Preparation method of low-damage polished leather for brittle material

Abstract

The invention discloses a preparation method of a low-damage polishing leather for a brittle material, and belongs to the technical field of polishing leather preparation, the method comprises the following steps: taking a rubber base material and dibutyl phthalate glue according to a ratio, putting the rubber base material and the dibutyl phthalate glue into an internal mixer, carrying out preliminary softening treatment, taking polishing powder according to a ratio, and gradually adding the polishing powder; the preparation method comprises the following steps: taking sulfur, zinc dithiocarbamate, an anti-aging agent, titanate or aluminate, a quaternary ammonium salt type cationic surfactant and carbon black filler in proportion, and continuously mixing until the mixture is uniform; tabletting the uniformly mixed rubber material through an open mill, carrying out fine tabletting on the rubber material subjected to primary tabletting, putting the rubber material subjected to fine tabletting into a mold, carrying out hot-pressing vulcanization, taking out a sheet after vulcanization, cooling, and carrying out mechanical polishing on the surface of the vulcanized rubber sheet, so as to remove surface impurities and improve the smoothness; and the surface smoothness and the polishing performance are improved through acid washing or alkali washing.

Description

Technical Field

[0001] This invention belongs to the field of polishing skin preparation technology, specifically, it relates to a method for preparing low-damage polishing skin for brittle materials. Background Technology

[0002] Brittle materials such as glass, ceramics, silicon carbide, and monocrystalline silicon exhibit significantly different properties from metallic materials during polishing due to their strong interatomic bonding and low fracture toughness. They are highly susceptible to surface and subsurface damage during machining. The core challenge of traditional polishing processes lies in the fact that pursuing high polishing efficiency often leads to microcracks and chipping on the surface of brittle materials when increasing the abrasive cutting force; conversely, excessively controlling damage significantly reduces the material removal rate, impacting processing efficiency.

[0003] Existing polishing consumables mainly suffer from the following problems: While metal grinding discs possess high rigidity and wear resistance, they lack cushioning properties, easily causing surface damage when polishing brittle materials; natural rubber polishing pads, although offering some cushioning, have poor wear resistance, short service life, and insufficient dispersion and retention of polishing powder. Furthermore, conventional polishing pads are prone to performance degradation under high temperature and pressure conditions, failing to meet the stability requirements of precision polishing. Currently available polishing pads made from materials such as natural rubber, styrene-butadiene rubber, and neoprene rubber struggle to achieve an ideal balance in terms of polishing efficiency, surface quality, and product lifespan.

[0004] To address the aforementioned issues, existing technologies urgently need improvement. Summary of the Invention

[0005] The purpose of this section is to outline some aspects of embodiments of the present invention and to briefly describe some preferred embodiments. Simplifications or omissions may be made in this section, as well as in the abstract and title of this application, to avoid obscuring the purpose of these documents; however, such simplifications or omissions should not be construed as limiting the scope of the invention.

[0006] To solve the above problems, the present invention adopts the following technical solution.

[0007] A method for preparing a low-damage polishing sheet for brittle materials includes the following steps: A rubber substrate and dibutyl phthalate are placed in a mixer for preliminary softening treatment at a temperature controlled at 60-80℃ for 5-10 minutes; Polishing powder is added gradually at a ratio, and the mixing time is 10-20 minutes; Sulfur, zinc dithiocarbamate, antioxidant, titanate or aluminate, quaternary ammonium salt cationic surfactant, and carbon black filler are added at a ratio, and the mixture is further mixed until homogeneous for 15-20 minutes; The homogeneous rubber compound is then pressed into sheets using a two-roll mill, with the sheet thickness controlled at 5-10 mm, and the temperature controlled at... The initial pressing temperature is controlled at 70-90℃, and the pressing time is 5-10 minutes. After initial pressing, the rubber compound is finely pressed, with the sheet thickness controlled at 1-5mm to ensure uniform thickness. The pressing time is 5-10 minutes. The finely pressed rubber compound is placed in a mold and hot-pressed for vulcanization. The vulcanization temperature is controlled at 140-160℃, the vulcanization time is 20-30 minutes, and the pressure is controlled at 5-10MPa. After vulcanization, the sheet is removed and cooled for 10-15 minutes. The surface of the vulcanized rubber sheet is mechanically polished to remove surface impurities and improve gloss. Acid washing or alkali washing is used to improve surface gloss and polishing performance.

[0008] Preferably, the polishing powder is one of aluminum oxide, silicon carbide, cerium oxide, or diamond powder.

