Photon cooling CPO switch

Abstract

The invention relates to the technical field of CPO switch cooling, in particular to a photon cooling CPO switch which comprises a switch mainboard, a switch main control chip, a laser, a first photon film cold plate and a plurality of CPO optical modules. The switch main control chip is arranged at the central position of the top surface of the switch mainboard; the plurality of CPO optical modules are arranged on the top surface of the switch mainboard around the switch main control chip; the first photon film cold plate abuts against the switch main control chip and the top surfaces of the plurality of CPO optical modules. The first photon film cold plate can detect the hot spot position of the switch main control chip or the CPO optical module, and laser is emitted to the first photon film cold plate through the laser device so as to carry out photon refrigeration. The hot spot position of the switch main control chip or the CPO optical module is detected through the first photon film cold plate, and the laser is emitted to the first photon film cold plate through the laser to perform photon refrigeration, so that accurate refrigeration of the hot spot is realized, and the dead angle hot spot is effectively eliminated.

Description

Technical Field

[0001] This invention relates to the field of CPO switch cooling technology, and specifically to a photonic-cooled CPO switch. Background Technology

[0002] The essence of CPO technology is to move the optical engine out of the pluggable optical module and package it more tightly next to the switch chip (ASIC). This brings huge advantages in energy efficiency and bandwidth, but also brings unprecedented heat dissipation challenges.

[0003] Firstly, heat is concentrated and difficult to dissipate: this is the core challenge. In 3D stacking, multiple high-power chips are stacked together, resulting in a huge total heat generation. More importantly, the heat is confined within the narrow stack. Traditional heat dissipation methods mainly rely on the top and bottom of the chip, but the 3D stacked IC structure means that the heat in the middle layer has no efficient dissipation path, like a "sandwich layer," making it extremely easy for heat to accumulate. Studies have shown that the power density of high-performance chips can reach the kilowatt-per-square-centimeter level. Furthermore, when the CPO optical module of the 3D stacked IC structure is connected to the LGS socket, the CPO's back contacts contact the LGA socket's pins, making it impossible to place components on this side, resulting in very little space for heat dissipation chips, as shown below. Figure 1 The existing internal heat dissipation method of CPO, which can only dissipate heat through the top of the CPO optical module, seriously affects the heat dissipation of the middle layer and bottom of the chip.

[0004] Secondly, temperature sensitivity: Optical components such as lasers and modulators are extremely sensitive to temperature. Temperature fluctuations can cause wavelength drift, decreased efficiency, or even failure. CPO requires optical components to be stabilized at a specific temperature (e.g., within ±3°C), which is much more demanding than cooling electronic chips (which can typically withstand much higher temperatures).

[0005] Third, the heat dissipation space is limited: traditional heat sinks, fans and thermal interface materials are difficult to work efficiently in such a compact package, and the heat conduction path also becomes very complicated.

[0006] Therefore, current CPO cooling solutions mainly rely on air cooling and system-level liquid cooling. For air cooling, high-speed fans blow air to dissipate heat from the chip. However, air has a very low specific heat capacity and thermal conductivity. When the heat flux density (heat generated per unit area) of the chip exceeds 50-100W / cm², air cooling basically reaches its limit and cannot effectively prevent the chip from overheating. In addition, air cooling also has problems such as high noise, high fan energy consumption, large fin space occupation, dust accumulation, and uneven cooling (creating cooling dead zones).

[0007] Liquid cooling involves coiling coolant into tubing on the chip's surface. However, water is a good conductor of electricity, and a leak can instantly cause expensive electronic equipment to short-circuit and burn out, resulting in significant economic losses and data loss. Secondly, the manufacturing and maintenance costs of liquid cooling are far higher than those of air cooling. Even if deionized water is used as the coolant, it can still corrode metal tubing over time, and microorganisms or algae can grow in the coolant, forming biofouling that blocks microchannels and reduces heat dissipation efficiency. Furthermore, the water-cooled plates, tubing, and coolant themselves significantly increase the weight of the equipment, placing higher demands on the load-bearing capacity of the cabinet and floor. Summary of the Invention

[0008] (a) Technical problems to be solved In view of the above-mentioned shortcomings and deficiencies of the prior art, the present invention provides a photonic-cooled CPO switch, which solves the technical problem that the existing air-cooling and liquid-cooling methods are difficult to meet the cooling requirements of CPO optical modules with 3D stacked IC structures.

