A method for manufacturing a liquid crystal panel
By using a shared APR plate design, the TFT substrate and CF substrate can share a single APR plate for PI coating, which solves the problems of high equipment investment and low efficiency in LCD panel manufacturing, and achieves cost savings and smooth production.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- YANTAI GUANGXIAN NEW MATERIAL TECHNOLOGY CO LTD
- Filing Date
- 2025-12-05
- Publication Date
- 2026-05-12
AI Technical Summary
In the existing technology, the PI coating process in the LCD panel manufacturing process requires two separate production lines, which results in high equipment investment costs and low production efficiency. In addition, the frequent replacement and cleaning of APR plates affects production continuity and product quality.
The APR plate co-printing design method is adopted, so that the TFT substrate and CF substrate share the same APR plate for PI roller coating. By judging the relationship between the PI printing pattern and the spacing of the four sides of the substrate, the co-printing conditions are determined, and substrate printing flow direction marks and alignment marks are set on the APR plate to ensure coating accuracy and correct flow direction.
It reduced equipment investment costs, improved production efficiency, reduced the number of APR plate replacements and cleanings, ensured product quality stability and smooth production process, reduced the risk of operational errors, and enhanced market competitiveness.
Smart Images
Figure CN121411035B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of liquid crystal display manufacturing technology, and more particularly to a method for manufacturing a liquid crystal panel. Background Technology
[0002] In the manufacturing process of thin-film transistor liquid crystal display (TFT-LCD) panels, polyimide (PI) alignment films play a crucial role. They combine with the anisotropy and birefringence properties of liquid crystals to achieve the display function. On a substrate lacking an alignment film, liquid crystal molecules are randomly aligned, resulting in an inability to effectively control the direction of light and thus preventing the generation of the desired color image. This is because the rotation direction of the liquid crystal molecules cannot be precisely controlled when voltage is applied, and there is a lack of pretilt angle, leading to a degraded image quality. To ensure correct alignment of liquid crystal molecules, a PI film must be coated on the surfaces of the TFT substrate and the color filter (CF) substrate. The PI film is then treated by rubbing or photoalignment processes to achieve the directional alignment of the liquid crystal molecules.
[0003] Currently, the mainstream PI film deposition processes in the industry mainly include inkjet printing and roller coating. Inkjet printing technology is particularly suitable for the production of large-size products due to its high efficiency; while roller coating technology is more suitable for the manufacturing of small-size, high pixel density (PPI) products.
[0004] In roller coating processes, the Alignment Plate (APR) is an indispensable fixture. Before making the APR, a detailed layout design must be carried out according to the specific requirements of the product to ensure the accuracy of the coating process and the quality of the final product.
[0005] In the production planning of LCD panel factories, there are two feasible options for setting up PI roller coating process production lines.
[0006] The first approach is a dual-production line model, which involves setting up two separate PI roller coating production lines. One line is dedicated to coating TFT substrates, while the other is used for coating CF substrates, with each line equipped with its own dedicated APR plate. The advantage of this approach is its ability to achieve parallel production, which helps to increase overall capacity to some extent. However, its significant disadvantage is the high initial investment cost, requiring substantial funds for equipment purchase, installation, and subsequent maintenance.
[0007] The second approach is a single-production-line mode, which involves setting up only one PI roller coating process production line. During production, PI coating of TFT substrates is performed centrally on a lot-by-lot basis, and then the process switches to PI coating of CF substrates. If the TFT and CF substrates can share the same APR plate, then during production process transitions, there is no need to replace or clean the APR plate, nor is it necessary to re-adjust and check the coating alignment accuracy. This not only effectively improves production efficiency and avoids time losses caused by equipment adjustments, but also significantly saves on production line investment costs, reducing expenses for equipment procurement and related supporting facilities.
[0008] APR plates, as specialized fixtures for PI roller coating, are consumables with a limited lifespan. In mass production, a single production line requires at least three sets of APR plates to ensure production continuity. One set serves as the primary fixture for current production, continuously used in the line process; another set is used for cleaning and rotation, undergoing a professional cleaning process to remove oil, debris, and other impurities accumulated during production, restoring its surface finish and compatibility, preparing it for the next round of use; the last set serves as a backup fixture, always on standby. If the currently used APR plate experiences excessive wear, performance degradation, or sudden malfunction, it can be immediately replaced, preventing production line shutdowns due to fixture issues and ensuring a smooth and efficient mass production rhythm. A dual production line mode requires at least six sets of APR plates to ensure production continuity and stability.
