Hydrogen release filler, adhesive film, solder strip, conductive adhesive, printing paste and photovoltaic module

Abstract

The invention relates to a hydrogen release filler, an adhesive film, a solder strip, a conductive adhesive, printing paste and a photovoltaic module. The hydrogen release filler comprises an inner core and a coating layer coating the inner core, the inner core is made of a hydrogen storage material, and the coating layer is made of one or more of silicon oxide, zirconium oxide, aluminum oxide, apatite and the like. The hydrogen release filler comprises a hydrogen storage material, and the hydrogen storage material can release hydrogen in the long-term operation process of the photovoltaic module, so that the surface of the battery piece is in a hydrogen-rich environment, dangling bonds are saturated, and the passivation effect of the battery piece is enhanced. The hydrogen release filler further comprises a coating layer coating the inner core, and the coating layer can prevent the hydrogen storage material from releasing a large amount of hydrogen outwards in a high-temperature environment in the photovoltaic module laminating process. In the long-term operation process, the coating layer is gradually degraded and cracked, and hydrogen can be released after the environment temperature reaches the decomposition temperature of the hydrogen storage material. The hydrogen release filler can release hydrogen within a long time, and long-acting passivation of the battery piece is achieved.

Description

Technical Field

[0001] This invention relates to the field of photovoltaic technology, and in particular to a hydrogen-releasing filler, adhesive film, solder ribbon, conductive adhesive, printing paste, and photovoltaic module. Background Technology

[0002] In crystalline silicon solar cells, there are a large number of defects on the surface of crystalline silicon. The main reasons include: (1) the lattice structure extending from the interior of crystalline silicon to the surface is interrupted at the surface, resulting in a large number of silicon dangling bonds on the surface; (2) the silicon surface is damaged during the slicing process, resulting in a large number of defects and lattice distortions. These defects will increase the defect state density on the surface of crystalline silicon, thereby increasing the recombination of electrons and holes at the interface and reducing the efficiency of the cell.

[0003] Typically, a passivation layer made of materials such as silicon nitride, aluminum oxide, or silicon oxide is formed on the surface of crystalline silicon solar cells to passivate defects, reduce recombination, and improve cell efficiency. Traditional technologies achieve excellent passivation effects by changing the passivation layer material and controlling the passivation layer deposition process. However, the effects of material selection and process control are limited, making it difficult to maintain good passivation performance over a long period. Summary of the Invention

[0004] Therefore, it is necessary to provide a hydrogen-releasing filler, film, solder ribbon, conductive adhesive, printing paste, and photovoltaic module to improve the long-term passivation effect.

[0005] The first aspect of the present invention provides a hydrogen-releasing packing material, the scheme of which is as follows:

[0006] A hydrogen-releasing filler includes a core and a coating layer covering the core, wherein the core is made of a hydrogen storage material, and the coating layer is made of one or more of silicon oxide, zirconium oxide, aluminum oxide, and apatite.

[0007] In one embodiment, the hydrogen storage material includes one or more of metal hydrogen storage materials, organic hydrides, and coordination hydrides.

[0008] In one embodiment, the metal hydrogen storage material includes one or more of magnesium-based hydrogen storage materials, rare earth-based hydrogen storage materials, and iron-titanium-based hydrogen storage materials.

[0009] In one embodiment, the coordination hydride includes one or more of LiBH4, NaBH4, and NaAlH4.

[0010] In one embodiment, the hydrogen-releasing filler further includes an intermediate layer located between the core and the covering layer, the intermediate layer being made of a photothermal agent.

[0011] In one embodiment, the photothermal agent includes one or more of carbon-based materials, metal nanoparticles, and semiconductor materials.

[0012] In one embodiment, the carbon-based material includes one or more of graphene, carbon nanotubes, and fullerenes.

[0013] In one embodiment, the metal nanoparticles include one or more of gold nanoparticles, gold nanorods, and silver nanoparticles.

[0014] In one embodiment, the semiconductor material includes one or more of copper sulfide and silver sulfide.

[0015] In one embodiment, the kernel has a particle size of 10 nm to 2 μm.

[0016] In one embodiment, the thickness of the coating layer is 10 nm to 200 nm.

