Surface height distribution measuring device

Abstract

The present invention provides a surface height distribution measurement device for measuring a surface height distribution of a plate-shaped measurement object, and comprises: a non-contact distance measurement unit for non-contact measurement of a distance from the non-contact distance measurement unit to the surface of the measurement object; a moving unit that moves the object to be measured and the non-contact distance measuring unit relative to each other; and a plate-shaped member provided at a position that is parallel to the measurement object and is not in contact with the measurement object when the measurement is performed by the non-contact distance measurement unit, and that covers at least a portion of the measurement object when viewed from a direction perpendicular to a surface of the measurement object. Therefore, compared with the prior art, measurement can be carried out with better precision.

Description

TECHNICAL FIELD

[0001] The present application relates to a surface height distribution measuring apparatus for measuring a surface height distribution of a plate-like measurement object. BACKGROUND

[0002] A measurement apparatus for measuring a surface height of a plate-like measurement object has been disclosed in Japanese Patent Laid-Open Publication No. 2003-75147 (hereinafter, referred to as "Document Dl"). The flatness measuring apparatus disclosed in the Document Dl is provided with three support portions for supporting a circular plate-like measurement object at three points, an upper and lower pair of electrostatic capacitance type displacement sensors for measuring a distance from an upper electrostatic capacitance type displacement sensor to an upper side surface of the measurement object and a distance from a lower electrostatic capacitance type displacement sensor to a lower side surface of the measurement object, a lifting and rotating device, and a computer. The flatness measuring apparatus measures in the following manner: the measurement object is lifted and rotated by a specified angle by the lifting and rotating device, and then, the measurement object is lowered and supported by each of the support portions; each of the pair of electrostatic capacitance type displacement sensors is scanned on a straight line passing through the center of the measurement object, thereby performing measurement, and the thickness of the measurement object is calculated from the measurement values of the upper side surface and the lower side surface by the computer; the measurement object is returned to the lifting and rotating device; the measurement object is lifted and rotated by the lifting and rotating device; and then, scanning and measurement are performed on the next straight line.

[0003] Since the flatness measuring apparatus disclosed in the Document Dl performs measurement by the pair of electrostatic capacitance type displacement sensors, when the measurement object is slightly vibrated in the up and down direction, the distance from the upper electrostatic capacitance type displacement sensor to the upper side surface of the measurement object and the distance from the lower electrostatic capacitance type displacement sensor to the lower side surface of the measurement object are erroneous, and thus, the measurement accuracy is deteriorated. SUMMARY

[0004] The present application has been made in view of the above-described circumstances, and has an object to provide a surface height distribution measuring apparatus capable of performing measurement with higher accuracy.

[0005] One aspect of the present application relates to a surface height distribution measuring apparatus for measuring a surface height distribution of a plate-like measurement object, and including: a non-contact distance measuring section that non- contactly measures a distance from the non-contact distance measuring section to a surface of the measurement object; a moving section that relatively moves the measurement object and the non-contact distance measuring section; and a plate-like member that is disposed at a position non-contacting and parallel to the measurement object when measurement is performed by the non-contact distance measuring section, and that covers at least a part of the measurement object when viewed from a direction perpendicular to the surface of the measurement object.

[0006] According to the present application, measurement can be performed with higher accuracy.

[0007] The above objects, features and other advantages of the present application will become more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which: BRIEF DESCRIPTION OF DRAWINGS

[0008] Figure 1 is a diagram for explaining a structural configuration of a surface height distribution measuring apparatus in the embodiment.

[0009] Figure 2 is a block diagram showing an electrical configuration of the surface height distribution measuring apparatus.

[0010] Figure 3 is a flowchart showing an operation of the surface height distribution measuring apparatus.

[0011] Figure 4 is a diagram for explaining an operation of the surface height distribution measuring apparatus. DETAILED DESCRIPTION

[0012] Hereinafter, one or more embodiments of the present application will be described with reference to the accompanying drawings. However, the scope of the present application is not limited to the disclosed embodiments. In addition, the constituent elements to which the same reference numerals are attached in each drawing represent the same constituent elements, and the explanation thereof is omitted accordingly. In the present specification, when a constituent element is indicated as a general term, the constituent element is indicated by a reference numeral with a suffix omitted, whereas when a constituent element is indicated as an individual term, the constituent element is indicated by a reference numeral with a suffix added.

[0013] First, the configuration of the present embodiment will be described. Figure 1 is a diagram for explaining a structural configuration of a surface height distribution measuring apparatus in the embodiment. Figure 1 In the diagram, A indicates a front view, B indicates a side view, and C indicates a plan view. Figure 2 is a block diagram showing an electrical configuration of the surface height distribution measuring apparatus.

[0014] The surface height distribution measuring apparatus 1000 in the embodiment, for example, as shown in Figure 1 and Figure 2 has: first and second lift-rotation sections 1A, 1B; first and second non-contact distance measuring sections 2A, 2B; a support-moving section 3; a control processing section 4; an input section 5; an output section 6; an interface section (IF section) 7; and a storage section 8.

