Method, device and equipment for controlling multiple programmable power supplies and medium
By using a polling and scanning control method based on the Modbus RTU communication protocol, multiple programmable power supplies are controlled sequentially according to the priority of key control parameters in the electroplating process. This solves the problem of asynchronous power supply control during electroplating and improves electroplating efficiency and quality.
Patent Information
- Application Number
- CN202511727585.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-24
- Publication Date
- 2026-01-20
AI Technical Summary
During the electroplating process, existing technologies struggle to control multiple programmable power supplies simultaneously, leading to reduced electroplating efficiency and quality. Furthermore, differences in power supply addresses and commands from different manufacturers increase the difficulty of programming.
The Modbus RTU communication protocol is adopted, and the polling and scanning control method is used to control each power supply in descending order of priority of key control parameters, thereby reducing the control interval time and ensuring compatibility with different power supplies.
It improves the synchronization of power control, enhances electroplating efficiency and quality, and simplifies the programming process for multiple power supplies.
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Figure CN121363034A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of communication control, and in particular to a multi-programmable power supply control method, device, equipment and medium. BACKGROUND
[0002] In the electroplating equipment, a programmable power supply is needed, which outputs the set voltage and current to the surface of the glass or silicon immersed in the chemical solution for electroplating. There are many brands of programmable power supplies, and the communication protocols include RS485 free port, Modbus RTU, EtherCat, etc. The market mainstream is Modbus RTU. In the electroplating process, corresponding timing control is needed, and the voltage, current and duration parameters of each timing can be set. The optimal formula is selected through repeated testing by process personnel.
[0003] The existing current control method has no problem in controlling a single power supply, but when multiple power supplies need to be controlled at the same time, the power supply control is out of sync, resulting in reduced electroplating efficiency and quality. This is because Modbus RTU communication needs to use station numbers to distinguish between slave stations, so only one slave station can be controlled at the same time. However, power supply control parameters usually have multiple parameters, including voltage, current, connection test, state, alarm, etc., which require a lot of time, and it is estimated that a delay of 0.5s will be caused. In addition, a single electroplating equipment may involve power supplies from different manufacturers, and the addresses and commands used for each power supply control are different, greatly increasing the difficulty of early programming. SUMMARY
[0004] The present application provides a multi-programmable power supply control method, device, equipment and medium, which can effectively reduce the control interval time of different power supply key control parameters based on Modbus RTU polling scan control, greatly improve the synchronization of power supply control, and support different power supplies compatible with Modbus RTU communication, which helps to improve the electroplating efficiency and quality.
[0005] According to one aspect of the present application, a multi-programmable power supply control method is provided, the method comprising:
[0006] When the target electroplating object is detected to reach the target electroplating position, the target electroplating formula is obtained; wherein the target electroplating formula includes a plurality of electroplating processes, and the target electroplating formula is used to describe a plurality of key control parameters of each electroplating process;
[0007] The priority of the plurality of key control parameters is determined, and the key control parameters of each target power supply are polled and controlled in each electroplating process in order of priority from high to low based on Modbus RTU communication;
[0008] control the plating process of the target plating object based on the polling control result of each target power supply.
[0009] According to another aspect of the present application, there is provided a multi-programmable power supply control device, the device comprising:
[0010] a plating recipe obtaining module configured to obtain a target plating recipe when detecting that a target plating object reaches a target plating position, wherein the target plating recipe comprises a plurality of plating procedures, and the target plating recipe is configured to describe a plurality of key control parameters of each plating procedure;
[0011] a key parameter polling module configured to determine priorities of the plurality of key control parameters, and perform key control parameter polling control on each target power supply in each plating procedure in a descending order of the priorities based on Modbus RTU communication;
[0012] a plating process control module configured to control the plating process of the target plating object based on the polling control result of each target power supply.
[0013] According to another aspect of the present application, there is provided an electronic device, the electronic device comprising:
[0014] at least one processor; and,
[0015] a memory communicatively connected to the at least one processor; wherein,
[0016] the memory stores a computer program executable by the at least one processor, and the computer program is executed by the at least one processor to enable the at least one processor to perform the multi-programmable power supply control method according to any one of the embodiments of the present application.