[0017] A second aspect of the present invention provides an adhesive film, the solution of which is as follows:

[0018] A film comprising a polymer matrix and a hydrogen-releasing filler as described in any of the above embodiments, wherein the hydrogen-releasing filler is dispersed in the polymer matrix.

[0019] In one embodiment, the adhesive film includes a base film and a barrier layer. The base film includes the polymer matrix and the hydrogen-releasing filler. The barrier layer is disposed on one side of the base film. The material of the barrier layer includes one or more of graphene and Al2O3 nanosheets.

[0020] A third aspect of the present invention provides a solder strip, the solution of which is as follows:

[0021] A welding strip includes a conductive strip and a hydrogen-releasing coating disposed on the conductive strip. The hydrogen-releasing coating includes a binder and a hydrogen-releasing filler as described in any of the above embodiments, wherein the hydrogen-releasing filler is dispersed in the binder.

[0022] A fourth aspect of the present invention provides a conductive adhesive, the solution of which is as follows:

[0023] A conductive adhesive includes an adhesive matrix, a conductive agent, and a hydrogen-releasing filler as described in any of the above embodiments, wherein the conductive agent and the hydrogen-releasing filler are dispersed in the adhesive matrix.

[0024] The fifth aspect of the present invention provides a printing paste, the solution of which is as follows:

[0025] A printing paste includes a conductive filler, a solvent, a binder, and a hydrogen-releasing filler as described in any of the above embodiments, wherein the conductive filler, the binder, and the hydrogen-releasing filler are mixed and dispersed in the solvent.

[0026] A sixth aspect of the present invention provides a photovoltaic module, the solution of which is as follows:

[0027] A photovoltaic module includes a first encapsulation panel, a second encapsulation panel, and a solar cell disposed between the first encapsulation panel and the second encapsulation panel; the photovoltaic module further includes one or more of the adhesive film, the solder ribbon, the conductive adhesive, and the electrode made of the printing paste located between the first encapsulation panel and the second encapsulation panel and disposed on the solar cell.

[0028] Compared with traditional solutions, the aforementioned hydrogen-releasing fillers, films, solder ribbons, conductive adhesives, printing pastes, and photovoltaic modules have the following advantages:

[0029] The aforementioned hydrogen-releasing filler can be applied to components in contact with solar cells, such as adhesive films, solder ribbons, conductive adhesives, and printing pastes used in photovoltaic module production. This hydrogen-releasing filler includes a hydrogen storage material. During long-term operation of the photovoltaic module, the hydrogen storage material releases hydrogen, creating a hydrogen-rich environment on the surface of the solar cell. This effectively saturates the dangling bonds on the crystalline silicon surface, enhancing the chemical passivation effect of the solar cell and improving its open-circuit voltage and other performance parameters. The hydrogen-releasing filler also includes a coating layer encapsulating the core, used to control the timing of hydrogen release from the hydrogen storage material. The coating layer material includes one or more of silicon oxide, zirconium oxide, aluminum oxide, and apatite, which can withstand short-term high temperatures and prevent the hydrogen storage material from releasing large amounts of hydrogen during the photovoltaic module lamination process due to the high-temperature environment. During long-term operation of the photovoltaic module, the coating layer gradually degrades and cracks, releasing hydrogen when the ambient temperature reaches the decomposition temperature of the hydrogen storage material. Therefore, the aforementioned hydrogen-releasing filler can release hydrogen over a relatively long period, achieving long-term passivation of the solar cell.

[0030] The aforementioned photovoltaic module includes one or more of the aforementioned adhesive film, solder ribbon, conductive adhesive, and electrodes made from the aforementioned printing paste, and thus possesses corresponding technical features and can obtain corresponding beneficial effects. Attached Figure Description

[0031] Figure 1 This is a schematic diagram of the structure of a hydrogen-releasing packing material according to one embodiment;

[0032] Figure 2 This is a schematic diagram of the hydrogen-releasing packing material according to another embodiment;

[0033] Figure 3 This is a schematic diagram of the structure of an adhesive film according to one embodiment;

[0034] Figure 4 This is a schematic diagram of the structure of the adhesive film according to another embodiment;

[0035] Figure 5 This is a schematic diagram of the solder strip structure in one embodiment;

[0036] Figure 6 This is a schematic diagram of the structure of a photovoltaic module according to one embodiment.

