Waste gas treatment device for semiconductor production

Abstract

The invention provides a semiconductor production waste gas treatment device which comprises a box body, the two sides of the box body are fixedly covered with flow guide covers, and the surfaces of the two flow guide covers are connected with a gas inlet connecting shell and a gas outlet connecting shell respectively; a drawing type activated carbon placing assembly is arranged in the box body, and the activated carbon placing assembly is laid on a waste gas flowing path; a flow guide assembly is arranged in the box body on one side of the air inlet connecting shell and an inner cavity of the flow guide cover, the flow guide assembly adjusts the stretching amplitude according to the flowing speed of waste gas, and the higher the flowing speed of the waste gas is, the larger the stretching amplitude of the flow guide assembly is, the slower the flowing speed of the waste gas is, the smaller the stretching amplitude of the flow guide assembly is or the flow guide assembly does not stretch. By introducing the flow guide assembly with the airflow response characteristic, the problems of uncontrollable airflow diffusion, low contact efficiency, insufficient adsorption utilization rate and the like in a traditional waste gas treatment box are solved, energy consumption control and equipment reliability are considered while the treatment effect is guaranteed, and the industrial application value is good.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of semiconductor processing, in particular to a waste gas treatment device for semiconductor production. BACKGROUND

[0002] With the continuous development of semiconductor manufacturing technology, the etching, cleaning, CVD, lithography and other process links involved in its production process will release a large amount of waste gas with corrosive, toxic or greenhouse effect, such as hydrogen fluoride vapor, phosphine, nitrogen trifluoride, isopropyl alcohol (IPA) and the like. If these waste gases are directly discharged without treatment, not only will they cause serious pollution to the environment, but also may pose a threat to the health of operators and the safety of equipment. Therefore, a dedicated waste gas treatment device is usually provided on the semiconductor production line to achieve the adsorption, neutralization or decomposition treatment of volatile organic compounds (VOCs) and inorganic harmful gases. The activated carbon adsorption tower is widely used in the purification process of low-concentration waste gas due to its simple structure, stable operation and wide adaptation to gas types.

[0003] However, the existing activated carbon adsorption device has the following problems: Unreasonable airflow organization: when the waste gas enters the adsorption box, it often forms a main channel along the direction of the inlet gas, and the airflow is not evenly diffused, resulting in too fast gas flow speed in some areas and insufficient adsorption, and slow or almost stagnant gas flow in some areas, forming an adsorption dead angle and affecting the overall utilization efficiency of the adsorption material; Lack of self-adaptive adjustment mechanism: the existing equipment has a fixed structure and cannot automatically adjust the diffusion range or contact area according to the actual flow rate or flow of the waste gas, which is likely to form a "straight-through flow" under high flow rate conditions and excessive diffusion under low flow rate conditions, both of which will reduce the waste gas treatment efficiency; Large fluctuation in adsorption efficiency, limited energy consumption and service life: due to insufficient contact between the airflow and the adsorption layer, the removal rate of pollutants in the waste gas is unstable. In order to ensure the adsorption effect, it is often necessary to increase the air volume or replace the adsorption material more frequently, resulting in high operating energy consumption and high maintenance cost.

[0004] Therefore, a waste gas treatment device for semiconductor production is provided to solve the above problems. SUMMARY

[0005] The present application solves the following problems: Firstly, the airflow organization is unreasonable, and the waste gas often passes through the fixed path quickly after entering the adsorption box, making it difficult to achieve full diffusion and resulting in insufficient utilization of the adsorption material in local areas, forming a "dead zone" or "short circuit flow"; secondly, there is a lack of self-adaptive adjustment mechanism, which cannot dynamically adjust the internal airflow distribution according to the change of the waste gas flow rate, and the adsorption efficiency may decrease under high flow rate or low flow rate conditions, thus providing a waste gas treatment device for semiconductor production.

