Micropump device, heat dissipation device and electronic equipment

Abstract

The embodiment of the invention provides a micropump device, a heat dissipation device and electronic equipment, the micropump device comprises a micro-channel substrate and a vibration substrate which are arranged in a stacked mode, the micro-channel substrate is provided with a first surface facing the vibration substrate, the first surface is provided with a pump chamber, a fluid inlet and a fluid outlet, the pump chamber faces an opening of the vibration substrate, and the fluid inlet is communicated with the fluid outlet. The pump chamber comprises a chamber bottom opposite to the opening and a chamber side wall surrounding the periphery of the chamber bottom, the fluid inlet and the fluid outlet are communicated to the chamber side wall, and the vibration substrate at least covers the opening of the pump chamber; the vibration exciter is connected with the vibration substrate, and the vibration substrate can vibrate under the driving of the vibration exciter, so that the cavity volume of the pump chamber is periodically changed. According to the micropump device, the heat dissipation device and the electronic equipment, the light and thin design requirement of the electronic equipment can be met.

Description

Technical Field

[0001] This invention relates to the field of microfluidic cooling and heat dissipation technology, and in particular to a micropump device, heat dissipation device, and electronic equipment. Background Technology

[0002] Thermal design is crucial to chip performance and reliability. As temperature rises, the failure rate of electronic components and devices increases exponentially, and breakthroughs in high-performance electronic systems increasingly depend on the ability to safely dissipate excess heat. Microfluidic cooling technology, focusing on liquid working fluids and microscale features, has become a focus of chip thermal design. However, micropump devices fabricated using microfluidic cooling technology suffer from large footprints, are unsuitable for the miniaturized, small-size, and lightweight design requirements of some thin and light electronic devices, and have low heat dissipation efficiency. Summary of the Invention

[0003] This disclosure provides a micropump device, a heat dissipation device, and an electronic device that can meet the requirements of thin and light electronic device design.

[0004] The technical solutions provided in this disclosure are as follows:

[0005] In a first aspect, embodiments of this disclosure provide a micropump device, including:

[0006] A microchannel substrate and a vibrating substrate are stacked together. The microchannel substrate has a first surface facing the vibrating substrate. The first surface is provided with a pump chamber, a fluid inlet, and a fluid outlet. The pump chamber opens toward the vibrating substrate and includes a chamber bottom opposite to the opening and chamber sidewalls surrounding the chamber bottom. The fluid inlet and the fluid outlet communicate with the chamber sidewalls. The vibrating substrate at least covers the opening of the pump chamber.

[0007] A vibration exciter connected to the vibration base plate, wherein the vibration base plate is capable of vibrating under the drive of the vibration exciter, so as to cause the cavity volume of the pump chamber to change periodically.

[0008] For example, a one-way guide valve microchannel structure is also provided at the fluid outlet and / or the fluid inlet.

[0009] For example, the unidirectional valve microchannel structure includes at least one unidirectional conduction unit; wherein, the unidirectional conduction unit includes:

[0010] The first DC channel, the compression channel, and the second DC channel are sequentially connected along a predetermined straight direction; and

[0011] A return flow bend, wherein the inlet end of the return flow bend is connected to the compression flow channel, and the outlet end of the return flow bend is connected to the first direct flow channel, so that the unidirectional guide valve microchannel structure is formed as a Tesla valve structure.

[0012] For example, when the Tesla valve structure is provided at the fluid inlet, the fluid inlet extends from the pump chamber along the predetermined straight direction and connects to the second DC channel or the first DC channel; when the Tesla valve structure is provided at the fluid outlet, the fluid inlet extends from the pump chamber along the predetermined straight direction and connects to the first DC channel.

[0013] For example, the unidirectional valve microchannel structure includes N unidirectional conduction units, and the N unidirectional conduction units are connected sequentially along the predetermined straight line direction, where N is an integer greater than or equal to 2.

[0014] For example, the unidirectional valve microchannel structure is integrated on the microchannel substrate and arranged on the first surface.

[0015] For example, the microchannel substrate includes a first substrate portion and a second substrate portion, the pump chamber, the fluid inlet and the fluid outlet are all arranged in the first substrate portion, the one-way valve microchannel structure is arranged in the second substrate portion, and the second substrate portion extends from the edge of the first substrate portion in a direction away from the first substrate portion.

[0016] For example, the first substrate portion includes a central region and a peripheral region surrounding the central region, the pump chamber is located in the central region, and the fluid inlet and the fluid outlet are located in the peripheral region; wherein the pump chamber is a circular or square chamber, and the peripheral region is an annular region surrounding the periphery of the pump chamber.

[0017] For example, the inner diameter of the pump chamber is a, the radial width of the outer perimeter is b, and 3b≤a≤18b.

[0018] For example, the fluid inlet and the fluid outlet are configured as the same inlet / outlet, and the one-way guide valve microchannel structure is provided at this inlet / outlet; or,

[0019] The fluid inlet and the fluid outlet are independent of each other, and the fluid inlet and the fluid outlet are located on the same side of the outer periphery of the bottom of the chamber, or distributed on different sides of the outer periphery of the bottom of the chamber, and at least one of the fluid outlets is provided with the one-way guide valve microchannel structure.

