Large-size packaging substrate and preparation method thereof
By combining split manufacturing with a high-modulus core and stress buffer layer design, the warping problem of large-size packaging substrates was solved, resulting in higher manufacturing yield and signal transmission reliability, while reducing production costs.
CN121311041AActive Publication Date: 2026-01-09AALTOSEMI INC
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Patent Information
- Application Number
- CN202511860578.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-10
- Publication Date
- 2026-01-09
- Estimated Expiration
- 2045-12-10
AI Technical Summary
Technical Problem
Large-size packaging substrates are difficult to control during manufacturing, which affects signal transmission performance and manufacturing yield, and also increases costs.
Method used
A split manufacturing strategy is adopted, in which the substrate is split into a first core and a second core manufactured independently. The second core has a higher elastic modulus than the first core. They are connected by a solder ball array and filled with an epoxy resin-based polymer as a stress buffer layer. Combining this with a compression molding process, warping is suppressed.
Benefits of technology
It effectively reduces substrate warpage, improves interlayer alignment accuracy and manufacturing yield, reduces production costs, and enhances signal transmission reliability.
✦ Generated by Eureka AI based on patent content.
Abstract
The invention provides a large-size packaging substrate and a preparation method thereof. According to the technical scheme, the preparation method comprises the following steps that a first core is independently manufactured, wherein first laminated layer dielectric material construction and SAP patterning and second laminated layer dielectric material construction and SAP patterning are sequentially carried out on a first core base material; applying an encoder mask; independently manufacturing a second core: constructing a second layer of core wire on a second core base material; a through hole structure is formed, and circuit layer processing is completed through electroplating and patterning processes; covering a welding mask and performing unit cutting; dual-core coupling: mechanically connecting the first core and the second core through a coupling structure; the coupling interface is filled with an underfill material to cure the structure. Through the dual-core independent manufacturing and compression molding coupling technology, the design of the high-modulus core body and the stress buffer layer is combined, interlayer dislocation and buckling deformation caused by material stress are effectively restrained, and the advantages that substrate warping is effectively reduced, interlayer alignment precision is improved, and the manufacturing yield is improved are achieved.
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