Display panel, preparation method thereof and display device

Abstract

The invention provides a display panel and a preparation method thereof and a display device, and relates to the technical field of display, the display panel comprises a substrate, a pixel definition layer, an isolation structure, a plurality of light emitting units, a first inorganic packaging layer and an organic filling layer, the pixel definition layer is arranged on one side of the substrate and is provided with a plurality of pixel openings, and the isolation structure is arranged on the first inorganic packaging layer; the isolation structures are arranged on the side, away from the substrate, of the pixel definition layer and define a plurality of isolation openings, the isolation openings are communicated with the corresponding pixel openings, the light-emitting units are arranged in the corresponding pixel openings, the first inorganic packaging layer covers the light-emitting units, the first inorganic packaging layer comprises a packaging main body and an extension part, and the extension part is arranged in the packaging main body. The packaging main body is arranged in the isolation opening and covers the light emitting unit, the extension part is arranged on the side, away from the substrate, of the isolation structure, a packaging gap is formed between the extension part and the isolation structure, the organic filling layer is arranged in the packaging gap, and the use performance of the display device can be improved through the display panel provided by the invention.

Description

Technical Field

[0001] This application belongs to the field of display technology, and more specifically, relates to a display panel, a method for manufacturing the same, and a display device. Background Technology

[0002] Currently, flat panel displays have advantages such as high image quality, energy saving, small thickness and wide application range, and are widely used in various consumer electronic products such as mobile phones, televisions, laptops, and desktop computers.

[0003] In traditional display panel manufacturing, a fine metal mask (FMM) is typically used to pattern the light-emitting pixels. FMM technology is mature and has extensive mass production experience. However, FMM technology also suffers from limitations in precision, high development costs, and long development cycles. Fine metal mask-less technology eliminates the limitations of traditional OLED processes on display size, resolution, and other screen performance aspects, offering advantages such as high performance, full-size display, and agile delivery. Patents CN118251982A, CN116648095A, CN117062489A, CN118742138A, CN118678783A, CN118660598A, CN118675450A, CN118824188A, and CN118781966A describe relevant content regarding fine metal mask-less technology and are provided for reference.

[0004] However, the performance and manufacturing process of current display devices need to be improved. Summary of the Invention

[0005] The purpose of this application is to provide a display panel, a method for manufacturing the same, and a display device, so as to improve the performance of the display device.

[0006] To achieve the above objectives, the technical solution adopted in this application is as follows: In a first aspect, this application provides a display panel, which includes a substrate, a pixel definition layer, an isolation structure, a plurality of light-emitting units, a first inorganic encapsulation layer, and an organic filler layer. The pixel definition layer is disposed on one side of the substrate and has a plurality of pixel openings. The isolation structure is disposed on the side of the pixel definition layer away from the substrate and forms a plurality of isolation openings. The isolation openings communicate with the corresponding pixel openings. The light-emitting units are disposed within the corresponding pixel openings. The first inorganic encapsulation layer covers the light-emitting units and includes an encapsulation body and an extension. The encapsulation body is disposed within the isolation openings and covers the light-emitting units. The extension is disposed on the side of the isolation structure away from the substrate and has an encapsulation gap between the extension and the isolation structure. The organic filler layer is disposed within the encapsulation gap.

[0007] Through the above technical solution, the organic filler layer is disposed within the encapsulation gap, which can at least to a certain extent prevent the subsequent etching solution from entering the encapsulation gap. Furthermore, the organic filler layer can support the extension portion, improving its stability. Therefore, the organic filler layer helps improve encapsulation reliability, prevents damage to the light-emitting unit, thereby improving the light-emitting effect and ultimately enhancing performance.

[0008] Therefore, the display panel provided in this application can improve the performance of the display device.

[0009] In some embodiments, the material of the organic filler layer includes photosensitive polyimide, or the material of the organic filler layer includes organosilicon.

[0010] In this way, the display panel provided by this application facilitates the placement of an organic filler layer within the encapsulation gap between the extension and the isolation structure, thereby filling the encapsulation gap between the extension and the isolation structure using the organic filler layer.

[0011] In some embodiments, the display panel provided in this application further includes a sealing layer, which is located on the side of the extension and the isolation structure away from the substrate. The side of the encapsulation gap away from the encapsulation body has a gap opening, and the sealing layer blocks the gap opening of the encapsulation gap.

[0012] It is understood that the display panel provided in this application can use a sealing layer to seal the gap opening of the encapsulation gap, which helps to prevent subsequent etching solutions from entering the encapsulation gap, thereby improving encapsulation reliability. This can prevent damage to the light-emitting unit, thereby improving the light-emitting effect and ultimately improving the performance.

[0013] In some implementations, the sealing layer is made of inorganic materials. This allows the sealing layer to effectively prevent subsequent etching solutions from entering the encapsulation gaps.

[0014] In some implementations, the inorganic material of the sealing layer is different from the inorganic material of the first inorganic encapsulation layer.

[0015] In this way, the sealing layer can have a different etching selectivity ratio than the first inorganic encapsulation layer, which can help avoid over-etching the first inorganic encapsulation layer when preparing the sealing layer.

[0016] Optionally, the inorganic material of the sealing layer includes one of silicon nitride, silicon oxide, and silicon oxynitride, and the inorganic material of the first inorganic encapsulation layer includes another of silicon nitride, silicon oxide, and silicon oxynitride.

[0017] In some implementations, the sealing layer encloses a gap that exposes at least a portion of the packaged body.

[0018] In this way, the sealing layer can expose at least part of the encapsulation body through the gap, which can reduce the pressure on the encapsulation body, thereby reducing the pressure on the light-emitting unit, which is beneficial to reducing the impact on the light-emitting unit, and thus improving the light-emitting performance of the light-emitting unit.

[0019] In some embodiments, the orthographic projection of the sealing layer on the substrate lies within the orthographic projection of the side surface of the isolation structure facing away from the substrate on the substrate.

[0020] In this way, the isolation structure can support the sealing layer through the extension, and the isolation structure can bear the pressure of the sealing layer. This helps to prevent the sealing layer from applying pressure to the light-emitting unit through the encapsulation body, thereby reducing the impact on the light-emitting unit and improving the light-emitting performance of the light-emitting unit.

[0021] In some embodiments, the edge of the isolation structure facing away from the substrate near the isolation opening is the first edge, and the edge of the sealing layer facing the substrate near the isolation opening is the second edge. The orthographic projection of the second edge on the substrate is located on the side of the first edge facing the isolation opening.

[0022] Optionally, the orthographic projection of the side surface of the isolation structure facing away from the substrate onto the substrate lies within the orthographic projection of the sealing layer onto the substrate.

[0023] In this way, the sealing layer can increase the bonding area with the extension, thereby increasing the path for water, oxygen, and subsequent etching solutions to penetrate, which is beneficial to improving the reliability of the packaging and thus improving the light-emitting performance of the light-emitting unit.

[0024] In some embodiments, the first inorganic encapsulation layer includes a plurality of encapsulation portions, each encapsulating portion covering a corresponding light-emitting unit. Each encapsulation portion includes an encapsulation body and an extension portion, the extension portion being connected to the encapsulation body. The organic filling layer includes a first filling portion and a second filling portion. The first filling portion is disposed within the encapsulation gap between the extension portion of one of the two adjacent encapsulation portions and the isolation structure, and the second filling portion is disposed within the encapsulation gap between the extension portion of the other of the two adjacent encapsulation portions and the isolation structure.

[0025] In this way, the display panel provided by this application can use the first filling part and the second filling part to fill the encapsulation gap between the extension of two adjacent encapsulation parts and the isolation structure, and the organic filling layer can use the first filling part and the second filling part to fill the encapsulation gap between the extension of two adjacent encapsulation parts and the isolation structure, respectively.

[0026] Optionally, the orthographic projections of the first filling portion and the second filling portion on the substrate are spaced apart. This allows the first and second filling portions to be fabricated separately or simultaneously.

[0027] Optionally, the display panel provided in this application further includes a sealing layer. The sealing layer is located on the side of the extension and the isolation structure away from the substrate. The packaging gap has a gap opening on the side away from the packaging body. The sealing layer includes a first sealing portion and a second sealing portion. The first sealing portion blocks the gap opening of the packaging gap between the extension of one of the two adjacent packaging portions and the isolation structure, and the second sealing portion blocks the gap opening of the packaging gap between the extension of the other of the two adjacent packaging portions and the isolation structure. In this way, the display panel provided in this application can use the sealing layer to block the gap opening of the packaging gap between the extension of two adjacent packaging portions and the isolation structure, which helps to prevent the subsequent etching solution from entering the packaging gap, thereby improving packaging reliability, preventing damage to the light-emitting unit, improving the light-emitting effect, and ultimately improving the performance.

[0028] Optionally, the orthographic projection of the first sealing portion on the substrate overlaps with the orthographic projection of the second sealing portion on the substrate. This allows the first and second sealing portions to overlap, increasing the pathways for water, oxygen, and subsequent etching solutions to penetrate, thereby improving the packaging reliability of the first inorganic encapsulation layer. Optionally, the orthographic projection of the first filling portion on the substrate lies within the orthographic projection of the first sealing portion on the substrate, and / or, the orthographic projection of the second filling portion on the substrate lies within the orthographic projection of the second sealing portion on the substrate. In this way, the first sealing portion can apply pressure to the first filling portion through its extension, compressing the first filling portion and helping to prevent the first filling portion from absorbing moisture or subsequent etching solutions. Furthermore, the second sealing portion can apply pressure to the second filling portion through its extension, compressing the second filling portion and helping to prevent the second filling portion from absorbing moisture or subsequent etching solutions.