[0006] The application solves the above technical problems by the following technical scheme: The application provides a waste gas treatment device for semiconductor production, which comprises a box body, flow directors are fixed on both sides of the box body, an air inlet connecting shell and an air outlet connecting shell are connected to the surfaces of the two flow directors respectively, An active carbon placing assembly in the form of a drawer is arranged in the box body, and the active carbon placing assembly is laid on the path of the waste gas flow; A flow guide assembly is arranged in the box body and the inner cavity of the flow director on one side of the air inlet connecting shell, the flow guide assembly adjusts the stretching range according to the flow speed of the waste gas, the faster the waste gas flow speed, the greater the stretching range of the flow guide assembly, and the slower the waste gas flow speed, the smaller the stretching range of the flow guide assembly or the flow guide assembly does not stretch.

[0007] The box body is connected to the waste gas treatment pipeline through the air inlet connecting shell and the air outlet connecting shell, the waste gas enters the box body through the air inlet connecting shell and flows out of the air outlet connecting shell or flows into the next waste gas treatment process generated by semiconductor processing.

[0008] When the waste gas flow enters the box body through the air inlet connecting shell, the airflow with a certain flow speed drives the flow guide assembly to operate.

[0009] When the waste gas flow speed is faster, the stretching range of the flow guide assembly driven is greater, the area of contact between the flow guide assembly and the airflow is increased, the waste gas is guided and diffused into the inner cavity of the box body, so that the waste gas and the active carbon in the inner cavity of the box body are fully contacted, and insufficient contact is avoided.

[0010] When the waste gas flow speed is slower, the stretching range of the flow guide assembly driven is smaller or the flow guide assembly returns to the original state, the area of contact between the flow guide assembly and the airflow is reduced, and the airflow is prevented from being excessively diffused in the inner cavity of the box body, so that the treatment efficiency of the waste gas is affected.

[0011] The flow guide assembly returns to the original state, and the second spring does not deform at this time.

[0012] In the technical scheme, the flow guide assembly comprises a bearing frame sliding in the direction of the waste gas flow, the bearing frame is movably connected to the inner wall of the box body or the inner wall of the corresponding flow director through two symmetrically arranged moving connecting parts; Flow guide parts are arranged on both sides of the bearing frame, the two flow guide parts are symmetrically arranged on both sides of the bearing frame, and a detection assembly is connected to the side of the bearing frame away from the air inlet connecting shell; The detection assembly drives the bearing frame to move in the horizontal direction under the pushing of the waste gas airflow, and the bearing frame in movement drives the two flow guide parts to synchronously stretch.

[0013] The bearing frame is arranged on the connecting line of the air inlet shell and the air outlet shell and coaxially arranged with each other, the airflow pushing detection part moves in the horizontal direction to drive the bearing frame to move, and the bearing frame in movement pushes the two flow guiding parts to expand outward to diffuse the exhaust gas flow entering the box from the air inlet connecting shell.

[0014] In the technical solution, the flow guiding part comprises an inclined flow guiding plate, a plurality of sliding connectors are arranged on one end side wall of the flow guiding plate close to the bearing frame, the flow guiding plate is movably connected to the bearing frame through the sliding connectors, and the flow guiding plate is connected to the inner wall of the box through a rotating connecting part; A plurality of guide arc plates are fixed on the outer walls of the two sides of the flow guiding plate and are distributed at equal intervals, and the guide arc plates are arranged in a curved manner away from the flow guiding plate.

[0015] When the bearing frame moves, the flow guiding plate is pulled to move through the sliding connectors, and the flow guiding plate rotates around the rotating connecting part to expand outward.

[0016] In the technical solution, the sliding connector comprises a guide sliding rail fixed on the outer wall of the flow guiding plate in the horizontal direction, a sliding block is slidably connected in the guide sliding rail, the sliding block is fixedly connected through a connecting rope and a connecting rod, and the connecting rod is fixed on the bearing frame.

[0017] When the bearing frame moves, the sliding block is driven to move on the guide sliding rail through the connecting rope, and since the length of the connecting rope is fixed, the flow guiding plate is driven to rotate around the rotating connecting part.

[0018] In the technical solution, the rotating connecting part is farther away from the air inlet connecting shell than the sliding connector, that is, the sliding connector is arranged between the rotating connecting part and the air inlet connecting shell, and the rotating connecting part is preferably two, and the two rotating connecting parts are connected to the top side wall and the bottom side wall of the inner cavity of the box respectively. The rotating connecting part comprises a support rod arranged in the vertical direction, a rotating sleeve ring is sleeved on the surface of the support rod, and the rotating sleeve ring is fixed on the flow guiding plate through a connecting block. The support rod is fixed on the inner wall of the box through a fixing block, a torsional spring is sleeved on the surface of the support rod, and the two ends of the torsional spring are fixed on the support rod and the rotating sleeve ring respectively.

