High-efficiency LED plane scanning exposure method

Abstract

The invention discloses a high-efficiency LED plane scanning exposure method. The method comprises the following steps: S1, overlapping a base material to be exposed and a pattern plate, and placing the overlapped base material and pattern plate in an exposure machine; s2, the LED lamp panel is started at high power; s3, parallelly moving the LED lamp panel from the front end of the to-be-exposed substrate to the rear end of the to-be-exposed substrate; s4, the LED lamp panel waits in situ, and the power is reduced; s5, the LED lamp panel is moved to the position over the base material to be exposed and exposed; s6, the LED lamp panel is turned off and reset; s7, taking out the to-be-exposed substrate and the pattern plate, exposing the to-be-exposed substrate once in a high-energy scanning manner by adopting a high-power LED lamp panel, carrying out polymerization reaction on the surface of the to-be-exposed substrate to cure an oxygen barrier layer, and then carrying out plane exposure, so that the plane exposure power can be improved under the protection of the oxygen barrier layer, the polymerization reaction speed is improved, the working efficiency is effectively improved, and the production cost is reduced. Meanwhile, the oxygen isolation layer can isolate oxygen from participating, so that the problem of imperfect low-energy polymerization reaction is avoided.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of exposure technology, in particular to a high-efficiency LED planar scanning exposure method. BACKGROUND

[0002] The exposure machine is a device for transferring specific patterns or information to photosensitive material. Some existing printing templates are made of photocuring resin. By placing a black light-blocking plate of a printing pattern on the photocuring resin, exposure is performed by an exposure machine, so that the irradiated part undergoes a polymerization reaction, thereby making the printing template solidified. In actual operation, if the power of the lamp plate is too low, the polymerization reaction will be imperfect due to the participation of oxygen. If the power of the lamp plate is too high, it is difficult to achieve due to heat dissipation and cost considerations. Meanwhile, in the use of the exposure machine by the applicant, one working cycle is about 30 minutes. The high-power lamp plate will cause the polymerization reaction to be too fast, resulting in resin shrinkage, thereby affecting the quality of the printing template. SUMMARY

[0003] In order to overcome the shortcomings of the prior art, the present application provides a high-efficiency LED planar scanning exposure method.

[0004] The technical scheme adopted by the present application to solve its technical problems is: A high-efficiency LED planar scanning exposure method, comprising the following steps: S1: Installing a substrate: after the substrate to be exposed and the pattern plate are overlapped, they are placed in the exposure machine; S2: Starting the device: starting the exposure machine, and starting the LED lamp plate at high power; S3: Scanning exposure: the LED lamp plate moves in parallel from the front end of the substrate to be exposed to the rear end of the substrate to be exposed; S4: Oxygen barrier layer forming: the LED lamp plate waits in place and reduces its power; S5: Planar exposure: moving the LED lamp plate to the top of the substrate to be exposed, and performing exposure; S6: Exposure ending: turning off the LED lamp plate and resetting, and waiting for the polymerization reaction of the substrate to be exposed to end; S7: Checking the finished product: taking out the substrate to be exposed and the pattern plate, and observing the solidified pattern quality of the substrate to be exposed.

[0005] In the step S4, the LED lamp plate waits in place for 30 seconds to 2 minutes, waiting for the surface of the substrate to be exposed to be cured with an oxygen barrier layer due to the polymerization reaction.

[0006] The thickness of the oxygen barrier layer is 1-10 mm.

[0007] In the step S5, the exposure operation time is 30 seconds to 10 minutes.

[0008] An exposure machine includes an exposure machine body, wherein an exposure cavity for placing a substrate to be exposed is provided inside the exposure machine body, and an LED light panel is slidably mounted above the exposure cavity.

[0009] The exposure machine body is provided with slide rails on both sides of the exposure chamber, and a sliding frame is slidably mounted on the slide rails. The LED light board is fixedly mounted on the bottom of the sliding frame.

[0010] The beneficial effects of this invention are as follows: This invention uses a high-power LED light board to expose the substrate to be exposed once in a high-energy scanning manner, so that a layer of oxygen barrier is solidified by the polymerization reaction on its surface, and then planar exposure is performed. Under the protection of the oxygen barrier layer, the power of planar exposure can be increased, thereby increasing the speed of polymerization reaction and effectively increasing work efficiency. At the same time, the oxygen barrier layer can isolate the participation of oxygen and avoid the problem of incomplete low-energy polymerization reaction. Attached Figure Description

[0011] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0012] Figure 1 This is a process flow diagram of the present invention. Detailed Implementation

[0013] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to specific embodiments and accompanying drawings. It should be noted that, unless otherwise specified, the embodiments and features described herein can be combined with each other.

[0014] It should be understood that these descriptions are merely exemplary and are not intended to limit the scope of the invention.

[0015] The following describes some embodiments of the present invention with reference to the accompanying drawings.

