoustic device B is SgapB; and the assembly sensitivity difference between multiple acoustic sensors in acoustic device C is SgapC. Acoustic devices A, B, and C want to use the same circuit design or algorithm to adjust the Sgap between multiple acoustic sensors. Therefore, the difference between any two Sgap values ​​(SgapA, SgapB, and SgapC) must remain within a preset range. However, algorithm adjustment typically has a certain threshold range, making it difficult to simultaneously improve sensitivity consistency across multiple acoustic devices and ensure yield.

[0097] Therefore, the present application provides an acoustic module 20. The acoustic module 20 is a separate module separated from the housing assembly 10. The acoustic module 20 has been treated to be liquid (water) resistant, so the assembly sensitivity of the acoustic module 20 is basically fixed.

[0098] The specific components of the acoustic module 20 are described below. Figure 4A shows a schematic diagram of an acoustic module 20 provided in accordance with some embodiments of this specification installed in the second accommodating cavity 111. Figure 4B shows a schematic diagram of an acoustic module 20 provided in accordance with some embodiments of this specification. Figure 4C shows a cross-sectional view taken along line BB of the acoustic module 20 shown in Figure 4B of this application. As shown in Figures 4A-4C, the acoustic module 20 may include a base 210, a first waterproof assembly 220, and a first acoustic assembly 230.

[0099] In some embodiments, the overall shape of the base 210 can be adapted to the accommodation space of the second accommodation chamber 111 so as to be installed within the second accommodation chamber 111. As shown in FIG4C , the base 210 can include a base sidewall 211, a base bottom wall 212, and a first sound hole 214. The base sidewall 211 and the base bottom wall 212 form a first accommodation chamber 213 to accommodate other components (e.g., the first waterproof component 220, the first acoustic component 230, etc.). The base 210 can define a first sound hole 214. The first sound hole 214 can extend through the base bottom wall 212 and communicate with the first accommodation chamber 213. For example, the first sound hole 214 can be defined in the base bottom wall 212. After the base 210 is installed in the second accommodation chamber 111, the first sound hole 214 can communicate with the second sound hole 111-C in the second accommodation chamber 111, ensuring that sound can be transmitted in and out of both holes. In some embodiments, the first sound hole 214 is not coaxial with the opening of the second sound hole 111-C on the second container bottom wall 111-B. In some embodiments, the first sound hole 214 can be coaxial with the opening of the second sound hole 111-C on the second container bottom wall 111-B to minimize the sound transmission path and provide good acoustic performance for the acoustic device 01.

[0100] As shown in FIG4C , the first waterproof component 220 can be installed in the first accommodating cavity 213, sealedly connected to the first accommodating cavity 213 and covering the first sound hole 214, thereby preventing liquid (water) from entering the first accommodating cavity 213 through the first sound hole 214. The first acoustic component 230 can be placed on a side of the first waterproof component 220 away from the base bottom wall 212.

[0101] In some embodiments, the first waterproof assembly 220 may include a first waterproof membrane 221 and a first buffer member 222. The first waterproof membrane 221 may have all the properties of the second waterproof membrane 121 described above. For example, the second waterproof membrane 221 may allow air to pass through while blocking water from passing through the first waterproof membrane 221. The first buffer member 222 may have a first central hole 222-A. The first buffer member 222 may abut against an edge region of the first waterproof membrane 221. Specifically, the edge region of the first buffer member 222 may abut against an edge region of the first waterproof membrane 221. In some embodiments, the first central hole 222-A and the first sound hole 214 are not coaxial. In some embodiments, the first central hole 222-A and the first sound hole 214 are coaxial, thereby preventing the first waterproof membrane 221 from being damaged by uneven water pressure, which could reduce or even render the waterproofing effectiveness of the first waterproof assembly 220 ineffective. In some embodiments, the first central hole 222-A and the first sound hole 214 are shaped to match. Similar to the aforementioned second center hole 122-A, the first center hole 222-A can be shaped in any form, such as circular, elliptical, square, or rectangular. This specification does not limit the shape of the first center hole 222-A. In some embodiments, the diameter of the first center hole 222-A can be larger than that of the first sound hole 214, allowing a larger area of ​​the first waterproof membrane 221 to withstand water pressure and thus be less susceptible to damage. The diameter can refer to the diameter of the hole.

