Temperature control device and method and storage medium

Abstract

The invention provides a temperature control device, a temperature control method and a computer readable storage medium. The temperature control device comprises a plurality of heating wires which are distributed in a plurality of areas of a heating disc; the plurality of drivers are connected with the plurality of heating wires and respectively comprise a voltage and current acquisition circuit; the controller is connected with the plurality of drivers and is configured as follows: voltage and current at the two ends of the corresponding heating wire are respectively acquired through a voltage and current acquisition circuit of each driver so as to calculate the resistance value of the heating wire; according to the resistance value of each heating wire, the actual temperature of the area where the heating wire is located is determined; and according to the actual temperature of each area and the corresponding preset temperature range, the power output by each driver to the corresponding heating wire is adjusted.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, and in particular to a temperature control device, a temperature control method, and a computer-readable storage medium. Background Technology

[0002] In the field of semiconductor integrated circuit equipment, the heating plate is a core heating component in wafer processing, often divided into multiple zones, each heated by a separate resistance wire. Existing temperature control solutions mostly rely on temperature sensors such as thermocouples to collect temperature data, and then indirectly control the temperature through the relationship between resistance and temperature. Some heating equipment also uses fixed power or a fixed ratio of current to drive multi-zone heating, attempting to achieve synchronous heating. However, these solutions have significant limitations: thermocouple data collection is easily affected by environmental interference, and traditional temperature control is mostly open-loop or semi-closed-loop, making it difficult to cope with dynamic changes during the heating process. Furthermore, uneven heat dissipation on the heating plate surface can easily generate thermal stress, which may cause the heating plate to break at high temperatures, affecting process stability.

[0003] To address the aforementioned issues, the industry often reduces complexity by decreasing the number of temperature sensors, using a fixed-ratio current to synchronously heat the edge areas relative to the center area. For example, a single sensor might be placed only at the center of the heating plate. However, this improvement still doesn't solve the core defects: First, for multi-zone heating plates, placing sensors in each zone for precise temperature control would significantly increase structural complexity and manufacturing difficulty. Second, as the temperature rises, the temperature difference between the internal temperature measurement point of the sensor and the surface of the heating plate gradually increases, especially in high-dynamic scenarios such as heating and wafer placement, where accumulated temperature difference errors lead to insufficient temperature control accuracy to meet the requirements of integrated circuit equipment. Third, the fixed-ratio current in the edge areas is an open-loop control, unable to dynamically adjust according to the actual temperature difference, still posing a risk of thermal stress causing the heating plate to break. The accuracy and reliability of traditional temperature control methods are both insufficient.

[0004] In order to overcome the above-mentioned defects of the existing technology, the present invention provides a temperature control technology for real-time detection of the temperature of each area of ​​the heating plate without installing a large number of temperature sensors, thereby controlling the temperature of each area of ​​the heating plate more in real time and more accurately. Summary of the Invention

[0005] The following provides a brief overview of one or more aspects to offer a basic understanding of them. This overview is not an exhaustive summary of all conceived aspects, nor is it intended to identify key or decisive elements of all aspects, nor to define the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form as a prelude to the more detailed descriptions that follow.

[0006] To overcome the aforementioned deficiencies in the prior art, the present invention provides a temperature control device, a temperature control method, and a computer-readable storage medium for real-time detection of the temperature of each area of ​​the heating plate without installing a large number of temperature sensors, thereby controlling the temperature of each area of ​​the heating plate more in real time and more accurately.

[0007] Specifically, the temperature control device provided according to the first aspect of the present invention includes: a plurality of heating wires distributed in a plurality of regions of a heating plate; a plurality of drivers connected to the plurality of heating wires and each including a voltage and current acquisition circuit; and a controller connected to the plurality of drivers and configured to: acquire the voltage and current at both ends of a corresponding heating wire via the voltage and current acquisition circuit of each driver to calculate its resistance value; determine the actual temperature of the region where each heating wire is located based on the resistance value of each heating wire; and adjust the power output by each driver to the corresponding heating wire based on the actual temperature of each region and its corresponding preset temperature range.

[0008] Furthermore, in some embodiments of the present invention, the controller is connected via a first driver to a first heating wire located in a first region of the heating plate, and via a second driver to a second heating wire located in a second region of the heating plate. The first region and the second region have a uniform preset temperature range. The controller is further configured to: determine a first actual temperature of the first region based on a first resistance value of the first heating wire, and determine a first power output by the first driver to the first heating wire based on the first actual temperature and the preset temperature range, so as to adjust the first actual temperature to the preset temperature range; and determine a second actual temperature of the second region based on a second resistance value of the second heating wire, and determine a second power output by the second driver to the second heating wire based on the second actual temperature and the preset temperature range, so as to adjust the second actual temperature to the preset temperature range.

[0009] Furthermore, in some embodiments of the present invention, the first region is the central region of the heating plate, and the second region is the edge region of the heating plate. The controller is further configured to: during the heating process, predict a first actual temperature of the first region at a future time based on a first actual temperature of the first region at the current time and a first power output by the first driver to the first heating wire at the current time; and determine a second power output by the second driver to the second heating wire at the current time based on a second actual temperature of the second region at the current time and a first actual temperature of the first region at a future time, so that the second actual temperature of the second region at a future time is within the range of the first actual temperature at a future time.

[0010] Furthermore, in some embodiments of the present invention, the controller is equipped with a resistance-temperature mapping curve of each heating wire calibrated by a temperature sensor. The step of determining the actual temperature of the area where each heating wire is located based on the resistance value of each heating wire includes: substituting the resistance value of each heating wire into the corresponding resistance-temperature mapping curve to determine the actual temperature of the area where each heating wire is located.

[0011] Furthermore, in some embodiments of the present invention, the temperature sensor is further provided in the first region of the heating plate, and the driver further includes a temperature acquisition circuit. The step of calibrating the resistance-temperature mapping curve includes: obtaining the highest target temperature of the heating plate, a preset temperature rise step, and a preset constant temperature interval; gradually increasing the first power provided by the first driver to the first heating wire disposed in the first region, and acquiring the first temperature of the surface of the first region at different times via the temperature sensor, so as to control the surface of the first region to be constant at a constant temperature interval for each temperature rise step below the highest target temperature; acquiring the first voltage and first current of the first heating wire at each constant temperature interval to calculate its first resistance value; and calibrating its first resistance-temperature mapping curve based on the first resistance value and first temperature of the first heating wire at each constant temperature interval.

[0012] Furthermore, in some embodiments of the present invention, the step of determining the actual temperature of the area where each heating wire is located based on the resistance value of each heating wire further includes: obtaining the temperature control mode of the heating plate; when the temperature control mode is constant temperature control, substituting the resistance value of each heating wire into the corresponding resistance-temperature mapping curve to determine the actual temperature of the area where each heating wire is located; and when the temperature control mode is heating control, inputting the resistance value of each heating wire and the preset temperature control parameters of the corresponding driver into a pre-constructed mathematical model to obtain the actual temperature of the area where each heating wire is located, wherein the preset temperature control parameters include at least the power output by the corresponding driver to the heating wire.

[0013] Further, in some embodiments of the present invention, the step of constructing the mathematical model includes: obtaining the first resistance value of the first heating wire disposed in the first region of the heating plate at multiple times, the first actual temperature of the first region at each corresponding time, and the first preset temperature control parameter at each corresponding time, and systematically identifying them to obtain a target mathematical relationship between the first resistance value and the first preset temperature control parameter with respect to the first actual temperature, wherein the target mathematical relationship is a linear relationship; and constructing a multi-input single-output mathematical model based on the target mathematical relationship, wherein the first input of the mathematical model is the first resistance value of the first heating wire, the second input of the mathematical model is the first preset temperature control parameter at the corresponding time, and the output of the mathematical model is the first actual temperature of the first region at the corresponding time.

[0014] Furthermore, in some embodiments of the present invention, the preset temperature control parameter also includes the ambient temperature of the heating plate.

[0015] Furthermore, in some embodiments of the present invention, the heating plate is further provided with a thermocouple, the driver further includes a temperature acquisition circuit, and the controller is further configured to: redundantly acquire a third actual temperature of the area where the thermocouple is located via the temperature acquisition circuit; and adjust the power output by the corresponding driver to the corresponding heating wire according to the third actual temperature, and the first actual temperature and / or the second actual temperature of the corresponding area.

[0016] Furthermore, in some embodiments of the present invention, the driver is a DC driver, and a sampling resistor is provided at the far end of the heating wire connected to the driver. The resistance value of the sampling resistor is much smaller than the resistance value of the heating wire. The step of acquiring the voltage and current across the corresponding heating wire via the voltage and current acquisition circuit of each driver to calculate its resistance value includes: acquiring the voltage across the heating wire via a first voltmeter; acquiring the voltage across the sampling resistor via a second voltmeter and dividing it by its resistance value to calculate the current flowing through the heating wire; and dividing the voltage across the heating wire by the current flowing through the heating wire to calculate the resistance value of the heating wire.

[0017] Furthermore, in some embodiments of the present invention, an amplifier circuit is connected in parallel across the sampling resistor to amplify the voltage across the sampling resistor, thereby improving the current resolution of the voltage and current acquisition circuit.

[0018] Furthermore, in some embodiments of the present invention, the driver is a DC driver, which further includes a power factor correction circuit and a DC-DC circuit. The input terminal of the power factor correction circuit is connected to an AC power supply, and its output terminal is connected to the input terminal of the DC-DC circuit. It is used to rectify and chop the AC signal provided by the AC power supply into a pulsed DC signal, and to control the output power by adjusting the duty cycle of its switching transistors. The output terminal of the DC-DC circuit is connected to the heating wire, and it drives the resonant inductor, resonant capacitor and transformer through the alternating conduction of multiple switching transistors to achieve zero-voltage switching and zero-current switching.

[0019] Furthermore, in some embodiments of the present invention, the DC-DC circuit includes an isolation transformer for achieving electrical isolation between its input and output terminals, preventing the DC component and / or low-frequency interference signals at the input terminal from being transmitted to the output terminal, and preventing a fault at the output terminal from affecting the circuit at the input terminal. The output terminal is also provided with a secondary rectifier circuit and a secondary filter circuit for performing secondary rectification and filtering on the AC induction signal obtained at the output terminal to obtain a DC drive voltage.

[0020] Furthermore, in some embodiments of the present invention, the driver further includes an EMI circuit, which utilizes the different impedance characteristics of inductors and capacitors to electromagnetic waves of different frequencies to bypass high-frequency interference signals in the driver to ground or filter and attenuate them, thereby reducing the intensity of electromagnetic interference.

[0021] Furthermore, in some embodiments of the present invention, the controller is also communicatively connected to a host computer for uploading control parameters of each of the drivers and / or the actual temperature of the area where each of the heating wires is located to the host computer, and / or receiving the preset temperature range sent by the host computer.

[0022] Furthermore, the temperature control method provided by the second aspect of the present invention includes the following steps: collecting the voltage and current at both ends of a plurality of heating wires distributed in a plurality of regions of a heating plate, respectively, to calculate their resistance values; determining the actual temperature of the region where each heating wire is located based on the resistance value of each heating wire; and adjusting the power output by the corresponding driver to each heating wire based on the actual temperature of each region and its corresponding preset temperature range.

[0023] Furthermore, according to a third aspect of the present invention, a computer-readable storage medium has computer instructions stored thereon. When the computer instructions are executed by a processor, the temperature control method as described in the second aspect of the present invention is implemented. Attached Figure Description

[0024] The above-described features and advantages of the present invention will be better understood after reading the following detailed description of embodiments of the present disclosure in conjunction with the accompanying drawings. In the drawings, components are not necessarily drawn to scale, and components having similar related characteristics or features may have the same or similar reference numerals.