[0019] In the technical solution, the moving connecting part comprises a fixed rod in the shape of a "Z" letter, one end of the fixed rod is fixed on the top or bottom of the bearing frame, the other end of the fixed rod extends away from the bearing frame, a guide telescopic rod arranged in the horizontal direction is fixed on the end of the fixed rod, the guide telescopic rod is fixed on the inner wall of the box or the inner wall of the corresponding flow cover, and a second spring is sleeved on the surface of the guide telescopic rod. The guide telescopic rod is composed of two rod bodies which are sleeved with each other, and two ends of the second spring are fixed on surfaces of the two rod bodies respectively.

[0020] When the bearing frame moves, the guide telescopic rod which is connected with the bearing frame and arranged in the horizontal direction is correspondingly elongated or shortened, and the second spring is deformed.

[0021] In the technical solution, the detection assembly comprises a synchronous rod arranged in the horizontal direction, the synchronous rod is fixed on a central region of a surface of the bearing frame, a detection cover is fixed on an end of the synchronous rod, and the detection cover is a thin shell structure which is recessed in a direction away from the air inlet connecting shell and has a rectangular or circular shape.

[0022] When the exhaust gas flow enters the box body from the air inlet connecting shell, the detection cover close to the air inlet connecting shell is pushed by the gas flow in a direction away from the air inlet connecting shell, so as to drive the bearing frame to move synchronously.

[0023] In the technical solution, the activated carbon placing assembly comprises a plurality of placing parts, each of the placing parts comprises a placing rack arranged in the box body, an outer wall of the placing rack and an inner wall of the box body are attached to each other, and a plurality of storage units which are pulled in the horizontal direction are arranged on the placing rack. A through slot is formed in a side wall of the box body on one side of the placing rack, a sealing plate covers the through slot, and the sealing plate and the box body are detachably connected.

[0024] When the activated carbon needs to be replaced, the sealing plate is removed, then the storage unit is pulled out, and the activated carbon in the storage unit is replaced.

[0025] In the technical solution, the storage unit comprises a pulling shell, the pulling shell is slidably connected to two guide rails on two sides of the bottom of the pulling shell, and the guide rails are fixed on the inner wall of the placing rack.

[0026] The pulling shell slides on the guide rails.

[0027] In the technical solution, a plurality of separation sliding plates are arranged in the pulling shell, the separation sliding plates are arranged in the vertical direction, the separation sliding plates are slidably connected in the inner cavity of the pulling shell, notches on surfaces of the separation sliding plates and guide strips are slidably connected, the guide strips are fixed in the pulling shell in the vertical direction, and the guide strips are distributed in the length direction of the pulling shell. Preferably, a tensioning unit is arranged between two adjacent separation sliding plates, and the tensioning unit is also arranged between the separation sliding plates on two sides of the end of the pulling shell and the side wall of the pulling shell. The tensioning unit comprises a tensioning telescopic rod, two ends of the tensioning telescopic rod are fixed on corresponding separation sliding plates or the inner wall of the pulling shell, and a first spring is sleeved on a surface of the tensioning telescopic rod. The tensioning telescopic rod includes an outer connecting rod and an inner sliding rod that are slidably sleeved together, and the two ends of the first spring are respectively fixed on the outer connecting rod and the inner sliding rod.

[0028] The partition slide can be used to create cavities of different sizes for placing activated carbon, in order to accommodate activated carbon packings of different shapes.

[0029] Based on common knowledge in the field, the above-mentioned preferred conditions can be combined arbitrarily to obtain various preferred embodiments of the present invention.

[0030] The positive and progressive effects of this invention are as follows: This invention utilizes a flow-guiding component installed inside the chamber that dynamically responds to changes in exhaust gas flow rate. This component automatically adjusts its expansion amplitude according to different exhaust gas flow rates, thereby adaptively regulating the diffusion path of the exhaust gas. When the exhaust gas flow rate is high, the flow-guiding component extends outward under the impact of the airflow, increasing the contact area with the airflow and effectively expanding the diffusion range of the exhaust gas inside the chamber. This promotes uniform distribution and full contact of the exhaust gas within the activated carbon adsorption area, improving the adsorption efficiency and treatment effect of pollutants.