[0102] In some embodiments, the first waterproof component 220 may have an adhesive surface, so that after the first waterproof component 220 is placed in the first accommodating cavity 213, the adhesive surface can adhere to the bottom wall of the first accommodating cavity 213, thereby achieving a sealed connection between the two and securing the first waterproof component 220. For example, the first waterproof component 220 may have a first adhesive surface 222-B and a second adhesive surface 222-C. The first adhesive surface 222-B can adhere the first waterproof component 220 to the first accommodating cavity 213 after being subjected to external pressure. The external pressure can be the weight of the first acoustic component 230 or the pressure applied by a pressure jig. The second adhesive surface 222-C can ensure that the first waterproof component 220 and the first acoustic component 230 are sealed and bonded together when they come into contact.

[0103] Specifically, the first waterproof component 220 can have two first buffer members 222, located on either side of the first waterproof membrane 221. The two surfaces of the first buffer members 222 facing the first accommodating cavity 213 and the first acoustic component 230 can be adhesive. By providing adhesive surfaces, the first waterproof component 220 is fixed within the first accommodating cavity 213 by adhesive bonding, achieving a waterproof effect while ensuring ease and convenience of operation. The first waterproof component 220 can have all the properties of the second waterproof component 120 described above, and will not be described here one by one.

[0104] The first acoustic assembly 230 includes a first acoustic sensor 231 and a first circuit board 232. The first acoustic sensor 231 is disposed on a side of the first waterproof assembly 220 away from the base bottom wall 212. The first circuit board 232 may be disposed between the first acoustic sensor 231 and the first waterproof assembly 220.

[0105] The first acoustic sensor 231 may include a first sound transmission hole 231 -A. The first acoustic sensor 231 may have the same characteristics as the aforementioned second acoustic sensor 131 , and details thereof will not be repeated here.

[0106] The first circuit board 232 can be mechanically connected to the first acoustic sensor 231. For example, the first acoustic sensor 231 can be fixed to the first circuit board 232 by welding. As previously described, the first acoustic component 230 can be bonded to the first waterproof component 220 via the second bonding surface 222-C. In some embodiments, pressure can be further applied to the first acoustic component 230 so that the first circuit board 232 can be more firmly bonded to the second bonding surface 222-C. For example, pressure can be applied to the first acoustic component 230 using a pressure jig. For another example, pressure can be applied to the first acoustic component 230 by placing a heavy object on it.

[0107] In some embodiments, the first circuit board 232 may be at least partially located within the first accommodating cavity 213. In some embodiments, the first circuit board 232 may also be located outside the first accommodating cavity 213. For example, the first circuit board 232 may be located outside the first accommodating cavity 213 and abut against the top surface of the base sidewall 211.

[0108] In some embodiments, the first circuit board 232 may be provided with a plurality of first positioning holes 232-A, and the top surface of the base sidewall 211 may be provided with a plurality of first positioning protrusions 232-B corresponding one-to-one with the first positioning holes 232-A. The provision of the first positioning holes 232-A and the first positioning protrusions 232-B facilitates alignment of the first sound transmission hole 231-A and the first center hole 222-A of the first buffer member 222, thereby minimizing the sound transmission path and ensuring good acoustic performance of the acoustic device 01. In some embodiments, there are multiple first positioning protrusions 232-B. These first positioning protrusions 232-B are distributed at different locations around the first waterproof assembly 220 or the second acoustic sensor 231. In some embodiments, the first positioning protrusions 232-B are unevenly distributed around the first waterproof assembly 220 or the second acoustic sensor 231. In some embodiments, the first positioning protrusions 232-B may be evenly or nearly evenly distributed around the first waterproof assembly 220 or the second acoustic sensor 231, facilitating positioning. For example, the lines connecting the three first positioning protrusions 232-B in FIG4B form a triangle, evenly distributed around the first acoustic sensor 231. The number of first positioning protrusions 232-B and first positioning holes 232-A can be three, as shown in FIG4B . This specification does not limit the number of positioning protrusions and positioning holes.

[0109] In some embodiments, the first positioning protrusion 232-B can be cylindrical, as shown in Figure 4B . In some embodiments, the first positioning protrusion 232-B can also be truncated into a cone shape, narrow at the top and wide at the bottom, to avoid interference with the first positioning hole 232-A during installation. In some embodiments, the first positioning protrusion 232-B includes a first column and an enlarged first column head. The first column is inserted into the corresponding first positioning hole 232-A.

[0110] In some embodiments, the first circuit board 232 may be a PCB. The PCB is not easily bent and has a certain degree of rigidity, and thus can well support the first acoustic sensor 231.

[0111] In some embodiments, the first circuit board 232 may be an FPC. As previously described, in order to increase the local thickness or hardness of the FPC and ensure the flatness of the FPC, the FPC may be partially or entirely reinforced. Here, the first acoustic component 230 may include a first reinforcing plate 233. The first reinforcing plate 233 may have the same or similar properties as the aforementioned second reinforcing plate 133, which will not be described in detail here. The first reinforcing plate 233 for enhancing the strength of the first circuit board 232 may be located between the first circuit board 232 and the first waterproof component 220. As shown in FIG4C , the first reinforcing plate 233 may abut against the top surface of the base side wall 211.

