Tidal satellite heat dissipation system and working method thereof

Abstract

The invention provides a tidal satellite heat dissipation system and a working method thereof, and belongs to the technical field of thermal control of space products. The problem that differential temperature control of equipment cannot be achieved in an existing scheme is solved. The heat dissipation system comprises a built-in heat pipe and a surface-mounted heat pipe combination, the built-in heat pipe is arranged in the cabin plate, the built-in heat pipe is of a sectional structure, the surface-mounted heat pipe combination comprises a flexible heat pipe, an upper cover, a driving part and a reset spring, the flexible heat pipe comprises a flexible section, a first rigid section and a second rigid section, and the first rigid section and the second rigid section are arranged in the cabin plate. The two ends of the flexible section are connected with the first rigid section and the second rigid section respectively, the first rigid section and the second rigid section are both connected to the cabin plate and located above the two embedded heat pipes respectively, and the upper cover is arranged above the second rigid section. And a driving part is arranged between the second rigid section and the upper cover and is made of a two-way memory alloy. The method is mainly used for dissimilatory temperature control of satellites.

Description

Technical Field

[0001] This invention belongs to the field of thermal control technology for space products, and in particular relates to a tidal satellite heat dissipation system and its working method. Background Technology

[0002] Depending on the power-on / off status of the communication payload, low-Earth orbit (LEO) communication satellites typically have two power consumption modes: peak power consumption mode and constant power consumption mode. In peak power consumption mode, the satellite operates at full power, and the communication payload is powered on. The satellite's power consumption can reach several kilowatts or even tens of kilowatts, but this mode has a short operating time. In constant power consumption mode, some satellite equipment is powered off, and the communication payload is in a power-off or standby state. Except for active thermal control power consumption, the satellite's power consumption is relatively low, often only a few hundred watts or a little over a thousand watts. This mode has a long operating time.

[0003] The thermal design requirements differ significantly for the two different power consumption modes: In peak power consumption mode, the heat dissipation of high-power loads / devices is correspondingly high. If heat dissipation cannot be achieved in time, the loads / devices are prone to overheating. Therefore, the main thermal design requirement is to achieve rapid heat dissipation for high-heat-dissipation loads / devices. In constant power consumption mode, high-power loads / devices are in a powered-off or standby state with relatively low heat dissipation. Their heat dissipation is insufficient to maintain the temperature of the loads / devices above the required lower temperature limit. Therefore, the main thermal design requirement is to achieve a heat preservation effect by heating the loads / devices through active thermal control.

[0004] Currently, the thermal design of low-Earth orbit communication satellites focuses on rapid heat dissipation under peak power consumption mode. The main approach is to improve the thermal conductivity of the cabin by embedding heat pipes inside the cabin or attaching heat pipes to the surface of the cabin, thereby achieving a uniform temperature design for the cabin with high heat dissipation loads / equipment installation. Heat is then rapidly conducted and extended to various parts of the cabin or to cooler individual units, and then dissipated to the cool space, thus achieving a rapid heat dissipation effect.

[0005] The above thermal design has significant flaws when the satellite enters constant power consumption mode, including: First, in constant power consumption mode, the satellite heats the payload / equipment through active thermal control. Due to the homogenization design of the cabin panels, the heat generated by active thermal control is also quickly conducted and dissipated. To ensure that the temperature of the payload / equipment is maintained above the required lower limit of temperature, the power consumption of active thermal control will increase significantly. In addition, the long working time of constant power consumption mode results in huge energy waste. Second, the on / off states of each device are different, and the temperature sensitivity of each device varies, so the required lower limit of temperature also varies. However, due to the homogenization design of the cabin panels, the active thermal control using closed-loop control can only maintain the temperature of each device within a similar temperature range, and cannot achieve differentiated temperature control, thus also causing some energy waste. Summary of the Invention

[0006] In view of this, the present invention aims to propose a tidal satellite heat dissipation system and its working method to solve the problem that low-orbit communication satellites need to dissipate heat quickly in peak power consumption mode and reduce active thermal control power consumption in constant power consumption mode, and existing solutions cannot achieve differentiated temperature control of equipment.

