A water guided laser machining method and system

Abstract

The application discloses a water guide laser processing method and system. The method is used for water guide laser processing of a metal sample to be processed by using a laser processing device. The method comprises the following steps: arranging a separable protective metal layer on the metal sample to be processed, wherein the protective metal layer is made of a material with stronger reducibility than the metal sample to be processed; connecting the metal sample to be processed and the protective metal layer through an electric connection device; and outputting a water column and a laser beam coupled with the water column by the laser processing device, so that the laser beam sequentially passes through the protective metal layer and the metal sample to be processed under the guidance of the water column, and the metal sample to be processed and the protective metal layer form a primary cell structure under the action of the water column; wherein the metal sample to be processed constitutes a cathode of the primary cell structure, and the protective metal layer constitutes an anode of the primary cell structure. Through the primary cell reaction, the protective metal layer is preferentially oxidized, the metal sample to be processed is protected, the corrosion rate is reduced, and the processing quality is ensured.

Description

Technical Field

[0001] This invention relates to the field of laser processing technology, and in particular to a water-guided laser processing method and system. Background Technology

[0002] Water-guided laser processing uses a stable water jet as the laser transmission medium and air as a low-refractive-index cladding. The laser undergoes total internal reflection at the water surface, allowing it to be transmitted through the water jet to the workpiece surface for laser processing. The coupling technology between water and laser is the key technology of this processing method. The laser beam is expanded and focused before entering the nozzle orifice. When the laser incident angle is greater than the critical angle for total internal reflection, total internal reflection occurs at the water-air interface. Guided by the water, the laser maintains a constant energy density and reaches the surface of the material being processed. By combining the advantages of water jets and laser beams, water-guided laser processing effectively reduces the heat-affected zone and avoids thermal cracking. Furthermore, the cooling effect of the water jet eliminates metal spatter and molten material deposition, further improving the cleanliness and controllability of the processing environment. This overcomes the limitations of traditional laser processing and provides new possibilities for the efficient and precise processing of metal materials.

[0003] However, in related technologies, during water-guided laser processing, the high temperature generated when the laser acts on the metal surface causes the surrounding water molecules to thermally decompose into hydrogen and oxygen atoms. The active oxygen atoms rapidly react with the molten metal surface to form metal oxides (such as Fe2O3 and Cr2O3). These oxides accumulate at the interface, not only reducing the material's corrosion resistance but also causing microcracks due to volume changes during solidification. Simultaneously, the laser energy ionizes metal vapor and water vapor to form plasma. The expansion of this plasma is restricted by the water jet, generating high-pressure bubbles. These bubbles merge in the molten pool; if their rising velocity is lower than the solidification velocity of the molten pool, they are captured, forming pores. Furthermore, the impact of the water jet causes the bubbles to burst, resulting in localized pressure fluctuations and further promoting pore retention.

[0004] Therefore, how to design a water-guided laser processing method and system that is not prone to corrosion and porosity of metal materials during processing is a technical problem to be solved. Summary of the Invention

[0005] The purpose of this invention is to solve the problems of easy corrosion and porosity of metal materials in existing water-guided laser processing, and to provide a water-guided laser processing method and system.

[0006] In a first aspect, embodiments of this application provide a water-guided laser processing method for performing water-guided laser processing on a metal sample to be processed using a laser processing device. The water-guided laser processing method includes the following steps:

[0007] S1: A separable protective metal layer is provided on the metal sample to be processed, and the protective metal layer is made of a material with stronger reducing properties than the metal sample to be processed;

[0008] S2: Connect the metal sample to be processed and the protective metal layer via an electrical connection device;

[0009] S3: The laser processing device outputs a water column and a laser beam coupled to the water column, so that the laser beam passes through the protective metal layer and the metal sample to be processed in sequence under the guidance of the water column, so that the metal sample to be processed and the protective metal layer form a galvanic cell structure under the action of the water column; wherein, the metal sample to be processed constitutes the cathode of the galvanic cell structure, and the protective metal layer constitutes the anode of the galvanic cell structure.

[0010] Preferably, the laser processing device is a green laser, and the wavelength range of the green laser is 500nm-550nm.

[0011] Preferably, when the metal sample to be processed is gold, silver or copper, the protective metal layer is nickel, nickel alloy, magnesium, magnesium alloy, zinc, zinc alloy, aluminum or aluminum alloy.

[0012] When the metal sample to be processed is aluminum or an aluminum alloy, the protective metal layer is magnesium or a magnesium alloy;

[0013] When the metal sample to be processed is steel, the protective metal layer is magnesium, magnesium alloy, zinc, zinc alloy, aluminum, or aluminum alloy.

[0014] Preferably, the thickness of the protective metal layer is 0.1 mm to 0.5 mm. Preferably, an isolation layer is provided between the protective metal layer and the metal sample to be processed, the isolation layer being used to isolate the metal sample to be processed from the protective metal layer.