[0112] Therefore, multiple first positioning holes 232-A can be provided on the first reinforcing plate 233. In some embodiments, the first positioning holes 232-A can be provided on both the first reinforcing plate 233 and the first circuit board 232. That is, the first positioning holes 232-A on the first reinforcing plate 233 and the first circuit board 232 correspond one-to-one, and the first positioning protrusion 232-B passes through the first positioning holes 232-A on both the first reinforcing plate 233 and the first circuit board 232. When the first positioning protrusion 232-B is the aforementioned first heat-staking stud, the first stud formed by heat-staking can abut against the upper surface of the first circuit board 232.

[0113] In some embodiments, the first circuit board 232 only partially covers the first reinforcement plate 233, as shown in Figure 4B. Therefore, the first positioning holes 232-A can be defined only on the first reinforcement plate 233. As shown in Figure 4B, the first reinforcement plate 233 has three first positioning holes 232-A, which are distributed approximately evenly in a triangular pattern around the first acoustic sensor 231. Furthermore, by not defining the first positioning holes 232-A on the first circuit board 232, the routing of the circuitry within the first circuit board 232 is avoided.

[0114] In some embodiments, each first positioning protrusion 232-B has the same or similar structure as the aforementioned second positioning protrusion 123-B. For example, each first positioning protrusion 232-B includes a first column and an enlarged first head. For example, the first column can be a screw, and the first head can be a screw cap. Alternatively, the first positioning protrusion 232-B can be a heat-seal post, referred to as a first heat-seal post. The first head of the first positioning protrusion 232-B can be formed by deforming the top portion of the first heat-seal post after heat-seal. This allows the elastic first buffer member 222 to be evenly pressed downward after heat-seal of the first positioning protrusion 232-B, thereby ensuring the sealing and adhesion of the first waterproof assembly 220. The first head can abut against the upper surface of the first reinforcing plate 233. The specific appearance after heat-seal can be referred to above as the second heat-seal post 132-B' (see Figure 3B). The specific process and method of heat-seal the first heat-seal post can be referred to as the second heat-seal post 132-B' and will not be further described here. The first stud of the first positioning protrusion 232-B can be formed by the deformation of the top portion of the first heat-seal column after heat-seal. The first stud can abut against the upper surface of the first reinforcing plate 233. The specific shape after heat-seal can refer to the second heat-seal column 132-B' (see Figure 3B) above.

[0115] The first circuit board 232 and the second circuit board 132 can be electrically connected to each other, thereby connecting the first acoustic sensor 231 and the second acoustic sensor 132, allowing them to work together. For example, the first circuit board 232 and the second circuit board 132 can be electrically connected directly by welding. In another example, the first circuit board 232 and the second circuit board 132 can be welded to another circuit board (a connecting circuit board), thereby achieving electrical connection through the circuit board. In another example, the first circuit board 232 and the second circuit board 132 can be electrically connected via board-to-board connectors (BTB connectors). As previously mentioned, in some embodiments, the second circuit board 132 can extend to the bottom wall 110-B of the housing, merging with the second accommodating cavity 111, thereby shortening the distance between the second circuit board 232 and the first circuit board 232. In this case, by connecting the first circuit board 232 and the second circuit board 132 using a connecting circuit board, compared to using a BTB, the internal space occupied by the housing 110 can be reduced, while also saving costs.

[0116] In some embodiments, the first circuit board 232 can be flush with the edge of the base 210. For example, as shown in FIG4A , the edge of the first circuit board 232 is flush with the edge of the base sidewall 211. In some embodiments, the first circuit board 232 can extend beyond the base 210. FIG5 shows a schematic structural diagram of another acoustic module 20 provided according to an embodiment of the present disclosure. As shown in FIG5 , the right side of the first circuit board 232 extends beyond the edge of the base sidewall 211. The protruding portion of the first circuit board 232 can extend beyond the base sidewall 211 and then bend to contact the housing bottom wall 110-B, thereby connecting directly to the second circuit board 132 or connecting to the second circuit board 132 via a connecting circuit board. By designing the first circuit board 232 to extend beyond the base 210, the connection point between the first circuit board 232 and the circuit board to be connected, such as the soldering point, can be located on the housing bottom wall 110-B, making connection more convenient than at the edge of the base 210.