[0029] In some embodiments, the side surface of the isolation structure facing away from the substrate includes a first region, a second region, and a third region, with the second region located between the first and third regions. The first filling portion is attached to the first region on the side facing the substrate, and the second filling portion is attached to the third region on the side facing the substrate.

[0030] In this way, the first sealing part and the second sealing part can be combined with the isolation structure in the second region, which makes it easy for the first sealing part to block the gap opening of the packaging gap between the extension of one of the two adjacent packaging parts and the isolation structure, and also makes it easy for the second sealing part to block the gap opening of the packaging gap between the extension of the other of the two adjacent packaging parts and the isolation structure.

[0031] In some embodiments, the plurality of light-emitting units include a first light-emitting unit, a second light-emitting unit, and a third light-emitting unit, and the plurality of encapsulation portions include a first encapsulation portion, a second encapsulation portion, and a third encapsulation portion. The first encapsulation portion covers the first light-emitting unit, the second encapsulation portion covers the second light-emitting unit, and the third encapsulation portion covers the third light-emitting unit. A first filling portion is disposed in the encapsulation gap between the extension portion of the first encapsulation portion and the isolation structure.

[0032] In this way, the first filling part can protect the first light-emitting unit, which can help prevent water, oxygen or subsequent etching solution from entering the first light-emitting unit.

[0033] Optionally, the second filling portion is disposed within the encapsulation gap between the extension of the second encapsulation portion and the isolation structure.

[0034] In this way, the second filling part can protect the second light-emitting unit, which can help prevent water, oxygen or subsequent etching solution from entering the second light-emitting unit.

[0035] Secondly, this application provides a method for manufacturing a display panel, the method comprising: Provide substrates; A pixel-defining material layer is fabricated on one side of the substrate. An isolation structure is fabricated on the side of the pixel definition material layer away from the substrate, and the isolation structure encloses and forms multiple isolation openings; The graphical pixel definition material layer forms multiple pixel openings, and the openings are isolated from the corresponding pixel openings; A light-emitting unit, a first inorganic encapsulation layer, and an organic filler layer are prepared. At least a portion of the light-emitting unit is disposed within a pixel opening. The first inorganic encapsulation layer covers the light-emitting unit. The first inorganic encapsulation layer includes an encapsulation body and an extension. The encapsulation body is disposed within an isolation opening and covers the light-emitting unit. The extension is disposed on the side of the isolation structure away from the substrate and has an encapsulation gap with the isolation structure. The organic filler layer is disposed within the encapsulation gap.

[0036] Through the above technical solution, the display panel fabrication method provided in this application can place an organic filling layer within the encapsulation gap, thereby at least to a certain extent preventing subsequent etching solutions from entering the encapsulation gap. Furthermore, the organic filling layer can support the extension portion, thus improving its stability. Therefore, the organic filling layer is beneficial for improving encapsulation reliability, preventing damage to the light-emitting unit, thereby improving the light-emitting effect and ultimately enhancing performance.

[0037] Therefore, the method for manufacturing the display panel provided in this application can improve the performance of the display device.

[0038] In some embodiments, the fabrication of the light-emitting unit, the first inorganic encapsulation layer, and the organic filler layer includes: Fabrication of light-emitting units; Preparation of the first inorganic encapsulation layer; An organic filler layer is prepared, wherein the material of the organic filler layer includes organic materials.

[0039] In this way, the method for fabricating the display panel provided in this application can prepare the organic filling layer after preparing the first inorganic encapsulation layer without affecting the fabrication process of the light-emitting unit.

[0040] Optionally, the preparation of the organic filler layer includes: Preparation of organic material layers; A patterned organic material layer is formed to create an organic filler layer; The organic filler layer is cured.

[0041] Optionally, after preparing the organic filler layer, the method for preparing the display panel provided in this application further includes: A sealing layer is prepared to seal the gap opening of the encapsulation gap, the gap opening being located on the side of the encapsulation gap away from the encapsulation body.

[0042] In some embodiments, the fabrication of the light-emitting unit, the first inorganic encapsulation layer, and the organic filler layer includes: Fabrication of the first light-emitting unit; A first encapsulation portion is prepared, and the first encapsulation portion covers the first light-emitting unit; A first filling portion is prepared, which is disposed in the encapsulation gap between the extension of the first encapsulation portion and the isolation structure.

[0043] In this way, the method for manufacturing the display panel provided in this application can use the first encapsulation part to encapsulate the first light-emitting unit, and can also use the first filling part to fill the encapsulation gap between the extension of the first encapsulation part and the isolation structure. The first filling part can protect the first light-emitting unit, which can help prevent water, oxygen or subsequent etching solution from entering the first light-emitting unit.

[0044] Optionally, preparing the first filling portion includes: Preparation of the first organic material layer; The first organic material layer is patterned to form the first filling portion; The first filling part is cured.

[0045] Optionally, after preparing the first filling portion, the method for preparing the display panel provided in this application further includes: A first sealing portion is prepared, which seals the gap opening of the encapsulation gap between the extension of the first encapsulation portion and the isolation structure.

[0046] Optionally, after fabricating the first filling portion, fabricating the light-emitting unit, the first inorganic encapsulation layer, and the organic filling layer further includes: Fabrication of a second light-emitting unit; A second encapsulation portion is prepared, which covers the second light-emitting unit; A second filling portion is prepared, which is disposed in the encapsulation gap between the extension of the second encapsulation portion and the isolation structure.

[0047] In this way, the method for manufacturing the display panel provided in this application can encapsulate the second light-emitting unit using the second encapsulation part, and can also fill the encapsulation gap between the extension of the second encapsulation part and the isolation structure using the second filling part. The second filling part can protect the second light-emitting unit, which can help prevent water, oxygen or subsequent etching solutions from entering the second light-emitting unit.

[0048] Optionally, preparing the second filling portion includes: Preparation of a second organic material layer; A second organic material layer is patterned to form a second filling portion; The second filling part is cured.

[0049] Optionally, after preparing the second filling portion, the method for preparing the display panel provided in this application further includes: A second sealing portion is prepared, which seals the gap opening of the encapsulation gap between the extension of the second encapsulation portion and the isolation structure.

[0050] Optionally, after fabricating the second filling portion, fabricating the light-emitting unit, the first inorganic encapsulation layer, and the organic filling layer further includes: Fabrication of the third light-emitting unit; A third encapsulation part is prepared, which covers the third light-emitting unit.

[0051] In this way, the method for manufacturing the display panel provided in this application can encapsulate the third light-emitting unit using the third encapsulation part.

[0052] Thirdly, this application provides a display device comprising a display panel according to any of the above embodiments or a display panel prepared by the preparation method of any of the above embodiments. The display device provided by this application has the same or similar technical effects as the display panel or the preparation method of any of the above embodiments, and will not be described in detail here. Attached Figure Description

[0053] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0054] Figure 1 This is a schematic diagram of the structure of the display panel provided in an embodiment of this application; Figure 2 for Figure 1 A magnified view of a portion of point A in the middle; Figure 3 For along Figure 2 One of the cross-sectional structural diagrams of the CC line; Figure 4 For along Figure 2 Sectional view of the CC line, part two; Figure 5 For along Figure 2 Sectional view of the CC line, Part 3; Figure 6 For along Figure 2 Sectional view of the CC line, Part 4; Figure 7 for Figure 6 A magnified view of a portion of point D; Figure 8 For along Figure 2 Fifth sectional view of the CC line; Figure 9 for Figure 8 One of the magnified views of a section at point E in the middle; Figure 10 for Figure 8 Second magnified view of a section at point E in the middle; Figure 11 This is one of the structural schematic diagrams of the display panel manufacturing process provided in this application; Figure 12 This is the second structural schematic diagram of the display panel manufacturing process provided in this application; Figure 13 This is the third structural schematic diagram of the display panel manufacturing process provided in this application; Figure 14 The fourth schematic diagram of the structure in the display panel manufacturing process provided in this application; Figure 15 This is the fifth structural schematic diagram of the display panel manufacturing process provided in this application; Figure 16 This is the sixth structural schematic diagram of the display panel manufacturing process provided in this application; Figure 17The seventh schematic diagram of the structure in the display panel manufacturing process provided in this application; Figure 18 This is the eighth structural schematic diagram of the display panel manufacturing process provided in this application.

