A stress compression testing device for a robotic modular fingertip structure and a testing method thereof

Abstract

The application relates to the technical field of compression resistance testing, and particularly relates to a stress compression resistance testing device of a robot modular fingertip structure and a testing method thereof, which comprises a cabinet body, a placing table arranged in the cabinet body and used for placing a robot hand, a horizontal moving seat movably arranged in the cabinet body and an assembly plate, the horizontal moving seat can be driven by a second linear driving module arranged in the cabinet body to move horizontally, the assembly plate can be driven by a pressure applying driving mechanism arranged in the cabinet body to move away from or close to the horizontal moving seat, so that a pressure applying piece arranged on the side of the assembly plate away from the horizontal moving seat is in contact with the robot finger; the first pressure applying plate and the second pressure applying plate are arranged to form a V-shaped structure, the robot finger can be directly pressed, and the stress condition of the robot finger when a local part of a gripped object enters the finger gap during the working process of the robot can be simulated, so that the diversification of the stress compression resistance mode of the robot during testing is realized.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of compression resistance test, and in particular to a stress compression resistance test device for a robot modular fingertip structure and a test method thereof. BACKGROUND

[0002] Modern robot dexterous hands are developing towards high bionization and intelligence, and the end effector, especially the fingertip part, has become the core unit integrating sensing and operation functions. Some advanced schemes currently adopt replaceable multi-modal fingertip effector design, which realizes quick disassembly and assembly of the fingertip module through a standardized interface and a magnetic suction-buckle composite mechanism, so that a single manipulator can flexibly adapt to different task requirements. These modular fingertips are built-in with various sensors such as vision, temperature, and odor, and can real-time feedback complex environmental information in combination with data fusion and deep learning algorithms.

[0003] In actual use, the stability of the modular fingertip structure needs to meet certain requirements. The robot finger generally includes movable joints. During the daily work of the robot hand, these movable joints need to have a certain bearing pressure capacity. If the bearing pressure capacity is not good, the fingertip structure may be offset due to excessive stress, and thus the sensors set may be difficult to accurately perceive and judge, affecting the normal work of the robot. Therefore, before the robot is put into use, the finger part needs to be tested for pressure to ensure that the fingertip structure can meet certain stress compression resistance performance.

[0004] The existing test equipment generally simulates the stress of the robot finger in actual use by applying pressure to the robot finger. However, when the robot is actually working, the local part of the object may enter the finger joint, and thus the finger is subjected to pressure in the axial direction of the joint. This factor may cause damage to the joint connection of the finger. Therefore, the existing stress compression resistance test method is relatively single, and the stress condition of the robot finger in actual work is easily ignored during testing, which may result in that the test result cannot effectively match the pressure condition faced by the robot finger in actual work, and the reference value of the test result needs to be improved. SUMMARY

[0005] The present application aims to provide a stress compression resistance test device for a robot modular fingertip structure and a test method thereof to solve the problems in the background art.

[0006] To achieve the above-mentioned purpose, the present application provides the following technical scheme:

[0007] A stress compression resistance test device for a robot modular fingertip structure, comprising a cabinet and a placing table arranged in the cabinet for placing a robot hand, further comprising:

[0008] The horizontal moving seat is arranged in the cabinet body and can be driven by the second linear driving module arranged in the cabinet body to move horizontally. The assembly plate can be driven by the pressure applying driving mechanism arranged in the cabinet body to move away from or close to the horizontal moving seat, so that the pressure applying part arranged on the side of the assembly plate away from the horizontal moving seat contacts the robot finger integrated with the touch surface array sensor module as the end execution module, and the compression resistance of the end of the robot finger connected by the composite locking is detected.

[0009] The lifting plate part is arranged on the assembly plate, and the driving motor is mounted on the lifting plate part. The output end of the driving motor is connected with a rotating shaft. The rotating shaft is connected with the pressure applying part through the opening and closing control mechanism. The lifting plate part can be driven by the height adjusting mechanism arranged on the assembly plate to perform lifting action, so as to change the height of the contact point between the pressure applying part and the joint of the robot finger provided with the sensor module interface.

[0010] The pressure applying part includes a first pressure applying plate and a second pressure applying plate, which form a "V" type structure. The opening and closing control mechanism is triggered when the contact point between the pressure applying part and the robot finger is raised, so as to drive the first pressure applying plate and the second pressure applying plate to perform opening action.

[0011] The driving motor can drive the pressure applying part to perform 90° deflection through the rotating shaft, so that the pressure applying part has two contact modes with the robot finger.

[0012] Firstly, the ends of the first pressure applying plate and the second pressure applying plate contact the robot finger.

[0013] Secondly, the ends of the first pressure applying plate and the second pressure applying plate pass through the gap of the robot finger, and the side parts contact the robot finger.

[0014] The stress compression test device of the robot modularized fingertip structure as described above: two groups of guide structures are arranged between the horizontal moving seat and the assembly plate. The guide structures include guide plates and telescopic plates fixed on the horizontal moving seat and the assembly plate respectively. The guide plates and the telescopic plates are slidingly fitted.

[0015] The assembly plate is provided with a through opening. The pressure applying driving mechanism includes a cross arm arranged in the through opening and slidingly connected with the assembly plate. The two ends of the cross arm are respectively connected with a group of power components arranged in the cabinet body.

