Synchronous processing device for spin coating and solidifying piezoelectric film of surface acoustic wave filter

Abstract

The present application relates to the technical field of surface wave filter manufacturing, in particular to a piezoelectric film spin coating and curing synchronous processing device for surface acoustic wave filter, which comprises a synchronous processing base and a synchronous processing frame, the top of the synchronous processing base is fixedly provided with the synchronous processing frame, and the side of the synchronous processing frame is respectively fixedly provided with a feeding frame and a discharging frame. The spin coating module and the curing module are integrated in the same processing station, the spin coating process and the curing process are simultaneously performed, and the automatic feeding frame, the discharging frame and the multi-station rotating structure are relied on to complete the full-process automatic operation of the substrate from feeding, centering, processing to discharging, without manual transfer or assistance, so that the single processing cycle is greatly shortened, the influence of external pollution on the film is reduced, the production capacity and the processing stability of the piezoelectric film of the surface acoustic wave filter are significantly improved, and the device is more suitable for large-scale production requirements.

Description

Technical Field

[0001] This invention relates to the field of surface acoustic wave (SAW) filter manufacturing technology, specifically to a device for simultaneous spin coating and curing of piezoelectric thin films for SAW filters. Background Technology

[0002] Surface acoustic wave (SAW) filters, as core components of radio frequency (RF) front-ends, are widely used in 5G communications, consumer electronics, aerospace, and other fields. Their performance directly depends on the quality of the piezoelectric film. Parameters such as the uniformity, crystallinity, interfacial adhesion, and piezoelectric coefficient of the piezoelectric film all have a critical impact on the center frequency stability, insertion loss, and quality factor of the SAW filter. With the surge in demand for high-frequency, low-loss SAW filters in 5G communications, the fabrication process of piezoelectric films faces a triple challenge of "high efficiency, high precision, and high consistency." Among these, spin coating and curing, as core processes in piezoelectric film formation, have become key technological bottlenecks restricting the mass production capacity and performance improvement of SAW filters.

[0003] The spin coating and curing process for piezoelectric thin films generally adopts a "step-by-step processing" mode, that is, firstly, a piezoelectric precursor is coated on the substrate surface using a spin coating device, and then the coated substrate is transferred to a separate curing device for curing. However, the step-by-step process requires multiple independent steps, including "spin coating machine loading, spin coating, substrate transfer, curing equipment loading, curing, and unloading," with a single processing cycle of 45-60 minutes. Moreover, the transfer process requires manual or semi-automated assistance, which cannot meet the needs of large-scale mass production of SAW filters. At the same time, during the transfer process, the substrate is exposed to the air, which easily adsorbs contaminants such as dust and moisture, leading to defects such as pinholes and delamination in the piezoelectric thin film.

[0004] Therefore, there is an urgent need for a device for simultaneous spin coating and curing of piezoelectric thin films for surface acoustic wave filters to address the aforementioned technical deficiencies. Summary of the Invention

[0005] The purpose of this invention is to provide a device for simultaneous spin coating and curing of piezoelectric thin films for surface acoustic wave filters, in order to solve the aforementioned technical defects.

[0006] To achieve the above effects, the technical solution adopted by the present invention is: a synchronous processing device for spin coating and curing of piezoelectric thin film of surface acoustic wave filter, comprising: a synchronous processing base and a synchronous processing frame, wherein the synchronous processing frame is fixedly provided on the top of the synchronous processing base, and a feeding frame and a discharging frame are fixedly provided on one side of the synchronous processing frame respectively.

[0007] The synchronous processing base has a workpiece rotating frame rotatably mounted inside. A spin coating control motor is fixedly mounted at the bottom of the synchronous processing base, and one end of the output shaft of the spin coating control motor is fixedly connected to the bottom of the workpiece rotating frame. The top of the workpiece rotating frame has several rotating slots, which are distributed at equal angles about the central axis of the workpiece rotating frame. A connecting column is fixedly mounted at the middle of the top of the workpiece rotating frame. The synchronous processing base has a synchronous rotating frame rotatably mounted inside, and the top of the connecting column is fixedly connected to the bottom of the synchronous rotating frame. The bottom of the synchronous rotating frame has several movable slots, which are distributed at equal angles about the central axis of the synchronous rotating frame.

[0008] Each of the several rotating tanks has a spin coating servo motor fixedly installed at its lower part, and the top of the output shaft of each of the several spin coating servo motors has a rotating shaft fixedly installed at its top; each of the several rotating tanks has a spin coating base rotatably installed inside, and the bottom of each of the several spin coating bases is fixedly connected to the top of each of the several rotating shafts; a Helmholtz coil is also fixedly installed at the bottom of each of the several rotating tanks; each of the spin coating bases has a workpiece placement groove inside, and the workpiece placement groove is equipped with positioning components by bolts around its perimeter.

[0009] Preferably, the top of the inner wall of both the feeding rack and the discharging rack is slidably provided with mounting brackets via electric slides, and a connecting bracket is movably provided on one side of each of the two mounting brackets; a material picking control electric cylinder is fixedly provided on one side of each of the two mounting brackets, and the drive end of each of the two material picking control electric cylinders is fixedly connected to one side of the connecting bracket.