[0031] When the exhaust gas velocity is low, the flow guiding component retracts or returns to its original state, reducing the flow guiding area and preventing excessive diffusion of airflow within the chamber, which could lead to a decrease in treatment efficiency. This further ensures the system's purification capability under low flow conditions. This structure enables active adjustment of the exhaust gas flow behavior under different operating conditions, avoiding the treatment dead zones and efficiency losses caused by uneven airflow distribution or insufficient adsorption contact in traditional structures.

[0032] In summary, by introducing a flow guiding component with airflow response characteristics, this invention solves the problems of uncontrollable airflow diffusion, low contact efficiency, and insufficient adsorption utilization in traditional waste gas treatment boxes. It ensures treatment effect while taking into account energy consumption control and equipment reliability, and has good industrial application value. Attached Figure Description

[0033] Figure 1 This is a schematic diagram of the external structure of the present invention; Figure 2 For the present invention Figure 1 A structural diagram from another perspective; Figure 3 This is a schematic diagram of the overall external structure of the box after the blanking is removed according to the present invention; Figure 4 For the present invention Figure 3 A structural diagram from another perspective; Figure 5 For the present invention Figure 3 A top-view structural diagram; Figure 6 This is a schematic diagram of the structure of the present invention with the pull-out shell in the extended state; Figure 7 Figure 1 is a perspective view of the present application; Figure 6 Figure 2 is a partial enlarged view of I in Figure 1; Figure 8 Figure 3 is a perspective view of the flow guide assembly of the present application; Figure 9 Figure 4 is a partial enlarged view of J in Figure 3; Figure 8 Figure 5 is a top view of the present application; Figure 10 Figure 8 Figure 6 is a perspective view of the section A-A of the present application; Figure 11 Figure 7 is a perspective view of the inside of the pull-out shell of the present application; Figure 10 Figure 8 is a partial enlarged view of K in Figure 7; Figure 12 Figure 9 is a perspective view of the flow guide assembly with a moving connecting part of the present application; Figure 13 Figure 12 Figure 10 is a partial enlarged view of L in Figure 9; Figure 14 Figure 11 is a perspective view of the flow guide assembly with a moving connecting part of the present application; Figure 15 Figure 12 is a partial enlarged view of M in Figure 11; Figure 14 Figure 13 is a perspective view of the flow guide assembly with a moving connecting part of the present application;

[0034] Figure 14 is a partial enlarged view of N in Figure 13; 1, box body; 2, flow guide cover; 21, air inlet connecting shell; 22, air outlet connecting shell; 3, sealing plate; 4, placing rack; 41, pull-out shell; 42, guide rail; 43, separating slide plate; 44, guide strip; 45, outer connecting rod; 46, inner slide rod; 47, first spring; 5, flow guide assembly; 51, bearing frame; 52, flow guide plate; 53, guide slide rail; 54, slide block; 55, connecting rope; 56, connecting rod; 57, guide arc plate; 58, fixing rod; 59, guide telescopic rod; 591, second spring; 6, rotating connecting part; 61, supporting rod; 62, rotating sleeve ring; 63, connecting block; 64, fixing block; 7, detection assembly; 71, synchronous rod; 72, detection cover. DETAILED DESCRIPTION

[0035] The present application will be further described in the following examples, but the present application is not limited in the scope of the examples.

[0036] As Figure 1 and Figure 2 ​​As shown, a waste gas treatment device for semiconductor production includes a housing 1, with guide hoods 2 fixedly covering both sides of the housing 1. An inlet connection shell 21 and an outlet connection shell 22 are respectively connected to the surfaces of the two guide hoods 2. The interior of the housing 1 is equipped with a pull-out activated carbon placement assembly, which is laid along the path of the exhaust gas flow. A flow guiding component 5 is installed inside the housing 1 and the flow guide shroud 2 on one side of the air intake connection shell 21. The flow guiding component 5 adjusts its extension amplitude according to the flow velocity of the exhaust gas. The extension amplitude is the area of ​​the entire flow guiding component 5 projected onto the plane of the flow guide shroud. The faster the exhaust gas flow velocity, the greater the extension amplitude of the flow guiding component 5 and the larger the projected area; the slower the exhaust gas flow velocity, the smaller the extension amplitude of the flow guiding component 5 or it does not extend at all, and the smaller the projected area.