[0017] According to another aspect of the present application, there is provided a computer readable storage medium storing computer instructions for enabling a processor to perform the multi-programmable power supply control method according to any one of the embodiments of the present application when executed by the processor.
[0018] The technical scheme of the embodiment of the present application, when detecting that the target electroplating object reaches the target electroplating position, acquires a target electroplating formula; wherein the target electroplating formula includes a plurality of electroplating processes, and the target electroplating formula is used to describe a plurality of key control parameters of each electroplating process; the priority of the plurality of key control parameters is determined, and the key control parameters of each target power supply are polled and controlled in each electroplating process in a descending order of priority based on Modbus RTU communication; and the electroplating process of the target electroplating object is controlled based on the polling control result of each target power supply. The technical scheme can effectively reduce the control interval time of different power supply key control parameters based on Modbus RTU polling scanning control, greatly improves the power control synchronization, simultaneously supports different power supplies compatible with Modbus RTU communication, and helps to improve the electroplating efficiency and quality.
[0019] It should be understood that the content described in this part is not intended to identify the key or important features of the embodiments of the present application, nor to limit the scope of the present application. Other features of the present application will become apparent from the following description. BRIEF DESCRIPTION OF DRAWINGS
[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed in the embodiment description will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.
[0021] Figure 1 is a flow chart of a multi-programmable power supply control method according to an embodiment of the present application;
[0022] Figure 2 is a flow chart of another multi-programmable power supply control method according to an embodiment of the present application;
[0023] Figure 3 is a structural schematic diagram of a multi-programmable power supply control device according to an embodiment of the present application;
[0024] Figure 4 is a structural schematic diagram of an electronic device for implementing a multi-programmable power supply control method according to an embodiment of the present application. DETAILED DESCRIPTION
[0025] In the following, the technical solutions in the embodiments of the present application will be described clearly and completely with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part but not all of the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative effort should fall into the protection scope of the present application.
[0026] It should be noted that the terms "first", "second", "target" and the like in the description, claims, and drawings of the present application are used to distinguish similar objects, and do not necessarily indicate a specific order or sequence. It should be understood that the data thus used can be interchanged under appropriate circumstances, so that the embodiments of the present application described herein can be implemented in an order other than that illustrated or described herein. In addition, the terms "include" and "have" and any variations thereof are intended to cover non-exclusive inclusion, for example, a process, method, system, product, or device including a series of steps or units does not necessarily have to include only those steps or units clearly listed, but can include other steps or units not clearly listed or inherent to the process, method, product, or device.
[0027] Embodiment one
[0028] Figure 1 A flowchart of a multi-programmable power supply control method provided by the first embodiment of the present application is shown in the figure. The embodiment can be applied to improve the synchronization of different power supply control. The method can be executed by a plurality of programmable power supply control devices, which can be realized in the form of hardware and / or software, and can be configured in an electronic device with data processing capability. As shown in the figure, the method comprises the following steps. Figure 1
[0029] S110, when it is detected that the target electroplating object reaches the target electroplating position, obtaining a target electroplating formula; wherein the target electroplating formula comprises a plurality of electroplating processes, and the target electroplating formula is used to describe a plurality of key control parameters of each electroplating process.
[0030] The target electroplating object can be a workpiece that needs to be electroplated, such as a glass or a silicon wafer. The target electroplating position can be a pre-set electroplating position according to actual needs, and an electrode is arranged at the target electroplating position. The target electroplating formula can be used to represent how to perform the electroplating process on the target electroplating object, including a plurality of electroplating processes, and is specifically used to describe a plurality of key control parameters of each electroplating process. For example, the target electroplating formula includes 10 electroplating processes. Optionally, the key control parameters include voltage, current, and state, wherein the state includes standby, start, run, and failure.
[0031] In the embodiment, when the target electroplating object is detected to reach the target electroplating position, the electrode is first inserted into the target electroplating object, and the target electroplating formula is obtained by the host device (such as a programmable logic controller PLC). The host device supports user input of the target electroplating formula.