[0016] The stress compression test device of the robot modularized fingertip structure as described above: the power components include a horizontal plate fixed in the cabinet body and hollow inside, and a first sliding block and a second sliding block slidingly arranged in the horizontal plate. The cross arm is fixedly connected with the second sliding block. The first sliding block and the second sliding block are connected with an elastic structure.

[0017] The power assembly further comprises a first cylinder rotatably installed in the cabinet body, and a movable end of the first cylinder is hingedly connected with the first sliding block.

[0018] The stress compression testing device of the robot modular fingertip structure as described above: the elastic structure comprises a crossbar fixed with the first sliding block and a cylindrical spring sleeved on the outer periphery of the crossbar, and the crossbar penetrates through the second sliding block and is in sliding connection with the second sliding block.

[0019] The end of the crossbar away from the first sliding block is fixed with a circular truncated cone, and an internal pressure sensor is arranged in the circular truncated cone; one end of the cylindrical spring is connected with the second sliding block, and the other end is in abutment with the internal pressure sensor.

[0020] The stress compression testing device of the robot modular fingertip structure as described above: two guide rails are fixed on the assembly plate, the height adjusting mechanism comprises two vertical arms respectively slidingly fitted on the two guide rails, the lifting plate member is fixedly connected with the two vertical arms, and a second cylinder is rotatably installed on the assembly plate, and a movable end of the second cylinder is hingedly connected with the vertical arms.

[0021] The stress compression testing device of the robot modular fingertip structure as described above: the opening and closing control mechanism comprises a swing plate fixed with the rotating shaft, the first pressing plate and the second pressing plate are connected with the swing plate through a support structure, and a push-pull structure is arranged between the support structure and the rotating shaft.

[0022] The two sides of the swing plate are respectively fixed with a fixed arm, and the end of the fixed arm away from the swing plate is fixedly provided with a shaft pin, and the first pressing plate and the second pressing plate are rotatably connected through the shaft pin.

[0023] The stress compression testing device of the robot modular fingertip structure as described above: a through slot is arranged on the swing plate, the support structure comprises two driven blocks symmetrically slidingly fitted in the through slot, two connecting arms are respectively slidingly arranged on the first pressing plate and the second pressing plate, the connecting arms are hingedly connected with the driven blocks, and the push-pull structure can drive the two driven blocks to slide towards each other.

[0024] The stress compression testing device of the robot modular fingertip structure as described above: the push-pull structure comprises a sleeve slidingly sleeved on the rotating shaft and a transmission plate arranged on the lifting plate member through two groups of sliding fitting members, the transmission plate is rotatably connected with the sleeve, two connecting rods are hingedly connected with the sleeve, and the ends of the two connecting rods away from the sleeve are respectively hingedly connected with the two driven blocks.

[0025] The stress compression test device of the robot modular fingertip structure as described above: the sliding fitting piece comprises a support arm fixed on the lifting plate piece and a sleeve plate slidingly sleeved with the support arm and fixedly connected with the transmission plate, the side of the sleeve plate is fixedly provided with a convex column, and a limiting plate piece is fixed on the assembly plate;

[0026] The limiting plate piece is provided with an inclined groove matched with the convex column, the convex column penetrates through the inclined groove and is slidingly connected with the limiting plate piece, when the lifting plate piece rises, the convex column slides in the inclined groove, and the sleeve plate can be driven to slide on the transmission plate and the sleeve pipe on the rotating shaft towards the swing plate.

[0027] A stress compression test method of a robot modular fingertip structure, adopting the test device, comprising the following steps:

[0028] Step one, place the robot hand to be tested on the placing table, make the palm of the robot hand face the first pressure plate and the second pressure plate, and fix the robot hand;

[0029] Step two, the pressure driving mechanism drives the first pressure plate and the second pressure plate to apply force to the robot fingers in the first contact mode;

[0030] Step three, the driving motor drives the first pressure plate and the second pressure plate to deflect 90° through the rotating shaft;

[0031] Step four, the pressure driving mechanism drives the first pressure plate and the second pressure plate to apply force to the robot fingers in the second contact mode;

[0032] Step five, the height adjusting mechanism lifts the height of the first pressure plate and the second pressure plate, and the opening and closing control mechanism increases the included angle between the first pressure plate and the second pressure plate;

[0033] Step six, repeat steps two, three and four, and analyze the stress compression capacity of the robot modular fingertip structure according to the collected data.

[0034] Compared with the prior art, the robot modular fingertip structure has the following advantages:

[0035] This invention uses a first pressure plate and a second pressure plate to form a V-shaped structure. During testing, the first and second pressure plates have two contact methods with the robot finger: first, the ends of the first and second pressure plates contact the robot finger; second, the ends of the first and second pressure plates pass through the gaps in the robot finger and the sides contact the robot finger. Therefore, the testing method of this invention can not only directly apply pressure to the robot finger, but also simulate the force situation of the robot finger when a part of the object being grasped enters the gap between the fingers during the robot's operation. This diversifies the robot's force and pressure resistance methods during testing, making the test results effectively match the pressure and pressure resistance conditions faced by the robot finger in actual work, and improving the reference value of the test results.