[0055] The following are the labeling elements in the figure: 100 - Display panel; 01 - Encapsulation gap; 011 - Gap opening; 10 - Substrate; 20 - First electrode; 30 - Pixel definition layer; 31 - First sub-layer; 32 - Second sub-layer; 40 - Isolation structure; 41 - Base; 42 - Support; 43 - Eaves; 401 - First isolation opening; 402 - Second isolation opening; 403 - Third isolation opening; 404 - First edge; 50 - Light-emitting layer; 51 - First light-emitting layer; 52 - Second light-emitting layer; 53-Third light-emitting layer; 60-Second electrode; 70-First inorganic encapsulation layer; 701-Encapsulation body; 702-Extension; 703-Notch; 71-First encapsulation part; 72-Second encapsulation part; 73-Third encapsulation part; 80-Organic filling layer; 801-First organic material layer; 802-Second organic material layer; 81-First filling part; 82-Second filling part; 90-Sealing layer; 901-Second edge; 91-First sealing part; 92-Second sealing part. Detailed Implementation

[0056] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0057] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0058] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0059] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0060] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. It should be noted that, unless otherwise specified, different features in the embodiments of this application can be combined with each other.

[0061] For ease of understanding, the accompanying drawings show mutually orthogonal X-axis, Y-axis, and Z-axis. The direction along the X-axis is called the X-direction, the direction along the Y-axis is called the Y-direction, and the direction along the Z-axis is called the Z-direction. The Z-direction is the normal direction relative to the plane containing the X and Y directions. Furthermore, the view of various elements parallel to the plane containing the X and Y directions is called a top view. Alternatively, the planes in the X and Y directions can be planes parallel to the display surface of the display panel 100, and the Z-direction can be a direction parallel to the thickness direction of the display panel 100.

[0062] For certain elements, terms like "above" or "overhead" are sometimes used when describing the position of an element in the Z direction, and "below" or "under" are used when describing the position of an element in the opposite direction. Furthermore, when using terms like "above," "overhead," "below," "under," or "relative" to define the positional relationship between two elements, this includes not only the state where the two elements are directly adjacent, but also the state where the two elements are separated by gaps or other elements. Additionally, terms like "first," "second," and "third" are used only for distinguishing descriptions and should not be interpreted as indicating or implying relative importance.

[0063] Please refer to the following: Figure 1 , Figure 2 and Figure 3 , Figure 1 This is a schematic diagram of the structure of the display panel 100 provided in the embodiments of this application. Figure 2 for Figure 1 A magnified view of a portion of point A in the middle. Figure 3 For along Figure 2 One of the cross-sectional structural diagrams of the CC line. This application embodiment provides a display panel 100, which can be an organic light-emitting diode (OLED). OLED (Emitting Diode) display panel 100 or Micro LED / μLED (Micro Light Emitting Diode) display panel 100.

[0064] The display panel 100 provided in this embodiment further includes a substrate 10, which includes a display area AA and a non-display area NA, with the non-display area NA surrounding at least a portion of the display area AA. The shape of the display area AA of the display panel 100 can be rectangular, or it can be a square, a circle, an ellipse, or other shapes.

[0065] Please continue reading. Figure 3 The display panel 100 provided in this embodiment further includes multiple light-emitting units. These light-emitting units are located on one side of the substrate 10 along its thickness direction, and can be fabricated in batches according to a process flow. For example, the multiple light-emitting units may include a first light-emitting unit, a second light-emitting unit, and a third light-emitting unit, which can emit light of different colors. For example, the first light-emitting unit can emit red light, the second light-emitting unit can emit green light, and the third light-emitting unit can emit blue light.

[0066] It is understood that the first light-emitting unit, the second light-emitting unit, and the third light-emitting unit are sequentially vapor-deposited and patterned. That is, when the display panel 100 provided in this application embodiment is manufactured, the first light-emitting unit can be vapor-deposited and patterned first, the second light-emitting unit can be vapor-deposited and patterned second, and the third light-emitting unit can be vapor-deposited and patterned last.

[0067] In some embodiments, the first light-emitting unit, the second light-emitting unit, and the third light-emitting unit can be patterned using a photomask.

[0068] In some embodiments, the display panel 100 provided in this application further includes a pixel-defined layer (PDL) 30 and an isolation structure 40. The isolation structure 40 and the pixel-defined layer 30 are disposed on the same side of the substrate 10 along the thickness direction, and the isolation structure 40 is disposed on the side of the pixel-defined layer 30 facing away from the substrate 10, and the isolation structure 40 encloses and forms a plurality of isolation openings. The orthographic projection of the light-emitting unit on the substrate 10 can be located within the orthographic projection of the corresponding isolation opening on the substrate 10. Optionally, the pixel-defined layer 30 and the isolation structure 40 can be located in the display area AA. It is understood that the first light-emitting unit, the second light-emitting unit, and the third light-emitting unit can be patterned using the isolation structure 40 instead of a photomask. The pixel-defined layer 30 has a plurality of pixel openings, which communicate with corresponding isolation openings, and at least a portion of the light-emitting unit is disposed within the corresponding pixel opening.

[0069] Multiple isolation openings may include a first isolation opening 401, a second isolation opening 402, and a third isolation opening 403. A first light-emitting unit corresponds to the first isolation opening 401, a second light-emitting unit corresponds to the second isolation opening 402, and a third light-emitting unit corresponds to the third isolation opening 403. Multiple pixel openings may include a first pixel opening, a second pixel opening, and a third pixel opening. The first pixel opening is connected to the first isolation opening 401, the second pixel opening is connected to the second isolation opening 402, and the third pixel opening is connected to the third isolation opening 403. At least a portion of the first light-emitting unit is disposed within the corresponding first pixel opening, at least a portion of the second light-emitting unit is disposed within the corresponding second pixel opening, and at least a portion of the third light-emitting unit is disposed within the corresponding third pixel opening.

[0070] Generally, the area of ​​the orthographic projection of the isolation opening onto the substrate 10 is larger than the area of ​​the orthographic projection of the pixel opening communicating with the isolation opening onto the substrate 10. The orthographic projections of the pixel openings of the light-emitting unit onto the substrate 10 overlap with the orthographic projections of the isolation openings onto the substrate 10. The pixel definition layer 30 is made of an inorganic material; for example, the pixel definition layer 30 is formed using at least one inorganic insulating material selected from silicon nitride (SiNx), silicon oxide (SiOx), and silicon oxynitride (SiON).

[0071] In another embodiment, the isolation structure 40 is disposed within the groove of the pixel definition layer 30. Alternatively, the pixel definition layer 30 may not be provided in the display panel 100, and the isolation structure 40 may be disposed on one side of the substrate 10, with the isolation structure 40 in contact with one side of the substrate 10.

[0072] The display panel 100 provided in this application embodiment further includes a first electrode layer. A portion of the first electrode layer is located between the pixel definition layer 30 and the substrate 10. The first electrode layer includes a plurality of spaced first electrodes 20. The pixel opening is connected to the isolation opening. The pixel opening exposes a portion of the first electrode 20. The light-emitting layer 50 can pass through the pixel opening and connect to the first electrode 20.

[0073] It is understood that the first electrode 20 of the light-emitting unit is located on the side of the pixel definition layer 30 facing the substrate 10. The light-emitting unit includes a light-emitting layer 50 and a second electrode 60 located on the side of the light-emitting layer 50 away from the substrate 10. The light-emitting layer 50 and the second electrode 60 of the light-emitting unit are located in the isolation opening, and the light-emitting layer 50 is located between the first electrode 20 and the second electrode 60.

[0074] Optionally, the first electrode 20 can be an anode, and the second electrode 60 can be a cathode.

[0075] It is understood that the light-emitting layer 50 of the first light-emitting unit is the first light-emitting layer 51, the light-emitting layer 50 of the second light-emitting unit is the second light-emitting layer 52, and the light-emitting layer 50 of the third light-emitting unit is the third light-emitting layer 53.

[0076] The display panel 100 provided in this embodiment further includes a first inorganic encapsulation layer 70. The first inorganic encapsulation layer 70 is disposed on the side of the pixel definition layer 30 away from the substrate 10 and is located on the side of the light-emitting unit away from the substrate 10. The first inorganic encapsulation layer 70 is adjacent to the light-emitting unit. The first inorganic encapsulation layer 70 includes a plurality of encapsulation portions, each encapsulating portion covering a corresponding isolation opening and a light-emitting unit. In other words, the orthographic projection of the isolation opening on the substrate 10 lies within the orthographic projection of the corresponding encapsulation portion on the substrate 10, and the orthographic projection of the light-emitting unit on the substrate 10 lies within the orthographic projection of the corresponding encapsulation portion on the substrate 10.

[0077] The multiple encapsulation portions may include a first encapsulation portion 71, a second encapsulation portion 72, and a third encapsulation portion 73. The first encapsulation portion 71 corresponds to the first light-emitting unit and is also formed by patterning. The second encapsulation portion 72 corresponds to the second light-emitting unit and is also formed by patterning. The third encapsulation portion 73 corresponds to the third light-emitting unit and is also formed by patterning. Optionally, the fabrication order of the first encapsulation portion 71, the second encapsulation portion 72, and the third encapsulation portion 73 is consistent with the fabrication order of the first light-emitting unit, the second light-emitting unit, and the third light-emitting unit.

[0078] It is understandable that the isolation openings and pixel openings corresponding to light-emitting units of different light-emitting colors can be prepared in different processes (for example, the first isolation opening 401 corresponding to the first light-emitting unit and the second isolation opening 402 corresponding to the second light-emitting unit are prepared in different processes). The first inorganic encapsulation layer 70 is usually used to encapsulate the light-emitting unit after it is formed. After the first inorganic encapsulation layer 70 encapsulates the light-emitting unit (e.g., the first light-emitting unit), it then prepares the isolation openings (e.g., the second isolation opening 402 and / or the third isolation opening 403) corresponding to the subsequent light-emitting units.