[0025] Figure 1 This is a diagram illustrating the composition of a heating device according to an embodiment of the present invention.

[0026] Figure 2 This is a diagram illustrating the composition of a multi-channel temperature control device according to an embodiment of the present invention.

[0027] Figure 3 A temperature control method according to some embodiments of the present invention is shown.

[0028] Figure 4 This is a diagram illustrating the composition of another multi-channel temperature control device according to an embodiment of the present invention.

[0029] Figure 5 A schematic diagram of the calibration process for the resistance-temperature mapping curve provided according to some embodiments of the present invention is shown.

[0030] Figure 6 This is a composition diagram of a driver according to an embodiment of the present invention.

[0031] Figure 7 This is a detailed circuit structure diagram of the power factor correction circuit and DC-DC circuit according to an embodiment of the present invention.

[0032] Figure 8 A schematic diagram of the control flow of a redundant design provided according to some embodiments of the present invention is shown.

[0033] Figure 9 This is a diagram illustrating the composition of a four-channel temperature control device according to an embodiment of the present invention.

[0034] Figure 10 This is a flowchart of a heating method according to an embodiment of the present invention.

[0035] Figure 11 This is a schematic diagram of the partitioning of a heating plate.

[0036] Figure 12 This is a schematic diagram of another type of heating plate partition.

[0037] Figure 13 This is a schematic diagram of another type of heating plate partition.

[0038] Figure 14 This is a schematic diagram of the heating system according to an embodiment of the present invention.

[0039] Figure 15This is a flowchart of a temperature control method for a wafer heating plate according to an embodiment of the present invention.

[0040] Figure 16 This is a flowchart illustrating the construction process of the mathematical model in an embodiment of the present invention.

[0041] Figure 17 This is a flowchart illustrating the construction process of the resistance thermometer model according to an embodiment of the present invention.

[0042] Figure 18 This is a flowchart illustrating the generation process of the resistance thermometer model according to an embodiment of the present invention.

[0043] Figure 19 This is a flowchart of another method for temperature control of a wafer heating plate according to an embodiment of the present invention.

[0044] Figure 20 This is a comparison chart of the output temperature of the mathematical model in an embodiment of the present invention and the actual measured temperature.

[0045] Figure 21 This is a schematic diagram of the temperature calculated based on resistance and the actual measured temperature according to an embodiment of the present invention.

[0046] Figure 22 This is a schematic diagram of the hardware connection when calibrating the output voltage and current of the driver according to an embodiment of the present invention.

[0047] Figure 23 This is a flowchart illustrating the calibration of the driver output voltage and current according to an embodiment of the present invention.

[0048] Figure 24 This is a schematic diagram of the hardware connection of the thermocouple sensor in the calibration process according to an embodiment of the present invention.

[0049] Figure 25 This is a flowchart of the calibration of the thermocouple sensor and the voltage acquisition process according to an embodiment of the present invention.

[0050] Figure 26 This is a structural block diagram of the temperature control device for the wafer heating plate according to an embodiment of the present invention.

[0051] Figure 27 This is a schematic diagram of the hardware structure of a computer device according to an embodiment of the present invention. Detailed Implementation

[0052] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. Although the description of the present invention is presented in conjunction with preferred embodiments, this does not mean that the features of the invention are limited to these embodiments. On the contrary, the purpose of describing the invention in conjunction with embodiments is to cover other options or modifications that may be derived based on the claims of the present invention. To provide a thorough understanding of the invention, many specific details will be included in the following description. The invention may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of the invention, some specific details will be omitted in the description.

[0053] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0054] Furthermore, the terms "upper," "lower," "left," "right," "top," "bottom," "horizontal," and "vertical" used in the following description should be understood as the orientations shown in the relevant paragraphs and accompanying drawings. These relative terms are for illustrative purposes only and do not imply that the described apparatus must be manufactured or operated in a specific orientation, and therefore should not be construed as limiting the invention.

[0055] It is understood that although terms such as "first," "second," and "third" may be used herein to describe various components, regions, layers, and / or parts, these components, regions, layers, and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, regions, layers, and / or parts. Therefore, the first components, regions, layers, and / or parts discussed below may be referred to as second components, regions, layers, and / or parts without departing from some embodiments of the present invention.

[0056] As mentioned above, in the field of IC equipment, a heater is a semiconductor processing tool used to heat the wafer placed on it. Heaters typically have multiple temperature zones, such as dual-zone heaters, four-zone heaters, six-zone heaters, etc., to define multiple heating zones. Each heating zone has a separate resistance wire to raise its temperature. Existing temperature control schemes mostly rely on temperature sensors such as thermocouples to collect temperature data, and then indirectly control the temperature through the correspondence between resistance and temperature. Some heating equipment also uses fixed power or fixed-ratio current to drive multi-zone heating, attempting to achieve synchronous heating. However, these schemes have significant limitations: thermocouple data collection is easily affected by environmental interference, and traditional temperature control is mostly open-loop or semi-closed-loop, making it difficult to cope with dynamic changes during the heating process. In single-resistance heating, due to heater materials (e.g., ceramics) and other factors, significant temperature differences may occur between certain zones during heating, resulting in different thermal stresses between the zones, leading to heater breakage and affecting process stability.

[0057] Furthermore, the industry often reduces complexity by decreasing the number of temperature sensors, using a fixed-ratio current to synchronously heat peripheral areas relative to the central area. For example, a single sensor might be placed only in the center of the heating plate. However, this improvement still doesn't address the core shortcomings. First, placing sensors in each zone of a multi-zone heating plate for precise temperature control would significantly increase structural complexity and manufacturing difficulty. Second, as the temperature rises, the temperature difference between the internal temperature measurement point of the sensor and the surface of the heating plate gradually increases. Especially in high-dynamic scenarios such as heating up and placing wafers, the accumulated temperature difference error leads to insufficient temperature control accuracy to meet the requirements of integrated circuit equipment. Third, the fixed-ratio current in the peripheral areas is an open-loop control, unable to dynamically adjust according to the actual temperature difference, resulting in uneven heat dissipation on the heating plate surface, which can easily generate thermal stress and potentially cause the heating plate to break at high temperatures.

[0058] To overcome the aforementioned deficiencies in the prior art, the present invention provides a temperature control device, a temperature control method, and a computer-readable storage medium for real-time detection of the temperature of each area of ​​the heating plate without installing a large number of temperature sensors, thereby controlling the temperature of each area of ​​the heating plate more in real time and more accurately.

[0059] In some non-limiting embodiments, the temperature control method provided in the second aspect of the present invention can be implemented based on the temperature control device provided in the first aspect of the present invention. Specifically, the temperature control device is equipped with a memory and a processor. The memory includes, but is not limited to, the computer-readable storage medium provided in the third aspect of the present invention, on which computer instructions are stored. The processor is connected to the memory and is configured to execute the computer instructions stored in the memory to implement the temperature control method provided in the second aspect of the present invention.

[0060] Please refer to the details. Figures 1-2 , Figure 1This is a diagram illustrating the composition of a heating device according to an embodiment of the present invention. Figure 2 This is a diagram illustrating the composition of a multi-channel temperature control device according to an embodiment of the present invention.

[0061] like Figure 1 As shown, the temperature control device includes multiple heating wires, multiple drivers, and a controller. The multiple heating wires are distributed across multiple areas of the heating plate. Each driver is connected to one of the heating wires and includes a voltage and current acquisition circuit. The controller is connected to the drivers and is configured to: acquire the voltage and current across the corresponding heating wire via the voltage and current acquisition circuit of each driver to calculate its resistance value; determine the actual temperature of its corresponding area based on the resistance value of each heating wire; and adjust the power output from each driver to the corresponding heating wire based on the actual temperature of each area and its corresponding preset temperature range.

[0062] Please refer to the reference. Figure 1 and Figure 2 The controller is connected to a first heating wire located in a first region of the heating plate via a first driver, and to a second heating wire located in a second region of the heating plate via a second driver. The first region and the second region have a unified preset temperature range. The controller is further configured to: determine a first actual temperature of the first region based on a first resistance value of the first heating wire, and determine a first power output by the first driver to the first heating wire based on the first actual temperature and the preset temperature range, so as to adjust the first actual temperature to the preset temperature range; and determine a second actual temperature of the second region based on a second resistance value of the second heating wire, and determine a second power output by the second driver to the second heating wire based on the second actual temperature and the preset temperature range, so as to adjust the second actual temperature to the preset temperature range.

[0063] In some embodiments, the measured second resistance value is not equal to the first resistance value, and the determined second actual temperature is not equal to the first actual temperature. Accordingly, the second power output by the second driver to the second heating wire is not equal to the first power output by the first driver to the first heating wire.

[0064] Specifically, to address the aforementioned issues, this embodiment provides a multi-channel temperature control device comprising: a controller and multiple drivers. The controller is connected to each driver, and each driver is connected to a heating wire, with each heating wire positioned in a different area of ​​the heating device. Here, the controller is used to deduce the current temperature of each heating wire based on its resistance value, and based on the current temperature and a preset temperature range, outputs a control command to the corresponding driver; the driver is used to output a target power to the corresponding heating wire based on the control command; the target power is used to heat the heating wire to a uniform preset temperature range.

[0065] Specifically, in some cases, when the heating equipment supports zoning, the heating equipment is divided into different zones, and a single heating wire is used to heat the surface of the heating equipment in each zone. The heating wires are generally connected in parallel, so that when a single heating wire is damaged, the problem can be located and replaced immediately.

[0066] Specifically, since the resistance of the heating wire varies at different temperatures, for heating wires with good linearity, the resistance of different resistance wires can be measured to reflect the surface temperature of the current range. This allows for temperature control of that area. It also reduces the need for temperature measurement sensors and lowers production costs.

[0067] Specifically, the controller independently controls the output power of each driver. The controller calculates the current temperature of each heating wire based on its resistance value. Based on the current temperature and a preset temperature range, the controller adjusts the output power of the drivers to gradually bring the temperature of the corresponding heating wire closer to the preset temperature range. This ensures that the temperature of each heating zone remains within a certain preset temperature range while independently controlling each heating wire, thus guaranteeing uniform temperature control and ensuring the reliability and safety of the heater.

[0068] Please refer to Figure 3 , Figure 3 A temperature control method according to some embodiments of the present invention is shown.

[0069] like Figure 3 As shown, the controller of this temperature control device can first execute step S101: collecting the voltage and current across multiple heating wires distributed in multiple areas of the heating plate to calculate their resistance values. Then, the controller can execute step S102: determining the actual temperature of the area where each heating wire is located based on its resistance value. Finally, the controller can execute step S103: adjusting the power output from the corresponding driver to each heating wire based on the actual temperature of each area and its corresponding preset temperature range.

[0070] In some embodiments, the first region is the central region of the heating plate, and the second region is the edge region of the heating plate. The controller is further configured to: during the heating process, predict a first actual temperature of the first region at a future time based on a first actual temperature of the first region at the current time and a first power output by the first driver to the first heating wire at the current time; and determine a second power output by the second driver to the second heating wire at the current time based on a second actual temperature of the second region at the current time and a first actual temperature of the first region at a future time, so that the second actual temperature of the second region at a future time follows the first actual temperature at a future time. Here, the following range is a safe range of temperature difference between the inner and outer rings calibrated according to the heating plate breakage data, which can be expressed as: ,in, The first actual temperature for a future moment. The second actual temperature at a future time, a can be between -5 and 0, and b can be between 10 and 15.