[0036] Regarding the two contact methods between the pressure-applying component and the robot finger, when the height adjustment mechanism increases the contact point between the pressure-applying component and the robot finger to improve the force on the finger under the first contact method, the opening and closing control mechanism can be triggered to increase the angle between the first pressure plate and the second pressure plate. Thus, when testing under the second contact method, the sides of the first and second pressure plates can make contact with the finger earlier, causing the final compression of the cylindrical spring to increase. That is, the force on the finger is synchronously and automatically increased under both contact methods, simulating the stability performance of the finger under different force conditions in actual robot operation. Attached Figure Description

[0037] Figure 1 A schematic diagram of one embodiment of a stress and compression testing device for a modular fingertip structure of a robot.

[0038] Figure 2 This is a structural schematic diagram from another angle of one embodiment of a force and compression resistance testing device for a modular fingertip structure of a robot.

[0039] Figure 3 This is a schematic diagram illustrating the connection state between the pressure-applying drive mechanism and the assembly plate in one embodiment of a force-resistance testing device for a modular fingertip structure of a robot.

[0040] Figure 4 for Figure 3 A structural diagram from another angle.

[0041] Figure 5 for Figure 3 Enlarged view of the structure at point A in the middle.

[0042] Figure 6 An exploded view of the pressure-applying drive mechanism in one embodiment of a stress-resistance testing device for a modular fingertip structure of a robot.

[0043] Figure 7A first pressing plate and a second pressing plate and a connection state diagram of a tension control mechanism in an embodiment of a stress compression test device for a robot modular fingertip structure.

[0044] Figure 8 For Figure 7 Another angle structural diagram.

[0045] Figure 9 A structural explosion diagram of a tension control mechanism in an embodiment of a stress compression test device for a robot modular fingertip structure.

[0046] Figure 10 For Figure 9 Another angle structural diagram.

[0047] In the figure: 1, cabinet body; 2, placing table; 3, first linear drive module; 4, assembly arm; 5, clamping piece; 6, second linear drive module; 7, transverse moving seat; 8, guide plate; 9, telescopic plate; 10, assembly plate; 1001, through port; 1002, guide rail; 11, cross arm; 12, cross plate; 13, cylindrical spring; 14, first sliding block; 15, second sliding block; 16, cross rod; 17, circular table; 18, first air cylinder; 19, vertical arm; 20, second air cylinder; 21, lifting plate piece; 2101, support arm; 22, cover plate; 2201, convex column; 23, transmission plate; 24, drive motor; 25, rotating shaft; 26, swing plate; 27, fixed arm; 2701, shaft pin; 28, sleeve; 29, first pressing plate; 30, second pressing plate; 31, connecting arm; 32, driven block; 33, connecting rod; 34, limiting plate piece. DETAILED DESCRIPTION

[0048] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0049] In addition, in the present application, an element is referred to as "fixed to" or "disposed on" another element, which can be directly on another element or can have a middle element. When an element is considered to be "connected" to another element, it can be directly connected to another element or can have a middle element. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation.

[0050] Please refer to Figures 1 to 10In the embodiment, the stress compression test device of the robot modular fingertip structure comprises a cabinet 1, a placing table 2 arranged in the cabinet 1 and used for placing a robot hand, and further comprises:

[0051] A horizontal moving seat 7 and an assembly plate 10 are movably arranged in the cabinet 1. The horizontal moving seat 7 is horizontally movable under the drive of a second linear drive module 6 arranged in the cabinet 1. The assembly plate 10 is movable away from or close to the horizontal moving seat 7 under the drive of a pressure applying drive mechanism arranged in the cabinet 1, so that a pressure applying piece arranged on the side of the assembly plate 10 away from the horizontal moving seat 7 contacts a robot finger which is an end execution module and integrates a touch surface array sensor module, and the compression resistance of the end of the robot finger connected by the composite locking is detected.

[0052] A lifting plate piece 21 movably arranged on the assembly plate 10 and a drive motor 24 mounted on the lifting plate piece 21 are provided. An output end of the drive motor 24 is connected with a rotating shaft 25. The rotating shaft 25 is connected with the pressure applying piece through a clenching control mechanism. The lifting plate piece 21 is movable under the drive of a height adjusting mechanism arranged on the assembly plate 10, and performs a lifting action to change the height of the contact point between the pressure applying piece and a joint of the robot finger provided with a sensor module interface.

[0053] The pressure applying piece comprises a first pressure applying plate 29 and a second pressure applying plate 30, which form a "V" type structure. The clenching control mechanism is triggered when the contact point between the pressure applying piece and the robot finger is raised, and can drive the first pressure applying plate 29 and the second pressure applying plate 30 to perform an opening action.

[0054] The drive motor 24 can drive the pressure applying piece to perform a 90° deflection through the rotating shaft 25, so that the pressure applying piece has two contact modes with the robot finger.

[0055] One of the two contact modes is that the ends of the first pressure applying plate 29 and the second pressure applying plate 30 contact the robot finger.

[0056] The other contact mode is that the ends of the first pressure applying plate 29 and the second pressure applying plate 30 pass through the gap of the robot finger, and the side parts contact the robot finger.