[0009] Preferably, the following testing steps are also included: testing the physical properties of the finished polished skin, such as hardness, tensile strength, and elongation at break, to ensure that it meets the standard requirements; then testing the wear resistance of the polished skin through an abrasion test to ensure its durability in actual use; and finally conducting an actual polishing test to test the polishing efficiency and effect of the polished skin to ensure that it meets the application requirements.

[0010] Preferably, the rubber substrate can be silicone rubber or polyurethane; The rubber substrate can be made of rubber, silicone, or polyurethane.

[0011] Preferably, the sulfur is 0.5-2 parts; the dibutyl phthalate adhesive is 5-8 parts; the polishing powder is 20-50 parts; the zinc dithiocarbamate is 0.5-1 parts; the antioxidant is 1-2 parts; the titanate or aluminate is 0.05-0.1 parts; the quaternary ammonium salt cationic surfactant is 1-2 parts; and the carbon black filler is 5-10 parts.

[0012] Preferably, the polishing powder has a particle size of 300nm-2000nm; the antioxidant is diphenylamine.

[0013] Preferably, nano-SiO2 is added during the initial softening treatment of the rubber substrate and dibutyl phthalate rubber in an internal mixer.

[0014] Preferably, the carbon black filler is acetylene black.

[0015] Preferably, polytetrafluoroethylene (PTFE) micro powder and silicone oil are added at the same time as polishing powder. The silicone oil needs to be mixed with titanate or aluminate for 10 minutes before being added and kneaded.

[0016] The present invention also discloses a polishing skin prepared by the above-described preparation method.

[0017] Compared with the prior art, the beneficial effects of the present invention are as follows: This application provides a low-damage polishing skin for brittle materials and its preparation method. By optimizing key steps such as softening of the rubber substrate, mixing of polishing powder, vulcanization process and surface treatment, and using a specific formulation of additives, it effectively buffers mechanical stress while ensuring material removal efficiency. It has the advantages of significantly reducing surface damage to brittle materials, improving the wear resistance and service life of the polishing skin while ensuring polishing efficiency. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of a low-damage polishing skin for brittle materials according to this application. Detailed Implementation

[0019] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0020] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the invention. Therefore, the invention is not limited to the specific embodiments disclosed below.

[0021] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places throughout this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that mutually excludes other embodiments. The present invention provides the following embodiments.

[0022] Example 1 As a preferred embodiment, the solution of this application is specifically implemented as follows: The low-damage polishing skin products for this brittle material can be rubber-based, silicone-based, or polyurethane-based. In traditional polishing processes for brittle materials, there is a significant trade-off between material removal rate and surface integrity. When using metal grinding discs as polishing tools, the excessive rigidity of the contact interface causes stress concentration on the brittle material surface due to the abrasive grains. This leads to subsurface crack propagation depth exceeding the critical cutting depth, resulting in irreversible damage such as conchoidal fracture. While using natural rubber-based polishing pads alleviates contact stress concentration due to the reduced elastic modulus, the material's insufficient tear resistance reduces abrasive grain retention. Under continuous mechanical loads, this results in synergistic deterioration of abrasive grain shedding and substrate wear, shortening the effective cutting time window to an unacceptable level.

[0023] For example, in the chemical mechanical polishing (CMP) process of silicon carbide wafers, users employ styrene-butadiene rubber-based polishing pads in conjunction with diamond abrasives for planar machining. When the spindle speed increases to 120 rpm and the downforce reaches 0.3 MPa, shear slip occurs at the interface between the abrasive grains and the substrate, resulting in a 40% decrease in the effective abrasive grain density actually participating in the cutting. At this point, to maintain the material removal rate, the abrasive concentration needs to be increased to 35 wt%, but this operation causes abrasive grain agglomeration, resulting in a localized increase in scratch density to 15 scratches / mm². Simultaneously, the rubber substrate undergoes permanent deformation under cyclic stress, and the thickness tolerance exceeds the process control standard of ±5 μm after 4 hours of continuous operation.

[0024] If these problems are not addressed, the processing of brittle materials will face the dual risks of uncontrolled surface quality and processing efficiency. In the field of optical component manufacturing, the depth fluctuation of the subsurface damage layer directly affects the coating adhesion, leading to a two-order-of-magnitude decrease in optical transmittance. In semiconductor wafer processing, the anisotropy of surface roughness can cause linewidth deviations in subsequent photolithography processes, causing the device breakdown voltage dispersion to exceed design tolerances. More seriously, the performance degradation of polishing tools will significantly increase the frequency of process compensation, and the extended processing cycle per batch will lead to a production cost increase of more than 30%, directly hindering the industrial application of third-generation semiconductor materials.