[0079] When preparing the isolation openings corresponding to the subsequent light-emitting units, it is necessary to use an adhesive layer (e.g., photoresist) to cover the already prepared first inorganic encapsulation layer 70 (e.g., the first encapsulation part 71) in order to pattern the isolation structure 40 to prepare the isolation openings corresponding to the subsequent light-emitting units.

[0080] It should be noted that, in addition to covering the first inorganic encapsulation layer 70 that has already been prepared, the adhesive layer also needs to cover the areas of the isolation structure 40 where no isolation openings are required.

[0081] For example, after the first encapsulation part 71 is prepared and before the second isolation opening 402 is prepared, the first adhesive layer covers the encapsulation part and the isolation structure 40 at the location where the isolation opening does not need to be opened.

[0082] For example, after the first encapsulation portion 71 is fabricated, but before the second isolation opening 402 and the third isolation opening 403 are fabricated, the first adhesive layer covers the first encapsulation portion 71 and the isolation structure 40 at locations where isolation openings are not required. The second isolation opening 402 and the third isolation opening 403 can be fabricated simultaneously.

[0083] For example, after fabricating the first encapsulation portion 71 and the second encapsulation portion 72, and before fabricating the third isolation opening 403, the second adhesive layer covers the first encapsulation portion 71 and the location of the isolation structure 40 where no isolation opening is required. The first isolation opening 401 and the second isolation opening 402 can be fabricated simultaneously. Optionally, the second isolation opening 402 can also be fabricated after the first isolation opening 401.

[0084] The inventor discovered this; please continue reading. Figure 3 The encapsulation portion includes an extension portion 702, which is located on the side of the isolation structure 40 away from the substrate 10. The orthographic projection of the extension portion 702 on the substrate 10 overlaps with the orthographic projection of the isolation structure 40 on the substrate 10. After the light-emitting layer 50 on the side of the extension portion 702 and the isolation structure 40 away from the substrate 10 is etched, an encapsulation gap 01 with a gap opening 011 is formed. In subsequent processes, water, oxygen or etching solution can easily enter between the encapsulation portion and the isolation structure 40 through the encapsulation gap 01, and then enter the light-emitting unit, causing damage to the light-emitting unit and affecting the light-emitting effect.

[0085] To resolve the above technical issues, please refer to [link / reference]. Figure 4 , Figure 4 For along Figure 2 The second cross-sectional view of the CC line shows that the first inorganic encapsulation layer 70 in the display panel 100 provided in this application embodiment includes an encapsulation body 701 and an extension 702. The encapsulation body 701 is disposed in the isolation opening and covers the light-emitting unit. The extension 702 is disposed on the side of the isolation structure 40 away from the substrate 10, and there is an encapsulation gap 01 between the extension 702 and the isolation structure 40.

[0086] The display panel 100 provided in this application embodiment also includes an organic filler layer 80, which is disposed within the encapsulation gap 01.

[0087] Through the above technical solution, the display panel 100 provided in this application embodiment has an organic filling layer 80 disposed within the encapsulation gap 01, which can at least to a certain extent prevent the subsequent etching solution from entering the encapsulation gap 01. Furthermore, the organic filling layer 80 can support the extension 702, improving the stability of the extension 702. Therefore, the organic filling layer 80 helps improve encapsulation reliability, prevents damage to the light-emitting unit, thereby improving the light-emitting effect and ultimately enhancing performance.

[0088] Therefore, the display panel 100 provided in this application embodiment can improve the performance of the display device.

[0089] Optionally, the organic filler layer 80 may be made of photosensitive polyimide (PSPI).

[0090] Optionally, the material of the organic filler layer 80 includes silicone.

[0091] It is understood that the material of the organic filler layer 80 can be the same as the material of the planarization layer. In this way, the display panel 100 provided in this application embodiment can utilize the material of the planarization layer to prepare the organic filler layer 80, which is beneficial to the preparation of the display panel 100.

[0092] Furthermore, the organic filler layer 80 can have good flowability, allowing it to enter the encapsulation gap 01 between the extension 702 and the isolation structure 40. Therefore, the display panel 100 provided in this embodiment facilitates the placement of the organic filler layer 80 within the encapsulation gap 01 between the extension 702 and the isolation structure 40, thereby filling the encapsulation gap 01 between the extension 702 and the isolation structure 40 with the organic filler layer 80.

[0093] Please refer to the following: Figure 5 and Figure 6 , Figure 5 For along Figure 2 The third sectional view of the CC line. Figure 6 For along Figure 2 Fourth cross-sectional view of the CC line. In some embodiments, the display panel 100 provided in this application further includes a sealing layer 90. The sealing layer 90 is located on the side of the extension 702 and the isolation structure 40 away from the substrate 10. The packaging gap 01 has a gap opening 011 on the side away from the packaging body 701. The sealing layer 90 blocks the gap opening 011 of the packaging gap 01.

[0094] It is understood that the display panel 100 provided in this application embodiment can use the sealing layer 90 to seal the gap opening 011 of the encapsulation gap 01, which helps to prevent water, oxygen, or subsequent etching solutions from entering the encapsulation gap 01, thereby improving encapsulation reliability. This can prevent damage to the light-emitting unit, thereby improving the light-emitting effect and ultimately improving the performance.

[0095] The sealing layer 90 covers the gap opening 011. The sealing layer 90 can be combined with the extension 702 and the side of the isolation structure 40 away from the substrate 10, which helps to improve structural stability and thus improve packaging reliability.

[0096] In some embodiments, the sealing layer 90 is made of inorganic materials. It is understood that inorganic materials have stronger etching resistance than organic materials, and using inorganic materials for the sealing layer 90 can help prevent water, oxygen, or subsequent etching solutions from entering the encapsulation gap 01.

[0097] Optionally, the inorganic material of the sealing layer 90 is different from the inorganic material of the first inorganic encapsulation layer 70.

[0098] In this way, the sealing layer 90 can have different etching selectivity ratios with the first inorganic encapsulation layer 70, which can help avoid over-etching the first inorganic encapsulation layer 70 when preparing the sealing layer 90.

[0099] The inorganic material of the sealing layer 90 includes one of silicon nitride, silicon oxide, and silicon oxynitride, and the inorganic material of the first inorganic encapsulation layer 70 includes another of silicon nitride, silicon oxide, and silicon oxynitride.

[0100] For example, the inorganic material of the sealing layer 90 includes silicon nitride, and the inorganic material of the first inorganic encapsulation layer 70 includes silicon oxide.

[0101] For example, the inorganic material of the sealing layer 90 includes silicon nitride, and the inorganic material of the first inorganic encapsulation layer 70 includes silicon oxynitride.

[0102] For example, the inorganic material of the sealing layer 90 includes silicon oxide, and the inorganic material of the first inorganic encapsulation layer 70 includes silicon nitride.

[0103] For example, the inorganic material of the sealing layer 90 includes silicon oxide, and the inorganic material of the first inorganic encapsulation layer 70 includes silicon oxynitride.

[0104] For example, the inorganic material of the sealing layer 90 includes silicon oxynitride, and the inorganic material of the first inorganic encapsulation layer 70 includes silicon nitride.

[0105] For example, the inorganic material of the sealing layer 90 includes silicon oxynitride, and the inorganic material of the first inorganic encapsulation layer 70 includes silicon oxide.

[0106] In some embodiments, the sealing layer 90 encloses a notch 703, which exposes at least a portion of the encapsulation body 701.

[0107] In this way, the sealing layer 90 can expose at least a portion of the encapsulation body 701 through the notch 703, which can reduce the pressure on the encapsulation body 701, thereby reducing the pressure on the light-emitting unit, which is beneficial to reducing the impact on the light-emitting unit, and thus improving the light-emitting performance of the light-emitting unit.

[0108] Alternatively, the edge of the notch 703 can be a closed ring.

[0109] Please see Figure 5 In some embodiments, the orthographic projection of the sealing layer 90 on the substrate 10 lies within the orthographic projection of the side surface of the isolation structure 40 facing away from the substrate 10 on the substrate 10.

[0110] In this way, the isolation structure 40 can support the sealing layer 90 through the extension 702. The isolation structure 40 can bear the pressure of the sealing layer 90, which helps to prevent the sealing layer 90 from applying pressure to the light-emitting unit through the encapsulation body 701, thereby reducing the impact on the light-emitting unit and improving the light-emitting performance of the light-emitting unit.

[0111] Please see Figure 6 and Figure 7 , Figure 7 for Figure 6 In a partially enlarged view at point D, in some embodiments, the edge of the isolation structure 40 facing away from the substrate 10 near the isolation opening is designated as the first edge 404, and the edge of the sealing layer 90 facing the substrate 10 near the isolation opening is designated as the second edge 901. The orthographic projection of the second edge 901 onto the substrate 10 is located on the side of the first edge 404 facing the isolation opening. This increases the bonding area between the sealing layer 90 and the extension 702, thereby increasing the pathway for water, oxygen, and subsequent etching solutions to penetrate, which improves packaging reliability and ultimately enhances the light-emitting performance of the light-emitting unit.

