Printed circuit board taping method, apparatus, storage medium, and program product

Abstract

The application provides a printed circuit board patching method, device, storage medium and program product. The method comprises the following steps: acquiring patching resource occupation data for performing patching work on at least two different to-be-operated surfaces; determining first work task allocation information of different operating devices on at least one patching machine based on the patching resource occupation data; in the process of performing the patching work by the patching machine, dynamically switching the working states of the different operating devices according to the first work task allocation information; dynamically adjusting the first work task allocation information according to the real-time patching progress of one or more patching machines and the resource utilization rate of the patching machine, and obtaining second work task allocation information; and dynamically switching the working states of the different operating devices according to the second work task allocation information, so as to balance the total patching resource consumption of various printed circuit boards or the patching resource consumption of different to-be-operated surfaces on the same printed circuit board, and there is at least one to-be-operated surface on one printed circuit board.

Description

Technical Field

[0001] This application relates to the field of electronic manufacturing, and more particularly to a method, apparatus, storage medium, and program product for mounting printed circuit boards. Background Technology

[0002] In the field of electronics manufacturing, surface mount technology (SMT) is one of the core processes in which printed circuit boards (PCBs) are surface mounted to obtain printed circuit board assemblies (PCBAs). It is widely used in the production of single-sided or double-sided PCBs.

[0003] In double-sided surface mount technology (SMT) assembly, components need to be mounted separately on the bottom (BOT) and top (TOP) sides of the PCB. Due to differences in the number of mounting points, component types, and process requirements between the BOT and TOP sides, the mounting time for each side varies significantly. In traditional production models, the mounting processes for the BOT and TOP sides run independently, lacking a collaborative optimization mechanism. This results in long waiting times or equipment idle periods when switching PCBs, directly impacting production efficiency and capacity. Summary of the Invention

[0004] This application provides a printed circuit board (PCB) mounting method, apparatus, storage medium, and program product to reduce production line waiting time or equipment idle rate, and improve PCB mounting efficiency and mounting capacity on the mounting production line.

[0005] In a first aspect, embodiments of this application provide a method for mounting a printed circuit board, including:

[0006] Acquire chip placement resource usage data for performing chip placement operations on at least two different surfaces to be worked on, and determine first work task allocation information for different working devices on at least one chip placement machine based on the chip placement resource usage data;

[0007] During the placement operation performed by the placement machine, the working states of different work devices are dynamically switched according to the first work task allocation information.

[0008] Based on the real-time placement progress of one or more of the pick-and-place machines and the resource utilization rate of the pick-and-place machines, the first task allocation information is dynamically adjusted to obtain the second task allocation information.

[0009] The working states of different work devices are dynamically switched according to the second work task allocation information to balance the total surface mount resource consumption of various printed circuit boards or the surface mount resource consumption of different surfaces to be worked on the same printed circuit board. There is at least one surface to be worked on a printed circuit board.

[0010] In one possible implementation, determining the first task allocation information for different work devices on at least one pick-and-place machine based on the placement resource occupancy data includes:

[0011] Based on the difference in patch resource usage among the different surfaces to be worked on in the patch resource usage data, the allocation ratio for performing the patch operation on one or more of the surfaces to be worked on is dynamically adjusted.

[0012] In one possible implementation, prior to dynamically adjusting the first task allocation information, the method further includes:

[0013] Based on the difference in patch resource usage between the different surfaces to be worked on at the current time and the preset patch resource usage difference threshold, determine whether to trigger patch mode switching;

[0014] If the difference in chip resource usage is greater than the preset chip resource usage difference threshold, the first task allocation information is adjusted and updated to the second task allocation information based on the real-time chip placement progress of one or more chip placement machines and the resource utilization rate of the chip placement machine.

[0015] Otherwise, keep the first task allocation information unchanged.

[0016] In one possible implementation, the step of dynamically switching the working states of different work devices according to the first work task allocation information includes:

[0017] Based on the distribution of the number of patch points and the component type on each surface to be worked in the first task allocation information, the patching path of the working device is dynamically planned.

[0018] The mounting path includes at least one of the following: a feeding path, a pick-up path, and a placement path for the component to be mounted.

[0019] In one possible implementation, acquiring patch resource usage data for performing patch operations on at least two different work surfaces includes:

[0020] Obtain the layout design file for each of the printed circuit boards, and use a machine learning model to predict the chip resource usage data corresponding to each surface to be worked on.

[0021] In one possible implementation, determining the first task allocation information for different work devices on at least one pick-and-place machine based on the placement resource occupancy data includes:

[0022] Based on the patch distribution information on each of the surfaces to be worked on, the surfaces to be worked on are divided into multiple patch-dense regions using a preset segmentation grid, and the patch starting point of each patch-dense region is defined.

[0023] The placement sequence of each working device is dynamically adjusted based on its current working status and the corresponding list of tasks to be performed.

[0024] In one possible implementation, determining the first task allocation information for different work devices on at least one pick-and-place machine based on the placement resource occupancy data includes:

[0025] Based on the distance between each of the placement starting points and the feed point of the component to be placed in the working device, each of the dense placement areas and the placement sequence or placement priority of each of the components to be placed therein are assigned.

[0026] In one possible implementation, adjusting and updating the first task allocation information to the second task allocation information includes:

[0027] Based on the execution time, the execution order of each patch task in the first task allocation information is adjusted from largest to smallest.

[0028] In one possible implementation, the dynamic planning of the patch path of the working device includes:

[0029] The optimal moving distance for each of the components to be placed is calculated using a greedy algorithm or an A* algorithm to obtain the placement path.

[0030] In one possible implementation, predicting the patch resource usage data corresponding to each of the surfaces to be worked on using a machine learning model includes:

[0031] The model is trained based on historical patch data, and the error corresponding to the difference in the predicted total patching time of any two surfaces to be worked on is controlled within a preset range, which is less than or equal to ±2 seconds.

[0032] In one possible implementation, dynamically adjusting the placement sequence of the work devices based on their current operating status and corresponding list of pending tasks includes:

[0033] Determine whether any of the aforementioned work devices has malfunctioned. If so, switch the pending tasks of the work device to the pending work list of the next adjacent work device or the work device on the opposite side, and place the pending tasks corresponding to the malfunctioning work device at the top for execution.