[0025] When faced with the above problems, refer to Figure 1This application first analyzes the performance defects of rigid tools and elastic matrices in existing technologies, finding that the contradiction between the stress distribution at the material interface and the abrasive grain retention capacity is the core issue. Addressing the dynamic load transfer characteristics during the polishing of brittle materials, this application considers balancing buffering and cutting requirements by constructing a gradient composite structure. Three improvement directions were explored: first, developing a multi-layer composite polishing skin, achieving stress gradient distribution through the stacking process of layers with different moduli; second, employing in-situ reinforcement technology to introduce nano-reinforcing phases into the rubber matrix to improve mechanical properties; and third, optimizing filler dispersion and interfacial bonding to establish a stable abrasive grain support system. Comparative analysis revealed that multi-layer structures increase the risk of interfacial failure, and in-situ reinforcement is sensitive to processing temperature, easily leading to performance fluctuations. However, through specific mixing processes and the synergistic effect of functional additives, performance optimization can be achieved in a single material system. Ultimately, a technology path centered on interface control was chosen.

[0026] First, the rubber substrate and dibutyl phthalate rubber are placed in a mixer in a predetermined ratio for preliminary softening treatment; the temperature is controlled at 70℃ and the treatment time is 8 minutes. This step aims to fully soften the rubber substrate and improve the uniformity of subsequent mixing.

[0027] Next, take a predetermined proportion of polishing powder, such as alumina powder, and gradually add it to the internal mixer. Set the mixing time to 15 minutes to ensure that the polishing powder is fully mixed with the softened rubber substrate.

[0028] Next, according to the formula ratio, sulfur, zinc dithiocarbamate, antioxidant, titanate, quaternary ammonium cationic surfactant, and carbon black filler are added to the internal mixer in sequence. Continue mixing for 18 minutes until all components are evenly dispersed.

[0029] Then, the well-mixed rubber compound is transferred to a two-roll mill for initial sheeting. The sheet thickness is controlled at 8 mm, the temperature is set at 80°C, and the sheeting time is 7 minutes.

[0030] Further, the pre-compressed rubber compound is subjected to fine compression. The sheet thickness is controlled at 3mm to ensure uniform thickness, and the compression time is 8 minutes.

[0031] Subsequently, the finely compressed rubber compound is placed in a mold and subjected to a hot-press vulcanization process. The vulcanization temperature is set at 150℃, the vulcanization time is 25 minutes, and the pressure is controlled at 8MPa.

[0032] After vulcanization, remove the film and allow it to cool. Set the cooling time to 12 minutes to ensure the film is fully cured.

[0033] The surface of the vulcanized film is mechanically polished to remove surface impurities and improve its smoothness.

[0034] Finally, acid washing is used to further improve the surface smoothness and polishing performance of the film.

[0035] The preliminary softening treatment refers to the process of heating and mixing the rubber substrate and dibutyl phthalate. When the rubber substrate and dibutyl phthalate are placed in an internal mixer for preliminary softening treatment, nano-SiO2 is preferentially added. Specifically, this can be achieved by treating the mixture at 60-80℃ for 5-10 minutes in an internal mixer. This step balances the plasticizing effect and the thermal stability of the material by controlling the temperature and time range, thus providing a uniform matrix for the subsequent dispersion of fillers.

[0036] The phased addition refers to adding polishing powder and vulcanizing agent separately at different mixing stages. Specifically, this can be achieved by first adding polishing powder and mixing for 10-20 minutes, and then adding vulcanizing agent and mixing for 15-20 minutes. This operation avoids the premature reaction of the agent, which may affect the dispersion of the polishing powder, and ensures the gradient distribution of functional components in the matrix.

[0037] Among them, the composite vulcanization system refers to the combined use of sulfur and zinc dithiocarbamate. Specifically, it can be achieved by using a ratio of 0.5-2 parts sulfur and 0.5-1 parts zinc dithiocarbamate. This system uses sulfur to provide the main crosslinking network and zinc dithiocarbamate to assist in vulcanization, thereby improving wear resistance while maintaining the elasticity of rubber.

[0038] The double pressing process refers to first forming a 5-10mm base sheet and then pressing it to 1-5mm. Specifically, this can be achieved by using an open mill at 70-90℃ for two pressings, each lasting 5-10 minutes. This process eliminates internal air bubbles by gradually reducing the thickness, ensuring the uniformity of the polished skin density.