[0117] In some embodiments, the second accommodating sidewall 111-A is higher than the upper surface of the first circuit board 232, thereby forming an accommodation space S for accommodating the second sealing member. Figure 6 shows the positional relationship between the second accommodating sidewall 111-A and the first circuit board 232 according to some embodiments of the present application. The accommodation space S is indicated by shading in Figure 6. In some embodiments, the second sealing member may be a sealant. In some embodiments, the sealant may be a UV adhesive.

[0118] As previously mentioned, the first circuit board 232 may be an FPC, and the right side of the first circuit board 232 may extend beyond the edge of the base side wall 211. Therefore, when the height of the second accommodating side wall 111-A is higher than the upper surface of the first circuit board 232, the first circuit board 232 needs to bend within the second accommodating cavity 111, extend out of the second accommodating cavity 111, pass over the second accommodating side wall 111-A, and then bend to the second accommodating bottom wall 111-B. This connects to the portion of the second circuit board 132 that extends to the second accommodating bottom wall 111-B, while reducing the space occupied by the housing 110.

[0119] Figure 7 shows a schematic diagram of a second accommodating sidewall 111-A provided according to some embodiments of the present application. Figure 7 does not show the portion of the first circuit board 232 that extends beyond the edge of the base sidewall 211. To reduce the degree of bending of the first circuit board 232 when crossing the second accommodating cavity 111 and prevent damage to the first circuit board due to excessive bending at the second accommodating cavity sidewall 111-A, the second accommodating sidewall 111-A may be provided with a target segment 111-a, as shown in Figure 7. The first circuit board 232 can pass over the second accommodating sidewall 111-A from the target segment 111-a of the second accommodating sidewall 111-A.

[0120] The target section 111-a may have a flatter design compared to other parts of the second accommodating side wall 111-A, thereby reducing the degree of bending of the first circuit board 232 in the second accommodating side wall 111-A section, thereby increasing the life of the first circuit board 232.

[0121] For example, the edges and corners of the other parts of the second accommodating side wall 111-A are sharp right angles, and the target segment 111-a can be designed to be more gentle with rounded corners. For another example, the edges and corners of the other parts of the second accommodating side wall 111-A are rounded corners with smaller angles, and the target segment 111-a can be designed to be more gentle with rounded corners with larger angles. For another example, the height difference between the other parts of the second accommodating side wall 111-A and the inner wall of the shell 110 is relatively high, and the target segment 111-a can be designed to be more gentle with a smaller height difference with the inner wall of the shell 110, and there can be a sloped support between the target segment 111-a and the inner wall of the shell 110. As shown in Figure 7, the target segment 111-a can include a guide opening 111-a1 and an inclined guide surface 111-a2 opened on the second accommodating side wall 111-A. The upper surface of the first circuit board 232 can be flush with the upper surface of the guide opening 111-a1, eliminating the need for the first circuit board 232 to bend to pass over the second accommodating side wall 111-A. The guide opening 111-a1 can be connected to the inner wall of the housing 110 via an inclined guide surface 111-a2. Because there is a certain height difference between the guide opening 111-a1 and the inner wall of the housing 110, the provision of the guide surface 111-a2 can support the first circuit board 232, preventing it from hanging in the air and reducing the risk of damage to the first circuit board 232.

[0122] In some embodiments, the degree of bending of the first circuit board 232 along the sidewall section of the second accommodating sidewall 111-A can be measured by the bending angle of the first circuit board 232. The smaller the bending angle, the lower the degree of bending. For example, an acute bending angle results in a lower degree of bending than a right angle. Without the guide surface 111-a2, the first circuit board 232 would need to bend at a right angle along the second accommodating sidewall 111-A. As shown in Figure 7, the inclined guide surface 111-a2 prevents the first circuit board 232 from bending downward at a sharp angle. The support provided by the guide surface 111-a2 ensures that the bending angle of the first circuit board 232 is both acute and small. In some embodiments, the target section 111-a can be designed with rounded corners, compared to the right-angle design of other sections. This allows the first circuit board 232 to bend along the rounded corners as it passes through the second accommodating sidewall 111-A, avoiding a direct bend. This improves the service life of the first circuit board 232.

[0123] Figure 8A shows a CC cross-sectional view of the acoustic device 01 shown in Figure 1 of this specification. Figure 8B shows another CC cross-sectional view of the acoustic device 01 shown in Figure 1 of this specification. Figure 8C shows an enlarged view of the D portion shown in Figure 8B provided in this specification.

[0124] As mentioned above, the base 210 is sealed and connected to the second accommodating chamber 111. In some embodiments, the base 210 and the second accommodating chamber 111 can be sealed and connected by a first sealing member 40 (shown in black). The first sealing member 40 can be a prefabricated sealing gasket. As shown in Figure 8A, the first sealing member 40 is pre-bonded to the second accommodating bottom wall 111-B, and then the acoustic module 20 is placed on the first sealing member 40 to fix the acoustic module 20 in the second accommodating chamber 111. In some embodiments, the sealing gasket can be double-sided tape, foam tape, or foam matrix + double-sided tape.