[0009] In conclusion, while the dual-line model offers capacity advantages, it comes at a high cost for LCD panel manufacturers planning PI roller coating production lines. The single-line model, assuming the TFT and CF substrates can share the same APR plate, offers both cost savings and efficiency improvements, making it a more ideal choice. However, the successful implementation of this solution heavily relies on the crucial prerequisite that the TFT and CF substrates can share the same APR plate. Summary of the Invention
[0010] To address the shortcomings of existing technologies, this invention provides a method for manufacturing a liquid crystal panel, primarily a design method for APR plate co-coating, wherein the APR plate co-coating refers to the TFT substrate and CF substrate sharing a single APR plate for PI roller coating.
[0011] The technical solution of the present invention to solve the above-mentioned technical problems is as follows:
[0012] A method for manufacturing a liquid crystal panel, used for APR (Advanced Perspective) plate co-printing design, wherein the APR plate co-printing refers to the use of a single APR plate for the roll coating of polyimide (PI) for both the thin-film transistor (TFT) substrate and the color filter (CF) substrate; the design steps include:
[0013] Whether the co-printing condition is met is determined based on the spacing relationship between the PI printed pattern and the four sides of the substrate. The spacing includes left spacing a, top spacing b, right spacing c, and bottom spacing d.
[0014] If either a=c or b=d is satisfied, then the TFT substrate and the CF substrate are determined to be capable of co-design.
[0015] By adopting the above technical solution, this invention can accurately determine whether the TFT substrate and CF substrate meet the co-printing design conditions based on the specific relationship between the PI printed pattern and the spacing of the four sides of the substrate. When either a=c or b=d is met, it can be determined that the two can be co-printed, providing a clear and reliable basis for subsequent co-printing operations. Compared to the traditional method of setting up two separate production lines and equipping each TFT substrate and CF substrate with a dedicated APR plate, the co-printing design method proposed in this invention greatly reduces production line investment costs. It eliminates the need to purchase two sets of equipment, perform two installations, and subsequent double maintenance, and also significantly reduces the procurement cost of APR plates, saving substantial funds and allowing for more rational resource allocation in production planning. Furthermore, in the production process, if the TFT substrate and CF substrate can share the same APR plate, there is no need to replace or clean the APR plate during production process transitions, nor is it necessary to re-adjust and check the coating alignment accuracy. This not only effectively improves production efficiency and avoids time losses caused by equipment adjustments, but also makes the production process smoother and more efficient, enabling faster completion of production tasks and meeting market demands. Moreover, by reducing unnecessary operational steps, the risk of product quality problems caused by operational errors is reduced, further ensuring the quality stability of the final product and enhancing its market competitiveness.
[0016] Furthermore, the determination of co-printing conditions based on spacing relationships specifically includes:
[0017] When a=c and b≠d, it is determined to be a co-designable substrate, and the TFT substrate and CF substrate adopt the same PI coating process.
[0018] When a≠c and b=d, it is determined to be a co-printable design, but the TFT substrate and CF substrate use different PI coating processes.
[0019] When a≠c and b≠d, it is determined to be a non-copyrightable design.
[0020] Furthermore, if the TFT substrate and CF substrate use different PI coating processes, and the glass flow angle of the TFT substrate is located at the lower left corner of the coating platform, then the CF substrate needs to be rotated 180 degrees so that its larger angle is located at the upper right corner of the coating platform before PI coating is performed. The coated substrates are then assembled normally.
[0021] By adopting the above technical solution, in the special case where the TFT substrate and CF substrate use different PI coating processes, this invention further considers the influence of glass flow direction on the coating effect. When the large angle of the glass flow direction of the TFT substrate is located at the lower left corner of the coating platform, the substrate flow direction is changed by an automatic transport program, and the CF substrate is rotated 180 degrees so that its large angle corresponds to the upper right corner of the coating platform. This maintains the stability of the coating equipment and ensures the accurate matching of the two substrates in the subsequent assembly process.
[0022] Furthermore, the APR plate design includes substrate printing flow direction marks to prevent mistakes during the PI coating process and ensure the correct glass flow direction; these substrate printing flow direction marks are also known as large angle indicator marks.
[0023] By adopting the above technical solution and introducing corner indicator marks into the APR plate design, process defects caused by misjudgment of glass flow direction during PI coating can be effectively solved. This marking system forms a physical error-proof mechanism through visual marking. When the operator places the substrate on the coating platform, the relative position of the corner of the substrate and the preset mark on the APR plate can be quickly compared to detect and correct glass flow direction deviations in real time.
[0024] Furthermore, the substrate printing flow direction markings include: markings corresponding to the TFT substrate and markings corresponding to the CF substrate.
[0025] Furthermore, the markings corresponding to the TFT substrate and the markings corresponding to the CF substrate are different.
[0026] Furthermore, a printing alignment mark system for the TFT substrate and CF substrate is provided on the APR plate;
[0027] The alignment marking system includes: four hollow cross-shaped square marks corresponding to the TFT substrate, and four cross marks corresponding to the CF substrate;
[0028] The alignment mark is used to check and adjust the alignment accuracy of the equipment during the PI coating process.