[0112] Optionally, the orthographic projection of the side surface of the isolation structure 40 facing away from the substrate 10 onto the substrate 10 lies within the orthographic projection of the sealing layer 90 onto the substrate 10.

[0113] In this way, the sealing layer 90 can further increase the bonding area with the extension 702, thereby increasing the path for water, oxygen and subsequent etching solutions to penetrate, which is beneficial to improving the reliability of the packaging and thus improving the light-emitting performance of the light-emitting unit.

[0114] In some embodiments, the first inorganic encapsulation layer 70 includes a plurality of encapsulation portions, each encapsulating portion covering a corresponding light-emitting unit. Each encapsulation portion includes an encapsulation body 701 and an extension portion 702, the extension portion 702 being connected to the encapsulation body 701. The organic filling layer 80 includes a first filling portion 81 and a second filling portion 82. The first filling portion 81 is disposed within the encapsulation gap 01 between the extension portion 702 of one of the two adjacent encapsulation portions (e.g., the first encapsulation portion 71) and the isolation structure 40. The second filling portion 82 is disposed within the encapsulation gap 01 between the extension portion 702 of the other of the two adjacent encapsulation portions (e.g., the second encapsulation portion 72) and the isolation structure 40.

[0115] In this way, the display panel 100 provided in this application embodiment can use the first filling part 81 and the second filling part 82 to fill the encapsulation gap 01 between the extension 702 of two adjacent encapsulation parts and the isolation structure 40, and the organic filling layer 80 can use the first filling part 81 and the second filling part 82 to fill the encapsulation gap 01 between the extension 702 of two adjacent encapsulation parts and the isolation structure 40, respectively.

[0116] Optionally, the orthographic projection of the first filling portion 81 on the substrate 10 and the orthographic projection of the second filling portion 82 on the substrate 10 are spaced apart. In this way, the first filling portion 81 and the second filling portion 82 can be prepared separately or simultaneously, thereby allowing for the selection of a suitable preparation method as needed, which facilitates the preparation of the display panel 100.

[0117] In some embodiments, the sealing layer 90 includes a first sealing portion 91 and a second sealing portion 92. The first sealing portion 91 blocks the gap opening 011 of the encapsulation gap 01 between the extension 702 of one of the two adjacent encapsulation portions and the isolation structure 40, and the second sealing portion 92 blocks the gap opening 011 of the encapsulation gap 01 between the extension 702 of the other of the two adjacent encapsulation portions and the isolation structure 40.

[0118] In this way, the display panel 100 provided in this application embodiment can use the sealing layer 90 to seal the gap opening 011 of the encapsulation gap 01 between the extension 702 of two adjacent encapsulation portions and the isolation structure 40, which helps to prevent the subsequent etching solution from entering the encapsulation gap 01, thereby improving the encapsulation reliability, preventing damage to the light-emitting unit, thereby improving the light-emitting effect, and further improving the performance.

[0119] Please continue reading. Figure 5 and Figure 6 Optionally, the orthographic projections of the first sealing portion 91 and the second sealing portion 92 on the substrate 10 are spaced apart. In this way, the first sealing portion 91 and the second sealing portion 92 do not interfere with each other, which facilitates the fabrication process and thus makes it easier to fabricate the sealing layer 90.

[0120] Please see Figure 8 , Figure 8 For along Figure 2 Optionally, in the fifth cross-sectional view of the CC line, the orthographic projection of the first sealing portion 91 on the substrate 10 overlaps with the orthographic projection of the second sealing portion 92 on the substrate 10.

[0121] In this way, the first sealing part 91 can overlap with the second sealing part 92, which helps to increase the path for water, oxygen and subsequent etching solutions to penetrate, thereby improving the packaging reliability of the first inorganic encapsulation layer 70.

[0122] Optionally, the orthographic projection of the first filling portion 81 on the substrate 10 lies within the orthographic projection of the first sealing portion 91 on the substrate 10. In this way, the first sealing portion 91 can apply pressure to the first filling portion 81 through the extension portion 702, which can compress the first filling portion 81 and help prevent the first filling portion 81 from absorbing moisture or subsequent etching solutions.

[0123] Optionally, the orthographic projection of the second filling portion 82 on the substrate 10 is located within the orthographic projection of the second sealing portion 92 on the substrate 10.

[0124] In this way, the second sealing part 92 can apply pressure to the second filling part 82 through the extension part 702, which can compress the second filling part 82 and help prevent the second filling part 82 from absorbing moisture or subsequent etching solution.

[0125] Optionally, the orthographic projection of the first filling portion 81 on the substrate 10 is located within the orthographic projection of the first sealing portion 91 on the substrate 10, and the orthographic projection of the second filling portion 82 on the substrate 10 is located within the orthographic projection of the second sealing portion 92 on the substrate 10.

[0126] In some embodiments, the isolation structure 40 includes a first region, a second region, and a third region on the side surface away from the substrate 10, with the second region located between the first region and the third region. The first filling portion 81 is attached to the first region on the side facing the substrate 10, and the second filling portion 82 is attached to the third region on the side facing the substrate 10.

[0127] In this way, the first sealing part 91 and the second sealing part 92 can be combined with the isolation structure 40 in the second region, which makes it easier for the first sealing part 91 to block the gap opening 011 of the encapsulation gap 01 between the extension 702 of one of the two adjacent encapsulation parts and the isolation structure 40, and also makes it easier for the second sealing part 92 to block the gap opening 011 of the encapsulation gap 01 between the extension 702 of the other of the two adjacent encapsulation parts and the isolation structure 40.

[0128] The orthographic projection of the overlapping portion of the first sealing portion 91 and the second sealing portion 92 on the substrate 10 is located within the orthographic projection of the second region on the substrate 10.

[0129] Please refer to the following: Figure 4 , Figure 5 and Figure 6 In some embodiments, the plurality of light-emitting units include a first light-emitting unit, a second light-emitting unit, and a third light-emitting unit, and the plurality of encapsulation portions include a first encapsulation portion 71, a second encapsulation portion 72, and a third encapsulation portion 73. The first encapsulation portion 71 covers the first light-emitting unit, the second encapsulation portion 72 covers the second light-emitting unit, and the third encapsulation portion 73 covers the third light-emitting unit. The first filling portion 81 is disposed in the encapsulation gap 01 between the extension portion 702 of the first encapsulation portion 71 and the isolation structure 40.

[0130] In this way, the first filling part 81 can protect the first light-emitting unit, which can help prevent water, oxygen or subsequent etching solution from entering the first light-emitting unit, thereby improving the light-emitting effect of the first light-emitting unit.

[0131] Optionally, the second filling portion 82 is disposed within the encapsulation gap 01 between the extension 702 of the second encapsulation portion 72 and the isolation structure 40, thereby improving the luminous effect of the first light-emitting unit.

[0132] In this way, the second filling part 82 can protect the second light-emitting unit, which can help prevent water, oxygen or subsequent etching solution from entering the second light-emitting unit, thereby improving the light-emitting effect of the second light-emitting unit.

[0133] Please continue reading. Figure 7 In some embodiments, the isolation structure 40 includes a support portion 42 and an eaves portion 43. The eaves portion 43 is located on the side of the support portion 42 facing away from the substrate 10. The orthographic projection of the support portion 42 on the substrate 10 lies within the orthographic projection of the eaves portion 43 on the substrate 10, meaning the width of the eaves portion 43 is greater than the width of the support portion 42. Therefore, the two ends of the eaves portion 43 protrude beyond the sides of the support portion 42, and this shape of the isolation structure 40 is also referred to as a cantilever shape. The support portion 42 and the eaves portion 43 are made of different materials, and the etching rate of the eaves portion 43 is lower than that of the support portion 42. The support portion 42 is made of a conductive material, specifically including at least one of aluminum (Al), aluminum alloys, and aluminum alloys including at least one of aluminum-neodymium alloy (AlNd), aluminum-yttrium alloy (AlY), or aluminum-silicon alloy (AlSi). The eaves 43 can be a single-layer structure or a multi-layer structure. If the eaves 43 is a single-layer structure, the material of the eaves 43 can include at least one of titanium, titanium nitride, molybdenum, tungsten, molybdenum-tungsten alloy or molybdenum-niobium alloy.

[0134] Please see Figure 9 , Figure 9 for Figure 8 One of the magnified partial views at point E shows that, in the case where the eaves 43 is a multi-layered structure, one layer of the eaves 43 is made of at least one of titanium, titanium nitride, molybdenum, tungsten, molybdenum-tungsten alloy, or molybdenum-niobium alloy, and the other layer of the eaves 43 may be made of conductive oxide or inorganic insulating material, such as indium tin oxide (ITO) or indium zinc oxide (IZO).