[0010] Preferably, lifting control electric cylinders are fixedly installed on both sides inside the two connecting frames, and a picking frame is fixedly installed at the bottom of the drive shaft of the two lifting control electric cylinders. A synchronous rotating frame is fixedly installed at the bottom of the two picking frames. Miniature electric cylinders are also slidably installed around the bottom of the picking frame inside the feeding frame via an electric slide table, and a curing synchronous frame is fixedly installed at the bottom of the drive shaft of the four miniature electric cylinders.

[0011] Preferably, each of the four positioning components has a positioning plate movably disposed on one side, and the four positioning plates are distributed at equal angles about the central axis of the workpiece placement groove.

[0012] Preferably, the positioning component consists of a mounting frame bolted to one side inside the workpiece placement groove, and an electromagnet is fixedly mounted on one side inside the mounting frame. A sliding plate is slidably mounted inside the mounting frame, and a metal attraction plate is mounted on the side of the sliding plate near the electromagnet.

[0013] Preferably, a sliding rod is fixedly provided on the other side of the sliding plate, and one end of the sliding rod passes through the mounting frame and extends to the outside of the mounting frame. The end of the sliding rod extending to the outside of the mounting frame is fixedly connected to one side of the positioning plate. A return spring is sleeved on the surface of the sliding rod, and the two ends of the return spring are fixedly connected to the sliding plate and one side of the inner wall of the mounting frame, respectively.

[0014] Preferably, each of the several movable slots is rotatably equipped with a curing synchronization frame, and the top of the inner wall of each of the several curing synchronization frames is fixedly equipped with a diffuse reflection plate; each of the curing synchronization frames is also fixedly equipped with several ultraviolet lamps on its inner wall, and the several ultraviolet lamps are all distributed at equal angles about the central axis of the curing synchronization frame.

[0015] Preferably, the bottom of the curing synchronization frame is also fixedly provided with four connecting rods, and the four connecting rods are distributed at equal angles about the central axis of the curing synchronization frame; the workpiece placement groove is provided with connecting holes on all four sides, and the four connecting holes are distributed at equal angles about the central axis of the workpiece placement groove; the top of the spin coating base is fixedly provided with sealing protrusions, and the bottom of the curing synchronization frame is provided with connecting grooves that cooperate with the sealing protrusions.

[0016] Preferably, a plurality of synchronously cooperating electric cylinders are fixedly provided on the top of the synchronous rotating frame, and the bottom ends of the drive shafts of the plurality of synchronously cooperating electric cylinders extend into the interior of the movable groove. A connecting slider is fixedly provided on the bottom ends of the drive shafts of the plurality of synchronously cooperating electric cylinders. A connecting groove is provided on the top of the curing synchronous frame, and the surface of the connecting slider is slidably disposed inside the connecting groove.

[0017] Preferably, a connecting pipe is fixedly installed in the middle of the curing synchronization frame, and a spin coating adjusting electric cylinder is fixedly installed at the lower part of the connecting pipe. A mixing frame is fixedly installed at the bottom end of the drive shaft of the spin coating adjusting electric cylinder. Several spring guide tubes are also fixedly installed inside the connecting pipe, and the bottom ends of the several spring guide tubes are fixedly connected to the top of the mixing frame. A mixing chamber is provided inside the mixing frame, and a stirring frame is rotatably installed inside the mixing chamber. An ultrasonic generator is fixedly installed on the outside of the mixing frame, and the output end of the ultrasonic generator extends into the interior of the mixing chamber. A spray head is fixedly installed at the bottom of the mixing frame, and the interior of the spray head communicates with the interior of the mixing chamber.

[0018] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0019] Existing technologies require transferring the substrate between spin coating and curing equipment, which not only increases manual intervention and extends the processing cycle but also easily leads to the substrate adsorbing contaminants during the transfer process, affecting film quality. This device integrates the curing module and spin coating module into the same processing station, enabling simultaneous spin coating and curing processes. Furthermore, relying on an automatic feeding rack, discharging rack, and multi-station rotating structure, it automates the entire process from substrate feeding, centering, processing to unloading, eliminating the need for manual transfer or assistance. This significantly shortens the processing cycle, reduces the impact of external contamination on the film, and significantly improves the mass production capacity and processing stability of surface acoustic wave filter piezoelectric films, making it more suitable for large-scale production needs.

[0020] Existing technologies suffer from large substrate centering offsets and uncontrollable clamping pressure, easily leading to uneven film thickness during spin coating. Furthermore, they lack methods for controlling the microstructure of piezoelectric materials, making it difficult to meet the stringent performance requirements of high-frequency surface acoustic wave (SAW) filters. This device achieves high-precision substrate centering during the feeding stage through a correction structure, ensuring alignment between the substrate and the spin coating platform's rotation center. During processing, a positioning component with pressure monitoring provides flexible substrate clamping, preventing substrate displacement or deformation and ensuring uniform film thickness. Simultaneously, the integrated magnetic field control module guides the domain walls of the ferroelectric material during curing. Combined with uniform curing energy distribution and an online material mixing structure, this effectively improves the crystallinity consistency, piezoelectric coefficient, and ferroelectric properties of the piezoelectric film, thereby improving key indicators such as insertion loss and quality factor of the SAW filter, making the device more suitable for the performance requirements of high-frequency communication applications.