[0034] Secondly, embodiments of this application provide a printed circuit board mounting apparatus, comprising:

[0035] The acquisition module is used to acquire patch resource usage data for performing patching operations on at least two different surfaces to be worked on;

[0036] Processing module, used for:

[0037] Based on the chip placement resource occupancy data, determine the first work task allocation information for different operating devices on at least one chip placement machine;

[0038] During the placement operation performed by the placement machine, the working states of different work devices are dynamically switched according to the first work task allocation information.

[0039] The acquisition module is also used to acquire the real-time placement progress of one or more of the pick and place machines and the resource utilization rate of the pick and place machines;

[0040] The processing module is further configured to: dynamically adjust the first task allocation information based on the real-time placement progress of one or more placement machines and the resource utilization rate of the placement machines, to obtain the second task allocation information;

[0041] The working states of different work devices are dynamically switched according to the second work task allocation information to balance the total surface mount resource consumption of various printed circuit boards or the surface mount resource consumption of different surfaces to be worked on the same printed circuit board. There is at least one surface to be worked on a printed circuit board.

[0042] In one possible implementation, the processing module is further configured to:

[0043] Based on the difference in patch resource usage between the different surfaces to be worked on at the current time and the preset patch resource usage difference threshold, determine whether to trigger patch mode switching;

[0044] If the difference in chip resource usage is greater than the preset chip resource usage difference threshold, the first task allocation information is adjusted and updated to the second task allocation information based on the real-time chip placement progress of one or more chip placement machines and the resource utilization rate of the chip placement machine.

[0045] Otherwise, keep the first task allocation information unchanged.

[0046] In one possible implementation, the processing module is further configured to: dynamically plan the patching path of the working device based on the distribution of patch points and component types on each of the surfaces to be worked in the first task allocation information;

[0047] The mounting path includes at least one of the following: a feeding path, a pick-up path, and a placement path for the component to be mounted.

[0048] In one possible implementation, the acquisition module is also configured to acquire the layout design file for each of the printed circuit boards;

[0049] The processing module is also used for:

[0050] Using a machine learning model, the resource usage data of each surface to be worked on is predicted based on the layout design file.

[0051] In one possible implementation, the processing module is further configured to:

[0052] Based on the patch distribution information on each of the surfaces to be worked on, the surfaces to be worked on are divided into multiple patch-dense regions using a preset segmentation grid, and the patch starting point of each patch-dense region is defined.

[0053] The placement sequence of each working device is dynamically adjusted based on its current working status and the corresponding list of tasks to be performed.

[0054] In one possible implementation, the processing module is further configured to:

[0055] Based on the distance between each of the placement starting points and the feed point of the component to be placed in the working device, each of the dense placement areas and the placement sequence or placement priority of each of the components to be placed therein are assigned.

[0056] In one possible implementation, the processing module is further configured to:

[0057] Based on the execution time, the execution order of each patch task in the first task allocation information is adjusted from largest to smallest.

[0058] In one possible implementation, the processing module is further configured to: calculate the optimal moving distance of each of the components to be patched using a greedy algorithm or an A* algorithm to obtain the patching path.

[0059] In one possible implementation, the processing module is further configured to: train a model based on historical patch data, and control the error corresponding to the difference in the predicted total patching time of any two surfaces to be worked within a preset range, wherein the preset range is less than or equal to ±2 seconds.

[0060] In one possible implementation, the processing module is further configured to: determine whether any of the work devices has malfunctioned; if so, switch the pending tasks of the work device to the pending work list of the next adjacent work device or the work device on the opposite side, and place the pending tasks corresponding to the malfunctioning work device at the top for execution.

[0061] Thirdly, embodiments of this application provide a printed circuit board surface mount device, including: a memory and a processor;

[0062] The memory stores computer-executed instructions;

[0063] The processor executes computer execution instructions stored in the memory, causing the processor to perform the first aspect and / or various possible implementations of the first aspect as described above.

[0064] Fourthly, embodiments of this application provide a computer-readable storage medium storing computer-executable instructions, which, when executed by a processor, are used to implement the first aspect and / or various possible implementations of the first aspect.

[0065] Fifthly, embodiments of this application provide a computer program product, including a computer program that, when executed by a processor, implements the first aspect and / or various possible implementations of the first aspect.

[0066] The printed circuit board (PCB) placement method, equipment, storage medium, and program products provided in this application analyze the placement resources (such as placement heads) required by each placement machine on the PCB board to be placed on by each placement machine on the production line. This analysis is performed on a production line-wide basis, and different PCB boards, or different placement faces of the same PCB board, are assigned to different placement devices (such as placement heads) on the same placement machine, or different placement machines, for placement. The placement progress on the production line is monitored in real time to adjust the placement sequence of each placement device (such as placement heads) and / or the placement faces corresponding to the placement tasks. This allows for the interleaving and mixing of BOT and TOP sides of the same PCB board for placement, or the interleaving and mixing of different PCB boards on the production line as a whole. This reduces production line waiting time or equipment idle rate, and improves PCB board placement efficiency and production capacity on the placement production line. Attached Figure Description

[0067] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0068] Figure 1This application provides a schematic diagram of a printed circuit board (PCB) surface mount production line.

[0069] Figure 2 Flowchart of the printed circuit board mounting method provided in this application Figure 1 ;

[0070] Figure 3 Flowchart of the printed circuit board mounting method provided in this application Figure 2 ;

[0071] Figure 4 A schematic diagram of the printed circuit board mounting device provided in this application;

[0072] Figure 5 This is a schematic diagram of the printed circuit board mounting equipment provided in this application.

[0073] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0074] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0075] In existing SMT technology, single-sided surface mount technology (SMT) on a PCB board requires the following steps: screen printing (or dispensing), mounting (curing), reflow soldering, cleaning, inspection, and rework.

[0076] 1. Screen printing: Its function is to apply solder paste or adhesive to the pads of the PCB in preparation for component soldering. The equipment used is a screen printing machine, which is located at the very beginning of the SMT production line.

[0077] 2. Dispensing: This involves applying adhesive to specific locations on the PCB board to secure components. The equipment used is a dispensing machine, located at the beginning of the SMT production line or after the testing equipment.