[0032] S120, determine the priority of the plurality of key control parameters, and perform key control parameter polling control on each target power supply in each electroplating process in order of priority from high to low based on Modbus RTU communication.
[0033] The target power supply can be a power supply for providing power for the electroplating process, and the present application involves a plurality of target power supplies. Modbus RTU is a serial communication protocol based on a master-slave architecture, uses binary data representation, and can realize efficient and reliable data exchange between devices through serial interfaces such as RS-232 or RS-485.
[0034] In the embodiment, the priority of each key parameter can be set based on the importance of the plurality of key control parameters. For example, assuming that the key control parameters include voltage, current and state, the priority can be set as follows based on the influence of the key control parameters on the electroplating process: current > state > voltage. In addition, a station number needs to be set for each target power supply, which can be used to uniquely identify each target power supply. After determining the priority of the plurality of key control parameters, each target power supply can be regarded as a slave device, and based on Modbus RTU communication between the host device and a plurality of slave devices, key control parameter polling read-write control is performed on each target power supply in each electroplating process in order of priority from high to low.
[0035] In the embodiment, the polling control of the key control parameters on each target power supply in each electroplating process in order of priority from high to low based on Modbus RTU communication can include: determining one key control parameter as the target control parameter of the current electroplating process according to the priority of the plurality of key control parameters each time; performing read-write control of the target control parameter on each target power supply according to the target station number, the target read-write address and the target read-write command of each target power supply in the current electroplating process; if the plurality of key control parameters of the current electroplating process are all polled, then the key control parameter polling control is performed on each target power supply in the next electroplating process until all electroplating processes are polled.
[0036] Specifically, from the first plating process of the target plating recipe, the first plating process is taken as the current plating process. According to the priorities of the plurality of key control parameters, the key control parameter with the highest priority is selected as the target control parameter of the current plating process. In the current plating process, first, the Modbus RTU communication parameters of each slave device (i.e., target power supply) are determined according to the target control parameter, specifically including the target station number, the target read-write address, and the target read-write command. Among them, the target station number is used to indicate which target power supply to perform the read-write operation on, the target read-write address is used to indicate which function parameter to perform the read-write operation on (the function parameter and the read-write address are in a one-to-one mapping relationship), and the target read-write command is used to indicate the read or write operation on the function parameter and the specific value and duration of the write operation. Then the master device sends corresponding communication requests to each slave device in turn according to the Modbus RTU communication parameters. After receiving the communication request sent by the master device, the slave device can perform the corresponding read-write operation according to the Modbus RTU communication parameters.
[0037] After all the slave devices complete the read-write operation of the target control parameter, the key control parameter with the second highest priority is selected as the target control parameter of the current plating process again, and the above Modbus RTU communication process is executed. Until the key control parameter with the lowest priority is selected as the target control parameter of the current plating process again, and the above Modbus RTU communication process is executed on all target power supplies, the next plating process is started. Repeat this process until all plating processes are polled.
[0038] For example, assuming there are 3 target power supplies, the target plating recipe includes 10 plating processes, the key control parameters include voltage, current and state, and the priorities are: current > state > voltage. For the first plating process, first, take the current as the target control parameter, determine the Modbus RTU communication parameters of each target power supply according to the current, and complete the write operation of the current on the 3 target power supplies in turn based on the Modbus RTU communication parameters. Then take the state as the target control parameter, determine the Modbus RTU communication parameters of each target power supply according to the state, and complete the read operation of the state on the 3 target power supplies in turn based on the Modbus RTU communication parameters. Then take the voltage as the target control parameter, determine the Modbus RTU communication parameters of each target power supply according to the voltage, and complete the write operation of the voltage on the 3 target power supplies in turn based on the Modbus RTU communication parameters. In this way, the power supply polling control of the first plating process is completed, and then the power supply polling control of the second plating process to the tenth plating process is started in turn.
[0039] In the embodiment, optionally, the Modbus RTU communication adopts the array and structure body mode for read-write control. Specifically, one Modbus RTU read-write can be divided into 31 time sequences, for example, time sequences 1-10 are used for writing current, and time sequences 11-31 are used for reading state. Each time sequence is described by an array of structure bodies, so that the read-write operation of different target power supplies can be realized, the configuration flexibility of the communication parameters of different power supplies is greatly improved, and the programming difficulty of multiple power supplies is reduced.