[0135] Please continue reading. Figure 9 Optionally, the isolation structure 40 further includes a base portion 41, with a support portion 42 located on the side of the base portion 41 facing away from the substrate 10. The orthographic projection of the support portion 42 on the substrate 10 lies within the orthographic projection of the base portion 41 on the substrate 10, and the orthographic projection of the base portion 41 on the substrate 10 lies within the orthographic projection of the eaves portion 43 on the substrate 10. Optionally, the base portion 41 protrudes relative to the support portion 42 in the direction toward the isolation opening. The material of the base portion 41 may include at least one of molybdenum (Mo), titanium (Ti), titanium nitride (TiN), molybdenum-tungsten alloy (MoW), or molybdenum-niobium alloy (MoNb). It is understood that the isolation structure 40 is used to connect with the second electrode 60 to electrically conduct the second electrode 60.

[0136] The first, second, and third light-emitting units each include a first electrode 20, a light-emitting layer 50, and a second electrode 60 stacked together. The first electrode 20 is disposed on the substrate 10. A pixel definition layer 30 covers the end of the first electrode 20, and a pixel opening is provided on the pixel definition layer 30, through which the first electrode 20 is exposed. The light-emitting layers 50 of the first, second, and third light-emitting units cover the sidewall of the pixel opening of the pixel definition layer 30 and the side of the pixel definition layer 30 facing away from the substrate 10. Each light-emitting layer 50 is located within the pixel opening and is in contact with the first electrode 20.

[0137] The second electrodes 60 of the first, second, and third light-emitting units respectively cover the corresponding light-emitting layers 50. The second electrodes 60 are electrically connected to the isolation structure 40. For example, the second electrodes 60 are connected to the support portion 42 of the isolation structure 40, and / or the second electrodes 60 are connected to the base portion 41 of the isolation structure 40.

[0138] In this design, the first electrode 20 can be an anode, and the second electrode 60 can be a cathode. The first electrode 20 of each light-emitting unit can be connected to the pixel circuit through a via, so that the pixel circuit drives the light-emitting unit to emit light.

[0139] The first electrode 20 may include a multilayer structure, such as a reflective layer and a pair of conductive oxide layers covering the upper and lower surfaces of the reflective layer, respectively. The reflective layer can be formed, for example, using silver, a metallic material with excellent light reflectivity. Each conductive oxide layer can be formed, for example, from a transparent conductive oxide such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), or IGZO (Indium Gallium Zinc Oxide). The second electrode 60 is formed, for example, from a metallic material such as an alloy of magnesium and silver (MgAg).

[0140] The light-emitting layer 50 of at least one of the first, second, and third light-emitting units includes a hole injection layer HIL, a hole transport layer HTL, an electron blocking layer EBL, a light-emitting material layer EML, a hole blocking layer HBL, an electron transport layer ETL, and an electron injection layer EIL stacked along a direction away from the substrate 10 (i.e., the Z direction). The light-emitting layer 50 may include a single light-emitting material layer EML, or a stacked light-emitting layer 50 including multiple light-emitting material layers EML.

[0141] In order for the light-emitting layer 50 to emit light, a pixel voltage is provided to the first electrode 20 and a common voltage is provided to the second electrode 60, forming a potential difference between the first electrode 20 and the second electrode 60, causing the light-emitting layer 50 disposed between the first electrode 20 and the second electrode 60 to emit light. In one embodiment, if a potential difference is formed between the first electrode 20 and the second electrode 60 of the first light-emitting unit, the light-emitting material layer EML of the light-emitting layer 50 emits blue light; if a potential difference is formed between the first electrode 20 and the second electrode 60 of the second light-emitting unit, the light-emitting material layer EML of the light-emitting layer 50 emits green light; and if a potential difference is formed between the first electrode 20 and the second electrode 60 of the third light-emitting unit, the light-emitting material layer EML of the light-emitting layer 50 emits red light.

[0142] In this configuration, the pixel voltage of the first electrode 20 is provided by the pixel circuit, and the common voltage of the second electrode 60 is provided by the isolation structure 40. Specifically, the second electrode 60 is electrically connected to the isolation structure 40, and the common voltage is supplied to the second electrode 60 by providing the isolation structure 40. That is, the isolation structure 40 has the function of supplying a common voltage to the second electrode 60.

[0143] Optionally, the display panel 100 provided in this application embodiment includes pixel circuits, and one pixel circuit drives at least one light-emitting unit to emit light. For example, the display area AA includes a normal display area and a light-transmitting display area. The light-transmitting display area is a display area set with light transmission performance corresponding to a sensor, and the normal display area is a display area not set with a corresponding sensor. In the normal display area, one pixel circuit drives one light-emitting unit to emit light, and in the light-transmitting display area, one pixel circuit drives one or more light-emitting units to emit light.

[0144] Optionally, the substrate 10 includes a pixel circuit layer and a planarization layer. The pixel circuit layer includes pixel circuits for driving light-emitting units to emit light. A transistor in the pixel circuit is illustrated. A via is provided in the planarization layer, and the first electrode 20 is electrically connected to the transistor in the pixel circuit layer through the via. Furthermore, the pixel circuit layer also includes at least one insulating layer, which may include at least one of inorganic and organic layers. Additionally, the substrate 10 includes scan lines providing a scan signal (Scan) and data lines providing a data signal (Data) to the pixel circuit.

[0145] The pixel circuit includes a driving transistor T and a data transistor T. The source of the data transistor T is connected to the data line that provides the data signal Data, the gate of the data transistor T is connected to the scan line that provides the scan signal Scan, the drain of the data transistor T is connected to the gate of the driving transistor T, the two ends of the storage capacitor C are connected to the gate and the source of the driving transistor T respectively, and the drain of the driving transistor T is connected to the light-emitting unit.

[0146] Please continue reading. Figure 9 Optionally, the encapsulation part includes an encapsulation body 701 and an extension 702 connected to each other. The encapsulation body 701 is located inside the isolation opening and is disposed on the side of the light-emitting unit away from the substrate 10. The extension 702 is located on the side of the isolation structure facing the isolation opening. The side surface of the encapsulation body 701 away from the substrate is not connected to the side surface of the extension 702 away from the isolation structure. That is, an open space is formed between the side surface of the encapsulation body 701 away from the substrate and the side surface of the extension 702 away from the isolation structure.

[0147] Please see Figure 10 , Figure 10 for Figure 8 In the second enlarged view at point E, optionally, the surface of the package body 701 facing away from the substrate and the surface of the extension 702 facing away from the isolation structure are at least partially connected to each other to enclose and form a closed gap space.

[0148] Please continue reading. Figure 9 and Figure 10In some embodiments, the pixel definition layer 30 includes a plurality of sub-layers, the plurality of sub-layers including a first sub-layer 31 and a second sub-layer 32 stacked sequentially along the direction away from the substrate, that is, the pixel definition layer 30 may adopt a dual-layer design.

[0149] For example, the first sublayer 31 has better film-forming properties than the second sublayer 32. That is, under the same thickness conditions, the first sublayer 31 can better cover the stepped structure formed by the first electrode than the second sublayer 32, without producing cracks. Conversely, to obtain the same stepped coverage effect, the thickness of the first sublayer 31 needs to be thinner than that of the second sublayer 32. That is, the thickness requirement for the first sublayer 31 is relatively low, which is conducive to product thinning. In addition, the better film-forming properties are reflected in the better coverage of the film formed, which is denser and more conducive to the isolation of water vapor.

[0150] For example, the second sublayer 32 has better etching resistance than the first sublayer 31. Since the side of the pixel definition layer 30 facing away from the substrate will be etched during the display panel manufacturing process, by selecting a material with stronger etching resistance as the second sublayer 32, the etching resistance of the pixel definition layer 30 can be improved, further enhancing the reliability of the display panel.

[0151] For example, the first sublayer 31 and the second sublayer 32 are made of different materials. For instance, the first sublayer 31 is made of silicon nitride, and the second sublayer 32 is made of silicon oxide.

[0152] For example, the thickness of the first sublayer 31 is greater than or equal to 1000 micrometers and less than or equal to 5000 micrometers. For example, the thickness of the first sublayer 31 is 1000 micrometers, 2000 micrometers, 3000 micrometers, 4000 micrometers, 5000 micrometers, etc.

[0153] For example, the thickness of the second sublayer 32 is greater than or equal to 500 micrometers and less than or equal to 3000 micrometers. For instance, the thickness of the second sublayer 32 is 500 micrometers, 1000 micrometers, 2000 micrometers, 3000 micrometers, etc.

[0154] In some embodiments, the display panel 100 provided in this application may further include an organic encapsulation layer and a second inorganic encapsulation layer. The organic encapsulation layer is located on the side of the first inorganic encapsulation layer 70 that is away from the substrate 10, and the second inorganic encapsulation layer is located on the side of the organic encapsulation layer that is away from the substrate 10.

[0155] Optionally, the first inorganic encapsulation layer 70 can be an inorganic encapsulation layer formed by chemical vapor deposition (CVD) and patterning.

[0156] Alternatively, the organic encapsulation layer can be an organic encapsulation layer made by inkjet printing (IJP).

[0157] Optionally, the second inorganic encapsulation layer can be an inorganic encapsulation layer formed by chemical vapor deposition (CVD).

[0158] The materials of the first inorganic encapsulation layer 70 and the second inorganic encapsulation layer include at least one of silicon nitride (SiN), silicon oxide (SiO), and silicon oxynitride (SiON). The organic encapsulation layer is an organic insulating material, such as epoxy resin, acrylic resin, or other resin materials. The first inorganic encapsulation layer 70 and the second inorganic encapsulation layer are continuously disposed at least over the entire display area AA, with a portion of them also disposed in the bezel area NA.