[0071] Here, the first actual temperature of the first region at a future time is predicted based on the first actual temperature and the first power at the current time. Then, combined with the pre-calibrated following range, the second power output by the second driver to the second heating wire at the current time is dynamically determined. This keeps the temperature difference between the first region and the second region within the following range, thereby preventing the heating plate from breaking due to excessive temperature differences between the inner and outer rings.

[0072] Please refer to Figure 4 , Figure 4 This is a diagram illustrating the composition of another multi-channel temperature control device according to an embodiment of the present invention.

[0073] In some alternative implementations, such as Figure 4 As shown, the controller communicates with each driver via a CAN bus.

[0074] Specifically, CAN (Controller Area Network) communication is a serial communication protocol widely used in automotive electronics, industrial automation and other fields. It has advantages such as high reliability and distributed control.

[0075] Specifically, in the controller, an address is set for each driver. Control commands are transmitted to the corresponding driver via CAN communication through the dedicated address of each driver, so as to control the output power of the driver and thus realize synchronous temperature control of multiple multi-zone heating.

[0076] In some alternative implementations, such as Figure 4 As shown, the controller is also communicatively connected to a host computer for uploading control parameters of each driver and / or the actual temperature of the area where each heating wire is located to the host computer, and / or receiving preset temperature ranges sent by the host computer, and / or the aforementioned following range (i.e., the safe range indicating the temperature difference between the inner and outer rings). Here, the control parameter can be the power output by the driver to the corresponding heating wire, PID parameters, etc.

[0077] Specifically, the controller is also connected to the host computer via a communication interface; the controller uploads the control parameters of each driver and the current temperature of each heating element to the host computer via the communication interface; the controller also receives the preset temperature range sent by the host computer via the communication interface, and outputs control commands to the corresponding driver based on the preset temperature range and the resistance value of each heating element.

[0078] Specifically, Figure 4 In this context, the main function of the host computer is to send control commands and display some data uploaded by the controller through a communication interface (such as EtherCAT). The data can include, for example, the control parameters of each driver, the current temperature and resistance of each heating element, and the control parameters of the driver can include output power, output voltage, current, etc.

[0079] Specifically, for different heating wires, the resistance value of the heating wire can be measured before starting. Then, based on the resistance value, the controller outputs corresponding control commands according to the preset temperature range. The control parameters of each driver are coordinated through the bus interface (CAN communication) to achieve the overall control target of the temperature control device, so that the temperature zones of the heater surface can achieve uniform temperature and rapid temperature rise response.

[0080] This embodiment provides a heating device, including: a multi-channel temperature control device and multiple heating wires, wherein the controller is connected to each driver, each driver is connected to one heating wire, and each heating wire is disposed in a different area of ​​the heating device.

[0081] The controller is used to calculate the current temperature of each heating wire based on the resistance value of each heating wire, and outputs control commands to the corresponding driver based on the current temperature and the preset temperature range; the driver is used to output target power to the corresponding heating wire based on the control command; the target power is used to heat the temperature of the heating wire to a uniform preset temperature range.

[0082] Specifically, in the process of using multi-zone heating equipment, there is also the issue of series and parallel connection of heating wires. This embodiment supports the connection of multiple drivers to the heating equipment, enabling the heating wires in each zone of the heating equipment to be connected in parallel. Therefore, the resistance of each heating wire can be accurately collected, thereby establishing a mapping relationship between resistance and temperature of each zone. It can also avoid the problem of a single heating wire failing (melting) and causing the entire heating equipment to become unusable when the heating equipment is used in series with heating wires in multiple zones, reducing the difficulty of locating a single faulty heating wire.

[0083] Please continue to refer to this. Figure 1 In this embodiment, a heating device is provided, including: a housing and a heating device, wherein a controller is connected to each driver, each driver is connected to a heating wire, and each heating wire is disposed in a different area inside the housing.

[0084] The controller is used to calculate the current temperature of each heating wire based on the resistance value of each heating wire, and outputs control commands to the corresponding driver based on the current temperature and the preset temperature range; the driver is used to output target power to the corresponding heating wire based on the control command; the target power is used to heat the temperature of the heating wire to a uniform preset temperature range.

[0085] In some embodiments, the controller has a built-in resistance-temperature mapping curve for each heating wire calibrated by a temperature sensor. The step of determining the actual temperature of the area where each heating wire is located based on its resistance value includes: substituting the resistance value of each heating wire into the corresponding resistance-temperature mapping curve to determine the actual temperature of the area where each heating wire is located.

[0086] Specifically, in some optional implementations, the controller has a built-in resistance-temperature curve for each heating wire. The controller outputs control commands to the corresponding driver based on the resistance-temperature curve and the resistance value of the heating wire. The resistance-temperature curve is obtained by fitting the resistance value of the heating wire at different temperatures.

[0087] Specifically, during the heating process, the controller records the resistance value of each heating wire at different temperatures and maps the temperature to the resistance value, thereby establishing a resistance-temperature curve for each heating wire. During the next heating, the controller obtains the current temperature of the heating wire from the resistance-temperature curve based on the current resistance value of the heating wire, and then outputs a control command.

[0088] Please refer to Figure 5 , Figure 5 A schematic diagram of the calibration resistance-temperature mapping curve provided according to some embodiments of the present invention is shown.

[0089] like Figure 5 As shown, a temperature sensor (e.g., a thermocouple) is also provided in the first region of the heating plate, and the driver also includes a temperature acquisition circuit. The steps for calibrating the resistance-temperature mapping curve include: obtaining the highest target temperature of the heating plate, a preset temperature rise step, and a preset constant temperature interval; gradually increasing the first power supplied by the first driver to the first heating wire located in the first region, and acquiring the first temperature of the surface of the first region at different times via the temperature sensor to control the surface of the first region to remain within the range below the highest target temperature, maintaining a constant temperature interval for each temperature rise step; acquiring the first voltage and first current of the first heating wire at each constant temperature interval to calculate its first resistance value; and calibrating its first resistance-temperature mapping curve based on the first resistance value and first temperature of the first heating wire at each constant temperature interval. Therefore, by determining the resistance-temperature mapping curve of the heating wire, the present invention can quickly determine the temperature distribution on the surface of the heating plate based on the resistance value of the heating wire.

[0090] In some embodiments, the first power supplied by the first driver to the first heating wire located in the first region can be increased from 0 or from any power value to improve heating efficiency.

[0091] In some embodiments, the first voltage and first current of the first heating wire at each constant temperature interval can be collected at the end of the constant temperature interval to calculate the resistance value at the end of the constant temperature interval, or the voltage and current can be collected multiple times throughout the constant temperature interval to calculate the average resistance value of the entire constant temperature interval.

[0092] Furthermore, the first region is a target heating region, and further, the step of collecting the first temperature of the surface of the target heating region at different times includes: collecting the first temperature of the surface of the target heating region at different times via a thermocouple disposed in the target heating region.

[0093] In some embodiments, the target heating area is the central region of the heating plate, and a second heating wire is further provided in the edge region of the heating plate. The calibration method further includes the following steps: providing a second power to the second heating wire synchronously with the first power according to a preset ratio, wherein the preset ratio is less than 1; collecting the second voltage and second current of the second heating wire at the end of each constant temperature interval to calculate its second resistance value; and calibrating the second resistance-temperature mapping curve of the second heating wire based on the second resistance value of the second heating wire at the end of each constant temperature interval and the first temperature at the corresponding constant temperature interval. Here, the temperature rise step can be between 50°C and 100°C, and the constant temperature interval can be between 5 minutes and 10 minutes.

[0094] In some embodiments, a first sampling resistor is provided at the distal end of the first heating wire connected to its driver. The resistance value of the first sampling resistor is much smaller than the first resistance value of the first heating wire. The step of collecting the first voltage and first current of the first heating wire at each constant temperature interval includes: collecting the voltage across the first heating wire as the first voltage; and collecting the voltage across the first sampling resistor and dividing it by its resistance value to calculate the first current. And / or a second sampling resistor is provided at the distal end of the second heating wire connected to its driver. The resistance value of the second sampling resistor is much smaller than the second resistance value of the second heating wire. The step of collecting the second voltage and second current of the second heating wire at the end of each constant temperature interval includes: collecting the voltage across the second heating wire as the second voltage; and collecting the voltage across the second sampling resistor and dividing it by its resistance value to calculate the second current.

[0095] Furthermore, the method for calibrating the resistance-temperature mapping curve also includes the following steps: in response to the first temperature of the target heating zone surface reaching the highest target temperature, gradually reducing the first power supplied to the first heating wire, and controlling the target heating zone surface to be kept at a constant temperature interval for each temperature rise step, and collecting the first voltage and first current of the first heating wire at each constant temperature interval to calculate its first resistance value, the step includes: calculating the average of the first resistance value obtained during the heating process and the first resistance value obtained during the cooling process, as the first resistance value of the first heating wire at each constant temperature interval.

[0096] Furthermore, the calibration method also includes the following steps: in response to the first power supplied to the first heating wire returning to zero, the first power supplied to the first heating wire is gradually increased again, and the surface of the target heating area is controlled to remain within a range below the highest target temperature, with a constant temperature interval for each temperature rise step; and in response to the first temperature of the target heating area surface reaching the highest target temperature again, the first power supplied to the first heating wire is gradually decreased again, and the surface of the target heating area is controlled to remain constant temperature interval for each temperature drop step, and the first voltage and first current of the first heating wire at each constant temperature interval are collected to calculate its first resistance value, including: calculating the average of the first resistance values ​​obtained in each heating process and each cooling process as the first resistance value of the first heating wire at each constant temperature interval.

[0097] Furthermore, the target heating area is the central region of the heating plate, and a second heating wire is also provided in the edge region of the heating plate. The calibration method also includes the following steps: placing a temperature measuring wafer on the heating plate, wherein multiple thermocouples are provided in the edge region of the temperature measuring wafer; providing a second power to the second heating wire synchronously with the first power according to a preset ratio, wherein the preset ratio is less than 1; acquiring the second temperature of the edge region surface at each constant temperature interval via the temperature measuring wafer; acquiring the second voltage and second current of the second heating wire at each constant temperature interval to calculate its second resistance value; and calibrating the second resistance-temperature mapping curve of the second heating wire based on the second resistance value and second temperature of the second heating wire at each constant temperature interval.

[0098] Here, the first resistance-temperature mapping curve is represented as: ,in, The first temperature of the first heating wire. The first resistance value of the first heating wire. , and The fitting coefficients for the first resistance-temperature mapping curve and / or the second resistance-temperature mapping curve are represented as follows: ,in, The second temperature is the second temperature of the second heating wire. This is the second resistance value of the second heating wire. , and The fitting coefficients are those for the second resistance-temperature mapping curve.

[0099] In addition, the controller is configured to: acquire a first voltage and a first current of the first heating wire to calculate its first resistance value; substitute the first resistance value into a first resistance-temperature mapping curve to determine a first temperature of the target heating zone surface; and adjust the first power supplied by the driver to the first heating wire according to the first temperature so that the target heating zone surface reaches a preset target temperature.