[0057] In the embodiment, it is necessary to be supplemented that, in order to ensure the stability of the robot hand during the test, a clamping mechanism is further arranged in the cabinet 1. The clamping mechanism comprises two first linear drive modules 3 mounted in the cabinet 1 and respectively located on both sides of the placing table 2, and two assembly arms 4 connected with the two first linear drive modules 3 at both ends. The assembly arms 4 are fixed with clamping pieces 5.

[0058] The first linear drive module 3 is an application of the prior art. A servo motor and a bidirectional screw are used to realize the opposite movement of the two assembly arms 4, so that the two clamping pieces 5 can clamp and fix the robot hand to be tested.

[0059] It should be emphasized that during the test, when placing the robot's hand on the placement platform 2, the palm of the robot's hand must face the first pressure plate 29 and the second pressure plate 30.

[0060] The second linear drive module 6 is also an application of existing technology. It uses a servo motor and a one-way lead screw to realize the horizontal movement of the transverse seat 7, thereby changing the horizontal displacement of the pressure application component so that the first pressure plate 29 and the second pressure plate 30 can respectively correspond to each finger and each finger gap.

[0061] With attachment Figure 7 Taking the state shown as an example, the drive motor 24 has not yet driven the pressure member to perform a 90° deflection through the rotating shaft 25. At this time, the pressure driving mechanism drives the assembly plate 10 to move away from the transverse seat 7. Then, the ends of the first pressure plate 29 and the second pressure plate 30 directly act on the robot finger to apply the first pressure to the robot finger. Through the drive of the second linear drive module 6, the transverse seat 7 can move horizontally, so that the first pressure plate 29 and the second pressure plate 30 can correspond to different fingers.

[0062] Subsequently, the drive motor 24 drives the pressure-applying component to deflect 90° via the rotating shaft 25, and the second linear drive module 6 adjusts the position of the transverse seat 7 so that the ends of the first pressure plate 29 and the second pressure plate 30 are aligned with the gaps between the robot's fingers. Then, when the assembly plate 10 moves away from the transverse seat 7, the ends of the first pressure plate 29 and the second pressure plate 30 will penetrate the gaps between the robot's fingers and contact the robot's fingers on the sides. Since the first pressure plate 29 and the second pressure plate 30 form a V-shaped structure, the first pressure plate 29 and the second pressure plate 30 will apply a second pressure to the fingers on both sides. The direction of the second pressure is perpendicular to the direction of the first pressure. By adjusting the position of the transverse seat 7, the first pressure plate 29 and the second pressure plate 30 correspond one-to-one with different finger gaps.

[0063] After the above operations are completed, the height adjustment mechanism works, driving the lifting plate 21 to move upward on the assembly plate 10. Correspondingly, the height of the first pressure plate 29 and the second pressure plate 30 increases. In the next round of testing, the height of the contact point between the two and the robot's fingers increases. With the stroke of the pressure driving mechanism remaining unchanged, the first pressure increases (similar to the lever principle). At the same time, the opening and closing control mechanism is triggered, which will drive the first pressure plate 29 and the second pressure plate 30 to perform an opening action. The angle between the two increases, and then, when testing the finger gaps in the future, the second pressure increases accordingly.

[0064] Therefore, the application sets the first pressing plate 29 and the second pressing plate 30 to form a "V" type structure, and the first pressing plate 29 and the second pressing plate 30 have two contact modes with the robot finger during testing, one is that the end of the first pressing plate 29 and the second pressing plate 30 contacts the robot finger, and the other is that the end of the first pressing plate 29 and the second pressing plate 30 passes through the gap of the robot finger and the side contacts the robot finger, so that the testing mode of the application can not only directly press the robot finger, but also simulate the stress condition of the robot finger when the local part of the grasped object enters the finger gap during the working process of the robot, so as to realize the diversification of the stress resistance of the robot during testing, so that the test result effectively matches the stress resistance condition of the robot finger in the actual work, and the reference value of the test result is improved.

[0065] The robot finger is connected by a magnetic attraction and mechanical buckle composite locking mechanism, and a large number of sensor modules are integrated on the robot finger, so that the above-mentioned compression resistance test can ensure that the module connection is stable, and single-handed quick replacement is supported; specifically, the robot finger is provided with a touch surface array sensor module, including an environment / multifunctional sensor module. The fingertip module structure uses high-strength lightweight aviation aluminum material, the module interface is standardized, and the sensor substrate / FPC flexible soft plate stringing structure is compatible with different sensing function fingertips (such as temperature, light perception, touch, gas probe, etc.) and communication interfaces.

[0066] In detail, the sensor module integrates environmental perception functions, including embedding a single sensor on the fingertip, such as a non-contact temperature sensor, an infrared thermal image sensor, a distance sensor (including a laser ranging sensor, an ultrasonic sensor, and an ultrasonic material recognition sensor), an electrochemical (environmental gas) sensor, an image sensor, and other functional sensors.

[0067] The non-contact temperature sensor can be an infrared temperature sensor module, which internally integrates an infrared thermocouple sensor, a low-noise instrument amplifier, and realizes high-precision temperature measurement. It is mainly applied to high-precision non-contact remote temperature measurement.

[0068] It can also be an infrared pyroelectric sensor for detecting the flame generated by the combustion of hydrocarbons.

[0069] In addition, the infrared thermal image sensor is an infrared thermocouple sensor, including an infrared temperature point array sensor module and an infrared thermal imager; based on the fact that the higher the temperature of an object is, the stronger the infrared radiation ability is, temperature data is obtained through chip processing.