[0039] Among them, the hot-press vulcanization parameters refer to the vulcanization process at 140-160℃ for 20-30 minutes. Specifically, it can be achieved by high-temperature cross-linking under a pressure of 5-10MPa. This combination of parameters enables the rubber molecular chains to fully cross-link and form a three-dimensional network, maintaining elastic buffering capacity while ensuring material strength.

[0040] Among them, the dual surface treatment refers to the combination of mechanical polishing and acid-base cleaning. Specifically, it can be achieved by sanding with a belt and then immersing in a pH 2-4 acid solution or a pH 10-12 alkaline solution. This treatment removes surface burrs and controls micro-roughness, reducing the risk of scratching brittle materials during the polishing process.

[0041] Through the above-described solution, this application solves the problem of balancing high polishing efficiency and low surface damage during the polishing of brittle materials. The resulting polishing skin possesses excellent buffering and cutting capabilities, effectively reducing damage to the surface of brittle materials while ensuring polishing efficiency. Specifically, the polishing skin exhibits excellent wear resistance and abrasive grain retention during use, effectively extending its service life. Furthermore, through an optimized interface structure, the polishing skin can form a uniform stress distribution on the surface of brittle materials, reducing surface damage caused by localized stress concentration. Moreover, the polishing skin maintains stable performance even under high-speed polishing conditions, improving processing efficiency. Therefore, the solution presented in this application provides an effective solution for the precision polishing of brittle materials, contributing to improved surface quality and production efficiency of brittle material products.

[0042] Example 2 Reference Figure 1 In some of the solutions described above in this application, polishing powder is used as a key component to improve polishing efficiency and reduce damage to brittle materials. However, in the actual implementation process, if the type of polishing powder is not properly selected, it may lead to a mismatch between the cutting force and the buffering requirements of the material surface, which in turn leads to problems such as low polishing efficiency or aggravated surface damage.

[0043] In this regard, this application further proposes that the polishing powder is one of alumina, silicon carbide, cerium oxide or diamond powder.

[0044] Among them, the hardness of alumina is controlled below Mohs hardness 9, and its particle size range can be selected from 300-2000nm. When mixed in an internal mixer, it matches the softening temperature of the rubber substrate of 60-80℃ to form a uniform dispersion system. The Vickers hardness of silicon carbide can reach above 25GPa. Its particle morphology is formed into a polyhedral structure through ball milling pretreatment. During the mixing process, it forms a three-dimensional network structure in synergy with the sulfur vulcanization system. The chemical activity of cerium oxide is enhanced by the dispersing effect of quaternary ammonium salt cationic surfactant. During the hot pressing vulcanization stage at 140-160℃, it forms a chemical bond with the titanate coupling agent. The particle size distribution of diamond powder is controlled below D50=1μm through centrifugal classification. During the mixing step, it forms a gradient hardness distribution with carbon black filler.

[0045] Specifically, during the softening stage of the rubber substrate, alumina particles are uniformly embedded in the gaps between rubber molecular chains through the plasticizing effect of dibutyl phthalate (DBP). During subsequent vulcanization, this forms a microscopic composite structure of hard and elastic phases, with an elastic modulus controllable within the range of 0.5-2 GPa, ensuring both efficient cutting force transmission and providing deformation buffer space. Silicon carbide particles, in the mixing stage, work together with zinc dithiocarbamate accelerator to promote the formation of a chemical adsorption layer on the particle surface using a sulfur crosslinking network. The thickness of this adsorption layer, measured by XPS, is 2-5 nm, effectively inhibiting particle shedding. Cerium oxide undergoes a hydrolysis reaction with the material surface during the post-acid pickling treatment stage. AFM observation shows that its surface roughness can be reduced to Ra < 0.5 nm. This process, along with the antioxidant effect of the anti-oxidant, maintains the stability of the polished interface. In the mechanical polishing process, diamond powder forms a self-sharpening effect through particle size matching. Its cutting depth is controlled at the submicron level by white light interferometer measurement, forming a dynamic balance with the resilience of the vulcanized film. The material removal rate can be increased to 200-500 nm / min and the subsurface damage depth is <100 nm.

[0046] As a preferred embodiment, the solution of this application is specifically implemented as follows: Alumina was chosen as the polishing powder. Alumina powder possesses moderate hardness and chemical stability, ensuring cutting efficiency while minimizing scratches on brittle materials. During preparation, alumina powder was added in a specific ratio to a mixture of pre-softened rubber substrate and dibutyl phthalate (DBP) for 15 minutes. The alumina powder particle size was selected as 500 nm to ensure good polishing results and surface finish.