[0037] Explanation of reference numerals in the attached figures:

[0038] 100, Hydrogen-releasing filler; 110, Core; 120, Coating layer; 130, Intermediate layer; 200, Adhesive film; 201, Polymer matrix; 210, Base film; 220, Barrier layer; 300, Solder ribbon; 310, Conductive strip; 320, Hydrogen-releasing coating; 321, Adhesive; 10, Photovoltaic module; 400, First encapsulation panel; 500, Second encapsulation panel; 600, Solar cell; 700, First encapsulation film; 800, Second encapsulation film. Detailed Implementation

[0039] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of the present invention. However, the present invention can be practiced in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0040] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0041] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0042] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0043] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0044] Crystalline silicon solar cells, such as TOPCon and HJT cells, are susceptible to degradation due to ultraviolet light. Studies have shown that the degradation mechanism primarily involves the breaking of Si-H bonds, leading to an increase in interface state density and carrier recombination. To address this, this invention provides a hydrogen-releasing filler. This filler can be applied to components in contact with the solar cells, such as encapsulant films, solder ribbons, conductive adhesives, and printing pastes used in photovoltaic module production. It releases hydrogen gas to reduce the number of broken Si-H bonds on the cell surface, thereby improving long-term passivation performance.

[0045] like Figure 1 As shown, one embodiment of the hydrogen-releasing filler 100 includes a core 110 and a coating layer 120 covering the core 110. The core 110 is made of a hydrogen storage material. The coating layer 120 is made of one or more of the following: SiO2 (silicon oxide), ZrO2 (zirconia), aluminum oxide, apatite, etc.

[0046] The aforementioned hydrogen-releasing filler 100 includes a hydrogen storage material. During the long-term operation of the photovoltaic module, the hydrogen storage material can release hydrogen gas, creating a hydrogen-rich environment on the surface of the solar cell. This effectively saturates the dangling bonds on the crystalline silicon surface, enhances the chemical passivation effect of the solar cell, and improves its performance parameters such as open-circuit voltage. The aforementioned hydrogen-releasing filler 100 also includes a coating layer 120 covering the core 110, used to control the timing of hydrogen release from the hydrogen storage material. The material of the coating layer 120 includes one or more of silicon oxide, zirconium oxide, aluminum oxide, apatite, etc., which can withstand short-term high temperatures and prevent the hydrogen storage material from releasing large amounts of hydrogen gas during the photovoltaic module lamination process in high-temperature environments (such as 140℃~150℃). During the long-term operation of the photovoltaic module, the coating layer 120 gradually degrades and cracks, releasing hydrogen gas once the ambient temperature reaches the decomposition temperature of the hydrogen storage material. Thus, the aforementioned hydrogen-releasing filler 100 can release hydrogen gas for a relatively long period of time, achieving long-term passivation of the solar cell.

[0047] Optionally, the hydrogen storage material may include, but is not limited to, one or more of the following: metal hydrogen storage materials, organic hydrides, and coordination hydrides.

[0048] Optionally, the metal hydrogen storage material includes, but is not limited to, one or more of magnesium-based, rare-earth-based, and iron-titanium-based hydrogen storage materials. Magnesium-based hydrogen storage materials include, for example, magnesium dihydrogenide (MgH2). Rare-earth-based hydrogen storage materials include, for example, hydrogen-filled lanthanum nickel pentoxide (LaNi5). Iron-titanium-based hydrogen storage materials include, for example, hydrogen-filled TiFe. Materials such as LaNi5 and TiFe can be coated with a coating layer 120, followed by hydrogen filling treatment. The coated material is then placed in a high-pressure (e.g., 2.0~4.0 MPa) hydrogen environment and reacted at a high temperature (e.g., 300℃~400℃) to achieve hydrogen filling. The decomposition temperature of the metal hydrogen storage material can be controlled by adjusting its particle size.

[0049] Optionally, the coordination hydride includes one or more of lithium borohydride (LiBH4), sodium borohydride (NaBH4), and sodium aluminum tetrahydrogen (NaAlH4).