[0020] For example, the thickness of the microchannel substrate in the direction perpendicular to the first surface is 0.3±0.1mm, the depth of the pump chamber, the fluid inlet and the fluid outlet in the direction perpendicular to the first surface is 0.15±0.1mm, the thickness of the vibration substrate in the direction perpendicular to the first surface is 0.15±0.1mm, and the total thickness of the micropump device in the direction perpendicular to the first surface is less than or equal to 0.8mm.

[0021] As an example of a microchannel substrate, the vibration exciter is disposed on the side of the vibration substrate away from the microchannel substrate, and / or on the side of the vibration substrate close to the microchannel substrate.

[0022] Secondly, embodiments of this disclosure provide a heat dissipation device, which includes the micropump device described above.

[0023] Thirdly, embodiments of this disclosure provide an electronic device comprising: a chip; and a heat dissipation device as described above, wherein the heat dissipation device is disposed on one side of the chip.

[0024] The beneficial effects of the embodiments disclosed herein are as follows:

[0025] In the micropump device, heat dissipation device, and electronic device provided in the embodiments of this disclosure, the micropump device includes a microchannel substrate, a vibrating substrate, and a vibration exciter. The microchannel substrate has a first surface facing the vibrating substrate. The first surface is provided with a pump chamber, a fluid inlet, and a fluid outlet. The pump chamber opens toward the vibrating substrate and includes a chamber bottom opposite to the opening and chamber sidewalls surrounding the chamber bottom. The fluid inlet and the fluid outlet are both microchannels and communicate with the chamber sidewalls. The vibrating substrate at least covers the opening of the pump chamber. The vibrating substrate can vibrate under the drive of the vibration exciter to make the cavity volume of the pump chamber change periodically, thereby achieving the purpose of continuously pumping fluid.

[0026] In the above solution, by setting the pump chamber, the fluid inlet, and the fluid outlet on the first surface of the microfluidic substrate, the depths of the pump chamber, the fluid inlet, and the fluid outlet in the microfluidic substrate can all be made smaller, thereby reducing the substrate thickness in the direction perpendicular to the first surface. Furthermore, the fluid inlet and the fluid outlet are connected to the side wall of the pump chamber. In other words, by arranging the fluid inlet and outlet on the side of the micropump device, a side-blowing micropump device can be formed. Thus, it is not necessary to reserve jet space for the fluid in the direction perpendicular to the first surface. This is beneficial for reducing the arrangement space reserved for the micropump device in electronic devices, thereby meeting the design requirements of miniaturized, small-sized, and lightweight electronic devices. Attached Figure Description

[0027] Figure 1 This is a top view of a micropump device provided in some embodiments of the present disclosure;

[0028] Figure 2 express Figure 1 Sectional view along line E-E';

[0029] Figure 3 This diagram illustrates the structure of the microchannel substrate in the micropump device provided in some embodiments of this disclosure.

[0030] Figure 4 A schematic diagram of a microchannel structure representing a unidirectional conduction unit;

[0031] Figure 5 The figure shows the simulation results obtained by using the multiphysics simulation software Comsol to perform multiphysics joint simulation of piezoelectricity and fluid-structure interaction to simulate and evaluate the actual heat dissipation effect of the micropump device in some embodiments of this disclosure.

[0032] Figure 6 This is one of the schematic diagrams showing the structure of the microchannel substrate in the micropump device provided in this disclosure;

[0033] Figure 7 This is the second schematic diagram showing the structure of the microchannel substrate in the micropump device provided in this disclosure;

[0034] Figure 8 This is the third schematic diagram showing the structure of the microchannel substrate in the micropump device provided in this disclosure;

[0035] Figure 9 This is the fourth schematic diagram showing the structure of the microchannel substrate in the micropump device provided in this disclosure. Detailed Implementation

[0036] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0037] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms “an,” “a,” or “the,” and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms “including,” “comprising,” or “containing,” and similar terms mean that the element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. The terms “connected,” “linked,” or similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. The terms “upper,” “lower,” “left,” and “right,” etc., are used only to indicate relative positional relationships, and these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0038] Before providing a detailed description of the micropump device, heat dissipation device, and electronic device provided in the embodiments of this disclosure, the following description of the related technologies is provided:

[0039] In related technologies, with the development of thinner and lighter electronic devices, traditional cooling systems such as fan cooling or external heat sinks can meet the heat dissipation requirements of high heat flux density electronic components, but they can no longer meet the thinner and lighter requirements of some high-performance thin and light electronic devices.

[0040] Synthetic jet cooling, as an active heat dissipation control technology, boasts advantages such as high control efficiency, simple structure, and easy deployment. Micro-pump cooling systems based on synthetic jet cooling are one of the cooling technologies for high heat flux density electronic components. The principle of synthetic jet cooling is that by periodically blowing fluid out and drawing it into an excitation chamber, a series of vortex rings or vortex pairs are induced at the fluid inlet and outlet. During the formation and downstream convection of these vortex rings or vortex pairs, they continuously entrain surrounding fluid through induction, thereby controlling the flow field.