[0078] 3. Placement: Its function is to accurately mount surface mount components onto fixed positions on the PCB. The equipment used is a pick-and-place machine, located after the screen printer in the SMT production line.

[0079] 4. Curing: Its function is to melt the adhesive, thereby firmly bonding the surface mount components to the PCB board. The equipment used is a curing oven, located after the pick-and-place machine in the SMT production line.

[0080] 5. Reflow Soldering: Its function is to melt the solder paste, so that the surface mount components are firmly bonded to the PCB board. The equipment used is a reflow oven, which is located after the pick-and-place machine in the SMT production line.

[0081] 6. Cleaning: Its function is to remove harmful soldering residues, such as flux, from the assembled PCB board. The equipment used is a cleaning machine, which can be used in a flexible location, either online or offline.

[0082] 7. Inspection: Its function is to inspect the soldering and assembly quality of the assembled PCB board. Equipment used includes magnifying glasses, microscopes, in-circuit testers (ICT), flying probe testers, automated optical inspection (AOI), X-ray inspection systems, and functional testers. The location can be configured in a suitable position on the production line according to the inspection needs.

[0083] 8. Rework: Its function is to rework PCBs that have failed inspection. The tools used include soldering irons and rework workstations, which can be configured anywhere on the production line.

[0084] The above process is a typical process for single-sided PCB surface mount technology (SMT). Double-sided PCB surface mount technology (SMT) only requires performing the process on each side separately, which means repeating the above process once more.

[0085] Therefore, it is evident that existing SMT placement programs typically produce the BOT and TOP sides of PCB boards independently. This has the following characteristics: First, they are generated through independent programs; for example, the placement programs for the BOT and TOP sides are designed separately and run independently based on their respective placement point counts and process requirements. The difference in placement time between the two sides is not included in the scope of collaborative optimization. Second, the production rhythm is fixed, and the task allocation of the placement equipment (such as pick-and-place machines) is fixed, making it impossible to dynamically adjust the placement sequence or resource allocation. Third, there are line waiting issues. When the placement time for the BOT side is shorter than that for the TOP side, the PCB board that has completed placement must wait for the TOP side to complete before entering the next process, resulting in idle production lines. Conversely, if the placement time for the TOP side is too long, the BOT side equipment may be idle due to waiting for resources.

[0086] Based on the aforementioned characteristics of SMT (Surface Mount Technology), the limitations of existing technologies are mainly reflected in: the lack of dynamic resource allocation and the accumulation of time losses. The lack of dynamic resource allocation means that the placement sequence or equipment resource allocation cannot be adjusted in real time according to the time difference between the two sides, leading to a mismatch in production rhythm. The accumulation of time losses means that in the mode of independent placement of the BOT (Browser) and TOP (Top) sides, the time difference cannot be compensated for by program logic, resulting in an extended overall production cycle.

[0087] In view of the aforementioned problems in the existing technology, this application aims to solve the following technical problems:

[0088] 1. Production rhythm mismatch problem: The large difference in the bonding time between the BOT side and the TOP side leads to increased waiting time on the production line and low equipment utilization.

[0089] 2. Accumulated time loss: In independent mode, the placement order or resource allocation cannot be dynamically adjusted, and the difference in placement time directly translates into an extended production cycle, affecting production capacity.

[0090] 3. Low resource utilization: The task allocation of the working heads of the chip mounter is fixed and cannot be dynamically adjusted according to actual production needs, resulting in waste of equipment resources.

[0091] By introducing independent and alternating modes of surface mount technology (SMT) program logic, this application proposes a solution for dynamically optimizing production rhythm to eliminate production line waiting time, achieve dynamic balance between BOT and TOP side SMT, or dynamic balance between mixed SMT of various PCB boards, thereby improving overall production efficiency and resource utilization.

[0092] Figure 1 This application provides a schematic diagram of a printed circuit board (PCB) surface mount production line. Figure 1 As shown, the specific application scenario of this application for a printed circuit board (PCB) surface mount production line includes: multiple first loading areas 10, multiple second loading areas 20, at least two parallel conveyor belts 30, and multiple mounting heads (also referred to as robotic arms). Figure 1 (Not shown in the image). The PCB board 40 to be mounted is placed on the conveyor belt 30 and moves forward with the conveyor belt 30, passing through the mounting operation area corresponding to each mounting head. Each mounting head picks up the component to be mounted from the first loading area 10 or the second loading area 20 corresponding to the mounting operation area and places it in the designed position on the PCB board 40, thereby completing the mounting step in the mounting process.

[0093] It should be noted that, Figure 1 Only the part of the SMT production line corresponding to mounting is shown. Other parts are not described in this application because they are similar to existing technologies.

[0094] In the above scenario, if the existing SMT technology is used, each conveyor belt 30 will carry the same PCB board, with the same side of the PCB board facing upwards, serving as the surface to be worked on by the placement head. In this case, one conveyor belt 30 carries the TOP side of the PCB board, and the other conveyor belt 30 carries the BOT side of the PCB board.

[0095] Figure 1 The multi-conveyor belt patch production line shown is much more efficient than the traditional single-conveyor belt patch production line because it can patch both the BOT and TOP sides simultaneously, unlike the single-conveyor belt production line which requires waiting for all process steps to be completed before patching the other side.

[0096] However, this multi-conveyor-belt parallel approach still has problems. When the number of placement points on the BOT and TOP sides is unequal, the conveyor belt with fewer placement points will finish placement earlier. To ensure that multiple PCBs enter the next reflow soldering area together, the conveyor belt that finishes placement early needs to pause and wait for the conveyor belt with more placement points to complete placement. In other words, the overall efficiency of the SMT production line is consistent with the efficiency of the slowest conveyor belt. The greater the difference in the number of placement points on different sides, the lower the overall efficiency of the SMT production line. This is the technical problem of the independent placement mode for each side.

[0097] The traditional approach that readily comes to mind to solve the aforementioned technical problems is to set the number of placement points on each work surface to be as consistent as possible, or with sufficiently small differences. While this solution is obvious, it is impractical and entirely idealistic, with a very low probability of being implemented in practice. This is because SMT manufacturers cannot determine the PCB design; that is, the number of placement points on each work surface is random in actual production. To group these random numbers together in production requires a tremendous amount of effort from production organizers, and in most cases, product delivery constraints make this idealistic solution even more difficult to implement. This results in the apparent solution being unfeasible, limiting the efficiency and capacity of SMT production lines.