[0040] In S130, the plating process of the target plating object is controlled based on the polling control result of each target power supply.
[0041] In the embodiment, in the process of polling control of the key control parameters of each target power supply, the plating process of the target plating object can be controlled based on the polling control result of each target power supply, so that the polling and plating are synchronized. Optionally, the plating process of the target plating object based on the polling control result of each target power supply includes: controlling the target power supply to output the target control parameter of the current plating process, and executing the current plating process on the target plating object according to the target control parameter of the current plating process; if the current plating process is completed, controlling the target power supply to output the target control parameter of the next plating process, and executing the next plating process on the target plating object according to the target control parameter of the next plating process, until all plating processes are completed.
[0042] Specifically, in the process of polling control of the key control parameters of each target power supply, after completing the read-write operation of one key control parameter of one target power supply each time, the target power supply can be controlled to output the current target control parameter, so that the current plating process is executed on the target plating object according to the current target control parameter. At the same time, the read-write operation of the key control parameter can be performed on other target power supplies, until all power supplies complete the read-write operation of the key control parameter, and then the next plating process is started, and all plating processes are completed. By adopting the adjacent processing mode for the same key control parameter of different target power supplies, the effect of plating while polling is achieved, and it is not necessary to wait until one target power supply completes the read-write operation of all power supply control parameters before polling control of the next target power supply, so that the control interval time of different power supply key control parameters is effectively reduced (verified that the control interval time of different target power supplies can be shortened to 0.1s), the synchronization of power supply control is greatly improved, and the plating efficiency and quality are improved.
[0043] The technical scheme of the embodiment of the present application can obtain a target electroplating formula when detecting that a target electroplating object reaches a target electroplating position, wherein the target electroplating formula includes a plurality of electroplating processes, and the target electroplating formula is used to describe a plurality of key control parameters of each electroplating process; the priority of the plurality of key control parameters is determined, and the key control parameters of each target power supply are polled and controlled in each electroplating process in a descending order of priority based on Modbus RTU communication; and the electroplating process of the target electroplating object is controlled based on the polling control result of each target power supply. The technical scheme can effectively reduce the control interval time of different power supply key control parameters based on Modbus RTU polling scanning control, greatly improve the power control synchronization, support different power supplies compatible with Modbus RTU communication, and help to improve the electroplating efficiency and quality.
[0044] In the embodiment, the method further includes: determining the read-write frequency and timeout length of each key control parameter according to the priority of the plurality of key control parameters; and correspondingly, polling and controlling the key control parameters of each target power supply in each electroplating process in a descending order of priority based on Modbus RTU communication, including: polling and controlling the key control parameters of each target power supply in each electroplating process in a descending order of priority based on Modbus RTU communication according to the read-write frequency and timeout length of each key control parameter.
[0045] In the embodiment, the read-write frequency and timeout length of each key control parameter can also be determined according to the priority of the plurality of key control parameters. The higher the priority of the key control parameter is, the greater the corresponding read-write frequency is, and the shorter the corresponding timeout length is. The timeout length can be used to represent the length of time of non-response. Specifically, in the process of polling and controlling the key control parameters of each target power supply in each electroplating process in a descending order of priority based on Modbus RTU communication, a higher read-write frequency can be used for the key control parameter with a higher priority, and a lower read-write frequency can be used for the key control parameter with a lower priority. Further, if the non-response time length of the key control parameter with a higher priority is greater than the timeout length, retrying is immediately performed (the number of retries does not exceed a preset number); and if the non-response time length of the key control parameter with a lower priority is greater than the timeout length, the key control parameter can be directly skipped or an error can be recorded.
[0046] Through the above setting, the key control parameters of different target power supplies are polled and controlled according to the read-write frequency and timeout length determined based on the priority of the key control parameters, which can further improve the efficiency and accuracy of polling control, and help to further improve the electroplating efficiency and quality.