[0041] Synthetic jets, as an active heat dissipation control technology, can be applied to heat dissipation of electronic components and other fields. It can improve heat dissipation efficiency and enhance heat dissipation effect faster and more efficiently. Compared with traditional heat dissipation devices such as fans, it has the characteristics of being thin, light, small in size, easy to integrate, and low in noise.

[0042] Synthetic jet micropumps can be categorized into piston-driven actuators and diaphragm vibration actuators. Based on the presence or absence of a movable valve, they are further classified into valved micropumps and valveless micropumps. Valved micropumps offer advantages such as simple operating principles, mature manufacturing processes, ease of control, and good reverse shut-off performance. However, they also have significant disadvantages: the presence of the valve necessitates advanced manufacturing processes, resulting in complex structures that hinder integration and miniaturization; valve fatigue is a concern, and backflow is unavoidable, leading to low pump efficiency.

[0043] Compared to valved micropumps, valveless micropumps have the following advantages: simple structure, easy processing and fabrication, can be made into planar structures, or directly integrated with microfluidic chips, facilitating the miniaturization and integration of micropumps; valveless micropumps utilize the characteristics of microfluidics to continuously pump fluids and can accurately detect and control flow rate.

[0044] However, in related technologies, synthetic jet micropump devices may include a pump chamber with a fluid inlet / outlet at the center of the bottom. Since the fluid inlet / outlet is located at the bottom of the pump chamber, a certain amount of space needs to be allocated in the vertical direction for the synthetic jet micropump device to function efficiently. This results in an excessively large vertical space required for the overall device structure. The main advantage of synthetic jet micropump devices in replacing traditional fans or heat sinks in electronic devices is their ultra-thin vertical dimension. Therefore, it is necessary to design a micropump device to meet the miniaturized, small-size, and lightweight design requirements of thin and light electronic devices.

[0045] This disclosure provides a micropump device, a heat dissipation device, and an electronic device that can meet the requirements of thin and light electronic device design.

[0046] like Figure 1 and Figure 2 As shown, the micropump device provided in this embodiment includes: a microchannel substrate 100 and a vibration substrate 200 stacked together; and a vibration exciter 300 connected to the vibration substrate 200.

[0047] The microchannel substrate 100 has a first surface 110 facing the vibrating substrate 200. The first surface 110 has a pump chamber 120, a fluid inlet 130, and a fluid outlet 140. The pump chamber 120 opens towards the vibrating substrate 200 and includes a chamber bottom 121 opposite to the opening and chamber sidewalls 122 surrounding the chamber bottom 121. The fluid inlet 130 and the fluid outlet 140 communicate with the chamber sidewalls 122. The vibrating substrate 200 at least covers... For example, the opening of the pump chamber 120 is such that the vibrating substrate 200 completely covers the first surface 110 of the microchannel substrate 100, and the inlet of the fluid inlet 130 and the outlet of the fluid outlet 140 face the side of the microchannel substrate 100; the vibration exciter 300 is connected to the vibrating substrate 200, and the vibrating substrate 200 acts as a vibrating diaphragm, which can vibrate under the drive of the vibration exciter 300, so that the cavity volume of the pump chamber 120 changes periodically, thereby achieving the purpose of continuously pumping in and out fluid.

[0048] In the above solution, by providing the pump chamber 120, the fluid inlet 130, and the fluid outlet 140 on the first surface 110 of the microfluidic substrate 100, the depths of the pump chamber 120, the fluid inlet 130, and the fluid outlet 140 in the microfluidic substrate 100 can all be made smaller, thereby reducing the substrate thickness in the direction perpendicular to the first surface 110. Furthermore, the fluid inlet 130 and the fluid outlet 140 are connected to the chamber sidewall 122 of the pump chamber 120. In other words, by arranging the fluid inlet and outlet on the side of the micropump device, a side-blowing micropump device can be formed. Thus, it is not necessary to reserve jet space for the fluid in the direction perpendicular to the first surface 110, which is beneficial to reduce the arrangement space reserved for the micropump device in the electronic device when it is placed on the electronic device, thereby meeting the design requirements of miniaturization, small size, and thinness of the electronic device.

[0049] It should be noted that the vibration substrate 200 can be an elastic substrate, which can generate a corresponding elastic deformation response under the excitation of the vibration exciter 300, so that fluid is periodically pumped in and out from the side of the micropump device, and the generated high-speed airflow plays a good heat dissipation role in space.

[0050] In some exemplary embodiments, the vibration exciter 300 can be any suitable vibration exciter such as a piezoelectric exciter or an acoustic exciter. For example, when the vibration exciter 300 uses a piezoelectric exciter, the micropump device is configured as a piezoelectric-driven micropump device, and its working principle can be to drive the thin film to vibrate based on the piezoelectric properties of the piezoelectric material to achieve fluid pumping.

[0051] Piezoelectric materials are crystalline materials that exhibit a voltage between their two ends when subjected to pressure. For example, the piezoelectric material may include any suitable material such as a piezoelectric sheet, a PZT (active piezoelectric ceramic) piezoelectric stack, or a piezoelectric thin film.