[0015] The first and second lift-rotation sections 1A, 1B are each a device that is electrically connected to the control processing section 4 and lifts and rotates a measurement object WA that is in a plate shape (in the present embodiment, a circular plate shape) by a specified angle in the circumferential direction in accordance with control by the control processing section 4. The first lift-rotation section 1A is disposed at a specified first position P1, and the second lift-rotation section 1B is disposed at a specified second position P2 that is different from the first position P1. Since the first and second lift-rotation sections 1A, 1B are of the same structure, the following mainly describes the first lift-rotation section 1A. Also, the description of the second lift-rotation section 1B is omitted by replacing the description of the second lift-rotation section 1B with the symbols of the constituent elements of the second lift-rotation section 1B enclosed in parentheses after the symbols of the constituent elements of the first lift-rotation section 1A.

[0016] More specifically, the first lift-rotation section 1A (1B) has: a rotation section 1-1A (1-1B); and a lift section 1-2A (1-2B). The rotation section 1-1A (1-1B) has: a rotation member; and a rotation mechanism that is electrically connected to the control processing section 4 and rotates the rotation member in the circumferential direction in accordance with control by the control processing section 4. The rotation section 1-1A (1-1B) rotates the rotation member in the circumferential direction by the rotation mechanism, thereby rotating the measurement object WA placed on the upper side of the rotation member in the circumferential direction. The rotation mechanism, for example, has: a stepping motor; and a transmission mechanism that is linked to the output shaft of the stepping motor and links the outer circumferential surface thereof to the inner circumferential surface of the rotation member, and transmits the rotation force of the stepping motor to the rotation member. The lift section 1-2A (1-2B) has: a guide member for guiding (directing) the rotation section 1-1A (1-1B); and a lift mechanism that is electrically connected to the control processing section 4 and lifts the rotation section 1-1A (1-1B) in accordance with control by the control processing section 4. The lift mechanism, for example, has an electromagnetic cylinder or the like. The lift section 1-2A (1-2B) lifts the rotation section 1-1A (1-1B) by the lift mechanism, thereby lifting the measurement object WA placed on the upper side of the rotation member.

[0017] The aforementioned first and second lifting and rotating parts 1A and 1B are respectively disposed at designated first and second positions P1 and P2 on the upper side of a plate-shaped member extending in one direction, i.e., the first support part 11. The two ends of the first support part 11 are respectively connected and fixed to a plate-shaped member, for example, erected on a platform BP, i.e., a pair of first and second legs 12-1 and 12-2. Therefore, the first leg 12-1, the first support part 11, and the second leg 12-2 are connected sequentially in this order, as follows: Figure 1 As shown in B, when viewed from the side, they are roughly shaped like a downward-facing "U".

[0018] For ease of explanation, such as Figure 1 As shown, an orthogonal xyz coordinate system is set. This orthogonal xyz coordinate system is an orthogonal coordinate system with the extension direction of the first support 11, i.e., the aforementioned direction, as the x-axis (x-direction; front-back direction), the width direction of the first support 11, which is orthogonal to the extension direction, as the y-axis (y-direction; left-right direction), and the direction orthogonal to the x-direction and y-direction, respectively, as the z-axis (z-direction; height direction). This orthogonal xyz coordinate system will be appropriately used in the following description.

[0019] Position P1 is a position that satisfies the following condition: during the return journey from position P2 to position P1, after scanning the object WA along a straight line passing through the center of the object WA by the first and second non-contact distance measuring units 2A and 2B, the object WA is positioned so that it can move up and down and rotate around its center. For example, position P1 is a position located on the x-direction relative to the positions of the first and second non-contact distance measuring units 2A and 2B, which is larger than the diameter of the object WA. Similarly, position P2 is a position that satisfies the following condition: during the forward journey from position P1 to position P2, after scanning the object WA along a straight line passing through the center of the object WA by the first and second non-contact distance measuring units 2A and 2B, the object WA is positioned so that it can move up and down and rotate around its center. For example, the second position P2 is located on the other side of the x-direction relative to the setting positions of the first and second non-contact distance measuring units 2A and 2B, and is a position that is larger than the diameter of the object being measured WA.

[0020] The object to be measured, WA, can be any component as long as it is plate-shaped. In this embodiment, it is a circular plate, such as a wafer used to manufacture semiconductors (e.g., a silicon wafer) or an aluminum or glass substrate for hard disks.

[0021] The first and second non-contact distance measuring sections 2A, 2B are devices that are electrically connected to the control processing section 4 and non-contactly measure the distance from the first and second non-contact distance measuring sections 2A, 2B to the surface (for example, the front surface, that is, the upper surface, or the back surface, that is, the lower surface) of the measurement object WA in accordance with the control of the control processing section 4, and are, for example, electrostatic capacity type displacement meters, eddy current type displacement meters, laser type displacement meters, confocal type displacement meters, or the like. In the present embodiment, an electrostatic capacity type displacement meter is employed from the viewpoint of reducing noise. The first non-contact distance measuring section 2A and the second non-contact distance measuring section 2B are disposed so as to face each other with a specified interval (first interval) so that the measurement object WA can pass therethrough. Based on this configuration, the first non-contact distance measuring section 2A measures a first distance from the first non-contact distance measuring section 2A to one side surface (one of the front surface and the back surface) of the measurement object WA, and the second non-contact distance measuring section 2B measures a second distance from the second non-contact distance measuring section 2B to the other side surface (the other of the front surface and the back surface) of the measurement object WA. The first and second non-contact distance measuring sections 2A, 2B respectively output each measurement result to the control processing section 4.