[0100] Furthermore, the step of determining the actual temperature of the area where each heating wire is located based on its resistance value can further include: S1021: Obtaining the temperature control mode of the heating plate. S1022: When the temperature control mode is constant temperature control, substituting the resistance value of each heating wire into the corresponding resistance-temperature mapping curve to determine the actual temperature of the area where each heating wire is located. S1023: When the temperature control mode is heating control, inputting the resistance value of each heating wire and the preset temperature control parameters of the corresponding driver into the pre-constructed mathematical model to obtain the actual temperature of the area where each heating wire is located, wherein the preset temperature control parameters at least include the power output by the corresponding driver to the heating wire.

[0101] Therefore, in constant temperature control, the resistance thermometer model can meet the accuracy requirements and is simpler and more convenient. However, in the case of temperature rise, calculating the temperature at a certain point using the lookup table method will have a lag, and the lookup table method cannot be very precise when the resolution is very low. In this case, it is more suitable to use a mathematical model that has the advantage of predicting temperature change trends in advance to calculate the temperature. By selecting the appropriate model for temperature calculation in different scenarios, this invention can make full use of the advantages of both models, balancing the convenience and accuracy of temperature measurement.

[0102] Further, the steps for constructing the mathematical model include: S1023-1: Obtaining the first resistance value of the first heating wire located in the first region of the heating plate at multiple times, the first actual temperature of the first region at each corresponding time, and the first preset temperature control parameter at each corresponding time, and systematically identifying them to obtain the target mathematical relationship between the first resistance value and the first preset temperature control parameter with respect to the first actual temperature, wherein the target mathematical relationship is a linear relationship. S1023-2: Based on the target mathematical relationship, constructing a multi-input single-output mathematical model, wherein the first input of the mathematical model is the first resistance value of the first heating wire, the second input of the mathematical model is the first preset temperature control parameter at the corresponding time, and the output of the mathematical model is the first actual temperature of the first region at the corresponding time. Thus, by constructing a multi-input single-output model that can comprehensively consider the influence of multiple input parameters on temperature, the present invention can more comprehensively reflect the temperature change law of the heating zone. Furthermore, by using the power parameter as input, the present invention can more directly reflect the control effect of heating power on temperature, thereby improving the model's ability to describe the temperature control process and the control effect.

[0103] Furthermore, the preset temperature control parameters also include the ambient temperature of the heating plate. By incorporating the ambient temperature into the preset temperature control parameters, this invention can more comprehensively consider the impact of environmental factors on the temperature of the heating zone, thereby further improving the accuracy of temperature measurement and control.

[0104] In addition, in some alternative implementations, the driver is a DC driver; the driver converts the input AC power into DC power.

[0105] In this context, DC control has advantages over AC control in terms of control precision, response speed, speed regulation smoothness, and energy utilization efficiency. Specifically, regarding control precision and response speed, DC can achieve precise and linear speed control simply by adjusting the voltage, with a fast response (no AC commutation delay). AC control, on the other hand, requires processing parameters such as frequency and phase, resulting in more complex algorithms and generally lower precision and response speed compared to DC. In terms of speed regulation smoothness, DC control can achieve stepless smooth speed regulation from extremely low speeds to rated speeds without "jitter" or "jerking." AC control (especially the traditional thyristor method) is prone to coarse speed regulation at low speeds due to waveform distortion. Regarding energy utilization efficiency, at low power output, the voltage regulation losses in a DC system are far lower than the waveform chopping losses in an AC system. Furthermore, DC does not have the "reactive power" of AC, making energy transmission and utilization more direct and efficient.

[0106] Furthermore, DC detection has advantages over AC detection in terms of signal stability, detection complexity and cost, accuracy, and interference resistance. Specifically, regarding signal stability, DC signals (such as voltage and current) are constant "linear" signals with no periodic changes in amplitude or direction; while AC signals are "sine waves," constantly fluctuating, requiring additional processing for "peak / RMS conversion" during detection, a step unnecessary for DC detection, resulting in more intuitive and stable data. In terms of detection complexity and cost, DC detection only requires measuring a constant voltage or current (e.g., direct reading with a multimeter), with simpler circuitry and equipment (e.g., a standard DC voltmeter and shunt); AC detection requires consideration of frequency (e.g., 50Hz / 60Hz) and phase shift, necessitating equipment with "AC coupling" and "RMS calculation" functions, leading to higher complexity and cost. Regarding accuracy and interference resistance, DC signals have no "zero-crossing" or frequency interference, making them less susceptible to external electromagnetic interference and resulting in lower reading errors; AC detection is easily affected by interference from the same frequency power grid (e.g., noise and harmonics), especially in low-amplitude detection scenarios, where accuracy is more difficult to guarantee.

[0107] Furthermore, direct resistor acquisition offers advantages over third-party devices like Hall effect sensors in terms of cost, hardware complexity, response speed, interference resistance, and accuracy. Specifically, regarding cost and hardware complexity, direct acquisition eliminates the need for additional Hall effect sensors and their associated power supplies and amplifiers. It utilizes basic circuitry such as voltage dividers and current limiters, combined with Ohm's law for design calculations. In terms of response speed, direct acquisition provides real-time readings of the voltage and current across the resistor, with no intermediate conversion steps, resulting in delays typically in the microsecond (μs) range. Hall effect sensors, on the other hand, undergo a process of "current generating a magnetic field – magnetic field inducing a Hall voltage – voltage signal amplification," incurring a fixed delay in the millisecond (ms) range, making them unsuitable for high-speed dynamic resistance monitoring. Regarding interference resistance and accuracy, direct acquisition is only affected by the accuracy of the sampling element (such as a high-precision resistor or ADC), without external magnetic field interference. Hall effect sensors are susceptible to surrounding magnetic components and temperature drift, introducing additional "magnetic-to-electrical conversion errors," requiring complex calibration to ensure accuracy. Direct acquisition, however, provides stable output without calibration.

[0108] Specifically, the driver is a DC driver, and a sampling resistor is provided at the far end of the heating wire connected to the driver (the end furthest from the heating wire and unaffected by its temperature) to overcome the problem that the Hall coil cannot collect DC current. The resistance value of the sampling resistor is much smaller than the resistance value of the heating wire, for example, less than 1% of the heating wire's resistance value. The steps of collecting the voltage and current across the corresponding heating wire via the voltage and current acquisition circuit of each driver to calculate its resistance value include: collecting the voltage across the heating wire via a first voltmeter; collecting the voltage across the sampling resistor via a second voltmeter, and then dividing it by its resistance value to calculate the current flowing through the heating wire; and dividing the voltage across the heating wire by the current flowing through the heating wire to calculate the resistance value of the heating wire.

[0109] Please refer to Figures 6-7 , Figure 6 This is a composition diagram of a driver according to an embodiment of the present invention. Figure 7 This is a detailed circuit structure diagram of the power factor correction circuit and DC-DC circuit according to an embodiment of the present invention.

[0110] like Figure 6 As shown, the driver is a DC driver, which also includes a power factor correction circuit and a DC-DC circuit. The input of the power factor correction circuit is connected to an AC power supply, while its output is connected to the input of the DC-DC circuit. It rectifies and chops the AC signal provided by the AC power supply into a pulsed DC signal, and controls the output power by adjusting the duty cycle of its switching transistors. The output of the DC-DC circuit is connected to a heating wire, which drives a resonant inductor, resonant capacitor, and transformer through the alternating conduction of multiple switching transistors to achieve zero-voltage switching and zero-current switching.

[0111] Specifically, the driver includes a power factor correction circuit and a DC-DC circuit, which together constitute an AC-DC conversion and power circuit. The AC-DC conversion and power circuit is mainly used to convert the input AC power into DC power and to supply power to other devices; its output power is controlled by a controller.

[0112] Specifically, the input terminal of the power factor correction circuit is an AC power input terminal, the output terminal of the power factor correction circuit is connected to the input terminal of the DC-DC circuit, and the output terminal of the DC-DC circuit is connected to the heating wire.

[0113] Optionally, such as Figure 7 As shown, the power factor correction circuit can stabilize the pulsating DC voltage to 380V. The DC-DC circuit is a full-bridge LLC resonant converter circuit. By alternately turning on two switching transistors (MOSFETs), it drives the resonant inductor, resonant capacitor and transformer to achieve zero voltage switching (ZVS) and zero current switching (ZCS). The output of the transformer secondary side is rectified and filtered to obtain a stable DC output voltage.

[0114] Optionally, Figure 7 The DC-DC circuit in the circuit can also be a two-transistor forward converter. High-voltage DC power enters the two-transistor forward converter, and through the alternating conduction of two switching transistors (MOSFETs), it drives the transformer to achieve energy transfer.

[0115] In some optional implementations, the controller includes a first control module and a second control module, wherein the first control module is used to control the operating state of the power factor correction circuit; and the second control module is used to control the operating state of the DC-DC circuit.

[0116] In some alternative implementations, the first control module and the second control module are connected via an isolated SCI communication circuit.

[0117] In some optional implementations, the DC-DC circuit includes an isolation transformer to provide electrical isolation between its input and output terminals, preventing DC components and / or low-frequency interference signals from the input terminal from being transmitted to the output terminal, and preventing output terminal faults from affecting the input terminal circuitry. The output terminal also includes a secondary rectifier circuit and a secondary filter circuit to perform secondary rectification and filtering on the AC inductive signal obtained at the output terminal to obtain a DC drive voltage.

[0118] Specifically, such as Figure 6 As shown, the driver also includes an isolation circuit to separate the input and output sections, preventing the risk of electric shock and providing personal safety protection measures. Optionally, when the DCDC circuit is... Figure 7 In a medium-sized structure, the isolation circuit can be a transformer. The primary and secondary windings of the transformer transfer energy through electromagnetic induction, while being electrically insulated from each other. This avoids direct electrical connection between the primary and secondary circuits, thus preventing DC components or low-frequency interference signals from being transmitted from the primary circuit to the secondary circuit. At the same time, it also prevents faults in the secondary circuit from affecting the primary circuit, improving the stability and reliability of the circuit.

[0119] In some alternative implementations, such as Figure 6 As shown, the driver also includes a voltage and current acquisition circuit.

[0120] During the heating process, the controller controls the output power of the driver based on the resistance value of the heating wire. In the entire closed-loop control process, it is necessary to collect the current and voltage of the driver and control the output power by controlling the duty cycle of each switch or the switching sequence of the switch.

[0121] The voltage and current acquisition circuit is also used to acquire the voltage and current across the resistor based on the DC output, thereby calculating the real-time resistance. This resistance is then used to calculate the temperature for temperature control. Compared to AC output system equipment, resistance calculation is simpler because it eliminates the need to consider factors such as phase difference.

[0122] In some alternative implementations, the driver also includes an EMI circuit that utilizes the different impedance characteristics of inductors and capacitors to electromagnetic waves of different frequencies to bypass or filter high-frequency interference signals in the driver to reduce the intensity of electromagnetic interference.

[0123] Specifically, such as Figure 6 As shown, the driver also includes an EMI circuit, which controls the propagation of electromagnetic interference through filtering, shielding, and grounding. It utilizes components such as inductors and capacitors to exhibit different impedance characteristics to electromagnetic waves of different frequencies, bypassing or filtering high-frequency interference signals on power lines or signal lines to ground, thereby reducing the intensity of electromagnetic interference.

[0124] Please refer to the reference. Figure 6 and Figure 8 , Figure 8 A schematic diagram of the control flow of a redundant design provided according to some embodiments of the present invention is shown.