[0037] The housing 1 is connected to the exhaust gas treatment pipeline through the inlet connection shell 21 and the outlet connection shell 22. The exhaust gas enters the housing 1 through the inlet connection shell 21 and flows out or into the exhaust gas treatment process generated by the next semiconductor processing step through the outlet connection shell 22.

[0038] When the exhaust gas flows into the housing 1 through the intake connection shell 21, the airflow with a certain velocity drives the flow guide assembly 5 to operate.

[0039] The faster the exhaust gas flow rate, the greater the extension of the flow guiding component 5, which increases the contact area between the flow guiding component 5 and the airflow, guiding the exhaust gas to diffuse into the inner cavity of the housing 1, so that the exhaust gas and the activated carbon inside the housing 1 can fully contact each other and avoid insufficient contact.

[0040] When the exhaust gas flow rate is slow, the extension of the guide component 5 is smaller or the guide component 5 returns to its original state, which reduces the contact area between the guide component 5 and the airflow, and avoids excessive airflow dispersion inside the housing 1, thus affecting the exhaust gas treatment efficiency.

[0041] The flow guide component 5 returns to its original state, at which point the second spring 591 does not deform.

[0042] like Figure 4 As shown, the flow guiding component 5 includes a support frame 51 that slides along the direction of exhaust gas flow. The support frame 51 is movably connected to the inner wall of the box 1 or the inner wall of the corresponding flow guiding hood 2 through two symmetrically arranged movable connecting parts. Both sides of the support frame 51 are provided with flow guides, and the two flow guides are symmetrically arranged on both sides of the support frame 51. The side of the support frame 51 away from the air inlet connection shell 21 is connected to the detection component 7. The detection component 7 drives the carrier frame 51 to move horizontally under the push of the exhaust gas flow, and the moving carrier frame 51 drives the two guide parts to extend synchronously.

[0043] The support frame 51 is set on the line connecting the air inlet connecting shell and the air outlet connecting shell, and is coaxial with each other. The airflow pushes the detection part to move in the horizontal direction, thereby driving the support frame 51 to move. The moving support frame 51 pushes the two guide parts to expand outward to diffuse the exhaust gas flow that enters the box 1 from the air inlet connecting shell 21.

[0044] like Figures 8-11 As shown, the flow guide includes an inclined flow guide plate 52, a sliding connector, and a guide arc plate 57. Multiple sliding connectors are provided on the side wall of the flow guide plate 52 near the support frame 51. The flow guide plate 52 is movably connected to the support frame 51 through the sliding connectors, and the flow guide plate 52 is connected to the inner wall of the box 1 through the rotating connection part 6. Multiple guide arc plates 57 are fixed on the outer walls of both sides of the guide plate 52, and the guide arc plates 57 are bent toward the side away from the guide plate 52.

[0045] The initial tilt angle of the deflector 52 is less than 15°.

[0046] When the support frame 51 moves, the guide plate 52 is pulled by the sliding connector. The guide plate 52 rotates around the rotating connector 6 as the center, thereby expanding outward.

[0047] The sliding connector includes a guide rail 53 fixed horizontally on the outer wall of the guide plate 52, and a slider 54 is slidably connected inside the guide rail 53. The slider 54 is fixedly connected by a connecting rope 55 and a connecting rod 56, and the connecting rod 56 is fixed on the support frame 51.

[0048] The carrier frame 51 moves, and the slider 54 moves on the guide rail 53 via the connecting rope 55. Since the length of the connecting rope 55 is fixed, it drives the guide plate 52 to rotate around the rotating connecting part 6.