[0007] To achieve the above objectives, the present invention adopts the following technical solution: a tidal satellite heat dissipation system, comprising an internal heat pipe and a surface-mounted heat pipe assembly. The internal heat pipe is disposed inside the cabin panel and has a segmented structure. The surface-mounted heat pipe assembly includes a flexible heat pipe, a top cover, a driving component, and a return spring. The flexible heat pipe includes a flexible section, a first rigid section, and a second rigid section. The two ends of the flexible section are respectively connected to the first and second rigid sections. Both the first and second rigid sections are connected to the cabin panel. The first and second rigid sections are located above the two internal heat pipe segments. The first rigid section is located at the beginning of external heat conduction, and the second rigid section is located at the end of external heat conduction. The top cover is positioned above the second rigid section. A driving component is positioned between the second rigid section and the top cover. The lower end of the second rigid section is connected to a return spring, and the other end of the return spring is recessed into the compartment plate. The driving component is a ring-shaped structure with a through hole in the center along the axial direction. After a screw passes through the top cover, the through hole of the driving component, the second rigid section, and the return spring in sequence, the screw is connected to the compartment plate. The driving component is made of a two-way memory alloy. The two-way memory alloy achieves a shape transformation from memory shape one to memory shape two as the temperature rises, and a shape transformation from memory shape two to memory shape one as the temperature falls. The axial length of the memory shape two of the driving component is greater than that of memory shape one.

[0008] Furthermore, both the first rigid section and the second rigid section are provided with fins. The upper end of the fins of the second rigid section is connected to the driving component, and the lower end of the fins of the second rigid section is connected to the return spring.

[0009] Furthermore, the two-way memory alloy is a nickel-titanium based alloy.

[0010] Furthermore, a thermally conductive pad is provided between the second rigid section and the cabin plate, and the thermally conductive pad is glued and fixed to the surface of the cabin plate.

[0011] Furthermore, the thermal pad is made of a gap-filling thermally conductive material.

[0012] Furthermore, thermal grease is applied to the bottom surface of the first rigid section.

[0013] Furthermore, the first rigid segment and the second rigid segment have the same structure.

[0014] Furthermore, the cabin panel is an aluminum honeycomb panel, which has a structure of aluminum skin on both sides and an aluminum honeycomb core in the middle.

[0015] Furthermore, the embedded heat pipe is a channel heat pipe.

[0016] The present invention also provides a method for operating a tidal satellite heat dissipation system, specifically as follows: When the satellite enters orbit and is in constant power consumption mode, all drive components exhibit memory shape one. Under the action of the reset spring, the second rigid section is lifted and moved away from the surface of the cabin. The embedded heat pipes of the segmented structure are in a state of mutual heat insulation. At this time, the cabin forms multiple independent thermal control areas, thereby reducing the active thermal control power consumption. When the satellite switches from constant power consumption mode to peak power consumption mode, the equipment heats up. The heat is transferred to the external heat conduction start end through the embedded heat pipe. The heat from the flexible heat pipe is conducted to the drive component. The drive component changes from memory shape one to memory shape two. The drive component extends and pushes the second rigid section to compress the reset spring downward until the second rigid section is close to the cabin plate. The drive component maintains memory shape two. At this time, the segmented embedded heat pipes are thermally connected to each other through the flexible heat pipe, and the cabin plate is in a homogenized state. When the satellite switches from peak power mode to constant power mode, the equipment cools down. As the cabin heats up, the temperature of the drive components gradually decreases. The drive components switch from memory shape two to memory shape one. Under the push of the reset spring, the second rigid section moves upward and away from the cabin surface. The cabin returns to multiple independent thermal control zones.

[0017] Compared with the prior art, the beneficial effects of the present invention are: (1) The tidal satellite heat dissipation system described in this invention can achieve the effect of reducing active thermal control power consumption in constant power consumption mode while ensuring rapid heat dissipation of the satellite in peak power consumption mode.

[0018] (2) The tidal satellite heat dissipation system described in this invention can achieve the effect of differentiated temperature control of each device in constant power consumption mode while ensuring rapid heat dissipation of the satellite in peak power consumption mode.

[0019] (3) The tidal satellite heat dissipation system described in this invention can repeatedly switch the thermal control state to achieve the tidal thermal control effect of rapid heat dissipation during peak power consumption and slow heat dissipation during constant power consumption. It is suitable for satellites with frequent changes in on-orbit temperature environment and working state.