[0125] like Figure 6 and Figure 8As shown, in some optional embodiments, the heating plate is further provided with a thermocouple, the driver further includes a temperature acquisition circuit, and the controller is further configured to: redundantly acquire a third actual temperature of the area where the thermocouple is located via the temperature acquisition circuit; and adjust the power output of the corresponding driver to the corresponding heating wire based on the third actual temperature, and the first and / or second actual temperatures of the corresponding area. Thus, by simultaneously configuring a redundant design for thermocouple temperature measurement and resistance value temperature measurement, both the response speed of temperature acquisition and the control accuracy of the heating plate temperature are considered.

[0126] Specifically, the driver also includes a temperature acquisition circuit, which collects the temperature at a specific location on the heating device to prevent large temperature deviations during temperature control. It can also be used to establish a correlation between temperature and resistance for temperature acquisition. This temperature acquisition circuit is a redundant module. Due to variations in heating devices, a temperature-resistance correlation needs to be established upon first use to reduce errors and facilitate temperature control.

[0127] In some embodiments, the step of adjusting the power output by the driver to the heating wire based on a first actual temperature and / or a second actual temperature and a third actual temperature includes: during the heating process of the heating plate, performing PID control based on the first actual temperature and / or the second actual temperature and the third actual temperature to adjust the power output by the driver to the heating wire.

[0128] In some embodiments, during the heating process of the heating plate, the step of adjusting the power output by the driver to the heating wire based on a first actual temperature and / or a second actual temperature and a third actual temperature includes: comparing the first actual temperature and / or the second actual temperature with a preset temperature threshold during the heating process of the heating plate; in response to the first actual temperature and / or the second actual temperature being less than the temperature threshold, performing first PID control based on the first actual temperature and / or the second actual temperature to adjust the power output by the driver to the heating wire; and in response to the first actual temperature and / or the second actual temperature being greater than or equal to the temperature threshold, performing second PID control based on the third actual temperature to adjust the power output by the driver to the heating wire.

[0129] In some embodiments, the step of performing second PID control based on a third actual temperature to adjust the power output by the driver to the heating wire in response to a first actual temperature and / or a second actual temperature being greater than or equal to a temperature threshold includes: firstly correcting the third actual temperature based on the first actual temperature and / or the second actual temperature to lock the first PID parameter of the first PID control within a preset time window, and then determining the second PID parameter based on the third actual temperature to perform second PID control.

[0130] In some embodiments, the step of first correcting a third actual temperature based on the first and / or second actual temperatures to lock a first PID parameter of the first PID control within a preset time window, and then determining a second PID parameter based on the third actual temperature to perform second PID control, in response to the first and / or second actual temperatures being greater than or equal to a temperature threshold, includes: determining a correction value based on the difference between the current first and / or second actual temperatures and the third actual temperature, and adding it to the subsequent third actual temperature to determine the corrected third actual temperature; and within the preset time window, first determining the corresponding first PID parameter based on the corrected third actual temperature, and then determining the corresponding second PID parameter based on the third actual temperature, and then gradually adjusting the weighted summation coefficient of the two to perform second PID control using the second PID parameter at the end of the preset time window.

[0131] In some embodiments, the controller is further configured to: digitally filter the resistance value acquired by the voltage and current acquisition circuit in response to completing the switching between the first PID control and the second PID control, so as to filter out the fluctuation noise of the switching process.

[0132] In some embodiments, the controller is further configured to: calculate the rate of temperature rise of a first actual temperature and / or a second actual temperature between each sampling time during the heating process; and determine that the first actual temperature and / or the second actual temperature is greater than or equal to a temperature threshold in response to the rate of temperature rise being less than a preset rate of temperature rise threshold.

[0133] In some alternative implementations, the driver also includes a power supply, which is not limited to a DC-DC power supply, to power the various modules within the driver. Optionally, the DC-DC power supply can be a switching power supply, but this is only an example and not a limitation.

[0134] In some alternative implementations, such as Figure 6 As shown, the driver also includes a display circuit that can display the status and parameters related to the operation of the power supply.

[0135] In some alternative implementations, such as Figure 6 As shown, the driver also includes a button circuit, which allows the user to switch the driver's operating state, such as stopping the machine immediately.

[0136] Please refer to Figure 9 , Figure 9 This is a diagram illustrating the composition of a four-channel temperature control device according to an embodiment of the present invention.

[0137] like Figure 9As shown, in some optional implementations, for production conditions requiring high-precision temperature control, the heating wire temperature is calculated based on the heating wire resistance. In this case, the calculated heating wire temperature is the internal temperature. Due to the influence of the production environment, the actual temperatures of surfaces A, B, C, and D are affected by external factors and the material of the heating stage. The actual temperatures of surfaces A, B, C, and D will differ slightly from the heating wire temperature, failing to meet the requirements for high-precision temperature control. For example, in chip manufacturing, the heating stage is located in a vacuum chamber. Some processes fill this vacuum chamber with helium or other gases. Due to the gap between the temperature sensor and the surface, and the poor thermal conductivity in a vacuum environment, when helium is introduced, the surface temperature of the heating plate changes rapidly, rising to near the resistance wire temperature. Based on the current gas supply signal or other influencing factor signals, a relationship is established between the surface temperature and the internal resistance of each zone, or a relationship is established between the surface temperature of each zone and parameters such as the driver output power, resistance, ambient temperature, and whether gas is introduced. A mathematical relationship model is established by system identification and used to control the uniform temperature of the surface in each interval. Once the model is established, the surface temperature can be calculated through parameters, thus eliminating the need for a surface temperature sensor. Under normal production conditions, inserting a surface temperature sensor can affect production, and in some conditions, it is inconvenient to insert the sensor. This solution can solve this problem.

[0138] Please refer to Figure 10 , Figure 10 This is a flowchart of a heating method according to an embodiment of the present invention.

[0139] like Figure 10 As shown, this embodiment provides a heating method, which is applied to the multi-channel temperature control device of the above embodiments. Its specific flowchart is as follows. Figure 10 As shown, the details are as follows:

[0140] (1) Establishing a mapping relationship: First, collect the resistance values ​​of each interval at different temperatures and establish a mapping relationship between the resistance values ​​and the temperature. This is the basis for subsequent temperature calculations.

[0141] (2) Calculate the temperature of the interval: Real-time acquisition of resistance value, and calculation of the temperature of the corresponding interval based on the mapping relationship established above.

[0142] (3) Resistance change perception: During the heating process, if a room temperature object is placed in a certain range, the resistance of the heating wire in that range will decrease.

[0143] (4) Temperature trend comparison: Compare the temperature of a certain overall collection point of the equipment to determine whether there is a heating or cooling trend.

[0144] (5) Temperature control: When a change in resistance is detected in a certain area, it is determined whether the trend of the change is consistent with the trend of the overall sampling points. Then, the temperature is calculated based on the change in resistance and the temperature is controlled to the specified target.

[0145] In addition, in some embodiments, please refer to Figure 11 Figure 14 , Figure 11 A schematic diagram of the partitioning of a heating plate is shown. Figure 12 This is a schematic diagram of another type of heating plate partition. Figure 13 This is a schematic diagram of another type of heating plate partition. Figure 14 This is a schematic diagram of the heating system according to an embodiment of the present invention.

[0146] like Figure 11 and Figure 12 As shown, the relevant scheme divides the heating plate into several regions, with a corresponding thermistor heating element embedded in each region, and the heating plate is heated by this thermistor heating element. For each region within the multiple regions, an RT table model corresponding to temperature and resistance is established. The temperature is obtained by looking up the table model, thereby controlling the heating power. This scheme relies on table lookup to obtain temperature data, making it difficult to adapt to complex temperature changes, resulting in limited control accuracy. Furthermore, it relies on temperature sensors for temperature measurement, leading to problems such as high cost, slow response, and susceptibility to environmental influences.

[0147] In view of this, the present invention proposes a method for temperature control of a wafer heating plate.

[0148] According to an embodiment of the present invention, a method for temperature control of a wafer heating plate is provided. It should be noted that the steps shown in the flowchart in the accompanying drawings can be executed in a computer system such as a set of computer-executable instructions. Furthermore, although a logical order is shown in the flowchart, in some cases, the steps shown or described may be executed in a different order than that shown here.

[0149] This embodiment provides a temperature control method for a wafer heating plate, used in a controller within a heating system. Combined with... Figure 13 and Figure 14 Taking a dual-zone heating plate as an example, the heating system includes two single-zone drivers, a controller and a host computer. The controller outputs heating power through each single-zone driver to control the temperature of each zone.

[0150] Please refer to Figure 15 , Figure 15 This is a flowchart of a temperature control method for a wafer heating plate according to an embodiment of the present invention.

[0151] like Figure 15 As shown, the temperature control method for the wafer heating disk in this embodiment of the invention includes the following steps:

[0152] Step S501: Obtain the preset temperature control parameters and the resistance parameters of the thermistor heating element set inside the target heating zone in the heating plate.

[0153] Specifically, the thermistor heating element uses a thermocouple sensor.

[0154] The preset temperature parameters include at least one of power and environmental parameters. The power can be calculated by measuring the current and voltage of the thermistor heating element, while the environmental parameters are obtained by detecting the temperature using a temperature sensor.

[0155] Step S502: According to the preset standard, select either to obtain the real-time temperature of the target heating zone based on the resistance parameters and the pre-built resistance thermometer model, or to obtain the real-time temperature based on the resistance parameters, preset temperature control parameters and the pre-built mathematical model. The input of the mathematical model is the resistance parameters and the preset temperature control parameters, and the output is the real-time temperature. The mathematical model is constructed by using a system identification method.

[0156] Specifically, in the mathematical model, mathematical equations are used to represent the output and the relationship between them, so that the corresponding output can be calculated after the input is obtained. For example, in this application, there is a linear relationship between the resistance parameter, the preset temperature control parameter, and the real-time temperature. Based on this linear relationship, the optimal mathematical model is selected by system identification.

[0157] Depending on the actual situation, the use of the mathematical model and the temperature resistance meter model can be switched. A single method or a combination of both methods can be used for comparison.

[0158] Among these, the resistance thermometer model is well-suited for environments with minimal changes. In such cases, using a lookup table—that is, finding the corresponding temperature based on the resistance parameters—makes temperature monitoring simpler and more convenient. However, the lookup table method generally cannot achieve very high precision, for example, in situations with very low resolution. In such cases, a mathematical model is needed to obtain the real-time temperature.

[0159] Step S503: Adjust the heating power of the target heating zone according to the real-time temperature so that the real-time temperature reaches the target temperature.

[0160] Specifically, after obtaining the real-time temperature of each zone, proportional-integral-derivative (PID) control is performed based on the real-time temperature to control the heating power of the heating plate, so that the temperature of each zone rises at the set rate / set power to reach the specified target temperature.

[0161] In some embodiments, a uniform temperature control algorithm or an adaptive coupling coefficient dynamic adjustment algorithm is used to adjust the heating power of the target heating zone so that the real-time temperature reaches the target temperature.

[0162] by Figure 11 For example, this area has a three-zone heating plate. We will use this as an example to illustrate the multi-zone plate temperature control algorithm. First, the surface temperature of each heating zone is calculated based on the resistance according to the lookup table model or system model. Then, calculate the weighted average temperature. = (T1+T2+T3) / 3, calculate the temperature deviation Based on the current temperature deviation, it determines whether power needs to be increased, generates control quantities, performs constraint processing, and outputs the results to achieve uniform temperature control, ensuring that the temperature difference between T1, T2, and T3 is within a certain range, thus achieving uniform temperature control.

[0163] The algorithm flow is as follows:

[0164] Initialization: Set the target temperature;

[0165] The plate temperatures T1, T2, and T3 were calculated.