[0050] By adjusting the particle size of the core 110 and the thickness of the coating layer 120 in the hydrogen release filler 100, the hydrogen release rate can be controlled to meet long-term passivation requirements.

[0051] The core 110 can be a nanoparticle or a submicron particle. In some examples, the particle size of the core 110 is 10 nm to 2 μm. In some examples, the core 110 is a nanoparticle with a particle size of 10 nm to 200 nm. In some examples, the core 110 is a submicron particle with a particle size of 0.5 μm to 2 μm.

[0052] In some of these examples, the thickness of the cladding layer 120 is 10nm to 200nm, specifically 10nm, 20nm, 50nm, 80nm, 120nm, 150nm, 200nm, etc.

[0053] like Figure 2 As shown, in some examples, the hydrogen-releasing filler 100 also includes an intermediate layer 130. The intermediate layer 130 is located between the core 110 and the covering layer 120. The material of the intermediate layer 130 includes a photothermal agent. A photothermal agent is a type of material that can absorb light energy of a specific wavelength (such as near-infrared light, visible light, etc.) and efficiently convert it into heat energy. In this example, an intermediate layer 130 containing a photothermal agent is provided between the core 110 and the covering layer 120. The covering layer 120 is not completely transparent, allowing light to pass through and act on the photothermal agent in the intermediate layer 130. The photothermal agent can convert light energy into heat energy, heating the hydrogen storage material in the core 110 to release hydrogen, thus achieving on-demand hydrogen supply. This design is suitable for situations where the decomposition temperature of the hydrogen storage material is high, and where photovoltaic modules are unable to reach the decomposition temperature of the hydrogen storage material in cold climates. In relatively cold environments, the module operating temperature is low and cannot reach the decomposition temperature of the hydrogen storage material. At this time, the heat generated by the photothermal agent provides localized heating, which helps the hydrogen storage material decompose and release hydrogen.

[0054] Optionally, the photothermal agent may be one or more of the following: including but not limited to carbon-based materials, metal nanoparticles, and semiconductor materials.

[0055] Carbon-based materials possess a conjugated structure, which enables photothermal conversion through its strong light absorption capacity. For example, carbon-based materials can include one or more of graphene, carbon nanotubes, and fullerenes.

[0056] Metal nanoparticles absorb light energy and convert it into heat energy through surface plasmon resonance, exhibiting high photothermal conversion efficiency and stability. Metal nanoparticles include, for example, one or more of gold nanoparticles, gold nanorods, and silver nanoparticles.

[0057] Semiconductor materials can absorb light energy and release it as heat energy through electron transitions. Semiconductor materials include one or more of copper sulfide (CuS) and silver sulfide (Ag2S).

[0058] In some of these examples, the thickness of the intermediate layer 130 is 10nm to 200nm, specifically 10nm, 20nm, 50nm, 80nm, 120nm, 150nm, 200nm, etc.

[0059] The hydrogen release filler 100 can be prepared by coating a coating layer 120 onto the surface of hydrogen storage material particles using hydrothermal method, sol-gel method, redox method, etc.

[0060] Taking the preparation of hydrogen-releasing filler formed by SiO2 coating MgH2 as an example, the sol-gel method is usually used for preparation. The specific preparation process is as follows: (1) Magnesium powder pretreatment: The magnesium powder is immersed in dilute hydrochloric acid and ultrasonically treated for 10 minutes to remove the surface oxide layer. It is washed with deionized water until neutral and vacuum dried to obtain active Mg powder; (2) SiO2 sol preparation: Tetraethyl orthosilicate is mixed with ethanol and deionized water containing ammonia is added dropwise under stirring to form transparent SiO2 sol; (3) Core-shell coating: Active MgH2 is coated with MgH2 and then coated with MgH2. Mg powder is added to SiO2 sol and ultrasonically dispersed. After heating, it is continuously stirred. Tetraethyl orthosilicate hydrolyzes and condenses to form a SiO2 gel shell on the surface of Mg powder. It is then left to stand at room temperature. (4) Drying and calcination: Vacuum drying at 60℃ for 12 hours, solvent removal, and calcination in an inert gas to enhance the density of SiO2. (5) Hydrogenation treatment: High-pressure hydrogen gas (2.0~4.0MPa) is introduced, and the temperature is raised to 300℃~400℃ for 3~5 hours to generate MgH2@SiO2 hydrogen storage material.