[0020] (4) The tidal satellite heat dissipation system described in this invention can automatically identify and actively switch the thermal control state according to its working mode. It does not require the addition of independent sensors or processors, satellite service intervention, or ground operation and control system intervention. It can reduce satellite weight, power consumption, and information flow pressure, and can greatly reduce the workload of the onboard processing system and ground operation and control.

[0021] (5) The switching of the thermal control state of the tidal satellite heat dissipation system described in this invention is achieved only through a micro-sized mechanism, which will not cause disturbance to the whole satellite and is beneficial to satellite attitude control.

[0022] (6) The tidal satellite heat dissipation system described in this invention is simple in composition and highly reliable. It does not impose an additional burden on the satellite layout and weight, and has no impact on the satellite energy and information flow design.

[0023] (7) The tidal satellite heat dissipation system described in this invention can be repeatedly used in ground thermal tests without special treatment.

[0024] (8) The components of the tidal satellite heat dissipation system described in this invention are independent of each other and can be redesigned / selected according to the specific needs of the satellite, making the device highly adaptable. Attached Figure Description

[0025] The accompanying drawings, which form part of this invention, are used to provide a further understanding of the invention. The illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an undue limitation of the invention. In the drawings: Figure 1 This is a schematic diagram of a tidal satellite heat dissipation system according to the present invention; Figure 2 This is a schematic cross-sectional view of a tidal satellite heat dissipation system according to the present invention. Figure 3 This is a schematic diagram of the cross-sectional structure of the embedded heat pipe described in this invention; Figure 4 This is a schematic diagram of the surface-mount heat pipe assembly structure described in this invention; Figure 5 This is a schematic diagram of the flexible heat pipe structure described in this invention; Figure 6 This is a schematic diagram of the shape switching memory of the driving component described in this invention; Figure 7 This is a schematic diagram of the surface-mount heat pipe assembly process described in this invention. Figure 1 ; Figure 8 This is a schematic diagram of the surface-mount heat pipe assembly process described in this invention. Figure 2 ; Figure 9 This is a schematic diagram of the construction process of a tidal satellite heat dissipation system according to the present invention. Figure 1 ; Figure 10 This is a schematic diagram of the construction process of a tidal satellite heat dissipation system according to the present invention. Figure 2 ; Figure 11 This is a schematic diagram of the construction process of a tidal satellite heat dissipation system according to the present invention. Figure 3 ; Figure 12 This is a schematic diagram of the combined state of surface-mount heat pipes in the zoned thermal control of a tidal satellite heat dissipation system according to the present invention; Figure 13 This is a schematic diagram of the zoned thermal control of a tidal satellite heat dissipation system according to the present invention; Figure 14 This is a schematic diagram of the surface-mount heat pipe assembly state during rapid heat dissipation in a tidal satellite cooling system according to the present invention.

[0026] In the picture: 1-Bug plate, 2-Embedded heat pipe, 3-Surface-mounted heat pipe assembly, 4-Heat conductive pad, 5-Flexible heat pipe, 6-Top cover, 7-Drive component, 8-Reset spring, 9-Flexible section, 10-First rigid section, 11-Second rigid section, 12-Fin, 13-Through hole. Detailed Implementation

[0027] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of the present invention can be combined with each other, and the described embodiments are only some embodiments of the present invention, not all embodiments.

[0028] See Figure 1-14This embodiment describes a tidal satellite cooling system, comprising an embedded heat pipe 2 and a surface-mounted heat pipe assembly 3. The embedded heat pipe 2 is disposed inside a cabin panel 1 and has a segmented structure. The surface-mounted heat pipe assembly 3 includes a flexible heat pipe 5, a top cover 6, a driving component 7, and a return spring 8. The flexible heat pipe 5 includes a flexible segment 9, a first rigid segment 10, and a second rigid segment 11. The two ends of the flexible segment 9 are respectively connected to the first rigid segment 10 and the second rigid segment 11. Both the first rigid segment 10 and the second rigid segment 11 are connected to the cabin panel 1. The first rigid segment 10 and the second rigid segment 11 are located above the two segments of the embedded heat pipe 2. The first rigid segment 10 is located at the beginning of external heat conduction, and the second rigid segment 11 is located at the end of external heat conduction. The upper cover 6 is positioned above the second rigid section 11. A driving component 7 is positioned between the second rigid section 11 and the upper cover 6. The lower end of the second rigid section 11 is connected to a return spring 8. The other end of the return spring 8 is recessed into the compartment plate 1. The driving component 7 is a ring-shaped structure with a through hole 13 axially formed at its center. After a screw passes through the upper cover 6, the through hole 13 of the driving component 7, the second rigid section 11, and the return spring 8 in sequence, the screw is connected to the compartment plate 1. The driving component 7 is made of a two-way memory alloy. The two-way memory alloy achieves a shape transformation from memory shape one to memory shape two as the temperature rises, and a shape transformation from memory shape two to memory shape one as the temperature falls. The axial length of the memory shape two of the driving component 7 is greater than that of memory shape one.