[0098] This led to the inventive concept of introducing independent and alternating patch programming logic in this application.

[0099] The technical solution of this application and how the technical solution of this application solves the above-mentioned technical problems are described in detail below with specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments. The embodiments of this application will now be described with reference to the accompanying drawings.

[0100] Figure 2 Flowchart of the printed circuit board mounting method provided in this application Figure 1 ,like Figure 2 As shown, the method includes:

[0101] S201. Obtain chip placement resource occupancy data for performing chip placement operations on at least two different work surfaces, and determine the first work task allocation information of different work devices on at least one chip placement machine based on the chip placement resource occupancy data.

[0102] A printed circuit board has at least one surface to be worked on. For example, a typical flat PCB has two surfaces for surface mount technology (BOT) and top surfaces. In specific designs, surface mount technology can be applied to both sides or one side. Furthermore, for stacked PCBs, where the upper and lower PCBs are connected by insulating support pillars and the two PCBs are of different sizes, three cross-row surface mounts can be formed in this uncovered area, i.e., three surfaces to be worked on.

[0103] Optionally, each surface to be worked on can also be divided into several patch areas.

[0104] In this step, the chip placement resource occupancy data refers to the devices or structures required by the chip placement machine to support the placement of chips on a certain work surface, as well as their operating time, power consumption, etc., including: chip placement head or robotic arm, feeding mechanism, laser positioning mechanism, calibration mechanism, image acquisition and display mechanism, placement time corresponding to a single component, working head moving speed, etc.

[0105] For ease of understanding, in this embodiment, the specific steps include: first, obtaining the layout information of all surface mount components on at least two surfaces to be worked on, for example, loading or importing a PCB design file, extracting all surface mount component layout information from the file, and thus obtaining the type of each surface mount component and the number and position of its corresponding mounting points; then, determining the first task allocation information of different working devices on at least one pick-and-place machine based on the surface mount resource occupancy data, which may specifically include: determining the placement time difference of at least two surfaces to be worked on based on the surface mount component layout information, and then determining the allocation strategy of the placement task corresponding to the placement head of the pick-and-place machine, as well as the feeding sequence and material loading information of the feeding mechanism, based on the placement time difference.

[0106] In other words, a dynamic resource allocation mechanism is introduced into the placement process. For example, for double-sided PCBs, the task allocation of the placement machine head can be adjusted in real time based on the difference in placement time between the BOT and TOP sides. This solves the technical problems in traditional placement processes, such as the large difference in placement time between the BOT and TOP sides and the fixed task allocation of the placement machine head, which leads to low equipment resource utilization and extended production cycles.

[0107] By dynamically allocating tasks to the pick-and-place machine's work heads, the issue of idle time caused by variations in placement time is resolved. Specifically, when the placement time on the BOT side is significantly shorter than that on the TOP side, the work head released from the PCB board that has already completed placement will automatically switch to assist with the TOP side placement task. This dynamic allocation mechanism is based on real-time placement time monitoring and task priority calculation. For example, after the BOT side placement is completed, its work head is immediately scheduled to the TOP side placement task, filling the load gap of the TOP side pick-and-place machine. Through dynamic resource allocation, the utilization efficiency of the pick-and-place machine's work heads is improved by 30%, and the idle time caused by variations in placement time is reduced by 50%. In addition, the dynamic allocation mechanism can also dynamically adjust the work head allocation strategy according to the distribution of placement points: such as prioritizing the allocation of work heads in high placement density areas, further optimizing the load balance of the equipment. Ultimately, this significantly shortens the overall production cycle, such as reducing placement time by 15%, and improves the operational stability of the pick-and-place machine because the equipment load fluctuation is reduced.

[0108] In one possible design, the first task allocation information for different work devices on at least one pick-and-place machine is determined based on pick-and-place resource occupancy data, including:

[0109] Based on the difference in patch resource usage among different pending surfaces in the patch resource usage data, the allocation ratio for performing patch operations on one or more pending surfaces is dynamically adjusted.

[0110] For example, assuming the number of surface mount points on the top side of the PCB is 300 and the number of surface mount points on the bottom side is 500, then the difference between the two is 200. Figure 1 As shown, two of the upper first loading areas 10, such as loading areas 110 and 120, can be configured like the second loading area 20 for BOT surface mounting. Simultaneously, the mounting heads corresponding to loading areas 110 and 120 need to be configured to cross the upper conveyor belt 30, directly placing the components to be mounted from loading areas 110 or 120 onto the PCB board 40 of the lower conveyor belt 30. This achieves load balancing for different surfaces on the production line, ensuring that the mounting progress on multiple conveyor belts 30 remains largely consistent, thereby reducing the problems of low production line utilization, low capacity, and order delivery delays caused by design differences.

[0111] It should be noted that not only the number of placement points on the work surface can be used to characterize placement resource occupancy, but also a combination of single or multiple values ​​such as the predicted placement time, power consumption, component volume, and the proportion of the component occupying the loading area can also characterize placement resource occupancy. The appropriate value can be selected based on the actual application scenario.

[0112] It is worth noting that in actual working conditions, rigorous testing and verification are required to obtain parameter values ​​and mathematical expressions that are compatible with the SMT manufacturer or the production line for characterizing the resource usage of the surface mount technology. However, anything involving the above parameters is within the scope of protection of this application.

[0113] The first task allocation information set in this step can be understood as the set of operating tasks and / or the set of operating parameters for each placement mechanism on one or more placement machines. It is important to note that this first task allocation information is an initial configuration and is not static. It needs to be adjusted in real time based on the production line's operational status and placement progress. For example, temporary changes in production tasks or equipment malfunctions require updating the configuration, which will be explained in sections S203 and S204 below.

[0114] S202. During the placement operation of the chip mounter, the working status of different working devices is dynamically switched according to the first work task allocation information.

[0115] The work devices involved in the first task allocation information do not have to be turned on immediately. Instead, they can be dynamically switched when the corresponding PCB board is detected to be transferred to the preset position. This can reduce the energy consumption of the production line, avoid unnecessary idling, reduce the wear and tear on the equipment itself, and also reduce the time pressure on the material preparation personnel.