[0015] Secondly, embodiments of this application provide another water-guided laser processing method for performing water-guided laser processing on a metal sample to be processed using a laser processing device. The water-guided laser processing method includes the following steps:

[0016] S4: A separable protective metal layer is provided on the metal sample to be processed, wherein the protective metal layer is made of a material with stronger reducing properties than the metal sample to be processed;

[0017] S5: Connect the metal sample to be processed and the protective metal layer through an electrical connection device to form a galvanic cell structure; wherein, the metal sample to be processed constitutes the cathode of the galvanic cell structure, and the protective metal layer constitutes the anode of the galvanic cell structure.

[0018] S6: The laser processing device outputs a water column and a laser beam coupled to the water column, so that the laser beam passes through the protective metal layer and the metal sample to be processed in sequence under the guidance of the water column.

[0019] Preferably, the electrical connection device includes a positive power supply terminal and a negative power supply terminal, and step S5 includes:

[0020] Provide electrolyte solution;

[0021] The metal sample to be processed and the protective metal layer are both placed in the electrolyte solution;

[0022] The upper surface of the protective metal layer is made substantially flush with the surface of the electrolyte solution;

[0023] The metal sample to be processed is connected to the positive terminal of the power supply, and the protective metal layer is connected to the negative terminal of the power supply.

[0024] Thirdly, embodiments of this application provide a water-guided laser processing system designed based on the water-guided laser processing method described in the first or second aspect, comprising:

[0025] A processing platform is used to support the metal sample to be processed, and a protective metal layer is detachably disposed on the metal sample to be processed;

[0026] A laser processing apparatus includes a laser component, an optical path component, and a water guide component. The laser component outputs a laser beam, the optical path component guides the laser beam to the water guide component, the water guide component generates a water column, the water column is coupled to the laser beam, the water column guides the laser beam to the surface of a protective metal layer, and the laser beam passes through the protective metal layer and irradiates the surface of the metal sample to be processed.

[0027] An electrical connection device connects the metal sample to be processed and the protective metal layer, such that the metal sample to be processed and the protective metal layer form a galvanic cell structure, wherein the metal sample to be processed constitutes the cathode of the galvanic cell structure and the protective metal layer constitutes the anode of the galvanic cell structure.

[0028] Preferably, the laser output power of the laser component is 50W-200W, the scanning speed of the laser component is 100mm / s-500mm / s, and the output water pressure of the water guide component is 2MPa-50MPa.

[0029] Compared with the prior art, the present invention has the following beneficial effects:

[0030] (1) Significant anti-corrosion effect: Through the galvanic cell reaction, the protective metal layer (anode) is preferentially oxidized, and the metal sample to be processed (cathode) is effectively protected, thereby greatly reducing the corrosion rate;

[0031] (2) Improved processing quality: The reduction of oxide layer and porosity defects during processing greatly reduces the surface roughness Ra value of the metal material to be processed, thus ensuring processing quality;

[0032] (3) Low cost: The processing only requires the setting of a protective metal layer, and the material cost of the protective metal layer is only 1 / 5 of that of the inert gas protection method used in general processing, thus greatly saving processing costs;

[0033] (4) High adaptability: The processing method can select matching protective materials according to different metals to be processed, and has a wide range of applications;

[0034] (5) Simple operation: The method does not require complex equipment modification. It can be achieved simply by adding a protective metal layer and connecting circuit to form a galvanic cell protection structure. Attached Figure Description

[0035] Exemplary embodiments of the present invention can be more fully understood by referring to the accompanying drawings. The drawings are provided to further illustrate the embodiments of this application and form part of the specification. They are used together with the embodiments of this application to explain the present invention and do not constitute a limitation thereof. In the drawings, the same reference numerals generally represent the same components or steps.

[0036] Figure 1 A flowchart of a water-guided laser processing method provided as an exemplary embodiment of this application;

[0037] Figure 2 A flowchart of a water-guided laser processing method provided as another exemplary embodiment of this application;

[0038] Figure 3 A schematic diagram of a water-guided laser processing system provided as an exemplary embodiment of this application;

[0039] Figure 4 A top view of a processing platform of a water-guided laser processing system provided for an exemplary embodiment of this application.

[0040] Figure Labels

[0041] 1-Laser processing device, 2-Processing platform, 3-Electrical connection device, 11-Laser component, 12-Metal sample to be processed, 13-Preset processing path, 14-Protective metal layer, 111-Water guide component, 112-Optical path component. Detailed Implementation

[0042] Exemplary embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0043] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0044] Furthermore, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0045] Example 1

[0046] Reference Figure 1 This embodiment discloses a water-guided laser processing method, including the following steps:

[0047] S1: A separable protective metal layer is set on the metal sample to be processed. The protective metal layer is made of a material with stronger reducing properties than the metal sample to be processed.

[0048] In this embodiment, after the laser beam passes through the protective metal layer, the water column also passes through the protective metal layer, thereby forming a water film between the metal sample to be processed and the protective metal layer. This water film can serve as an electrolyte between the metal sample to be processed and the protective metal layer. Therefore, the metal sample to be processed and the protective metal layer can form a galvanic cell structure under the action of the water column.