[0029] Both the first rigid section 10 and the second rigid section 11 are provided with fins 12. The upper end of the fins 12 of the second rigid section 11 is connected to the driving component 7, and the lower end of the fins 12 of the second rigid section 11 is connected to the return spring 8. The two-way memory alloy is a nickel-titanium based alloy. A thermally conductive pad 4 is provided between the second rigid section 11 and the compartment plate 1. The thermally conductive pad 4 is glued and fixed to the surface of the compartment plate 1. The thermally conductive pad 4 is made of gap-filling thermally conductive material. Thermal grease is applied to the bottom surface of the first rigid section 10. The first rigid section 10 and the second rigid section 11 have the same structure. The compartment plate 1 is an aluminum honeycomb panel. The aluminum honeycomb panel has a structure of aluminum skin on both sides and aluminum honeycomb core in the middle. The embedded heat pipe 2 is a channel heat pipe.

[0030] The following will describe this embodiment in detail with reference to the accompanying drawings: like Figure 1 and Figure 2 As shown, a tidal satellite heat dissipation system includes a cabin panel 1, an embedded heat pipe 2, a surface-mounted heat pipe assembly 3, and a thermal pad 4.

[0031] Cabin panel 1 is made of aluminum honeycomb panel, a composite material consisting of aluminum skins on both sides and an aluminum honeycomb core in the middle. This is a commonly used cabin panel material in satellites, possessing advantages such as lightweight, high strength, and high rigidity, while allowing for the installation and fixation of embedded components and internal heat pipes 2. Because the main body of the honeycomb panel is a hollow honeycomb core, the honeycomb panel itself has poor thermal conductivity; this is precisely why heat pipes and other measures are introduced in the thermal design. Figure 2 For ease of visual representation, the aluminum honeycomb core of compartment 1 is not shown; only the upper and lower skins of compartment 1 are shown.

[0032] like Figure 3 As shown, the embedded heat pipe 2 adopts a channel heat pipe, which forms a two-phase flow closed loop circulation by relying on the capillary suction effect of the channel to realize heat transfer and control. It has the advantages of high heat transfer efficiency, good isothermal properties and high reliability, and is a mature thermal control technology for satellite applications.

[0033] like Figure 4 As shown, the surface-mount heat pipe assembly 3 includes a flexible heat pipe 5, a top cover 6, a driving component 7, and a return spring 8.

[0034] like Figure 5 As shown, the flexible heat pipe 5 is developed from traditional heat pipe technology, inheriting its high heat transfer efficiency while possessing the characteristic of being bendable. The flexible heat pipe 5 includes a flexible segment 9, a first rigid segment 10, and a second rigid segment 11. The flexible segment 9 enables the flexible heat pipe 5 to bend. The first rigid segment 10 and the second rigid segment 11 are completely identical, the difference being that during the functional implementation process, the first rigid segment 10 is fixed, while the second rigid segment 11 is movable. Both the first rigid segment 10 and the second rigid segment 11 have fins 12, which, while increasing the heat dissipation contact surface, can also be used to fix the flexible heat pipe 5 on the surface of the compartment plate 1.

[0035] like Figure 6 As shown, the drive component 7 has a ring-shaped structure with a through hole 13 in the middle, through which screws can pass for fixing the surface-mount heat pipe assembly 3. The drive component 7 is made of two-way shape memory alloy and has two shape memory shapes: a shorter axial shape one and a longer axial shape two. The two-way shape memory alloy part can switch between the two shape memory shapes according to temperature changes.