[0021] Existing technologies suffer from poor sealing of the processing environment, making them susceptible to external airflow and contaminants. Furthermore, the specialized fixtures have poor adaptability and high replacement costs, while rigid clamping can easily damage the substrate. This device, through a sealed structure, creates a closed space in the processing area, isolating it from external contaminants and reducing film defects. The positioning components and material conveying structure are adaptable to substrates of different sizes and types, as well as piezoelectric materials, eliminating the need for frequent fixture changes and reducing equipment adaptation costs. The design combining flexible clamping and pressure monitoring prevents substrate deformation or cracking caused by excessive clamping pressure, improving substrate utilization. This not only enhances the device's process adaptability and operational safety but also reduces defect rates and scrap costs during production, providing strong support for the diversified and high-quality production of surface acoustic wave (SAW) filters. It possesses outstanding technological value and industrialization prospects. Attached Figure Description

[0022] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a schematic diagram of the structure of the synchronous processing device for spin coating and curing of piezoelectric thin film for surface acoustic wave filter according to an embodiment of the present invention;

[0024] Figure 2 This is a schematic diagram of the synchronous processing base, synchronous processing frame, and processing rotating frame structure according to an embodiment of the present invention;

[0025] Figure 3 This is a schematic diagram of the workpiece rotating frame and spin coating base structure according to an embodiment of the present invention;

[0026] Figure 4 This is a schematic diagram of the synchronous processing base, synchronous processing frame, and spin coating control motor structure according to an embodiment of the present invention;

[0027] Figure 5 This is a schematic diagram of the internal structure of the mounting frame in an embodiment of the present invention;

[0028] Figure 6 This is a schematic diagram of the internal structure of the feeding rack according to an embodiment of the present invention;

[0029] Figure 7 This is a schematic diagram of the synchronous rotating frame and the curing synchronous frame structure according to an embodiment of the present invention;

[0030] Figure 8 This is a schematic diagram of the curing synchronization frame and ultraviolet lamp structure according to an embodiment of the present invention;

[0031] Figure 9 This is a schematic diagram of the solidification synchronization frame structure according to an embodiment of the present invention;

[0032] Figure 10 This is a schematic diagram of the internal structure of the mixing rack in an embodiment of the present invention.

[0033] In the diagram, 1. Synchronous processing base; 2. Synchronous processing frame; 3. Feeding frame; 4. Discharging frame; 5. Workpiece rotating frame; 6. Processing rotating frame; 7. Rotary groove; 8. Spin coating base; 9. Helmholtz coil; 10. Spin coating servo motor; 11. Rotary shaft; 12. Workpiece placement groove; 13. Positioning assembly; 14. Positioning plate; 15. Connecting socket; 16. Connecting rod; 17. Sealing protrusion; 18. Connecting groove; 19. Spin coating control motor; 20. Mounting frame; 21. Electromagnet; 22. Sliding plate; 23. Slide rod; 24. Return spring; 25. Connecting... 26. Connecting column; 27. Synchronous rotating frame; 28. Movable groove; 29. ​​Curing synchronous frame; 30. Ultraviolet lamp tube; 31. Diffuse reflector plate; 32. Spray nozzle; 33. Connecting pipe; 34. Spin coating adjustment cylinder; 35. Mixing rack; 36. Spring guide tube; 37. Stirring rack; 38. Ultrasonic generator; 39. Synchronous matching cylinder; 40. Connecting slider; 41. Connecting chute; 42. Mounting frame; 43. Material picking control cylinder; 44. Connecting frame; 45. Lifting control cylinder; 46. Material picking frame; 47. Substrate electromagnetic chuck; 48. Miniature cylinder; 49. Calibration block. Detailed Implementation

[0034] The present invention will be further explained below with reference to the accompanying drawings and specific embodiments.

[0035] Example 1

[0036] Please see Figures 1 to 10 As shown, this embodiment discloses a simultaneous spin-coating and curing processing device for surface acoustic wave filter piezoelectric thin films, including: a simultaneous processing base 1 and a simultaneous processing frame 2. The simultaneous processing frame 2 is fixedly mounted on the top of the simultaneous processing base 1, and a feeding frame 3 and a discharging frame 4 are respectively fixedly mounted on one side of the simultaneous processing frame 2. Specifically, the top of the inner wall of the feeding frame 3 and the discharging frame 4 are both slidably mounted with mounting frames 41 via electric slides, and a connecting frame 43 is movably mounted on one side of each of the two mounting frames 41. A material picking control device is fixedly mounted on one side of each of the two mounting frames 41. The cylinder 42, and the drive ends of the two material picking control electric cylinders 42 are fixedly connected to one side of the connecting frame 43; the two sides inside the two connecting frames 43 are fixedly provided with lifting control electric cylinders 44, and the bottom ends of the drive shafts of the two lifting control electric cylinders 44 are fixedly provided with picking racks 45, and the bottom ends of the two picking racks 45 are fixedly provided with synchronous rotating frames 26; the bottom of the picking racks 45 located inside the feeding rack 3 is also provided with miniature electric cylinders 47 via electric slides, and the bottom ends of the drive shafts of the four miniature electric cylinders 47 are fixedly provided with curing synchronous frames 28.