[0159] Optionally, the display panel 100 provided in this embodiment may further include other film layers located on the side of the second inorganic encapsulation layer facing away from the substrate 10. These other film layers may include at least one layer such as a touch layer, a polarizer, a color filter substrate, or a protective cover. These film layers may also be bonded to the display panel 100 via an adhesive layer such as optically clear adhesive (OCA).

[0160] Please refer to the following: Figure 4 , Figure 5 , Figure 11 , Figure 12 , Figure 13 , Figure 14 , Figure 15 , Figure 16 , Figure 17 , Figure 18 , Figure 11 This is one of the structural schematic diagrams provided in this application for the manufacturing process of the display panel. Figure 12 This is the second structural schematic diagram of the display panel manufacturing process provided in this application. Figure 13 This is the third structural schematic diagram of the display panel manufacturing process provided in this application. Figure 14 This is the fourth structural schematic diagram of the display panel manufacturing process provided in this application. Figure 15 This is the fifth structural schematic diagram of the display panel manufacturing process provided in this application. Figure 16 This is the sixth structural schematic diagram of the display panel manufacturing process provided in this application. Figure 17 The seventh schematic diagram of the display panel manufacturing process provided in this application. Figure 18 This is the eighth structural schematic diagram of the display panel manufacturing process provided in this application.

[0161] This application embodiment also provides a method for manufacturing a display panel 100, the method comprising: S100, provides a substrate 10; S200, a pixel definition material layer is prepared on one side of the substrate 10; S300, an isolation structure 40 is prepared on the side of the pixel definition material layer away from the substrate 10, and the isolation structure 40 encloses and forms a plurality of isolation openings; S400, a graphical pixel-defined material layer forms multiple pixel openings, and the isolated openings are connected to the corresponding pixel openings; S500, a light-emitting unit, a first inorganic encapsulation layer 70, and an organic filling layer 80 are prepared. At least a portion of the light-emitting unit is disposed within a pixel opening. The first inorganic encapsulation layer 70 covers the light-emitting unit. The first inorganic encapsulation layer 70 includes an encapsulation body 701 and an extension 702. The encapsulation body 701 is disposed within an isolation opening and covers the light-emitting unit. The extension 702 is disposed on the side of the isolation structure 40 away from the substrate 10 and has an encapsulation gap 01 between it and the isolation structure 40. The organic filling layer 80 is disposed within the encapsulation gap 01.

[0162] Through the above technical solution, the method for manufacturing the display panel 100 provided in this application embodiment can place the organic filling layer 80 within the encapsulation gap 01, thereby at least to a certain extent preventing the subsequent etching solution from entering the encapsulation gap 01. Furthermore, the organic filling layer 80 can support the extension 702, thereby improving the stability of the extension 702. Therefore, the organic filling layer 80 is beneficial for improving encapsulation reliability, preventing damage to the light-emitting unit, thus improving the light-emitting effect and ultimately enhancing performance.

[0163] Therefore, the method for manufacturing the display panel 100 provided in this application embodiment can improve the performance of the display device.

[0164] In some embodiments, step S500 involves fabricating a light-emitting unit, a first inorganic encapsulation layer 70, and an organic filling layer 80, including: S510, fabrication of light-emitting units; S520, Prepare the first inorganic encapsulation layer 70; S530, Prepare organic filler layer 80, wherein the material of organic filler layer 80 includes organic materials.

[0165] In this way, the method for preparing the display panel 100 provided in this application embodiment can prepare the organic filling layer 80 after preparing the first inorganic encapsulation layer 70, without affecting the preparation process of the light-emitting unit.

[0166] Optionally, in step S530, preparing the organic filler layer 80 includes: S531, Prepare an organic material layer, wherein when preparing the organic material layer, the organic material layer is filled with the encapsulation gap 01 by controlling the formation rate of the organic material layer and other methods; S532, a patterned organic material layer is formed to form an organic filler layer 80, wherein the extension 702 of the first inorganic encapsulation layer 70 can block the organic material layer in the encapsulation gap 01 and can act as a mask, thereby facilitating the preparation of the organic filler layer 80. S533, the organic filler layer 80 is cured, for example, the organic filler layer 80 can be baked.

[0167] In this way, the method for preparing the display panel 100 provided in this application embodiment can prepare the organic filler layer 80 and improve the structural strength of the organic filler layer 80.

[0168] Optionally, after the preparation of the organic filler layer 80, the method for preparing the display panel 100 provided in this application further includes: S600, prepare a sealing layer 90, the sealing layer 90 sealing the gap opening 011 of the encapsulation gap 01, the gap opening 011 being located on the side of the encapsulation gap 01 away from the encapsulation body 701.

[0169] Please see Figure 11 , Figure 12 , Figure 13 and Figure 14 In some embodiments, step S500, fabricating the light-emitting unit, the first inorganic encapsulation layer 70, and the organic filling layer 80, includes: S501, Prepare the first light-emitting unit; S502, Prepare a first encapsulation part 71, the first encapsulation part 71 covers the first light-emitting unit; S503, Prepare a first filling portion 81, which is disposed in the encapsulation gap 01 between the extension 702 of the first encapsulation portion 71 and the isolation structure 40.

[0170] In this way, the method for preparing the display panel 100 provided in this application embodiment can use the first encapsulation part 71 to encapsulate the first light-emitting unit, and can also use the first filling part 81 to fill the encapsulation gap 01 between the extension 702 of the first encapsulation part 71 and the isolation structure 40. The first filling part 81 can protect the first light-emitting unit, which can help prevent water, oxygen or subsequent etching solution from entering the first light-emitting unit.

[0171] Optionally, in step S503, preparing the first filling portion 81 includes: S5031, Prepare the first organic material layer 801, wherein when preparing the first organic material layer 801, the first organic material layer 801 is filled with the encapsulation gap 01 by controlling the formation rate of the first organic material layer 801 and other methods. S5032, pattern the first organic material layer 801 to form the first filling part 81, wherein the extension 702 of the first inorganic encapsulation layer 70 can block the first organic material layer 801 in the encapsulation gap 01, and can act as a mask, thereby facilitating the preparation of the first filling part 81. S5033, the first filling portion 81 is cured, for example, the first filling portion 81 can be baked.

[0172] In this way, the method for preparing the display panel 100 provided in this application embodiment can prepare the first filling part 81 and improve the structural strength of the first filling part 81.

[0173] Please see Figure 15 Optionally, after preparing the first filling portion 81 in step S503, the method for preparing the display panel 100 provided in this application embodiment further includes: S610, Prepare a first sealing portion 91, the first sealing portion 91 sealing the gap opening 011 of the encapsulation gap 01 between the extension 702 of the first encapsulation portion 71 and the isolation structure 40.

[0174] In this way, the method for manufacturing the display panel 100 provided in this application embodiment can use the first sealing portion 91 to seal the gap opening 011 of the encapsulation gap 01 between the extension portion 702 of the first encapsulation portion 71 and the isolation structure 40.

[0175] Please continue reading. Figure 15 , Figure 16 and Figure 17 Optionally, after preparing the first filling portion 81 in step S503, the preparation of the light-emitting unit, the first inorganic encapsulation layer 70, and the organic filling layer 80 in step S500 further includes: S504, fabricating the second light-emitting unit; S505, Prepare a second encapsulation part 72, the second encapsulation part 72 covers the second light-emitting unit; S506, Prepare a second filling portion 82, which is disposed in the encapsulation gap 01 between the extension 702 of the second encapsulation portion 72 and the isolation structure 40.

[0176] In this way, the method for preparing the display panel 100 provided in this application embodiment can use the second encapsulation part 72 to encapsulate the second light-emitting unit, and can also use the second filling part 82 to fill the encapsulation gap 01 between the extension 702 of the second encapsulation part 72 and the isolation structure 40. The second filling part 82 can protect the second light-emitting unit, which can help prevent water, oxygen or subsequent etching solution from entering the second light-emitting unit.

[0177] Optionally, in step S506, preparing the second filling portion 82 includes: S5061, Prepare the second organic material layer 802, wherein when preparing the second organic material layer 802, the second organic material layer 802 is filled with the encapsulation gap 01 by controlling the formation rate of the second organic material layer 802 and other methods. S5062, pattern the second organic material layer 802 to form the second filling portion 82, wherein the extension portion 702 of the first inorganic encapsulation layer 70 can block the second organic material layer 802 in the encapsulation gap 01, and can act as a mask, thereby facilitating the preparation of the second filling portion 82. S5063, the second filling portion 82 is cured, for example, the second filling portion 82 can be baked.

[0178] In this way, the method for preparing the display panel 100 provided in this application embodiment can prepare the second filling part 82 and improve the structural strength of the second filling part 82.

[0179] Please see Figure 18 Optionally, after preparing the second filling portion 82 in step S506, the method for preparing the display panel 100 provided in this application further includes: S620, prepare a second sealing part 92, the second sealing part 92 seals the gap opening 011 of the encapsulation gap 01 between the extension 702 of the second encapsulation part 72 and the isolation structure 40.