[0052] The advantages of using piezoelectric drive in the vibration exciter 300 are its simple structure, large driving force, short response time, low energy consumption, and high efficiency. It is understood that the vibration exciter 300 is not limited to the piezoelectric exciter described above.

[0053] In addition, such as Figure 2 As shown, in some exemplary embodiments, the vibration actuator 300 is disposed on the side of the vibration substrate 200 away from the microchannel substrate 100. Thus, the vibration actuator 300 can drive the vibration substrate 200 to vibrate, periodically changing the volume of the pump chamber 120, and the vibration actuator 300 does not occupy the longitudinal (direction perpendicular to the first surface 110) space of the pump chamber 120, which helps to reduce the longitudinal dimension of the pump chamber 120.

[0054] However, it is understood that the arrangement of the vibration exciter 300 is not limited to this. For example, in other embodiments not shown, the vibration exciter 300 may also be arranged on the side of the vibration substrate 200 near the microchannel substrate 100.

[0055] Furthermore, the number of vibration exciters 300 is not limited. Figure 2 In the illustrated embodiment, there may be one vibration actuator 300. However, in other embodiments not shown, there may be two or more vibration actuators 300. For example, when there are two or more vibration actuators 300, one of the vibration actuators 300 may be located on the side of the vibration substrate 200 away from the microchannel substrate 100, and the other may be located on the side of the vibration substrate 200 closer to the microchannel substrate 100.

[0056] Furthermore, in some exemplary embodiments, such as Figure 2 As shown, a connecting substrate 400 may also be provided between the vibration exciter 300 and the vibration substrate 200, and the connecting substrate 400 can transmit the vibration of the vibration exciter 300 to the vibration substrate 200.

[0057] For example, the connecting substrate 400 and the vibration substrate 200 can be made of the same material to effectively transmit the vibration of the vibration exciter 300 to the vibration substrate 200.

[0058] It is understood that in other embodiments, the vibration exciter 300 may also be directly connected to the vibration substrate 200. In practical applications, the choice of whether or not to include the connecting substrate 400 can be made based on the heat dissipation effect of the micropump device.

[0059] Furthermore, in some exemplary embodiments, such as Figure 3 As shown, a one-way flow valve microchannel structure 500 is also provided at the fluid outlet 140 and / or the fluid inlet 130. By setting the one-way flow valve microchannel structure 500, the problem of fluid backflow can be solved, and the flow rate is more stable, the jet velocity is faster, the directional transport of fluid is realized, the pumping efficiency of the micropump device is improved, and the heat dissipation effect is enhanced.

[0060] For example, when the one-way flow valve microchannel structure 500 is disposed at the fluid inlet 130, the fluid can be directionally drawn into the pump chamber 120 through the fluid inlet 130 under the entrainment effect of the high-speed jet, thereby realizing the directional transport of the fluid; when the one-way flow valve microchannel structure 500 is disposed at the fluid outlet 140, the fluid can be directionally blown out of the pump chamber 120 through the fluid inlet 130 under the entrainment effect of the high-speed jet, thereby realizing the directional transport of the fluid.

[0061] like Figure 3 As shown, in some exemplary embodiments, the unidirectional valve microchannel structure 500 includes at least one unidirectional conduction unit 510. Please refer to... Figure 4 As shown, the unidirectional conduction unit 510 includes: a first DC channel 511, a compression channel 512, a second DC channel 513, and a return flow bend 514. The first DC channel 511, the compression channel 512, and the second DC channel 513 are connected sequentially along a predetermined straight direction. There is at least one return flow bend 514, and the inlet end of the return flow bend 514 is connected to the compression channel 512, and the outlet end of the return flow bend 514 is connected to the first DC channel 511, so that the unidirectional conduction valve microchannel structure 500 is formed as a Tesla valve structure.

[0062] The first direct current channel 511 is used to guide the forward-flowing fluid, the return flow bend 514 is used to collect the fluid that is blocked and flows back downstream of the flow field, and then merges back into the main flow through the return flow bend 514. The second direct current channel 513 is located downstream of the Tesla valve structure and is used to collect and stabilize the fluid from the Tesla valve structure, which helps to stabilize the downstream flow field.

[0063] In the above solution, the unidirectional nature of the Tesla valve solves the problem of jet backflow. The backflow bend 514 allows the backflow portion to rejoin the main flow, ensuring full utilization of the jet energy and guaranteeing downstream flow. Furthermore, the Tesla valve structure can accelerate the jet flow from the fluid outlet 140 of the micropump device, improving the overall heat dissipation capacity of the device during side-blowing and enhancing the side-blowing jet effect of the side-blowing micropump device.

[0064] For example, such as Figure 4 As shown, a unidirectional flow unit 510 may include two return bends 514, and the two return bends 514 are located on opposite sides of the compression flow channel 512.

[0065] It should be noted that in the above embodiments, the one-way valve microchannel structure 500 is a Tesla valve structure, but it is not limited to this.