[0022] The first non-contact distance measuring section 2A described above is provided in a portion (position) of the lower surface of a plate-shaped member, that is, the first support arm section 22-1, at one end in the one direction (x direction), and the second non-contact distance measuring section 2B is provided in a portion (position) of the upper surface of a plate-shaped member, that is, the second support arm section 22-2, at one end in the one direction (x direction) and in the y direction with a width wider than the outer diameter of the second lifting and rotating section IB. In order to cause the first non-contact distance measuring section 2A and the second non-contact distance measuring section 2B to face each other with the first interval, the first and second support arm sections 22-1, 22-2 are respectively joined and fixed to a columnar member, that is, the second support section 21, which is erected on the platform BP at the outer side in the x direction with respect to the second leg section 12-2 (or at the outer side in the x direction with respect to the first leg section 12-1) by the end portions of the other ends thereof. Thus, the first and second support arm sections 22-1, 22-2 are disposed apart from each other in the z direction, and as shown in FIG. 8B, the first support arm section 22-1, the second support arm section 22-2, and the second support section 21 substantially have an F-shaped appearance in side view. Figure 1 A through opening is formed in the second support arm section 22-2 at a position corresponding to the position at which the second lifting and rotating section IB is provided, so as to allow the second lifting and rotating section IB to be able to be raised and lowered with respect to the second support arm section 22-2 in the z direction.

[0023] Further, the first non-contact distance measuring section 2A and the second non-contact distance measuring section 2B can also be structures that are held by other means in a manner that passes through the center of the measurement object WA.

[0024] The support moving section 3 is electrically connected to the control processing section 4 and supports the measurement object WA in accordance with the control of the control processing section 4, and moves the measurement object WA and the first and second non-contact distance measuring sections 2A, 2B relative to each other between the first and second positions PI, P2 in a manner that the first and second non-contact distance measuring sections 2A, 2B pass through the center of the measurement object WA. In the present embodiment, as described above, the first and second non-contact distance measuring sections 2A, 2B are fixedly provided based on the first and second support arm sections 22-1, 22-2 and the second support section 21, and the measurement object WA is moved relative to the first and second non-contact distance measuring sections 2A, 2B by moving the support moving section 3 that supports the measurement object WA. Further, the surface height distribution measuring apparatus 1000 can also be configured in a manner that the first and second non-contact distance measuring sections 2A, 2B are moved relative to the measurement object WA that is fixedly disposed.

[0025] More specifically, the support moving section 3 includes three first to third support pins 31-1 to 31-3, a pair of third and fourth support sections 32-1, 32-2, a linking section 33, a moving section 34, and a plate-shaped member 35. The first to third support pins 31-1 to 31-3 are needle-shaped members or thin columnar members that support the measurement object WA from below at one ends in the z direction, i.e., distal ends, respectively (3-point support). In the present embodiment, the first to third support pins 31-1 to 31-3 are formed of, for example, an insulating material such as resin. The first support pin 31-1 is vertically provided from one end face in the z direction of the plate-shaped member, i.e., the third support section 32-1, at the other end in the z direction, i.e., the base end. The second support pin 31-2 is vertically provided from one end face in the z direction of the plate-shaped member, i.e., the fourth support section 32-2, at the other end in the z direction, i.e., the base end, and similarly, the third support pin 31-3 is vertically provided from the end face in the z direction of the plate-shaped member, i.e., the fourth support section 32-2, at the other end in the z direction, i.e., the base end, and the second and third support pins 31-2, 31-3 are disposed apart from each other by a specified interval (second interval) in the x direction. The linking section 33 is a plate-shaped member that is wider than the first support section 11 in the y direction, and is fixedly linked to each end face in the z direction of the third and fourth support sections 32-1, 32-2, each at both end portions in the y direction, in a manner that the third and fourth support sections 32-1, 32-2 are vertically provided. The third support section 32-1 and the fourth support section 32-2 are disposed apart from each other by a specified interval (third interval) in the y direction, each outside of the first support section 11, and the third support section 32-1, the linking section 33, and the fourth support section 32-2 are sequentially linked in this order, as Figure 1As shown in A, in an elevation view, they are roughly in the shape of an upside U. The first support portion 11 is disposed inside the U shape formed by the third support portion 32-1, the connecting portion 33, and the fourth support portion 32-2. The first to third support pins 31-1 to 31-3 are disposed at the apexes of a triangle formed by the third and fourth support portions 32-1, 32-2. The moving portion 34 is an apparatus that is electrically connected to the control processing portion 4 and moves the first to third support pins 31-1 to 31-3 supported by the third and fourth support portions 32-1, 32-2 and the connecting portion 33 in accordance with the control of the control processing portion 4, so that the center of the measurement object WA supported by the first to third support pins 31-1 to 31-3 can be moved in the x direction at least between the first position PI and the second position P2. The moving portion 34, for example, has a housing 34-1 of a box shape, and a base 34-2 that extends in the x direction from the inside of the first leg portion 12-1 to the inside of the second leg portion 12-2. The base 34-2 is configured to have a rack that extends in the x direction. The housing 34-1 is configured to be fixed to the connecting portion 33 at its upper side, and to have a pinion that moves linearly on the rack and an actuator (e.g., a servo motor or the like) that rotates the pinion inside it. The moving portion 34 is configured to move the housing 34-1 and the connecting portion 33 linearly with respect to the base 34-2 based on a gear and rack mechanism. Based on the movement of the connecting portion 33, the measurement object WA supported by the first to third support pins 31-1 to 31-3 moves in the x direction.