[0009] (II) Technical Solution To achieve the above objectives, the photonic cooling CPO switch of the present invention includes a switch motherboard, a switch main control chip, a laser, a first photonic thin film cold plate, and multiple CPO optical modules. The main control chip of the switch is located at the center of the top surface of the switch motherboard; a plurality of CPO optical modules are arranged around the main control chip of the switch motherboard on the top surface of the switch motherboard; the first photonic thin film cold plate abuts against the top surface of the main control chip of the switch and the plurality of CPO optical modules; The first photonic thin-film cold plate can detect the hot spot location of the main control chip of the switch or the CPO optical module, and emit laser light into the first photonic thin-film cold plate through the laser to perform photonic cooling.

[0010] Optionally, the photonic cooling CPO switch further includes a CPO fixing bracket for fixing the first photonic thin film cold plate; The bottom end of the CPO mounting bracket is connected to the main control chip of the switch and the CPO optical module. The first photonic thin-film cold plate includes multiple photonic cold plates; each of the multiple photonic cold plates is snapped into the top of the CPO fixing bracket in a one-to-one correspondence.

[0011] Optionally, the photonic cold plate includes a receiving and reflecting layer, a cooling layer, and a thermal sensing layer that are sequentially bonded together vertically from top to bottom; The top of the receiving and reflecting layer is constructed as an array of multiple prisms; the prisms can focus the incoming laser onto the cooling layer; The cooling layer can absorb the laser light focused by the prism, perform photon cooling, and reflect high-energy light, which is emitted through the prism. The thermal sensing layer can detect the hotspot locations of the CPO optical module or the main control chip of the switch.

[0012] Optionally, the first photonic thin-film cold plate further includes a reflective layer; One side of the reflective layer is attached to the cooling layer, and the other side is attached to the thermal sensing layer; the reflective layer can reflect laser and high-energy light emitted through the cooling layer.

[0013] Optionally, the photonic cooling CPO switch further includes a thermal imaging display that is electrically connected to the laser and the thermal sensing layer; The thermal imaging display can acquire the hot spot area detected by the first photonic thin film cold plate and drive the laser to emit laser light towards one or more prisms above the hot spot area.

[0014] Optionally, the CPO fixing bracket has a plurality of through first slots vertically along its upper edge; the top surface of the CPO fixing bracket has a plurality of second slots; the second slots are connected to the plurality of first slots. Multiple CPO optical modules are snapped into multiple first slots in a one-to-one correspondence, and multiple first photonic thin-film cold plates are snapped into multiple second slots in a one-to-one correspondence, so that the top surface of the CPO optical module abuts against the bottom surface of the first photonic thin-film cold plate.

[0015] Optionally, the laser is disposed above a plurality of the first photonic thin-film cold plates; the laser is capable of adjusting the wavelength of the emitted laser.

[0016] Optionally, the CPO optical module includes an optical fiber and multiple built-in heating devices and multiple second photonic thin-film cold plates; the photonic cooled CPO switch also includes an external laser source; Multiple second photonic thin-film cold plates are respectively disposed on multiple heating devices; one end of the optical fiber is connected to the second photonic thin-film cold plates connected in parallel with multiple waveguides, and the other end extends out of the CPO optical module and is connected to the external laser light source; The second photonic thin-film cold plate can detect the hot spot location of the heating device and emit laser light into the optical fiber through the external laser light source, so that the second photonic thin-film cold plate can perform photonic cooling.

[0017] Optionally, the second photonic thin-film cold plate is disposed on the side of the housing top plate of the heating device that is away from the CPO optical module.

[0018] Optionally, the photonic-cooled CPO switch further includes a switch housing; The switch motherboard, the switch main control chip, the laser, the first photonic thin-film cold plate, the CPO optical module, the external laser source, and the optical fiber are all built into the switch housing; The inner wall of the switch housing is coated with a radiation-absorbing and heat-dissipating coating.

[0019] (III) Beneficial Effects The beneficial effects of this invention are: Strong cooling capacity: below ambient temperature. Photonic cooling can "cool" the temperature of heat-generating devices inside the photonic cooled CPO switch, reducing the temperature below ambient temperature. It is highly adaptable to devices that are extremely sensitive to temperature.

[0020] High precision: point-to-point cooling. Photon cooling uses a laser beam to precisely cool a specific hot spot like a "scalpel" without affecting the temperature of the surrounding area, achieving precise cooling of the hot spot and effectively eliminating cooling dead zones.

[0021] High reliability and quiet operation: No moving parts. Photonic cooling consists only of optical paths, with no mechanical moving parts, resulting in an extremely long theoretical lifespan and complete silence, making it ideal for scenarios with stringent requirements for reliability and quiet operation. Furthermore, the response speed of the optical path is far superior to that of gases and liquids, allowing photonic-cooled CPO switches to more precisely control the temperature of heat-generating devices, meeting the needs of temperature-sensitive optical components.