[0036] The specific switching process is as follows: Initial low temperature state: The alloy is in the martensitic state, exhibiting shape memory.

[0037] Heating process: When the temperature rises above As, the alloy begins to transform into austenite and its shape begins to transform into shape memory II; when the temperature rises above Af, the transformation is complete, the alloy becomes austenite completely, and it exhibits shape memory II.

[0038] Cooling process: When the temperature drops from the high point, even below Af, the alloy will still maintain the austenitic state and shape memory 2; when the temperature drops below Ms, the alloy begins to transform into martensite and begins to transform into shape memory 1; when the temperature drops below Mf, the transformation is complete, the alloy becomes completely martensite, and exhibits shape memory 1.

[0039] The meanings of the above four key temperatures are as follows: As: Austenite transformation start temperature, that is, the temperature at which the body begins to transform from martensite to austenite when heated.

[0040] Af: Austenite transformation end temperature, that is, the temperature at which the austenite completely transforms into austenite when heated.

[0041] Ms: Martensite transformation start temperature, that is, the temperature at which the austenite begins to transform into martensite upon cooling.

[0042] Mf: Martensitic transformation end temperature, that is, the temperature at which the material completely transforms into martensite upon cooling.

[0043] The relationship between the four key temperatures is: Af > As > Ms > Mf.

[0044] Two-way memory alloys are preferably made of nickel-titanium-based alloys, which possess superelasticity, high corrosion resistance, strong recovery force, and long-life fatigue performance. Through training, a very stable and accurate two-way memory effect can be obtained. Variants can be obtained by adding a third element, such as Cu, Fe, Nb, or Pd, to adjust the phase transition temperature, hysteresis, and mechanical properties.

[0045] The preparation process of two-way shape memory alloy is as follows: obtain the basic material through melting and processing; obtain the second shape memory at high temperature through shaping heat treatment; and obtain the first shape memory at low temperature through methods such as constraint cycle, deformation cycle or over-aging.

[0046] The installation process for surface-mount heat pipe assembly 3 is as follows: Figure 7 As shown, the drive component 7 and the upper cover 6 are placed sequentially above the second rigid section 11, and the return spring 8 is placed below it; as shown Figure 8 As shown, the return spring 8 is placed into the countersunk hole of the compartment plate 1, and then a long screw is passed through the upper cover 6, the through hole 13 of the drive component 7, the second rigid section 11, and the return spring 8 in sequence. The screw is then connected to the compartment plate 1 to complete the fixation. Figure 8 As shown, thermal grease is applied to the bottom surface of the first rigid section 10, and then screws are used to directly fix it to the surface of the compartment plate 1.

[0047] The thermal pad 4 is made of a high-performance gap-filling thermally conductive material with good adhesion, flexibility, compression performance and thermal conductivity. In this embodiment, the thermal pad 4 is fixed to the surface of the compartment plate 1 by adhesive bonding. When the thermal pad 4 is deformed by extrusion, it fully contacts the material on both sides, which can achieve a high thermal conductivity effect between the compartment plate 1 and the flexible heat pipe 5.

[0048] In the thermal design process, the construction process of a tidal satellite heat dissipation system is as follows: The first step is to complete the layout of the embedded heat pipe 2 based on the satellite's heat dissipation requirements in peak power consumption mode, such as... Figure 9 As shown, for the purpose of intuitive demonstration of the present invention, Figure 9 The middle panel 1 is not shown.

[0049] The second step, based on the satellite's requirement for regional active thermal control in constant power consumption mode, involves segmenting the completed embedded heat pipe 2 into multiple sections. This divides the complete heat pipe designed in the first step into several parts, thereby achieving low-temperature insulation and reducing heat dissipation. Figure 10 As shown.

[0050] The design principles for segmentation include, but are not limited to: 1. Heat pipe segments with a large difference in heat dissipation between the two devices under constant power consumption mode; 2. Heat pipe segments with inconsistent on / off states of the two devices under constant power consumption mode; 3. Heat pipe segments with a large difference in the lower limit temperature requirements of the two devices under constant power consumption mode; 4. Heat pipe segments with devices on one side and no devices on the other side.