[0026] In addition, the number of support pins 31 can be more than three. In addition, the shape of the support pin 31 can be a shape other than a needle-shaped member, and can be a shape other than a thin columnar member.

[0027] The first leg portion 12-1, the first support portion 11, and the second leg portion 12-2 provided with the first and second lifting and rotating portions 1A, 1B, and the first support arm portion 22-1, the second support arm portion 22-2, and the second support portion 21 provided with the first and second non-contact distance measuring portions 2A, 2B are arranged in the order of the center of the first lifting and rotating portion 1A (first position P1), the centers of the first and second non-contact distance measuring portions 2A, 2B, and the center of the second lifting and rotating portion 1B (second position P2) on a straight line along the x direction. The moving portion 34 is arranged so that, in a case where the center of the measurement object WA coincides with each other and the measurement object WA is placed on the first lifting and rotating portion 1A (or the second lifting and rotating portion 1B) and supported by the first to third support pins 31-1 to 31-3, the center of the measurement object WA supported by the first to third support pins 31-1 to 31-3 moves on a straight line passing through the center of the first lifting and rotating portion 1A (first position P1) and the center of the second lifting and rotating portion 1B (second position P2) with respect to the first leg portion 12-1, the first support portion 11, and the second leg portion 12-2 and the first support arm portion 22-1, the second support arm portion 22-2, and the second support portion 21 arranged as described above.

[0028] The plate-shaped member 35 is a member arranged at a position that is substantially parallel to the measurement object WA in non-contact with the measurement object WA when measurement is performed by the first and second non-contact distance measuring portions 2A, 2B, and covers at least a part of the measurement object WA when viewed from a direction perpendicular to the surface of the measurement object WA (z direction in the present embodiment). In the present embodiment, since the measurement object WA moves based on the moving portion 34, the plate-shaped member 35 has the first and second plate-shaped members 35-1, 35-2 arranged at a specified interval (fourth interval) wider than the width (length in the y direction) of the first and second lifting and rotating portions 1A, 1B.

[0029] The first plate-shaped member 35-1 is, for example, rectangular in shape, and is attached to the first support pin 31-1 in such a manner that the back surface (lower surface) of the measurement object WA becomes parallel to the surface of the first plate-shaped member 35-1 and the distal end portion of the first support pin 31-1 protrudes outside the first plate-shaped member 35-1 when the measurement object WA is disposed at the distal end of each of the first to third support pins 31-1 to 31-3. Thus, the first plate-shaped member 35-1 is spaced apart from the measurement object WA in the z direction by a length corresponding to the distal end portion of the first support pin 31-1 (fifth spacing). Also, in the present embodiment, the first plate-shaped member 35-1 is attached to the first support pin 31-1 in such a manner that the side edge on the first support portion 11 side extending in the one direction (x direction) becomes parallel to the side edge of the first support portion 11 and is disposed outside the first and second lift-rotating portions 1A and 1B in the width direction (y direction) of the first support portion 11. The first plate-shaped member 35-1 has an area that covers at least a portion of the measurement object WA (first portion of the measurement object WA) outside in the +y direction with respect to the first support portion 11 when viewed in the z direction when the measurement object WA is disposed at the distal end of each of the first to third support pins 31-1 to 31-3, and is attached to the first support pin 31-1 in such a manner as to cover the first portion on the back surface side (lower surface side) of the measurement object WA. Thus, the first portion of the measurement object WA overlaps the first plate-shaped member 35-1 in the z direction. The first plate-shaped member 35-1 is formed of, for example, a conductor such as aluminum or an alloy containing a conductor such as aluminum, and is grounded. Alternatively, the first plate-shaped member 35-1 is formed of, for example, a semiconductor such as a silicon semiconductor, and is grounded. Further, the first support pin 31-1 and the first plate-shaped member 35-1 can be configured to be attached to a member disposed below the first plate-shaped member 35-1.

[0030] The second plate-shaped member 35-2 is, for example, rectangular in shape, and is fixed to the second and third support pins 31-2, 31-3 in such a manner that the back surface (lower surface) of the measurement object WA becomes parallel to the surface of the second plate-shaped member 35-2 when the measurement object WA is disposed at the distal ends of the first to third support pins 31-1 to 31-3, and the distal end portions of the second and third support pins 31-2, 31-3 protrude to the outside of the second plate-shaped member 35-2 by a length corresponding to the fifth interval. Thus, the second plate-shaped member 35-2 is spaced apart from the measurement object WA in the z direction by the fifth interval. Also, in the present embodiment, the second plate-shaped member 35-2 is fixed to the second and third support pins 31-2, 31-3 in such a manner that the side edge on the side of the first support portion 11 extending in the one direction (x direction) becomes parallel to the side edge of the first support portion 11 and is disposed outside the first and second elevation and rotation portions 1A, 1B in the width direction (y direction) of the first support portion 11. The second plate-shaped member 35-2 has an area that covers at least the portion of the measurement object WA that is outside in the -y direction with respect to the first support portion 11 when viewed in the z direction when the measurement object WA is disposed at the distal ends of the first to third support pins 31-1 to 31-3, and is fixed to the second and third support pins 31-2, 31-3 on the back side (lower surface side) of the measurement object WA in such a manner as to cover this portion. Thus, the second portion of the measurement object WA overlaps the second plate-shaped member 35-2 in the z direction. The second plate-shaped member 35-2 is formed of, for example, a conductor such as aluminum or an alloy containing a conductor such as aluminum, and is grounded. Alternatively, the second plate-shaped member 35-2 is formed of, for example, a semiconductor such as a silicon semiconductor, and is grounded. Furthermore, the second and third support pins 31-2, 31-3 and the second plate-shaped member 35-2 can be configured to be mounted on a member disposed below the second plate-shaped member 35-2.