[0022] Strong integration potential: on-chip and on-chip thermal management. Photonic cooling can be designed into micro-nano scale structures and integrated on the chip surface or even inside, which makes it possible to achieve "on-chip cooling" or "on-chip cooling", eliminating heat directly from the source and achieving efficient cooling of the CPO optical module 4 with a 3D stacked IC structure. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the photonic cooling CPO switch of the present invention; Figure 2 This is an exploded view of the photonic-cooled CPO switch of the present invention; Figure 3 This is a schematic diagram of the compound eye laser of the present invention emitting laser light onto the first photonic thin film cold plate; Figure 4 This is a schematic diagram of the structure of the photonic cold plate of the present invention; Figure 5 This is a schematic diagram of the CPO optical module of the present invention; Figure 6This is a schematic diagram of the CPO optical module of the present invention receiving an external laser source.

[0024] Explanation of reference numerals in the attached figures 1: Switch motherboard; 2: Switch main control chip; 3: First photonic thin-film cold plate; 31: Photonic cold plate; 311: Receiving and reflecting layer; 3111: Prism; 312: Cooling layer; 313: Thermal sensing layer; 314: Reflective layer; 4: CPO optical module; 41: Optical fiber; 42: Second photonic thin-film cold plate; 43: Chip; 44: DFB laser; 45: Photonic integrated chip; 46: Intermediate board; 47: PCB board; 48: FAU; 5: CPO mounting bracket; 51: First slot; 52: Second slot; 6: Thermal imaging display; 7: Compound eye laser; 8: External laser light source; 9: Switch housing. Detailed Implementation

[0025] To better explain and facilitate understanding of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0026] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0027] Furthermore, in this invention, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0028] In this invention, unless otherwise explicitly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "fixed" can mean a fixed connection, a detachable connection, or an integral part; "connection" can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0029] See Figures 1 to 3 This invention provides a photonic-cooled CPO switch, comprising a switch motherboard 1, a switch main control chip 2, a laser, a first photonic thin-film cold plate 3, and multiple CPO optical modules 4. The switch main control chip 2 is located at the center of the top surface of the switch motherboard 1. The multiple CPO optical modules 4 are arranged around the switch main control chip 2 on the top surface of the switch motherboard 1. The first photonic thin-film cold plate 3 is disposed on the top surface of the switch main control chip 2 and the multiple CPO optical modules 4. The first photonic thin-film cold plate 3 can detect the hot spots of the switch main control chip 2 or the CPO optical modules 4, and emit laser light into the first photonic thin-film cold plate 3 through the laser to perform photonic cooling. In this embodiment, the CPO optical modules 4 are 3D stacked IC structure CPO optical modules, and photonic cooling is achieved through the effective cooperation of the laser and the first photonic thin-film cold plate 3, thereby cooling the internal temperature of the CPO optical modules 4.

[0030] Photonic cooling is a type of laser cooling. Photonic cooling technology utilizes the principle of laser-induced anti-Stokes cooling to directly convert heat energy into light energy. Specifically, the anti-Stokes effect refers to the phenomenon where, when incident photons interact with molecules, some photons are scattered due to energy level transitions in molecular vibrations. If the energy of the scattered photons is higher than that of the incident photons (shorter wavelength), it is called anti-Stokes scattering; otherwise, it is called Stokes scattering. In the anti-Stokes process, molecules absorb energy from the outside (manifested as an increase in the energy of scattered photons), thereby lowering their own temperature. This utilizes the principle that materials absorb low-energy light and then emit high-energy light, thus cooling the material. Specifically, when a laser irradiates a special material, the ions in the material absorb the incident light, and combined with the material's lattice vibrations, trigger the emission of even higher-energy light. Unlike traditional heat dissipation methods, photonic cooling does not require cooling the entire chip; instead, it precisely targets the hot areas on the chip that need cooling. Photonic cooling differs significantly from traditional air cooling and water-cooled plate cooling in its underlying principles. This technology can keep the temperature of heat-generating devices below 50°C, while the temperature after cooling by traditional heat dissipation solutions is generally between 90°C and 120°C. This is because photon cooling converts waste heat into electrical energy. The heat-carrying high-energy light escapes from the chip, taking away the heat. Since the photon escape speed is extremely fast (nanosecond level), the heat is difficult to be reabsorbed by the chip material, thus achieving a rapid drop in local temperature.

[0031] Firstly, it has a strong cooling capacity: cooling below ambient temperature. Air cooling and water cooling plates only "dissipate heat," while photonic cooling is "cooling," enabling the temperature of heat-generating devices inside the photonic-cooled CPO switch to be reduced below ambient temperature. This capability is irreplaceable for devices that are extremely sensitive to temperature (such as lasers, qubits, and high-precision sensors).