[0061] The shape of the hydrogen release packing 100 is not limited to spherical particles; for example, it can also be elliptical particles, sheet-like particles, rod-like particles, irregular shapes, etc.

[0062] Furthermore, the present invention also provides an adhesive film.

[0063] like Figure 3 As shown, the film 200 of one embodiment includes a polymer matrix 201 and a hydrogen-releasing filler 100 of any of the above examples. The hydrogen-releasing filler 100 is dispersed in the polymer matrix 201.

[0064] The aforementioned encapsulant film 200 can be used as an encapsulation component for solar cells in photovoltaic modules. By adding hydrogen-releasing filler 100 to the polymer matrix 201, the hydrogen-releasing filler 100 continuously releases hydrogen during the operation of the photovoltaic module, keeping the surface of the solar cell in a hydrogen-rich environment and maintaining a good passivation effect for a long time.

[0065] In some examples, the mass fraction of hydrogen-releasing filler 100 in the film 200 is 0.01% to 1%, specifically 0.01%, 0.05%, 0.1%, 0.2%, 0.4%, 0.6%, 0.8%, 1%, etc. At this content, the addition of hydrogen-releasing filler 100 will not have a significant adverse effect on the encapsulation performance and light transmittance of the film 200.

[0066] In some of these examples, the preparation method of the aforementioned adhesive film 200 includes the following steps:

[0067] The hydrogen-releasing filler 100 is mixed evenly with the polymer matrix 201 and then formed by co-extrusion or casting.

[0068] Optionally, in order to ensure that the hydrogen-releasing filler 100 is mixed evenly with the polymer matrix 201 and to prevent the hydrogen-releasing filler 100 from agglomerating and affecting the light transmittance of the film 200, a dispersant can be added when the hydrogen-releasing filler 100 is mixed with the polymer matrix 201, or uniform dispersion can be achieved by ultrasonic treatment.

[0069] The aforementioned adhesive film 200 can be a single adhesive film, such as an EVA adhesive film (polymer matrix 201 is EVA), a POE adhesive film (polymer matrix 201 is POE), a PE adhesive film (polymer matrix 201 is PE), a PVB adhesive film (polymer matrix 201 is PVB), etc.; it can also be a composite adhesive film, such as an EP adhesive film, an EPE adhesive film, etc. The composite adhesive film includes multiple stacked sub-films. The EP adhesive film includes an EVA sub-film and a POE sub-film. The EPE adhesive film includes a first EVA sub-film, a POE sub-film, and a second EVA sub-film. In the composite adhesive film, the hydrogen-releasing filler 100 can be dispersed in one of the sub-films, dispersed in multiple sub-films, or dispersed in all the sub-films.

[0070] like Figure 4 As shown, in some examples, the adhesive film 200 includes a base film 210 and a barrier layer 220. The base film 210 includes the aforementioned polymer matrix 201 and hydrogen-releasing filler 100. The barrier layer 220 is disposed on one side of the base film 210. The material of the barrier layer 220 includes, but is not limited to, one or more of graphene, Al2O3 nanosheets, aluminum foil, ZrO2, etc.

[0071] In the above example, when the encapsulant film 200 is used as an encapsulation material in a photovoltaic module, the barrier layer 220 is disposed on the side of the base film 210 away from the solar cell. The barrier layer 220 can prevent the hydrogen gas released by the hydrogen-releasing filler 100 from escaping to the outside of the photovoltaic module, thereby allowing the hydrogen gas to permeate into the solar cell and achieve a passivation effect.

[0072] For POE films, EP films, and EPE films, their inherent water vapor barrier properties mean that even without the aforementioned barrier layer 220, these films still offer good hydrogen barrier performance. However, for EVA films, PE films, and PVB films, the aforementioned barrier layer 220 is more effective in preventing hydrogen escape.

[0073] In some of these examples, the thickness of the base film 210 is 200 μm to 600 μm.

[0074] In some of these examples, the thickness of the barrier layer 220 is 0.02 μm to 20 μm.

[0075] Furthermore, the present invention also provides a welding strip.