[0180] In this way, the method for manufacturing the display panel 100 provided in this application embodiment can use the second sealing portion 92 to seal the gap opening 011 of the encapsulation gap 01 between the extension portion 702 of the second encapsulation portion 72 and the isolation structure 40.

[0181] Please see Figure 4 and Figure 5 Optionally, after preparing the second filling portion 82 in step S506, in step S500, the preparation of the light-emitting unit, the first inorganic encapsulation layer 70, and the organic filling layer 80 further includes: S507, fabrication of the third light-emitting unit; S508, a third encapsulation part 73 is prepared, and the third encapsulation part 73 covers the third light-emitting unit.

[0182] In this way, the method for manufacturing the display panel 100 provided in this application embodiment can utilize the third encapsulation part 73 to encapsulate the third light-emitting unit.

[0183] This application also provides a display device, which includes the display panel 100 of any of the above embodiments or the display panel 100 prepared by the preparation method of any of the above embodiments. The display device provided in this application has the same or similar technical effects as the display panel 100 of any of the above embodiments or the preparation method of any of the above embodiments, and will not be described again here.

[0184] The above are merely specific embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A display panel, characterized by, include: Substrate; A pixel definition layer is disposed on one side of the substrate and has multiple pixel openings; An isolation structure is disposed on the side of the pixel definition layer opposite to the substrate, and encloses a plurality of isolation openings, wherein the isolation openings are connected to the corresponding pixel openings; Multiple light-emitting units, wherein the light-emitting units are disposed within the corresponding pixel openings; A first inorganic encapsulation layer covers the light-emitting unit. The first inorganic encapsulation layer includes an encapsulation body and an extension. The encapsulation body is disposed within the isolation opening and covers the light-emitting unit. The extension is disposed on the side of the isolation structure away from the substrate and has an encapsulation gap with the isolation structure. An organic filler layer is disposed within the encapsulation gap.

2. The display panel of claim 1, wherein, The organic filler layer is made of photosensitive polyimide, or the organic filler layer is made of organosilicon.

3. The display panel of claim 1, wherein, The display panel further includes a sealing layer located on the side of the extension and the isolation structure away from the substrate. The packaging gap has a gap opening on the side away from the packaging body, and the sealing layer blocks the gap opening of the packaging gap.

4. The display panel of claim 3, wherein, The sealing layer is made of inorganic materials.

5. The display panel of claim 3, wherein, The inorganic material of the sealing layer is different from the inorganic material of the first inorganic encapsulation layer; Preferably, the inorganic material of the sealing layer includes one of silicon nitride, silicon oxide, and silicon oxynitride, and the inorganic material of the first inorganic encapsulation layer includes another of silicon nitride, silicon oxide, and silicon oxynitride.

6. The display panel of claim 3, wherein, The sealing layer encloses a gap, which exposes at least a portion of the encapsulated body.

7. The display panel of claim 3, wherein, The orthographic projection of the sealing layer on the substrate is located within the orthographic projection of the side surface of the isolation structure facing away from the substrate on the substrate.

8. The display panel of claim 3, wherein, The edge of the isolation structure facing away from the substrate and close to the isolation opening is the first edge, and the edge of the sealing layer facing the substrate and close to the isolation opening is the second edge. The orthographic projection of the second edge on the substrate is located on the side of the first edge facing the isolation opening. Preferably, the orthographic projection of the side surface of the isolation structure facing away from the substrate onto the substrate lies within the orthographic projection of the sealing layer onto the substrate.

9. The display panel of claim 1, wherein, The first inorganic encapsulation layer includes a plurality of encapsulation portions, each encapsulation portion covering a corresponding light-emitting unit. Each encapsulation portion includes an encapsulation body and an extension portion, the extension portion being connected to the encapsulation body. The organic filling layer includes a first filling portion and a second filling portion. The first filling portion is disposed within the encapsulation gap between the extension portion of one of the two adjacent encapsulation portions and the isolation structure. The second filling portion is disposed within the encapsulation gap between the extension portion of the other of the two adjacent encapsulation portions and the isolation structure. Preferably, the orthographic projection of the first filling portion on the substrate and the orthographic projection of the second filling portion on the substrate are spaced apart; Preferably, the display panel further includes a sealing layer located on the side of the extension and the isolation structure away from the substrate, and the packaging gap having a gap opening on the side away from the packaging body. The sealing layer includes a first sealing portion and a second sealing portion, the first sealing portion blocking the gap opening of the packaging gap between the extension and the isolation structure of one of the two adjacent packaging portions, and the second sealing portion blocking the gap opening of the packaging gap between the extension and the isolation structure of the other of the two adjacent packaging portions. Preferably, the orthographic projection of the first sealing portion on the substrate overlaps with the orthographic projection of the second sealing portion on the substrate; Preferably, the orthographic projection of the first filling portion on the substrate is located within the orthographic projection of the first sealing portion on the substrate, and / or, the orthographic projection of the second filling portion on the substrate is located within the orthographic projection of the second sealing portion on the substrate.

10. The display panel of claim 9, wherein, The isolation structure includes a first region, a second region, and a third region on the side of the substrate facing away from the substrate. The second region is located between the first region and the third region. The first filling portion is attached to the first region on the side facing the substrate, and the second filling portion is attached to the third region on the side facing the substrate.

11. The display panel of claim 9, wherein, The plurality of light-emitting units include a first light-emitting unit, a second light-emitting unit, and a third light-emitting unit; the plurality of encapsulation portions include a first encapsulation portion, a second encapsulation portion, and a third encapsulation portion; the first encapsulation portion covers the first light-emitting unit; the second encapsulation portion covers the second light-emitting unit; and the third encapsulation portion covers the third light-emitting unit; the first filling portion is disposed within the encapsulation gap between the extension portion of the first encapsulation portion and the isolation structure. Preferably, the second filling portion is disposed within the encapsulation gap between the extension of the second encapsulation portion and the isolation structure.

12. A method for manufacturing a display panel, characterized in that, The preparation method includes: Provide substrates; A pixel definition material layer is prepared on one side of the substrate. An isolation structure is prepared on the side of the pixel definition material layer opposite to the substrate, and the isolation structure encloses and forms a plurality of isolation openings; The pixel-defined material layer is graphically formed to create multiple pixel openings, and the isolation openings are connected to the corresponding pixel openings; A light-emitting unit, a first inorganic encapsulation layer, and an organic filler layer are fabricated. At least a portion of the light-emitting unit is disposed within the pixel opening. The first inorganic encapsulation layer covers the light-emitting unit and includes an encapsulation body and an extension. The encapsulation body is disposed within the isolation opening and covers the light-emitting unit. The extension is disposed on the side of the isolation structure away from the substrate and has an encapsulation gap with the isolation structure. The organic filler layer is disposed within the encapsulation gap.

13. The preparation method according to claim 12, characterized in that, The fabrication of the light-emitting unit, the first inorganic encapsulation layer, and the organic filling layer includes: Prepare the light-emitting unit; Prepare the first inorganic encapsulation layer; An organic filler layer is prepared, wherein the material of the organic filler layer includes organic materials; Preferably, the preparation of the organic filler layer includes: Preparation of organic material layers; The organic material layer is patterned to form the organic filler layer; The organic filler layer is cured; Preferably, after preparing the organic filler layer, the preparation method further includes: A sealing layer is prepared to seal the gap opening of the encapsulation gap, the gap opening being located on the side of the encapsulation gap away from the encapsulation body.

14. The preparation method according to claim 12, characterized in that, The fabrication of the light-emitting unit, the first inorganic encapsulation layer, and the organic filling layer includes: Fabrication of the first light-emitting unit; A first encapsulation portion is prepared, which covers the first light-emitting unit; A first filling portion is prepared, and the first filling portion is disposed in the encapsulation gap between the extension of the first encapsulation portion and the isolation structure; Preferably, the preparation of the first filling portion includes: Preparation of the first organic material layer; The first organic material layer is patterned to form the first filling portion; The first filling portion is cured; Preferably, after preparing the first filling portion, the preparation method further includes: Prepare a first sealing portion, which seals the gap opening of the encapsulation gap between the extension of the first encapsulation portion and the isolation structure; Preferably, after preparing the first filling portion, the preparation of the light-emitting unit, the first inorganic encapsulation layer, and the organic filling layer further includes: Fabrication of a second light-emitting unit; A second encapsulation portion is prepared, which covers the second light-emitting unit; A second filling portion is prepared, which is disposed in the encapsulation gap between the extension of the second encapsulation portion and the isolation structure; Preferably, the preparation of the second filling portion includes: Preparation of a second organic material layer; The second organic material layer is patterned to form the second filling portion; The second filling portion is cured; Preferably, after preparing the second filling portion, the preparation method further includes: Prepare a second sealing portion, which blocks the gap opening of the encapsulation gap between the extension of the second encapsulation portion and the isolation structure; Preferably, after preparing the second filling portion, the preparation of the light-emitting unit, the first inorganic encapsulation layer, and the organic filling layer further includes: Fabrication of the third light-emitting unit; A third encapsulation portion is prepared, which covers the third light-emitting unit.

15. A display device, characterized in that, This includes the display panel as described in any one of claims 1 to 11 or the display panel prepared by the preparation method described in any one of claims 12 to 14.

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