[0037] It should be noted that a conveyor frame is installed below both the feeding frame 3 and the discharging frame 4 for automatic feeding and discharging of the substrate of the surface acoustic wave filter. During substrate feeding, the mounting frame 41 is controlled by an electric slide on the top of the feeding frame 3 to slide back and forth, and the substrate is conveyed to the area directly below the picking frame 45. The driving end of the lifting control cylinder 44 controls the picking frame 45 to move downwards until the bottom surface of the substrate electromagnetic chuck 46 contacts the top surface of the substrate. Simultaneously, the electric slide around the bottom of the picking frame 45 controls four miniature electric cylinders 47 to move closer to the perimeter of the substrate. The driving ends of the four miniature electric cylinders 47 control the corresponding correction blocks 48 to contact the perimeter of the substrate, and the four correction blocks 48 are used to align the substrate with the bottom surface of the substrate electromagnetic chuck 46. The substrate undergoes centering and alignment. The substrate's upper surface is electromagnetically attracted using the substrate electromagnetic chuck 46. Then, the mounting bracket 41, controlled by an electric slide table located at the top of the inner wall of the feeding rack 3, moves into the synchronous processing rack 2. Simultaneously, the drive end of the material handling control cylinder 42 controls the connecting bracket 43 to move into the synchronous processing rack 2, feeding the substrate electromagnetically attracted at the bottom of the substrate electromagnetic chuck 46 into the processing area inside the synchronous processing rack 2 for subsequent piezoelectric film spin coating and curing synchronous processing. After the synchronous processing of piezoelectric film spin coating and curing is completed inside the synchronous processing rack 2, the substrate with the spin-coated and cured piezoelectric film is automatically removed by the material handling rack 45 inside the discharge rack 4. This eliminates the need for manual assistance, significantly improving the processing efficiency of surface acoustic wave filter piezoelectric films.

[0038] As a further explanation of the solution in this embodiment, a workpiece rotating frame 5 is rotatably arranged inside the synchronous processing base 1, and a spin coating control motor 19 is fixedly arranged at the bottom of the synchronous processing base 1, and one end of the output shaft of the spin coating control motor 19 is fixedly connected to the bottom of the workpiece rotating frame 5; a number of rotating grooves 7 are arranged on the top of the workpiece rotating frame 5, and the number of rotating grooves 7 are arranged at equal angles about the central axis of the workpiece rotating frame 5.

[0039] Furthermore, a connecting column 25 is fixedly installed at the center of the top of the workpiece rotating frame 5, and a synchronous rotating frame 26 is rotatably installed inside the synchronous processing frame 2, with the top of the connecting column 25 fixedly connected to the bottom of the synchronous rotating frame 26; the bottom of the synchronous rotating frame 26 is provided with a number of movable slots 27, and the number of movable slots 27 are distributed at equal angles about the central axis of the synchronous rotating frame 26; the number of the number of movable slots 27 corresponds vertically to the position of the number of rotating slots 7, so that each movable slot 27 corresponds to one rotating slot 7.

[0040] Furthermore, a spin coating servo motor 10 is fixedly installed at the bottom of each of the several rotating slots 7, and a rotating shaft 11 is fixedly installed at the top of the output shaft of each of the several spin coating servo motors 10; a spin coating base 8 is rotatably installed inside each of the several rotating slots 7, and the bottom of each of the several spin coating bases 8 is fixedly connected to the top of each of the several rotating shafts 11; a Helmholtz coil 9 is also fixedly installed at the bottom of each of the several rotating slots 7, and the Helmholtz coil 9 consists of two sets of parallel coils symmetrically arranged below the spin coating base 8. An alternating current is passed through the Helmholtz coil 9, and the outer surface of the Helmholtz coil 9 is wrapped with an aluminum nitride ceramic heat insulation layer to prevent the high temperature of the spin coating base 8 from damaging the coil. A metal magnetic shield is provided between the Helmholtz coil 9 and the spin coating base 8 to avoid magnetic field interference. The spin coating base 8 has a workpiece placement groove 12 inside, and positioning components 13 are bolted to all four sides of the workpiece placement groove 12. Positioning plates 14 are movably installed on one side of each of the four positioning components 13, and the four positioning plates 14 are distributed at equal angles about the central axis of the workpiece placement groove 12. A pressure sensor is also installed on one side of the positioning plate 14 to monitor the positioning and clamping pressure on the substrate and ensure the stability of the substrate during the processing.

[0041] Furthermore, the positioning assembly 13 consists of a mounting frame 20 bolted to one side inside the workpiece placement groove 12, and an electromagnet 21 is fixedly installed on one side inside the mounting frame 20. A sliding plate 22 is slidably installed inside the mounting frame 20, and a metal attraction piece is installed on the side of the sliding plate 22 near the electromagnet 21. A sliding rod 23 is fixedly installed on the other side of the sliding plate 22, and one end of the sliding rod 23 passes through the mounting frame 20 and extends to the outside of the mounting frame 20. The end of the sliding rod 23 extending to the outside of the mounting frame 20 is fixedly connected to one side of the positioning plate 14. A return spring 24 is sleeved on the surface of the sliding rod 23, and both ends of the return spring 24 are fixedly connected to the sliding plate 22 and one side of the inner wall of the mounting frame 20, respectively.