[0070] The ultrasonic material recognition sensor is based on the difference in echo caused by the different absorption capabilities of different materials to ultrasonic waves. The echo of different materials is matched based on the TOF measurement principle, and the different materials are distinguished through echo detection technology, so as to accurately recognize the material of the picked object and judge the torque required by the finger.

[0071] The light measurement and distance measurement sensor can be a TOF laser ranging sensor. The working process is that the sensor emits modulated near-infrared light, which is reflected after encountering an object. The sensor calculates the time difference or phase difference between light emission and reflection to convert the distance of the photographed object to generate depth information. In addition, combined with traditional camera shooting, the three-dimensional profile of the object can be presented in different colors representing different distances.

[0072] The environmental gas sensor in the electrochemical (environmental gas) sensor can be a methane sensor or a natural gas sensor. Such sensors are manufactured using a multi-layer thick film process. A heater and a metal oxide semiconductor gas sensitive layer are respectively made on both sides of a micro Al2O3 ceramic substrate and packaged in a metal shell. When there is a detected gas in the ambient air, the sensor conductivity changes. The higher the concentration of the gas, the higher the conductivity of the sensor. A simple circuit can convert this change in conductivity into an output signal corresponding to the gas concentration. Of course, it can also be a carbon dioxide sensor, which can directly output a gas concentration value signal after linearization and temperature compensation.

[0073] The image sensor is a CMOS image sensor, which is a photoelectric converter based on the complementary metal oxide semiconductor (CMOS) process, converts optical signals into electrical signals, and finally forms a digital image. With flexibility, low cost and continuous technological innovation, it has become the dominant technology in the imaging field. The maximum resolution is 1920x1080, the pixel size is 2.8x2.8μm, and the scanning speed is 0.1s.

[0074] In addition, the tactile probe has tactile array sensing function. Thin film pressure sensors are embedded on the side of the replaceable end effector of the manipulator. The types include resistance, capacitance and piezoelectricity. The principles of the three types of sensors are as follows:

[0075] Resistance: Resistance sensor is one of the most common thin film pressure sensors. Its working principle is that when the film is subjected to pressure, the conductive layer inside the sensor will deform, causing the resistance value to change. By measuring the change in resistance, the size of the pressure can be calculated.

[0076] Capacitive: Capacitive sensors are made of two conductive films with an insulating material in between, forming a capacitor; when pressure is applied to the films, the distance between the two films changes, causing the capacitance to change; by measuring the change in capacitance, pressure can be sensed.

[0077] Piezoelectric: Piezoelectric sensors use the properties of piezoelectric materials; when the material is subjected to pressure or deformation, it generates an electric charge; these charges form a voltage signal, and the size of the voltage is directly proportional to the change in pressure.

[0078] It is precisely because a large number of sensors are integrated on the end effector module of the manipulator that the manipulator fingertip end effector integrates multiple sensing capabilities; in order to ensure that the modular fingertip structure can maintain stability when performing actions, it must be subjected to compression testing.

[0079] As a further scheme of the present application, please refer to Figure 4 And Figure 6 , two sets of guide structures are provided between the transverse seat 7 and the assembly plate 10, the guide structure includes guide plates 8 and telescopic plates 9 fixed on the transverse seat 7 and the assembly plate 10 respectively, the guide plates 8 and the telescopic plates 9 are slidingly fitted; the assembly plate 10 is provided with a through opening 1001, the pressure driving mechanism includes a cross arm 11 provided in the through opening 1001 and slidingly connected with the assembly plate 10, both ends of the cross arm 11 are connected with a set of power components provided in the cabinet 1.

[0080] The power component includes a horizontal plate 12 fixed in the cabinet 1 and hollow inside, and a first sliding block 14 and a second sliding block 15 slidingly provided in the horizontal plate 12, the cross arm 11 is fixedly connected with the second sliding block 15, and the first sliding block 14 and the second sliding block 15 are connected with an elastic structure; the power component further includes a first air cylinder 18 rotatably installed in the cabinet 1, and the movable end of the first air cylinder 18 is hinged with the first sliding block 14.

[0081] The elastic structure includes a cross rod 16 fixed with the first sliding block 14 and a cylindrical spring 13 sleeved on the outer periphery of the cross rod 16, the cross rod 16 penetrates through the second sliding block 15 and is slidingly connected with the second sliding block 15; one end of the cross rod 16 away from the first sliding block 14 is fixed with a circular truncated cone 17, the circular truncated cone 17 is provided with an internal pressure sensor, one end of the cylindrical spring 13 is connected with the second sliding block 15, and the other end is abutted with the internal pressure sensor.