[0047] Embodiment Two
[0048] Figure 2 A flow chart of a method for controlling multiple programmable power supplies is provided for the second embodiment of the present application, which is optimized based on the above-mentioned embodiment. The specific optimization is that the method further comprises: writing a target threshold upper limit to each target power supply based on Modbus RTU communication; wherein the target threshold upper limit is used to limit the key control parameters; and accordingly, controlling the electroplating process of the target electroplating object based on the polling control result of each target power supply, including: checking the polling control result of each target power supply according to the target threshold upper limit; if the check passes, controlling the electroplating process of the target electroplating object according to the polling control result of each target power supply; and if the check fails, issuing a control parameter error alarm.
[0049] As shown in Figure 2 , the method of the present embodiment specifically comprises the following steps:
[0050] S210, when it is detected that the target electroplating object reaches the target electroplating position, obtaining a target electroplating formula; wherein the target electroplating formula comprises multiple electroplating processes, and the target electroplating formula is used to describe multiple key control parameters of each electroplating process.
[0051] S220, writing a target threshold upper limit to each target power supply based on Modbus RTU communication; wherein the target threshold upper limit is used to limit the key control parameters.
[0052] For example, the target threshold upper limit can include a voltage upper limit, a current upper limit and a power upper limit, which are respectively used to limit the voltage, the current and the power (represented as the product of the voltage and the current).
[0053] S230, determining the priority of the multiple key control parameters, and performing key control parameter polling control on each target power supply in each electroplating process in the order from high to low based on Modbus RTU communication according to the priority.
[0054] S240, checking the polling control result of each target power supply according to the target threshold upper limit.
[0055] It should be noted that, in order to ensure the correctness of the key control parameters, considering the possibility of manual input of the target electroplating formula error, a check link is added in the present embodiment, by comparing the polling control result of each target power supply with the corresponding target threshold upper limit respectively to determine whether there is an overrun. If there is no overrun, it is determined that the check passes; if there is an overrun, it is determined that the check fails.
[0056] S250, if the check passes, controlling the electroplating process of the target electroplating object according to the polling control result of each target power supply.
[0057] S260, if the check fails, a control parameter error alarm is sent out.
[0058] In this embodiment, if the check passes, the plating process of the target plating object can be directly controlled according to the polling control result of each target power supply. The specific control process can be referred to the related description in the above embodiments. If the check fails, a control parameter error alarm needs to be sent out immediately to remind the relevant management personnel to handle it in time. Exemplarily, the content of the control parameter error alarm can include the parameter object that generates the error, the parameter value, the threshold upper limit and the over-limit value. In addition, the specific way of the control parameter error alarm is not limited in this embodiment, and one or more alarm ways can be used, such as text reminder (such as short message or pop-up window), voice reminder (such as telephone or broadcast) and sound and light alarm.
[0059] The technical solution of the embodiment of the application can also write a target threshold upper limit to each target power supply based on Modbus RTU communication. The target threshold upper limit is used to limit the key control parameters. When the plating process of the target plating object is controlled based on the polling control result of each target power supply, the polling control result of each target power supply is checked according to the target threshold upper limit. If the check passes, the plating process of the target plating object is controlled according to the polling control result of each target power supply. If the check fails, a control parameter error alarm is sent out. This technical solution can effectively reduce the control interval time of the key control parameters of different power supplies based on Modbus RTU polling control, greatly improve the synchronization of power supply control, and at the same time, support different power supplies compatible with Modbus RTU communication, which helps to improve the plating efficiency and quality. In addition, the polling control result of each target power supply is checked by adding a checking link, which can effectively deal with the situation that the target plating formula is input by artificial error, ensure the correctness of the key control parameters, and help to further improve the plating quality.
[0060] Embodiment three
[0061] Figure 3 A structural schematic diagram of a multi-programmable power supply control device provided for the third embodiment of the application is shown in the figure. The device can execute the multi-programmable power supply control method provided by any embodiment of the application, and has the corresponding function modules and beneficial effects of the execution method. As shown in the figure, the device comprises: Figure 3
[0062] The plating formula acquisition module 310 is configured to acquire a target plating formula when detecting that a target plating object reaches a target plating position. The target plating formula comprises a plurality of plating processes, and the target plating formula is used to describe a plurality of key control parameters of each plating process.