[0032] Secondly, superior precision: point-to-point cooling. In modern chips, heat distribution is extremely uneven, creating fatal "hot spots," or heat dissipation dead zones. Air cooling and water cooling plates provide surface cooling, which is insufficient to address localized overheating; however, photonic cooling uses a laser beam, like a "scalpel," to precisely cool a specific hot spot without affecting the temperature of the surrounding area. This is a dream capability for the optical engine in a CPO (Content Processing Unit) located right next to the switching chip.

[0033] Thirdly, superior reliability and quiet operation: no moving parts. Fans wear out, water pumps fail, and pipes age and leak—these are all single points of failure in traditional cooling systems. Photonic cooling, however, consists only of optical paths, with no mechanical moving parts, resulting in an extremely long theoretical lifespan and complete silence, making it ideal for scenarios with stringent requirements for reliability and quiet operation. Furthermore, the response speed of the optical path is far superior to that of gases and liquids, allowing for immediate heat removal as hotspots form. This enables photonic-cooled CPO switches to more precisely control the temperature of heat-generating devices, meeting the needs of temperature-sensitive optical components.

[0034] Fourth, strong integration potential: on-chip and on-chip thermal management. Photonic cooling can be designed into micro-nano scale structures and integrated on the chip surface or even inside, which makes it possible to achieve "on-chip cooling" or "on-chip cooling", eliminating heat directly from the source and achieving efficient cooling of the CPO optical module 4 with a 3D stacked IC structure.

[0035] In this invention, the main control chip 2 of the switch is located at the center of the top surface of the main board 1 of the switch, and multiple CPO optical modules 4 are arranged around the main control chip 2 on the top surface of the main board 1 of the switch. This ring layout effectively concentrates the hot spots, making all the hot spots concentrated on the same horizontal plane, which facilitates the laser to irradiate the first photonic thin film cold plate 3. This allows the laser to cover all the hot spots inside the photonic cooling CPO switch, that is, to cover the top surface (laser receiving surface) of the first photonic thin film cold plate 3, thereby eliminating the purpose of laser irradiation dead zones.

[0036] The first photonic thin-film cold plate 3 is disposed on the top surface of the main control chip 2 of the switch and multiple CPO optical modules 4. The first photonic thin-film cold plate 3 can be fixed above the CPO optical modules 4 (or the main control chip 2 of the switch). By irradiating the first photonic thin-film cold plate 3 with a laser, the air temperature at the top surface of the CPO optical module 4 is reduced, thereby reducing the high temperature inside the CPO optical module 4. Preferably, the first photonic thin-film cold plate 3 is disposed in close contact with the top plate of the housing of the CPO optical module 4, eliminating the gap between the two through surface-to-surface contact, achieving the purpose of direct heat exchange, and effectively improving the cooling efficiency of the CPO optical module 4.

[0037] The hot spot location of the main control chip 2 or CPO optical module 4 of the switch is detected by the first photonic thin film cold plate 3, and the laser is guided to emit laser light towards the first photonic thin film cold plate 3 for photonic cooling. This achieves precise cooling of the hot spot, effectively reduces cooling energy consumption, and improves cooling efficiency.

[0038] The main control chip 2 and CPO optical modules 4 generate a large amount of heat during operation. A first photonic thin-film cold plate 3 is attached to the top surface of the main control chip 2 and multiple CPO optical modules 4 to achieve "on-chip cooling." The first photonic thin-film cold plate 3 is a thin-film sheet structure, thin and lightweight, making it easy to integrate onto heat-generating devices. Cooling is achieved by laser irradiation of the first photonic thin-film cold plate 3, followed by heat conduction through the housing of the CPO optical modules 4. This results in efficient and precise cooling of the 3D stacked IC structure of the CPO optical modules 4, reducing the temperature of local hot spots to the target temperature. The same principle applies to the main control chip 2, and will not be elaborated further.

[0039] Furthermore, the photonic-cooled CPO switch also includes a CPO mounting bracket 5 for fixing the first photonic thin-film cold plate 3; the bottom end of the CPO mounting bracket 5 is snapped into the main control chip 2 and the CPO optical module 4 of the switch; the first photonic thin-film cold plate 3 includes multiple photonic cold plates 31; the multiple photonic cold plates 31 are snapped into the top end of the CPO mounting bracket 5 one-to-one. In this embodiment, the main control chip 2 and the CPO optical module 4 are soldered to the main board 1 of the switch; the CPO mounting bracket 5 is detachably connected to the main control chip 2 of the switch, optionally using screws or snap-fit ​​connections. The CPO mounting bracket 5 supports the thin-film cold plate, allowing the thin-film cold plate to be mounted on the top surface of the main control chip 2 and the CPO optical module 4 for direct contact temperature conduction. By arranging multiple photonic cold plates 31 corresponding to the areas where heat-generating devices are located on the top of the CPO fixing bracket 5, compared to setting the first photonic thin film cold plate 3 as a single plate, the arrangement of multiple photonic cold plates 31 for the areas where heat-generating devices are located effectively reduces the space and weight occupied by the first photonic thin film cold plate 3, as well as the energy consumption generated by cooling.