[0031] The first and second plate-shaped members 35-1, 35-2 are preferably each configured so as not to interfere with the elevation and rotation of the first and second elevation and rotation portions 1A, 1B, and to cover the measurement object WA as widely as possible in a range that does not interfere with the measurement of the second non-contact distance measuring portion 2B.

[0032] The fifth interval is a length that does not come into contact with the first and second plate-shaped members 35-1, 35-2 even if the measurement object WA is deflected by its own weight or individual differences (product variations), and the like, and is preferably as short (small) as possible. The fifth interval is, for example, a length of several mm or less, such as 0.5 mm, 1 mm, or 2 mm.

[0033] Further, each of the first and second plate-shaped members 35-1, 35-2 is not limited to a rectangular shape, but can be another shape such as a semicircular shape. Further, in a case where the first non-contact distance measuring section 2A measures only the surface height distribution of the measurement object WA from a specified reference surface without performing measurement by the second non-contact distance measuring section 2B, the plate-shaped member 35 can be one member of, for example, a square shape or a circular shape, etc. having a through opening formed in a central portion thereof through which the first and second lifting and rotating sections 1A, 1B can be raised and lowered in the z direction.

[0034] The input section 5 is an apparatus electrically connected to the control processing section 4 and inputting various instructions (for example, an instruction instructing start of measurement, etc.) and various data (for example, a name of the measurement object WA or a pre-set angle, etc.) necessary when the surface height distribution measuring apparatus 1000 is operated, which is, for example, a plurality of input switches or a keyboard or a mouse, etc. to which a pre-set function is assigned. The output section 6 is an apparatus electrically connected to the control processing section 4 and outputting the instructions or data input from the input section 5 and the operation results, etc. in accordance with the control of the control processing section 4, which is, for example, a display device such as a CRT display, an LCD (Liquid Crystal Display) or an organic EL display, or a printing device such as a printer, etc.

[0035] Further, the input section 5 and the output section 6 can be formed by a touch panel. In a case where the input section 5 and the output section 6 are formed by a touch panel, the input section 5 can be, for example, a position input device detecting an operation position in a resistive film manner or an electrostatic capacity manner and performing input, and the output section 6 can be a display device. In the touch panel, the position input device is provided on a display surface of the display device, and a candidate item capable of inputting one or a plurality of input contents of the display device is displayed, when a user touches a display position indicating an input content which the user wants to input, the position is detected based on the position input device, and a display content displayed at the detected position is input to the surface height distribution measuring apparatus 1000 as an operation input content of the user. In the touch panel, since the user easily understands the input operation intuitively, a surface height distribution measuring apparatus 1000 which is easy to handle for the user is provided.

[0036] The IF section 7 is a circuit (for example, an interface circuit of RS-232C of a serial communication system, an interface circuit in accordance with a Bluetooth (registered trademark) specification, or an interface circuit in accordance with a USB specification, etc.) electrically connected to the control processing section 4 and inputting and outputting data between, for example, the apparatus and an external device in accordance with the control of the control processing section 4. Further, the IF section 7 can be a communication interface circuit (for example, a data communication card, or a communication interface circuit in accordance with an IEEE 802.11 specification, etc.) which transmits and receives a communication signal with an external device.

[0037] The storage section 8 is an electric circuit that is electrically connected to the control processing section 4 and stores various kinds of preset programs and various kinds of preset data in accordance with the control of the control processing section 4.

[0038] The various kinds of preset programs include, for example, a control processing program including, for example, a control program and a measurement control program. The control program respectively controls each of the sections 1A, 1B, 2A, 2B, 3, 5 to 8 of the surface height distribution measuring apparatus 1000 in accordance with the functions of the sections. The measurement control program is a program that controls measurement of the measurement object WA.

[0039] The various kinds of preset data include, for example, data necessary when the above-described programs are executed (for example, the name of the measurement object WA, a preset angle, a preset sampling interval, or a measurement result, etc.).

[0040] The above-described storage section 8 includes, for example, a ROM (Read Only Memory) serving as a nonvolatile storage element, or an EEPROM (Electrically Erasable Programmable Read Only Memory) serving as a rewritable nonvolatile storage element, etc. Further, the storage section 8 includes a RAM (Random Access Memory) serving as a work memory of the control processing section 4 that stores data and the like generated in the execution of the above-described preset programs, etc. In addition, the storage section 8 can include a hard disk device and / or a solid state drive (SSD) having a large storage capacity.

[0041] The control processing section 4 is an electric circuit that respectively controls each of the sections 1A, 1B, 2A, 2B, 3, 5 to 8 of the surface height distribution measuring apparatus 1000 in accordance with the functions of the sections and measures the surface height distribution of the measurement object. The control processing section 4 includes, for example, a CPU (Central Processing Unit) and its peripheral circuit. The control processing section 4 functionally includes a control section 41 and a measurement control section 42 by executing the control processing program.