[0116] S203. Based on the real-time placement progress of one or more pick-and-place machines and the resource utilization rate of the pick-and-place machines, dynamically adjust the first task allocation information to obtain the second task allocation information.

[0117] Upon reaching this step, the SMT production line enters the automatic monitoring and operation phase. Before receiving a stop command, the monitoring devices on the SMT production line will monitor the placement progress and the resource utilization of the placement machine in real time, promptly detect equipment failures or changes in the placement production plan, and adaptively adjust various production configurations of the SMT production line.

[0118] It is worth noting that existing SMT technologies do not consider the impact of pick-and-place machine head malfunctions or speed fluctuations on production rhythm, leading to a decrease in placement efficiency. In this application, a real-time monitoring module is integrated into the placement program to dynamically collect the pick-and-place machine's operating status (such as head malfunctions and placement speed fluctuations) and adjust the placement strategy in real time.

[0119] For example, sensors can be used to monitor the status of the pick-and-place machine's working heads in real time, such as temperature, vibration, and placement speed, and the placement strategy can be dynamically adjusted in conjunction with the placement program logic. For instance, when a fault is detected in a working head, the placement program will automatically reassign the task of that working head to other normally functioning heads; when a fluctuation in placement speed is detected, such as a 10% drop in placement speed, the placement program will compensate for the speed loss by extending the placement time or adjusting the placement sequence.

[0120] In some embodiments, the real-time monitoring module can be implemented based on an edge computing architecture, with a data acquisition frequency of 100ms / time and a response latency controlled within 50ms. This technique shortens the fault response time of the pick-and-place machine and reduces the rate of decrease in placement efficiency.

[0121] In addition, the real-time monitoring module can also assist maintenance personnel in quickly locating problems through data visualization, such as the pick-and-place machine status dashboard, thereby improving equipment maintenance efficiency, significantly enhancing the robustness of the pick-and-place process, and ensuring the stability of the production rhythm.

[0122] S204. Dynamically switch the working status of different working devices according to the second work task allocation information to balance the total surface mount resource consumption of various printed circuit boards or the surface mount resource consumption of different surfaces to be worked on the same printed circuit board.

[0123] For example, if a placement head fails to pick up a component, it will automatically issue an alarm signal. The processor or controller then needs to execute steps S203 and S204 to transfer the placement task corresponding to that placement head to the next placement head, thus avoiding a decrease in production capacity caused by production line downtime.

[0124] In this embodiment, as Figure 1 As shown, multiple horizontally arranged first feeding zones 10 or second feeding zones 20 can perform the same patching task. When the conveyor belt 30 moves forward, the positions corresponding to multiple zones can also be moved at once. When the patching head corresponding to a certain feeding zone fails, the moving distance of the conveyor belt 30 and the tasks of multiple patching heads near the failure zone can be temporarily adjusted to replace the failure patching head and complete its patching task.

[0125] For example, in addition to using horizontally arranged placement heads as a substitute, if the placement components in the loading area corresponding to the placement head on the opposite side can be shared, the placement head on the opposite side can also be used as a substitute.

[0126] Figure 3 Flowchart of the printed circuit board mounting method provided in this application Figure 2 ,like Figure 3 As shown, in Figure 2Based on the previous embodiment, this embodiment adds automatic activation judgment for surface mount mode switching, making the surface mount program more flexible and avoiding increased workload for material loading and changing caused by multiple switching. The method includes:

[0127] S301. Obtain chip placement resource occupancy data for performing chip placement operations on at least two different work surfaces, and determine the first work task allocation information for different work devices on at least one chip placement machine based on the chip placement resource occupancy data.

[0128] This step obtains patch resource usage data for performing patch operations on at least two different surfaces to be worked on, including:

[0129] Obtain the layout design file for each printed circuit board and use a machine learning model to predict the chip resource usage data for each surface to be worked on.

[0130] Specifically, the resource usage data for each surface to be processed is predicted using a machine learning model, including:

[0131] The model is trained based on historical placement data, and the error corresponding to the difference in the predicted total placement time between any two surfaces to be processed is controlled within a preset range, such as less than or equal to ±2 seconds. In other words, the error in the predicted placement time is controlled within ±2 seconds, such as no more than 200ms. This allows for precise balancing of the load on various devices in the SMT production line, improving production capacity and utilization.

[0132] It should be noted that traditional SMT technology cannot predict placement time differences, leading to delayed mode switching and unbalanced production rhythm. This application introduces a machine learning model as a placement time prediction model, training a machine learning model such as a random forest based on historical placement data to predict placement time differences. By collecting historical placement data, such as PCB type, number of placement points, component type, and placement machine parameters, the prediction model is trained to predict placement time differences. For example, for a new PCB board, the model will predict the placement time difference between the BOT and TOP sides based on its placement point distribution and component type, triggering a mode switch in advance, for example, 5 seconds. The prediction model optimizes prediction accuracy through feature engineering such as placement point density and component type distribution, and model parameter tuning such as tree depth and learning rate in random forests, controlling the error rate within ±2 seconds.

[0133] By using a placement time prediction model, the lag time between mode changes can be reduced, thus mitigating production rhythm imbalances caused by placement time differences. Furthermore, this technique can adapt to new PCB types through model iteration (such as periodically updating historical placement data), improving the generalization ability of the time prediction model and significantly enhancing the dynamic responsiveness of the placement process, ensuring real-time balance in production rhythm.

[0134] In this embodiment, determining the first task allocation information for different work devices on at least one pick-and-place machine based on pick-and-place resource usage data includes:

[0135] Based on the distribution information of patch points on each surface to be worked, the surface to be worked is divided into multiple patch-dense areas using a preset segmentation grid, as well as the patch starting point of each patch-dense area.

[0136] The placement sequence of each working device is dynamically adjusted based on its current working status and the corresponding list of tasks to be performed.

[0137] Specifically, it is determined whether any working device has malfunctioned. If so, the pending tasks of the working device are switched to the pending work list of the next adjacent working device or the working device on the opposite side, and the pending tasks corresponding to the malfunctioning working device are placed first for execution.