[0125] As mentioned above, the interior of the shell 110 can form a second accommodating side wall 111-A and a second accommodating bottom wall 111-B of the second accommodating chamber 111. In some embodiments, the second accommodating bottom wall 111-B may include a first step. As shown in Figure 8B, the first step can divide the second accommodating bottom wall into a first bottom wall 111-B1 and a second bottom wall 111-B2. Among them, the second sound hole 111-C passes through the first bottom wall 111-B1 and is connected to the second accommodating chamber 111. The base 210 can abut against the second bottom wall 111-B2. A first gap I1 (shown in the shaded portion in Figure 8C) can be formed between the base 210 and the first bottom wall 111-B1. The first sealing member 40 can be in the first gap I1 and seal the first gap I1.

[0126] The first sealing member 40 can be the aforementioned sealing gasket or a solidified fluid sealing material. To reduce the difficulty of assembling the acoustic module 20 and the second accommodating chamber 111, the size of the acoustic module 20 can be slightly smaller than the size of the second accommodating chamber 111. Therefore, a gap can exist between the acoustic module 20 and the second accommodating sidewall 111-A. The fluid sealing material can enter the first gap I1 along the above-mentioned gap and solidify in the first gap I1, thereby fixing the acoustic module 20 in the second accommodating chamber 111.

[0127] Since the fluid sealing material may enter the second sound hole 111-C during the flow process, it may partially or completely fill the second sound hole 111-C, thereby affecting the sound intake. In addition, when the second sound hole 111-C is set at an angle, it is more difficult to clean the fluid sealing material flowing into the hole. In some embodiments, by providing a limiter on the base 210 and the second accommodating bottom wall 111-B, the fluid sealing material can be prevented from flowing into the second sound hole 111-C. Specifically, the base bottom wall 212 is provided with a first limiter 215-A along the circumference of the first sound hole 214. The first bottom wall 111-B1 is provided with a circle of second limiters 215-B along the circumference of the second sound hole 111-C. As shown in Figure 8B, the base bottom wall 212 is provided with a circle of first limiters 215-A along the opening of the first sound hole 214. The first bottom wall 111-B1 is provided with a circle of second limiters 215-B along the opening of the second sound hole 111-C. The shapes and sizes of the first limiting portion 215-A and the second limiting portion 215-B match each other so that they couple with the second limiting portion 215-B when the acoustic module 20 is assembled into the housing 110 of the acoustic device. A first limiting portion 215-A is provided on the side of the base bottom wall 212 facing the second accommodating cavity 111. The first limiting portion 215-A and the first limiting portion 215-B cooperate and abut against each other, thereby preventing the fluid sealing material from flowing into the second sound hole 111-C. By providing a circle of first limiting portions 215-A and a circle of second limiting portions 215-B, all paths by which the fluid sealing material can flow into the second sound hole 111-C are blocked.

[0128] In some embodiments, the first limiting portion 215-A includes a groove arranged on the bottom wall 212 of the base along the circumference of the first sound hole 214, and the second limiting portion 251-B includes a second step arranged on the first bottom wall 111-B1 along the circumference of the second sound hole 111-C, as shown in Figure 8B. By providing a second step or a similar protrusion, the fluid sealing material is prevented from flowing into the second sound hole 111-C. By providing a corresponding groove, the height of the second step can be higher, thereby better preventing the fluid sealing material from flowing into the second sound hole 111-C. By providing the groove and the second step, not only can the fluid sealing material be prevented from flowing into the second sound hole 111-C, but it also plays a positioning role when the acoustic module 20 is placed in the second accommodating cavity 111.

[0129] In some embodiments, taking into account the manufacturing precision error and reducing the difficulty of assembling the acoustic module 20 and the second accommodating chamber 111, the notch of the groove can be slightly larger than the second step. Therefore, the first limiting portion 215-A and the second limiting portion 215-B can form a second gap I2 (shown in the shaded portion in Figure 8C). The second gap I2 can also be used to accommodate fluid sealing materials. Therefore, after the fluid sealing material flows into the first gap I1, if there is an excess amount, it can enter the second gap I2, thereby not only ensuring that the fluid sealing material does not flow into the second sound hole 111-C, but also extending the accommodation path of the fluid sealing material, so that more fluid sealing material can be placed between the acoustic module 20 and the second accommodating chamber 111. Enhanced the firmness of the connection between the two.