[0082] In this embodiment, the lengthening amount of the movable end of the first cylinder 18 remains unchanged during each round of testing, and when the movable end of the first cylinder 18 is lengthened, the first slider 14 will be driven to slide away from the second linear drive module 6 in the cross plate 12, and correspondingly, the first slider 14 will drive the second slider 15 to slide together, the guide plate 8 and the telescopic plate 9 guide the assembly plate 10, and then the second slider 15 drives the assembly plate 10 to move away from the horizontal moving seat 7 through the horizontal arm 11, so that the first pressing plate 29 and the second pressing plate 30 move towards the robot hand;

[0083] When the second linear drive module 6 drives the horizontal moving seat 7 to move in the horizontal direction to change the test position of the first pressing plate 29 and the second pressing plate 30, the horizontal moving seat 7 can drive the assembly plate 10 to slide on the horizontal arm 11 through the guide plate 8 and the telescopic plate 9;

[0084] Further, after the pressing member contacts the robot finger in two ways, with the continuous sliding of the first slider 14, the first slider 14 and the second slider 15 will move relatively, that is, the first slider 14 moves away from the second slider 15, and the cylindrical spring 13 is compressed, and after the first slider 14 reaches the end of the stroke, it is kept for a certain period of time, during which the built-in pressure sensor monitors the pressure value in real time and draws a spline curve, and if the pressure value changes, it indicates that under the pressing action of the first pressing plate 29 and the second pressing plate 30, the robot finger is offset to a certain extent due to the pressure, and the stress resistance performance is not good, which may affect the accuracy of the sensor sensing and judgment on the fingertip structure in actual work.

[0085] As a further scheme of the present application, please refer to Figure 4 , Figure 6 and Figure 7 , two guide rails 1002 are fixedly arranged on the assembly plate 10, the height adjusting mechanism comprises two vertical arms 19 which are respectively slidably embedded in the two guide rails 1002, the lifting plate 21 is fixedly connected with the two vertical arms 19, and the second cylinder 20 is rotatably installed on the assembly plate 10, and the movable end of the second cylinder 20 is hingedly connected with the vertical arm 19.

[0086] In this embodiment, after each round of testing, when the stress on the robot finger needs to be increased, the movable end of the second cylinder 20 is lengthened to drive the vertical arm 19 to slide upward on the guide rail 1002, and correspondingly, the vertical arm 19 drives the lifting plate 21 to rise, and the height of the first pressing plate 29 and the second pressing plate 30 is increased, and during subsequent testing, when the first pressing plate 29 and the second pressing plate 30 act on the robot finger in the first contact mode, the contact point is raised, and the lengthening amount of the movable end of the first cylinder 18 remains unchanged, and according to the principle of lever, the stress on the robot finger is increased at this time;

[0087] Further, the lifting plate 21 will trigger the opening and closing control mechanism during the lifting process, and the opening and closing control mechanism will drive the first pressing plate 29 and the second pressing plate 30 to perform the opening action, so that the included angle between the first pressing plate 29 and the second pressing plate 30 increases. During the subsequent test, when the first pressing plate 29 and the second pressing plate 30 act on the robot finger in the second contact mode, the side part will contact the robot finger in advance after the end part penetrates the finger gap, and therefore, the final compression amount of the cylindrical spring 13 increases under the premise that the extension amount of the movable end of the first cylinder 18 is unchanged, and the stress of the finger on both sides of the finger gap penetrated by the first pressing plate 29 and the second pressing plate 30 increases accordingly.

[0088] Therefore, for the two contact modes of the pressing member and the robot finger, when the height adjusting mechanism increases the contact point position of the pressing member and the robot finger to improve the stress of the finger in the first contact mode, the opening and closing control mechanism can be triggered to increase the included angle between the first pressing plate 29 and the second pressing plate 30, so that the side surface of the first pressing plate 29 and the second pressing plate 30 can be in contact with the finger in advance when tested in the second contact mode, so as to increase the final compression amount of the cylindrical spring 13, that is, to automatically increase the stress degree of the finger in the two contact modes, and to simulate the stability performance of the finger under different stress conditions in the actual work of the robot.

[0089] As a further scheme of the present application, please refer to Figure 7 and Figure 9 , the opening and closing control mechanism comprises a swing plate 26 fixed with the rotating shaft 25, the first pressing plate 29 and the second pressing plate 30 are connected with the swing plate 26 through a support structure, and a push-pull structure is arranged between the support structure and the rotating shaft 25; two fixed arms 27 are respectively fixed on the two sides of the swing plate 26, and a shaft pin 2701 is fixedly arranged at the end of the fixed arm 27 away from the swing plate 26, and the first pressing plate 29 and the second pressing plate 30 are rotationally connected through the shaft pin 2701.

[0090] The swing plate 26 is provided with a through slot, the support structure comprises two driven blocks 32 symmetrically slidingly embedded in the through slot, and two connecting arms 31 are respectively slidingly arranged on the first pressing plate 29 and the second pressing plate 30, the connecting arms 31 are hinged with the driven blocks 32, and the push-pull structure can drive the two driven blocks 32 to slide towards each other.

[0091] When the lifting plate 21 is lifted to increase the height of the first pressing plate 29 and the second pressing plate 30, the lifting plate 21 drives the push-pull structure to drive the two driven blocks 32 to slide away from each other on the swing plate 26, and then the first pressing plate 29 and the second pressing plate 30 swing synchronously but in different directions, the connecting arm 31 and the first pressing plate 29 and the second pressing plate 30 slide relative to each other, so that the automatic increase of the included angle between the first pressing plate 29 and the second pressing plate 30 is realized.