[0040] like Figure 4As shown, the photonic cooling plate 31 includes a receiving and reflecting layer 311, a cooling layer 312, and a thermal sensing layer 313, which are sequentially attached vertically from top to bottom. The top of the receiving and reflecting layer 311 is constructed with an array of multiple prisms 3111. The prisms 3111 can focus the incident laser onto the cooling layer 312. The cooling layer 312 can absorb the laser focused by the prisms 3111, perform photonic cooling, and reflect high-energy light, which is emitted through the prisms 3111. The thermal sensing layer 313 can detect the hot spot location of the CPO optical module 4 or the main control chip 2 of the switch. The thermal sensing layer 313 has many thermally sensing pixel materials (vanadium oxide, amorphous silicon) attached to it and is electrically connected to the thermal imaging display 6. The basic principle of the thermal sensing layer 313 is based on the fact that the thermal sensing material can sense the temperature radiated from the CPO optical module 4. The temperature change causes the resistance of the thermal sensing material to change. By detecting the resistance change of each pixel through the reading circuit, the infrared radiation intensity received by each pixel can be calculated and finally converted into temperature value and image signal output to the thermal imaging display 6. This achieves the purpose of monitoring the temperature of potential hot spots in each heat-generating device and accurately locating a hot spot. Specifically, the thermal sensing layer 313, which is in contact with the heat-generating device, first detects the hot spot and guides the laser to emit a laser beam from the prism 3111 above the hot spot (not necessarily the prism 3111 directly above it) to accurately locate the hot spot. The laser is low-energy light, which is absorbed by the cooling layer 312 and emitted as high-energy light, achieving cooling. The cooling energy is conducted to the interior of the heat-generating device through the top plate of the housing, achieving cooling of the interior and bottom of the heat-generating device. The heat-carrying high-energy light is reflected by the prism 3111 to the switch housing 9, where the heat is dissipated.

[0041] It should be noted that prism 3111 concentrates the laser beam in a specific direction through refraction and total internal reflection, focusing the laser onto the cooling layer 312. Each prism 3111 has a corresponding laser incident angle, and the laser operates in conjunction with each prism 3111 based on the corresponding laser incident angle. Prisms 3111 can be triangular or right-angled prisms, as long as the laser can transmit the laser beam to the corresponding photonic cooling plate 31. Compared to traditional couplers (lenses that focus the incident laser beam onto the micro-cooled region), the prism 3111 structure occupies less space, has a regular shape, and is easy to integrate into an array on the same horizontal plane.

[0042] Secondly, the first photonic thin-film cold plate 3 also includes a reflective layer 314; one side of the reflective layer 314 is attached to the cooling layer 312, and the other side is attached to the thermal sensing layer 313; the reflective layer 314 can reflect the laser and high-energy light emitted through the cooling layer 312. Specifically, the reflective layer 314 can be a back reflector, which reflects the laser signal to prevent the incident laser from directly irradiating the CPO optical module 4, thereby eliminating the "dark silicon" problem (i.e., the chip cannot operate at full speed due to heat dissipation limitations). Due to the different angles at which the laser enters the prism 3111, some laser and high-energy light may be directed towards the thermal sensing layer 313, affecting the detection accuracy of the thermal sensing layer 313 for hot spots of the CPO optical module 4. Based on this, a reflective layer 314 is added between the cooling layer 312 and the thermal sensing layer 313 to avoid the thermal sensing layer 313 being affected by laser and heat-carrying high-energy light, thereby improving the detection accuracy of the thermal sensing layer 313 for hot spots of heat-generating devices. Compared to the traditional method of setting up the back reflector and hot spot detection sensor separately, the receiving reflective layer 311, cooling layer 312, thermal sensing layer 313 and reflective layer 314 of the present invention are integrated in the form of thin film stacking, which occupies less space and has a high degree of integration with the CPO optical module with 3D stacked IC structure.