[0063] The key parameter polling module 320 is configured to determine priorities of the plurality of key control parameters, and perform key control parameter polling control on each target power supply in each electroplating process according to the priorities from high to low based on Modbus RTU communication.
[0064] The electroplating process control module 330 is configured to control an electroplating process of the target electroplating object based on the polling control result of each target power supply.
[0065] Optionally, the key parameter polling module 320 is configured to:
[0066] determine one key control parameter as a target control parameter of a current electroplating process according to the priorities of the plurality of key control parameters each time;
[0067] perform read-write control of the target control parameter on each target power supply according to the target station number, the target read-write address and the target read-write command of each target power supply in the current electroplating process;
[0068] If the key control parameters of the current electroplating process are all polled, then perform key control parameter polling control on each target power supply in a next electroplating process until all electroplating processes are polled.
[0069] Optionally, the electroplating process control module 330 is configured to:
[0070] control the target power supply to output the target control parameter of the current electroplating process, and perform the current electroplating process on the target electroplating object according to the target control parameter of the current electroplating process;
[0071] If the current electroplating process is performed, then control the target power supply to output the target control parameter of the next electroplating process, and perform the next electroplating process on the target electroplating object according to the target control parameter of the next electroplating process until all electroplating processes are performed.
[0072] Optionally, the apparatus further comprises a communication parameter determination module configured to:
[0073] determine a read-write frequency and a timeout duration of each key control parameter according to the priorities of the plurality of key control parameters;
[0074] Correspondingly, the key parameter polling module 320 is configured to:
[0075] perform key control parameter polling control on each target power supply in each electroplating process according to the priorities from high to low based on Modbus RTU communication according to the read-write frequency and the timeout duration of each key control parameter.
[0076] Optionally, the device further comprises: a threshold upper limit writing module, configured to:
[0077] write a target threshold upper limit to each of the target power supplies based on the Modbus RTU communication; wherein the target threshold upper limit is used to limit the key control parameter;
[0078] Correspondingly, the electroplating process control module 330 is configured to:
[0079] verify the polling control result of each target power supply according to the target threshold upper limit;
[0080] if the verification is passed, control the electroplating process of the target electroplating object according to the polling control result of each target power supply;
[0081] if the verification is not passed, issue a control parameter error alarm.
[0082] Optionally, the Modbus RTU communication adopts an array and structure body mode for read-write control.
[0083] Optionally, the key control parameter comprises voltage, current and state, and the state comprises standby, start, running and failure.
[0084] The multi-programmable power supply control device provided by the embodiment of the application can execute the multi-programmable power supply control method provided by any embodiment of the application, and has the corresponding function modules and beneficial effects of the execution method.
[0085] Embodiment Four
[0086] Figure 4 A structural schematic diagram of an electronic device 10 that can be used to implement embodiments of the application is shown. The electronic device is intended to represent various forms of digital computers, such as laptops, desktops, tablets, personal digital assistants, servers, blade servers, mainframes, and other appropriate computers. The electronic device can also represent various forms of mobile devices, such as personal digital assistants, cellular telephones, smartphones, wearable devices (e.g., headsets, glasses, watches, etc.), and other similar computing devices. The components shown here, their connections and relationships, and their functions, are meant to be examples only, and are not intended to limit the implementations of the applications described and / or claimed in this document.
[0087] As Figure 4As shown, the electronic device 10 includes at least one processor 11, and a memory, such as a read-only memory (ROM) 12, a random access memory (RAM) 13, etc., communicatively connected to the at least one processor 11, where the memory stores a computer program executable by the at least one processor. The processor 11 can perform various appropriate actions and processes according to the computer program stored in the read-only memory (ROM) 12 or loaded from the storage unit 18 into the random access memory (RAM) 13. In the RAM 13, various programs and data required for the operation of the electronic device 10 can also be stored. The processor 11, the ROM 12, and the RAM 13 are connected to each other through a bus 14. An input / output (I / O) interface 15 is also connected to the bus 14.