[0049] The rotating connection part 6 is further away from the air intake connection shell 21 than the sliding connection part, that is, the sliding connection part is located between the rotating connection part 6 and the air intake connection shell 21. Preferably, there are two rotating connection parts 6, and the two rotating connection parts 6 are respectively connected to the top side wall and the bottom side wall of the inner cavity of the housing 1. The rotating connection part 6 includes a support rod 61 arranged vertically, and a rotating collar 62 is sleeved on the surface of the support rod 61. The rotating collar 62 is fixed to the guide plate 52 by a connecting block 63. The support rod 61 is fixed to the inner wall of the housing 1 by a fixing block 64. A torsion spring is sleeved on the surface of the support rod 61, and the two ends of the torsion spring are respectively fixed to the support rod 61 and the rotating collar 62.

[0050] When the bearing frame 51 moves, the rotating ring 62 on the deflector 52 rotates on the surface of the support rod 61, so that the deflector 52 rotates and expands, and in the above process, the torsional spring is deformed, and the torsional spring provides elastic force to return the deflector 52 to the original position.

[0051] As shown in Figure 14 and Figure 15 , the moving connection part includes a fixed rod 58 in the shape of a "Z" letter, one end of the fixed rod 58 is fixed to the top or bottom of the bearing frame 51, and the other end of the fixed rod 58 extends away from the bearing frame 51, a guide telescopic rod 59 arranged in the horizontal direction is fixed on the end of the fixed rod 58, the guide telescopic rod 59 is fixed on the inner wall of the box body 1 or the inner wall of the corresponding deflector 2, and the surface of the guide telescopic rod 59 is sleeved with a second spring 591; The guide telescopic rod 59 is composed of two rod bodies that are slidably sleeved with each other, and the two ends of the second spring 591 are fixed on the surfaces of the two rod bodies, respectively.

[0052] When the bearing frame 51 moves, the guide telescopic rod 59 arranged in the horizontal direction and connected with the bearing frame 51 is correspondingly elongated or shortened, and the second spring 591 is deformed.

[0053] The elastic force provided by the second spring 591 enables the bearing frame 51 to have the ability or tendency to return to the original position under the condition that it is not pushed by the airflow or the pushing force of the airflow is small.

[0054] As shown in Figure 11 , the detection assembly 7 includes a synchronous rod 71 arranged in the horizontal direction, the synchronous rod 71 is fixed on the central area of the surface of the bearing frame 51, and a detection cover 72 is fixed on the end of the synchronous rod 71, the detection cover 72 is a thin shell structure in the shape of a rectangle or a circle recessed away from the air inlet connecting shell 21.

[0055] When the exhaust gas flow enters the box body 1 from the air inlet connecting shell 21, the detection cover 72 close to the air inlet connecting shell 21 is pushed by the airflow away from the air inlet connecting shell 21, thereby driving the bearing frame 51 to move synchronously.

[0056] Ventilation holes can be provided on the detection cover 72, which are used to ensure that the exhaust gas directly passes through the detection cover 72 through the ventilation holes in time after the flow rate of the exhaust gas reaches the upper limit that can be borne by the deflector assembly 5 during the detection process, so as to avoid the formation of excessive pushing force at the detection cover 72, which can damage the structure of the deflector assembly 5, and also reduce the interference to the normal flow of the exhaust gas, thereby ensuring that the overall exhaust gas emission process is more stable.

[0057] As shown in Figure 6As shown, the active carbon placing assembly comprises a plurality of placing parts, the placing part comprises a placing rack 4 arranged inside the box body 1, the outer wall of the placing rack 4 and the inner wall of the box body 1 are attached to each other, and a plurality of storage units are arranged on the placing rack 4 and can be pulled out in the horizontal direction. A through slot is arranged on the side wall of the box body 1 on one side of the placing rack 4, and a sealing plate 3 is arranged on the through slot, and the sealing plate 3 and the box body 1 are detachably connected by bolts or buckles in the prior art.

[0058] When the active carbon needs to be replaced, the sealing plate 3 is removed, and then the storage unit is pulled out, and the active carbon inside the storage unit is replaced.

[0059] The storage unit comprises a pulling shell 41, the pulling shell 41 is slidably connected to two guide rails 42 on the bottom of the pulling shell 41, and the guide rails 42 are fixed on the inner wall of the placing rack 4.

[0060] The pulling shell 41 slides on the guide rail 42.