[0066] Furthermore, in some exemplary embodiments, as shown in the figure, when the Tesla valve structure is provided at the fluid inlet 130, the fluid inlet 130 extends from the pump chamber 120 along the predetermined straight direction and connects to the second direct current channel 513. In other words, the fluid inlet 130 connects to the second direct current channel 513, and the fluid inlet 130 is a direct current channel extending along the predetermined straight direction. This reduces the phenomenon of backflow due to fluid being blocked by the flow channel sidewall of the fluid inlet 130.

[0067] Furthermore, it should be noted that the unidirectional flow of the microchannel structure 500 refers to the flow rate in one direction being greater than the flow rate in the opposite direction, rather than completely blocking the fluid in the opposite direction. Therefore, when the unidirectional flow valve microchannel structure 500 is provided at the fluid inlet 130, the fluid inlet 130 can also extend from the pump chamber 120 to the first direct current channel 511 along the predetermined straight line direction. In this case, the fluid inlet 130 effectively serves as both a fluid outlet 140 and a fluid outlet, allowing for both pumping in and out of the fluid.

[0068] In some embodiments, such as Figure 3 and Figure 4 As shown, when the Tesla valve structure is provided at the fluid outlet 140, the fluid inlet 130 extends from the pump chamber 120 along the predetermined straight direction and connects to the first direct current channel 511. In other words, the fluid outlet 140 connects to the first direct current channel 511, and the fluid inlet 130 is a direct current channel extending along the predetermined straight direction. This reduces the phenomenon of backflow caused by fluid being blocked by the flow channel sidewall of the fluid outlet 140.

[0069] It is understood that in other embodiments, the fluid inlet 130 and the fluid outlet 140 may not be limited to a straight channel structure extending along the predetermined straight direction, but may also be constructed as other shaped channels with oblique channel sidewalls inclined relative to the predetermined straight direction.

[0070] Furthermore, in some exemplary embodiments of this disclosure, such as Figure 3 As shown, the unidirectional valve microchannel structure 500 includes N unidirectional conduction units 510, and the N unidirectional conduction units 510 are connected sequentially along the predetermined straight line direction, where N is an integer greater than or equal to 2.

[0071] The specific value of N can be reasonably selected based on the assembly space of the entire micropump device and the heat dissipation requirements of the micropump device. Specifically, considering that the micropump device needs to be assembled with other components in application, its lateral dimension (i.e., the direction parallel to the first surface 110) should not be too large. In order to achieve a small size design of the entire device, the smaller the value of N, the better, so that the space occupied by the device in the lateral direction is smaller. However, if N is too small, it may not be able to meet the requirements of jet velocity, flow rate, etc. at the fluid outlet 140, that is, it may not be able to meet the heat dissipation requirements. In this case, the value of N can be appropriately increased to achieve the expected heat dissipation effect while minimizing the space occupied by the entire device.

[0072] For example, N can be equal to 6, but it is not limited to this. Figure 5 As shown, with the Tesla valve structure installed at the fluid outlet 140 and N equal to 6, the performance of the micropump device was simulated and verified. Specifically, the piezoelectric and fluid-structure interaction multiphysics joint simulation was performed using the multiphysics simulation software Comsol to simulate and evaluate the actual heat dissipation effect of the micropump device. Specific simulation results are presented below. Figure 5 As shown.

[0073] Depend on Figure 5 The simulation results show that the micropump device can generate a side-blown jet under the action of the vibration exciter 300, and the velocity at the jet outlet is above 1 m / s. According to the simulation results, the maximum velocity at the jet outlet can reach 15 m / s, which indicates that the micropump device has good heat dissipation performance.

[0074] Furthermore, in some exemplary embodiments, such as Figure 3 As shown, the unidirectional valve microchannel structure 500 is integrated on the microchannel substrate 100 and arranged on the first surface 110. That is to say, the unidirectional valve microchannel structure 500 is also a microchannel arranged on the first surface 110, which results in higher structural integration and simpler molding process.

[0075] It is understood, of course, that in other embodiments, the unidirectional valve microchannel structure 500 may also be disposed on another substrate independent of the microchannel substrate 100.

[0076] In some exemplary embodiments, such as Figure 3 As shown, the microchannel substrate 100 includes a first substrate portion 100A and a second substrate portion 100B. The pump chamber 120, the fluid inlet 130 and the fluid outlet 140 are all arranged in the first substrate portion 100A. The one-way valve microchannel structure 500 is arranged in the second substrate portion 100B, and the second substrate portion 100B extends from the edge of the first substrate portion 100A in a direction away from the first substrate portion 100A.

[0077] Thus, the microchannel substrate 100 is a single substrate, and the second substrate portion 100B may be formed by extending from the edge of the first substrate portion 100A in a direction away from the first substrate portion 100A.

[0078] For example, the first substrate portion 100A includes a central region S1 and a peripheral region S2 surrounding the central region S1. The pump chamber 120 is located in the central region S1, and the fluid inlet 130 and the fluid outlet 140 are located in the peripheral region S2. The pump chamber 120 can be a circular or square chamber, and the peripheral region S2 is an annular area surrounding the pump chamber 120.

[0079] As shown in the figure, the pump chamber 120 is a circular chamber, and the first substrate portion 100A is a circular substrate adapted to the shape of the pump chamber 120. It should be noted that the shape of the pump chamber 120 is not limited to circular or square, but can be any other suitable shape such as a polygon.