[0016] Reference Figure 1 A high-efficiency method for LED planar scanning exposure includes the following steps: S1 Substrate Installation: The substrate to be exposed and the pattern plate are overlapped and placed inside the exposure machine; S2 Start-up Equipment: Starts the exposure machine; LED light board starts at high power. S3 Scan Exposure: The LED light panel moves parallel to the front end of the substrate to be exposed to the rear end of the substrate; S4 oxygen barrier layer forming: The LED light board is left in place and its power is reduced; S5 Planar Exposure: The LED light panel is moved directly above the substrate to be exposed, and exposure is performed; S6 Exposure complete: Turn off the LED light panel and reset it, and wait for the polymerization reaction of the substrate to be exposed to complete; S7 Inspect the finished product: Remove the substrate to be exposed and the pattern plate, and observe the quality of the cured pattern on the substrate to be exposed.

[0017] This invention employs a high-power LED light panel with high-energy scanning to expose the substrate once, causing a polymerization reaction to solidify an oxygen barrier layer on its surface before planar exposure. Under the protection of the oxygen barrier layer, the power of planar exposure can be increased, thereby increasing the speed of the polymerization reaction and effectively increasing work efficiency. At the same time, the oxygen barrier layer can isolate oxygen participation, avoiding the problem of incomplete polymerization reaction caused by low energy.

[0018] In step S4, the LED light board waits in place for 30 seconds to 2 minutes, allowing the surface of the substrate to be exposed to solidify an oxygen barrier layer due to the polymerization reaction, thus isolating it from oxygen.

[0019] The thickness of the oxygen barrier layer is 1-10 mm, which is adjusted according to the requirements of the printing template. If the printing template needs to be relatively flat, the thickness of the oxygen barrier layer will be thicker.

[0020] In step S5, the exposure time is 30 seconds to 10 minutes.

[0021] In this invention, the actual thickness of the oxygen barrier layer formed by the resin material needs to be tested based on different brands and models. This requires testing of the LED light board power, scanning exposure time, and speed to ensure the accuracy of the oxygen barrier layer thickness and prevent the printing template from failing to meet requirements during subsequent planar exposure. Similarly, the required LED light board power and exposure time also need to be tested for oxygen barrier layers of different thicknesses. For example, if a flat printing template is required for a specific brand and model of resin, multiple oxygen barrier layers of different thicknesses need to be fabricated simultaneously, and the corresponding LED light board power, scanning exposure time, and speed are recorded. Subsequently, different low-power planar exposures are performed on substrates with oxygen barrier layers of different thicknesses until it is determined that the printing template performs best when all three conditions are met simultaneously: a certain LED light board power, a certain oxygen barrier layer thickness, and a certain exposure time. The LED light board power, scanning exposure time, and speed corresponding to the oxygen barrier layer thickness are then the required scanning exposure parameters for that printing template.

[0022] An exposure machine includes an exposure machine body, wherein an exposure cavity for placing a substrate to be exposed is provided inside the exposure machine body, and an LED light panel is slidably mounted above the exposure cavity.

[0023] The exposure machine body is provided with slide rails on both sides of the exposure chamber, and a sliding frame is slidably mounted on the slide rails. The LED light board is fixedly mounted on the bottom of the sliding frame.

[0024] In this invention, the term "a plurality of" refers to two or more unless otherwise expressly defined. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items. The terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; "linking" can be a direct connection or an indirect connection via an intermediate medium. Those skilled in the art will understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0025] It should be noted that when a component is referred to as being "assembled on," "mounted on," "fixed to," or "set on" another component, it can be directly on the other component or there may be an intermediate component. When a component is considered to be "connected to" another component, it can be directly connected to the other component or there may be an intermediate component present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0026] In the description of this specification, the terms "one embodiment," "some embodiments," "specific embodiment," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0027] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A high-efficiency method for LED planar scanning exposure, characterized in that... Includes the following processes: S1 Substrate Mounting: Place the substrate to be exposed and the pattern plate overlapping inside the exposure machine; S2 Start-up Equipment: Starts the exposure machine; LED light board starts at high power. S3 Scan Exposure: The LED light panel moves parallel to the front end of the substrate to be exposed to the rear end of the substrate; S4 oxygen barrier layer forming: The LED light board is left in place and its power is reduced; S5 planar exposure: The LED light panel is moved directly above the substrate to be exposed and then exposed; S6 Exposure complete: Turn off the LED light panel and reset it, and wait for the polymerization reaction of the substrate to be exposed to complete; S7 Inspect the finished product: Remove the substrate to be exposed and the pattern plate, and observe the quality of the cured pattern on the substrate to be exposed.

2. The high-efficiency LED planar scanning exposure method according to claim 1, characterized in that, In step S4, the LED light board waits in place for 30 seconds to 2 minutes, allowing the surface of the substrate to be exposed to solidify an oxygen barrier layer due to the polymerization reaction.

3. The high-efficiency LED planar scanning exposure method according to claim 2, characterized in that... The thickness of the oxygen barrier layer is 1-10 mm.

4. The high-efficiency LED planar scanning exposure method according to claim 1, characterized in that, In step S5, the exposure time is 30 seconds to 10 minutes.

5. An exposure machine, comprising an exposure machine body, characterized in that... The exposure machine body is provided with an exposure cavity for placing the substrate to be exposed, and the LED light panel is slidably mounted above the exposure cavity.

6. The exposure machine according to claim 5, characterized in that... The exposure machine body is provided with slide rails on both sides of the exposure chamber, and a sliding frame is slidably mounted on the slide rails. The LED light board is fixedly mounted on the bottom of the sliding frame.

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