[0130] When the first sealing member 40 is the aforementioned prefabricated sealing gasket, particularly double-sided tape, water entering the second sound hole 111-C of the acoustic device 01 may reduce the gasket's adhesive strength. Therefore, a sealing member with stronger adhesive strength can be used to secure the acoustic module 20, thereby ensuring normal operation of the acoustic device 01. For example, the first sealing member 40 can be made of silicone, hot melt adhesive, or the like. Both silicone and hot melt adhesive have advantages such as strong adhesion, low pollution, and fast curing.

[0131] By providing a separate acoustic module 20, the sensitivity difference of the acoustic device 01 can be flexibly adjusted, thereby improving the sensitivity consistency of different acoustic devices 01. In other words, it can be ensured that the difference between the sensitivity differences Sgap of different acoustic devices 01 is within a preset range, thereby ensuring the yield of the acoustic device 01.

[0132] FIG9A shows a line graph of acoustic sensor sensitivity under solution A according to some embodiments of the present specification.

[0133] FIG9B shows a line graph of acoustic sensor sensitivity according to solution B provided in some embodiments of this specification. An acoustic sensor is described as a microphone as an example.

[0134] Solution A adopts the acoustic device 01 obtained by the installation method of the second acoustic sensor 131 as mentioned above. Figure 9A shows three acoustic devices A, B, and C among many acoustic devices. Taking the acoustic sensor including two microphones, MIC1 and MIC2 as an example, the sensitivity of the two microphones of each acoustic device is the value in the predetermined frequency band. The predetermined frequency band shown in Figure 9A is 200HZ~4KHZ. Among them, the microphone sensitivity of the same acoustic device 01 is shown using the same broken line. The three broken lines above in Figure 9A represent the sensitivity changes of MIC1; the three broken lines below represent the sensitivity changes of MIC2. The sensitivity difference between the two microphones is recorded as Sgap. The average value of the sensitivity difference between the two microphones of acoustic device A is Sgap AThe average sensitivity difference between the two microphones of acoustic device B is Sgap B The average sensitivity difference between the two microphones of acoustic device C is Sgap C Among them, Sgap A With Sgap B The difference between A-B About 1.07dB; Sgap A With Sgap C The difference between A-C About 1.9dB; Sgap B With Sgap C The difference between B-C This is approximately 0.83dB. This means that if the sensitivity consistency between the acoustic devices needs to be adjusted, the adjustment threshold must be at least 1.9dB.

[0135] Solution B adopts the above-mentioned method of selecting an acoustic module 20 that meets the preset conditions to obtain an acoustic device 01. Figure 9B shows three acoustic devices A', B', and C' among many acoustic devices. Also, taking the acoustic sensor including two microphones, MIC1 and MIC as an example, the sensitivity of the front and rear microphones of each acoustic device is the value in the predetermined frequency band. The predetermined frequency band shown in Figure 9B is 200HZ~4KHZ, in which the microphone sensitivity of the same acoustic device 01 is shown using the same broken line. The three broken lines above in Figure 9B represent the sensitivity changes of MIC1; the three broken lines below represent the sensitivity changes of MIC2. The sensitivity difference between the two microphones is recorded as Sgap'. The average value of the sensitivity difference between the two microphones of the acoustic device A' is Sgap A The average sensitivity difference between the two microphones of acoustic device B' is Sgap B The average sensitivity difference between the two microphones of the acoustic device C' is Sgap C '. Among them, Sgap A 'With Sgap B 'The difference between Sgap A ' -B 'About 0.47dB; Sgap A 'With Sgap C 'The difference between Sgap A ' -C 'About 0.85dB; Sgap B 'With Sgap C 'The difference between Sgap B '- C' is about 0.38dB. That is to say, if the sensitivity consistency between the acoustic devices needs to be adjusted at this time, the adjustment threshold only needs to reach 0.85dB.

[0136] The above data shows that the maximum difference in Sgap' after using Solution B is much smaller than the maximum difference in Sgap after using Solution A. By testing and statistically analyzing the microphone sensitivity of nearly 100 acoustic devices using Solution A and nearly 100 using Solution B, we found that the average difference in Sgap for acoustic devices using Solution A was approximately 0.83dB to 2.1dB. The average difference in Sgap' for acoustic devices using Solution B was approximately 0.3dB to 0.84dB. Therefore, it can be concluded that using Solution B resulted in a more consistent sensitivity of Acoustic Device 01, and its call performance was more stable.