[0088] Various components in the electronic device 10 are connected to the I / O interface 15, including an input unit 16, such as a keyboard, a mouse, etc., an output unit 17, such as various types of displays, a speaker, etc., a storage unit 18, such as a magnetic disk, an optical disk, etc., and a communication unit 19, such as a network card, a modem, a wireless communication transceiver, etc. The communication unit 19 allows the electronic device 10 to exchange information / data with other devices through a computer network, such as the Internet, and / or various telecommunication networks.
[0089] The processor 11 can be various general and / or special-purpose processing components with processing and computing capabilities. Some examples of the processor 11 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various special-purpose artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, a digital signal processor (DSP), and any appropriate processor, controller, microcontroller, etc. The processor 11 performs various methods and processes described above, such as the multi-programmable power supply control method.
[0090] In some embodiments, the multi-programmable power supply control method can be implemented as a computer program tangibly embodied in a computer readable storage medium, such as the storage unit 18. In some embodiments, part or all of the computer program can be loaded and / or installed onto the electronic device 10 via the ROM 12 and / or the communication unit 19. When the computer program is loaded into the RAM 13 and executed by the processor 11, one or more steps of the multi-programmable power supply control method described above can be performed. Alternatively, in other embodiments, the processor 11 can be configured to perform the multi-programmable power supply control method by any other appropriate means, such as by means of firmware.
[0091] The various embodiments of the systems and techniques described above can be implemented in digital electronic circuitry, integrated circuitry, a field programmable gate array (FPGA), an application specific integrated circuit (ASIC), a system on a chip (SOC), a load programmable logic device (CPLD), computer hardware, firmware, software, and / or combinations thereof. These various embodiments can include implementation in one or more computer programs that are executable and / or interpretable on a programmable system including at least one programmable processor, which can be special or general purpose, coupled to receive data and instructions from, and to transmit data and instructions to, a storage system, at least one input device, and at least one output device.
[0092] Computer programs used to implement the processes of the application can be written in any combination of one or more programming languages. These computer programs can be provided to a processor of a general purpose computer, special purpose computer, or other programmable data processing apparatus, such that the computer program
[0093] In the context of the present application, a computer-readable storage medium can be a tangible medium that can contain or store computer programs for use by or in connection with an instruction execution system, apparatus, or device. Computer-readable storage media can include, but are not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any suitable combination of the foregoing. Alternatively, a computer-readable storage medium can be a machine-readable signal medium. More specific examples of the machine-readable storage medium will include one or more lines of a program of instructions in a transitory signal, a portable computer diskette, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM or flash memory), an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the foregoing.
[0094] To provide for interaction with a user, the systems and techniques described here can be implemented on an electronic device having a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user and a keyboard and a pointing device (e.g., a mouse or a trackball) by which the user can provide input to the electronic device. Other kinds of devices can be used to provide for interaction with a user as well; for example, feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form, including acoustic, speech, or tactile input.
[0095] The systems and techniques described here can be implemented in a computing system that includes a back end component (e.g., as a data server), or that includes a middleware component (e.g., an application server), or that includes a front end component (e.g., a user computer having a graphical user interface or a Web browser through which a user can interact with an implementation of the systems and techniques described here), or any combination of such back end, middleware, or front end components. The components of the system can be interconnected by any form or medium of digital data communication (e.g., a communication network). Examples of communication networks include a local area network (LAN), a wide area network (WAN), a blockchain network, and the Internet.
[0096] The computing system can include clients and servers. A client and server are generally remote from each other and typically interact through a communication network. The relationship of client and server arises by virtue of computer programs running on the respective computers and having a client-server relationship to each other. A server can be a cloud server, also known as a cloud computing server or cloud host, which is a host product in the cloud computing service system, to solve the defects of large management difficulty and weak business scalability in traditional physical host and VPS service.
[0097] It should be understood that the various forms of flow shown above can be re-ordered, added to, or deleted from without departing from the scope of the present disclosure. For example, the steps recited in the present disclosure can be executed in parallel, executed in sequence, or executed in a different order, as long as the desired results of the present disclosure are achieved, and the present disclosure is not limited herein.