[0061] As shown in Figure 12 and Figure 13 As shown, a plurality of partition sliding plates 43 are arranged inside the pulling shell 41, the partition sliding plates 43 are arranged in the vertical direction, the partition sliding plates 43 are slidably connected in the inner cavity of the pulling shell 41, the notch on the surface of the partition sliding plate 43 and the guide strip plate 44 are slidably connected, the guide strip plate 44 is fixed inside the pulling shell 41 in the vertical direction, and is distributed along the length direction of the pulling shell 41; Preferably, a tensioning unit is arranged between the two adjacent partition sliding plates 43, and a tensioning unit is also arranged between the partition sliding plates 43 on both sides of the end of the pulling shell 41 and the side wall of the pulling shell 41; The tensioning unit comprises a tensioning telescopic rod, both ends of the tensioning telescopic rod are fixed on the corresponding partition sliding plate 43 or the inner wall of the pulling shell 41, and the surface of the tensioning telescopic rod is sleeved with a first spring 47; The tensioning telescopic rod comprises an outer connecting rod 45 and an inner sliding rod 46 which are slidably sleeved with each other, and both ends of the first spring 47 are fixed on the outer connecting rod 45 and the inner sliding rod 46.

[0062] The partition sliding plate 43 can separate different sizes of cavities for placing active carbon, so as to adapt to active carbon fillers of different shapes.

[0063] Specifically, a flexible sealing strip is arranged on the side wall of the partition sliding plate 43, which is tightly attached to the inner wall of the pulling shell 41 to form a sliding sealing connection structure.

[0064] Through the tensioning telescopic rod, the connection between the two adjacent partition sliding plates 43 and the active carbon filler can be made more tightly, so as to avoid leaving a large gap.

[0065] The side wall of the pull-out housing 41 is preferably of a lattice structure.

[0066] The present application is not limited to the above-described embodiments, and any changes in shape or structure are within the scope of the present application. The scope of the present application is defined by the appended claims, and those skilled in the art can make various changes or modifications to the embodiments without departing from the principles and the spirit of the present application, and such changes and modifications are within the scope of the present application.

Claims

1. Semiconductor production exhaust gas treatment device, including box (1), both sides of the box (1) are covered and fixed with fairing (2), the surface of two fairings (2) is connected with air inlet connecting shell (21) and air outlet connecting shell (22) respectively; The inside of the box (1) is provided with a pull-out type activated carbon placing assembly, which is laid on the path of the exhaust gas flow, characterized in that: The box (1) and the inner cavity of the fairing (2) on one side of the air inlet connecting shell (21) are provided with a flow guide assembly (5), which adjusts the expansion range according to the flow velocity of the exhaust gas, the faster the exhaust gas flow rate, the greater the expansion range of the flow guide assembly (5), the slower the exhaust gas flow rate, the smaller the expansion range of the flow guide assembly (5) or no expansion.

2. The semiconductor manufacturing exhaust treatment apparatus according to Claim 1, wherein: The flow guide assembly (5) includes a bearing frame (51) sliding along the direction of exhaust gas flow, which is movably connected with the inner wall of the box (1) or the corresponding inner wall of the fairing (2) through two symmetrically arranged moving connecting parts; Both sides of the bearing frame (51) are provided with flow guide parts, and the two flow guide parts are symmetrically arranged on both sides of the bearing frame (51), and the side of the bearing frame (51) away from the air inlet connecting shell (21) is connected with a detection assembly (7); The detection assembly (7) drives the bearing frame (51) to move in the horizontal direction under the push of the exhaust gas flow, and the bearing frame (51) in movement drives the two flow guide parts to expand synchronously.

3. The semiconductor manufacturing exhaust treatment apparatus according to Claim 2, wherein: The flow guide part includes an inclined flow guide plate (52), a plurality of sliding connectors are arranged on the side wall of the flow guide plate (52) close to the bearing frame (51), the flow guide plate (52) is movably connected with the bearing frame (51) through the sliding connectors, and the flow guide plate (52) is connected with the inner wall of the box (1) through a rotating connecting part (6); A plurality of guide arc plates (57) are fixed on the outer walls of both sides of the flow guide plate (52), and the guide arc plates (57) are curvedly arranged away from the flow guide plate (52).