[0043] See you again Figure 3 The photonic cooling CPO switch also includes a thermal imaging display 6, which is electrically connected to the laser and the thermal sensing layer 313. The thermal imaging display 6 can acquire the hot spot area detected by the first photonic thin film cold plate 3 and drive the laser to emit laser light towards one or more prisms 3111 above the hot spot area. In this embodiment, the laser is a compound eye laser 7 that can rotate 360° at high speed and is located directly above the first photonic thin film cold plate 3. The laser can be emitted to any corner inside the switch, fully covering the first photonic thin film cold plate 3, that is, fully covering the heat-generating device. Furthermore, the compound eye laser 7 can emit one or multiple lasers simultaneously, and the corresponding laser emission angle is adjustable. After receiving the hot spot information of each thermal sensing layer 313, the thermal imaging display 6 drives the laser on the compound eye laser 7 responsible for the corresponding hot spot area to move to the corresponding angle, so that the emitted laser can accurately be directed towards the prism 3111 above the hot spot. The thermal imaging display 6 detects areas of high heat flux density inside the CPO switch and senses hot spots in the chip. When a hot spot appears, a laser irradiates the prism 3111 above the hot spot, stimulating the photon process and absorbing heat, ultimately achieving precise cooling.

[0044] Furthermore, the CPO mounting bracket 5 has multiple through-holes 51 vertically formed along its upper edge; multiple second slots 52 are formed on the top surface of the CPO mounting bracket 5; the second slots 52 are connected to the multiple first slots 51; multiple CPO optical modules 4 are engaged with the multiple first slots 51 one-to-one, and multiple first photonic thin-film cold plates 3 are engaged with the multiple second slots 52 one-to-one, so that the top surface of the CPO optical module 4 and the bottom surface of the first photonic thin-film cold plate 3 form surface-to-surface contact. Specifically, the first slot 51 engages with the housing of the CPO optical module 4, so that the top plate of the housing of the CPO optical module 4 is flush with or protrudes from the horizontal plane where the first slot 51 is located. The first slot 51 improves the relative positional accuracy between the housing of the CPO optical module 4 and the first photonic thin-film cold plate 3, thereby ensuring the accuracy of the prism 3111 in receiving laser light, and ultimately achieving precise cooling of the hot spot area. The second slot 52 is used to support the first photonic thin-film cold plate 3, so that the bottom surface of the first photonic thin-film cold plate 3 abuts against the top plate of the CPO optical module 4 housing, thereby achieving heat conduction. In addition, a third slot and a fourth slot are also provided at the center of the CPO fixing bracket 5. The third slot is set similarly to the first slot 51, and the fourth slot is set similarly to the second slot 52, so that the top plate of the switch main control chip 2 housing abuts against the photonic cold plate 31 above it.

[0045] In this embodiment, the main control chip 2 of the switch is located at the center of the top surface of the switch motherboard 1. Four sets of CPO optical module combinations are correspondingly arranged at the front, back, left, and right edges of the top surface of the switch motherboard 1. Each CPO optical module combination has multiple CPO optical modules 4 arranged in an array along the edge line of the top surface of the switch motherboard 1, and a photonic cold plate 31 is arranged above each CPO optical module combination. A photonic cold plate 31 is also arranged above the main control chip 2 of the switch, so that the four photonic cold plates 31 above the four sets of CPO optical module combinations surround the photonic cold plate 31 above the main control chip 2 of the switch. Figure 3 As shown, this facilitates the emission of lasers from the compound eye laser 7 to each photon cold plate 31, reduces the range of laser head movement that the compound eye laser 7 needs to adjust, and improves the response speed of the compound eye laser 7.

[0046] In one embodiment, a laser is disposed above a plurality of first photonic thin-film cold plates 3 and installed inside the switch housing 9; the laser can adjust the wavelength of the emitted laser. Specifically, the laser can flexibly adjust the controllable temperature range of the first photonic thin-film cold plates 3 according to the wavelength of the emitted wave matched with the cooling material, thereby improving the adaptability to temperature control of different temperature-sensitive optical components and heat-generating devices.

[0047] In another embodiment, such as Figure 5 and Figure 6As shown, the CPO optical module 4 includes an optical fiber 41 and multiple built-in heat-generating devices and multiple second photonic thin-film cold plates 42. Multiple second photonic thin-film cold plates 42 are correspondingly disposed on each of the heat-generating devices. One end of the optical fiber 41 is connected to a second photonic thin-film cold plate 42 connected in parallel with multiple waveguides, and the other end extends out of the CPO optical module 4 and is connected to an external laser source 8. The second photonic thin-film cold plate 42 can detect the hot spot location of the heat-generating device and emit laser light to the optical fiber 41 through the external laser source 8, thereby enabling the second photonic thin-film cold plate 42 to perform photonic cooling. Compared to the "on-chip cooling" of the previous embodiment, in this embodiment, the photonic thin-film cold plate is built into the CPO optical module 4 for "in-chip cooling," directly cooling the heat source and optimizing the process of cold energy conduction through the casing, significantly improving the cooling efficiency of the heat-generating device. Specifically, the second photonic thin-film cold plate 42 is similar to the first photonic thin-film cold plate 3, with the same structure and cooling principle, differing only in its installation position. An external laser source 8 is installed inside the switch housing 9. The external laser source 8 is connected to an optical fiber 41. The optical fiber 41 transmits the laser light through a waveguide to the corresponding second photonic thin-film cold plate 42, providing laser light to the second photonic thin-film cold plate 42 built into the CPO optical module 4. Figure 5 As shown, the optical fiber 41 directly irradiates the center of the second photonic thin film cold plate 42 at the bottom of the heat-generating device through the waveguide. The laser covers the entire second photonic thin film cold plate 42, achieving the purpose of directly cooling the chip and cooling from the source of heat generation.