[0042] It should be noted that during the positioning and placement of the substrate, the drive end of the material handling control cylinder 42 controls the connecting frame 43 to move towards the top of the workpiece placement slot 12 until the substrate electromagnetic chuck 46 is directly above the workpiece placement slot 12. Then, the drive end of the lifting control cylinder 44 controls the material handling frame 45 to move downwards, using the substrate electromagnetic chuck 46 to deliver the substrate to be processed into the workpiece placement slot 12. When the substrate is placed into the workpiece placement slot 12, the electromagnets 21 inside the four mounting frames 20 attract the sliding plate 22 when energized. The metal attraction plate on one side, together with the sliding rod 23 on the side of the sliding plate 22, pulls the positioning plate 14 towards the periphery of the workpiece placement groove 12. After the base is placed into the workpiece placement groove 12, the electromagnet 21 is de-energized. Under the action of the return spring 24, the sliding plate 22 is pulled towards one side of the mounting frame 20 until one side of the positioning plate 14 contacts the outer peripheral surface of the base. The pressure sensor on one side of the positioning plate 14 monitors the clamping and positioning pressure to avoid excessive clamping and positioning pressure of the positioning plate 14 on the base, which could cause deformation of the base.

[0043] Furthermore, each of the several movable slots 27 has a curing synchronization frame 28 rotatably mounted inside, and a diffuse reflector plate 30 is fixedly mounted on the top of the inner wall of each of the several curing synchronization frames 28; each curing synchronization frame 28 also has a number of ultraviolet lamps 29 fixedly mounted on its inner wall, and the several ultraviolet lamps 29 are all distributed at equal angles about the central axis of the curing synchronization frame 28; four connecting rods 16 are also fixedly mounted on the bottom of the curing synchronization frame 28, and the four connecting rods 16 are distributed at equal angles about the central axis of the curing synchronization frame 28; the workpiece The placement groove 12 is provided with connection holes 15 on all four sides, and the four connection holes 15 are distributed at equal angles about the central axis of the workpiece placement groove 12; the top of the spin coating base 8 is fixedly provided with sealing protrusions 17, and the bottom of the curing synchronization frame 28 is provided with connecting grooves 18 that cooperate with the sealing protrusions 17; by sealing the connection between the sealing protrusions 17 and the connecting grooves 18, the sealing connection between the curing synchronization frame 28 and the spin coating base 8 is ensured, and the substrate is prevented from being contaminated by the outside world during the spin coating and curing process of the piezoelectric film.

[0044] Furthermore, a number of synchronously cooperating electric cylinders 38 are fixedly installed on the top of the synchronous rotating frame 26, and the bottom ends of the drive shafts of the synchronously cooperating electric cylinders 38 extend into the interior of the movable groove 27. A connecting slider 39 is fixedly installed at the bottom ends of the drive shafts of the synchronously cooperating electric cylinders 38. A connecting groove 40 is provided on the top of the solidifying synchronous frame 28, and the surface of the connecting slider 39 is slidably positioned inside the connecting groove 40. The connecting slider 39 adopts a convex slider structure, and the connecting groove 40 is a convex groove that cooperates with the convex slider structure.

[0045] Furthermore, a connecting pipe 32 is fixedly installed in the middle of the interior of the curing synchronization frame 28, and a spin coating adjusting electric cylinder 33 is fixedly installed at the lower part of the interior of the connecting pipe 32. A mixing frame 34 is fixedly installed at the bottom end of the drive shaft of the spin coating adjusting electric cylinder 33. Several spring guide pipes 35 are also fixedly installed inside the connecting pipe 32, and the bottom ends of the several spring guide pipes 35 are fixedly connected to the top of the mixing frame 34. The top ends of the several spring guide pipes 35 extend to the top of the connecting pipe 32, and are connected to the conveying pipes of different spin coating materials through the several spring guide pipes 35, so that different spin coating materials are introduced into the interior of the mixing frame 34. The mixing rack 34 has a mixing chamber inside, and a stirring rack 36 is rotatably mounted inside the mixing chamber. An ultrasonic generator 37 is fixedly mounted on the outside of the mixing rack 34, and the output end of the ultrasonic generator 37 extends into the interior of the mixing chamber. A spray head 31 is fixedly mounted at the bottom of the mixing rack 34, and the interior of the spray head 31 is connected to the interior of the mixing chamber. The stirring rack 36 is driven to rotate inside the mixing chamber by a built-in motor. The stirring rack 36 performs the mixing treatment of the spin-coated material inside the mixing chamber, thereby effectively improving the uniformity of the spin-coated material on the piezoelectric film.

[0046] It should be noted that during the spin coating and curing process of the piezoelectric film on the substrate, the curing timing frame 28 is first moved downward by the drive end of the synchronous cylinder 38 until the connecting groove 18 at the bottom of the curing timing frame 28 and the sealing protrusion 17 at the top of the spin coating base 8 are connected. At this time, the spin coating material is uniformly mixed inside the mixing frame 34. The drive end of the spin coating adjustment cylinder 33 is used to control the mixing frame 34 to move downward, so that the spray head 31 is directly above the base. The output shaft of the spin coating servo motor 10 controls the rotation shaft 11 to rotate, and the rotation shaft 11 drives the spin coating base 8 to rotate, so that the base is spin coated inside the workpiece placement groove 12. During the spin coating process, the ultraviolet lamp 29 inside the curing timing frame 28 emits ultraviolet light. The ultraviolet light is reflected by the diffuse reflector 30 at the top, so that the ultraviolet light shines on the upper surface of the base, and the spin coating material on the upper surface of the base is cured simultaneously during the spin coating process, which greatly improves the efficiency of spin coating and curing of the piezoelectric film.