[0042] The control section 41 respectively controls each of the sections 1A, 1B, 2A, 2B, 3, 5 to 8 of the surface height distribution measuring apparatus 1000 in accordance with the functions of the sections, and governs the control of the entire surface height distribution measuring apparatus 1000.

[0043] The measurement control section 42 controls measurement of the measurement object WA. More specifically, the measurement control section 42 controls the first lift-rotation section 1A in such a manner that the measurement object WA is rotated by a prescribed angle in the circumferential direction. The measurement control section 42 controls the first lift-rotation section 1A and the support moving section 3 in such a manner that the measurement object WA is supported from the first lift-rotation section 1A to the support moving section 3. The measurement control section 42 controls the support moving section 3 and the first and second non-contact distance measurement sections 2A, 2B in such a manner that, in the case where the measurement object WA is moved from the first position PI to the second position P2 by the support moving section 3, the first and second distances to the one side surface and the other side surface in the measurement object WA are measured at a prescribed sampling interval by the first and second non-contact distance measurement sections 2A, 2B. The measurement control section 42 controls the support moving section 3 and the second lift-rotation section 1B in such a manner that the measurement object WA is supported from the support moving section 3 to the second lift-rotation section 1B. The measurement control section 42 controls the second lift-rotation section 1B in such a manner that the measurement object WA is rotated by the prescribed angle in the circumferential direction. The measurement control section 42 controls the second lift-rotation section 1B and the support moving section 3 in such a manner that the measurement object WA is supported from the second lift-rotation section 1B to the support moving section 3. The measurement control section 42 controls the support moving section 3 and the first and second non-contact distance measurement sections 2A, 2B in such a manner that, in the case where the measurement object WA is moved from the second position P2 to the first position PI by the support moving section 3, the first and second distances are measured at the prescribed sampling interval by the first and second non-contact distance measurement sections 2A, 2B. The measurement control section 42 controls the support moving section 3 and the first lift-rotation section 1A in such a manner that the measurement object WA is supported from the support moving section 3 to the first lift-rotation section 1A.

[0044] The thickness of the measurement object WA can be calculated in the following manner. The distance between the arrangement position of the first non-contact distance measurement section 2A and the arrangement position of the second non-contact distance measurement section 2B is previously obtained, and the thickness of the measurement object WA is obtained from the distance from the first non-contact distance measurement section 2A to the front surface (upper side surface) of the measurement object WA and the distance from the second non-contact distance measurement section 2B to the back surface (lower side surface) of the measurement object WA ((thickness of the measurement object WA) = (distance between the arrangement position of the first non-contact distance measurement section 2A and the arrangement position of the second non-contact distance measurement section 2B) - ((first distance from the first non-contact distance measurement section 2A to the front surface (upper side surface) of the measurement object WA measured by the first non-contact distance measurement section 2A) + (second distance from the second non-contact distance measurement section 2B to the back surface (lower side surface) of the measurement object WA measured by the second non-contact distance measurement section 2B)). The device embodiment in which the thickness of the measurement object WA at each measurement point is obtained by this method is also an embodiment of the surface height distribution measuring device of the present application.

[0045] The control processing section 4, the input section 5, the output section 6, the IF section 7, and the storage section 8 of the surface height distribution measuring apparatus 1000 described above can be configured by using, for example, a computer of a desktop or notebook type.

[0046] Next, the operation of the present embodiment will be described. Figure 3 is a flowchart showing the operation of the surface height distribution measuring apparatus. Figure 4 is a diagram for explaining the operation of the surface height distribution measuring apparatus.

[0047] The surface height distribution measuring apparatus 1000 thus configured performs initialization of each section as required after its power is turned on, and starts its operation. The control processing section 4 functionally has a control section 41 and a measurement control section 42 by executing its control processing program.

[0048] In Figure 3 and Figure 4 , first, the measurement object WA is placed on the first lifting and rotating section 1A with the center of the measurement object WA coinciding with the center of the first lifting and rotating section 1A, for example, by a user or a robot arm or the like omitted from illustration. Next, the surface height distribution measuring apparatus 1000, upon receiving an instruction to start measurement, causes the measurement control section 42 of the control processing section 4 to control the first lifting and rotating section 1A so that the measurement object WA is rotated by a specified angle (θ) in the circumferential direction "S1" in Figure 3 ; "1. Rotating the measurement object WA" in Figure 4 .

[0049] Next, the surface height distribution measuring apparatus 1000 causes the measurement control section 42 to control the first lifting and rotating section 1A and the support moving section 3 so that the measurement object WA is supported from the first lifting and rotating section 1A to the support moving section 3 by lifting "S2" in Figure 3 .

[0050] Next, the surface height distribution measuring apparatus 1000 causes the measurement control section 42 to control the support moving section 3 and the first and second non-contact distance measuring sections 2A and 2B in such a manner that, in the case where the measurement object WA is moved from the first position PI to the second position P2 by the support moving section 3, the first distance from the first non-contact distance measuring section 2A to the one side surface of the measurement object WA is measured by the first non-contact distance measuring section 2A at a pre-set sampling interval and the second distance from the second non-contact distance measuring section 2B to the other side surface of the measurement object WA is measured by the second non-contact distance measuring section 2B at a pre-set sampling interval "S3" in Figure 3 ; "3. Measuring the surface height distribution of the measurement object WA" in Figure 4The measurement results of the 1st non-contact distance measuring section 2A, that is, the surface height distribution of the one side surface of the measurement object WA (1st A surface height distribution (each height of each measurement point at the pre-set sampling interval)) and the measurement results of the 2nd non-contact distance measuring section 2B, that is, the surface height distribution of the other side surface of the measurement object WA (1st B surface height distribution (each height of each measurement point at the pre-set sampling interval)) are stored in the storage section 8 in association with the order n of measurement (or the cumulative rotation angle from the initial position ((1st rotation angle) x (number of measurements n)).