[0098] The specific embodiments described above are not intended to be limiting, and persons skilled in the art will appreciate that various modifications, combinations, sub-combinations and alternatives can be made to the specific embodiments without departing from the spirit and principles of the disclosure. Accordingly, the disclosure is not limited to the specific embodiments described above, but only by the scope of the appended claims.
Claims
1. A method of controlling a plurality of programmable power supplies, characterized by, The method comprises: When a target electroplating object reaches a target electroplating position, a target electroplating formula is obtained; wherein the target electroplating formula comprises a plurality of electroplating processes, and the target electroplating formula is used to describe a plurality of key control parameters of each electroplating process; A priority of the plurality of key control parameters is determined, and each target power supply is controlled in each electroplating process according to the priority from high to low based on Modbus RTU communication; An electroplating process of the target electroplating object is controlled based on a polling control result of each target power supply.
2. The method of claim 1, wherein, The polling control of each target power supply in each electroplating process according to the priority from high to low based on Modbus RTU communication comprises: According to the priority of the plurality of key control parameters, one key control parameter is determined as a target control parameter of a current electroplating process each time; In the current electroplating process, each target power supply is controlled in reading and writing of the target control parameter according to a target station number, a target read-write address and a target read-write command of each target power supply; If the polling of the plurality of key control parameters of the current electroplating process is completed, each target power supply in a next electroplating process is controlled in polling of key control parameters until the polling of all electroplating processes is completed.
3. The method of claim 2, wherein, The electroplating process of the target electroplating object is controlled based on the polling control result of each target power supply, comprising: The target power supply is controlled to output the target control parameter of the current electroplating process, and the target electroplating object is executed in the current electroplating process according to the target control parameter of the current electroplating process; If the execution of the current electroplating process is completed, the target power supply is controlled to output the target control parameter of the next electroplating process, and the target electroplating object is executed in the next electroplating process according to the target control parameter of the next electroplating process until the execution of all electroplating processes is completed.
4. The method of claim 1, wherein, The method further comprises: A read-write frequency and a timeout duration of each key control parameter are determined according to the priority of the plurality of key control parameters; Accordingly, the polling control of each target power supply in each electroplating process according to the priority from high to low based on Modbus RTU communication comprises: The polling control of each target power supply in each electroplating process according to the priority from high to low based on Modbus RTU communication comprises:
5. The method of claim 1, wherein, A target threshold upper limit is written into each target power supply based on the Modbus RTU communication; wherein the target threshold upper limit is used to limit the key control parameter; Accordingly, the electroplating process of the target electroplating object is controlled based on the polling control result of each target power supply, comprising: The polling control result of each target power supply is verified according to the target threshold upper limit; If the verification is passed, the electroplating process of the target electroplating object is controlled according to the polling control result of each target power supply. If the check fails, a control parameter error alarm is issued.
6. The method according to any one of claims 1-5, characterized in that, The Modbus RTU communication adopts an array and structure body mode for read-write control.
7. The method of claim 6, wherein, The key control parameters include voltage, current and state, and the state includes standby, start, running and failure.
8. A plurality of programmable power supply control devices, characterized by, The device comprises: An electroplating formula acquisition module is configured to acquire a target electroplating formula when a target electroplating object is detected to arrive at a target electroplating position, wherein the target electroplating formula comprises a plurality of electroplating processes, and the target electroplating formula is configured to describe a plurality of key control parameters of each electroplating process; A key parameter polling module is configured to determine priorities of the plurality of key control parameters, and perform key control parameter polling control on each target power supply in each electroplating process in a descending order of the priorities based on Modbus RTU communication; An electroplating process control module is configured to control an electroplating process of the target electroplating object based on a polling control result of the each target power supply.
9. An electronic device, comprising: The electronic device comprises: at least one processor; and a memory connected with the at least one processor in communication; wherein The memory stores a computer program executable by the at least one processor, and the computer program is executed by the at least one processor to enable the at least one processor to execute the multi-programmable power supply control method in any one of claims 1-7.
10. A computer-readable storage medium, characterized in that, The computer readable storage medium stores computer instructions for enabling the processor to execute the multi-programmable power supply control method in any one of claims 1-7 when executed.