[0047] Specifically, this embodiment also discloses a processing method for a simultaneous spin-coating and curing apparatus for surface acoustic wave (SAW) filter piezoelectric thin films, including the following steps:

[0048] The substrate of the surface acoustic wave filter is cleaned, surface activated, and its flatness is controlled to ensure that the substrate surface is free of contaminants, has sufficient active groups, and meets the flatness standard, providing a high-quality surface for subsequent spin coating and curing. The conveyor frame below the feeding rack 3 is activated to transport the pretreated substrate to the inside of the feeding rack 3 directly below the picking rack 45. The mounting frame 41 is controlled to slide back and forth by the electric slide table on the top of the inner wall of the feeding rack 3, so that the picking rack 45 is aligned with the substrate on the conveyor frame. The lifting control electric cylinder 44 on the top of the picking rack 45 is activated, and its drive shaft drives the picking rack 45 to move downward until the bottom surface of the substrate electromagnetic chuck 46 at the bottom of the picking rack 45 contacts the upper surface of the substrate.

[0049] The electric slides around the bottom of the feeding rack 45 on the three sides of the feeding rack are activated, controlling the four micro electric cylinders 47 to move closer to the periphery of the substrate; the drive shafts of the four micro electric cylinders 47 extend, driving the correction blocks 48 to contact the outer peripheral surface of the substrate. Through the coordinated action of the four correction blocks 48, the substrate is adjusted to be aligned with the center directly below the substrate electromagnetic chuck 46; the substrate electromagnetic chuck 46 is activated to electromagnetically adsorb and fix the upper surface of the substrate, completing the substrate gripping and centering.

[0050] The electric slide table at the top of the inner wall of the feeding rack 3 controls the mounting frame 41 to move into the synchronous processing rack 2 again, and at the same time, the picking control electric cylinder 42 is activated, and its drive end pushes the connecting frame 43 to extend into the synchronous processing rack 2; until the substrate attracted by the substrate electromagnetic chuck 46 moves to directly above a certain rotating slot 7 of the workpiece rotating rack 5 inside the synchronous processing rack 2, the electric slide table and the picking control electric cylinder 42 stop operating.

[0051] When the electromagnet 21 of the positioning assembly 13 around the workpiece placement slot 12 on the rotary coating base 8 is energized, the electromagnet 21 generates a magnetic field that attracts the metal attraction piece on one side of the sliding plate 22 inside the mounting frame 20. The sliding plate 22 compresses the return spring 24 and slides towards the electromagnet 21. At the same time, the positioning plate 14 is moved to the outside of the workpiece placement slot 12 through the slide rod 23, so that there is enough space inside the workpiece placement slot 12 to accommodate the base.

[0052] Start the lifting control electric cylinder 44 to drive the material picker 45 to move downwards, and slowly put the substrate attracted by the substrate electromagnetic chuck 46 into the workpiece placement groove 12; turn off the electromagnetic attraction function of the substrate electromagnetic chuck 46, and at the same time cut off the power of the electromagnet 21. The reset spring 24 restores its deformation and pushes the sliding plate 22 to slide outwards from the mounting frame 20. The slide rod 23 drives the positioning plate 14 to approach the outer peripheral surface of the substrate; until one side of the positioning plate 14 contacts the outer peripheral surface of the substrate, the clamping pressure is monitored in real time by the pressure sensor on one side of the positioning plate 14. When the pressure reaches the preset threshold, the positioning plate 14 stops moving, and the positioning and fixing of the substrate in the workpiece placement groove 12 is completed.

[0053] Start the spin coating control motor 19 at the bottom of the synchronous processing base 1. Its output shaft drives the workpiece rotating frame 5 to rotate, and rotates the rotating groove 7 with the substrate placed to the spin coating curing processing position inside the synchronous processing frame 2. At the same time, the connecting column 25 at the top of the workpiece rotating frame 5 drives the synchronous rotating frame 26 to rotate synchronously, so that the movable groove 27 at the corresponding position on the synchronous rotating frame 26 is aligned vertically with the rotating groove 7.

[0054] Start the synchronously engaged electric cylinder 38 corresponding to the movable groove 27 at the top of the synchronous rotating frame 26. Its drive shaft drives the connecting slider 39 to slide in the connecting groove 40 at the top of the curing synchronous frame 28, while simultaneously driving the curing synchronous frame 28 to move downwards. Until the connecting groove 18 at the bottom of the curing synchronous frame 28 is tightly engaged with the sealing protrusion 17 at the top of the spin coating base 8, a sealed connection between the curing synchronous frame 28 and the spin coating base 8 is achieved, preventing external contamination of the substrate during the spin coating curing process.

[0055] Different types of spin coating materials are conveyed to the mixing chamber inside the mixing rack 34 through the spring guide tube 35; the ultrasonic generator 37 on the outside of the mixing rack 34 is started, and the motor built into the stirring rack 36 is started at the same time. The stirring rack 36 rotates and stirs the materials in the mixing chamber, and the ultrasonic generator 37 outputs ultrasonic waves to assist in dispersing the materials and ensure that the materials are mixed evenly; the spin coating adjustment cylinder 33 inside the connecting pipe 32 is started, and its drive shaft drives the mixing rack 34 to move downward, so that the spray head 31 at the bottom of the mixing rack 34 moves to a preset height directly above the substrate.