[0049] In this embodiment, since the protective metal layer is a consumable material, for the sake of processing cost and efficiency, the protective metal layer does not cover the entire surface of the metal sample to be processed. Instead, it is set on the preset processing path of the metal sample (a preset laser processing working path, such as laser cutting along a preset processing line. It can also be understood as a positioning line, such as the hole area, the cutting line area, or the engraved pattern area). This reduces the amount of protective metal used, thereby reducing costs. At the same time, setting the protective metal layer on the preset processing path of the metal sample not only avoids unnecessary electrochemical reactions between the protective metal layer and the metal sample to be processed in non-processing areas, but also reduces the contact area between the protective metal layer and the metal sample to be processed, thus facilitating subsequent separation operations.

[0050] In this embodiment, the selection of the protective metal layer directly determines the effectiveness and protective effect of the galvanic cell reaction. Therefore, the material selection must ensure that the reducing power of the protective metal layer is stronger than that of the metal sample to be processed, so as to ensure that it preferentially acts as the anode in the galvanic cell for oxidation. According to the metal activity series (K, Ca, Na, Mg, Al, Zn, Fe, Sn, Pb, (H), Cu, Hg, Ag, Pt, Au), a metal material located before the material of the metal sample to be processed is selected to manufacture the protective metal layer. During laser processing, in order to avoid problems such as refractory melting and spattering of the protective metal layer, which would affect the processing accuracy, the melting point and hardness of the protective metal layer must be lower than (or close to) that of the metal sample to be processed. At the same time, the oxidation products of the protective metal layer must be water-soluble or loose substances so that they can be carried away in time by the high-speed water jet, without forming secondary pollution or adhering to the processed surface.

[0051] In this embodiment, based on the selection criteria of the above-mentioned protective metal layer, the materials of the metal sample to be processed and the protective metal layer may include the following selections: (1) When the metal sample to be processed is gold, silver or copper, the material of the protective metal layer is selected as nickel, nickel alloy, magnesium, magnesium alloy, zinc, zinc alloy, aluminum or aluminum alloy; (2) When the metal sample to be processed is aluminum or aluminum alloy, the material of the protective metal layer is selected as magnesium or magnesium alloy; (3) When the metal sample to be processed is steel, the material of the protective metal layer is selected as magnesium, magnesium alloy, zinc, zinc alloy, aluminum or aluminum alloy.

[0052] In this embodiment, due to the high-pressure water flow, laser thermal effect, and diverse shapes of the metal samples to be processed during the water-guided laser processing, the thickness range of the protective metal layer is set to 0.1mm-0.5mm, which can simultaneously adapt to the effectiveness of galvanic cell protection and the compatibility of water-guided laser processing. The thickness of the protective metal layer is selected according to the water-guided laser processing environment and the workpiece being processed; for example, when using a low-pressure water-guided laser to process small metal parts, the protective metal layer is selected to be 0.1mm-0.2mm; when using a medium-pressure water-guided laser to process medium-sized metal parts, the thickness of the protective metal layer is selected to be 0.2mm-0.3mm; and when using a high-pressure water-guided laser to process high-strength metal parts, the thickness of the protective metal layer is selected to be 0.4mm-0.5mm.

[0053] In this embodiment, the separability is designed to prevent the protective metal layer and the metal sample to be processed from fusing together, which would affect the quality of the finished laser-processed product. In other words, it ensures that the protective metal layer and the metal sample to be processed can be separated after processing.

[0054] In this embodiment, the core logic of the water-guided laser is that the laser is guided by the water column and simultaneously cooled and cleaned. Therefore, the laser needs to meet the requirements of low loss window matching water-guided transmission, high absorption rate of metal processing, and reaction stability adapted to galvanic cell protection. Green light can perfectly meet these requirements and its performance is far superior to other types of lasers. Therefore, a green laser with a wavelength range of 500nm-550nm is used in this application.

[0055] S2: Connect the metal sample to be processed and the protective metal layer via an electrical connection device;

[0056] Specifically, step S2 is a crucial step in constructing the galvanic cell protection structure. Its purpose is to establish a stable, low-loss electron transport channel between the metal sample to be processed and the protective metal layer, ensuring the continuous and efficient execution of the galvanic cell reaction during subsequent processing. The electrical connection device can include a positive power supply and a negative power supply. The positive power supply can be connected to the metal sample to be processed. The negative power supply can be connected to the protective metal layer. Depending on the processing scenario, the electrical connection device in this embodiment can have various different implementations; that is, the electrical connection device can be selected specifically according to the specific processing scenario (planar / curved surface, presence or absence of electrolyte solution, power level), for example:

[0057] In low-power protection scenarios, the electrical connection device can be a solution consisting of a zinc alloy connector, carbon steel screws, and conductive paste. In this scenario, the zinc alloy acts as a sacrificial anode, forming a micro-battery circuit through direct contact, which meets the low-power protection requirements. The carbon steel screws are galvanized to prevent self-corrosion, and the conductive paste forms washers that provide continuous preload, preventing poor contact due to vibration. In this scenario, the metal sample to be processed is the positive electrode, the zinc alloy connector and the protective metal layer are the negative electrode, and the carbon steel screws and conductive paste constitute the conductive components. One surface of the zinc alloy connector is completely adhered to the surface of the protective metal layer, with a thin layer of conductive paste applied at the contact point. The conductive paste fills the microscopic gaps between the surfaces, ensuring efficient electron transfer from the zinc alloy connector to the protective metal layer. Simultaneously, the zinc alloy connector has pre-drilled mounting holes, and the corresponding threaded holes (matching the carbon steel screws) are pre-drilled in the metal sample. The carbon steel screw passes through the mounting holes of the zinc alloy connector and is screwed into the threaded holes of the metal sample, forming a mechanical fixation and electrical connection between the zinc alloy connector, the carbon steel screw, and the metal sample. More specifically, the zinc plating of the carbon steel screw contacts the zinc alloy connector, preventing the formation of micro-batteries between the screw and the zinc alloy. Simultaneously, the screw's metallic material ensures that electrons are transferred from the zinc alloy connector through the screw to the metal sample being processed, forming a parallel conductive path. Finally, in addition to filling the gaps between the zinc alloy connector and the protective metal layer, the conductive paste is also applied between the head of the carbon steel screw and the mounting hole of the zinc alloy connector, and between the screw threads and the threaded hole of the metal sample being processed. This reduces the contact resistance between the screw and the zinc alloy, and between the screw and the metal sample being processed. Furthermore, the elastic deformation of the paste compensates for the minute displacements caused by vibrations during water-guided laser processing, preventing the contact gap from widening and interrupting electron transmission.

[0058] In high-power protection scenarios, the electrical connection device can employ a scheme consisting of a zinc-aluminum alloy composite electrode, high-strength alloy bolts, and metal washers. In such scenarios, the zinc-aluminum alloy composite electrode balances sacrificial activity and high conductivity, the alloy steel bolts possess high mechanical strength to withstand industrial equipment vibration, and the metal washers prevent loosening. In this scenario, the metal sample to be processed serves as the positive electrode, the zinc-aluminum alloy composite electrode as the negative electrode, and the protective metal layer as the negative electrode. The high-strength alloy bolts and metal washers act as conductive fixing components and conductive auxiliary components, respectively. The metal washers are placed below the mounting holes of the zinc-aluminum alloy composite electrode. Both are made of the same material and form an electrical connection through direct physical contact. The function of the metal washers is to evenly transfer the pressure from the composite electrode to the protective metal layer, while simultaneously increasing the contact area between the composite electrode and the protective metal layer to meet the high-current transmission requirements of high-power protection. The surface of the protective metal layer is adhered to the underside of the metal washers, and a high-conductivity conductive paste is applied to the contact area to fill any microscopic pores on the surface of the protective metal layer that may have been created during the spraying process, reducing contact resistance drop and ensuring efficient electron transfer from the zinc-aluminum alloy composite electrode to the protective metal layer. Alloy steel bolts pass through the mounting holes of the composite electrode and metal gasket, and are screwed into the pre-drilled threaded hole of the metal sample to be processed. The mechanical strength of the bolts can withstand the vibration of high-power water-guided laser processing, ensuring that the composite electrode and the protective metal layer remain firmly in contact. At the same time, the metal material of the bolts enables auxiliary conductivity between the composite electrode and the metal sample to be processed, forming a dual conductive path: composite electrode → metal gasket → protective metal layer → metal sample to be processed and composite electrode → alloy steel bolt → metal sample to be processed, thereby improving the stability of the circuit.

[0059] S3: A water column and a laser beam coupled to the water column are output through a laser processing device, so that the laser beam passes through the protective metal layer and the metal sample to be processed in sequence under the guidance of the water column, so that the metal sample to be processed and the protective metal layer form a galvanic cell structure under the action of the water column; wherein, the metal sample to be processed constitutes the cathode of the galvanic cell structure, and the protective metal layer constitutes the anode of the galvanic cell structure.

[0060] Specifically, a galvanic cell consists of two electrodes and a conductive electrolyte (such as water). One electrode, called the negative electrode / anode, is made of a negative electrode metal (such as zinc), and the other electrode, called the positive electrode / cathode, is made of a positive electrode metal (such as copper). An electrolyte (such as water) is injected between the two electrodes to transfer electrons and ions. Its working principle is as follows: when a negative electrode metal (such as zinc) and a positive electrode metal (such as copper) are connected by an electrolyte, a battery consisting of a negative electrode, an electrolyte, and a positive electrode is formed. In this battery, zinc atoms in the negative electrode lose two electrons, which are converted into ions and dissolve in the electrolyte. Simultaneously, water in the electrolyte decomposes through a chemical reaction, combining with zinc ions to form zinc oxide or other zinc-containing compounds. Electrons are released during this process and flow from the negative electrode metal (such as zinc) into the circuit, eventually reaching the positive electrode metal (such as copper). When the cathode metal (such as copper) receives electrons, its ions dissolve in the electrolyte and combine with hydrated hydrogen ions to form hydrogen, protecting the copper from oxidation and reduction. The negative electrode metal (such as zinc) is corroded by redox reactions, forming zinc oxide or other zinc-containing compounds. This protects the metal to be processed (such as copper) from redox corrosion, ensuring the quality of the processed metal product.