[0092] The shaft pin 2701 is fixed through the fixing arm 27, so that the initial distance between the first pressing plate 29 and the second pressing plate 30 and the robot hand can be maintained. If the position of the shaft pin 2701 is not fixed, the distance between the first pressing plate 29 and the second pressing plate 30 and the robot hand will be reduced when the first pressing plate 29 and the second pressing plate 30 perform the opening action, and then the force exerted by the first pressing plate 29 and the second pressing plate 30 on the robot hand cannot be effectively adjusted in the subsequent test.

[0093] As a further scheme of the present application, please refer to Figure 5 The push-pull structure comprises a sleeve 28 sleeved on the rotating shaft 25 and a transmission plate 23 provided on the lifting plate 21 through two sets of sliding matching pieces. The transmission plate 23 is rotationally connected with the sleeve 28, and two connecting rods 33 are hinged on the sleeve 28. The ends of the two connecting rods 33 away from the sleeve 28 are respectively hinged with the two driven blocks 32. The sliding matching pieces comprise a supporting arm 2101 fixed on the lifting plate 21 and a sleeve plate 22 sleeved with the supporting arm 2101 and fixedly connected with the transmission plate 23. The side of the sleeve plate 22 is fixedly provided with a protruding column 2201, and the assembly plate 10 is fixedly provided with a limiting plate 34.

[0094] The limiting plate 34 is provided with an inclined groove matched with the protruding column 2201. The protruding column 2201 penetrates through the inclined groove and is slidably connected with the limiting plate 34. When the lifting plate 21 is lifted, the protruding column 2201 slides in the inclined groove and can drive the sleeve plate 22 to drive the sleeve 28 to slide on the rotating shaft 25 towards the swing plate 26 through the transmission plate 23.

[0095] In this embodiment, when the lifting plate 21 rises to increase the height of the first pressing plate 29 and the second pressing plate 30, the convex column 2201 slides through the through slot and the limiting plate 34, the convex column 2201 drives the sleeve plate 22 to move, specifically, the sleeve plate 22 slides on the supporting arm 2101 away from the lifting plate 21, and the sleeve tube 28 slides on the rotating shaft 25 towards the swing plate 26 through the transmission plate 23, thus the sleeve tube 28 can push the two driven blocks 32 through the connecting rod 33, so that the two driven blocks 32 slide away from each other on the swing plate 26, and the first pressing plate 29 and the second pressing plate 30 perform the opening action.

[0096] A stress compression test method of a robot modular fingertip structure, using the test device, comprising the following steps:

[0097] Step one, place the robot hand to be tested on the placing table 2, so that the palm of the robot hand faces the first pressing plate 29 and the second pressing plate 30, and fix the robot hand;

[0098] Step two, the pressure driving mechanism drives the first pressing plate 29 and the second pressing plate 30 to apply force to the robot fingers in the first contact mode;

[0099] Step three, the driving motor 24 drives the first pressing plate 29 and the second pressing plate 30 to deflect 90° through the rotating shaft 25;

[0100] Step four, the pressure driving mechanism drives the first pressing plate 29 and the second pressing plate 30 to apply force to the robot fingers in the second contact mode;

[0101] Step five, the height adjusting mechanism raises the height of the first pressing plate 29 and the second pressing plate 30, and the opening and closing control mechanism increases the included angle between the first pressing plate 29 and the second pressing plate 30;

[0102] Step six, repeat steps two, three and four, and analyze the stress compression capacity of the robot modular fingertip structure according to the collected data.

[0103] It is apparent to those skilled in the art that the present application is not limited to the details of the foregoing exemplary embodiments, and that the present application can be implemented in other specific forms without departing from the spirit or essential characteristics of the present application. Therefore, the embodiments should be considered in all respects as illustrative and not restrictive, and the scope of the present application should be defined by the appended claims rather than the above description, and it is intended to include all changes falling within the meaning and scope of equivalents of the claims. Any reference signs in the claims should not be considered as limiting the claims involved.

[0104] Furthermore, it should be understood that although the specification is described in terms of embodiments, not every embodiment includes every feature described. The specification can include implicit combinations of explicitly mentioned features and / or explicit combinations of implicitely mentioned features. Each embodiment depends on the explicit combinations of features and / or the implicit combinations of features made specifically within that embodiment, and each such embodiment can be combined with every other such embodiment to create further embodiments.

Claims

1. A stress compression testing device for a robot modular fingertip structure, comprising a cabinet and a placement table arranged in the cabinet for placing a robot hand; characterized in that Further comprising: a horizontal moving seat movably arranged in the cabinet and a mounting plate, the horizontal moving seat being horizontally movable by a second linear driving module arranged in the cabinet, and the mounting plate being movable away from or close to the horizontal moving seat by a pressure applying driving mechanism arranged in the cabinet, so that a pressure applying member arranged on a side of the mounting plate away from the horizontal moving seat contacts a robot finger which is a terminal execution module and integrates a touch surface array sensor module, and detects the compression resistance of the terminal of the robot finger connected by a composite locking connection; a lifting plate movably arranged on the mounting plate and a driving motor mounted on the lifting plate, an output end of the driving motor being connected with a rotating shaft, the rotating shaft being connected with the pressure applying member through a clenching control mechanism, and the lifting plate being movable by a height adjusting mechanism arranged on the mounting plate to perform a lifting action to change the height of a contact point between the pressure applying member and a joint of the robot finger provided with a sensor module interface; the pressure applying member comprising a first pressure applying plate and a second pressure applying plate, the two forming a "V"-shaped structure, the clenching control mechanism being triggered when the contact point between the pressure applying member and the robot finger is raised to drive the first pressure applying plate and the second pressure applying plate to perform an opening action; the driving motor being capable of driving the pressure applying member to perform a 90° deflection through the rotating shaft, so that the pressure applying member has two contact modes with the robot finger; one of the two modes being that the ends of the first pressure applying plate and the second pressure applying plate contact the robot finger; the other mode being that the ends of the first pressure applying plate and the second pressure applying plate pass through a gap of the robot finger and the sides thereof contact the robot finger.