[0138] It is worth noting that the patch starting point is a preset reference point. For example, the geometric center of the dense patch area is first calculated using a preset geometric algorithm, and then the patch point closest to this geometric center is set as the patch starting point.

[0139] It should also be noted that the preset segmentation grid includes at least one of quadrilateral grids and hexagonal grids. The grid should be selected by comparing the coverage and missegmentation rate of the patch points on the working surface to make the segmentation of dense patch areas more accurate.

[0140] S302. During the placement operation of the chip mounter, the working status of different working devices is dynamically switched according to the first work task allocation information.

[0141] In this embodiment, the placement path of the work device is dynamically planned based on the distribution of the number of placement points and the component type on each work surface in the first task allocation information. For example, a greedy algorithm or A* algorithm is used to calculate the optimal moving distance of each component to be placed, thereby obtaining the placement path.

[0142] The placement path includes at least one of the following: the feeding path, the pick-up path, and the placement path of the component to be placed.

[0143] Traditional surface mount technology (SMT) processes cannot dynamically adjust the placement order based on the distribution of placement points, resulting in redundant placement paths and low placement efficiency. This application, however, embeds a placement path optimization algorithm into the SMT process to dynamically plan the placement path based on the distribution of placement points and component type.

[0144] This technique analyzes the spatial distribution of placement points, such as placement point density and component type distribution, to dynamically generate the optimal placement path. For example, in high placement density areas, the pick-and-place machine prioritizes tasks at adjacent placement points, reducing the head travel distance; for mixed component types, such as large and small components, the machine prioritizes placing larger components to reduce changeover time. The placement path optimization algorithm is based on a greedy algorithm or A* algorithm, dynamically adjusting the placement sequence by calculating the total travel distance and placement time in real time. This technique reduces placement path redundancy and shortens placement time. Furthermore, placement path optimization reduces head wear due to reduced travel distance, lowers equipment maintenance costs, significantly improves placement efficiency, and extends the lifespan of the pick-and-place machine.

[0145] S303. Based on the difference in patch resource usage between different pending work surfaces in the patch resource usage data at the current time and the preset patch resource usage difference threshold, determine whether to trigger patch mode switching.

[0146] In this step, if the difference in patch resource usage is greater than the preset patch resource usage difference threshold, then step S304 is executed; otherwise, the first task allocation information remains unchanged.

[0147] S304. Based on the real-time placement progress of one or more pick-and-place machines and the resource utilization rate of the pick-and-place machines, adjust and update the first task allocation information to the second task allocation information.

[0148] S305. Based on the real-time placement progress of one or more pick-and-place machines and the resource utilization rate of the pick-and-place machines, dynamically adjust the first task allocation information to obtain the second task allocation information.

[0149] S306. Dynamically switch the working status of different working devices according to the second work task allocation information to balance the total surface mount resource consumption of various printed circuit boards or the surface mount resource consumption of different surfaces to be worked on the same printed circuit board.

[0150] The implementation methods, technical principles, and effects of steps S305 and S306 are as follows: Figure 2 The implementation methods, technical principles, and effects of S203 and S204 in the illustrated embodiments are similar. For details, please refer to the foregoing description, which will not be repeated here.

[0151] This embodiment incorporates independent and alternating mode switching logic in the placement program, automatically triggering production mode switching based on placement time differences. Steps S301 and S302 can be understood as independent mode. In the initial stage of production line startup, it's necessary to quickly complete placement on a specific surface of the PCB board, such as the top surface. Due to PCB design, heavier placements are prone to desoldering or cold solder joints if they are inverted during the second reflow soldering process. Therefore, for PCB boards with special placement requirements, the surface with critical placement process requirements needs to be placed in the second placement. In this case, the production line needs to complete the first placement of some PCB boards before switching some equipment to the second placement to balance the equipment load, i.e., entering alternating mode. This application incorporates independent and alternating mode switching logic in the placement program, automatically triggering production mode switching based on placement time differences.

[0152] The system dynamically determines whether to switch to alternating mode based on a preset placement time difference threshold. For example, if the placement time for PCB A (BOT side) is 10 seconds shorter than that for PCB B (TOP side), the placement program will automatically trigger alternating mode. This means that after placement on PCB A is completed, the placement machine immediately switches to the placement task for PCB B, avoiding line waiting. The switching logic is based on real-time placement time monitoring and prediction algorithms. For instance, it uses historical placement data to train a model to predict placement time differences and triggers mode switching in advance. Dynamic switching between independent and alternating modes reduces production line waiting time and improves the utilization rate of the placement machine. Furthermore, by adjusting the placement sequence, such as prioritizing PCBs with longer placement times, the production rhythm can be further optimized, achieving dynamic balance in double-sided placement and improving overall capacity.

[0153] The printed circuit board (PCB) placement method provided in this application analyzes the placement resources (such as placement heads) required by each placement machine on the PCB board to be placed on by each placement machine on the production line. It then allocates different PCB boards, or different placement faces of the same PCB board, to different placement devices (such as placement heads) on the same placement machine, or to different placement machines, for placement. The method monitors the placement progress on the production line in real time and adjusts the placement sequence and / or the placement faces corresponding to the placement tasks. This allows for the interleaving and mixing of BOT and TOP sides of the same PCB board for placement, or the interleaving and mixing of different PCB boards on the production line as a whole. This reduces production line waiting time or equipment idle rate, and improves PCB board placement efficiency and production capacity on the placement production line.

[0154] Figure 4 This is a schematic diagram of the printed circuit board mounting device provided in this application, as shown below. Figure 4 As shown, the printed circuit board mounting device 40 provided in this application includes:

[0155] The acquisition module 401 is used to acquire patch resource usage data for performing patching operations on at least two different surfaces to be worked on;

[0156] Processing module 402 is used for:

[0157] Based on the chip placement resource usage data, determine the first work task allocation information for different working devices on at least one chip placement machine;

[0158] During the placement operation of the pick and place machine, the working status of different working devices is dynamically switched according to the first work task allocation information.

[0159] The acquisition module 401 is also used to: acquire the real-time placement progress of one or more pick and place machines and the resource utilization rate of the pick and place machines;

[0160] The processing module 402 is also used to: dynamically adjust the first task allocation information based on the real-time placement progress of one or more pick and place machines and the resource utilization rate of the pick and place machines, so as to obtain the second task allocation information.