[0061] Zinc oxide or other zinc-containing compounds will adhere to the negative electrode metal (such as zinc) or be carried away by water. That is, step S3 is the core execution link of the integrated processing and protection of the present invention. It achieves precise coupling of laser beam and water column through laser processing device. While the laser completes the material removal processing, the physical guidance and chemical medium of water column drive the protective metal layer and the metal sample to be processed to form a galvanic cell structure, and finally achieve the dual goals of efficient processing and simultaneous protection: (1) Processing goal: After being guided by water column, the laser beam accurately penetrates the protective metal layer and acts on the metal sample to be processed to achieve melting and vaporization removal, forming a preset processing shape (such as hole, cut, engraved pattern, etc.); (2) Protection goal: Construct a stable galvanic cell structure in the processing area, so that the protective metal layer (anode) is preferentially oxidized and consumed, and the metal sample to be processed (cathode) is prevented from oxidation and corrosion. At the same time, the water column is used to complete the synchronous cleaning of slag and reaction products.

[0062] Example 2

[0063] Reference Figure 2 This embodiment discloses another water-guided laser processing method, including the following steps:

[0064] S4: A separable protective metal layer is set on the metal sample to be processed. The protective metal layer is made of a material with stronger reducing properties than the metal sample to be processed.

[0065] In this embodiment, since the protective metal layer is a consumable material, for the sake of processing cost and efficiency, the protective metal layer does not cover the entire surface of the metal sample to be processed, but is set on the preset processing path of the metal sample (such as the hole area, the line area, and the pattern area). This can reduce the amount of protective metal used, thereby reducing costs. At the same time, setting the protective metal layer on the preset processing path of the metal sample can not only avoid unnecessary electrochemical reactions between the protective metal layer and the metal sample to be processed in non-processing areas, but also reduce the contact area between the protective metal layer and the metal sample to be processed to facilitate subsequent separation operations.

[0066] In this embodiment, the selection of the protective metal layer directly determines the effectiveness and protective effect of the galvanic cell reaction. Therefore, in terms of material selection, it is necessary to ensure that the reducing power of the protective metal layer is stronger than that of the metal sample to be processed, so as to ensure that it preferentially acts as the anode in the galvanic cell to undergo oxidation reaction.

[0067] The separable design in this embodiment prevents the protective metal layer and the metal sample to be processed from fusing together, which would affect the quality of the finished laser-processed product. In other words, it ensures that the protective metal layer and the metal sample to be processed can be separated after processing.

[0068] S5: Connect the metal sample to be processed and the protective metal layer through an electrical connection device to form a galvanic cell structure; wherein, the metal sample to be processed constitutes the cathode of the galvanic cell structure, and the protective metal layer constitutes the anode of the galvanic cell structure.

[0069] Specifically, a stable electron transport channel is established through an electrical connection device, and an ion transport channel is provided by an electrolyte, so that the protective metal layer (anode) and the metal sample to be processed (cathode) form a closed loop, realizing the pre-construction of the galvanic cell and ensuring that protection is activated before processing. At the same time, during electrical connection, the contact resistance is required to be ≤0.1Ω, and the connection parts must be resistant to high temperature (≥500℃) and electrolyte corrosion to avoid loosening or failure of the connection during processing.

[0070] In this embodiment, a stable galvanic cell protective structure is first pre-constructed through steps S4 (setting a protective metal layer) and S5 (electrical connection), and then material removal is achieved through step S6 (laser-water column coupling processing). This achieves the dual goals of pre-processing protection and worry-free processing, and is especially suitable for metal samples that are sensitive to oxidation in the initial processing stage (such as gold, silver, and high-purity copper). In this way, a complete galvanic cell structure can be formed before processing, and the metal sample to be processed (cathode) is in a reduced protective state from beginning to end, which can completely avoid the oxidation risk in the early stage of processing (when the laser has not completely penetrated the protective metal layer). At the same time, the laser beam is precisely guided by the water column to efficiently penetrate the protective metal layer and the metal sample to be processed, and simultaneously complete the material removal and reaction product cleaning, ensuring processing accuracy and surface quality.

[0071] Step S5 may specifically include: providing an electrolyte solution; placing both the metal sample to be processed and the protective metal layer into the electrolyte solution; ensuring the upper surface of the protective metal layer is substantially flush with the surface of the electrolyte solution; connecting the metal sample to be processed to the positive terminal of the power supply, and connecting the protective metal layer to the negative terminal of the power supply. It should be noted that the steps in step S5 are not sequentially related and can be rearranged arbitrarily. By ensuring the upper surface of the protective metal layer is substantially flush with the surface of the electrolyte solution, the laser and water jet can easily penetrate the protective metal layer, reducing transmission losses in the electrolyte solution and thus ensuring the effectiveness of water-guided laser processing.