[0166] Calculate the weighted average temperature;

[0167] Calculate the average temperature deviation;

[0168] Generate a comprehensive control input or use an adaptive coupling coefficient as the control input;

[0169] Perform constraint processing;

[0170] Output control;

[0171] Weighted average temperature calculation:

[0172]

[0173] in, The weighted average temperature; Let i be the temperature of the i-th region; is the weighting coefficient for the i-th region (considering factors such as heat capacity and area); n is the total number of heating regions;

[0174] Temperature deviation calculation:

[0175]

[0176] The deviation between the i-th region and the average temperature;

[0177] Basic adjustment calculation:

[0178]

[0179] is the base power adjustment for region i; β is the global adjustment gain coefficient; f(·) is the nonlinear adjustment function;

[0180]

[0181] K is the adjustment curve steepness coefficient;

[0182] The thermal coupling compensation term is:

[0183]

[0184] This represents the thermal coupling compensation amount for the i-th region; is the thermal coupling coefficient between region i and region j;

[0185] Calculate the comprehensive control quantity :

[0186]

[0187] Output power is controlled based on comprehensive control variables.

[0188] Alternatively, an adaptive coupling coefficient dynamic adjustment algorithm can be used, as follows:

[0189]

[0190] The dynamic coupling coefficient between region i and region j at time k is used as the power output coefficient.

[0191] The basic coupling coefficient reflects the heat conduction characteristics caused by the inherent structure of the heating plate;

[0192] This represents the power adjustment required for region i to reach a new steady state when the power in region j undergoes a step change.

[0193] Let J be the temperature change in region j.

[0194] This is the instantaneous temperature difference term. When a sudden temperature difference occurs in adjacent regions (such as a sudden temperature rise in region j), this term immediately increases the coupling coefficient to compensate for the thermal diffusion effect in advance. The proportionality coefficient is... Determine the compensation sensitivity;

[0195] This is a cumulative temperature difference term to address the problem of continuous accumulation of small temperature differences caused by thermal inertia.

[0196] Based on dynamic coupling coefficient Control the output power.

[0197] The temperature control method for the wafer heating plate of the present invention obtains preset temperature control parameters and resistance parameters of the thermistor heating element set inside the target heating area in the heating plate. According to preset standards, it selects to obtain the real-time temperature of the target heating area based on the resistance parameters and a pre-built resistance temperature table model, or based on the resistance parameters, preset temperature control parameters and a pre-built mathematical model. The mathematical model is input to the resistance parameters and preset temperature control parameters, and outputs the real-time temperature. The mathematical model is constructed by using a system identification method, which can obtain accurate real-time temperature. Then, the heating power of the target heating area is adjusted according to the real-time temperature to make the real-time temperature reach the target temperature. By selecting two models to obtain the real-time temperature according to the actual situation, it can adapt to complex temperature change conditions, thereby improving control accuracy.

[0198] Please refer to Figure 16 , Figure 16 This is a flowchart illustrating the construction process of the mathematical model in an embodiment of the present invention.

[0199] In some embodiments, such as Figure 16 As shown, the steps for constructing a mathematical model include:

[0200] Step S601: Obtain several sets of surface temperatures of the target heating zone, as well as the resistance parameters and preset temperature control parameters at each set of surface temperatures.

[0201] Specifically, the voltage and current parameters collected from the target heating area are calibrated; the heating plate is controlled to heat up at a constant rate, and the surface temperature of the target heating area at different times is collected; the calibrated voltage, current, and preset temperature control parameters of the target heating area at different surface temperatures are collected; and the resistance parameters are calculated based on the voltage and current parameters.

[0202] Please refer to Figure 18 , Figure 18 This is a flowchart illustrating the generation process of the resistance thermometer model according to an embodiment of the present invention.

[0203] like Figure 18 As shown, the purpose of calibrating the voltage and current parameters is to accurately calibrate the driver's output voltage and current, enabling precise calculations for subsequent temperature control. After clicking the automatic voltage and current calibration button on the host computer, the controller sends a command to the driver. The driver will slowly increase the current and voltage from zero to their maximum values. Simultaneously, the driver will send the current current channel ADC data, all voltage channel ADC data, and actual measurement data to the host computer. The host computer will record the current data. Once the host computer has finished recording, the driver automatically shuts off the output, establishing the relationship between the voltage / current and the actual control signal, and writes this relationship into the driver. At this point, the automatic calibration is complete.

[0204] By calibrating the voltage and current parameters, the accuracy of the collected data was improved, and by controlling the heating plate to heat up at a constant rate, comprehensive and systematic data samples could be collected at different temperature points.

[0205] Step S602: Systematically identify the resistance parameters, preset temperature control parameters, and surface temperature to obtain the target mathematical relationship between the resistance parameters and preset temperature control parameters of the target heating zone and the surface temperature.

[0206] Specifically, the resistance parameters, preset temperature control parameters, and surface temperature are identified to obtain several initial mathematical relationships between the resistance parameters and preset temperature control parameters of the target heating zone and the surface temperature; the prediction error of the initial mathematical relationships is verified, and the initial mathematical relationship with the smallest prediction error is taken as the target mathematical relationship.

[0207] The prediction error is the difference between the predicted value calculated based on the initial mathematical relationship and the actual value.

[0208] By selecting the optimal initial mathematical relationship to construct a mathematical model, such as a linear relationship, and constructing a linear model based on this linear relationship as the final mathematical model, the mathematical model can better reflect the actual temperature characteristics of the heating zone, thereby improving the model's performance and adaptability.

[0209] Step S603: Establish a mathematical model based on the target mathematical relationship.

[0210] Specifically, the mathematical model adopts a Multiple Input Single Output (MISO) model, with preset temperature control parameters including power parameters. The MISO model can comprehensively consider the influence of multiple input parameters on temperature, enabling the model to more fully reflect the temperature change pattern of the heating zone. Using the power parameter as input can more directly reflect the control effect of heating power on temperature, improving the model's ability to describe the temperature control process and its control effect.

[0211] In one embodiment, the preset temperature control parameters include power parameters and environmental parameters.

[0212] By incorporating ambient temperature into the preset temperature control parameters, the impact of environmental factors on the heating zone temperature can be considered more comprehensively, thereby improving the accuracy of temperature measurement and control.

[0213] The identification process of the mathematical model in this application will be illustrated below with a specific example:

[0214] After testing the system and acquiring all data (resistance parameters, preset temperature control parameters, and surface temperature), an identification algorithm is used to process the data centrally to obtain estimated values ​​of the model parameters. This method is called offline identification. Online identification, on the other hand, requires knowledge of the model's structure and order. When new input and output data are obtained, a recursive identification method is used to correct the original parameter estimates to obtain new parameter estimates.

[0215] Taking this experiment as an example, the experiment was divided into black boxes according to the provided experimental information, and the identification method was offline identification. The heating plate was a dual-zone heating plate, the mathematical model was a multiple-input single-output (MISO) mathematical model, and the preset temperature control parameters included power parameters.

[0216] By inputting the resistance parameter (R) of each zone and the measured surface temperature (T) and power parameter (P) of each zone, a mathematical model is finally established. The ultimate goal is to obtain the surface temperature of each zone by inputting variables according to the mathematical model.

[0217] Let the inner circle data be R0, P0, T0; and the outer circle data be R3, P3, T3.

[0218] Taking the inner circle data as an example, the collected three columns of data R0-P0-T0 are labeled, with the two columns of data R0-P0 labeled as input and the data T0 labeled as output. Through the system's identification method, the relationship between the input (R0-P0) and the output (T0) will be identified and represented as a mathematical model.

[0219] In one example, the mathematical model for the inner circle data is a form of ARMAX model. The mathematical model for the inner circle is shown by the following formula:

[0220]

[0221]

[0222]

[0223]

[0224]

[0225] The mathematical model for the outer ring is shown by the following formula:

[0226]

[0227]

[0228]

[0229]

[0230]

[0231] In the formula, and The output of the system is represented by the surface temperatures of the inner and outer rings, respectively, and t represents time. and These represent the input at the current moment, namely the resistance parameter and the power parameter; , , and All of these are the transfer polynomials of the input signals; and The polynomial describes the dynamic characteristics of the system, either inertia or delay; e(t) represents random noise. This indicates a time interval, representing the sampling interval. For example, a data sampling time of 1 second means that the data is from the previous second.

[0232] Please refer to Figure 20 , Figure 20 This is a comparison chart of the output temperature of the mathematical model in an embodiment of the present invention and the actual measured temperature.

[0233] like Figure 20 As shown, multiple models were set based on the collected data, and then the best-performing model was selected for temperature estimation. In this embodiment, the optimal model was a linear model. During the experiment, the optimal mathematical model was identified based on the relationship between (RP) and T. The blue line represents the calculated temperature output by inputting (RP) into the current mathematical model. The black line represents the actual temperature. The better the overlap between the black and blue lines, the more accurate the mathematical model.

[0234] After obtaining the model, it is converted into an algorithm. The resistance parameter R and power parameter P obtained in real time are used to calculate the temperature of each area of ​​the disk for real-time control, thereby determining whether to increase or decrease the power to achieve the control target value.

[0235] Existing methods for temperature estimation using lookup tables can cause a sudden drop in surface temperature if a wafer at room temperature is suddenly placed on the surface under normal temperature control. This results in a delay in the reflection of the temperature at the internal center measuring point and the resistance, leading to inaccurate control. However, this invention utilizes a system identification method to accurately establish the mathematical relationship between resistance parameters, preset temperature control parameters, and surface temperature. It also considers the influence of multiple input parameters on temperature, such as the wafer addition time and ambient temperature. By setting appropriate inputs according to requirements, accurate output can be obtained. Through experimental data-driven modeling, the dynamic characteristics of the actual system can be more accurately reflected, avoiding errors caused by traditional model assumptions and improving the accuracy and reliability of the mathematical model.

[0236] Please refer to Figures 17-18 , Figure 17 This is a flowchart illustrating the construction process of the resistance thermometer model according to an embodiment of the present invention.

[0237] In some embodiments, combined with Figure 17 and Figure 18 As shown, the steps for constructing the resistance thermometer model include:

[0238] Step S701: Obtain the mapping relationship between resistance parameters and surface temperature based on several sets of surface temperatures and the resistance parameters at each set of surface temperatures;

[0239] Step S702: Construct a resistance thermometer model based on the mapping relationship.

[0240] Please refer to Figure 21 , Figure 21 This is a schematic diagram of the temperature calculated based on resistance and the actual measured temperature according to an embodiment of the present invention.

[0241] like Figure 21 As shown, an experiment was conducted, using a resistance thermometer model to calculate the temperature based on resistance and the actual measured temperature, generating a model as follows: Figure 11 The temperature data graph shown shows good consistency between the calculated temperature and the real-time measured temperature.

[0242] Specifically, the resistance thermometer model is constructed based on the mapping relationship between resistance parameters and surface temperature. Since the thermistor heating element is set inside the target heating zone, compared with the prior art which uses the thermistor heating element itself as the model, the actual temperature obtained is the temperature inside the heating plate. The embodiments of the present invention can obtain the surface temperature based on the resistance parameters, and can accurately measure the surface temperature.

[0243] In some embodiments, step S502, according to a preset standard, selects to obtain the real-time temperature of the target heating zone based on resistance parameters and a pre-built resistance thermometer model, or obtains the real-time temperature based on resistance parameters, preset temperature control parameters, and a pre-built mathematical model, including:

[0244] Step S5021: Obtain the temperature control mode of the heating plate;

[0245] Step S5022: When the temperature control mode is constant temperature control, select the real-time temperature of the target heating zone based on the resistance parameters and the pre-built resistance temperature table model.