[0051] The third step, as Figure 11 As shown, surface-mounted heat pipe assemblies 3 and thermally conductive pads 4 are arranged on the surface of the compartment 1 at all segment locations, with the first rigid segment 10 located directly above one side of the segmented heat pipe and the second rigid segment 11 located directly above the other side of the segmented heat pipe. The location of the first rigid segment 10 is defined as the external heat conduction start end, and the location of the second rigid segment 11 is defined as the external heat conduction end end.

[0052] The design principles for external heat conduction start and external heat conduction end include, but are not limited to: 1. In peak power consumption mode, the side with high heat dissipation is designed with an external heat conduction start, and the side with low heat dissipation is designed with an external heat conduction end; 2. The side with equipment is designed with an external heat conduction start, and the side without equipment is designed with an external heat conduction end.

[0053] Based on the above design, the processing of the cabin panel 1, the embedding of the internal heat pipe 2, the overall assembly of the satellite, and the fixing of the surface heat pipe assembly 3 and the thermal pad 4 were completed, thus completing the construction of a tidal satellite heat dissipation system from a physical perspective.

[0054] A method for operating a tidal satellite cooling system, specifically as follows: When the satellite enters orbit and is in constant power consumption mode, all drive components 7 exhibit a memory shape. At this time, such as Figure 12 As shown, under the action of the return spring 8, the second rigid section 11 is lifted away from the surface of the compartment 1, and the segmented embedded heat pipes 2 are in a state of mutual thermal insulation. In this state, the compartment 1 forms multiple independent thermal control zones, such as... Figure 13 As shown in the dashed box. Independent thermal control zones can effectively reduce the outward conduction and dissipation of heat generated by active thermal control, thereby reducing the power consumption of active thermal control. At the same time, independent thermal control zones can perform differentiated closed-loop thermal control according to the different temperature requirements of the laid-out equipment, thereby further reducing the power consumption of active thermal control.

[0055] When the satellite switches from constant power consumption mode to peak power consumption mode, the high heat-consuming equipment heats up. Heat is transferred through the embedded heat pipe 2 on its mounting surface to the external heat conduction initiation point. The flexible heat pipe 5 heats up and conducts the heat to the driving component 7. When the temperature of the driving component 7 rises to the range As~Af, it begins to transform into shape memory. The driving component 7 extends, pushing the second rigid segment 11 to compress the return spring 8 and move downwards. Figure 14 As shown, when the temperature exceeds Af, the transformation is complete, and the driving component 7 maintains its memory shape. At this time, the second rigid section 11 adheres tightly to the compartment plate 1, thereby achieving a high thermal conductivity with the compartment plate 1. At this time, the segmented embedded heat pipes 2 are interconnected through flexible heat pipes 5, and the compartment plate 1 is in a homogenized state. The heat generated by the high heat-consuming equipment is quickly conducted and extended to all parts of the compartment plate 1 or to the cooler individual units, and dissipated into the cold space to avoid overheating.

[0056] When the satellite switches from peak power mode to constant power mode, high heat-consuming equipment is shut down or put into standby mode. In the initial stage, the cabin plate 1 is still in a homogenization state. As the cabin plate 1 dissipates heat rapidly, the temperature of the drive component 7 gradually decreases. When the temperature decreases to the range of Ms to Mf, the drive component 7 begins to switch from memory shape two to memory shape one. Under the push of the reset spring 8, the second rigid section 11 of the external heat-conducting end moves upward and away from the surface of the cabin plate 1. The cabin plate 1 returns to the state of multiple independent thermal control zones.

[0057] During satellite operation, a tidal satellite cooling system can actively switch thermal control states repeatedly according to its operating mode, achieving a tidal thermal control effect of rapid heat dissipation during peak power consumption and slow heat dissipation during constant power consumption.

[0058] The specific embodiments of the present invention disclosed above are merely illustrative of the invention. These embodiments do not exhaustively describe all details, nor do they limit the invention to the specific embodiments described. Many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the invention, thereby enabling those skilled in the art to better understand and utilize the invention.