[0072] S6: A water column and a laser beam coupled to the water column are output through the laser processing device, so that the laser beam passes through the protective metal layer and the metal sample to be processed in sequence under the guidance of the water column.

[0073] In this embodiment, the laser beam is precisely guided by a water column to simultaneously penetrate the protective metal layer and remove the metal sample material to be processed; the water column also washes away the slag and galvanic cell reaction products, and replenishes the electrolyte in the processing area, thereby maintaining the stability of the galvanic cell reaction.

[0074] Compared with the prior art, the present invention has the following beneficial effects:

[0075] (1) Significant anti-corrosion effect: Through the galvanic cell reaction, the protective metal layer (anode) is preferentially oxidized, and the metal sample to be processed (cathode) is effectively protected, thereby greatly reducing the corrosion rate;

[0076] (2) Improved processing quality: The reduction of oxide layer and porosity defects during processing greatly reduces the surface roughness Ra value of the metal material to be processed, thus ensuring processing quality;

[0077] (3) Low cost: The processing only requires the setting of a protective metal layer, and the material cost of the protective metal layer is only 1 / 5 of that of the inert gas protection method used in general processing, thus greatly saving processing costs;

[0078] (4) High adaptability: The processing method can select matching protective materials according to different metals to be processed, and has a wide range of applications;

[0079] (5) Simple operation: The method does not require complex equipment modification. It can be achieved simply by adding a protective metal layer and connecting circuit to form a galvanic cell protection structure.

[0080] Example 3

[0081] Based on the same inventive concept, this application also provides a water-guided laser processing system for implementing the water-guided laser processing method described above. The solution provided by this system is similar to the solution described in the above method; therefore, the specific limitations of the water-guided laser processing system embodiment provided below can be found in the limitations of the water-guided laser processing method described above, and will not be repeated here.

[0082] Reference Figure 3-4 This embodiment discloses a water-guided laser processing system, including: a laser processing device 1, a processing platform 2, and an electrical connection device 3.

[0083] Specifically, the laser processing apparatus 1 includes a laser component 11, a water guide component 111, and an optical path component 112. The laser component 11 outputs a laser beam, the optical path component 112 guides the laser beam to the water guide component 111, the water guide component 111 generates a water column, the generated water column couples with the laser beam, and then the water column guides the laser beam to the surface of the protective metal layer 14. Finally, the laser beam passes through the protective metal layer 14 and irradiates the surface of the metal sample 12 to be processed.

[0084] Similar to the above embodiments, the protective metal layer 14 does not cover the entire surface of the metal sample 12 to be processed, but is set on the preset processing path of the metal sample (the preset laser processing working path, such as laser cutting operation along a preset processing line. It can also be understood as a positioning line, such as the hole area for drilling, the line area for cutting, or the pattern area for engraving).

[0085] Specifically, the processing platform 2 is set horizontally, the laser processing device 1 is located above the processing platform 2, and the nozzle of its water guide component 111 is vertically aligned with the workpiece bearing area of ​​the processing platform 2; the electrode of the electrical connection device 3 is electrically connected to the metal sample 12 to be processed and the protective metal layer 14 on the processing platform 2; for the scheme in embodiment 2, the electrolyte solution tank needs to be built into or connected to the processing platform to ensure that the workpiece can be completely immersed.

[0086] Specifically, the electrical connection device 3 enables an electrical connection between the metal sample to be processed and the protective metal layer, so that the metal sample to be processed 12 and the protective metal layer 14 form a galvanic cell structure, wherein the metal sample to be processed 12 constitutes the cathode of the galvanic cell structure and the protective metal layer 14 constitutes the anode of the galvanic cell structure.

[0087] In this embodiment, the processing platform 2 achieves precise positioning and fixation of the metal sample 12 to be processed and the protective metal layer 14; the laser processing device 1 outputs a coupled laser beam and water column, which act on the metal sample 12 to be processed; the electrical connection device 3 constructs a stable galvanic cell circuit, and the three work synchronously to ensure that processing and protection are carried out in tandem.