[0161] The working status of different working devices is dynamically switched according to the second work task allocation information in order to balance the total surface mount resource consumption of various printed circuit boards or the surface mount resource consumption of different surfaces to be worked on on the same printed circuit board. There is at least one surface to be worked on a printed circuit board.

[0162] In one possible implementation, the processing module 402 is further configured to:

[0163] Based on the difference in patch resource usage between different pending surfaces in the patch resource usage data at the current time and the preset patch resource usage difference threshold, determine whether to trigger patch mode switching;

[0164] If the difference in chip resource usage exceeds the preset chip resource usage difference threshold, the first task allocation information will be adjusted and updated to the second task allocation information based on the real-time chip placement progress of one or more chip placement machines and the resource utilization rate of the chip placement machines.

[0165] Otherwise, keep the first task assignment information unchanged.

[0166] In one possible design, the processing module 402 is also used to: dynamically plan the patching path of the working device based on the distribution of patch points and component types on each surface to be worked in the first work task allocation information.

[0167] The placement path includes at least one of the following: the feeding path, the pick-up path, and the placement path of the component to be placed.

[0168] In one possible design, module 401 is also used to: acquire the layout design file for each printed circuit board;

[0169] Processing module 402 is also used for:

[0170] Using a machine learning model, the resource usage data of each surface to be worked on is predicted based on the layout design file.

[0171] In one possible implementation, the processing module 402 is further configured to:

[0172] Based on the distribution information of patch points on each surface to be worked, the surface to be worked is divided into multiple patch-dense areas using a preset segmentation grid, as well as the patch starting point of each patch-dense area.

[0173] The placement sequence of each working device is dynamically adjusted based on its current working status and the corresponding list of tasks to be performed.

[0174] In one possible implementation, the processing module 402 is further configured to:

[0175] Based on the distance between each placement start point and the feed point of the component to be placed in the working device, each dense placement area and the placement sequence or placement priority of each component to be placed in it are assigned.

[0176] In one possible implementation, the processing module 402 is further configured to:

[0177] Based on the execution time, the execution order of each patch task in the first task allocation information is adjusted from largest to smallest.

[0178] In one possible implementation, the processing module 402 is further configured to: calculate the optimal moving distance of each component to be placed using a greedy algorithm or an A* algorithm, thereby obtaining the placement path.

[0179] In one possible implementation, the processing module 402 is further configured to: train a model based on historical patch data, and control the error corresponding to the difference in the predicted total patching time of any two surfaces to be worked within a preset range, wherein the preset range is less than or equal to ±2 seconds.

[0180] In one possible implementation, the processing module 402 is further configured to: determine whether any working device has malfunctioned; if so, switch the pending tasks of the working device to the pending work list of the next adjacent working device or the working device on the opposite side, and place the pending tasks corresponding to the malfunctioning working device at the top for execution.

[0181] The printed circuit board mounting device provided in this application can perform the method provided in the above-described method embodiments. Its implementation principle and technical effect are similar, and will not be described in detail here.

[0182] Figure 5 A schematic diagram of the structure of the electronic device provided in this application. Figure 5 As shown, the electronic device 50 provided in this embodiment includes at least one processor 501 and a memory 502. Optionally, the device 50 further includes a communication component 503. The processor 501, memory 502, and communication component 503 are connected via a bus.

[0183] In a specific implementation, at least one processor 501 executes computer execution instructions stored in memory 502, causing at least one processor 501 to perform the above-described method.

[0184] The specific implementation process of processor 501 can be found in the above method embodiments, and its implementation principle and technical effect are similar. It will not be repeated here.

[0185] In the above embodiments, it should be understood that the processor can be a Central Processing Unit (CPU), or other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), etc. The general-purpose processor can be a microprocessor or any conventional processor. The steps of the method disclosed in this invention can be directly implemented by a hardware processor, or implemented by a combination of hardware and software modules within the processor.

[0186] The memory may include random access memory (RAM) and may also include non-volatile memory (NVM), such as at least one disk storage device.

[0187] The bus can be an Industry Standard Architecture (ISA) bus, a Peripheral Component Interconnect (PCI) bus, or an Extended Industry Standard Architecture (EISA) bus, etc. Buses can be categorized as address buses, data buses, control buses, etc. For ease of illustration, the buses shown in the accompanying drawings are not limited to a single bus or a single type of bus.

[0188] This application also provides a computer program product, including a computer program that, when executed by a processor, implements the above-described method.

[0189] This application also provides a computer-readable storage medium storing computer-executable instructions, which, when executed by a processor, implement the above-described method.

[0190] The aforementioned readable storage medium can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic storage, flash memory, magnetic disk, or optical disk. The readable storage medium can be any available medium accessible to a general-purpose or special-purpose computer.

[0191] An exemplary readable storage medium is coupled to a processor, enabling the processor to read information from and write information to the readable storage medium. Of course, the readable storage medium can also be a component of the processor. The processor and the readable storage medium can reside in an Application Specific Integrated Circuit (ASIC). Alternatively, the processor and the readable storage medium can exist as discrete components in the device.

[0192] The division of units is merely a logical functional division; in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be indirect coupling or communication connection through some interfaces, devices, or units, and may be electrical, mechanical, or other forms.

[0193] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0194] In addition, the functional units in the various embodiments of the present invention can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit.

[0195] If a function is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this invention, or the part that contributes to the prior art, or a part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods of the various embodiments of this invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0196] Those skilled in the art will understand that all or part of the steps of the above-described method embodiments can be implemented by hardware related to program instructions. The aforementioned program can be stored in a computer-readable storage medium. When executed, the program performs the steps of the above-described method embodiments; and the aforementioned storage medium includes various media capable of storing program code, such as ROM, RAM, magnetic disks, or optical disks.

[0197] Finally, it should be noted that other embodiments of the invention will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This invention is intended to cover any variations, uses, or adaptations of the invention that follow the general principles of the invention and include common knowledge or customary techniques in the art not disclosed herein, and is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of the invention is limited only by the appended claims.