[0080] For example, the inner diameter of the pump chamber 120 is 'a', and the radial width of the outer perimeter area S2 is 'b'. The relationship between 'a' and 'b' satisfies the following formula: 3b ≤ a ≤ 18b. However, this is not a limitation.

[0081] For example, the inner diameter a of the pump chamber 120 can be 16±5mm, the outer diameter of the first base plate portion 100A can be (15.25±3.05)mm to (29.15±5.85)mm, and the radial width b of the peripheral area S2 can be (2.14±1.53)mm to (4.1±2.9)mm.

[0082] By adopting the above solution and rationally designing the dimensions of the pump chamber 120 and the first substrate portion 100A in the microchannel substrate 100, a better heat dissipation effect can be obtained, but it is not limited thereto.

[0083] Furthermore, in some exemplary embodiments, such as Figure 2 As shown, the thickness d1 of the microchannel substrate in the direction perpendicular to the first surface 110 is 0.3±0.1mm, the depth h of the pump chamber 120, the fluid inlet 130 and the fluid outlet 140 in the direction perpendicular to the first surface 110 is 0.15±0.1mm, the thickness d2 of the vibration substrate 200 in the direction perpendicular to the first surface 110 is 0.15±0.1mm, and the total thickness D of the micropump device in the direction perpendicular to the first surface 110 is less than or equal to 0.8mm.

[0084] By adopting the above-described scheme, the dimensions of each component of the entire micropump device are optimized, thereby achieving the goal of reducing the overall vertical spatial dimension of the device while obtaining the expected heat dissipation effect. However, the dimensional parameters of each component in the micropump device are not limited to this.

[0085] Furthermore, in some exemplary embodiments, the microchannel width of any one of the fluid outlet 140, the fluid inlet 130, and the one-way valve microchannel structure 500 may be approximately equal, for example, 0.3 ± 0.1 mm. However, this is not a limitation.

[0086] Furthermore, in the micropump device provided in this disclosure embodiment, the fluid outlet 140 and the fluid inlet 130 can be implemented through only one inlet and outlet, or they can be independent of each other.

[0087] In some exemplary embodiments, such as Figure 7 As shown, the fluid inlet 130 and the fluid outlet 140 are constructed as the same inlet and outlet, and the one-way guide valve microchannel structure 500 is provided at the inlet and outlet.

[0088] It should be noted that the unidirectional flow of the microchannel structure 500 means that the flow rate in one direction is greater than the flow rate in the other direction, rather than completely blocking the fluid in the other direction. Therefore, when the unidirectional flow valve microchannel structure 500 is provided at the inlet and outlet, the fluid can also achieve the purpose of pumping fluid into and out of the micropump device on one side through the inlet and outlet.

[0089] Furthermore, since the micropump device needs to be assembled with other components in application, when the micropump device realizes fluid pumping in and pumping out on one side, the micropump device only needs to reserve flow field space on the side where the jet is located, and no space needs to be reserved on the other sides. It is suitable for scenarios where the lateral space dimension of the micropump device is small.

[0090] In another exemplary embodiment, the fluid inlet 130 and the fluid outlet 140 are independent of each other, and the fluid inlet 130 and the fluid outlet 140 are located on the same side of the outer periphery of the bottom 121 of the chamber, and at least one of the fluid outlets 140 is provided with the one-way valve microchannel structure 500.

[0091] It should be noted that the fluid inlet 130 and the fluid outlet 140 are located on the same side of the outer periphery of the chamber bottom 121. This can mean that a first line is drawn from the fluid inlet 130 to the center of the chamber bottom 121, and a second line is drawn from the fluid inlet 130 to the center of the chamber bottom 121. The angle between the first and second lines can be within a first threshold. For example, the first threshold can be greater than 0 and less than or equal to 60°.

[0092] In another exemplary embodiment, such as Figure 6 As shown, the fluid inlet 130 and the fluid outlet 140 are independent of each other, and the fluid inlet 130 and the fluid outlet 140 are distributed on different sides of the outer periphery of the bottom of the chamber 121, and at least one of the fluid outlets 140 is provided with the one-way valve microchannel structure 500.

[0093] It should be noted that the fluid inlet 130 and the fluid outlet 140 are distributed on different sides of the outer periphery of the chamber bottom 121. Specifically, a first line can be drawn from the fluid inlet 130 to the center of the chamber bottom 121, and a second line can be drawn from the fluid inlet 130 to the center of the chamber bottom 121. The angle between the first and second lines can be greater than or equal to a second threshold. For example, the second threshold can be 60°.

[0094] Specifically, in some embodiments, such as Figure 6 As shown, the fluid inlet 130 and the fluid outlet 140 are respectively located on opposite sides of the pump chamber 120, and the one-way valve microchannel structure 500 is not provided at the fluid inlet 130, but is provided at the fluid outlet 140.

[0095] At this time, the micropump device can realize fluid pumping in on one side and fluid pumping out on the other side, which is beneficial for directional fluid delivery. Considering that the micropump device needs to be assembled with other components in the application, when the micropump device realizes fluid pumping in and out on both sides, space needs to be reserved on both sides of the micropump device. This is suitable for scenarios where the lateral reserved space of the micropump device is large.