[0048] In this embodiment, the CPO optical module 4 is a 3D stacked IC structure, including a chip 43, a DFB laser 44 (distributed feedback laser), a photonic integrated chip 45, an intermediate board 46, a PCB board 47, and a FAU 48 (fiber array unit). The photonic integrated chip 45, the intermediate board 46, and the PCB board 47 are stacked vertically in sequence and electrically connected by contacts. The heat-generating devices include the chip 43 and the DFB laser 44. The chip 43 and the DFB laser 44 are correspondingly disposed inside the photonic integrated chip 45 and the intermediate board 46. The heat-generating devices are connected by waveguides. The waveguide connection method occupies little space and is easy to integrate into the CPO optical module 4 with the 3D stacked IC structure. The waveguide structure and optical fiber 41 are connected by FAU48. The external laser source 8 transmits the laser to the hot spot area that needs to be cooled through the optical fiber 41 and the waveguide structure, that is, the corresponding second photonic thin film cold plate 42, for targeted photonic cooling. Of course, lasers can also be emitted directly to all the second photonic thin film cold plates 42 to cool all the heat-generating devices.

[0049] Furthermore, the second photonic thin-film cold plate 42 is disposed on the side of the heat-generating device facing away from the top plate of the housing of the CPO optical module 4. Since the housing of the CPO optical module 4 has heat dissipation capabilities, the heat of the CPO optical module 4 is mainly concentrated inside and at the bottom. Based on this, by placing the second photonic thin-film cold plate 42 against the bottom surface of the heat-generating device, the area where heat is concentrated inside the CPO optical module 4 can be efficiently cooled. Optionally, the second photonic thin-film cold plate 42 is disposed on the bottom plate of the heat-generating device inside the CPO optical module 4 to achieve "in-chip cooling". "In-chip cooling" cools the entire heat-generating device above the second photonic thin-film cold plate 42, cooling from the heat source. At the same time, the first photonic thin-film cold plate 3 is disposed on the top plate of the housing of the CPO optical module 4 to achieve "on-chip cooling". "On-chip cooling" is point-to-point cooling. Based on the detection of hot spots that reach or exceed the threshold by the thermal sensing layer 313 of the first photonic thin-film cold plate 3, the compound eye laser 7 is controlled to emit lasers to the corresponding prisms 3111 in a targeted manner to reduce local hot spots. "In-chip cooling" works in conjunction with "on-chip cooling" to cool down heat-generating devices. With "in-chip cooling" as the primary method and "on-chip cooling" as a supplement, the response speed to temperature control is effectively improved, ultimately achieving efficient and precise cooling of hot spots.

[0050] Furthermore, whether it is "on-chip cooling" or "in-chip cooling", the thin film structure occupies very little space and does not affect the integration of photonic cooling with air cooling and / or liquid cooling. When multiple cooling methods are integrated, the cooling efficiency of heat-generating devices can be further improved.

[0051] Secondly, the photonic-cooled CPO switch also includes a switch housing 9; the switch motherboard 1, the switch main control chip 2, the laser, the first photonic thin-film cold plate 3, the CPO optical module 4, the external laser source 8, and the optical fiber 41 are all built into the switch housing 9; the inner wall of the switch housing 9 is coated with a radiation-absorbing heat dissipation coating. Specifically, the switch housing 9 is a cube, and all six inner walls of the switch housing 9 are coated with a radiation-absorbing heat dissipation coating, so that when the heat-carrying high-energy light emitted by the prism 3111 strikes the switch housing 9, it can achieve the effect of radiation heat dissipation through the radiation-absorbing heat dissipation coating.

[0052] It should be understood that the above description of specific embodiments of the present invention is only for illustrating the technical approach and features of the present invention, and is intended to enable those skilled in the art to understand the content of the present invention and implement it accordingly. However, the present invention is not limited to the specific embodiments described above. All changes or modifications made within the scope of the technical solution of the present invention should be covered within the protection scope of the present invention.