2. The robotic modular fingertip structure stress compression testing device of claim 1, wherein, Two sets of guide structures are arranged between the horizontal moving seat and the mounting plate, the guide structures comprising guide plates and telescopic plates fixed to the horizontal moving seat and the mounting plate respectively, the guide plates and the telescopic plates being slidingly fitted; a through opening is arranged on the mounting plate, the pressure applying driving mechanism comprising a cross arm arranged in the through opening and slidingly connected with the mounting plate, two ends of the cross arm each being connected with a set of power components arranged in the cabinet.

3. The robotic modular fingertip structure stress compression testing device of claim 2, wherein, The power components comprise a cross plate fixed in the cabinet and hollow inside and first and second sliding blocks slidingly arranged in the cross plate, the cross arm being fixedly connected with the second sliding block, and the first and second sliding blocks being connected with an elastic structure therebetween; the power components further comprising a first air cylinder rotatably mounted in the cabinet, a movable end of the first air cylinder being hingedly connected with the first sliding block.

4. The robotic modular fingertip structure stress compression testing device of claim 3, wherein, The elastic structure comprises a cross rod fixed with the first sliding block and a cylindrical spring sleeved on an outer periphery of the cross rod, the cross rod penetrating through the second sliding block and being slidingly connected with the second sliding block; wherein one end of the cross rod away from the first sliding block is fixed with a circular truncated cone, an internal pressure sensor is arranged in the circular truncated cone, one end of the cylindrical spring is connected with the second sliding block, and the other end thereof is in abutment with the internal pressure sensor.

5. The robotic modular fingertip structure stress compression testing device of claim 1, wherein, Two guide rails are fixed on the assembly plate, the height adjusting mechanism comprises two vertical arms which are respectively slidably fitted on the two guide rails, the lifting plate is fixedly connected with the two vertical arms, and a second air cylinder is rotatably installed on the assembly plate, and the movable end of the second air cylinder is hingedly connected with the vertical arm.

6. The robotic modular fingertip structure stress compression testing device of claim 1, wherein, The opening and closing control mechanism comprises a swing plate fixed with the rotating shaft, the first pressing plate and the second pressing plate are connected with the swing plate through a support structure, and a push-pull structure is arranged between the support structure and the rotating shaft. The swing plate is provided with a through slot, the support structure comprises two driven blocks which are symmetrically slidably fitted in the through slot, two connecting arms are slidably arranged on the first pressing plate and the second pressing plate respectively, the connecting arms are hingedly connected with the driven blocks, and the push-pull structure can drive the two driven blocks to slide towards each other.

7. A robotic modular fingertip structure stress compression testing device according to claim 6, wherein, The push-pull structure comprises a sleeve pipe slidably sleeved on the rotating shaft and a transmission plate arranged on the lifting plate through two groups of sliding fit members, the transmission plate is rotatably connected with the sleeve pipe, two connecting rods are hingedly connected with the sleeve pipe, and one end of each of the two connecting rods is hingedly connected with a driven block.

8. The robotic modular fingertip structure stress compression testing device of claim 7, wherein, The sliding fit member comprises a support arm fixed on the lifting plate and a sleeve plate slidably sleeved with the support arm and fixedly connected with the transmission plate, a convex column is fixedly arranged on the side of the sleeve plate, and a limiting plate is fixed on the assembly plate.

9. A robotic modular fingertip structure stress compression testing device according to claim 8, wherein, The limiting plate is provided with an inclined groove matched with the convex column, the convex column penetrates through the inclined groove and is slidably connected with the limiting plate, when the lifting plate rises, the convex column slides in the inclined groove, and the sleeve plate can drive the sleeve pipe to slide on the rotating shaft towards the swing plate through the transmission plate. The method comprises the following steps:

10. A method of stress compression testing of a robotic modular fingertip structure using the testing apparatus of any one of claims 1-9, wherein, Step one, place the robot hand to be tested on the placement table, so that the palm of the robot hand faces the first pressing plate and the second pressing plate, and fix the robot hand; Step two, the pressure driving mechanism drives the first pressing plate and the second pressing plate to apply force to the robot fingers in the first contact mode; Step three, the driving motor drives the first pressing plate and the second pressing plate to deflect 90° through the rotating shaft; Step four, the pressure driving mechanism drives the first pressing plate and the second pressing plate to apply force to the robot fingers in the second contact mode; Step five, the height adjusting mechanism lifts the height of the first pressing plate and the second pressing plate, and the opening and closing control mechanism increases the included angle between the first pressing plate and the second pressing plate; Step six, repeat steps two, three and four, analyze the stress and compression resistance of the robot modular fingertip structure according to the collected data. ​

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