[0096] Furthermore, in other embodiments, such as Figure 8 As shown, the fluid inlet 130 and the fluid outlet 140 are respectively located on opposite sides of the pump chamber 120, and the one-way guide valve microchannel structure 500 is provided at both the fluid inlet 130 and the fluid outlet 140.

[0097] Furthermore, for example, please see Figure 8 As shown, the fluid inlet 130 and the fluid outlet 140 are respectively connected to the first direct current channel 511 in the corresponding one-way valve microchannel structure 500. At this time, the fluid inlet 130 and the fluid outlet 140 can both be regarded as inlets and outlets that can simultaneously realize fluid pumping in and pumping out.

[0098] Considering that the micropump device needs to be assembled with other components in the application, when the micropump device realizes fluid pumping in and pumping out on both sides, space needs to be reserved on both sides of the micropump device. This is suitable for scenarios where the lateral reserved space of the micropump device is large.

[0099] It should be noted that, in other embodiments, when both the fluid inlet 130 and the fluid outlet 140 are provided with the one-way flow valve microchannel structure 500, the fluid inlet 130 can also be connected to the second direct current channel 513 in the corresponding one-way flow valve microchannel structure 500, so as to facilitate the directional pumping of fluid into the pump chamber 120; the fluid outlet 140 can be connected to the first direct current channel 511 in the corresponding one-way flow valve microchannel structure 500, so as to facilitate the directional pumping of fluid out of the pump chamber 120.

[0100] Furthermore, in other embodiments, such as Figure 9 As shown, the total number of fluid inlets 130 and fluid outlets 140 can be more than two, for example... Figure 9 The fluid inlet 130 and the fluid outlet 140 shown have a total of 4, and are evenly distributed along the circumference of the pump chamber 120. At least one of the fluid outlets 140 is provided with the one-way guide valve microchannel structure 500.

[0101] For example, each of the fluid inlets 130 and fluid outlets 140 is provided with the one-way valve microchannel structure 500, but this is not a limitation. In other embodiments, the one-way valve microchannel structure 500 may be provided only at some of the fluid outlets 140. In practical applications, it can be reasonably arranged in combination with the assembly space and heat dissipation performance requirements of the micropump device.

[0102] Furthermore, in some exemplary embodiments, the fluid inlet 130 and the fluid outlet 140 are respectively connected to the first direct current channel 511 in the corresponding one-way valve microchannel structure 500. In this case, the fluid inlet 130 and the fluid outlet 140 can both be regarded as inlets and outlets that can simultaneously realize fluid pumping in and pumping out.

[0103] Considering that the micropump device needs to be assembled with other components in the application, when the micropump device realizes fluid pumping in and pumping out on both sides, space needs to be reserved on both sides of the micropump device. This is suitable for scenarios where the lateral reserved space of the micropump device is large.

[0104] It should be noted that, in other embodiments, when both the fluid inlet 130 and the fluid outlet 140 are provided with the one-way flow valve microchannel structure 500, the fluid inlet 130 can also be connected to the second direct current channel 513 in the corresponding one-way flow valve microchannel structure 500, so as to facilitate the directional pumping of fluid into the pump chamber 120; the fluid outlet 140 can be connected to the first direct current channel 511 in the corresponding one-way flow valve microchannel structure 500, so as to facilitate the directional pumping of fluid out of the pump chamber 120.

[0105] Furthermore, it should be noted that the first substrate portion 100A can be configured as a substrate adapted to the shape of the pump chamber 120, such as a circular or square substrate; the number and shape of the second substrate portions 100B are adapted to the arrangement number and position of the one-way valve microchannel structure 500.

[0106] For example: Figure 6 to Figure 8 As shown, the second substrate portion 100B may be a strip-shaped extended substrate formed by radially extending outward from the edge of the first substrate portion 100A, and one of the one-way valve microchannel structures 500 corresponds to one second substrate portion 100B; as Figure 9 As shown, the second substrate portion 100B may also be an annular substrate formed by radially extending outward from the edge of the first substrate portion 100A, and the plurality of the unidirectional guide valve microchannel structures 500 are arranged on the annular substrate.

[0107] In summary, the micropump device provided in this disclosure is characterized by its miniaturization and thinness, providing an active heat dissipation solution for high-performance, thin and light electronic devices such as laptops and tablets.

[0108] Furthermore, embodiments of this disclosure provide a heat dissipation device, which includes the micropump device provided in embodiments of this disclosure.

[0109] Furthermore, this disclosure also provides an electronic device, which includes: a chip; and a heat dissipation device provided in this disclosure, wherein the heat dissipation device is disposed on one side of the chip.

[0110] Obviously, the heat dissipation device and electronic device provided in the embodiments of this disclosure also have the beneficial effects brought by the micropump device provided in the embodiments of this disclosure, and will not be described in detail here.

[0111] The following points need to be explained:

[0112] (1) The accompanying drawings of the embodiments of this disclosure only involve the structures involved in the embodiments of this disclosure. Other structures can be referred to the general design.