[0047] Example 3 Reference Figure 1 When preparing low-damage polishing skin for brittle materials, diphenylamine is selected as the antioxidant.

[0048] Specifically, during the mixing process, 1-2 parts of diphenylamine antioxidant are added according to the formula. Diphenylamine can be fully mixed with other components such as sulfur and zinc dithiocarbamate to ensure uniform distribution in the rubber matrix during subsequent hot-pressing vulcanization. Thus, at a vulcanization temperature of 140-160℃, diphenylamine can effectively exert its antioxidant effect and protect the rubber matrix from the effects of high temperature.

[0049] Example 4 Reference Figure 1 One part of sulfur, six parts of dibutyl phthalate, 35 parts of polishing powder, 0.8 parts of zinc dithiocarbamate, 1.5 parts of antioxidant, 0.08 parts of titanate, 1.5 parts of quaternary ammonium salt cationic surfactant, and 7 parts of carbon black filler are mixed, pressed, vulcanized, and processed according to the steps described in Example 1 to prepare a low-damage polishing skin for brittle materials.

[0050] Example 5 Reference Figure 1 In preparing low-damage polishing sheets for brittle materials, alumina with a particle size of 500 nm was selected as the polishing powder. First, the rubber substrate and dibutyl phthalate were placed in a mixer for initial softening treatment at 70°C for 8 minutes. Then, the polishing powder was gradually added, mixing for 15 minutes. Next, sulfur, zinc dithiocarbamate, antioxidants, titanate, quaternary ammonium cationic surfactants, and carbon black filler were added, and mixing continued until homogeneous for 18 minutes. The homogeneous rubber compound was then pressed into sheets using a two-roll mill, with the sheet thickness controlled... At a thickness of 7mm, a temperature controlled at 80℃, and a pressing time of 7 minutes, the rubber compound is initially pressed into fine sheets, controlling the sheet thickness to 3mm to ensure uniform thickness. The pressing time is 8 minutes. The finely pressed rubber compound is then placed in a mold and subjected to hot-press vulcanization at a temperature controlled at 150℃ for 25 minutes and a pressure controlled at 8MPa. After vulcanization, the sheet is removed and cooled for 12 minutes. The surface of the vulcanized sheet is then mechanically polished to remove surface impurities and improve gloss. Finally, acid pickling is used to further improve surface gloss and polishing performance.

[0051] Example 6 Reference Figure 1 After the rubber substrate has softened, nano-SiO2 should be added first. Specifically, after the rubber substrate has undergone preliminary softening treatment, the pre-prepared nano-SiO2 powder can be added immediately. The amount of nano-SiO2 added can be adjusted according to actual needs. For example, it can be selected to account for 1% to 5% of the mass of the rubber substrate. After adding nano-SiO2, it should be mixed thoroughly. The mixing time can be controlled between 5 and 10 minutes to ensure that the nano-SiO2 can be evenly dispersed in the softened rubber substrate. Subsequently, other formulation components are added in the predetermined order, and the mixing continues.

[0052] Example 7 Reference Figure 1 In the preparation of polished leather, when mixing the rubber compound, acetylene black is added as a carbon black filler to the internal mixer and mixed with sulfur, zinc dithiocarbamate, antioxidant, titanate, and quaternary ammonium salt cationic surfactant. The temperature of acetylene black mixed with the rubber substrate in the internal mixer is maintained at 70°C and the mixing time is controlled at 18 minutes to ensure that its chain structure is fully dispersed in the rubber compound. After mixing, the rubber compound is subjected to hot-press vulcanization treatment. The vulcanization temperature is set at 150°C, the pressure is maintained at 8MPa, and the vulcanization time is 25 minutes. After vulcanization, the rubber sheet is mechanically polished and the surface is acid-washed to remove residual impurities.

[0053] Example 8 Reference Figure 1In the mixing process, alumina polishing powder with a particle size of 800nm ​​and polytetrafluoroethylene (PTFE) micro powder are simultaneously added to the internal mixer at a mass ratio of 100:3. The particle size of the PTFE micro powder is controlled below 5μm. Dimethyl silicone oil is used as the silicone oil and is pre-mixed with titanate coupling agent at 60℃ for 10 minutes. The mixing ratio is silicone oil: titanate = 20:1. The pre-treated silicone oil-titanate composite system is uniformly added to the internal mixer by spraying and mixed with rubber substrate, polishing powder and PTFE micro powder for 18 minutes. The mixing temperature is maintained at 75℃. During the mixing process, the rotor speed of the internal mixer is set to 40rpm to ensure sufficient shearing and dispersion of materials.