[0051] Next, the surface height distribution measuring device 1000 causes the measurement control section 42 to control the support moving section 3 and the 2nd lift-rotating section IB so that the measurement object WA is supported from the support moving section 3 to the 2nd lift-rotating section IB by lifting (S4). Figure 3 (S4) in FIG. 8; Figure 4 (3. Measurement on the n-th line is completed) in FIG. 8.

[0052] Next, the surface height distribution measuring device 1000 causes the measurement control section 42 to control the 2nd lift-rotating section IB so that the measurement object WA is rotated in the circumferential direction by the specified angle (S5). Figure 3 (S5) in FIG. 8; Figure 4 (4. Rotating the measurement object WA to the next line) in FIG. 8.

[0053] Next, the surface height distribution measuring device 1000 causes the measurement control section 42 to control the 2nd lift-rotating section IB and the support moving section 3 so that the measurement object WA is supported from the 2nd lift-rotating section IB to the support moving section 3 by lifting (S6). Figure 3 (S6) in FIG. 8.

[0054] Next, the surface height distribution measuring device 1000 causes the measurement control section 42 to control the support moving section 3 and the 1st and 2nd non-contact distance measuring sections 2A, 2B in such a manner that, in the case where the measurement object WA is moved from the 2nd position P2 to the 1st position PI by the support moving section 3, the 1st distance from the 1st non-contact distance measuring section 2A to the one side surface of the measurement object WA is measured by the 1st non-contact distance measuring section 2A at the pre-set sampling interval and the 2nd distance from the 2nd non-contact distance measuring section 2B to the other side surface of the measurement object WA is measured by the 2nd non-contact distance measuring section 2B at the pre-set sampling interval (S7). Figure 3 (S7) in FIG. 8. Figure 4The measurement results of the 1st non-contact distance measuring section 2A, i.e., the surface height distribution of one side surface of the measurement object WA (2A surface height distribution) and the measurement results of the 2nd non-contact distance measuring section 2B, i.e., the surface height distribution of the other side surface of the measurement object WA (2B surface height distribution) are stored in the storage section 8 in association with the order n of measurement (or the cumulative rotation angle from the initial position).

[0055] Next, the surface height distribution measuring apparatus 1000 causes the measurement control section 42 to control the support moving section 3 and the 1st lift-rotating section 1A so that the measurement object WA is lifted from the support moving section 3 to the 1st lift-rotating section 1A by the lift (S5). Figure 3 (S8) in FIG. 6; Figure 4 (S6) in FIG. 6.

[0056] Next, the surface height distribution measuring apparatus 1000 causes the measurement control section 42 to determine whether or not the measurement is ended (S9). In the case where the result of the determination is that the measurement is ended ("Yes"), the surface height distribution measuring apparatus 1000 outputs each measurement result to the output section 6 (S10) and ends the present processing. On the other hand, in the case where the result of the determination is that the measurement is not ended ("No"), the surface height distribution measuring apparatus 1000 returns the processing to the processing S1. The determination of the end of the measurement is performed, for example, in accordance with whether or not the measurement of the necessary number of times obtained by dividing 360 [degrees] by the rotation angle of one time has been performed (in the case where the necessary number of times is even, the end of the measurement is determined at the time when the measurement of the necessary number of times has been performed, and in the case where the necessary number of times is odd, the end of the measurement is determined at the time when the measurement of (the necessary number of times + 1) has been performed).

[0057] Further, the measurement control section 42 can output each measurement result to an external device through the IF section 7 as necessary. Further, the processing S1 can be omitted in the 1st measurement after the start of the measurement described above.

[0058] As described above, since the surface height distribution measuring apparatus 1000 in the embodiment is provided with the plate-shaped member 35, vibration can be suppressed based on the air layer between the measurement object WA and the plate-shaped member 35, and thus measurement can be performed more accurately and favorably.

[0059] In the surface height distribution measuring apparatus 1000 described above, a capacitor is formed by the measurement object and the plate-shaped member. In the case where the 1st and 2nd non-contact distance measuring sections 2A, 2B are electrostatic capacitance type displacement gauges, since an alternating electric field is generated in measurement, based on the capacitor, the surface height distribution measuring apparatus 1000 described above can reduce noise in measurement of the electrostatic capacitance type displacement gauge.

[0060] The surface height distribution measuring apparatus 1000 measures each surface height distribution in the outbound direction from the first position P1 to the second position P2 and in the return direction from the second position P2 to the first position P1, respectively. Therefore, compared with a case where measurement is performed in only one of the outbound direction and the return direction, the measurement time can be shortened.

[0061] The surface height distribution measuring apparatus 1000 can simultaneously measure each surface height distribution of one surface and the other surface of the measurement object WA because the first and second non-contact distance measuring sections 2A and 2B face each other via the measurement object WA.