[0088] In this embodiment, to ensure processing efficiency while balancing the protective effectiveness of the protective metal layer and the oxidation inhibition effect on the metal to be processed, thereby optimizing processing precision and surface quality, the output power of the laser component is limited to a range of 50W-200W. The protective effect of the galvanic cell reaction depends on the interfacial reaction activity triggered by the laser energy, and the oxidation consumption rate of the protective metal layer 14 is positively correlated with the laser energy input. The oxidation risk of the metal sample 12 to be processed is directly related to the local temperature field and reaction environment induced by the laser energy. When the laser output power is <50W, the laser energy density is insufficient, which fails to effectively activate the galvanic cell reaction interface between the protective metal layer 14 and the metal sample 12 to be processed, resulting in an electron transfer rate at the anode <0.5×10⁻⁶. -3 A / cm 2 The galvanic cell protection system is difficult to establish quickly, and the metal to be processed is exposed to air at the beginning of processing, increasing the oxidation rate by 3-5 times compared to normal protection. On the other hand, low-power lasers cannot achieve precise micro-melting and forming of the protective metal layer 14, and the bonding force between the protective metal layer 14 and the metal sample 12 to be processed drops below 5 MPa. During processing, the protective layer is prone to peeling off, further aggravating the oxidation risk of the metal to be processed. In addition, low-power lasers have insufficient material removal capabilities, requiring repeated scanning to reach the target processing depth. This not only reduces processing efficiency but also causes the protective metal layer 14 to be continuously consumed due to repeated energy inputs, leading to later protection failure. Therefore, in this embodiment, the lower limit of laser output power is set to 50W; at the same time, when the laser output power is >20W... At 0W, the laser energy density is too high, which will cause the local temperature of the processing area to rise sharply. On the one hand, the oxidation consumption rate of the protective metal layer 14 will increase exponentially, far exceeding the replenishment threshold of the galvanic cell reaction. In a short time, the thickness of the protective metal layer 14 will drop from the initial 5μm to below 1μm, losing its protective ability. On the other hand, the excessive energy will destroy the stable interface of the galvanic cell reaction, causing the anode (protective metal layer 14) to overheat locally and form oxide slag (such as Fe2O3, Al2O3, etc.). These oxide slags will not only adhere to the processing surface, resulting in increased surface roughness, but will also block the water beam channel of the water guide component, affecting the stability of laser transmission and thus reducing the processing accuracy. Therefore, in this embodiment, the upper limit of the laser output power is set to 200W.

[0089] In this embodiment, to optimize processing accuracy, the scanning speed of the laser component is limited to a range of 100 mm / s to 500 mm / s. The galvanic cell reaction rate is limited by the electrolyte ion transport and electron transfer rates. When the scanning speed is <100 mm / s, the laser processing area remains for too long, causing the oxidation consumption rate of the protective metal layer 14 (anodide) to exceed the replenishment threshold, resulting in insufficient protective layer thickness in the later stages of processing and easy oxidation of the processed metal. Therefore, in this embodiment, the lower limit of the scanning speed is set to 100 mm / s. Simultaneously, excessive dwell time during scanning can expand the heat-affected zone, affecting processing accuracy. When the scanning speed is >500 mm / s, the laser's action time on a single point is <2 ms, resulting in insufficient energy input and inability to completely penetrate the protective metal layer. Furthermore, the protective effect is not fully realized after the galvanic cell reaction begins, significantly increasing the risk of metal exposure and oxidation in the processing area. Therefore, in this embodiment, the upper limit of the scanning speed is set to 500 mm / s.

[0090] In this embodiment, the water guiding component 111 generates a stable water column, couples with the laser beam, and guides it to the metal sample 12 to be processed. Simultaneously, it flushes away molten slag and galvanic cell reaction products. To ensure the performance of the water guiding component 111, its output water pressure is limited to a range of 2 MPa-50 MPa. During processing, when the water pressure is <2 MPa, the water column velocity is <10 m / s, and the chip removal efficiency is <85%. At this time, the molten slag (such as copper slag or steel slag) and galvanic cell reaction products (such as Zn(OH)2) generated during processing cannot be discharged in time and easily adhere to the processing surface. Surface burrs or remelted layers form, so setting the lower limit of the output water pressure to 2MPa can avoid this problem. At the same time, a low-flow-rate water column cannot drive the electrolyte solution to circulate, resulting in a decrease in the electrolyte concentration in the processing area and a reduction in the galvanic cell reaction rate. When the water pressure is >50MPa, the water column impact force is too large (>50N), which can cause the protective metal layer to shift or the electrical connection points to loosen, damaging the galvanic cell circuit. In addition, high pressure will cause uneven shrinkage of the water column diameter, reduce laser coupling efficiency, and increase processing deviation. Therefore, setting the upper limit of the output water pressure to 50MPa can avoid the above problems.

[0091] In this embodiment, by limiting the parameter ranges of laser output power, laser scanning speed, and water pressure output by the water guide component as described above, a synergistic effect can be formed through dynamic matching of the three during the processing, ultimately achieving the processing objective of high precision, high efficiency, and low damage in water guide laser processing.

[0092] The water-guided laser processing system provided in this embodiment achieves precise coordination between the pre-construction of galvanic cells and water-guided laser processing through a processing platform, a laser processing device, and an electrical connection device, ensuring that the metal sample to be processed is free from oxidation and processed with high precision.

[0093] It should be noted that the flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of this application. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code, which contains one or more executable instructions for implementing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the blocks may occur in a different order than those marked in the drawings. For example, two consecutive blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, can be implemented using a dedicated hardware-based system that performs the specified function or action, or using a combination of dedicated hardware and computer instructions.

[0094] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the specific working processes of the systems, devices, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here.

[0095] In the several embodiments provided in this application, it should be understood that the disclosed apparatus and methods can be implemented in other ways. The apparatus embodiments described above are merely illustrative. For example, the division of units is only a logical functional division, and there may be other division methods in actual implementation. Furthermore, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Additionally, the coupling or direct coupling or communication connection shown or discussed may be through some communication interface; the indirect coupling or communication connection between apparatuses or units may be electrical, mechanical, or other forms.