Claims

1. A tidal satellite cooling system, characterized in that: It includes an embedded heat pipe (2) and a surface-mounted heat pipe assembly (3). The embedded heat pipe (2) is installed inside the cabin plate (1). The embedded heat pipe (2) has a segmented structure. The surface-mounted heat pipe assembly (3) includes a flexible heat pipe (5), a top cover (6), a driving component (7), and a return spring (8). The flexible heat pipe (5) includes a flexible section (9), a first rigid section (10), and a second rigid section (11). The two ends of the flexible section (9) are respectively connected to the first rigid section (10) and the second rigid section (11). The first rigid section (10) and the second rigid section (11) are both connected to the cabin plate (1). The first rigid section (10) and the second rigid section (11) are respectively located above the two embedded heat pipes (2). The first rigid section (10) is located at the beginning of external heat conduction, and the second rigid section (11) is located at the end of external heat conduction. The top cover (6) The drive component (7) is located above the second rigid section (11). A drive component (7) is located between the second rigid section (11) and the top cover (6). The lower end of the second rigid section (11) is connected to the return spring (8). The other end of the return spring (8) is recessed into the compartment plate (1). The drive component (7) is a ring structure with a through hole (13) in the center along the axial direction. After the screw passes through the top cover (6), the through hole (13) of the drive component (7), the second rigid section (11), and the return spring (8) in sequence, the screw is connected to the compartment plate (1). The material of the drive component (7) is a two-way memory alloy. The two-way memory alloy realizes the shape transformation from memory shape one to memory shape two as the temperature rises, and realizes the shape transformation from memory shape two to memory shape one as the temperature falls. The axial length of the memory shape two of the drive component (7) is greater than that of memory shape one.

2. The tidal satellite cooling system according to claim 1, characterized in that: The first rigid section (10) and the second rigid section (11) are both provided with fins (12). The upper end of the fins (12) of the second rigid section (11) is connected to the driving component (7), and the lower end of the fins (12) of the second rigid section (11) is connected to the reset spring (8).

3. The tidal satellite cooling system according to claim 1, characterized in that: The two-way memory alloy is a nickel-titanium based alloy.

4. The tidal satellite cooling system according to claim 1, characterized in that: A heat-conducting pad (4) is provided between the second rigid section (11) and the cabin plate (1), and the heat-conducting pad (4) is glued and fixed to the surface of the cabin plate (1).

5. A tidal satellite cooling system according to claim 4, characterized in that: The thermal pad (4) is made of gap-filling thermally conductive material.

6. A tidal satellite cooling system according to claim 1, characterized in that: Thermal grease is applied to the bottom surface of the first rigid section (10).

7. A tidal satellite cooling system according to claim 1, characterized in that: The first rigid segment (10) and the second rigid segment (11) have the same structure.

8. A tidal satellite cooling system according to claim 1, characterized in that: The cabin panel (1) is an aluminum honeycomb panel, which has an aluminum honeycomb core in the middle and aluminum skin on both sides.

9. A tidal satellite cooling system according to claim 1, characterized in that: The embedded heat pipe (2) is a channel heat pipe.

10. A method for operating the tidal satellite heat dissipation system as described in claim 1, characterized in that: When the satellite enters orbit and is in constant power consumption mode, all drive components (7) exhibit memory shape one. Under the action of the reset spring (8), the second rigid section (11) is lifted and moved away from the surface of the cabin plate (1). The embedded heat pipes (2) of the segmented structure are in a state of mutual heat insulation. At this time, the cabin plate (1) forms multiple independent thermal control areas, thereby reducing the active thermal control power consumption. When the satellite switches from constant power consumption mode to peak power consumption mode, the equipment heats up and the heat is transferred to the external heat conduction start end through the embedded heat pipe (2). The heat from the flexible heat pipe (5) is conducted to the drive component (7). The drive component (7) changes from memory shape one to memory shape two. The drive component (7) extends and pushes the second rigid section (11) to compress the reset spring (8) and move downward until the second rigid section (11) is close to the cabin plate (1). The drive component (7) maintains memory shape two. At this time, the segmented embedded heat pipes (2) are connected to each other through the flexible heat pipe (5), and the cabin plate (1) is in a homogenized state. When the satellite switches from peak power mode to constant power mode, the equipment cools down. As the heat dissipation of the cabin plate (1) increases, the temperature of the drive component (7) gradually decreases. The drive component (7) changes from memory shape two to memory shape one. Under the push of the reset spring (8), the second rigid section (11) moves upward and away from the surface of the cabin plate (1). The cabin plate (1) returns to multiple independent thermal control areas.

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