[0056] The spin coating servo motor 10 inside the spin coating tank 7 is activated, and its output shaft drives the rotating shaft 11 to rotate. The rotating shaft 11 drives the spin coating platform 8 to rotate at a preset speed, and the substrate rotates synchronously with the spin coating platform 8. The spray nozzle 31 sprays the uniformly mixed spin coating material onto the upper surface of the rotating substrate, and the material is evenly spread on the substrate surface under the action of centrifugal force. At the same time, the ultraviolet lamp tube 29 on the inner wall of the curing synchronization frame 28 is activated. After being reflected by the diffuse reflection plate 30 at the top of the curing synchronization frame 28, the ultraviolet light is evenly irradiated onto the spin coating surface of the substrate. Regarding the materials, the spin coating process and the UV curing process are carried out simultaneously. If the substrate is a ferroelectric material, the Helmholtz coil 9 is activated, and an alternating current with a preset frequency and current is introduced into it to generate a uniform alternating magnetic field of 0-100mT. The magnetic field induces the domain walls of the material to oriented and optimize the piezoelectric properties. During the spin coating and curing process, the flow sensor of the spray head 31 and the light intensity monitor of the UV lamp tube 29 provide real-time feedback of parameters, and dynamically adjust the spray amount, spin coating speed and UV light intensity to ensure uniform film thickness and sufficient curing.

[0057] After spin coating and curing are completed, turn off the UV lamp 29, Helmholtz coil 9 and spin coating servo motor 10, start the synchronous matching electric cylinder 38, drive the curing synchronous frame 28 to move upward, disengage from the sealed connection with the spin coating base 8, and return to the initial position; start the spin coating control motor 19, drive the workpiece rotating frame 5 to rotate, and rotate the rotating groove 7 where the processed substrate is located to directly below the discharge frame 4; start the electric slide table and material picking control electric cylinder 42 on the top of the inner wall of the discharge frame 4, drive the material picking frame 45 on the side of the discharge frame 4 to move directly above the rotating groove 7, start the lifting control electric cylinder 44 to lower the material picking frame 45, the substrate electromagnetic chuck 46 adsorbs the processed substrate, and then the lifting control electric cylinder 44 drives the material picking frame 45 to rise.

[0058] The electric slide of the discharge rack 4 and the picking control cylinder 42 drive the picking rack 45, which adsorbs the substrate, to move to the top of the conveyor rack below the discharge rack 4. The electromagnetic chuck 46 of the substrate is closed, and the substrate falls into the conveyor rack, which then transports it to the subsequent patterning or packaging process to complete a single spin coating and curing cycle.

[0059] Furthermore, any content not described in detail in this specification is existing technology known to those skilled in the art.

[0060] This invention is not limited to the optional embodiments described above, and anyone can derive other various forms of products based on the inspiration of this invention. The specific embodiments described above should not be construed as limiting the scope of protection of this invention; the scope of protection of this invention should be determined by the claims, and the specification can be used to interpret the claims.

Claims

1. A device for simultaneous spin coating and curing of piezoelectric thin films for surface acoustic wave filters, characterized in that, include: Synchronous processing base (1) and synchronous processing frame (2), the synchronous processing base (1) is fixedly provided with synchronous processing frame (2) on the top, and a feeding frame (3) and a discharging frame (4) are fixedly provided on one side of the synchronous processing frame (2). The synchronous processing base (1) is internally equipped with a workpiece rotating frame (5), and a spin coating control motor (19) is fixedly installed at the bottom of the synchronous processing base (1). One end of the output shaft of the spin coating control motor (19) is fixedly connected to the bottom of the workpiece rotating frame (5). The top of the workpiece rotating frame (5) is provided with several rotating slots (7), and the several rotating slots (7) are distributed at equal angles about the central axis of the workpiece rotating frame (5). A connecting column (25) is fixedly installed in the middle of the top of the workpiece rotating frame (5). The synchronous processing frame (2) is internally equipped with a synchronous rotating frame (26), and the top of the connecting column (25) is fixedly connected to the bottom of the synchronous rotating frame (26). The bottom of the synchronous rotating frame (26) is provided with several movable slots (27), and the several movable slots (27) are distributed at equal angles about the central axis of the synchronous rotating frame (26). A spin coating servo motor (10) is fixedly installed at the bottom of each of the several rotating slots (7), and a rotating shaft (11) is fixedly installed at the top of the output shaft of each of the several spin coating servo motors (10); a spin coating base (8) is rotatably installed inside each of the several rotating slots (7), and the bottom of each of the several spin coating bases (8) is fixedly connected to the top of each of the several rotating shafts (11); a Helmholtz coil (9) is also fixedly installed at the bottom of each of the several rotating slots (7); a workpiece placement slot (12) is provided inside the spin coating base (8), and a positioning component (13) is installed around the inside of the workpiece placement slot (12) by bolts.