[0062] The present specification discloses various modes of technology as described above, and the main technology thereof is summarized as follows.

[0063] The first technical solution relates to a surface height distribution measuring apparatus for measuring a surface height distribution of a plate-shaped measurement object, and includes: a non-contact distance measuring section that non-contactly measures a distance from the non-contact distance measuring section to a surface of the measurement object; a moving section that relatively moves the measurement object and the non-contact distance measuring section; and a plate-shaped member that is disposed at a position that is non-contact with the measurement object and parallel to the measurement object when measurement is performed by the non-contact distance measuring section, and that covers at least a part of the measurement object when viewed from a direction perpendicular to the surface of the measurement object.

[0064] In this technical solution, "parallel to the measurement object" means not only "the plate-shaped member is in a state of being parallel to the measurement object", but also "the plate-shaped member is in a state of being substantially parallel to the measurement object", and more specifically, means a state of being parallel to the measurement object or a state of being substantially parallel to the measurement object, on the premise that the following technical effect is exerted.

[0065] According to this configuration, because the surface height distribution measuring apparatus of this technical solution has the plate-shaped member, vibration can be suppressed based on an air layer between the measurement object and the plate-shaped member, and thus the technical effect of measuring with good precision can be exerted.

[0066] The surface height distribution measuring apparatus according to the first aspect can be, for example, a surface height distribution measuring apparatus for measuring a surface height distribution of a plate-like measurement object, and includes: first and second non-contact distance measuring sections that non-contactly measure distances from the first and second non-contact distance measuring sections to a surface of the measurement object; a support moving section that relatively moves the measurement object and the first and second non-contact distance measuring sections; and a plate-like member that is disposed at a position non-contacting with and parallel to the measurement object when measurement is performed by the first and second non-contact distance measuring sections, and that covers at least a part of the measurement object when viewed from a direction perpendicular to the surface of the measurement object.

[0067] The surface height distribution measuring apparatus according to the second aspect is a surface height distribution measuring apparatus according to the first aspect in which the measurement object is any one of a conductor and a semiconductor, the non-contact distance measuring section is an electrostatic capacitance type displacement meter, and the plate-like member is any one of a grounded conductor and a grounded semiconductor.

[0068] According to this configuration, a capacitor is formed by the measurement object and the plate-like member. In a case where the non-contact distance measuring section is an electrostatic capacitance type displacement meter, since an alternating electric field is generated in measurement, the surface height distribution measuring apparatus according to this aspect is able to reduce noise in measurement by the electrostatic capacitance type displacement meter, based on the capacitor.

[0069] The surface height distribution measuring apparatus according to the third aspect is a surface height distribution measuring apparatus according to the first or second aspect in which the measurement object is a circular plate, and further includes: a first rotating section configured at a first position and rotating the measurement object by a specified angle in a circumferential direction; and a second rotating section configured at a second position different from the first position and rotating the measurement object by the specified angle in the circumferential direction, the moving section relatively moving the measurement object and the non-contact distance measuring section between the first position and the second position.

[0070] According to this configuration, the surface height distribution measuring apparatus according to this aspect measures each surface height distribution (an upper surface height distribution and a lower surface height distribution) in a forward path from the first position to the second position and in a return path from the second position to the first position, respectively, and thus is able to shorten a measurement time compared to a case where measurement is performed in only one of the forward path and the return path.

[0071] This application is based on Japanese Patent Application No. 2024-113804 filed on July 17, 2024, the content of which is incorporated herein.

[0072] For the purpose of describing the present application, the present application has been explained above with reference to the drawings and by embodiments as appropriate and sufficient, but it should be recognized that the above-described embodiments can be easily changed and / or modified by those skilled in the art. Therefore, the changed or modified embodiments by those skilled in the art, as long as they are within the level that does not depart from the protection scope of the claims of the present application recited in the claims, can be interpreted as being included in the protection scope of the claims.

[0073] Industrial applicability

[0074] According to the present application, it is possible to provide a surface height distribution measuring device for measuring a surface height distribution of a plate-shaped measurement object.

Claims

1. A surface height distribution measuring apparatus for measuring a surface height distribution of a plate-like measurement object, characterized by including: a non-contact distance measuring section that non-contactly measures a distance from the non-contact distance measuring section to a surface of the measurement object; a moving section that relatively moves the measurement object and the non-contact distance measuring section; and a plate-shaped member that is disposed at a position that, when measurement is performed by the non-contact distance measuring section, is non-contact with the measurement object and parallel to the measurement object, and that, when viewed from a direction perpendicular with respect to the surface of the measurement object, covers at least a part of the measurement object.

2. The surface height distribution measuring apparatus according to claim 1, wherein the measurement object is any one of a conductor and a semiconductor, the non-contact distance measuring section is an electrostatic capacitance type displacement meter, the plate-shaped member is any one of a conductor and a semiconductor that is grounded.

3. The surface height distribution measuring apparatus according to claim 1, wherein the measurement object is in a circular plate shape, the surface height distribution measuring apparatus further includes: a first rotating section that is disposed at a first position and rotates the measurement object by a specified angle in a circumferential direction; and a second rotating section that is disposed at a second position different from the first position and rotates the measurement object by the specified angle in the circumferential direction, the moving section relatively moves the measurement object and the non-contact distance measuring section between the first position and the second position.

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