[0246] Step S5023: When the temperature control mode is heating control, the real-time temperature is obtained based on the resistance parameters, preset temperature control parameters and pre-built mathematical model.

[0247] Specifically, in constant temperature control, using a resistance thermometer model is simple and convenient. For example, if a stable operation at 100℃ is required, a lookup table method can meet the accuracy requirements.

[0248] When heating, such as from 100℃ to 200℃, using a lookup table to calculate the temperature at a specific point during the heating process will result in a lag, and the lookup table method cannot achieve very high precision, especially with very low resolution. In such cases, a mathematical model is more suitable for calculating the temperature. Mathematical models have the advantage of predicting temperature change trends in advance.

[0249] Furthermore, this application also fully utilizes the advantages of both models by selecting the corresponding model for temperature calculation in different scenarios.

[0250] Please refer to Figure 19 , Figure 19 This is a flowchart of another method for temperature control of a wafer heating plate according to an embodiment of the present invention.

[0251] The following combination Figure 19 The overall temperature control process of this application is explained.

[0252] 1. The driver is connected to the heating plate, and the voltage and current are automatically calibrated.

[0253] 2. The heating plate is subjected to a constant rate heating experiment. Data is collected at 10 Hz, including voltage and current. The resistance is calculated in real time according to Ohm's law. At the same time, the voltage, current, resistance, power, temperature of each zone of the heating plate, and ambient temperature are recorded in the data table.

[0254] 3. Systematically identify the resistance, power, surface temperature of each zone of the heating plate, and ambient temperature in the data table.

[0255] 4. Identify the relationship between input resistance, power, ambient temperature and the surface temperature output of each zone of the heating plate, such as a linear relationship, select the optimal relationship, and establish a mathematical model.

[0256] 5. At the same time, a resistance temperature meter model is also established based on the collected data. The resistance temperature meter model is switched to be used as needed according to the actual situation. The temperature calculated based on the model can also be used as a reference value.

[0257] 6. Convert the obtained mathematical model into a corresponding control algorithm, and use the algorithm to calculate the temperature of the heating plate in that area based on the real-time collected resistance, power, and ambient temperature (T1).

[0258] 7. Based on the preset standards and the actual heating plate conditions, switch between the mathematical model or the resistance thermometer model to calculate the temperature. You can use a single method or a combination of both methods for reference and temperature control.

[0259] 8. Based on the temperature calculated for that zone of the heating plate, perform PID control to control the temperature of each zone of the heating plate to rise at the set rate / set power until the specified target value is reached.

[0260] The temperature control algorithm mainly functions to reflect the temperature of each zone by calculating the real-time resistance based on the real-time voltage and current, and to control the temperature of each zone in real time so that the temperature reaches the target value. The purpose of calibrating the voltage and current parameters is to accurately calibrate the output voltage and current of the driver so that the subsequent temperature control can be calculated accurately.

[0261] Please refer to Figures 22-23 , Figure 22 This is a schematic diagram of the hardware connection when calibrating the output voltage and current of the driver according to an embodiment of the present invention. Figure 23 This is a flowchart illustrating the calibration of the driver output voltage and current according to an embodiment of the present invention.

[0262] When calibrating the voltage and current, the driver's output must first be calibrated. Figure 22 shows a hardware connection diagram for calibrating the driver's output voltage and current. A high-precision voltmeter and a high-precision ammeter are used to measure the voltage and current from the driver output to the rated resistor, respectively. Figure 23 As shown, the driver, host computer, rated resistor, high-precision voltmeter, and high-precision ammeter are connected respectively. The host computer sends a command to start calibrating the voltage and current to the driver. The driver outputs power from 0W for 2 minutes. During this time, the host computer reads the data from the high-precision voltmeter and ammeter, as well as the original values ​​of the voltage and current channels actually acquired by the driver's ADC. The driver increases the output by 100W each time, until it reaches 3kW, with each constant power output lasting 2 minutes. The host computer reads the data from the high-precision voltmeter and ammeter, as well as the original values ​​of the voltage and current channels actually acquired by the driver's ADC for each constant power interval. After the acquisition is completed, the read values ​​and actual values ​​are calculated and a mapping relationship is established. The calculation results are stored in the corresponding driver, completing the driver output voltage and current calibration.

[0263] Please refer to Figures 24-25 , Figure 24 This is a schematic diagram of the hardware connection of the thermocouple sensor in the calibration process according to an embodiment of the present invention. Figure 25 This is a flowchart of the calibration of the thermocouple sensor and the voltage acquisition process according to an embodiment of the present invention.

[0264] Thermistor heating elements actually use thermocouple sensors, such as... Figure 24 and Figure 25As shown, thermocouple sensors generate different voltages (mV values) at different temperatures, so the temperature acquisition module is calibrated using mV values. Calculations are performed based on the different mV values ​​acquired by the ADC and the set value, thereby calibrating the acquired values ​​against the set value to make the calculated temperature more accurate.

[0265] First, during the calibration process, the host computer software can directly connect to the driver via the communication interface. A temperature acquisition module calibration command is sent to the driver. At this time, the driver enters the calibration mode and sends an output voltage command to the signal generator, with the output ranging from 0mV to 55mV, increasing by 5mV each time. For each constant voltage output interval, the actual ADC acquisition value within that 5-minute period is recorded and averaged. The set output value is also recorded. This continues until the maximum set mV value is reached. Finally, the actual acquisition value and the set value for each interval are linearly interpolated to obtain the optimal acquisition result. The mathematical correspondence is written into the driver's memory, thus completing the driver's temperature acquisition module calibration. The accurate temperature can then be calculated from the mV value generated by the TC thermocouple sensor.

[0266] This invention improves the accuracy and real-time performance of temperature control by combining mathematical models or resistance thermometer models for model optimization and selection, enabling real-time temperature control and feedback. These innovations make this solution highly reliable and efficient in practical applications.

[0267] Please refer to Figure 26 , Figure 26 This is a structural block diagram of the temperature control device for the wafer heating plate according to an embodiment of the present invention.

[0268] This invention also provides a temperature control device for a wafer heating plate, such as... Figure 26 As shown, it includes:

[0269] The parameter acquisition module 1301 is used to acquire preset temperature control parameters and resistance parameters of the thermistor heating element set inside the target heating zone in the heating plate.

[0270] The real-time temperature acquisition module 1302 is used to select, according to preset standards, to acquire the real-time temperature of the target heating zone based on resistance parameters and a pre-built resistance temperature meter model, or to acquire the real-time temperature based on resistance parameters, preset temperature control parameters and a pre-built mathematical model. The input of the mathematical model is resistance parameters and preset temperature control parameters, and the output is the real-time temperature. The mathematical model is constructed by using a system identification method.

[0271] The heating power adjustment module 1303 is used to adjust the heating power of the target heating zone according to the real-time temperature so that the real-time temperature reaches the target temperature.

[0272] The temperature control device for the wafer heating plate of this invention obtains preset temperature control parameters and the resistance parameters of the thermistor heating element located inside the target heating area in the heating plate. According to preset standards, it selects to obtain the real-time temperature of the target heating area based on the resistance parameters and a pre-built resistance temperature table model, or based on the resistance parameters, preset temperature control parameters, and a pre-built mathematical model. The mathematical model is input to the resistance parameters and preset temperature control parameters, and outputs the real-time temperature. The mathematical model is constructed using a system identification method, which can obtain accurate real-time temperature. Then, the heating power of the target heating area is adjusted according to the real-time temperature to make the real-time temperature reach the target temperature. By selecting two models to obtain the real-time temperature according to the actual situation, it can adapt to complex temperature changes and thus improve control accuracy.

[0273] Furthermore, the temperature control device for the wafer heating plate also includes:

[0274] The group parameter acquisition module is used to acquire several groups of surface temperatures of the target heating zone, as well as the resistance parameters and preset temperature control parameters of each group of surface temperatures;

[0275] The system identification module is used to systematically identify the resistance parameters, preset temperature control parameters and surface temperature, and obtain the target mathematical relationship between the resistance parameters and preset temperature control parameters of the target heating zone and the surface temperature.

[0276] The mathematical model building module is used to build mathematical models based on target mathematical relationships.

[0277] Furthermore, the group parameter acquisition module includes:

[0278] The parameter calibration module is used to calibrate the voltage and current parameters collected from the target heating zone;

[0279] The heating control module is used to control the heating plate to heat up at a constant rate and to collect the surface temperature of the target heating area at different times.

[0280] The data acquisition module is used to collect the voltage parameters, current parameters, and preset temperature control parameters of the target heating zone after calibration at different surface temperatures;

[0281] The resistance calculation module is used to calculate resistance parameters based on voltage and current parameters.

[0282] Furthermore, the system identification module includes:

[0283] The mathematical relationship acquisition module is used to identify the resistance parameters, preset temperature control parameters and surface temperature, and obtain several initial mathematical relationships between the resistance parameters and preset temperature control parameters of the target heating area and the surface temperature.

[0284] The optimal model verification module is used to verify the prediction error of the initial mathematical relation and take the initial mathematical relation with the smallest prediction error as the target mathematical relation.

[0285] Furthermore, the mathematical model adopts a multi-input single-output model, and the preset temperature control parameters include power parameters.

[0286] Furthermore, the preset temperature control parameters also include ambient temperature.

[0287] Furthermore, the temperature control device for the wafer heating plate also includes:

[0288] The mapping relationship acquisition module is used to obtain the mapping relationship between resistance parameters and surface temperature based on several sets of surface temperatures and the resistance parameters at each set of surface temperatures.

[0289] The table model acquisition module is used to construct a resistance temperature table model based on the mapping relationship.

[0290] Furthermore, the real-time temperature acquisition module includes:

[0291] Temperature control mode acquisition module, used to acquire the temperature control mode of the heating plate;

[0292] The first selection module is used to select the real-time temperature of the target heating zone based on the resistance parameters and a pre-built resistance temperature table model when the temperature control mode is constant temperature control.

[0293] The second selection module is used to obtain the real-time temperature based on the resistance parameters, preset temperature control parameters, and a pre-built mathematical model when the temperature control mode is heating control.

[0294] Please refer to Figure 27 , Figure 27 This is a schematic diagram of the hardware structure of a computer device according to an embodiment of the present invention.

[0295] This invention also provides a schematic diagram of the structure of a computer device, such as... Figure 27As shown, the computer device includes one or more processors 10, memory 20, and interfaces for connecting the components, including high-speed interfaces and low-speed interfaces. The components communicate with each other via different buses and can be mounted on a common motherboard or otherwise installed as needed. The processors can process instructions executed within the computer device, including instructions stored in or on memory to display graphical information of a GUI on external input / output devices (such as display devices coupled to the interfaces). In some alternative implementations, multiple processors and / or multiple buses can be used with multiple memories and multiple memory modules, if desired. Similarly, multiple computer devices can be connected, each providing some of the necessary operations (e.g., as a server array, a group of blade servers, or a multiprocessor system). Figure 27 Take a processor 10 as an example.

[0296] Processor 10 may be a central processing unit, a network processor, or a combination thereof. Processor 10 may further include a hardware chip. The hardware chip may be an application-specific integrated circuit (ASIC), a programmable logic device (PLD), or a combination thereof. The programmable logic device may be a complex programmable logic device (CAMP), a field-programmable gate array (FPGA), a general-purpose array logic (GDA), or any combination thereof.