[0076] like Figure 5 As shown, in one embodiment, the solder strip 300 includes a conductive strip 310 and a hydrogen-releasing coating 320 disposed on the conductive strip 310. The hydrogen-releasing coating 320 includes a binder 321 and a hydrogen-releasing filler 100 as described in any of the above examples. The hydrogen-releasing filler 100 is dispersed in the binder 321.

[0077] The aforementioned solder ribbon 300 has a hydrogen-releasing coating 320 on the conductive strip 310, and a hydrogen-releasing filler 100 is added to the hydrogen-releasing coating 320. During the operation of the photovoltaic module, the hydrogen-releasing filler 100 can release hydrogen gas. In addition, when the current flows through the solder ribbon 300, the heat generated by the solder ribbon 300 will also promote the release of hydrogen gas by the hydrogen-releasing filler 100, which acts on the cell and can maintain a good passivation effect for a long time.

[0078] In some examples, the mass fraction of hydrogen-releasing filler 100 in the hydrogen-releasing coating 320 is 0.01% to 1%, specifically 0.01%, 0.05%, 0.1%, 0.2%, 0.4%, 0.6%, 0.8%, 1%, etc.

[0079] Furthermore, the present invention also provides a conductive adhesive.

[0080] One embodiment of the conductive adhesive includes a matrix, a conductive agent, and a hydrogen-releasing filler 100 as described in any of the above examples. The conductive agent and the hydrogen-releasing filler 100 are dispersed in the matrix.

[0081] In some examples, the mass fraction of hydrogen-releasing filler 100 in the conductive adhesive is 0.01% to 1%, specifically 0.01%, 0.05%, 0.1%, 0.2%, 0.4%, 0.6%, 0.8%, 1%, etc.

[0082] Optionally, the material of the adhesive matrix may include, but is not limited to, silicone resin, acrylic resin, epoxy resin, etc.

[0083] Alternatively, the conductive agent may be made of materials including, but not limited to, silver, silver-clad copper, copper, aluminum, etc.

[0084] In some of these examples, the method for preparing the conductive adhesive includes the following steps:

[0085] The conductive agent, hydrogen-releasing filler 100, and adhesive matrix are mixed evenly.

[0086] During the operation of photovoltaic modules, the hydrogen-releasing filler 100 in the above-mentioned conductive adhesive can release hydrogen gas, which acts on the solar cells and can maintain a good passivation effect for a long time.

[0087] Furthermore, the present invention also provides a printing paste.

[0088] One embodiment of the printing paste includes a conductive filler, a solvent, a binder, and a hydrogen-releasing filler 100 as described in any of the above examples. The conductive filler, the binder, and the hydrogen-releasing filler 100 are mixed and dispersed in the solvent.

[0089] During the operation of photovoltaic modules, the coating formed on the cells using the above-mentioned printing paste contains hydrogen-releasing filler 100. The hydrogen-releasing filler 100 can release hydrogen gas, which acts on the cells and can maintain a good passivation effect for a long time.

[0090] In some of these examples, the mass fraction of hydrogen-releasing filler 100 in the printing paste is 0.01% to 1%, specifically 0.01%, 0.05%, 0.1%, 0.2%, 0.4%, 0.6%, 0.8%, 1%, etc.

[0091] In some of these examples, the conductive filler includes, for example, silver. The binder includes, for example, glass powder.

[0092] In some of these examples, the method for preparing the above-mentioned printing paste includes the following steps:

[0093] The hydrogen-releasing filler 100 is mixed and dispersed with the binder in a solvent.

[0094] Furthermore, the present invention also provides a photovoltaic module.

[0095] like Figure 6 As shown, a photovoltaic module 10 of one embodiment includes a first encapsulation panel 400, a second encapsulation panel 500, and a solar cell 600. The solar cell 600 is disposed between the first encapsulation panel 400 and the second encapsulation panel 500. Furthermore, the photovoltaic module 10 also includes one or more of the aforementioned adhesive film 200, solder ribbon 300, conductive adhesive, and electrodes made of the aforementioned printing paste, located between the first encapsulation panel 400 and the second encapsulation panel 500 and disposed on the solar cell 600.