[0137] The foregoing description of this specification describes specific embodiments. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recited in the claims can be performed in an order different from that described in the embodiments and still achieve the desired results. Furthermore, the processes depicted in the accompanying drawings do not necessarily require the particular order or sequential order shown to achieve the desired results. In certain embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0138] In summary, after reading this detailed disclosure, those skilled in the art will appreciate that the foregoing detailed disclosure may be presented by way of example only and may not be limiting. Although not expressly stated herein, those skilled in the art will understand that this specification encompasses various reasonable changes, improvements, and modifications to the embodiments. Such changes, improvements, and modifications are intended to be suggested by this specification and are within the spirit and scope of the exemplary embodiments of this specification.

[0139] Furthermore, certain terms in this specification have been used to describe embodiments of this specification. For example, “one embodiment,” “an embodiment,” and / or “some embodiments” mean that a particular feature, structure, or characteristic described in connection with that embodiment may be included in at least one embodiment of this specification. Therefore, it is emphasized and should be understood that two or more references to “an embodiment,” “one embodiment,” or “an alternative embodiment” in various parts of this specification do not necessarily refer to the same embodiment. Furthermore, particular features, structures, or characteristics may be appropriately combined in one or more embodiments of this specification.

[0140] It should be understood that in the foregoing descriptions of the embodiments of this specification, to facilitate understanding of a feature and to simplify this specification, various features are combined in a single embodiment, figure, or description thereof. However, this does not necessarily mean that these features are combined. When reading this specification, those skilled in the art may extract some of the features and understand them as separate embodiments. In other words, the embodiments of this specification can also be understood as the integration of multiple sub-embodiments. This also applies when each sub-embodiment contains fewer than all the features of a single previously disclosed embodiment.

[0141] Each patent, patent application, patent application publication, and other materials, such as articles, books, specifications, publications, documents, articles, etc., cited herein is hereby incorporated by reference in its entirety for all purposes, except for any prosecution document history related thereto, any equivalent that may be inconsistent or conflicting with this document, or any equivalent prosecution document history that may have a limiting effect on the broadest scope of the claims now or hereafter associated with this document. For example, if there is any inconsistency or conflict between the description, definition, and / or use of terms associated with any incorporated material and the terminology, description, definition, and / or use associated with this document, the terminology in this document shall control.

[0142] Finally, it should be understood that the embodiments of the application disclosed herein are illustrative of the principles of the embodiments of this specification. Other modified embodiments are also within the scope of this specification. Therefore, the embodiments disclosed in this specification are merely examples and not limitations. Those skilled in the art can adopt alternative configurations based on the embodiments in this specification to implement the application in this specification. Therefore, the embodiments of this specification are not limited to the embodiments precisely described in the application.

Claims

1. An acoustic module, characterized in that, Comprising: A base, including a base side wall, a base bottom wall, and a first sound passage hole. The base side wall and the base bottom wall form a first accommodation cavity, and the first sound passage hole penetrates through the base bottom wall and communicates with the first accommodation cavity; A first waterproof component, disposed within the first accommodation cavity and covering the first sound passage hole to prevent liquid from entering the first accommodation cavity through the first sound passage hole; A first acoustic component, including: A first acoustic sensor, which is disposed on a side of the first waterproof component away from the base bottom wall, and A first circuit board, which is disposed between the first acoustic sensor and the first waterproof component and is mechanically connected to the first acoustic sensor.

2. The acoustic module according to claim 1, wherein The first waterproof component includes: A first waterproof film; and A first buffer member, having a first central hole, and the first buffer member abuts against an edge region of the first waterproof film.

3. The acoustic module according to claim 1, wherein The first waterproof component has a first bonding surface and a second bonding surface; The first bonding surface has adhesiveness so as to bond the first waterproof component to the bottom wall surface of the first accommodation cavity after being subjected to an external pressure; and The second bonding surface has adhesiveness so as to bond the first waterproof component and the first acoustic component when contacting the first acoustic component.

4. The acoustic module according to claim 1, wherein The first circuit board abuts against the top surface of the base side wall; The first circuit board includes a plurality of first positioning holes; and A plurality of first positioning protrusions are provided on the top surface of the base side wall, and the plurality of first positioning protrusions correspond to the plurality of first positioning holes one by one.

5. The acoustic module according to claim 1, wherein The first acoustic component further includes a reinforcing member, which is located between the first circuit board and the waterproof component and abuts against the top surface of the base side wall; The reinforcing member includes a plurality of first positioning holes; and A plurality of first positioning protrusions are provided on the top surface of the base side wall, and the plurality of first positioning protrusions correspond to the plurality of first positioning holes one by one.

6. The acoustic module according to claim 4 or 5, wherein Each of the first positioning protrusions includes a first column body and an enlarged first column head, and the first column body passes through the corresponding first positioning hole.