[0054] This application further proposes a polished skin prepared using the above-described method.

[0055] The above description, in conjunction with specific embodiments, provides a further detailed explanation of the present invention. It should not be construed that the specific implementation of the present invention is limited to these descriptions. For those skilled in the art, several simple deductions or substitutions can be made without departing from the concept of the present invention, and all such deductions or substitutions should be considered to fall within the scope of protection defined by the claims submitted herein.

Claims

1. A method for preparing a low-damage polishing skin for brittle materials, characterized in that, Includes the following steps: Take the rubber base material and dibutyl phthalate rubber in proportion and put them into the internal mixer for preliminary softening treatment. The temperature is controlled at 60-80℃ and the time is 5-10 minutes. Take the polishing powder according to the ratio and add it gradually, mixing for 10-20 minutes; Take sulfur, zinc dithiocarbamate, antioxidant, titanate or aluminate, quaternary ammonium salt cationic surfactant and carbon black filler in proportion, and continue to mix until uniform. The mixing time is 15-20 minutes. The uniformly mixed rubber compound is pressed into sheets using an open mill. The sheet thickness is controlled at 5-10 mm, the temperature is controlled at 70-90℃, and the pressing time is 5-10 minutes. After initial compression, the rubber compound is subjected to fine compression, controlling the sheet thickness to 1-5mm to ensure uniform thickness. The compression time is 5-10 minutes. The finely compressed rubber compound is placed in a mold and hot-pressed for vulcanization. The vulcanization temperature is controlled at 140-160℃, the vulcanization time is 20-30 minutes, and the pressure is controlled at 5-10MPa. After vulcanization, remove the sheet and cool it for 10-15 minutes. Mechanical polishing is performed on the surface of the vulcanized film to remove surface impurities and improve its smoothness; Acid or alkali washing can improve surface smoothness and polishing performance.

2. The method for preparing a low-damage polishing skin for brittle materials according to claim 1, characterized in that, The polishing powder is one of aluminum oxide, silicon carbide, cerium oxide, or diamond powder.

3. The method for preparing a low-damage polishing skin for brittle materials according to claim 1, characterized in that, It also includes the following testing steps: Test the physical properties of the finished polished leather, such as hardness, tensile strength, and elongation at break, to ensure that it meets the standard requirements; Next, the abrasion resistance of the polishing pad is tested through abrasion tests to ensure its durability in actual use. Finally, actual polishing tests are conducted to test the polishing efficiency and effect of the polishing pad to ensure that it meets application requirements.

4. The method for preparing a low-damage polishing skin for brittle materials according to claim 1, characterized in that, The rubber substrate can be silicone rubber or polyurethane; The rubber substrate can be made of rubber, silicone, or polyurethane.

5. The method for preparing a low-damage polishing skin for brittle materials according to claim 1, characterized in that, The sulfur is taken in portions of 0.5-2 parts; Take 5-8 parts of the dibutyl phthalate gum; Take 20-50 parts of the polishing powder; The zinc dithiocarbamate is taken in portions of 0.5-1 parts; Take 1-2 parts of the antioxidant; The titanate or aluminate is taken in portions of 0.05-0.1 parts; Take 1-2 parts of the quaternary ammonium salt cationic surfactant; The carbon black filler is taken in portions of 5-10 parts.

6. The method for preparing a low-damage polishing skin for brittle materials according to claim 5, characterized in that, The polishing powder has a particle size of 300nm-2000nm; the antioxidant is diphenylamine.

7. The method for preparing a low-damage polishing skin for brittle materials according to claim 1, characterized in that, Nano-SiO2 is preferentially added during the initial softening treatment of rubber substrate and dibutyl phthalate rubber in an internal mixer.

8. The method for preparing a low-damage polishing skin for brittle materials according to claim 1, characterized in that, The carbon black filler is acetylene black.

9. The method for preparing a low-damage polishing skin for brittle materials according to claim 1, characterized in that, When adding polishing powder, add polytetrafluoroethylene (PTFE) micro powder and silicone oil. The silicone oil needs to be mixed with titanate or aluminate for 10 minutes before adding and mixing.

10. A polished leather prepared by the preparation method according to any one of claims 1-9.

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