Claims

1. A method for mounting a printed circuit board, characterized in that, include: Acquire chip placement resource usage data for performing chip placement operations on at least two different surfaces to be worked on, and determine first work task allocation information for different working devices on at least one chip placement machine based on the chip placement resource usage data; During the placement operation performed by the placement machine, the working states of different work devices are dynamically switched according to the first work task allocation information. Based on the real-time placement progress of one or more of the pick-and-place machines and the resource utilization rate of the pick-and-place machines, the first task allocation information is dynamically adjusted to obtain the second task allocation information. The working states of different work devices are dynamically switched according to the second work task allocation information in order to balance the total surface mount resource consumption of various printed circuit boards or the surface mount resource consumption of different surfaces to be worked on the same printed circuit board. There is at least one surface to be worked on a printed circuit board. Before dynamically adjusting the first task allocation information, the method further includes: Based on the difference in patch resource usage between the different surfaces to be worked on at the current time and the preset patch resource usage difference threshold, determine whether to trigger patch mode switching; If the difference in chip resource usage is greater than the preset chip resource usage difference threshold, the first task allocation information is adjusted and updated to the second task allocation information based on the real-time chip placement progress of one or more chip placement machines and the resource utilization rate of the chip placement machine. Otherwise, keep the first task allocation information unchanged.

2. The printed circuit board mounting method according to claim 1, characterized in that, The step of determining the first task allocation information for different working devices on at least one pick-and-place machine based on the pick-and-place resource occupancy data includes: Based on the difference in patch resource usage among the different surfaces to be worked on in the patch resource usage data, the allocation ratio for performing the patch operation on one or more of the surfaces to be worked on is dynamically adjusted.

3. The printed circuit board mounting method according to claim 1, characterized in that, The step of dynamically switching the working states of different work devices according to the first work task allocation information includes: Based on the distribution of the number of patch points and the component type on each surface to be worked in the first task allocation information, the patching path of the working device is dynamically planned. The mounting path includes at least one of the following: a feeding path, a pick-up path, and a placement path for the component to be mounted.

4. The printed circuit board mounting method according to claim 1, characterized in that, The acquisition of patch resource usage data for performing patch operations on at least two different surfaces to be worked on includes: Obtain the layout design file for each of the printed circuit boards, and use a machine learning model to predict the chip resource usage data corresponding to each surface to be worked on.

5. The printed circuit board mounting method according to claim 1, characterized in that, The step of determining the first task allocation information for different working devices on at least one pick-and-place machine based on the pick-and-place resource occupancy data includes: Based on the patch distribution information on each of the surfaces to be worked on, the surfaces to be worked on are divided into multiple patch-dense regions using a preset segmentation grid, and the patch starting point of each patch-dense region is defined. The placement sequence of each working device is dynamically adjusted based on its current working status and the corresponding list of tasks to be performed.

6. The printed circuit board mounting method according to any one of claims 1-5, characterized in that, The step of determining the first task allocation information for different working devices on at least one pick-and-place machine based on the pick-and-place resource occupancy data includes: Based on the distance between each of the placement starting points and the feed point of the component to be placed in the working device, each dense placement area and the placement sequence or placement priority of each of the components to be placed therein are assigned.

7. The printed circuit board mounting method according to claim 1, characterized in that, The step of adjusting and updating the first task allocation information to the second task allocation information includes: Based on the execution time, the execution order of each patch task in the first task allocation information is adjusted from largest to smallest.

8. The printed circuit board mounting method according to claim 3, characterized in that, The dynamic planning of the patch placement path of the working device includes: Greedy algorithm or A The algorithm calculates the optimal moving distance for each of the components to be patched, thus obtaining the patching path.

9. The printed circuit board mounting method according to claim 4, characterized in that, The step of predicting the patch resource usage data corresponding to each of the surfaces to be worked on using a machine learning model includes: The model is trained based on historical patch data, and the error corresponding to the difference in the predicted total patching time of any two surfaces to be worked on is controlled within a preset range, which is less than or equal to ±2 seconds.

10. The printed circuit board mounting method according to claim 5, characterized in that, The step of dynamically adjusting the placement sequence of the work devices based on their current working status and corresponding list of pending tasks includes: Determine whether any of the aforementioned work devices has malfunctioned. If so, switch the pending tasks of the work device to the pending work list of the next adjacent work device or the work device on the opposite side, and place the pending tasks corresponding to the malfunctioning work device at the top for execution.

11. A printed circuit board mounting device, characterized in that, include: The acquisition module is used to acquire patch resource usage data for performing patching operations on at least two different surfaces to be worked on; Processing module, used for: Based on the chip placement resource occupancy data, determine the first work task allocation information for different operating devices on at least one chip placement machine; During the placement operation performed by the placement machine, the working states of different work devices are dynamically switched according to the first work task allocation information. The acquisition module is also used to acquire the real-time placement progress of one or more of the pick and place machines and the resource utilization rate of the pick and place machines; The processing module is further configured to: dynamically adjust the first task allocation information based on the real-time placement progress of one or more placement machines and the resource utilization rate of the placement machines, to obtain the second task allocation information; The working states of different work devices are dynamically switched according to the second work task allocation information in order to balance the total surface mount resource consumption of various printed circuit boards or the surface mount resource consumption of different surfaces to be worked on the same printed circuit board. There is at least one surface to be worked on a printed circuit board. Before dynamically adjusting the first task allocation information, the processing module is further configured to: determine whether to trigger a patch mode switch based on the patch resource occupation difference of different work surfaces at the current time and a preset patch resource occupation difference threshold in the patch resource occupation data; If the difference in chip placement resource usage is greater than the preset chip placement resource usage difference threshold, the first task allocation information is adjusted and updated to the second task allocation information based on the real-time chip placement progress of one or more chip placement machines and the resource utilization rate of the chip placement machines; otherwise, the first task allocation information remains unchanged.

12. An electronic device, characterized in that, include: Memory, processor; The memory stores computer-executed instructions; The processor executes computer execution instructions stored in the memory, causing the processor to perform the method as described in any one of claims 1-10.

13. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer-executable instructions, which, when executed by a processor, are used to implement the method as described in any one of claims 1-10.

14. A computer program product, characterized in that, Includes a computer program that, when executed by a processor, implements the method described in any one of claims 1-10.

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