[0096] like Figure 6 As shown, taking a photovoltaic module 10 including the aforementioned encapsulant film 200 as an example, the photovoltaic module 10 includes a first encapsulation panel 400, a first encapsulant film 700, a solar cell 600, a second encapsulant film 800, and a second encapsulation panel 500 stacked sequentially. At least one of the first encapsulant film 700 and the second encapsulant film 800 uses the aforementioned encapsulant film 200.

[0097] In the example where the adhesive film 200 includes a base film 210 and a barrier layer 220, the barrier layer 220 is disposed on the side of the base film 210 away from the battery cell 600.

[0098] In some examples, the aforementioned solar cell 600 is a crystalline silicon solar cell. Alternatively, the aforementioned solar cell 600 can be, but is not limited to, a passivated emitter back contact cell (PERC cell), a tunnel oxide passivated contact cell (TOPCon cell), a heterojunction cell (HJT cell), a back contact cell (BC cell), etc.

[0099] The following specific embodiments further illustrate the present invention. These specific embodiments are provided to better understand the present invention, but are not limited to these embodiments and do not constitute a limitation on the scope of protection of the present invention.

[0100] Example 1

[0101] This embodiment provides a hydrogen-releasing packing material.

[0102] The hydrogen-releasing filler in this embodiment includes a core and a coating layer covering the core. The core is made of MgH2, a hydrogen storage material. The coating layer is made of SiO2. The core has a particle size of 100 nm, and the coating layer has a thickness of 60 nm.

[0103] Example 2

[0104] This embodiment provides a hydrogen-releasing packing material.

[0105] The hydrogen-releasing filler in this embodiment includes a core and a coating layer covering the core. The core is made of LiBH4, a hydrogen storage material. The coating layer is made of apatite. The core has a particle size of 70 nm, and the coating layer has a thickness of 20 nm.

[0106] Example 3

[0107] This embodiment provides a hydrogen-releasing packing material.

[0108] The hydrogen-releasing filler in this embodiment includes a core, an intermediate layer, and a coating layer. The intermediate layer coats the core, and the coating layer coats the intermediate layer. The core is made of MgH2, a hydrogen storage material. The intermediate layer is made of carbon nanotubes. The coating layer is made of SiO2. The core has a particle size of 100 nm, the intermediate layer has a thickness of 30 nm, and the coating layer has a thickness of 60 nm.

[0109] Example 4

[0110] This embodiment provides an adhesive film.

[0111] The film in this embodiment includes a polymer matrix and the hydrogen-releasing filler provided in Example 1. The polymer matrix is ​​EVA. The mass fraction of the hydrogen-releasing filler is 0.1%.

[0112] Example 5

[0113] This embodiment provides an adhesive film.

[0114] The film in this embodiment includes a base film and a barrier layer. The base film includes a polymer matrix and the hydrogen-releasing filler provided in Example 1. The polymer matrix is ​​EVA. The mass fraction of the hydrogen-releasing filler is 0.3%. The barrier layer is disposed on one side of the base film. The material of the barrier layer is Al2O3 nanosheets. The thickness of the base film is 400 nm. The thickness of the barrier layer is 80 nm.

[0115] Example 6

[0116] This embodiment provides a solder strip.

[0117] The solder strip in this embodiment includes a conductive strip and a hydrogen-releasing coating disposed on one side of the conductive strip. The conductive strip is made of copper. The hydrogen-releasing coating includes a binder and the hydrogen-releasing filler provided in Example 1 above. The hydrogen-releasing filler is dispersed in a polymer matrix. The mass fraction of the hydrogen-releasing filler is 0.05%.

[0118] Example 7

[0119] This embodiment provides a conductive adhesive.

[0120] The conductive adhesive of this embodiment includes a binder matrix, a conductive agent, and the hydrogen-releasing filler provided in Example 1. The conductive agent and the hydrogen-releasing filler are dispersed in the binder matrix. The binder matrix is ​​made of acrylic resin. The conductive agent is made of silver powder. The hydrogen-releasing filler has a mass fraction of 0.15%.

[0121] Example 8

[0122] This embodiment provides a printing paste.