7. The acoustic module according to claim 6, characterized in that, The plurality of first positioning protrusions are a plurality of first hot melt columns, The first column head is formed by the deformation of the top end portion of the first hot melt column after being hot melted.

8. The acoustic module according to claim 1, characterized in that, A first limiting portion is provided on the base bottom wall so as to be coupled with a second limiting portion on the inner wall of the acoustic device when assembled to the acoustic device.

9. An acoustic device, characterized in that, Comprising: The acoustic module according to any one of claims 1-7; A housing assembly, including: A housing, including a second accommodation cavity, a second sound passage hole, a third accommodation cavity, and a third sound passage hole. The second sound passage hole penetrates through the housing and communicates with the second accommodation cavity, and the third sound passage hole penetrates through the housing and communicates with the third accommodation cavity, A second waterproof component, within the third accommodation cavity, is sealingly connected to the third accommodation cavity and covers the third sound passage hole to prevent the liquid from entering the third accommodation cavity through the third sound passage hole, and A second acoustic component, including a second acoustic sensor, the second acoustic component covers the third accommodation cavity and is disposed on a side of the second waterproof component away from the housing, wherein The acoustic module is installed within the second accommodation cavity, the base is sealingly connected to the second accommodation cavity, and the first sound passage hole and the second sound passage hole are in communication.

10. The acoustic device according to claim 9, characterized in that, The inner wall of the housing forms a second accommodation side wall and a second accommodation bottom wall of the second accommodation cavity. The second accommodation bottom wall includes a first step, the first step divides the second accommodation bottom wall into a first bottom wall and a second bottom wall, and the second sound passage hole penetrates the first bottom wall and communicates with the second accommodation cavity.

11. The acoustic device according to claim 10, characterized in that, It further includes a first seal. The base abuts against the second bottom wall; and A first gap is formed between the base and the first bottom wall, and the first seal is within the first gap and seals the first gap.

12. The acoustic device according to claim 11, wherein A first limiting portion is provided on the bottom wall of the base along the circumferential direction of the first sound passage hole, A second limiting portion is provided on the first bottom wall along the circumferential direction of the second sound passage hole, and the first limiting portion and the second limiting portion cooperate and abut against each other.

13. The acoustic device according to claim 12, characterized in that, The first seal is a fluid sealing material obtained by curing; and The first limiting portion and the second limiting portion cooperate and abut against each other to prevent the fluid sealing material from flowing into the second sound passage hole.

14. The acoustic device according to claim 12, wherein The first limiting portion includes a groove provided on the bottom wall of the base along the circumferential direction of the first sound passage hole; and The second limiting portion includes a second step provided on the first bottom wall along the circumferential direction of the second sound passage hole.

15. The acoustic device according to claim 12 or 14, wherein The first limiting portion and the second limiting portion form a second gap, and the second gap is sealed by the first seal.

16. The acoustic device according to claim 9 or 11, characterized in that, The base and the second accommodation cavity are sealingly connected by a first seal, and the first seal is a prefabricated gasket.

17. The acoustic device according to claim 9, characterized in that, The aperture of the second sound passage hole on the inner wall of the housing is smaller than the aperture of the second sound passage hole on the outer wall of the housing; and / or The aperture of the third sound passage hole on the inner wall of the housing is smaller than the aperture of the third sound passage hole on the outer wall of the housing.

18. The acoustic device according to claim 9, characterized in that, The central axis of the second sound passage hole is inclined with respect to the second accommodation bottom wall of the second accommodation cavity; and / or The central axis of the third sound passage hole is inclined with respect to the third accommodation bottom wall of the third accommodation cavity.

19. The acoustic device according to claim 9, characterized in that, It further includes a second seal, The inner wall of the housing forms a second accommodation side wall of the second accommodation cavity; The height of the second accommodation side wall is higher than the upper surface of the first circuit board, thereby forming an accommodation space to accommodate the second seal.

20. The acoustic device according to claim 19, characterized in that, The second acoustic component includes a second circuit board; The first circuit board is connected to the second circuit board, and the first circuit board crosses the second accommodating side wall from a target section of the second accommodating side wall. Wherein the first circuit board is a flexible circuit board; And The target section of the second accommodating side wall has a more gentle design than other parts of the second accommodating side wall to reduce the bending degree of the first circuit board at the second accommodating side wall section.

21. The acoustic device according to claim 20, wherein The target section includes a guiding opening formed in the second accommodating side wall and an inclined guiding surface, and the guiding opening is connected to the inner wall of the housing through the guiding surface to support the first circuit board.

22. The acoustic device according to claim 9, wherein The second waterproof component includes: A second waterproof film; and A second buffer member having a second central hole, and the second buffer member abuts against an edge area of the second waterproof film.

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