2. The simultaneous spin-coating and curing apparatus for surface acoustic wave filter piezoelectric thin films according to claim 1, characterized in that, The top of the inner wall of the feeding rack (3) and the discharging rack (4) are both equipped with mounting brackets (41) that slide on an electric slide table, and a connecting bracket (43) is movably provided on one side of each of the two mounting brackets (41); a picking control electric cylinder (42) is fixedly provided on one side of each of the two mounting brackets (41), and the driving end of each of the two picking control electric cylinders (42) is fixedly connected to one side of the connecting bracket (43).

3. The simultaneous spin-coating and curing apparatus for surface acoustic wave filter piezoelectric thin films according to claim 2, characterized in that, Lifting control electric cylinders (44) are fixedly installed on both sides inside the two connecting frames (43), and picking racks (45) are fixedly installed at the bottom of the drive shafts of the two lifting control electric cylinders (44), and synchronous rotating racks (26) are fixedly installed at the bottom of the two picking racks (45); miniature electric cylinders (47) are also slidably installed around the bottom of the picking racks (45) inside the feeding rack (3) via electric slides, and curing synchronous racks (28) are fixedly installed at the bottom of the drive shafts of the four miniature electric cylinders (47).

4. The simultaneous spin-coating and curing apparatus for surface acoustic wave filter piezoelectric thin films according to claim 1, characterized in that, Each of the four positioning components (13) has a positioning plate (14) movably provided on one side, and the four positioning plates (14) are arranged at equal angles about the central axis of the workpiece placement groove (12).

5. The simultaneous spin-coating and curing apparatus for surface acoustic wave filter piezoelectric thin films according to claim 4, characterized in that, The positioning component (13) consists of a mounting frame (20) with bolts set on one side inside the workpiece placement groove (12), and an electromagnet (21) is fixedly installed on one side inside the mounting frame (20). A sliding plate (22) is slidably installed inside the mounting frame (20), and a metal attraction piece is installed on the side of the sliding plate (22) near the electromagnet (21).

6. The simultaneous spin-coating and curing apparatus for surface acoustic wave filter piezoelectric thin films according to claim 5, characterized in that, A slide rod (23) is fixedly provided on the other side of the sliding plate (22), and one end of the slide rod (23) passes through the mounting frame (20) and extends to the outside of the mounting frame (20). The end of the slide rod (23) extending to the outside of the mounting frame (20) is fixedly connected to one side of the positioning plate (14). A return spring (24) is sleeved on the surface of the slide rod (23), and the two ends of the return spring (24) are fixedly connected to the sliding plate (22) and one side of the inner wall of the mounting frame (20), respectively.

7. The simultaneous spin-coating and curing apparatus for surface acoustic wave filter piezoelectric thin films according to claim 1, characterized in that, Each of the several movable slots (27) is rotatably equipped with a curing synchronization frame (28), and the top of the inner wall of each of the several curing synchronization frames (28) is fixedly equipped with a diffuse reflection plate (30); each of the curing synchronization frames (28) is also fixedly equipped with a number of ultraviolet lamps (29), and the number of ultraviolet lamps (29) are all distributed at equal angles about the central axis of the curing synchronization frame (28).

8. The simultaneous spin-coating and curing apparatus for surface acoustic wave filter piezoelectric thin films according to claim 7, characterized in that, The bottom of the curing synchronization frame (28) is also fixedly provided with four connecting rods (16), and the four connecting rods (16) are arranged at equal angles about the central axis of the curing synchronization frame (28); the workpiece placement groove (12) is provided with connecting holes (15) around its interior, and the four connecting holes (15) are arranged at equal angles about the central axis of the workpiece placement groove (12); the top of the spin coating base (8) is fixedly provided with sealing protrusions (17), and the bottom of the curing synchronization frame (28) is provided with connecting grooves (18) that cooperate with the sealing protrusions (17).

9. The simultaneous spin-coating and curing apparatus for surface acoustic wave filter piezoelectric thin films according to claim 7, characterized in that, The top of the synchronous rotating frame (26) is fixedly provided with a number of synchronously cooperating electric cylinders (38), and the bottom end of the drive shaft of the number of synchronously cooperating electric cylinders (38) extends into the interior of the movable groove (27). The bottom end of the drive shaft of the number of synchronously cooperating electric cylinders (38) is fixedly provided with a connecting slider (39). The top of the curing synchronous frame (28) is provided with a connecting groove (40), and the surface of the connecting slider (39) is located inside the connecting groove (40) and slides.

10. The simultaneous spin-coating and curing apparatus for surface acoustic wave filter piezoelectric thin films according to claim 7, characterized in that, A connecting pipe (32) is fixedly installed in the middle of the interior of the curing synchronous frame (28), and a spin coating adjustment electric cylinder (33) is fixedly installed at the bottom of the interior of the connecting pipe (32). A mixing frame (34) is fixedly installed at the bottom of the drive shaft of the spin coating adjustment electric cylinder (33). Several spring guide pipes (35) are also fixedly installed inside the connecting pipe (32), and the bottom ends of the several spring guide pipes (35) are fixedly connected to the top of the mixing frame (34). A mixing chamber is provided inside the mixing frame (34), and a stirring frame (36) is rotatably installed inside the mixing chamber. An ultrasonic generator (37) is fixedly installed on the outside of the mixing frame (34), and the output end of the ultrasonic generator (37) extends into the interior of the mixing chamber. A spray head (31) is fixedly installed at the bottom of the mixing frame (34), and the interior of the spray head (31) is connected to the interior of the mixing chamber.

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