[0113] (2) For clarity, the thickness of layers or regions is enlarged or reduced in the drawings used to describe embodiments of the present disclosure, i.e., these drawings are not drawn to actual scale. It will be understood that when an element such as a layer, film, region or substrate is referred to as being “above” or “below” another element, the element may be “directly” located “above” or “below” the other element or there may be intermediate elements.

[0114] (3) Where there is no conflict, the embodiments of this disclosure and the features in the embodiments can be combined with each other to obtain new embodiments.

[0115] The above are merely specific embodiments of this disclosure, but the scope of protection of this disclosure is not limited thereto. The scope of protection of this disclosure shall be determined by the scope of the claims.

Claims

1. A micropump device, characterized by The application relates to a micro-fluid channel structure. The micro-fluid channel structure comprises: a micro-fluid channel substrate and a vibration substrate which are stacked, the micro-fluid channel substrate has a first surface facing the vibration substrate, the first surface is provided with a pump chamber, a fluid inlet and a fluid outlet, the pump chamber is open to the vibration substrate, the pump chamber comprises a cavity bottom opposite to the opening and a cavity side wall surrounding the cavity bottom, the fluid inlet and the fluid outlet are communicated to the cavity side wall, and the vibration substrate covers at least the opening of the pump chamber; 2. The micropump device according to claim 1, characterized in that a vibration exciter connected to the vibration substrate, the vibration substrate can vibrate under the driving of the vibration exciter to periodically change the cavity volume of the pump chamber.

3. The micropump device according to claim 2, characterized in that A one-way valve micro-fluid channel structure is further arranged at the fluid outlet and / or the fluid inlet. The one-way valve micro-fluid channel structure comprises at least one one-way valve unit, wherein the one-way valve unit comprises: a first straight channel, a compression channel and a second straight channel which are sequentially communicated along a predetermined straight line direction; and 4. The micropump device according to claim 3, characterized in that a backflow bend, an inlet end of the backflow bend is communicated to the compression channel, and an outlet end of the backflow bend is communicated to the first straight channel, so that the one-way valve micro-fluid channel structure is formed into a Tesla valve structure.

5. The micropump device of claim 3, wherein When the fluid inlet is provided with the Tesla valve structure, the fluid inlet extends from the pump chamber to the second straight channel or the first straight channel along the extension direction of the predetermined straight line direction; when the fluid outlet is provided with the Tesla valve structure, the fluid inlet extends from the pump chamber to the first straight channel along the extension direction of the predetermined straight line direction.

6. The micropump device of claim 2, wherein, The one-way valve micro-fluid channel structure comprises N one-way valve units, and the N one-way valve units are sequentially communicated along the predetermined straight line direction, and N is an integer greater than or equal to 2.

7. The micropump device according to claim 6, characterized in that The one-way valve micro-fluid channel structure is integrally arranged on the micro-fluid channel substrate and arranged on the first surface.

8. The micropump device according to claim 7, characterized in that The micro-fluid channel substrate comprises a first substrate part and a second substrate part, the pump chamber, the fluid inlet and the fluid outlet are arranged on the first substrate part, the one-way valve micro-fluid channel structure is arranged on the second substrate part, and the second substrate part extends from the edge of the first substrate part in a direction away from the first substrate part.

9. The micropump device according to claim 8, characterized in that The first substrate part comprises a middle area and a peripheral area surrounding the middle area, the pump chamber is located in the middle area, and the fluid inlet and the fluid outlet are located in the peripheral area; wherein the pump chamber is a circular or square cavity, and the peripheral area is an annular area surrounding the periphery of the pump chamber.

10. The micropump device of claim 2, wherein, The inner diameter of the pump chamber is a, the radial width of the peripheral area is b, and 3b<=a<=18b. The fluid inlet and the fluid outlet are configured as one outlet, and the one-way valve micro-fluid channel structure is arranged at the outlet; or The fluid inlet and the fluid outlet are independent of each other, and the fluid inlet and the fluid outlet are located on the same side of the periphery of the cavity bottom or distributed on different sides of the periphery of the cavity bottom, and the one-way valve micro-fluid channel structure is arranged at at least one fluid outlet.

11. The micropump device of claim 1, wherein, The thickness of the microfluidic substrate in the direction perpendicular to the first surface is 0.3±0.1 mm, the depth of the pump chamber, the fluid inlet and the fluid outlet in the direction perpendicular to the first surface is 0.15±0.1 mm, the thickness of the vibrating substrate in the direction perpendicular to the first surface is 0.15±0.1 mm, and the total thickness of the micro-pump device in the direction perpendicular to the first surface is less than or equal to 0.8 mm.

12. The micropump device of claim 1, wherein, The vibrating exciter is arranged on the side of the vibrating substrate away from the microfluidic substrate and / or on the side of the vibrating substrate close to the microfluidic substrate.

13. A heat dissipating device characterized by comprising: A micro-pump device comprising any one of claims 1 to 12.

14. An electronic device, comprising: A micro-pump device comprising: a chip; and a heat dissipation device as claimed in claim 13, wherein the heat dissipation device is arranged on one side of the chip.

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