[0297] The memory 20 stores instructions executable by at least one processor 10 to cause at least one processor 10 to perform the method shown in the above embodiments.

[0298] The memory 20 may include a program storage area and a data storage area. The program storage area may store the operating system and applications required for at least one function; the data storage area may store data created based on the use of the computer device. Furthermore, the memory 20 may include high-speed random access memory and may also include non-transitory memory, such as at least one disk storage device, flash memory device, or other non-transitory solid-state storage device. In some alternative embodiments, the memory 20 may optionally include memory remotely located relative to the processor 10, and these remote memories may be connected to the computer device via a network. Examples of such networks include, but are not limited to, the Internet, intranets, local area networks, mobile communication networks, and combinations thereof.

[0299] The memory 20 may include volatile memory, such as random access memory; the memory may also include non-volatile memory, such as flash memory, hard disk or solid-state drive; the memory 20 may also include a combination of the above types of memory.

[0300] The computer device also includes an input device 30 and an output device 40. The processor 10, memory 20, input device 30, and output device 40 can be connected via a bus or other means. Figure 27 Taking the example of a connection between China and Israel via a bus.

[0301] Input device 30 can receive input numerical or character information, and generate key signal inputs related to user settings and function control of the computer device, such as a touchscreen, keypad, mouse, trackpad, touchpad, joystick, one or more mouse buttons, trackball, joystick, etc. Output device 40 may include display devices, auxiliary lighting devices (e.g., LEDs), and haptic feedback devices (e.g., vibration motors). The aforementioned display devices include, but are not limited to, liquid crystal displays, light-emitting diodes, displays, and plasma displays. In some alternative embodiments, the display device may be a touchscreen.

[0302] This invention also provides a computer-readable storage medium. The methods described above according to embodiments of the invention can be implemented in hardware or firmware, or implemented as computer code that can be recorded on a storage medium, or implemented as computer code downloaded via a network and originally stored on a remote storage medium or a non-transitory machine-readable storage medium and then stored on a local storage medium. Thus, the methods described herein can be processed by software stored on a storage medium using a general-purpose computer, a dedicated processor, or programmable or dedicated hardware. The storage medium can be a magnetic disk, optical disk, read-only memory, random access memory, flash memory, hard disk, or solid-state drive, etc.; further, the storage medium can also include combinations of the above types of memory. It is understood that computers, processors, microprocessor controllers, or programmable hardware include storage components capable of storing or receiving software or computer code, which, when accessed and executed by the computer, processor, or hardware, implements the methods shown in the above embodiments.

[0303] A portion of this invention can be applied as a computer program product, such as computer program instructions, which, when executed by a computer, can invoke or provide the methods and / or technical solutions according to the invention through the operation of the computer. Those skilled in the art will understand that the forms in which computer program instructions exist in a computer-readable medium include, but are not limited to, source files, executable files, installation package files, etc. Correspondingly, the ways in which computer program instructions are executed by a computer include, but are not limited to: the computer directly executing the instructions, or the computer compiling the instructions and then executing the corresponding compiled program, or the computer reading and executing the instructions, or the computer reading and installing the instructions and then executing the corresponding installed program. Here, the computer-readable medium can be any available computer-readable storage medium or communication medium accessible to a computer.

[0304] In summary, the temperature control device, temperature control method, and computer-readable storage medium provided by this invention are used to detect the temperature of each area of ​​the heating plate in real time without installing a large number of temperature sensors, thereby controlling the temperature of each area of ​​the heating plate more in real time and more accurately.

[0305] Although embodiments of the invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the invention, and all such modifications and variations fall within the scope of protection.

Claims

1. A temperature control device, characterized in that, include: Multiple heating wires are distributed in multiple areas of the heating plate; Multiple drivers are connected to the multiple heating wires, and each includes a voltage and current acquisition circuit; as well as The controller is connected to the plurality of drivers and is configured to: acquire the voltage and current at both ends of the corresponding heating wire via the voltage and current acquisition circuit of each of the drivers, so as to calculate its resistance value; The actual temperature of the area where each heating wire is located is determined based on its resistance value. And adjust the power output of each driver to the corresponding heating wire according to the actual temperature of each region and its corresponding preset temperature range.

2. The temperature control device as described in claim 1, characterized in that, The controller is connected via a first driver to a first heating wire located in a first region of the heating plate, and via a second driver to a second heating wire located in a second region of the heating plate. The first region and the second region have a uniform preset temperature range. The controller is further configured to: Based on the first resistance value of the first heating wire, the first actual temperature of the first region is determined, and based on the first actual temperature and the preset temperature range, the first power output by the first driver to the first heating wire is determined, so as to adjust the first actual temperature to the preset temperature range. as well as Based on the second resistance value of the second heating wire, the second actual temperature of the second region is determined, and based on the second actual temperature and the preset temperature range, the second power output by the second driver to the second heating wire is determined, so as to adjust the second actual temperature to the preset temperature range.

3. The temperature control device as described in claim 2, characterized in that, The first region is the central region of the heating plate, the second region is the edge region of the heating plate, and the controller is further configured to: During the heating process, based on the first actual temperature of the first region at the current moment and the first power output by the first driver to the first heating wire at the current moment, the first actual temperature of the first region at a future moment is predicted. Based on the second actual temperature of the second region at the current time and the first actual temperature of the first region at a future time, the second power output by the second driver to the second heating wire at the current time is determined so that the second actual temperature of the second region at the future time is within the range of the first actual temperature at the future time.

4. The temperature control device as described in claim 1, characterized in that, The controller has a built-in resistance-temperature mapping curve for each heating wire calibrated by a temperature sensor. The step of determining the actual temperature of the region based on the resistance value of each heating wire includes: The resistance value of each heating wire is substituted into the corresponding resistance-temperature mapping curve to determine the actual temperature of the region where each heating wire is located.

5. The temperature control device as described in claim 4, characterized in that, The temperature sensor is also provided in the first region of the heating plate, and the driver further includes a temperature acquisition circuit. The step of calibrating the resistance-temperature mapping curve includes: The highest target temperature of the heating plate, the preset temperature rise step size, and the preset constant temperature interval are obtained. The first power supplied by the first driver to the first heating wire located in the first region is gradually increased, and the first temperature of the surface of the first region at different times is collected by the temperature sensor to control the surface of the first region within the range below the highest target temperature. Each temperature rise step is followed by a constant temperature interval. The first voltage and first current of the first heating wire at each of the said constant temperature intervals are collected to calculate its first resistance value; and Based on the first resistance value and first temperature of the first heating wire at each of the constant temperature intervals, the first resistance-temperature mapping curve is calibrated.

6. The temperature control device as described in claim 4, characterized in that, The step of determining the actual temperature of the region based on the resistance value of each heating wire further includes: Obtain the temperature control mode of the heating plate; When the temperature control mode is constant temperature control, the resistance value of each heating wire is substituted into the corresponding resistance-temperature mapping curve to determine the actual temperature of the area where each heating wire is located; and When the temperature control mode is heating control, the resistance value of each heating wire and the preset temperature control parameters of the corresponding driver are respectively input into the pre-constructed mathematical model to obtain the actual temperature of the area where each heating wire is located. The preset temperature control parameters include at least the power output by the corresponding driver to the heating wire.

7. The temperature control device as described in claim 6, characterized in that, The steps for constructing the mathematical model include: The system acquires the first resistance value of the first heating wire located in the first region of the heating plate at multiple times, the first actual temperature of the first region at each corresponding time, and the first preset temperature control parameter at each corresponding time, and systematically identifies these parameters to obtain a target mathematical relationship between the first resistance value and the first preset temperature control parameter with respect to the first actual temperature, wherein the target mathematical relationship is a linear relationship; and Based on the target mathematical relationship, a multi-input single-output mathematical model is constructed, wherein the first input of the mathematical model is the first resistance value of the first heating wire, the second input of the mathematical model is the first preset temperature control parameter at the corresponding time, and the output of the mathematical model is the first actual temperature of the first region at the corresponding time.

8. The temperature control device as described in claim 6, characterized in that, The preset temperature control parameters also include the ambient temperature of the heating plate.

9. The temperature control device as described in claim 1, characterized in that, The heating plate is also equipped with a thermocouple, the driver also includes a temperature acquisition circuit, and the controller is further configured to: The temperature acquisition circuit redundantly acquires the third actual temperature of the area where the thermocouple is located; and adjusts the power output of the corresponding driver to the corresponding heating wire based on the third actual temperature, the first actual temperature and / or the second actual temperature of the corresponding area.

10. The temperature control device as described in claim 1, characterized in that, The driver is a DC driver, and a sampling resistor is provided at the distal end of the heating wire connected to the driver. The resistance value of the sampling resistor is much smaller than the resistance value of the heating wire. The step of acquiring the voltage and current across the corresponding heating wire via the voltage and current acquisition circuit of each driver to calculate its resistance value includes: The voltage across the heating wire is collected using a first voltmeter; The voltage across the sampling resistor is measured using a second voltmeter, and then divided by its resistance value to calculate the current flowing through the heating wire; and The resistance value of the heating wire is calculated by dividing the voltage across the heating wire by the current flowing through the heating wire.

11. The temperature control device as described in claim 10, characterized in that, An amplifier circuit is also connected in parallel across the sampling resistor to amplify the voltage across the sampling resistor, thereby improving the current resolution of the voltage and current acquisition circuit.

12. The temperature control device as claimed in claim 1, characterized in that, The driver is a DC driver, and also includes a power factor correction circuit and a DC-DC circuit, wherein... The power factor correction circuit has its input connected to an AC power supply, and its output connected to the input of the DC-DC circuit. It rectifies and chops the AC signal provided by the AC power supply into a pulsed DC signal, and controls the output power by adjusting the duty cycle of its switching transistor. The output of the DC-DC circuit is connected to the heating wire, which drives the resonant inductor, resonant capacitor and transformer to achieve zero-voltage switching and zero-current switching through the alternating conduction of multiple switching transistors.

13. The temperature control device as described in claim 12, characterized in that, The DC-DC circuit includes an isolation transformer to achieve electrical isolation between its input and output terminals, preventing DC components and / or low-frequency interference signals from the input terminal from being transmitted to the output terminal, and preventing faults at the output terminal from affecting the circuitry at the input terminal. The output terminal is also provided with a secondary rectifier circuit and a secondary filter circuit, which are used to perform secondary rectification and filtering on the AC induction signal obtained from the output terminal to obtain a DC drive voltage.

14. The temperature control device as described in claim 12, characterized in that, The driver also includes an EMI circuit, which utilizes the different impedance characteristics of inductors and capacitors to electromagnetic waves of different frequencies to bypass high-frequency interference signals in the driver to ground or filter and attenuate them, thereby reducing the intensity of electromagnetic interference.

15. The temperature control device as claimed in claim 1, characterized in that, The controller is also communicatively connected to a host computer, used to upload the control parameters of each of the drivers and / or the actual temperature of the area where each of the heating wires is located to the host computer, and / or receive the preset temperature range sent by the host computer.

16. A temperature control method, characterized in that, Includes the following steps: The voltage and current at both ends of multiple heating wires distributed in multiple areas of the heating plate are collected respectively to calculate their resistance value; The actual temperature of the area where each heating wire is located is determined based on its resistance value. as well as Based on the actual temperature of each region and its corresponding preset temperature range, the power output by the corresponding driver to each heating wire is adjusted.

17. A computer-readable storage medium storing computer instructions thereon, characterized in that, When the computer instructions are executed by the processor, the temperature control method as described in claim 16 is implemented.

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