[0029] By adopting the above technical solution, the printing alignment mark system set on the APR plate provides precise alignment assurance for the co-coating of the TFT substrate and the CF substrate. Specifically, the four hollow cross-shaped marks corresponding to the TFT substrate and the four cross-shaped marks corresponding to the CF substrate are designed differently in shape, which facilitates operators in quickly distinguishing the coating positions of the two substrates. Attached Figure Description
[0030] Figure 1 For the first case: a=c and b≠d, a shared-version design schematic diagram is possible;
[0031] Figure 2 A schematic diagram showing the alignment of the printed alignment mark with the TFT substrate for the APR version;
[0032] Figure 3 A schematic diagram showing the alignment of the printed alignment mark with the CF substrate for the APR plate;
[0033] Figure 4 For the second case: a≠c and b=d, a shared design schematic diagram is possible;
[0034] Figure 5 For the second scenario, a schematic diagram of PI coating results for different process flows of CF substrate;
[0035] Figure 6 This is the second scenario. After the CF substrate is rotated 180 degrees and PI coating is applied, it can be assembled normally. (Schematic diagram)
[0036] Figure 7 The third case is: a≠c and b≠d, which is a non-co-design schematic diagram. Detailed Implementation
[0037] The principles and features of the present invention are described below with reference to all the accompanying drawings. The examples given are only for explaining the present invention and are not intended to limit the scope of the present invention.
[0038] This invention discloses a method for manufacturing a liquid crystal panel.
[0039] Reference Figures 1-7 A method for manufacturing a liquid crystal panel, used for APR plate co-printing design, wherein the APR plate co-printing refers to the use of a single APR plate for the roll coating of polyimide (PI) on both the thin-film transistor (TFT) substrate and the color filter (CF) substrate.
[0040] The co-printing conditions are determined based on the spacing relationship between the PI printed pattern and the four sides of the substrate. The spacing includes the left spacing a, the top spacing b, the right spacing c, and the bottom spacing d. If either a=c or b=d is satisfied, it is determined that the TFT substrate and the CF substrate can be co-printed.
[0041] In this invention, the product design must consider whether the TFT and CF substrates can share a single APR plate. As long as the substrate pattern design satisfies either a=c or b=d, a single APR plate can be designed to be used, which can save on project investment costs; reduce the number of APR plate replacements and cleanings during production, and improve production efficiency.
[0042] The shared design approach includes the following three cases:
[0043] First case: If a=c and b≠d, co-printing design is possible, and the process flow for the two substrates is exactly the same during PI coating.
[0044] The second scenario: If a≠c and b=d, a co-design is possible, but the two substrates will have different process flows during PI coating.
[0045] The third case: If a≠c and b≠d, a shared design is not allowed.
[0046] In the APR co-printing design, two types of substrate printing alignment marks are set: four hollow cross-shaped marks for the TFT substrate and four cross-shaped marks for the CF substrate, used to check and adjust the alignment accuracy of the PI coating equipment; corner indicator marks are set on the substrate to prevent mistaken identification and ensure the correct glass flow direction. In this embodiment, the corner indicator marks are the substrate printing flow direction marks.
[0047] In the second scenario, the PI coating process differs between the two substrates. If the larger angle of the glass flow direction on the TFT substrate is in the lower left of the coating platform, the CF substrate needs to be rotated 180 degrees (with the larger angle in the upper right of the coating platform) for PI coating. After coating, the finished products can be assembled normally. During APR board co-design, corresponding larger angle indicator marks are set for both the TFT and CF substrates to prevent mistaken identification and ensure correct glass flow direction. Specifically, the TFT substrate corresponds to a T-shaped mark, and the CF substrate corresponds to a triangular mark, such as... Figure 4 As shown.
[0048] Specifically, Figure 1 This is a schematic diagram illustrating the first scenario in the APR version co-design method of this invention. For example... Figure 1 As shown, the spacing between the PI printed pattern and the four sides of the substrate is equal on both sides (a=c and b≠d), allowing for co-printing. The PI coating process is identical for both substrates. Specifically, the glass flow angle of the TFT substrate is at the lower left of the coating platform. After the TI film coating of the TFT substrate is completed, the TI film coating of the CF substrate can continue using the same process.