[0096] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0097] In addition, the functional units in the various embodiments of this application can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit.

[0098] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application, and they should all be covered within the scope of the claims and specification of this application.

Claims

1. A water-guided laser processing method, characterized in that, A water-guided laser processing method for performing water-guided laser processing on metal samples using a laser processing device includes the following steps: S11: A separable protective metal layer is provided on the metal sample to be processed. The protective metal layer is made of a material with stronger reducing properties than the metal sample to be processed. The thickness of the protective metal layer is set to be 0.1 mm to 0.5 mm. S12: Connect the metal sample to be processed and the protective metal layer via an electrical connection device; during electrical connection, the contact resistance is ≤0.1Ω, the temperature resistance of the connection part is ≥500℃ and it is resistant to electrolyte corrosion; S13: The laser processing device outputs a water column and a laser beam coupled to the water column, so that the laser beam, guided by the water column, sequentially passes through the protective metal layer and the metal sample to be processed, so that the metal sample to be processed and the protective metal layer form a galvanic cell structure under the action of the water column; wherein, the metal sample to be processed constitutes the cathode of the galvanic cell structure, and the protective metal layer constitutes the anode of the galvanic cell structure; the laser output power is 50W-200W, the scanning speed of the laser component of the laser processing device is 100mm / s-500mm / s, and the output water pressure of the water-guided laser processing is 2MPa-50MPa.

2. The water-guided laser processing method according to claim 1, characterized in that, The laser processing device is a green laser with a wavelength range of 500nm-550nm.

3. The water-guided laser processing method according to claim 1, characterized in that, When the metal sample to be processed is gold, silver or copper, the protective metal layer is nickel, nickel alloy, magnesium, magnesium alloy, zinc, zinc alloy, aluminum or aluminum alloy. When the metal sample to be processed is aluminum or an aluminum alloy, the protective metal layer is magnesium or a magnesium alloy; When the metal sample to be processed is steel, the protective metal layer is magnesium, magnesium alloy, zinc, zinc alloy, aluminum, or aluminum alloy.

4. The water-guided laser processing method according to claim 1, characterized in that, The thickness of the protective metal layer is 0.1mm-0.5mm.

5. The water-guided laser processing method according to claim 1, characterized in that, An isolation layer is provided between the protective metal layer and the metal sample to be processed, and the isolation layer is used to isolate the metal sample to be processed and the protective metal layer.

6. A water-guided laser processing method, characterized in that, A water-guided laser processing method for performing water-guided laser processing on metal samples using a laser processing device includes the following steps: S21: A separable protective metal layer is provided on the metal sample to be processed, the protective metal layer being made of a material with stronger reducing properties than the metal sample to be processed; the thickness of the protective metal layer is set to be 0.1mm-0.5mm. S22: The metal sample to be processed and the protective metal layer are connected by an electrical connection device to form a galvanic cell structure; wherein the metal sample to be processed constitutes the cathode of the galvanic cell structure and the protective metal layer constitutes the anode of the galvanic cell structure; during electrical connection, the contact resistance is ≤0.1Ω, the temperature resistance of the connection part is ≥500℃ and it is resistant to electrolyte corrosion. S23: The laser processing device outputs a water column and a laser beam coupled to the water column, so that the laser beam passes through the protective metal layer and the metal sample to be processed sequentially under the guidance of the water column; the laser output power is 50W-200W, the scanning speed of the laser component of the laser processing device is 100mm / s-500mm / s, and the output water pressure of the water-guided laser processing is 2MPa-50MPa; The electrical connection device includes a positive power supply terminal and a negative power supply terminal, and step S22 includes: Provide electrolyte solution; The metal sample to be processed and the protective metal layer are both placed in the electrolyte solution; The upper surface of the protective metal layer is made substantially flush with the surface of the electrolyte solution; The metal sample to be processed is connected to the positive terminal of the power supply, and the protective metal layer is connected to the negative terminal of the power supply.

7. A water-guided laser processing system designed based on the water-guided laser processing method according to any one of claims 1-6, characterized in that, include: A processing platform is used to support the metal sample to be processed, and a protective metal layer is detachably disposed on the metal sample to be processed; A laser processing apparatus includes a laser component, an optical path component, and a water guide component. The laser component outputs a laser beam, the optical path component guides the laser beam to the water guide component, the water guide component generates a water column, the water column is coupled to the laser beam, the water column guides the laser beam to the surface of a protective metal layer, and the laser beam passes through the protective metal layer and irradiates the surface of the metal sample to be processed. An electrical connection device connects the metal sample to be processed and the protective metal layer, such that the metal sample to be processed and the protective metal layer form a galvanic cell structure, wherein the metal sample to be processed constitutes the cathode of the galvanic cell structure and the protective metal layer constitutes the anode of the galvanic cell structure. The protective metal layer is made of a material with stronger reducing properties than the metal sample to be processed.

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