[0123] The printing paste of this embodiment includes a conductive filler, a binder, a solvent, and the hydrogen-releasing filler provided in Example 1. The binder and the hydrogen-releasing filler are mixed and dispersed in the solvent. The conductive filler is made of silver powder. The binder is made of glass powder. The solvent is terpineol. The mass fraction of the hydrogen-releasing filler is 0.2%.

[0124] Example 9

[0125] This embodiment provides a photovoltaic module.

[0126] The photovoltaic module of this embodiment includes a first encapsulation panel, a first encapsulating film, a solar cell, a second encapsulating film, and a second encapsulation panel stacked sequentially. The first and second encapsulation panels are photovoltaic glass. The first and second encapsulating films are the same as those provided in Example 5. The solar cell is a TOPCon cell.

[0127] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0128] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A hydrogen-releasing packing material, characterized in that, It includes a core and a coating layer covering the core. The core is made of a hydrogen storage material, and the coating layer is made of one or more of silicon oxide, zirconium oxide, aluminum oxide, and apatite.

2. The hydrogen-releasing packing material as described in claim 1, characterized in that, The hydrogen storage material includes one or more of the following: metal hydrogen storage materials, organic hydrides, and coordination hydrides.

3. The hydrogen-releasing packing material as described in claim 2, characterized in that, The metal hydrogen storage material includes one or more of magnesium-based hydrogen storage materials, rare earth-based hydrogen storage materials, and iron-titanium-based hydrogen storage materials; And / or, the coordination hydride includes one or more of LiBH4, NaBH4, and NaAlH4.

4. The hydrogen-releasing packing material according to any one of claims 1 to 3, characterized in that, The hydrogen-releasing filler also includes an intermediate layer located between the core and the coating layer, the intermediate layer being made of a photothermal agent.

5. The hydrogen-releasing packing material as described in claim 4, characterized in that, The photothermal agent includes one or more of carbon-based materials, metal nanoparticles, and semiconductor materials.

6. The hydrogen-releasing packing material as described in claim 5, characterized in that, The carbon-based material includes one or more of graphene, carbon nanotubes, and fullerenes; And / or, the metal nanoparticles include one or more of gold nanoparticles, gold nanorods, and silver nanoparticles; And / or, the semiconductor material includes one or more of copper sulfide and silver sulfide.

7. The hydrogen-releasing packing material according to any one of claims 1 to 3, 5, and 6, characterized in that, The particle size of the core is 10nm~2μm; And / or, the thickness of the coating layer is 10nm~200nm.

8. A film, characterized in that, It includes a polymer matrix and a hydrogen-releasing filler as described in any one of claims 1 to 7, wherein the hydrogen-releasing filler is dispersed in the polymer matrix.

9. The adhesive film as described in claim 8, characterized in that, The adhesive film includes a base film and a barrier layer. The base film includes the polymer matrix and the hydrogen-releasing filler. The barrier layer is disposed on one side of the base film. The material of the barrier layer includes one or more of graphene, Al2O3 nanosheets, aluminum foil, and ZrO2.

10. A welding strip, characterized in that, It includes a conductive strip and a hydrogen-releasing coating disposed on the conductive strip, the hydrogen-releasing coating comprising a binder and a hydrogen-releasing filler as described in any one of claims 1 to 7, the hydrogen-releasing filler being dispersed in the binder.

11. A conductive adhesive, characterized in that, It includes a rubber matrix, a conductive agent, and a hydrogen-releasing filler as described in any one of claims 1 to 7, wherein the conductive agent and the hydrogen-releasing filler are dispersed in the rubber matrix.

12. A printing paste, characterized in that, The mixture includes conductive filler, solvent, binder, and hydrogen-releasing filler as described in any one of claims 1 to 7, wherein the conductive filler, the binder, and the hydrogen-releasing filler are mixed and dispersed in the solvent.

13. A photovoltaic module, characterized in that, The photovoltaic module includes a first encapsulation panel, a second encapsulation panel, and a solar cell disposed between the first encapsulation panel and the second encapsulation panel; the photovoltaic module also includes one or more of the encapsulating film of claim 8 or 9, the solder ribbon of claim 10, the conductive adhesive of claim 11, and the electrode made of the printing paste of claim 12, located between the first encapsulation panel and the second encapsulation panel and disposed on the solar cell.

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