[0049] In the APR (Advanced Persistent Printing) co-printing design, two types of substrate printing alignment marks are used. Specifically, the four hollow cross-shaped square marks 01 on the APR version are aligned and fitted with the corresponding cross-shaped marks on the TFT substrate, as shown below. Figure 2 As shown, this is used to check and adjust the printing alignment accuracy of the PI coating equipment; the four cross marks 02 on the APR plate are aligned with the corresponding square marks on the CF substrate, as shown. Figure 3 As shown, this is used to check and adjust the printing alignment accuracy of the PI coating equipment. A T-shaped mark 03 indicating the large corner of the substrate is set to prevent mistaken identification and ensure correct glass flow direction.
[0050] Figure 4This is a schematic diagram illustrating the second scenario in the APR co-printing design method of this invention. The spacing between the PI printed pattern and the four sides of the substrate is equal on both the top and bottom sides (a≠c and b=d), allowing for co-printing design. However, the PI coating process differs between the two substrates. If the glass flow direction of the TFT substrate is at the lower left of the coating platform, after the TFT substrate PI film coating is completed, when switching to CF substrate coating, the glass flow direction process needs to be changed. The CF substrate needs to be rotated 180 degrees in front of the coating machine (with the larger corner at the upper right of the coating platform stage). Figure 5 Then, PI coating is performed, and the finished product can be assembled normally after coating.
[0051] Specifically, if the PI coating process of the CF substrate and the TFT substrate is the same, the PI film coating area of the CF substrate will not match its AA area, resulting in misalignment. Figure 5 As shown in Figure 2, the red box represents the AA region of the CF substrate, and the black box represents the PI film region after coating (compared to the PI film region of the TFT substrate). Figure 5 (Same as shown in Figure 1). After rotating the CF substrate 180 degrees, PI coating is performed. The resulting PI film coating area completely matches its AA region, as shown in Figure 1. Figure 5 As shown in Figure 3, the upper right corner of the CF substrate is where the PI coating pattern of the substrate and the PI film area of the TFT substrate are located. Figure 5 The same as shown in Figure 1. The TFT substrate and CF substrate coated in this way can be properly assembled during the bonding process, as shown in Figure 1. Figure 6 As shown.
[0052] In the APR version co-design, two types of substrate printing alignment marks are also set: a hollow cross square mark 01 for the TFT substrate and four cross marks 02 for the CF substrate. The large-angle indicator T-shaped mark 03 for the TFT substrate is retained for foolproofing, and the large-angle indicator triangle mark 04 for the CF substrate is also set for foolproofing to ensure the correct glass flow direction.
[0053] Figure 7 For the third case: a≠c and b≠d, a shared design schematic is not allowed. It is recommended to use an INKJET device for PI printing.
[0054] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.
Claims
1. A method for manufacturing a liquid crystal panel, characterized in that, For APR plate co-printing design, the APR plate co-printing refers to the thin film transistor TFT substrate and the color filter CF substrate sharing the same APR plate for polyimide PI roll coating; The design steps include: Whether the co-printing condition is met is determined based on the spacing relationship between the PI printed pattern and the four sides of the substrate. The spacing includes left spacing a, top spacing b, right spacing c, and bottom spacing d. If either a=c or b=d is satisfied, then the TFT substrate and the CF substrate are determined to be capable of co-design.
2. The method for manufacturing a liquid crystal panel according to claim 1, characterized in that: The specific conditions for determining co-version based on spacing relationships include: When a=c and b≠d, it is determined to be a co-designable substrate, and the TFT substrate and CF substrate adopt the same PI coating process. When a≠c and b=d, it is determined to be a co-printable design, but the TFT substrate and CF substrate use different PI coating processes. When a≠c and b≠d, it is determined to be a non-copyrightable design.
3. The method for manufacturing a liquid crystal panel according to claim 2, characterized in that: When the TFT substrate and CF substrate use different PI coating processes, if the glass flow angle of the TFT substrate is located at the lower left corner of the coating platform, the CF substrate needs to be rotated 180 degrees so that its angle is located at the upper right corner of the coating platform before PI coating is performed. The coated substrates are then assembled normally.
4. The method for manufacturing a liquid crystal panel according to claim 3, characterized in that: The APR plate design includes substrate printing flow direction marks to prevent mistakes during the PI coating process and ensure correct glass flow.
5. A method for manufacturing a liquid crystal panel according to claim 4, characterized in that: The substrate printing flow direction markings include: markings corresponding to the TFT substrate and markings corresponding to the CF substrate.
6. A method for manufacturing a liquid crystal panel according to claim 5, characterized in that: The markings corresponding to the TFT substrate and the markings corresponding to the CF substrate are different.
7. A method for manufacturing a liquid crystal panel according to claim 1, characterized in that: The APR plate is provided with a printing alignment mark system for the TFT substrate and the CF substrate; The alignment marking system includes: four hollow cross-shaped square marks corresponding to the TFT substrate, and four cross marks corresponding to the CF substrate; The alignment mark is used to check and adjust the alignment accuracy of the equipment during the PI coating process.