4. The semiconductor manufacturing exhaust treatment apparatus according to Claim 3, wherein: The sliding connector includes a guide rail (53) fixed on the outer wall of the flow guide plate (52) in the horizontal direction, a sliding block (54) is slidably connected in the guide rail (53), the sliding block (54) is fixedly connected through a connecting rope (55) and a connecting rod (56), and the connecting rod (56) is fixed on the bearing frame (51).

5. The semiconductor manufacturing exhaust treatment apparatus according to Claim 3, wherein: The rotating connecting part (6) is farther away from the air inlet connecting shell (21) than the sliding connector, the rotating connecting part (6) is two, and the two rotating connecting parts (6) are connected with the top side wall and the bottom side wall of the inner cavity of the box (1) respectively; The rotating connecting part (6) includes a support rod (61) arranged in the vertical direction, a rotating sleeve ring (62) is sleeved on the surface of the support rod (61), and the rotating sleeve ring (62) is fixed on the flow guide plate (52) through a connecting block (63). The support rod (61) is fixed on the inner wall of the box (1) through a fixing block (64), a torsional spring is sleeved on the surface of the support rod (61), and two ends of the torsional spring are fixed on the support rod (61) and the rotating sleeve ring (62) respectively.

6. The semiconductor manufacturing exhaust treatment apparatus according to Claim 2, wherein: The moving connecting part comprises a fixed rod (58) in the shape of "Z", one end of the fixed rod (58) is fixed on the top or bottom of the bearing frame (51), the other end of the fixed rod (58) extends to the side away from the bearing frame (51), a guide telescopic rod (59) arranged in the horizontal direction is fixed on the end of the fixed rod (58), the guide telescopic rod (59) is fixed on the inner wall of the box (1) or the inner wall of the corresponding flow guide cover (2), and a second spring (591) is sleeved on the surface of the guide telescopic rod (59). The guide telescopic rod (59) is composed of two rod bodies which are sleeved on each other, and two ends of the second spring (591) are fixed on the surfaces of the two rod bodies respectively.

7. The semiconductor manufacturing exhaust treatment apparatus according to Claim 2, wherein: The detection assembly (7) comprises a synchronous rod (71) arranged in the horizontal direction, the synchronous rod (71) is fixed on the central area of the surface of the bearing frame (51), a detection cover (72) is fixed on the end of the synchronous rod (71), and the detection cover (72) is a thin shell structure in the shape of a rectangle or a circle which is recessed to the side away from the air inlet connecting shell (21).

8. The semiconductor manufacturing exhaust treatment apparatus according to Claim 1, wherein: The active carbon placing assembly comprises a plurality of placing parts, the placing part comprises a placing rack (4) arranged in the box (1), the outer wall of the placing rack (4) and the inner wall of the box (1) are attached to each other, and a plurality of storage units arranged in the horizontal direction are arranged on the placing rack (4). A through groove is formed in the side wall of the box (1) on one side of the placing rack (4), and a sealing plate (3) covers the through groove.

9. The semiconductor manufacturing exhaust treatment apparatus according to Claim 8, wherein: The storage unit comprises a pulling shell (41), the pulling shell (41) is slidingly connected to two guide rails (42) on the two sides of the bottom of the pulling shell (41), and the guide rails (42) are fixed on the inner wall of the placing rack (4).

10. The semiconductor manufacturing exhaust treatment apparatus according to Claim 9, wherein: A plurality of partition sliding plates (43) are arranged in the pulling shell (41), the partition sliding plates (43) are arranged in the vertical direction, the partition sliding plates (43) are slidingly connected in the inner cavity of the pulling shell (41), the notch on the surface of the partition sliding plate (43) is slidingly connected with a guide strip plate (44), the guide strip plate (44) is fixed in the vertical direction in the inner part of the pulling shell (41) and is distributed in the length direction of the pulling shell (41). Tensioning units are arranged between adjacent two partition sliding plates (43), and tensioning units are also arranged between the partition sliding plates (43) on the two sides of the end of the pulling shell (41) and the side wall of the pulling shell (41). The tensioning unit comprises a tensioning telescopic rod, two ends of the tensioning telescopic rod are fixed on the inner wall of the corresponding partition sliding plate (43) or the pulling shell (41) respectively, and a first spring (47) is sleeved on the surface of the tensioning telescopic rod.

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