Claims

1. A photonic cooling (CPO) switch, comprising: The photon cooling CPO switch comprises a switch mainboard (1), a switch main control chip (2), a laser, a first photon thin film cooling plate (3) and a plurality of CPO optical modules (4); The switch main control chip (2) is arranged at the center of the top surface of the switch mainboard (1); the plurality of CPO optical modules (4) are arranged on the top surface of the switch mainboard (1) around the switch main control chip (2); and the first photon thin film cooling plate (3) is arranged on the top surface of the switch main control chip (2) and the plurality of CPO optical modules (4); The first photon thin film cooling plate (3) can detect the hot spot position of the switch main control chip (2) or the CPO optical module (4), and guide the laser to emit laser to the first photon thin film cooling plate (3) to perform photon cooling.

2. The photonic cooling CPO switch of claim 1, wherein, The photon cooling CPO switch further comprises a CPO fixing support (5) for fixing the first photon thin film cooling plate (3); The bottom end of the CPO fixing support (5) is correspondingly clamped with the switch main control chip (2) and the CPO optical module (4); The first photon thin film cooling plate (3) comprises a plurality of photon cooling plates (31); and the plurality of photon cooling plates (31) are correspondingly clamped with the top end of the CPO fixing support (5).

3. The photonic cooling CPO switch of claim 2, wherein, The photon cooling plate (31) comprises a receiving reflection layer (311), a cooling layer (312) and a thermal induction layer (313) sequentially attached from top to bottom along the vertical direction; The top end of the receiving reflection layer (311) is configured as a plurality of prisms (3111) arranged in an array; the prism (3111) can focus the incident laser to the cooling layer (312); The cooling layer (312) can absorb the focused laser of the prism (3111), perform photon cooling, and reflect high-energy light, and the high-energy light is emitted through the prism (3111); The thermal induction layer (313) can detect the hot spot position of the CPO optical module (4) or the switch main control chip (2).

4. The photonic cooling CPO switch of claim 3, wherein, The first photon thin film cooling plate (3) further comprises a reflection layer (314); One side of the reflection layer (314) is attached with the cooling layer (312), and the other side is attached with the thermal induction layer (313); and the reflection layer (314) can reflect the laser and high-energy light emitted through the cooling layer (312).

5. The photonic cooling CPO switch of claim 3, wherein, The photon cooling CPO switch further comprises a thermal imaging display instrument (6) electrically connected with the laser and the thermal induction layer (313); The thermal imaging display instrument (6) can acquire the hot spot area detected by the first photon thin film cooling plate (3), and drive the laser to emit laser to one or more prisms (3111) above the hot spot area.

6. The photonic cooling CPO switch of claim 2, wherein, A plurality of first clamping grooves (51) are vertically arranged on the CPO fixing support (5); a plurality of second clamping grooves (52) are arranged on the top surface of the CPO fixing support (5); and the second clamping grooves (52) are correspondingly communicated with the plurality of first clamping grooves (51). A plurality of the CPO optical modules (4) are correspondingly clamped with a plurality of the first card slots (51), and a plurality of the first photonic thin film cold plates (3) are correspondingly clamped with a plurality of the second card slots (52), so that the top surface of the CPO optical module (4) abuts against the bottom surface of the first photonic thin film cold plate (3).

7. The photonic cooling CPO switch according to any of claims 1-6, characterized in that, The laser is arranged above a plurality of the first photonic thin film cold plates (3); the laser can adjust the wavelength of the emitted laser.

8. The photonic cooling CPO switch according to any of claims 1-6, characterized in that, The CPO optical module (4) comprises optical fibers (41) and a plurality of built-in heating devices and a plurality of second photonic thin film cold plates (42); the photonic cooling CPO switch further comprises an external laser light source (8); A plurality of the second photonic thin film cold plates (42) are correspondingly arranged on a plurality of the heating devices; one end of the optical fiber (41) is connected to a plurality of waveguides in parallel with the second photonic thin film cold plates (42), and the other end of the optical fiber (41) is connected to the external laser light source (8) outside the CPO optical module (4); The second photonic thin film cold plate (42) can detect the hot spot position of the heating device and emit laser to the optical fiber (41) through the external laser light source (8), so that the second photonic thin film cold plate (42) performs photonic refrigeration.

9. The photonic cooling CPO switch of claim 8, wherein, The second photonic thin film cold plate (42) is arranged on one side of the heating device away from the top plate of the shell of the CPO optical module (4).

10. The photonic cooling CPO switch of claim 8, wherein, The photonic cooling CPO switch further comprises a switch shell (9); The switch mainboard (1), the switch main control chip (2), the laser, the first photonic thin film cold plate (3), the CPO optical module (4), the external laser light source (8) and the optical fiber (41) are all built-in in the switch shell (9); The inner wall of the switch shell (9) is coated with a radiation-absorbing heat dissipation coating.

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